TW201020581A - Heat-resistant composite lens - Google Patents

Heat-resistant composite lens Download PDF

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TW201020581A
TW201020581A TW97145715A TW97145715A TW201020581A TW 201020581 A TW201020581 A TW 201020581A TW 97145715 A TW97145715 A TW 97145715A TW 97145715 A TW97145715 A TW 97145715A TW 201020581 A TW201020581 A TW 201020581A
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Taiwan
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group
resin
lens
resin layer
composite lens
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TW97145715A
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Chinese (zh)
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TWI459020B (en
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Masatoshi Yuasa
Toshihiro Kawatani
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Nippon Steel Chemical Co
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Abstract

To provide a heat-resistant composite lens durable against a solder reflow process. The composite lens includes a lens base to which a resin layer is joined, wherein each of the lens base and the resin layer is made of a curable resin. At least the lens base includes a cured silicone resin containing polyorganosilsesquioxane expressed by general formula (1):(RSiO<SB>1.5</SB>)m(RSiO<SB>0.5</SB>)n and having a cage structure in the structural unit. In formula (1), R represents an unsaturated group expressed by (a) -R1-OCO-CR2=CH2, (b) -R1-CR2=CH2 or (c) -CH=CH2, an alkyl group, a cycloalkyl group, a cycloalkenyl group, a phenyl group, a hydrogen atom, an alkoxyl group or an alkylsiloxy group, and a plurality of R in formula (1) may be mutually different but at least one of them includes (a), (b) or (c); R1 represents an alkylene group, an alkylidene group or a phenylene group; R2 represents a hydrogen atom or an alkyl group; m represents a number from 8 to 16; and n represents a number from 0 to 4.

Description

201020581 九、發明說明 【發明所屬之技術領域】 ' 本發明係關於一種耐熱性複合型透鏡,其特徵係關於 ' 一種將樹脂層接合於透鏡基材上所成之複合型透鏡,例如 搭載於行動電話、數位照相機等之附有透鏡之CCD ( Charge Coupled Device)或附有透鏡之CMOS (相補性金 屬氧化膜半導體)感應器等,而適合將半導體及透鏡作成 • 一體化之照相機模組的透鏡等使用者。 【先前技術】 傳統上,照相機模組用透鏡係基於低價格化之目的而 使用塑膠製之透鏡。塑膠製之透鏡,可將聚碳酸酯樹脂、 .......,基丙烯酸樹脂、脂環式缔烴聚含物等透明樹脂加以射出 成形等,而製得凸透鏡或凹透鏡。 近年來,基於電子零件之實裝成本降低之目的,有提 ® 案將照相機模組與其他之電子零件同樣地,進行迴流焊接 ^ 從而能一次性地實裝之方法,其須要能耐住迴焊爐之熱( 26(TC)。然而,現行之塑膠製透鏡因其耐熱溫度僅在180 °C以下,故無法通過迴焊爐。 解決此課題之手段之一,例如特開2004- 1 3 3 3 28號公 報(專利文獻1)所記載者,係將能耐住迴焊溫度之熱或 光硬化性樹脂作成後補材料。然而,一般而言,卻有硬化 性樹脂容易因反應時所產生之硬化收縮而造成成形過程上 之成型破裂,甚至難以確保成型物之模具複製性的安定等 -5- 201020581 問題。 此外,又如特開2005-60657號公報(專利文獻2)所 記載者,係將玻璃透鏡作爲母材而在其表面上使熱或光硬 · 化性樹脂成膜之複合型透鏡。然而,上述傳統之複合型透 鏡,因玻璃與樹脂之線膨脹係數之差等因素,特別在濕熱 環境下其與玻璃樹脂界面之密接性會容易降低,從而在耐 久性之點上並不完全。進而,複合型透鏡,其母材的玻璃 透鏡相較於塑膠製透鏡而言,卻因成形時間長、大量生產 © 有困難,而導致其製造成本高,並在要求能便宜且大量生 產之行動電話或數位相機用之照相機模組上,尙不適合。 專利文獻1:特開2004-133328公報 專利文獻2 :特開2005-60657公報 【發明內容】 發明之揭示 發明所欲解決之課題 ® 因此,本發明爲解決上述課題起見,其目的在於提供 _ 一種耐熱性複合型透鏡,其特徵係適合於作爲能耐住迴流 焊接步驟之照相機模組用之透鏡等。 解決課題之手段 本發明者們,爲解決傳統之塑膠製透鏡或複合型透鏡 之問題點’而進行銳意檢討之結果,發現了至少將具有籠 型構造之聚有機砂倍半氧院(silsesquioxane)爲主成分之 -6 - 201020581 聚砂酮樹脂所成之硬化樹脂適用於透鏡基材上,進而將由 該硬化樹脂所成之樹脂層接合於在該透鏡基材上,就可提 '* 供一種便宜且可供應於迴流焊接步驟之耐熱性複合型透鏡 ' ,從而完成了本發明。 亦即,本發明係:一種耐熱性複合型透鏡,其特徵爲 其係將樹脂層接合於透鏡基材上所成之複合型透鏡,且透 鏡基材及樹脂層係各由硬化樹脂所成,至少透鏡基材係以 〇 下述一般式(1)所示, (RSi〇15)m(RsiO〇.5)„ ( 1 ) (惟,R 係(a ) -R^OCO-CR^CHi ' ( b ) -R1- CR2 = CH2或(c ) -CH = CH2所示之不飽和基、烷基、環烷 基、環烯基、苯基、氫原子、烷氧基、或烷基甲矽烷氧基 ,式(1)中之多數R可爲相異者,惟至少1個係含有上 • 述(O 、(b)或(c)之任一者,R1係伸烷基、烷叉或 伸苯基,R2係氫或烷基,m = 8~16,n = 0〜4之數),在構造 單位中係以具有籠型構造之聚有機矽倍半氧烷爲主成分之 聚矽酮樹脂進行硬化所成者。 此外,本發明之較佳態樣,其中上述樹脂層係以一般 式(1)所示,且在構造單位中係以具有籠型構造之聚有 機矽倍半氧烷爲主成分之聚矽酮樹脂進行硬化所成者。 在本發明中,亦可獲得一種硬化樹脂,其中對於上述 聚矽酮樹脂,係配合有在分子中至少具有1個氫化甲矽烷 -7- 201020581 基之化合物及/或具有伸乙基性不飽和基之化合物,進而 再配合氫化甲矽烷基化觸媒及/或自由基開始劑所得之硬 化性樹脂紕成物後,而使該硬化性樹脂組成物發生熱硬化 或光硬化所成者。 以下,茲具體地說明本發明。 本發明中之樹脂基材及樹脂層各係由硬化樹脂所成, 其中至少樹脂基材係由以下具體說明之聚矽酮樹脂所硬化 而成者。亦即,本發明所使用之聚矽酮樹脂,係以上述一 Θ 般式(η所示,亦即在構造單位中具有籠型構造之聚有 機矽倍半氧烷(以下,亦稱爲「籠型構造之聚有機矽倍半 氧烷」)爲主成分者。在此,構造單位,具體上係指在一 般式(1)中以m或η所示之重複單位,所謂在構造單位 中具有籠型構造者,係指m或η所示之重複單位之一者或 二者係具有籠型構造之意。此外,具有籠型構造之聚有機 矽倍半氧烷,如以下所說明者,係由三次元多面體構造骨 架及R所構成者,惟其中三次元多面體構造骨架之一部爲 © 開環者(亦即不完全之籠型構造)亦包含在內。 在此,一般式(1)中,係以R之至少1個爲上述(a )、(b)或(c)所示之不飽和基爲必要,此等之不飽和 基之具體例子,有3-甲基丙烯氧基丙基、3-丙烯氧基丙基 、芳基、乙烯基、及苯乙烯基等。本發明之聚矽酮樹脂中 ,在具有籠型構造之聚有機矽倍半氧烷以外,尙包含具有 以下構造或不包含籠型構造之聚矽酮樹脂,其比例則以未 達30wt%爲較佳。 -8- 201020581 【化1】201020581 IX. INSTRUCTIONS OF THE INVENTION [Technical Field of the Invention] The present invention relates to a heat-resistant composite lens characterized in that a composite lens formed by bonding a resin layer to a lens substrate is, for example, carried in action. A CCD (Charge Coupled Device) with a lens or a CMOS (Complementary Metal Oxide Semiconductor) sensor with a lens, such as a telephone or a digital camera, and is suitable for a semiconductor camera and a lens. Wait for users. [Prior Art] Conventionally, a lens for a camera module uses a lens made of plastic based on the purpose of lowering the price. A lens made of a plastic can be obtained by injection molding or the like of a transparent resin such as a polycarbonate resin, a acryl resin or an alicyclic hydrocarbon-containing polymer to obtain a convex lens or a concave lens. In recent years, based on the purpose of reducing the cost of mounting electronic components, it has been possible to reflow soldering the camera module in the same manner as other electronic components, so that it can be refilled at one time. Furnace heat (26 (TC). However, the current plastic lens cannot pass the reflow oven because its heat resistance temperature is only below 180 ° C. One of the means to solve this problem, such as special opening 2004- 1 3 3 Japanese Patent Publication No. 3 (Patent Document 1) discloses that a heat-resistant or photocurable resin capable of withstanding a reflow temperature is used as a post-replenishment material. However, in general, a curable resin is likely to be generated by a reaction. In the case of the hardening and shrinkage, the molding is broken during the forming process, and it is difficult to ensure the stability of the mold reproducibility of the molded article, etc., in the case of the Japanese Patent Publication No. 2005-60657 (Patent Document 2). A composite lens in which a glass lens is used as a base material to form a film of heat or light hardening resin on the surface thereof. However, the conventional composite lens has a difference in linear expansion coefficient between glass and resin. In particular, in the hot and humid environment, the adhesion to the interface between the glass and the resin is easily lowered, which is not complete at the point of durability. Further, in the composite lens, the glass lens of the base material is compared with the plastic lens. However, due to the long forming time and the high production cost, the manufacturing cost is high, and it is not suitable for a camera module for a mobile phone or a digital camera that can be produced inexpensively and mass-produced. Patent Document 1: Special Opening 2004 SUMMARY OF THE INVENTION PROBLEMS TO BE SOLVED BY THE INVENTION In order to solve the above problems, an object of the present invention is to provide a heat-resistant composite lens. The present invention is suitable for use as a lens for a camera module capable of withstanding a reflow soldering step, etc. Solution to Problem The inventors of the present invention have conducted intensive review to solve the problem of the conventional plastic lens or composite lens. , found that at least the clustered structure of polyorganic sand silsesquioxane as the main component of -6 - 201020581 The hardened resin made of the ketone resin is applied to the lens substrate, and the resin layer formed of the hardened resin is bonded to the lens substrate to provide an inexpensive heat supply which can be supplied to the reflow soldering step. The present invention has been completed. That is, the present invention is a heat-resistant composite lens characterized by a composite lens in which a resin layer is bonded to a lens substrate, and a lens base. Each of the material and the resin layer is made of a hardened resin, and at least the lens substrate is represented by the following general formula (1): (RSi〇15)m (RsiO〇.5) „ (1) (only, R system (a) -R^OCO-CR^CHi ' (b) -R1-CR2 = CH2 or (c) -CH = an unsaturated group represented by CH2, an alkyl group, a cycloalkyl group, a cycloalkenyl group, a phenyl group, a hydrogen atom, an alkoxy group, or an alkylcarbomethoxy group, wherein a plurality of R in the formula (1) may be different, but at least one system contains the above (O, (b) or (c) In one case, R1 is an alkyl group, an alkylidene or a phenyl group, R2 is a hydrogen or an alkyl group, m = 8 to 16, and n = 0 to 4), and is a cluster having a cage structure in a structural unit. Organic Poly siloxane silicone-resin main component of the semi-hardening the winner. Further, in a preferred aspect of the invention, the resin layer is represented by the general formula (1), and in the structural unit, a polyfluorene ketone having a polyorgano sesquioxanes having a cage structure as a main component The resin is hardened. In the present invention, a hardening resin may be obtained, wherein the polyfluorene ketone resin is compounded with a compound having at least one hydrogenated methyl sulfonium-7-201020581 group in the molecule and/or having ethyl acrylate unsaturated Further, the compound of the base is further blended with a curable resin composition obtained by hydrogenating a formazan alkylation catalyst and/or a radical initiator, and then the curable resin composition is thermally cured or photocured. Hereinafter, the present invention will be specifically described. Each of the resin substrate and the resin layer in the present invention is made of a cured resin, and at least the resin substrate is cured by a polyketone resin which will be specifically described below. That is, the polyfluorene ketone resin used in the present invention is a polyorgano sesquioxanes having a cage structure as shown in the above formula (n, that is, a cage structure in a structural unit (hereinafter, also referred to as " Here, the structural unit, specifically, the repeating unit represented by m or η in the general formula (1), is called in the structural unit. In the case of a cage structure, it means that one of the repeating units indicated by m or η or both has a cage structure. Further, a polyorgano sesquioxanes having a cage structure are as described below. It consists of a three-dimensional polyhedron structure skeleton and R, but one of the three-dimensional polyhedral structural skeletons is also included in the open loop (that is, the incomplete cage structure). Here, the general formula ( In the case of 1), it is necessary that at least one of R is an unsaturated group represented by the above (a), (b) or (c), and a specific example of such an unsaturated group is 3-methylpropenyloxy. a propyl group, a 3-propenyloxypropyl group, an aryl group, a vinyl group, a styryl group, etc. The polyfluorene ketone of the present invention Among the fats, in addition to the polyorganobexesquioxane having a cage structure, the ruthenium contains a polyfluorene ketone resin having the following structure or no cage structure, and the proportion thereof is preferably less than 30% by weight. 201020581 【化1】

O' ? •^i~0~ R R&quot;0_O' ? •^i~0~ R R&quot;0_

•R R~0* K ν (上述式中,R之至少一部係以一般式(1 )所示之基,y ® 則係重複數1〜1 000 ) 一般式(1),係表示由三次元多面體構造骨架及R 所構成之籠型聚矽氧烷,其各自之例子,當一般式(1) 中之m爲8且η爲0時,其爲下述構造式(3):當m爲 10且η爲0時,其爲下述構造式(4);當m爲12且η 爲〇時,其爲下述構造式(5):以及,當m爲8且η爲 2時,其爲下述構造式(6)。惟,以一般式(1)所示之 聚矽酮樹脂,並不限於此等之構造式(3) 、(4) 、(5 ® )、及(6 )所示者。 -9- 201020581 【化2 RSi-Ο-SiR/ /1 RSi^—?·〇-SiR ? (3)• RR~0* K ν (In the above formula, at least one of R is based on the general formula (1), and y ® is the number of repetitions 1 to 1 000.) The general formula (1) is expressed by three times. The polyhedral structural skeleton and the cage polyoxyalkylene formed by R, each of which is an example of the following formula (3) when m in the general formula (1) is 8 and η is 0: when m When 10 is 10 and η is 0, it is the following structural formula (4); when m is 12 and η is 〇, it is the following structural formula (5): and, when m is 8 and η is 2, It is the following structural formula (6). However, the polyketone resin represented by the general formula (1) is not limited to those represented by the structural formulae (3), (4), (5 ® ), and (6). -9- 201020581 【化2 RSi-Ο-SiR/ /1 RSi^—?·〇-SiR ? (3)

RSi-0-SiR RRSi-0-SiR R

(4 )(4)

R R —〇一Si、R R —〇一Si,

RSi^° 〇 0 \jR 广〇、I R.〇riRSi^° 〇 0 \jR Hirose, I R.〇ri

1少具卜( RSi^ 〇 〇 u R R1 Less Bu (RSi^ 〇 〇 u R R

〇 RSi —!〇—Si I I 一 SiR 9〇 RSi —!〇—Si I I — SiR 9

〇J (5 )〇J (5)

&gt;SiR&gt;SiR

上述構造式(3) 、(4)、及(5)所示之籠型聚矽 氧烷,係可單獨或複數使用以下述一般式(7)所示之矽 化合物, -10- 201020581The cage type polysiloxanes represented by the above structural formulas (3), (4), and (5) may be used singly or in combination with the oxime compound represented by the following general formula (7), -10- 201020581

RSiX3 (惟,R 係(a) -R1-OCO-CR2 = CH2 ' ( b ) -R1-CR2 = CH2 或(c ) -CH = CH2所示之不飽和基、烷基、環烷基、環烯 基、苯基、氫原子、烷氧基、或烷基甲矽烷氧基,R1係伸 烷基、烷叉或伸苯基,R2係氫或烷基,此外,X爲選自烷 ❹ 氧基、鹵原子、及羥基之群之1種之水解性基),而在鹼 性觸媒下,以非極性溶劑及極性溶劑中之一者或二者同時 使用之溶劑進行水解,同時使其一部縮合而製得。 此外’以上述構造式(6)所示之籠型聚矽氧烷,則 係可將構造式(3) 、(4)、或(5)所示之籠型聚矽氧 烷,進一步在非極性溶劑及鹼性觸媒之存在下使其發生再 縮合所製得之再縮合物上,使二矽氧烷化合物進行平衡化 反應而得者。 ® 關於在得到構造式(3)~(6)之籠型矽氧烷時之極 性溶劑,例如有甲醇、乙醇、2-丙醇等之醇類等。此外, 關於非極性溶劑,例如有甲苯、二甲苯、苯等。再者,關 於鹼性觸媒,例如有四甲基氫氧化銨、四乙基氫氧化銨、 四丁基氫氧化銨、苄基三甲基氫氧化銨、苄基三乙基氫氧 化銨等之氫氧化銨鹽。其中,又基於高觸媒活性之觀點, 係以四甲基氫氧化銨爲較佳。再者,鹼性觸媒,一般則使 用水溶液。 此外,在本發明中,對於聚矽酮樹脂,可配合在分子 -11 - 201020581 中至少具有1個伸乙基性不飽和雙鍵之化合物、或在分子 中至少具有氫化甲矽烷基之化合物之任一者,而作成硬化 性樹脂組成物;亦可將此等二者加以配合,而作成硬化性 樹脂組成物。接著,亦可將此種硬化性樹脂組成物施以熱 硬化或光硬化而得到透鏡基材或樹脂層之任一者或二者。 在此,如係配合在分子中至少具有一個伸乙基性不飽和雙 鍵之化合物時,可使其在硬化性樹脂組成物中含有自由基 開始劑;又如係配合在分子中至少具有氫化甲矽烷基之化 ❹ 合物時,則可使其在硬化性樹脂組成物中含有氫化甲矽烷 基化觸媒。 關於在上述分子中至少具有一個伸乙基性不飽和雙鍵 之化合物,只要係可與聚矽酮樹脂及自由基共聚合之不飽 和化合物即可,惟在配合於上述聚矽酮樹脂上,適合者可 大別爲該構造單位之重複數爲2~20左右之聚合物之反應 性低聚物,以及低分子量且低黏度之反應性單體。此外, 其亦可大別爲具有1個不飽和基之單官能不飽和化合物及 ® 具有2個以上之多官能不飽和化合物。爲得到良好之3次 元交聯體起見,可含有極少量(1%以下左右)之多官能不 飽和化合物,惟如期待共聚物之耐熱性、強度等時,係以 每一個分子,平均1.1個以上爲較佳,1.5個以上爲更佳 ’ 1.6~5個爲最佳。因此,亦可混合使用單官能不飽和化 合物及具有2~5個不飽和基之多官能不飽和化合物,並調 整其平均之官能基數。 具體而言,反應性低聚物,例如有環氧基丙烯酸酯、 -12- 201020581 環氧化油丙烯酸酯、胺基甲酸酯丙烯酸酯、不飽和聚酯、 聚酯丙烯酸酯、聚醚丙烯酸酯、乙烯基丙烯酸酯、聚烯/ 硫醇、聚矽酮~丙烯酸酯、聚丁二烯、聚苯乙烯乙基甲基丙 烯酸酯等。此等係單官能不飽和化合物及多官能不飽和化 合物,反應性之單官能單體,例如有苯乙烯、醋酸乙烯酯 、N-乙烯基吡咯烷酮、丁基丙烯酸酯、2-乙基己基丙烯酸 酯、η-己基丙烯酸酯、環己基丙烯酸酯、η-癸基丙烯酸酯 φ 、異冰片基丙烯酸酯、二環戊烯氧基乙基丙烯酸酯、苯氧 基乙基丙烯酸酯、三氟乙基甲基丙烯酸酯等。此外,反應 性之多官能單體,例如有一般式(2 )以外之不飽和化合 物之三丙二醇二丙烯酸酯、1,6-己二醇二丙烯酸酯、雙酚 Α二環氧丙基醚二丙烯酸酯、四乙二醇二丙烯酸酯、羥基 三甲基乙酸新戊基乙二醇二丙烯酸酯、三羥甲基丙烷三丙 烯酸酯、季戊四醇三丙烯酸酯、季戊四醇四丙烯酸酯、二 季戊四醇六丙烯酸酯等。 ® 本發明所可使用之在分子中至少具有1個伸乙基性不 飽和雙鍵之化合物,除上述所例示者外,並可使用各種反 應性低聚物或單體。此外,此等之反應性低聚物或單體, 可各自單獨使用,亦可將2種類以上混合使用。藉由將此 等進行自由基共聚合,亦可同樣地製得聚矽酮樹脂共聚物 〇 與在分子中至少具有1個伸乙基性不飽和雙鍵之化合 物一起配合使用之自由基開始劑,只要係可作爲光聚合開 始劑或熱聚合開始劑皆可。在此,光聚合開始劑,其適合 -13- 201020581 使用者有苯乙酮系、苯偶因系、二苯甲嗣系、噻噸酮系、 醯基膦氧化物系等之化合物。具體而言,例如有三氯苯乙 嗣、一乙氧基苯乙嗣、1-苯&quot;基-2 -經基-2-甲基丙院-1-嗣、 1-羥基-環己基苯基酮、2 -甲基-1- (4 -甲基硫苯基)-2 -嗎 啉代丙烷-1-酮、苯偶因甲基醚、噻噸酮、2,4,6-三甲基苯 甲醯二苯基膦氧化物、甲基苯基乙醛酸酯、樟腦醌、苯偶 醯、蒽醌、米蚩酮等。此外,亦可與光聚合開始劑加以組 合而倂用能發揮效果之光開始助劑或增感劑(sensitizer ) φ 。此等光聚合開始劑,可以單獨使用,亦可將2種類以上 混合使用。 再者,基於上述目的所使用之熱聚合開始劑,其適合 使用者有酮過氧化物系、過氧化縮酮系、氫過氧化物系、 二烷基過氧化物系、二醯基過氧化物系、過氧基二碳酸酯 系、過氧基酯系等各種之有機過氧化物。具體而言,例如 有環己酮過氧化物、1,1-雙(t-六過氧)環己酮、枯烯氫 過氧化物、二枯烯基過氧化物、苯甲醯過氧化物、二異丙 Θ 基過氧化物、t-丁基過氧基-2-乙基己酸酯等,惟不限於此 等之範圍。此外,此等熱聚合開始劑,可以單獨使用,亦 可將2種類以上混合使用。 自由基開始劑,如配合有光聚合開始劑或熱聚合開始 劑時,其添加量,相對於聚矽酮樹脂100重量份,係以 0.1〜5重量份之範圍爲較佳,並以0.1 ~3重量份之範圍爲 最佳。此添加量如未達0.1重量份時,硬化會不完全,所 得到之透鏡之強度或剛性會降低。另一方面,如超過5重 -14- 201020581 量份時,則會產生透鏡之著色等問題。 另一方面,關於在上述分子中至少具有氫化甲矽烷基 之化合物,其較佳者係低聚物及單體,且該低聚物及單體 ' 之特徵爲在分子中之矽原子上至少具有1個以上之可氫化 甲矽烷基化之氫原子。在矽原子上具有氫原子之低聚物, 例如有聚氫二烯矽氧烷類、聚二甲基氫甲矽烷氧基矽氧烷 類及其共聚物、末端係以二甲基氫甲矽烷氧基進行修飾之 〇 矽氧烷等。再者,在矽原子上具有氫原子之單體,例如有 四甲基環四矽氧烷、五甲基環戊烷等之環狀矽氧烷類、二 氫二矽氧烷類、三氫單矽烷類、二氫單矽烷類、單氫單矽 烷類、二甲基甲矽烷氧基矽氧烷類等。此等亦可將2種類 以上混合使用。 與在分子中至少具有氫甲矽烷氧基之化合物一起配合 使用之氫甲矽烷基觸媒,例如有氯舶(IV)、氯鉑酸、氯 鉛酸及醇、醛、酮之錯合物、氯鉑酸及烯烴類之錯合物、 • 銷及乙烯基矽氧烷之錯合物、二羰基二氯鉑及鈀系觸媒、 鍺系觸媒等鉑族金屬系觸媒。此等之中,基於觸媒活性之 觀點,係以選自氯鉑酸、氯鉑酸及烯烴類之錯合物、以及 鉛及乙烯基矽氧烷之錯合物爲較佳。此外,此等可以單獨 使用,亦可將2種類以上混合使用。 如配合有上述氫甲矽烷基化觸媒時,其添加量,相對 於聚矽酮樹脂的重量’係以1〜1〇〇〇 ppm爲較佳,並以 20〜500 ppm之範圍爲最佳。氫甲矽烷基觸媒可以單獨使 用,亦可與先前說明之自由基開始劑進行組合,而將2種 -15- 201020581 類以上倂用。 在本發明中,製得含有上述聚矽銅樹脂之硬化性樹脂 組成物時,基於使含有聚矽酮樹脂硬化而得到複合型透鏡 . 之目的,或將複合型透鏡之物性加以改良之目的,其係以 適當選擇:在分子中至少具有1個伸乙基性不飽和雙鍵之 化合物、在分子中至少具有1個氫甲矽烷基之化合物、自 由基開始劑 '氫甲矽烷基化觸媒等而加以配合爲較佳。亦 即,如配合有:具有伸乙基性不飽和雙鍵之化合物、或具 @ 有氫甲矽烷基之化合物時,可配合作爲促進反應之添加劑 之氫甲矽烷基化觸媒獲自由基開始劑(熱聚合開始劑或光 聚合開始劑),進而,亦可配合熱聚合促進劑、光開始助 劑、銳感劑等。此外,只要在不逸脫本發明目的之範圍下 ,可添加有機/無機塡充劑、可塑劑、難燃劑、熱安定劑 、抗氧化劑、光安定劑、紫外線吸收劑、滑劑、抗靜電劑 、脫模劑、發泡劑、核劑、著色劑、交聯劑、分散助劑、 樹脂成分等之各種添加劑。 © 再者,在本發明中,樹脂層亦可使用上述聚矽酮樹脂 進行硬化者以外之物。此時,亦可使用上述在分子中至少 具有1個伸乙基性不飽和雙鍵之化合物進行硬化者。 本發明之複合型透鏡,可藉由將上述聚矽酮樹脂進行 加熱或光照射而硬化、形成透鏡基材,並在該透鏡基材上 形成樹脂層而製得。 藉由加熱而製造透鏡基材時,該成形溫度,藉由熱聚 合開始劑或促進劑等之選擇,可在由室溫起至200°C前後 -16- 201020581 之廣大範圍中加以選擇。此時,例如可在金屬板或玻璃板 上澆鑄聚矽酮樹脂(或硬化性樹脂組成物),並以加熱硬 化而得到薄片狀之透鏡基材。 此外,如藉由光照射而製造透鏡基材時,可以照射波 長100〜400 nm之紫外線或波長400〜700 nm之可見光線, 而製得成形體(透鏡基材)。所使用之光之波長並無特別 之限制,惟其中係以波長200〜400 nm之近紫外線爲適合 〇 。作爲紫外線發生源之燈,例如有低壓水銀燈(輸出: 0_4〜4 W/cm )、高壓水銀燈(40〜160 W/cm)、超高壓水 銀燈(1 73~43 5 W/cm )、金屬鹵素燈(80〜1 60 W/cm )、 脈衝氙燈(80〜120 W/cm )、無電極放電燈(80〜1 20 W/cm )等。此等之紫外線燈,由於在各自之分光分布上 有其特徵之故,可根據所使用之光聚合開始劑之種類而加 以選定。此外,與前述因加熱而製造之方法爲相同地,例 如可在玻璃板上澆鑄聚矽酮樹脂(或硬化性樹脂組成物) ® ,並以光硬化而得到薄片狀之透鏡基材。 再者,構成本發明之複合型透鏡之樹脂層,可將聚矽 酮樹脂或具有伸乙基性不飽和雙鍵之化合物等之具有硬化 性能者,載置於上述透鏡基材上(如係液狀物時,亦包含 澆鑄等),並以加熱或光照射而使其硬化並形成。 再者’爲使透鏡基材或樹脂層成爲所定之形狀或厚度 起見,可使用傳統上習知之方法。舉例而言,可在被加工 成所定形狀之模具(例如具有球面形狀之凹部之模具等) 中,將成爲樹脂層之具有硬化性能之樹脂或化合物等,以 -17- 201020581 定量進行充塡,並於其上部側已設置有預先被硬化之透鏡 基材之狀態下,以加熱或光照射使其硬化,而製得透鏡型 狀之成型物。亦可藉由該成型物而作晚複合型透鏡,惟在 - 透鏡基材之剩下之另一面上亦可同樣地設置所定形狀之樹 脂層,然後再將透鏡基材之兩面的2個樹脂層加以接合, 以作成複合型透鏡。此外,在事先硬化之樹脂層上,亦可 設置作成所定形狀之模具,再將聚矽酮樹脂(或硬化性樹 脂組成物)塡充其中,而形成透鏡基材。 @ 再者,在製得複合型透鏡時,如有必要,亦可基於防 反射、賦予高硬度、提升耐磨耗性、賦予防霧度性等之改 良之目的,而施加表面硏磨、防靜電處理、硬塗佈處理、 無反射塗佈處理、調光處理等習知之物理或化學處理。 本發明之複合型透鏡,由於至少透鏡基材係以具有籠 型構造之聚有機矽倍半氧烷爲主成分之聚矽酮樹脂進行硬 化所成者之故,其耐熱性優良。因此,其可供應於迴流焊 接步驟,並適合利用於例如行動電話、搭載於數位照相機 〇 等之附有透鏡之CCD或附有透鏡之CMOS感應器等,將 半導體及透鏡作成一體化之照相機模組的透鏡等使用者。 【實施方式】 實施發明之最佳型態 以下茲舉出實施例進一步地具體說明本發明。惟,本 發明並不受這些實施例之範圍之任何限制。 -18- 201020581 實施例 以下,說明本發明之實施例。此外,在下述實施例所 使用之聚矽酮樹脂,係藉由以下之合成例所示方法而製得 者。 合成例1 在具有攪拌機、滴下漏斗及溫度計之反應容器中,裝 〇 入作爲溶劑之2-丙醇(IPA) 40 ml及作爲鹼性觸媒之5% 四甲基氫氧化銨水溶液(TMAH水溶液)。另在滴下漏斗 中裝入IP A 15 ml及3-甲基丙烯氧基丙基三甲氧基矽烷( MTMS :東麗·道康寧•聚矽酮股份有限公司製SZ-6 300 )12·69 g,將反應容器一面攪拌,一面以 30分鐘將 MTMS之IPA液滴入其中。在MTMS之滴下終了後,不加 熱而攪拌2小時。再將2小時攪拌後之溶劑於減壓下除去 其溶劑,以甲苯50 ml進行溶解。再以飽和食鹽水將反應 ® 溶液水洗至中性,再以無水硫酸鎂使其脫水。將無水硫酸 鎂濾掉,以濃縮得到8.6 g之水解生成物(矽倍半氧烷) 。該矽倍半氧烷係可溶於各種有機溶劑之無色黏性液體。 接著,在具有攪拌機、「丁斯塔克」縮聚合裝置、及 冷卻管之反應容器中,加入上述得到之矽倍半氧烷8.0 g 、甲苯32 ml及10%TMAH水溶液1.2 g,徐徐地加熱將水 餾去再加熱至1 3(TC,以迴流溫度使甲苯進行再縮合反應 。此時之反應溶液之溫度係108 °C。在甲苯還流後並攪拌 2小時後,將反應終了。另以飽和食鹽水將反應溶液水洗 -19- 201020581 至中性後,再以無水硫酸鎂使其脫水。將無水硫酸鎂濾掉 ,以濃縮得到具有下述平均組成式之聚矽酮樹脂(產量 7.5 g,產率87%)。所得到之聚矽酮樹脂係可溶於各種有 機溶劑之無色黏性液體。 [CH2=CH (CH3) OCO (CH2) 3SiO, 5] m [CH2=CH (CH3) 0C0 (CH2) 3Si00.5] n ( 8 ) 表1中,係彙整了所得到之聚矽酮樹脂(8 )以液體 色層分析大氣壓離子化分析計(LC/APC1-MS )進行之質 @ 量分析所測得之主要峰部,以及相當於其之聚矽酮樹脂( 8 )之m、η之數値。所測之峰部m/z,係聚矽嗣樹脂(8 )(惟m爲8〜16,η爲0~4)所示之聚矽酮樹脂之分子量 上附加有銨離子之値。 [表1] 經酬之觸 m η 14 5 1 8 0 18 0 9 10 0 2 18 9 12 .0 合成例2 在具有攪拌機、滴下漏斗及溫度計之反應容器中,裝 入作爲溶劑之甲苯150 ml及2-丙醇(ΙΡΑ ) 85 ml及作爲 鹼性觸媒之5 %四甲基氫氧化銨水溶液(TMAH水溶液) 37_2 g。另在滴下漏斗中裝入甲苯25 ml及三甲氧基乙烯 基矽烷(信越化學股份有限公司製KBM1003) 50.3 g,將 反應容器一面攪拌,一面以3小時將三甲氧基乙烯基矽烷 -20- 201020581 之甲苯溶液滴入其中。在三甲氧基乙烯基矽烷之滴下終了 後,室溫下攪拌2小時。在1小時攪拌後,停止攪拌並靜 置1日。將反應溶液以1 〇%檸檬酸水溶液2 3.0 g中和後, ' 再以飽和食鹽水洗淨,另以無水硫酸鎂使其脫水。將無水 硫酸鎂濾掉,以濃縮得到20.6 g (產率77% )之聚縮合物 。該聚縮合物係難溶於各種有機溶劑之難溶性白色固體。 接著,在具有攪拌機、「丁斯塔克」縮聚合裝置、冷 φ 卻管、及溫度計之反應容器中,加入上述得到之聚縮合物 15.0 g、甲苯 380 ml 及 5%TMAH 水溶液 1.72 g,於 120°C 下將水餾去,再將甲苯還流加熱以進行縮聚合反應。在甲 苯還流後並攪拌3小時後,恢復室溫並使反應終了。將反 應溶液以10%檸檬酸23.0 g中和後,另以飽和食鹽水洗淨 ,再以無水硫酸鎂使其脫水。將無水硫酸鎂濾掉,以濃縮 得到再縮合物1 4.5 g。所得到之再縮合物係白色固體,且 對於各種溶劑具有難溶性。 # 最後,在具有攪拌機、「丁斯塔克」縮聚合裝置、及 冷卻管之反應容器中,加入所得到之再縮合物14.5 g、甲 苯 300 ml、5%TMAH水溶液 3.0 g、及 1,3-二乙烯基-1,1,3,3-四甲基二矽氧烷(丁\10¥0 8:信越化學股份有限公 司製LS-7250 ) 9.76 g,於120°C下將水餾去,再將甲苯還 流加熱以進行縮聚合反應。在甲苯還流後並攪拌3小時後 ,恢復室溫並使反應終了。將反應溶液以10%檸檬酸3.24 g中和後,另以飽和食鹽水洗淨,再以無水硫酸鎂使其脫 水。將無水硫酸鎂濾掉,以濃縮得到具有下述平均組成式 -21 - 201020581 之聚矽酮樹脂(產量16.9g,產率88%)。所得到之聚矽 酮樹脂,係可溶於各種有機溶劑之無色黏性液體。 [CH2=CHSi015]m[CH2=CH(CH3)2Si00.5]n (9) 表2中,係彙整了上述得到之聚矽酮樹脂以液體色層 分析大氣壓離子化分析計(LC/APC1-MS)進行之質量分 析所測得之主要峰部,以及相當於其之聚矽酮樹脂(9 ) φ 之m、η之數値。所測之峰部m/z,係聚矽酮樹脂(9 )( 惟m爲8〜16,η爲〇~4)所示之聚矽酮樹脂(9)之分子 量上附加有銨離子之値。 [表2] 經檢測之峰部 m η 8 2 2. 1 9 1 8 3 6. 2 8 2 9 8 0.1 11 1 9 9 4. 1 10 2 115 2. 1 12 2 116 6. 2 11 3 1 3 2 4. 1 13 3 1 4 8 2. 1 15 3RSiX3 (R, R system (a) - R1-OCO-CR2 = CH2 ' ( b ) -R1-CR2 = CH2 or (c) -CH = unsaturated group represented by CH2, alkyl group, cycloalkyl group, ring Alkenyl, phenyl, hydrogen, alkoxy, or alkylformyloxy, R1 is alkyl, alkyl or phenyl, R2 is hydrogen or alkyl, and X is selected from alkoxy a hydrolyzable group of one of a group of a halogen group and a hydroxyl group), and a solvent which is used in one or both of a nonpolar solvent and a polar solvent under a basic catalyst, and simultaneously Made by condensation. Further, the cage type polyoxyalkylene shown by the above structural formula (6) can further form a cage type polyoxane represented by the structural formula (3), (4), or (5). The re-condensation product obtained by re-condensation in the presence of a polar solvent and a basic catalyst is obtained by subjecting a dioxane compound to an equilibrium reaction. ® For the polar solvent in the case of obtaining the cage-type siloxane of the structural formulae (3) to (6), for example, an alcohol such as methanol, ethanol or 2-propanol may be mentioned. Further, as the nonpolar solvent, for example, toluene, xylene, benzene or the like is mentioned. Further, examples of the basic catalyst include tetramethylammonium hydroxide, tetraethylammonium hydroxide, tetrabutylammonium hydroxide, benzyltrimethylammonium hydroxide, benzyltriethylammonium hydroxide, and the like. Ammonium hydroxide salt. Among them, tetramethylammonium hydroxide is preferred from the viewpoint of high catalyst activity. Further, in the case of an alkaline catalyst, an aqueous solution is generally used. Further, in the present invention, for the polyfluorene ketone resin, a compound having at least one ethylenically unsaturated double bond in the molecule -11 - 201020581 or a compound having at least a hydrogenated methyl hydrazine group in the molecule may be blended. Alternatively, a curable resin composition may be used; or both of them may be blended to form a curable resin composition. Then, the curable resin composition may be thermally cured or photocured to obtain either or both of a lens substrate or a resin layer. Here, if a compound having at least one ethylenically unsaturated double bond in the molecule is blended, it may contain a radical initiator in the curable resin composition; and if it is a compound, it has at least hydrogenation in the molecule. In the case of a carbaryl alkylate compound, a hydroformylation catalyst can be contained in the curable resin composition. The compound having at least one ethylenically unsaturated double bond in the above molecule may be an unsaturated compound which can be copolymerized with a polyfluorene ketone resin and a radical, but is compounded on the above polyfluorene ketone resin. Suitable polymers are reactive oligomers of polymers having a repeat number of from 2 to 20, and low molecular weight and low viscosity reactive monomers. Further, it may be a monofunctional unsaturated compound having one unsaturated group and a polyfunctional unsaturated compound having two or more. For the purpose of obtaining a good 3D crosslinked body, a very small amount (about 1% or less) of a polyfunctional unsaturated compound may be contained, and when the heat resistance and strength of the copolymer are expected, the average molecular weight per molecule is 1.1. More than one is preferred, and 1.5 or more is better '1.6 to 5 is the best. Therefore, a monofunctional unsaturated compound and a polyfunctional unsaturated compound having 2 to 5 unsaturated groups may be used in combination, and the average number of functional groups may be adjusted. Specifically, reactive oligomers, for example, epoxy acrylate, -12-201020581 epoxidized oil acrylate, urethane acrylate, unsaturated polyester, polyester acrylate, polyether acrylate , vinyl acrylate, polyolefin / thiol, poly fluorenone ~ acrylate, polybutadiene, polystyrene ethyl methacrylate and the like. These are monofunctional unsaturated compounds and polyfunctional unsaturated compounds, reactive monofunctional monomers such as styrene, vinyl acetate, N-vinyl pyrrolidone, butyl acrylate, 2-ethylhexyl acrylate , η-hexyl acrylate, cyclohexyl acrylate, η-mercapto acrylate φ, isobornyl acrylate, dicyclopentenyloxyethyl acrylate, phenoxyethyl acrylate, trifluoroethyl Acrylate and the like. Further, a reactive polyfunctional monomer such as tripropylene glycol diacrylate having an unsaturated compound other than the general formula (2), 1,6-hexanediol diacrylate, bisphenol quinone diepoxypropyl ether II Acrylate, tetraethylene glycol diacrylate, hydroxytrimethylacetic acid neopentyl glycol diacrylate, trimethylolpropane triacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol hexaacrylate Wait. ® A compound having at least one ethylenically unsaturated double bond in the molecule which can be used in the present invention, and various reactive oligomers or monomers can be used in addition to those exemplified above. Further, these reactive oligomers or monomers may be used singly or in combination of two or more kinds. By radical copolymerizing these, it is also possible to obtain a radical initiator which is used in combination with a compound having at least one ethylenically unsaturated double bond in the molecule. As long as it can be used as a photopolymerization initiator or a thermal polymerization initiator. Here, the photopolymerization initiator is suitable for a compound such as an acetophenone system, a benzoin system, a benzophenone system, a thioxanthone system or a mercaptophosphine oxide system. Specifically, for example, trichlorophenylacetamidine, monoethoxyphenidinium, 1-phenyl&quot;yl-2-carbazino-2-methylpropan-1-pyrene, 1-hydroxy-cyclohexylphenyl Ketone, 2-methyl-1-(4-methylthiophenyl)-2-morpholinopropan-1-one, benzoin methyl ether, thioxanthone, 2,4,6-trimethyl Benzamidine diphenylphosphine oxide, methylphenylglyoxylate, camphorquinone, benzoin, oxime, rice ketone, and the like. Further, it is also possible to combine a photopolymerization initiator with a light-starting aid or a sensitizer φ which can exert an effect. These photopolymerization initiators may be used singly or in combination of two or more types. Further, a thermal polymerization initiator used for the above purpose is suitable for a user having a ketone peroxide system, a peroxyketal system, a hydroperoxide system, a dialkyl peroxide system, and a dithiol peroxidation. Various organic peroxides such as a system, a peroxydicarbonate system, and a peroxy ester system. Specifically, for example, cyclohexanone peroxide, 1,1-bis(t-hexaperoxy)cyclohexanone, cumene hydroperoxide, dicumyl peroxide, benzamidine peroxide And diisopropyl hydrazine peroxide, t-butylperoxy-2-ethylhexanoate, etc., but are not limited to these ranges. Further, these thermal polymerization initiators may be used singly or in combination of two or more types. When a radical initiator, such as a photopolymerization initiator or a thermal polymerization initiator, is added, the amount thereof is preferably 0.1 to 5 parts by weight based on 100 parts by weight of the polyfluorenone resin, and is 0.1 to 0.1. The range of 3 parts by weight is optimal. If the amount is less than 0.1 part by weight, the hardening may be incomplete, and the strength or rigidity of the obtained lens may be lowered. On the other hand, if it exceeds 5 parts -14 - 201020581 parts, problems such as the color of the lens may occur. In another aspect, the compound having at least a hydrogenated methylation group in the above molecule is preferably an oligomer and a monomer, and the oligomer and the monomer are characterized by at least a ruthenium atom in the molecule. A hydrogen atom having one or more hydrogenated methyl hydrazides. An oligomer having a hydrogen atom on a ruthenium atom, for example, a polyhydrogenadiene oxyalkylene, a polydimethylhydroformaloxy alkoxy olefin, a copolymer thereof, and a terminal dimethyl hydroformane A methoxy group modified with an oxy group. Further, as the monomer having a hydrogen atom on the ruthenium atom, for example, a cyclic siloxane such as tetramethylcyclotetraoxane or pentamethylcyclopentane, dihydrodioxane or trihydrogen is used. Monodecanes, dihydromonodecanes, monohydromonodecanes, dimethylformamoxyoxyalkylenes, and the like. These can also be used in combination of 2 or more types. a hydroformamidine catalyst used in combination with a compound having at least a hydroformyloxy group in the molecule, for example, a chlorine (IV), a chloroplatinic acid, a chlorolead acid, and a complex of an alcohol, an aldehyde, a ketone, A complex of chloroplatinic acid and an olefin, a complex of a pin and a vinyl siloxane, a dicarbonyl chloroplatinum, a palladium catalyst, and a platinum group metal catalyst such as a ruthenium catalyst. Among these, from the viewpoint of catalyst activity, a complex selected from the group consisting of chloroplatinic acid, chloroplatinic acid, and an olefin, and a complex of lead and vinyl alumoxane are preferred. Further, these may be used alone or in combination of two or more types. When the above-mentioned hydroformylation catalyst is blended, the amount of addition is preferably 1 to 1 〇〇〇 ppm based on the weight of the polyfluorene ketone resin, and is preferably in the range of 20 to 500 ppm. . The hydroformyl alkyl catalyst can be used singly or in combination with the radical initiator described above, and two types of -15-201020581 or more can be used. In the present invention, when the curable resin composition containing the above polyfluorene-copper resin is obtained, the composite lens is obtained by curing the polyfluorene-containing resin, or the physical properties of the composite lens are improved. It is suitably selected: a compound having at least one ethylenically unsaturated double bond in the molecule, a compound having at least one hydroformyl group in the molecule, and a radical initiator "hydroformamidine alkylation catalyst" It is better to cooperate with it. That is, if a compound having an ethylenically unsaturated double bond or a compound having a hydroformyl group is added, it can be combined with a hydroformylation catalyst as an additive for promoting the reaction to obtain a radical. The agent (thermal polymerization initiator or photopolymerization initiator) may further contain a thermal polymerization accelerator, a photo-starting aid, a sharpener, and the like. In addition, organic/inorganic chelating agents, plasticizers, flame retardants, thermal stabilizers, antioxidants, light stabilizers, ultraviolet absorbers, lubricants, antistatic agents may be added as long as they do not deviate from the object of the present invention. Various additives such as a agent, a release agent, a foaming agent, a nucleating agent, a coloring agent, a crosslinking agent, a dispersing aid, and a resin component. Further, in the present invention, the resin layer may be used other than those hardened by using the above polyketone resin. In this case, it is also possible to use a compound having at least one ethylenically unsaturated double bond in the molecule to be hardened. The composite lens of the present invention can be obtained by curing the above polyfluorene ketone resin by heating or light irradiation to form a lens substrate, and forming a resin layer on the lens substrate. When the lens substrate is produced by heating, the molding temperature can be selected from a wide range of from room temperature to 200 ° C -16 to 201020581 by selection of a heat polymerization initiator or accelerator. In this case, for example, a polyketone resin (or a curable resin composition) may be cast on a metal plate or a glass plate, and hardened by heating to obtain a sheet-like lens substrate. Further, when a lens substrate is produced by light irradiation, an ultraviolet ray having a wavelength of 100 to 400 nm or a visible ray having a wavelength of 400 to 700 nm can be irradiated to obtain a molded body (lens substrate). The wavelength of the light to be used is not particularly limited, but it is suitable for near ultraviolet rays having a wavelength of 200 to 400 nm. As the light source of the ultraviolet light, for example, a low-pressure mercury lamp (output: 0_4 to 4 W/cm), a high-pressure mercury lamp (40 to 160 W/cm), an ultra-high pressure mercury lamp (1 73 to 43 5 W/cm), a metal halide lamp (80 to 1 60 W/cm), pulsed xenon lamp (80 to 120 W/cm), electrodeless discharge lamp (80 to 1 20 W/cm), and the like. These ultraviolet lamps are characterized by their respective spectral distributions and can be selected depending on the type of photopolymerization initiator to be used. Further, in the same manner as the above-described method of producing by heating, for example, a polyfluorenone resin (or a curable resin composition) ® can be cast on a glass plate, and a lens substrate having a sheet shape can be obtained by photocuring. Further, the resin layer constituting the composite lens of the present invention may be provided on the lens substrate by a resin having a curing property such as a polyfluorene ketone resin or a compound having an ethylenically unsaturated double bond. In the case of a liquid, it also contains casting, etc., and it is hardened by heat or light irradiation. Further, in order to make the lens substrate or the resin layer into a predetermined shape or thickness, a conventionally known method can be used. For example, in a mold that is processed into a predetermined shape (for example, a mold having a spherical recessed shape, etc.), a resin or a compound having a curing property as a resin layer may be quantitatively charged at -17 to 201020581. Further, in a state where the lens substrate which has been previously hardened is provided on the upper side thereof, it is hardened by heating or light irradiation to obtain a molded article of a lens shape. It is also possible to use the molded product as a late composite lens, but a resin layer of a predetermined shape may be similarly disposed on the other side of the lens substrate, and then two resins on both sides of the lens substrate may be used. The layers are joined to form a composite lens. Further, a mold having a predetermined shape may be provided on the resin layer which has been previously hardened, and a polyketone resin (or a curable resin composition) may be filled therein to form a lens substrate. @ Furthermore, when making a composite lens, if necessary, it is also possible to apply surface honing and anti-reflection based on anti-reflection, high hardness, improved wear resistance, and anti-fogging property. Physical or chemical treatments such as electrostatic treatment, hard coating treatment, non-reflective coating treatment, and dimming treatment. The composite lens of the present invention is excellent in heat resistance because at least the lens substrate is hardened by a polyketone resin containing a polyorganosilsesquioxane having a cage structure as a main component. Therefore, it can be supplied to a reflow soldering step, and is suitable for use in, for example, a mobile phone, a lens-attached CCD mounted on a digital camera, or a CMOS sensor with a lens, etc., and an integrated camera lens for a semiconductor and a lens. Group of lenses and other users. [Embodiment] BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be specifically described by way of examples. However, the invention is not limited by the scope of the examples. -18- 201020581 Embodiment Hereinafter, an embodiment of the present invention will be described. Further, the polyfluorene ketone resins used in the following examples were obtained by the methods shown in the following synthesis examples. Synthesis Example 1 In a reaction vessel having a stirrer, a dropping funnel, and a thermometer, 40 ml of 2-propanol (IPA) as a solvent and 5% aqueous solution of tetramethylammonium hydroxide (TMAH aqueous solution) as a basic catalyst were charged. ). In addition, IP A 15 ml and 3-methylpropoxypropyltrimethoxydecane (MTMS: SZ-6 300 manufactured by Toray Dow Corning Copolysinone Co., Ltd.) 12·69 g were placed in the dropping funnel. The reaction container was stirred while one side of the MTMS was dropped into it for 30 minutes. After the end of the dropping of MTMS, the mixture was stirred for 2 hours without heating. The solvent which was stirred for 2 hours was removed under reduced pressure, and dissolved in 50 ml of toluene. The reaction solution was washed with a saturated saline solution to neutrality, and then dehydrated with anhydrous magnesium sulfate. Anhydrous magnesium sulfate was filtered off to concentrate to obtain 8.6 g of a hydrolyzed product (hydrazine sesquioxane). The sesquioxanes are colorless viscous liquids which are soluble in various organic solvents. Next, in the reaction vessel having a stirrer, a "Dust Stark" polycondensation unit, and a cooling tube, 1.2 g of the obtained sesquisesquioxane 8.0 g, toluene 32 ml, and 10% TMAH aqueous solution were added, and the mixture was slowly heated. The water was distilled off and heated to 13 (TC), and the toluene was subjected to recondensation reaction at a reflux temperature. The temperature of the reaction solution at this time was 108 ° C. After the toluene was still flowed and stirred for 2 hours, the reaction was terminated. The reaction solution was washed with water to neutrality after -19-201020581, and then dehydrated with anhydrous magnesium sulfate. The anhydrous magnesium sulfate was filtered off to concentrate to obtain a polyfluorene ketone resin having the following average composition (yield 7.5 g). , yield 87%). The obtained polyfluorenone resin is a colorless viscous liquid which is soluble in various organic solvents. [CH2=CH (CH3) OCO (CH2) 3SiO, 5] m [CH2=CH (CH3) 0C0 (CH2) 3Si00.5] n ( 8 ) In Table 1, the obtained polyfluorene ketone resin (8 ) was analyzed by liquid chromatography analysis atmospheric pressure ionization analyzer (LC/APC1-MS)@ The main peak measured by the quantitative analysis, and the number of m and η of the polyfluorene ketone resin (8) corresponding thereto The measured peak portion m/z is a molecular weight of the polyfluorene ketone resin shown by the polyfluorene resin (8) (only m is 8 to 16 and η is 0 to 4). Table 1] Reward touch m η 14 5 1 8 0 18 0 9 10 0 2 18 9 12 .0 Synthesis Example 2 In a reaction vessel equipped with a stirrer, a dropping funnel and a thermometer, 150 ml of toluene as a solvent was charged. 2-propanol (ΙΡΑ) 85 ml and a 5 % tetramethylammonium hydroxide aqueous solution (TMAH aqueous solution) as a basic catalyst 37_2 g. Into the dropping funnel, 25 ml of toluene and trimethoxyvinyl decane were placed. 50.3 g of KBM1003) manufactured by Shin-Etsu Chemical Co., Ltd., and the reaction vessel was stirred while stirring, and a toluene solution of trimethoxyvinylnonane-20-201020581 was dropped into it for 3 hours. After the end of the dropwise drop of trimethoxyvinyl decane The mixture was stirred at room temperature for 2 hours. After stirring for 1 hour, the stirring was stopped and allowed to stand for 1 day. The reaction solution was neutralized with 1 〇% citric acid aqueous solution 2 3.0 g, and then washed with saturated brine, and It was dehydrated with anhydrous magnesium sulfate, filtered off with anhydrous magnesium sulfate, and concentrated to give 20.6 g (yield 77%) a polycondensate which is a poorly soluble white solid which is insoluble in various organic solvents. Next, it is added to a reaction vessel having a stirrer, a "Dust Stark" polycondensation unit, a cold φ tube, and a thermometer. 15.0 g of the polycondensate obtained above, 380 ml of toluene and 1.72 g of a 5% TMAH aqueous solution were distilled off at 120 ° C, and the toluene was further heated to carry out a polycondensation reaction. After the toluene was still allowed to flow and stirred for 3 hours, the room temperature was returned and the reaction was terminated. The reaction solution was neutralized with 23.0 g of 10% citric acid, and then washed with saturated brine and then dried over anhydrous magnesium sulfate. Anhydrous magnesium sulfate was filtered off to concentrate to give a recondensate of 14.5 g. The resulting recondensate is a white solid and is poorly soluble in various solvents. # Finally, in the reaction vessel with a stirrer, a "Dust Stark" polycondensation unit, and a cooling tube, 14.5 g of the obtained recondensate, 300 ml of toluene, 3.0 g of a 5% TMAH aqueous solution, and 1,3 were added. -Divinyl-1,1,3,3-tetramethyldioxane (Ding\10¥0 8: LS-7250, manufactured by Shin-Etsu Chemical Co., Ltd.) 9.76 g, distilling water at 120 ° C Then, the toluene is further heated to carry out a polycondensation reaction. After the toluene was still flowed and stirred for 3 hours, the room temperature was returned and the reaction was terminated. The reaction solution was neutralized with 3.24 g of 10% citric acid, and then washed with a saturated aqueous solution of sodium chloride and then evaporated. Anhydrous magnesium sulfate was filtered off to concentrate to obtain a polyfluorene ketone resin (yield: 16.9 g, yield: 88%) having the following average composition formula -21 - 201020581. The obtained polyketone resin is a colorless viscous liquid which is soluble in various organic solvents. [CH2=CHSi015]m[CH2=CH(CH3)2Si00.5]n (9) In Table 2, the above obtained polyfluorene ketone resin was analyzed by liquid chromatography to analyze the atmospheric pressure ionization analyzer (LC/APC1- MS) The main peak measured by the mass analysis, and the number η of m and η corresponding to the polyfluorene ketone resin (9) φ. The measured peak portion m/z is a polyfluorene ketone resin (9) (only m is 8 to 16, η is 〇~4), and the molecular weight of the polyfluorene ketone resin (9) is added with ammonium ions. . [Table 2] The detected peaks m η 8 2 2. 1 9 1 8 3 6. 2 8 2 9 8 0.1 11 1 9 9 4. 1 10 2 115 2. 1 12 2 116 6. 2 11 3 1 3 2 4. 1 13 3 1 4 8 2. 1 15 3

實施例1 將上述合成例1所得到之在矽原子上具有甲基丙烯醢 基之籠型聚矽酮樹脂:25重量份、二環戊基二丙烯酸酯: 75重量份、作爲光聚合開始劑之丨_羥基環己基苯基酮: -22- 201020581 2.5重量份,進行混合,而製得透明之硬化性樹脂組成物 (聚矽酮樹脂組成物)。表3中,係顯示了本實施例1所 使用之聚矽酮樹脂組成物之組成。此外’表3中之數値係 以重量份表示。 [表3] A B G D E 實施例1 25 75 2. 5 實施例2 50 50 2. 5 實施例3 50 10 40 2. 5 實施例4 20 50 30 2. 5 實施例5 25 65 10 2. 5 比較例1 25 60 15 2.5 比較例2 50 30 20 2.5 表3中使用之符號A〜E,其意義係如下所示。 ❹ A :合成例1所得到之聚矽酮樹脂 B:二甲基丙烯氧基丙基聚二甲基矽氧烷(「阿茲馬 克士」股份有限公司製DMS-R11) C:二季戊四醇六丙烯酸酯(共榮社化學(股)製「 來特」丙烯酸酯DPE-6A) D:二環戊基二丙烯酸酯(共榮社化學(股)製「來 特」丙稀酸醋DCP-A:在一般式中,n = 0,R = H) E : 1 -羥基環己基苯基酮(聚合開始劑) 將上述硬化性樹脂組成物之一部流進以玻璃板組成之 -23- 201020581 模型’使成爲厚度2 mm大小’使用30 W/cm之高壓水銀 燈,以2000 mJ/cm2之積算曝光量使其硬化,而得到所定 厚度之薄片狀之聚矽酮樹脂成形體(透鏡基材i) ° 接著,如圖1所示,在所定之球面形狀上具有經加工 之凹部的玻璃製之模具3中,將上述硬化性樹脂組成物2 加以塡充,並在塡充之硬化性樹脂組成物2之表面(液面 )可以接觸之情形下,以設置有透鏡基材1之狀態下使用 3 0 W/cm高壓水銀燈,另以1 000 mJ/cm2之積算曝光量使 其硬化,而在透鏡基材上形成厚度〇.〇2 mm之樹脂層。 進一步,在透鏡基材1之剩下的表面上,將上述硬化 性樹脂組成物2以同樣之方法使其硬化,而得到在透鏡基 材1之兩面上有樹脂層4接合之複合型透鏡5。所得到之 複合型透鏡5之物性値,係如表4所示。複合型透鏡5之 物性評價,則係如下述行之。 1) 全光線穿透率(參考規格JISK 7361-1):使用紫 外可見紅外分光光度計(V-63 0M日本分光(股)製)進 行測定。 2) 折射率:使用阿貝折射計(DR-M4雅達哥(株) 製)進行測定。 3) 吸永率:使樣品在50°C下乾燥後,測定其重量, 再於25C之溫水中浸漬24小時。測定24小時後之重量, 依據下式求出其吸水率。 吸水率(%)=[(吸水重量一乾燥重量)/乾燥重量]χ1〇〇 201020581 4) 線膨脹係數:使用熱機械分析裝置(TMA製)’ 以升溫速度5°C /分鐘、壓縮負重0.1 Ν之條件,在30°C至 200°C之範圍中測定其線膨脹係數。 5) 耐熱變色性:在峰部溫度被設定在保持於260 °C -1 5秒之迴焊爐,使其連續2次通過迴焊爐後,測定其樣品 之光線穿透率( 400 nm)及通過前之光線穿透率,而將通 過前後之穿透率變化(% )作爲耐熱變色性進行評價。Example 1 The cage type polyfluorene ketone resin having a methacryl fluorenyl group on a ruthenium atom obtained in the above Synthesis Example 1 : 25 parts by weight, dicyclopentyl diacrylate: 75 parts by weight, as a photopolymerization initiator Then, hydroxycyclohexyl phenyl ketone: -22-201020581 2.5 parts by weight, and mixed to obtain a transparent curable resin composition (polyfluorenone resin composition). In Table 3, the composition of the polyketone resin composition used in the present Example 1 is shown. Further, the numbers in Table 3 are expressed in parts by weight. [Table 3] ABGDE Example 1 25 75 2. 5 Example 2 50 50 2. 5 Example 3 50 10 40 2. 5 Example 4 20 50 30 2. 5 Example 5 25 65 10 2. 5 Comparative Example 1 25 60 15 2.5 Comparative Example 2 50 30 20 2.5 The symbols A to E used in Table 3 are as follows. ❹ A : Polyfluorene ketone resin B obtained in Synthesis Example 1: dimethyl methoxy propyl polydimethyl decane ("DMS-R11" manufactured by Azmak Co., Ltd.) C: dipentaerythritol Acrylate ("Excellent" acrylate DPE-6A manufactured by Kyoeisha Chemical Co., Ltd.) D: Dicyclopentyl diacrylate (Kyoto Chemical Co., Ltd.) "Lite" acrylate vinegar DCP-A In the general formula, n = 0, R = H) E : 1 -hydroxycyclohexyl phenyl ketone (polymerization initiator) One part of the above-mentioned curable resin composition is poured into a glass plate -23- 201020581 The model 'make a thickness of 2 mm' using a high-pressure mercury lamp of 30 W/cm, and hardening it by an integrated amount of 2000 mJ/cm 2 to obtain a sheet-like polyketone resin molded body having a predetermined thickness (lens substrate i) Then, as shown in Fig. 1, the curable resin composition 2 is filled in a glass mold 3 having a processed concave portion in a predetermined spherical shape, and is composed of a curable resin which is filled with When the surface (liquid level) of the object 2 can be contacted, 30 W/c is used in a state in which the lens substrate 1 is provided. The high-pressure mercury lamp is further hardened by an integrated exposure of 1 000 mJ/cm 2 to form a resin layer having a thickness of 〇 2 mm on the lens substrate. Further, on the remaining surface of the lens substrate 1, the curable resin composition 2 is cured in the same manner to obtain a composite lens 5 having a resin layer 4 joined on both surfaces of the lens substrate 1. . The physical properties of the obtained composite lens 5 are shown in Table 4. The physical property evaluation of the composite lens 5 is as follows. 1) Total light transmittance (reference specification JISK 7361-1): Measurement was carried out using a violet visible infrared spectrophotometer (V-63 0M Japan Spectrophotometer). 2) Refractive index: Measurement was carried out using an Abbe refractometer (DR-M4, manufactured by Yada Co., Ltd.). 3) Suction ratio: After the sample was dried at 50 ° C, the weight was measured and immersed in 25 C of warm water for 24 hours. The weight after 24 hours was measured, and the water absorption rate was determined according to the following formula. Water absorption rate (%) = [(water absorption weight - dry weight) / dry weight] χ 1〇〇 201020581 4) Linear expansion coefficient: using a thermomechanical analysis device (manufactured by TMA) at a heating rate of 5 ° C / min, a compression load of 0.1 The linear expansion coefficient is measured in the range of 30 ° C to 200 ° C under the conditions of hydrazine. 5) Heat-resistant discoloration: The peak penetration temperature is set at a reflow furnace maintained at 260 °C -1 5 seconds, and the light transmittance of the sample is measured after passing through the reflow furnace twice in succession (400 nm). And the light transmittance before passing through, and the change in transmittance (%) before and after passing through was evaluated as heat discoloration resistance.

[表4] 全光線穿透率 (%) 折射率 (n d) 吸水率 (%) 線膨關數 (ppm/k) 耐熱變色性 (%) 實施例1 88 1. 531 0. 5 75 0.4 實施例2 90 1. 525 0· 8 71 0· 3 實施例3 90 1. 527 1. 5 62 0.4 實施例4 87 1. 532 2. 1 54 0, 6 實施例5 88 1. 530 2. 7 37 0.6 實施例6 91 1. 458 0. 02 90 0. 1 實施例7 90 1. 518 0· 3 95 0. 2 實施例8 90 1. 516 0· 2 89 0. 2 實施例9 90 1. 517 0. 2 80 0. 2 比較例1 88 1. 508 2. 8 110 0.4 比較例2 89 1. 497 2. 2 150 0. 3 比較例3 90 1. 432 0. 02 220 0.2 比較例4 90 1. 491 0. 3 ----- 180 ------— 〇. 3 (實施例2〜5及比較例1、2 ) 除硬化性樹脂組成物之配合組成係如表3所示者外, -25- 201020581 其餘與實施例1相同地進行操作,而製得複合型透鏡5。 此外,就所得到之複合型透鏡5之物性値,與實施例1同 樣地進行評價。其結果示於表4。 (實施例6) 將上述合成例2所得到之矽上具有乙烯基之樹脂60 重量份、末端氫修飾甲基氫矽氧烷-苯基甲基矽氧烷共聚 物(「阿茲馬克士」股份有限公司製HPM-502 ) 40重量 份、以及鉛-乙烯基矽氧烷錯合物(「阿茲馬克士」股份 有限公司製SIP 6830.3) 0.5重量份,混合至均一爲止,而 作成硬化性樹脂組成物。在表5中,係表示使用本實施例 6之硬化性樹脂組成物之組成。此外,表5中之數値係以 重量份表示。 [表5] F G Η I C J 實施例6 60 40 0. 5 實施例7 35 15 0. 5 50 2. 5 實施例8 40 10 0. 5 50 2. 5 實施例9 53 7 0. 5 40 2. 5 比較例3 60 40 0. 5 比較例4 40 10 0_ 5 50 2. 5[Table 4] Total light transmittance (%) Refractive index (nd) Water absorption (%) Linear expansion (ppm/k) Heat discoloration (%) Example 1 88 1. 531 0. 5 75 0.4 Implementation Example 2 90 1. 525 0· 8 71 0· 3 Example 3 90 1. 527 1. 5 62 0.4 Example 4 87 1. 532 2. 1 54 0, 6 Example 5 88 1. 530 2. 7 37 0.6 Example 6 91 1. 458 0. 02 90 0. 1 Example 7 90 1. 518 0· 3 95 0. 2 Example 8 90 1. 516 0· 2 89 0. 2 Example 9 90 1. 517 0. 2 80 0. 2 Comparative Example 1 88 1. 508 2. 8 110 0.4 Comparative Example 2 89 1. 497 2. 2 150 0. 3 Comparative Example 3 90 1. 432 0. 02 220 0.2 Comparative Example 4 90 1 491 0. 3 ----- 180 ------- 〇. 3 (Examples 2 to 5 and Comparative Examples 1 and 2) The composition of the composition of the curable resin is as shown in Table 3. Further, -25-201020581 The rest was operated in the same manner as in Example 1 to produce a composite lens 5. Further, the physical properties of the obtained composite lens 5 were evaluated in the same manner as in Example 1. The results are shown in Table 4. (Example 6) 60 parts by weight of a vinyl group-containing resin obtained by the above Synthesis Example 2, and a terminal hydrogen-modified methylhydroquinone-phenylmethyl decane copolymer ("Azmak" 40 parts by weight of HPM-502, manufactured by Co., Ltd., and 0.5 parts by weight of lead-vinyl oxime complex ("SIP 6830.3" manufactured by Azmak Co., Ltd.), mixed until uniform, and made sclerosing Resin composition. In Table 5, the composition of the curable resin composition of the present Example 6 was used. Further, the numbers in Table 5 are expressed in parts by weight. [Table 5] FG Η ICJ Example 6 60 40 0. 5 Example 7 35 15 0. 5 50 2. 5 Example 8 40 10 0. 5 50 2. 5 Example 9 53 7 0. 5 40 2. 5 Comparative Example 3 60 40 0. 5 Comparative Example 4 40 10 0_ 5 50 2. 5

表5中使用之符號F~J,其意義係如下所示。 F :合成例2所得到之聚矽酮樹脂 -26- 201020581 G:二乙烯基聚二甲基聚矽酮(「阿茲馬克士」股份 有限公司製DMS-V05) H:末端氫修飾甲基氫矽氧烷-苯基甲基矽氧烷共聚物 ' (「阿茲馬克士」股份有限公司製HPM-5 02 ) 1:鉑-乙烯基矽氧烷錯合物(「阿茲馬克士」股份有 限公司製SIP6830.3) J:二枯烯基過氧化物(日本油脂股份有限公司製「 φ 帕庫密爾D」) 將上述得到之硬化性樹脂組成物流進以玻璃板組成之 模型’使成爲厚度2 mm大小,再以1〇〇 °C 1小時、120 °C 1 小時、140 °C 1小時、160 °C 1小時、180 °C 2小時進行加熱 ’而得到所定厚度之薄片狀之聚矽酮樹脂成形體(透鏡基 材1 )。 接著,如圖1所示,在所定之球面形狀上具有經加工 之凹部的玻璃製之模具3中,將上述硬化性樹脂組成物2 〇 加以塡充,並在塡充之硬化性樹脂組成物2之表面(液面 )可以接觸之情形下,並在設置有事先形成之透鏡基材之 狀態下,另以l〇〇°C 1小時、120°C 1小時、140°C 1小時、 160°C 1小時、18(TC 2小時加熱使其硬化,而在透鏡基材 上形成厚度0.02 mm之樹脂層4。 進一步,在透鏡基材1之剩下的表面上,將上述硬化 性樹脂組成物2以同樣之方法使其硬化’而得到在透鏡基 材1之兩面上有樹脂層4接合之複合型透鏡5。就所得到 之複合型透鏡5之物性値,與實施例1同樣地進行評價, -27- 201020581 其結果如表4所示。 (實施例7~9及比較例3、4 ) . 除硬化性樹脂組成物之配合組成係如表5所示者外, 其餘與上述實施例6相同地進行操作,而製得複合型透鏡 5。此外’就所得到之複合型透鏡5之物性値,同樣地進 行評價。其結果示於表4〇 Ο 產業上可利用性 本發明之耐熱性複合型透鏡,係適用於例如搭載於行 動電話、數位照相機等之附有透鏡之CCD、附有透鏡之 CMOS感應器等,而將半導體及透鏡作成一體化之照相機 模組的透鏡等使用者。此外,其亦可利用於要求耐熱性之 車載用照相機模組等之透鏡等上。 【圖式簡單說明】 _ 圖1:係表示本發明之耐熱性複合型透鏡之製造方法 的流程圖。 【主要元件符號說明】 1 :透鏡基材 2 :硬化性樹脂組成物 3 :玻璃製模具 4 :樹脂層 -28- 201020581 5 :複合型透鏡The symbols F~J used in Table 5 are as follows. F: Polyfluorene ketone resin obtained in Synthesis Example 2-26-201020581 G: Divinylpolydimethylpolyfluorene ketone ("DMS-V05" manufactured by Azmak Co., Ltd.) H: terminal hydrogen-modified methyl group Hydroquinoxane-phenylmethyl decane copolymer' (HPM-5 02, manufactured by Azmaks Co., Ltd.) 1: Platinum-vinyl oxirane complex ("Azmak" SIP6830.3) manufactured by Co., Ltd. J: Dicumyl peroxide ("Pakumur D" manufactured by Nippon Oil & Fat Co., Ltd.) The composition of the curable resin obtained above is converted into a model composed of a glass plate. The thickness is 2 mm, and then heated at 1 °C for 1 hour, 120 °C for 1 hour, 140 °C for 1 hour, 160 °C for 1 hour, and 180 °C for 2 hours to obtain a sheet of a predetermined thickness. The polyketone resin molded body (lens substrate 1). Next, as shown in FIG. 1, the curable resin composition 2 is entangled in a glass mold 3 having a processed concave portion in a predetermined spherical shape, and the curable resin composition is filled. In the case where the surface (liquid level) of 2 can be contacted, and in the state in which the lens substrate formed in advance is provided, another 1 hour, 1 hour at 120 ° C, 1 hour at 140 ° C, 1 hour, 160 °C 1 hour, 18 (TC 2 hours heating to harden, and a resin layer 4 having a thickness of 0.02 mm is formed on the lens substrate. Further, on the remaining surface of the lens substrate 1, the above-mentioned curable resin is composed The material 2 is cured in the same manner to obtain a composite lens 5 in which the resin layer 4 is bonded to both surfaces of the lens substrate 1. The physical properties of the obtained composite lens 5 are the same as in the first embodiment. Evaluation, -27-201020581 The results are shown in Table 4. (Examples 7 to 9 and Comparative Examples 3 and 4) The composition of the curable resin composition was as shown in Table 5, and the others were carried out as described above. Example 6 was operated in the same manner to produce a composite lens 5. The physical properties of the composite lens 5 are evaluated in the same manner. The results are shown in Table 4. Industrial Applicability The heat-resistant composite lens of the present invention is applied to, for example, a mobile phone or a digital camera. A CCD with a lens, a CMOS sensor with a lens, etc., and a semiconductor lens and a lens are integrated into a lens of a camera module, etc. Further, it can be used for a camera module or the like that requires heat resistance. Fig. 1 is a flow chart showing a method of manufacturing the heat-resistant composite lens of the present invention. [Explanation of main component symbols] 1: Lens base material 2: Curable resin composition 3 : Glass mold 4 : Resin layer -28- 201020581 5 : Composite lens

-29-29

Claims (1)

201020581 十、申請專利範圍 1. 一種耐熱性複合型透鏡,其特徵爲其係將樹脂層接 合於透鏡基材上所成之複合型透鏡,且透鏡基材及樹脂層 係各由硬化樹脂所成,至少透鏡基材係以下述一般式(i )所示, (RSi015)m(Rsi〇〇.5)n ( 1 ) Θ (惟,R 係(a) -R1-OCO-CR2 = CH2 &gt; ( b ) -R^CR^CHj 或(c) -CH = CH2所示之不飽和基、烷基、環烷基 '環烯 基、苯基、氫原子、烷氧基、或烷基甲矽烷氧基,式(1 )中之多數R可爲相同或相異者,惟至少1個係含有上述 (a) 、(b)或(c)之任一者,R1係伸烷基、烷叉或伸 苯基,R2係氫或院基,m = 8~16,n = 0〜4之數),在構造單 位中係以具有籠型構造之聚有機矽倍半氧烷爲主成分之聚 矽酮樹脂進行硬化所成者。 G 2. 如申請專利範圍第1項之耐熱性複合型透鏡,其中 樹脂層係以該一般式(1 )所示,且在構造單位中係以具 有籠型構造之聚有機矽倍半氧烷爲主成分之聚矽酮樹脂進 行硬化所成者。 3. 如申請專利範圍第1或第2項之耐熱性複合型透鏡 ,其中透鏡基材及/或樹脂層,對於聚矽酮樹脂,係配合 有在分子中至少具有1個伸乙基性不飽和雙鍵之化合物及 /或在分子中至少具有氫化甲矽烷基之化合物,進而再配 -30- 201020581 合自由基開始劑及/或氫化甲矽烷基化觸媒所得之硬化性 樹脂組成物,而使該硬化性樹脂組成物發生硬化所成者。201020581 X. Patent Application Area 1. A heat-resistant composite lens characterized in that it is a composite lens in which a resin layer is bonded to a lens substrate, and the lens substrate and the resin layer are each formed of a hardened resin. , at least the lens substrate is represented by the following general formula (i), (RSi015)m(Rsi〇〇.5)n ( 1 ) Θ (only, R system (a) - R1-OCO-CR2 = CH2 &gt; (b) -R^CR^CHj or (c) -CH = an unsaturated group represented by CH2, an alkyl group, a cycloalkyl 'cycloalkenyl group, a phenyl group, a hydrogen atom, an alkoxy group, or an alkyl formane The oxy group, a plurality of R in the formula (1) may be the same or different, but at least one of the above includes (a), (b) or (c), and the R1 is an alkyl group or an alkylidene group. Or a phenyl group, R2 is hydrogen or a hospital base, m = 8~16, n = 0~4), in the structural unit is a polyorgano-sesity sesquioxane with a cage structure as the main component The ketone resin is hardened. G 2. The heat-resistant composite lens according to claim 1, wherein the resin layer is represented by the general formula (1), and in the structural unit, the polyorgano sesquioxanes having a cage structure are used. The main component of the polyketone resin is hardened. 3. The heat-resistant composite lens according to claim 1 or 2, wherein the lens substrate and/or the resin layer, for the polyfluorene ketone resin, is compounded with at least one ethyl group in the molecule. a compound having a saturated double bond and/or a compound having at least a hydroformylalkyl group in the molecule, and further comprising a sclerosing resin composition obtained by using a -30-201020581 free radical initiator and/or a hydrogenated methylation catalyst; Further, the curable resin composition is cured. -31 --31 -
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