201020739 六、發明說明： 【發明所屬之技術領域】 本發明係關於-種可攜式電腦之散熱構造，尤指_種適用於 南發熱功率且幾何空間狹小之可攜式電腦之巾央處理n晶片之散 熱構造。 【先前技術】 ❺ 按’目前可攜式電腦為了讓處理H晶片能夠發揮最大效率以 及有效率提升多工效能’處理器晶片大多已朝向多核心處理器晶 片發展，當多核心晶片因時脈運算不同時會產生不同熱源，因此 散熱模組設計必須具有多熱源快速及高效率散熱能力，以達到最 佳運算效能。 請參閱第-圖所不，-般習用可攜式電職熱構造設計大多 為圓型熱管組成’其組成方式複數根外徑為6或8〇1111圓形熱管(1〇) ❿結合-銘、銅金屬件底座⑴)及複數銘、銅散熱簿片⑽组合而成， 將這些組成元件結合在-起容易衍生該散熱構造加工複雜度及產 品可靠度下降等問題增加。而該些圓形熱管(1〇)雖能快速導熱但受 限於該些圓形熱管(1〇)之蒸發部⑽受熱面積為圓形因此需配合金 屬件加工成平坦面積才能和-處理^晶⑽)直接接觸導熱，因此 該金屬件底座(11)主要目的為固定該些圓形熱管(1〇)及當成加熱面 迅速將由該處理器晶片（2)運算所產生的熱移至該些散熱鋒片（12) 冷凝端，並藉由一風扇(14)和外界進行熱交換以達成溫控效果。 3 201020739 以INTEL可攜式四核心電腦筆記型cpu晶片qX93〇〇為例， 規格45nm製程處理器工作時脈速度已經發展至2 53GHZ以上， 其熱流設計規範TPD達44W，晶片接和溫度約為105T：左右，因 此設計符合熱流規範之散熱模組非常重要。由於該鋁、銅底座(11) 容易加工且成本較便宜但其傳熱機制為單相傳熱（singlephase flow)造成迅速傳熱效果不佳’因此由多核心處理器晶片(2)運算 會產生不同熱源無法即時將此熱源迅速移走，常衍生熱點產生 參（hot-spot)，使得該底座(n)整體熱阻大幅增加，而無法達到熱流設 計規範TPD需求，該處理器晶片(2)便無法發揮最大功用。 【發明内容】 有鑑於先前技術存在之問題，本發明為一種可攜式電腦之散 熱構造，主要目的為只要修正部分結構即可依處理器晶片散熱需 求更新功能以符合設計規範，以達到減少重覆開模及降低成本， ❹並藉由平板式熱管直接與處理器晶片接觸導熱，以提高散熱效率。 為達成上述之目的，本發明所提供之技術手段為一種可攜式 電腦之散熱構造，包括： 一平板熱管：藉由關之管壁_形成—容室，該容室設有複 數間隔排列且猶該平板熱管之支舰，且該平板熱管内部 灌/主-工作流體’且沿該平板熱管之内管壁覆設一毛細結構 ’而該平祕管具有-級部與—核部，該蒸發部可供與 一處理器晶片散熱面接觸導熱； -散熱鰭;i :結合於該平板熱管之冷凝部，可供該平板熱管蒸 4 201020739 發部吸附之熱量發散； 一風扇：結合於該散熱鰭片一侧，可供冷卻該散熱鰭片。 本發明安裝時，可直接將該平板熱管之蒸發部一側直接與該 處理器晶片之散熱面以導熱接合膠接觸結合，使得多核心不同位 置的熱源’得以透過該平板熱管傳熱朝向該冷凝部散熱，故處理 器產生熱可快速散熱至電腦週圍，讓處理器晶片能發揮最佳運作 效能。 【實施方式】 以下藉由圖式說明本發明之内容、特色與實施例，俾使貴審 查人員對於本發明有更進一步之瞭解。 清參閱第二圖與第三圖所示，為本發明一種可攜式電腦之散 熱構造，包括： 一平板熱官(3):藉由周圍之管壁框圍形成一容室(31)，該容室(31) 設有複數間隔排列且頂撐該平板熱管(3)内管壁之支撐體(32), 且該平板熱管(3)内部灌注一工作流體(33)(較佳為純水），且沿 該平板熱管⑶之内管壁覆設一毛細結構(34)，該毛細結構(34) 為一金屬網紗，且在上述元件組裝後真空去除該容室(31)之非 凝結體(如：氧、氮)後密封，而該平板熱管(3)具有-蒸發部(35) 與一冷凝部(36)，該蒸發部(35)可供與一處理晶片(2)散熱面 直接導熱； 複數散鱗片(4):呈相間以導齡、錫膏其中之-黏合於 該平板熱管⑶之冷凝部(36)一側，可供該平板熱管⑶蒸發部 201020739 (35)吸附之熱量發散； 一風扇(6):結合於該些散熱錯片(4)一侧’可供冷卻該些散熱簿 片(4)。 本發明為配合狹小空間散熱，以及避開其他硬體裝置，如： 硬碟、插槽、電池以及主機板之晶片組等，該平板熱管設有一 彎折部(37)，藉由該彎折部(37)令該平板熱管(3)之蒸發部(35)與該 冷凝部(36)位置不在同一水平面上，為避免該平板熱管⑶於加工彎 折部(37)時，受擠壓而造成變形’使該平板熱管(3)之頂面與底面壓 ® 合在一起，而使傳熱通道受阻，進而降低傳熱效率，因此設置該 些支樓體(32)頂撐於該平板熱管⑶内部，以補強該平板熱管⑶之 整體結構;該平板熱管(3)與該些支撐體(32)係由高導熱係數之金屬 所製(較佳為銅），而該平板熱管(3)係呈長方形平坦結構，可直接在 表面黏著導熱接合膠(5),且直接與該處理器晶片（2)散熱面接觸， 以達到快速散熱目的。 凊參閱第二圖與第三圖所示，該平板熱管(3)之熱傳機制係利 ❹用該工作流體(33)之蒸汽與液體雙相之間潛熱變化給值差，一般而 言以純水為例，其蒸汽與液體之焓值差可達數百以上，使其具有 尚效率熱傳導率；而該毛細結構(34)主要功用為提供毛細驅動力讓 冷凝液可以快速流回該蒸發部(35)且快速均勻分佈於該蒸發部(35) 受熱^方止熱點（h〇t-spot)產生；本發明之散熱過程主要係由該 平板熱&⑶之蒸發部⑽藉由該導祕合膠⑶將該處理器晶片⑺ 產生·^熱f ’導至該蒸發部(35)，透職工作流即$吸收熱量後 產生蒸汽，飄散至該冷凝部(坤，使該蒸汽經該減散熱錯片(4) 6 201020739 以及該風扇(6)快速散熱’令該蒸汽冷凝成液體並附著於該毛細結 構(34) ’藉由毛細驅動力讓冷凝液可以快速流回蒸發部(35)且快速 均勻分佈於整個蒸發部(35)受熱’以達成快速散熱之目的。 請參閱第二圖所示’該平板熱管(3)主要可分為蒸發部(35)及冷 凝部(36) ’其熱傳機制為雙相流模式（加〇fj〇w)其中該蒸發 部(35)長度為輸入的熱源位置，可視該處理器晶片面積大小做彈 性調整加熱面積；該冷凝部(36)長度為輸出和外界作熱交換之需要 φ 冷凝面積，其可視該處理器晶片（2)功率需散熱功率大小作彈性增 加冷凝面積及該些散熱鰭片（4)之數量。 請參閱第四圖所示，為了驗證本發明可發揮最佳散熱功用， 經由實驗模擬方式，可以評估散熱構造優劣以及該處理器是否能 正常運作指標，習甩熱傳途徑如下方程式所示： θ— = 0』韻-一 拟一 Θηχ·— 其中符號說明為： ❹ θ ·熱阻，τ :溫度，j :接合面，bl〇ck :金屬件，heatpipe :熱 管，HX .熱交換器（風扇），ambient :外面空氣溫度，熱阻定義 Θ.201020739 VI. Description of the Invention: [Technical Field] The present invention relates to a heat dissipating structure of a portable computer, in particular to a portable computer for a south heating power and a narrow geometric space. The heat dissipation structure of the wafer. [Prior Art] ❺ Press 'Current portable computers to maximize the efficiency and efficiency of processing H-chips'. Most of the processor chips have been developed toward multi-core processor chips, when multi-core chips are clocked. Different heat sources will be generated at different times. Therefore, the heat dissipation module design must have multiple heat sources to quickly and efficiently dissipate heat to achieve the best computing performance. Please refer to the figure-No, the conventional portable electric occupational thermal structure design is mostly composed of round heat pipes. The composition of the multiple roots is 6 or 8〇1111 round heat pipes (1〇) ❿ Combination-Ming The combination of the copper metal base (1) and the plurality of copper and heat-dissipating sheets (10) increases the complexity of processing the heat-dissipating structure and the reliability of the product. The circular heat pipes (1〇) are capable of rapid heat conduction, but are limited to the circular heat pipes (1). The heat-recovering portion (10) has a circular area of heat, so it needs to be processed into a flat area with metal parts to process and process ^ The crystal (10)) is in direct contact with heat conduction, so the main purpose of the metal member base (11) is to fix the circular heat pipes (1〇) and to quickly transfer the heat generated by the processor chip (2) operation to the heating surfaces. The heat sink front (12) condenses the end and exchanges heat with a fan (14) to achieve temperature control. 3 201020739 Take INTEL portable four-core computer notebook cpu chip qX93〇〇 as an example, the working pulse speed of the specification 45nm process processor has been developed to above 2 53GHZ, its heat flow design specification TPD is 44W, the wafer connection and temperature are about 105T: Left and right, so it is very important to design a thermal module that meets the heat flow specification. Since the aluminum and copper base (11) is easy to process and relatively inexpensive, its heat transfer mechanism is a single phase heat transfer which causes poor heat transfer effect. Therefore, it is generated by multi-core processor chip (2) operation. Different heat sources can not quickly remove this heat source, and the hot-spots are often generated by hotspots, which makes the overall thermal resistance of the base (n) increase greatly, and cannot meet the heat flow design specification TPD requirements. The processor chip (2) I can't get the most out of it. SUMMARY OF THE INVENTION In view of the problems existing in the prior art, the present invention is a heat dissipation structure of a portable computer, and the main purpose thereof is to update the function according to the heat dissipation requirement of the processor chip to conform to the design specification, so as to reduce the weight. Covering the mold and reducing the cost, and directly contacting the processor chip with heat through the flat heat pipe to improve heat dissipation efficiency. In order to achieve the above object, the technical means provided by the present invention is a heat dissipation structure of a portable computer, comprising: a flat heat pipe: by a closed wall _ forming a chamber, the chamber is arranged at a plurality of intervals The flat heat pipe is a ship, and the flat heat pipe is internally filled with a main-working fluid and a capillary structure is disposed along the inner wall of the flat heat pipe, and the flat pipe has a - portion and a core portion. The evaporating portion can be in contact with the heat dissipating surface of the processor chip; the heat dissipating fin; i: combined with the condensation portion of the flat heat pipe, can be used for the flat heat pipe to be steamed 4 201020739 The heat absorbed by the hair part is diverged; One side of the heat sink fin can be used to cool the heat sink fin. When the invention is installed, the evaporation portion side of the flat heat pipe can be directly combined with the heat dissipating surface of the processor chip by a heat conductive bonding glue, so that the heat source of the multi-core different position can be transferred to the condensation through the flat heat pipe. The heat is dissipated, so the processor generates heat to quickly dissipate heat around the computer, allowing the processor chip to perform optimally. [Embodiment] The contents, features, and embodiments of the present invention will be described in the following, so that the reviewers will have a better understanding of the present invention. Referring to the second and third figures, a heat dissipation structure of a portable computer according to the present invention includes: a flat panel heat official (3): a chamber (31) is formed by surrounding a wall frame. The chamber (31) is provided with a plurality of spaced-apart supports (32) supporting the inner wall of the flat heat pipe (3), and the flat heat pipe (3) is internally filled with a working fluid (33) (preferably pure) Water), and a capillary structure (34) is disposed along the inner wall of the flat heat pipe (3), the capillary structure (34) is a metal mesh, and the chamber (31) is vacuum removed after the components are assembled. The condensation body (eg, oxygen, nitrogen) is sealed, and the flat heat pipe (3) has an evaporation portion (35) and a condensation portion (36), and the evaporation portion (35) is provided for heat dissipation with a processing wafer (2) Direct heat conduction; multiple scattered scales (4): in the phase between the lead, solder paste - adhered to the side of the flat heat pipe (3) condensation section (36), for the flat heat pipe (3) evaporation section 201020739 (35) adsorption The heat is diverged; a fan (6): coupled to the side of the heat dissipating strips (4) to cool the heat sink sheets (4). The invention is designed to cooperate with a narrow space to dissipate heat, and to avoid other hardware devices, such as a hard disk, a slot, a battery, and a chipset of a motherboard. The flat heat pipe is provided with a bent portion (37) by which the bending is provided. The portion (37) is such that the evaporation portion (35) of the flat heat pipe (3) is not at the same level as the condensation portion (36), and is prevented from being squeezed when the flat heat pipe (3) is processed in the bending portion (37). The deformation causes 'the top surface of the flat heat pipe (3) and the bottom surface are pressed together, and the heat transfer passage is blocked, thereby reducing the heat transfer efficiency, so that the branch bodies (32) are placed on the flat heat pipe. (3) internally to reinforce the overall structure of the flat heat pipe (3); the flat heat pipe (3) and the support bodies (32) are made of a metal having a high thermal conductivity (preferably copper), and the flat heat pipe (3) The utility model has a rectangular flat structure, and can directly adhere the thermal conductive bonding adhesive (5) on the surface, and directly contacts the heat dissipating surface of the processor chip (2) for rapid heat dissipation. Referring to the second and third figures, the heat transfer mechanism of the flat heat pipe (3) is a difference in the latent heat between the vapor and the liquid two phases of the working fluid (33), generally speaking For example, pure water has a vapor-liquid enthalpy difference of more than several hundred, which makes it have an efficient thermal conductivity; and the capillary structure (34) is mainly used to provide a capillary driving force to allow the condensate to quickly flow back to the evaporation. The portion (35) is rapidly and uniformly distributed in the evaporation portion (35) by a hot spot (h〇t-spot); the heat dissipation process of the present invention is mainly performed by the evaporation portion (10) of the plate heat & (3) The guiding glue (3) leads the processor chip (7) to the evaporation portion (35), and the through-work workflow, that is, absorbs heat, generates steam, and is dispersed to the condensation portion (Kun, so that the steam passes through The heat-dissipating chip (4) 6 201020739 and the fan (6) rapidly dissipate the vapor to condense into a liquid and adhere to the capillary structure (34) 'by the capillary driving force, the condensate can quickly flow back to the evaporation portion ( 35) and quickly and evenly distributed throughout the evaporation section (35) heated to achieve rapid heat dissipation Please refer to the second figure. 'The flat heat pipe (3) can be mainly divided into the evaporation part (35) and the condensation part (36). The heat transfer mechanism is a two-phase flow mode (plus 〇fj〇w), where the evaporation part (35) The length is the input heat source position, and the heating area can be elastically adjusted according to the size of the processor chip; the length of the condensation portion (36) is required for the heat exchange between the output and the outside, and the condensed area is visible, which can be regarded as the processor chip ( 2) The power needs heat dissipation power to increase the condensation area and the number of the heat dissipation fins (4). Please refer to the fourth figure. In order to verify the optimal heat dissipation function of the present invention, it can be evaluated through experimental simulation. The advantages and disadvantages of the heat dissipation structure and whether the processor can operate normally, the heat transfer route is as follows: θ — = 0 』 rhyme - one imaginary Θ χ χ · where the symbols are: ❹ θ · thermal resistance, τ : temperature , j : joint surface, bl〇ck: metal parts, heatpipe: heat pipe, HX. heat exchanger (fan), ambient: outside air temperature, thermal resistance definition Θ.
AT ^CPU * ambient 1 ambientAT ^CPU * ambient 1 ambient
P〇PU 而本發明之熱傳途徑如下方程式所示·· β』—=β』-_-θρΙα^Ηχ-θΗχ_— 經實際模_試數據顯示該處理器熱功率權，可得知該散熱構造 整體熱阻u L 32 t/w，比傳統散熱模組為i. 63 t/w低， .且將降低11¾度達23.4%，表示其散熱能力比較好。 7 201020739 請參閱第五_ ’ _本發日柯以針對處理H晶片發熱 功率改變料板鮮在微變轉轉线條有雜能力，而 做了調整散_片數及面酬試，其中測試條件為該處理器提高 至輸入珊，增加散細數由12變成18時，其接合溫度Μ 度由96·4 °C下降至94.8Ϊ。 刊物U用本發明確實符合產業彻性’且未於申請前見於 ❹ ，亦未為公眾所知悉，且具有非顯而易知性，符 合可專利之要件，歧法提出專利申請。 上一較佳實施例，舉凡依本發明 皆屬本案訴求標的之範_。 准上述所陳，為本創作產業 申請專利範圍所作之均等變化， 8 201020739 【圖式簡單說明】 第一圖為習用之立體圖 第二圖為本發明之立體圖 第三圖為本發明之局部剖面放大圖 第四圖為本發明與習用之熱阻量測數據表 第五圖為本發明之散熱鰭片數與冷凝部面積隨處理器晶片功率改 變之量測數據表 ® 【主要元件符號說明】 (ίο)圓形熱管 (11) 底座 (12) 散熱鰭片 (13) 蒸發部 (14) 風扇 (2) 處理器晶片 (3) 平板熱管 (31) 容室 (32) 支撐體 (33) 工作流體 (34) 毛細結構 (35) 蒸發部 (36) 冷凝部 201020739 (37)彎折部 (4) 散熱鰭片 (5) 導熱接合膠 ⑹風扇P〇PU and the heat transfer path of the present invention is as shown in the following equation: · β』—=β』-_-θρΙα^Ηχ-θΗχ_- The heat power of the processor is displayed by the actual mode test data, and the heat dissipation can be known. The overall thermal resistance u L 32 t/w is constructed, which is lower than the conventional heat dissipation module of i. 63 t/w, and will reduce the 113⁄4 degree to 23.4%, indicating that the heat dissipation capability is better. 7 201020739 Please refer to the fifth _ ' _ this hair day Ke to change the heat output of the H chip to change the material in the micro-transformed line has the ability to mix, and made adjustments _ number of films and face compensation test, which test The condition is that the processor is increased to the input, and when the number of the fines is changed from 12 to 18, the junction temperature is lowered from 96·4 °C to 94.8 。. The publication U uses the invention to be in line with the industry's nature and has not been seen before the application, nor is it known to the public, and it is not obvious, and it meets the patentable requirements. In the previous preferred embodiment, the invention is in accordance with the scope of the present invention. Appropriate changes in the scope of patent application for the creative industry, 8 201020739 [Simplified illustration of the drawings] The first picture is a perspective view of the prior art. The second picture is a perspective view of the present invention. The third figure is a partial cross-section of the present invention. Figure 4 is a diagram showing the thermal resistance measurement data of the present invention and the fifth. The measurement data table of the number of heat sink fins and the area of the condensing portion of the present invention is changed according to the power of the processor chip. Ίο) Round heat pipe (11) Base (12) Heat sink fins (13) Evaporator (14) Fan (2) Processor chip (3) Flat heat pipe (31) Housing (32) Support (33) Working fluid (34) Capillary structure (35) Evaporation section (36) Condensation section 201020739 (37) Bending section (4) Heat sink fins (5) Thermal joint glue (6) Fan