201029915 六、發明說明： 【發明所屬之技術領域】 本發明是有關於一種微奈米Μ印製程（Micro/nano Impnntmg Pr0cess)，且特別是有關於一種微奈米圖案直接 接觸滾印於可撓性基板的方法。 【先前技術】 隨著電子元件之尺寸的日益縮減’元件之圖案定義也 面臨嚴重考驗。在目前之電子元件製程中，一般大都採用 光學微影技術來進行元件特徵圖案的定義。然而，受限於 光學繞射的極限，光學微影技術所能定義之圖案特徵尺寸 也受到嚴重限制。 有鑑於此’近年來發展出之微奈米壓印技術 (Micro/Nano-imprinting Technology)已被視為未來最有可 能超越並取代傳統之微奈米光學微影製程技術的方法之 一。在目前已開發出的壓印技術中，接觸式微奈米圖案轉 /印技術為近來常見之壓印技術。接觸式微奈来圖案轉印技 術係將轉印材料層設置在模仁之圖案結構上，再將基板斑 模仁之圖案結構相對壓合，以使圖案結構之凸狀部上的轉 =材料層與基板表面接合，接著透過加熱轉印材料層的方 ;、’來增加模仁之凸狀部上的轉印材料層與基板表面之間 的黏附力’然後移除模仁’ g卩可將模仁圖案結之 印材料層轉移至基板表面上，而完成微奈米圖案 然而’實際上轉移圖案之尺寸的持續縮滅至微奈米尺 4 201029915 = =狀部之間的高度落差將大幅降 低圖案轉移之均勻度、精確度、可靠度。 板上製作出微奈米圖案，必須券服、、e 、疋』榥j·王吞 ㈣見度對可撓性基板所造 成的,、、、變形’或疋可撓性基板在光學微影 化學蝕刻所造成的基板損害。 時〃員〜及 因此，亟需-種侧並簡單的微奈_ 可克服因模仁之圖案結構的高低差而對圖案轉移製程之均 勻度、精確度、可#度與成功率所造成之負㈣變，同時 可克服可撓性基板上製作出微奈米圖案，因溫度產生的熱 變形或是顯影及化學蝕刻所造成的基板損害。 【發明内容】 因此，本發明之目的就是在提供一種微奈米圖案直接 接觸滾印於可撓性基板的方法，其係透過加熱壓印模仁上 之轉印材料層的方式’利用加熱後的轉印材料層局部接觸 可撓性基板it而局部加熱可撓性基板，使得與轉印材料層 • 接觸之可撓性基板可局部軟化，經滚印後進而可使模仁上 之轉印材料層黏附或壓入在局部軟化的可撓性基板上，順 利地將微奈米圖案轉印至可撓性基板上。 本發明之另一目的是在提供一種微奈米圖案直接接觸 滾印於可撓性基板的方法，其可利用滾輪來進行滾印動 作，因此可有效解決模仁與可撓性基板之接觸面之間可能 存在之高低差與均勻度的問題，而可提高轉印製程之可靠 度’進而可利用壓印製程將微奈米圖案順利地轉移至可撓 * 性基板上。 201029915 本發明之另一目的是在提供一種微奈米圖案直接接觸 滾印於可撓性基板的方法，其利用局部接觸加熱可撓性基 板而有效解決因溫度產生的基板熱變形，進而可利用壓印 製程將微奈米圖案順利地轉移至可撓性基板上。 本發明之另一目的是在提供一種微奈米圖案直接接觸 滚印於可挽性基板的方法’其利用直接接觸滾印轉印材料 層而達到一次性的轉印微奈米圖案，避免掉光學微影製程 時，顯影及化學姓刻所造成的基板損害，進而可利用壓印 製程將微奈米圖案順利地轉移至可撓性基板上。 根據本發明之上述目的，提出一種微奈米圖案直接接 觸滾印於可撓性基板的方法，至少包含：提供一模仁其 中模仁具有相對之第一表面與第二表面，且第一表面設有 一圖案結構，此圖案結構包含複數個凸狀部與複數個凹陷 部；形成一轉印材料層於前述之凸狀部與凹陷部上；設置 一可撓性基板於模仁上，其中可撓性基板具有相對之第一 表面與第二表面，且可撓性基板之第一表面與前述凸狀部 上之轉印材料層接觸；從模仁之第二表面進行一加熱步 驟，以經由凸狀部上之加熱後的轉印材料層局部接觸可撓 性基板進而局部加熱可撓性基板，使得與轉印材科層接觸 之可撓性基板可局部軟化；利用一滚輪在可撓性基板之第 二表面上進行一滾印步驟，以使凸狀部上之轉印材料層轉 貼黏附或壓入於可撓性基板之第一表面上；以及移除&輪 與模仁，而使模仁與凸狀部上之轉印材料層分離。 依照本發明一較佳實施例，上述之模仁的材料為杜邦 (DuPont)公司所生產的乙烯_四氟乙烯共聚物时 6 201029915 tetrafluoroethylene)。 根據本發明之目的，提出一種微奈米圖案直接接觸滾 印於可撓性基板的方法，至少包含：提供一模仁，其中模 仁具有相狀第一表面與第二表面，且第一表面設^ 一圖 案結構，此圖案結構包含複數個凸狀部與複數個凹陷部； 形成一抗沾黏膜層於前述之凸狀部與凹陷部上；形成一轉 印材料層於抗沾黏膜層上；設置一可撓性基板於模仁上， 其中可撓性基板具有相對之第一表面與第二表面，且可撓 φ 性基板之第一表面與凸狀部上之轉印材料層接觸；從模仁 之s亥第二表面進行一加熱步驟，以經由凸狀部上之加熱後 的轉印材料層局部接觸可撓性基板進而局部加熱可撓性基 板，使得與轉印材料層接觸之可撓性基板可局部軟化；利 用一滾輪在可撓性基板之第二表面上進行一滾印步驟，以 使凸狀部上之轉印材料層轉貼黏附或壓入於可撓性基板之 第一表面上；以及移除滾輪與模仁，而使前述凸狀部上之 轉印材料層與模仁上之抗沾黏膜層分離。 φ 依照本發明一較佳實施例，上述之模仁的材料可為梦 (Si);可撓性基板之材料可為聚乙烯對笨二甲酸酷 (Polyethylene Terephthalate ; PET);且加熱步驟係採用紅外 光燈源加熱器。 【實施方式】 本發明揭露一種微奈米圖案直接接觸滚印於可撓性基 板的方法，可利用滚印製程將微奈米圖案順利地轉移至可 • 撓性基板上。為了使本發明之敘述更加詳盡與完備，可參 7 201029915 照下列描述並配合第丨圖至第6圖之圖式。 實施其係繪示依照本發明-較佳 程剖面圖。在=以:接=^ 刚，其中約-⑽JL^ 壓印用之模仁 模仁100具有相對之表面1〇2與1〇4。如 槿= 1〇0之表面102上預設有欲進行轉印之圖宰： 構11〇,其+此圖案結才冓110包 陷部⑽。在本發财，^ 1G8與數個凹 圖案、、Ό構110之圖案尺寸齡接"5Γ • 米級。在一實施例中，模仁100之材料例如 可為矽(Si)、尚分子聚合物(p〇ly ;夥材料、半導_、金娜、石英、玻璃材料' 瓷材料、無機材料、或上述材料中任二者 合成之材料。 有乂上所 接下來，如第2圖所示，可選擇性地利用例如熱蒸錢 (Evap〇rati°n)方式形成抗沾黏膜層112 t蓋在模仁卿I圖 案結構110上。此抗沾點膜層112可包含二部分112a與 ❿U2b，其中抗沾黏膜層U2之部分112a覆蓋在圖案結構11〇 之凹陷部106的底面上’而抗沾黏膜層112之另-部分112b 則覆蓋在圖案結構110之凸狀部108的頂面上。在另一示 範實施例中’當所採用之模仁刚的材料本身具有抗沾黏 特性’例如具抗沾黏效果的含氟高分子聚合物❻咖⑺系 列材質’則可無需於模仁1〇〇之表自1〇2上額外設置上述 ，抗沾黏膜層/112。在一例子中，此具抗沾黏效果的含氟 尚分子聚合物系列材質例如可為杜邦（Dup〇叫公司所生產 -的乙稀-四氣乙稀共聚物(ethylene _fi_ethylenep 8 201029915 接著’請再次參照第2圖，利用例如熱蒸鍍或電子 蒸鍍法，或者化學氣相沉積或物理氣相沉積等方式並画 一般圖案定義技術，而在抗沾黏膜層112上形成轉印 ， 層114。轉印材料層114包含二部分U4a與114b，其中； 印材料層114之部分114a覆蓋在圖案結構110之凹 $ 106中之抗沾黏膜層n2的部分112a上’而轉印材料層 之部分114b則覆蓋在圖案結構no之凸狀部108之頂面上 之抗沾黏膜層112的部分112b上。在一些實施例中，咯 仁100的材料本身具有抗沾黏特性時，轉印材料層114 |、 可直接覆蓋在模仁100之圖案結構110上，其中轉印材= 層114之部分114a直接覆蓋在圖案結構11〇之凹陷部^6 的底面上，而轉印材料層114之另一部分U4b則直接 在圖案結構110之凸狀部1〇8之頂面上。轉印材料層 料可為無機材料、陶瓷材料、半導體材料、有機材料、 焉分子聚合物(polymer)系列材料、或塑膠材料。在一、 =中轉印材料層114之材料可例如為金屬，例如 金屬。藉由抗沾黏膜層112的設置，或者藉由採用其） ^材料就具有抗沾黏雜的模仁⑽，可在後續轉印過程 ’使模仁100之凸出部1〇8上之轉印材料,114的部分 順利脫離模仁1〇〇之凸狀部1〇8。 接下來’提供可撓性基板116，其中此可撓性基板ii6 「有相對之表面118與12()。在—實施射，可撓性基板 之材料例如可為有機材料、塑膠材料、高分子材料、 材料中任二者或任二者以上所合成之材料。在一示 已只方例中’可撓性基板116之材料可例如為聚乙婦對笨 9 201029915 二甲義。而後’請參照第3圖’將可撓性基板116設置 在模仁1〇〇之表面102上，並使可撓性基板116之表面ιι8 與模仁100之表© 102相對，且使可撓性基板116之表面 118與模仁100之圖案結構11〇之凸狀部1〇8上之轉印材料 層114的部分114b接觸。 隨後，請參照第4圖，提供加熱源122，並利用此加 熱源122從模仁1〇〇之表面1〇4進行加熱步驟。在此加熱 步驟中，加熱源122從模仁1〇〇之表面1〇4對模仁1〇〇加 鲁 熱，經過熱傳導及熱幅射效應而加熱模仁1〇〇之另一表面 102的凸狀部1〇8上之轉印材料層114的部分iMb，而受 熱之轉印材料層114的部分ii4b進一步對與其接觸之可撓 性基板116之表面118部分加熱，如此一來可局部加熱可 撓性基板116，而在與轉印材料層114之部分U4b接觸的 可撓性基板116的局部區域上形成加熱部分la。在一示 範實施例中，此一加熱步驟包含控制加熱溫度，以使與模 仁100之凸狀部108上之轉印材料層114的部分114b接觸 _ 之可撓性基板U6的受熱部分124達到玻璃轉變溫度(Tg) 熱熔融狀態，並控制溫度在避免使可撓性基板116的受熱 部分124以外的部分產生軟化熔融現象的範圍内，而使可 撓性基板116的文熱部分丨24產生軟化現象。因此，與可 撓性基板116之受熱部分124壓合之轉印材料層114的部 分114b可黏附或壓入在可撓性基板116之已軟化溶融的受 熱部分124中。在—些實施例中，上述之加熱步驟所採用 之加熱源122例如可為雷射光式加熱源、燈源照光式加熱 ' 源、熱電阻式加熱源、渦電流式加熱源、微波加熱式加熱 201029915 源或超音波加熱式加熱源。 在局部加熱可撓性基板116時，可提供滾輪126，並 將此滚輪126設置在可撓性基板116之表面120上，以從 可撓性基板116之表面120來對可撓性基板116施壓。在 一實施例中，滚輪126之材質可為透光材質。在一示範實 施例中，滾輪126之材質可為不透光材質。滾輪126之材 料例如可為玻璃、金屬、塑膠、高分子聚合物(p〇lymer)系 列材料、無機材料、陶瓷材料、半導體材料、或有機材料。 請參照第5圖，利用滾輪126在可撓性基板116之表面12〇 上進行滾印步驟，以使模仁1〇〇之圖案結構11()中的所有 凸狀部108上之轉印材料層114的部分11仆均可與可撓性 基板116之表面118更為緊密地接觸。由於此時可撓性基 板116之受熱部分124已經軟化熔融，因而經滾印步驟後， 可使所有凸狀部108上之轉印材料層114的部分U4b完全 轉印於可撓性基板116之表面118。因此，藉由滾輪126 的輔助，可有效解決模仁1〇〇之凸狀部1〇8上的轉印材料 層114的部分114b與可撓性基板116之接觸面之間可能存 在之高低差與均勻度的問題，彌補接觸面平整度不足之缺 失，如此一來可提高轉印製程之可靠度。 、 在-示範實施例中，模仁1〇〇之材料可例如為石夕，可 撓性基板Π6之材料可例如為聚乙烯對苯二甲酸酯，而 熱步驟所採用之加熱源122則可例如杜外光燈源加^ 器。由於紅外光對砂所構成之模仁⑽的透光率高，因: 除了間接之熱傳導加熱外’紅外光亦可直接對模仁刚之 另一表面102上的轉印材料層114加熱，而可使加熱源122 201029915 之能量有效傳遞’進而可提高製程效率。在此示範實施例 - 中’上述之加熱步驟之加熱溫度可例如控制在介於實質9〇 。與實質110°之間，以能使可撓性基板116與轉印7才料層 114接觸之部分達熱熔融為主。 然後’自可撓性基板116之表面120上移除滾輪126， 再將模仁100與可挽性基板116分離。此時，由於模彳_ 1 〇〇 與轉印材料層114之間設有抗沾黏膜層112，或者模仁1 〇〇 本身之材料具有抗沾黏特性，再加上模仁1〇〇之圖案結構 》 110之凸狀部108上之轉印材料層114的部分11朴黏附或 壓入於可撓性基板116之經加熱而局部軟化溶融的加熱部 分124，因此模仁1〇〇之凸狀部108上的轉印材料層114 的部分114b可順利脫離模仁1〇〇之凸狀部1〇8，而順利地 轉印黏附或壓入至可撓性基板116之表面118上，並在可 撓性基板11ό之表面118上形成轉印圖案結構128，如第6 圖所示。如此一來，即已完成將模仁100之圖案結構11〇 的圖案直接轉印於可撓性基板116的製程。 • 由上述之實施例可知，本發明之一優點就是因為本發 明之微奈米圖案直接接觸滚印於可撓性基板的方法可透過 加熱壓印模仁上之轉印材料層的方式，利用加熱後的轉印 材料層局部接觸可撓性基板進而局部加熱可撓性基板，而 可局部軟化炼融與轉印材料層接觸之可撓性基板，進而可 使模仁上之轉印材料層順利地轉印至可撓性基板上。 由上述之實施例可知，本發明之另一優點就是因為本 發明之微奈米圖案直接接觸滾印於可撓性基板的方法可利 用滾輪來進行滾印動作，因此可有效解決模仁與可撓性基 12 201029915 板之接觸面之間可能存在之高低差與均勻度的問題，而可 • 提高轉印製程之可靠度，進而可利用壓印製程將微奈米圖 案順利地轉移至可撓性基板上。 由上述之實施例可知，本發明之又一優點就是因為本 發明之微奈米圖案直接接觸滾印於可撓性基板的方法係利 用局部接觸加熱可撓性基板，而可有效解決因溫度產生的 基板熱變形，進而可利用壓印製程將微奈米圖案順利地轉 移至可撓性基板上。 , 由上述之實施例可知，本發明之再一優點就是因為本 發明之微奈米圖案直接接觸滾印於可撓性基板的方法係利 用直接接觸滚印轉印材料層而達到一次性的轉印微奈米圖 案，可避免掉光學微影製程時，顯影及化學蝕刻所造成的 基板損害’進而可利用壓印製程將微奈米圖案順利地轉移 至可挽性基板上。 雖然本發明已以一較佳實施例揭露如上，然其並非用 以限定本發明，任何在此技術領域中具有通常知識者，在 Φ 不脫離本發明之精神和範圍内，當可作各種之更動與潤 飾’因此本發明之保護範圍當視後附之申請專利範圍所界 定者為準。 【圖式簡單說明】 為讓本發明之上述和其他目的、特徵、優點與實施例 能更明顯易懂，所附圖式之說明如下： 第1圖至第6圖係繪示依照本發明一較佳實施例的一 種滾輪辅助微奈米圖案直接轉印於可撓性基板的製程剖面 13 201029915 圖。 【主要元件符號說明】 100 :模仁 102 :表面 104 :表面 106 :凹陷部 108 :凸狀部 110 :圖案結構 112 :抗沾黏膜層 112a :部分 112b :部分 114 :轉印材料層 114a :部分 114b :部分 116 :可撓性基板 118 :表面 120 :表面 122 :加熱源 124 :加熱部分 126 :滾輪 128 :轉印圖案結構 14201029915 VI. Description of the Invention: [Technical Field] The present invention relates to a micro/nano Impnntmg Pr0cess, and in particular to a micro-nano pattern direct contact roll-to-roll Method of a substrate. [Prior Art] As the size of electronic components is shrinking, the definition of the pattern of components is also seriously tested. In the current electronic component manufacturing process, optical lithography is generally used to define the feature pattern of the component. However, limited by the limits of optical diffraction, the pattern feature size that optical lithography can define is also severely limited. In view of this, the Micro/Nano-imprinting Technology developed in recent years has been regarded as one of the most promising methods to surpass and replace the traditional micro-nano optical lithography process technology in the future. Among the imprinting technologies that have been developed so far, contact micro-nano pattern transfer/printing technology is a recent common imprinting technique. The contact micro-nize pattern transfer technology is to place the transfer material layer on the pattern structure of the mold core, and then press the pattern structure of the substrate pattern mold to press the material layer and the substrate on the convex portion of the pattern structure. Surface bonding, followed by heating the side of the transfer material layer; 'to increase the adhesion between the transfer material layer on the convex portion of the mold and the substrate surface' and then removing the mold 'g卩 can be used to pattern the mold The layer of printed material is transferred to the surface of the substrate, and the micro-nano pattern is completed. However, the size of the actual transfer pattern continues to shrink to the micro-nano ruler. 4 201029915 = The height difference between the segments will greatly reduce the pattern transfer. Uniformity, accuracy, reliability. The micro-nano pattern is made on the board, and it must be vouchers, e, 疋 榥 · · · 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 可 可 可 可 可 可 可 可 可 可 可 可Substrate damage caused by chemical etching. 〃 〜 及 及 及 及 及 及 及 及 及 及 及 及 及 种 种 种 种 种 种 种 种 种 种 种 _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ (4) The change can also overcome the micro-nano pattern on the flexible substrate, the thermal deformation caused by temperature or the substrate damage caused by development and chemical etching. SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a method for direct contact of a micro-nano pattern onto a flexible substrate by means of heating the layer of the transfer material on the imprinted mold. The transfer material layer partially contacts the flexible substrate and locally heats the flexible substrate, so that the flexible substrate in contact with the transfer material layer can be partially softened, and the transfer can be performed on the mold after the roll printing. The material layer is adhered or pressed onto the partially softened flexible substrate to smoothly transfer the micro-nano pattern onto the flexible substrate. Another object of the present invention is to provide a method for directly contacting a micro-nano pattern to a flexible substrate, which can perform a roll printing operation using a roller, thereby effectively solving the contact surface between the mold core and the flexible substrate. There may be a problem of height difference and uniformity between them, and the reliability of the transfer process can be improved', and the micro-nano pattern can be smoothly transferred to the flexible substrate by the imprint process. 201029915 Another object of the present invention is to provide a method for directly contacting a micro-nano pattern onto a flexible substrate, which utilizes local contact heating of the flexible substrate to effectively solve the thermal deformation of the substrate due to temperature, and thus can be utilized. The imprint process smoothly transfers the micro-nano pattern onto the flexible substrate. Another object of the present invention is to provide a micro-nano pattern in direct contact with a method of printing on a printable substrate, which utilizes direct contact with the transfer transfer material layer to achieve a disposable transfer micro-nano pattern, avoiding In the optical lithography process, the substrate is damaged by development and chemical characterization, and the micro-nano pattern can be smoothly transferred to the flexible substrate by the embossing process. According to the above object of the present invention, a method for directly contacting a micro-nano pattern onto a flexible substrate is provided, comprising: providing a mold core in which the mold core has opposite first and second surfaces, and the first surface a pattern structure comprising a plurality of convex portions and a plurality of concave portions; forming a transfer material layer on the convex portion and the concave portion; and providing a flexible substrate on the mold core, wherein The flexible substrate has opposite first and second surfaces, and the first surface of the flexible substrate is in contact with the transfer material layer on the convex portion; a heating step is performed from the second surface of the mold to pass the convex The heated transfer material layer on the portion partially contacts the flexible substrate to locally heat the flexible substrate, so that the flexible substrate in contact with the transfer material layer can be partially softened; using a roller on the flexible substrate Performing a squeezing step on the second surface to cause the transfer material layer on the convex portion to be adhered or pressed onto the first surface of the flexible substrate; and removing the & wheel and the mold, thereby making the mold Separation of the transfer material layer on the convex portions. According to a preferred embodiment of the present invention, the material of the above-mentioned mold core is ethylene tetrafluoroethylene copolymer produced by DuPont (6 201029915 tetrafluoroethylene). According to an object of the present invention, a method for directly contacting a micro-nano pattern to a flexible substrate is provided, comprising: providing a mold core, wherein the mold core has a first surface and a second surface, and the first surface a pattern structure comprising a plurality of convex portions and a plurality of concave portions; forming an anti-adhesion film layer on the convex portion and the concave portion; forming a transfer material layer on the anti-adhesion film layer Providing a flexible substrate on the mold core, wherein the flexible substrate has opposite first and second surfaces, and the first surface of the flexible substrate is in contact with the transfer material layer on the convex portion; Performing a heating step from the second surface of the mold core to partially contact the flexible substrate via the heated transfer material layer on the convex portion to locally heat the flexible substrate so as to be in contact with the transfer material layer The flexible substrate can be partially softened; a roll step is performed on the second surface of the flexible substrate by using a roller, so that the transfer material layer on the convex portion is affixed or adhered to the first of the flexible substrate. On the surface And removing the roller and the mold core to separate the transfer material layer on the convex portion from the anti-adhesion layer on the mold core. φ According to a preferred embodiment of the present invention, the material of the mold core may be Dream (Si); the material of the flexible substrate may be Polyethylene Terephthalate (PET); and the heating step is adopted. Infrared light source heater. [Embodiment] The present invention discloses a method in which a micro-nano pattern is directly contacted and printed on a flexible substrate, and the micro-nano pattern can be smoothly transferred onto the flexible substrate by a roll printing process. In order to make the description of the present invention more detailed and complete, reference can be made to 7 201029915 as described below and in conjunction with the drawings of Figures 6 through 6. The implementation is depicted in accordance with the present invention - a preferred cross-sectional view. In the ==:===, where about -(10)JL^ is used for imprinting the mold core 100 has opposite surfaces 1〇2 and 1〇4. For example, the surface 102 of 槿 = 1 〇 0 is pre-set with the pattern to be transferred: 11 〇, + 图案 图案 冓 包 包 包 包 包 包 包 包 包 包 包 包 包 包 包 包 包 包 包 包 包 包 包In this fortune, ^ 1G8 is connected to a number of concave patterns, and the size of the structure of the structure 110 is "5" • meters. In an embodiment, the material of the mold core 100 may be, for example, bismuth (Si), a molecular polymer (p〇ly; a material, a semiconductor material, a gold alloy, a quartz material, a glass material, a ceramic material, an inorganic material, or A material synthesized by any of the above materials. In the following, as shown in Fig. 2, the anti-adhesion film layer 112 can be selectively formed by, for example, hot evaporation (Evap〇rati°n). The anti-smudge layer 112 may include two portions 112a and ❿U2b, wherein a portion 112a of the anti-adhesion layer U2 covers the bottom surface of the recess 106 of the pattern structure 11 and resists The other portion 112b of the mucous layer 112 overlies the top surface of the convex portion 108 of the pattern structure 110. In another exemplary embodiment, 'when the material of the mold core used itself has anti-stick properties', for example The anti-adhesive effect of the fluoropolymer ❻ (7) series of materials can be additionally set on the 〇1〇〇2, which is not required to be applied to the 模1,2, anti-adhesive layer/112. In an example, this The fluorine-containing molecular polymer series material with anti-sticking effect can be DuPont (Dup screaming), for example. Ethylene-tetraethylene ethylene copolymer produced by the company (ethylene _fi_ethylenep 8 201029915 then 'Please refer to Figure 2 again, using, for example, thermal evaporation or electron evaporation, or chemical vapor deposition or physical vapor deposition By way of a general pattern definition technique, a transfer, layer 114 is formed on the anti-adhesion layer 112. The transfer material layer 114 comprises two portions U4a and 114b, wherein a portion 114a of the printed material layer 114 covers the pattern structure 110. The portion 112a of the anti-adhesion layer n2 in the recess $106 is formed on the portion 112b of the anti-adhesion layer 112 on the top surface of the convex portion 108 of the pattern structure no. In some embodiments, when the material of the oleoxon 100 itself has anti-stick properties, the transfer material layer 114 can be directly overlaid on the pattern structure 110 of the mold core 100, wherein the portion 114a of the transfer material = layer 114 is directly covered. The other portion U4b of the transfer material layer 114 is directly on the top surface of the convex portion 1〇8 of the pattern structure 110. The transfer material layer may be an inorganic material. , ceramic materials, semiconductors a material, an organic material, a ruthenium polymer series material, or a plastic material. The material of the transfer material layer 114 may be, for example, a metal such as a metal, by the anti-adhesion layer 112, or By using the material to have the anti-sticky mold core (10), the transfer material on the projections 1 of the mold core 100 can be smoothly removed from the mold 1 during the subsequent transfer process. The convex portion 1〇8. Next, a flexible substrate 116 is provided, wherein the flexible substrate ii6 "has opposite surfaces 118 and 12(). The material of the flexible substrate may be, for example, a material synthesized from any one or more of an organic material, a plastic material, a polymer material, and a material. In a single example, the material of the flexible substrate 116 can be, for example, a polymethylene pair of stupid 9 201029915. Then, please refer to FIG. 3, the flexible substrate 116 is placed on the surface 102 of the mold core 1 , and the surface ι 8 of the flexible substrate 116 is opposed to the surface 102 of the mold core 100, and is made flexible. The surface 118 of the substrate 116 is in contact with the portion 114b of the transfer material layer 114 on the convex portion 1〇8 of the pattern structure 11 of the mold core 100. Subsequently, referring to Fig. 4, a heating source 122 is provided, and the heating step 122 is used to perform a heating step from the surface 1〇4 of the mold core 1〇〇. In this heating step, the heating source 122 heats the mold core from the surface 1〇4 of the mold core 1 and heats the other surface 102 of the mold core 1 through heat conduction and heat radiation effect. The portion iMb of the transfer material layer 114 on the convex portion 1〇8, and the portion ii4b of the heated transfer material layer 114 further heats the surface 118 of the flexible substrate 116 in contact therewith, thereby locally heating The flexible substrate 116 is formed with a heating portion 1a on a partial region of the flexible substrate 116 that is in contact with a portion U4b of the transfer material layer 114. In an exemplary embodiment, the heating step includes controlling the heating temperature such that the heated portion 124 of the flexible substrate U6 that contacts the portion 114b of the transfer material layer 114 on the convex portion 108 of the mold core 100 reaches The glass transition temperature (Tg) is in a hot-melt state, and the temperature is controlled so as to avoid a softening and melting phenomenon in a portion other than the heat-receiving portion 124 of the flexible substrate 116, and the heat-generating portion 可24 of the flexible substrate 116 is generated. Softening phenomenon. Therefore, the portion 114b of the transfer material layer 114 which is pressed against the heated portion 124 of the flexible substrate 116 can be adhered or pressed into the softened and melted heat-receiving portion 124 of the flexible substrate 116. In some embodiments, the heating source 122 used in the heating step may be, for example, a laser light heating source, a light source heating type source, a thermal resistance heating source, an eddy current heating source, and a microwave heating type heating. 201029915 Source or ultrasonic heated heating source. When the flexible substrate 116 is locally heated, a roller 126 may be provided, and the roller 126 is disposed on the surface 120 of the flexible substrate 116 to apply the flexible substrate 116 from the surface 120 of the flexible substrate 116. Pressure. In one embodiment, the material of the roller 126 can be a light transmissive material. In an exemplary embodiment, the material of the roller 126 may be an opaque material. The material of the roller 126 may be, for example, a glass, a metal, a plastic, a p〇lymer series material, an inorganic material, a ceramic material, a semiconductor material, or an organic material. Referring to FIG. 5, a roller printing step is performed on the surface 12 of the flexible substrate 116 by the roller 126 so that the transfer material on all the convex portions 108 in the pattern structure 11 () of the mold core 1 is removed. Portions 11 of layer 114 may all be in closer contact with surface 118 of flexible substrate 116. Since the heated portion 124 of the flexible substrate 116 has softened and melted at this time, the portion U4b of the transfer material layer 114 on all the convex portions 108 can be completely transferred to the flexible substrate 116 after the printing step. Surface 118. Therefore, with the aid of the roller 126, the possible difference between the contact surface of the portion 114b of the transfer material layer 114 on the convex portion 1〇8 of the mold core 1 and the flexible substrate 116 can be effectively solved. With the problem of uniformity, it makes up for the lack of flatness of the contact surface, which can improve the reliability of the transfer process. In the exemplary embodiment, the material of the mold core 1 can be, for example, Shi Xi, the material of the flexible substrate Π 6 can be, for example, polyethylene terephthalate, and the heating source 122 used in the thermal step is For example, a Duguang light source can be added. Since the transmittance of the mold core (10) composed of infrared light to the sand is high, the infrared light can directly heat the transfer material layer 114 on the other surface 102 of the mold core, except for indirect heat conduction heating. The energy of the heating source 122 201029915 can be effectively transmitted', thereby improving the process efficiency. In the exemplary embodiment - the heating temperature of the above heating step can be controlled, for example, to be substantially 9 。. Between 110° and substantially 110°, the portion where the flexible substrate 116 is in contact with the transfer layer 114 is thermally melted. The roller 126 is then removed from the surface 120 of the flexible substrate 116 and the mold core 100 is separated from the slidable substrate 116. At this time, since the anti-adhesion film layer 112 is provided between the mold 彳 1 〇〇 and the transfer material layer 114, or the material of the mold core 1 itself has anti-stick property, plus the mold core 1 The portion 11 of the transfer material layer 114 on the convex portion 108 of the pattern structure 110 is adhered or pressed into the heated portion 124 of the flexible substrate 116 which is heated and locally softened and melted, so that the mold core is convex. The portion 114b of the transfer material layer 114 on the portion 108 can be smoothly separated from the convex portion 1〇8 of the mold core 1 and smoothly transferred or pressed onto the surface 118 of the flexible substrate 116, and A transfer pattern structure 128 is formed on the surface 118 of the flexible substrate 11A as shown in FIG. As a result, the process of directly transferring the pattern of the pattern structure 11 of the mold core 100 to the flexible substrate 116 has been completed. It can be seen from the above embodiments that one of the advantages of the present invention is that the method for directly contacting the micro-nano pattern of the present invention to be printed on a flexible substrate can be utilized by heating the layer of the transfer material on the stamping die. The heated transfer material layer partially contacts the flexible substrate to locally heat the flexible substrate, and partially softens the flexible substrate in contact with the transfer material layer, thereby enabling the transfer material layer on the mold core Smooth transfer to a flexible substrate. It can be seen from the above embodiments that another advantage of the present invention is that since the micro-nano pattern of the present invention directly contacts the method of printing on the flexible substrate, the roller can be used for the printing operation, thereby effectively solving the mold and the mold. Flexible base 12 201029915 There may be problems of height difference and uniformity between the contact faces of the plates, and the reliability of the transfer process can be improved, and the micro-nano pattern can be smoothly transferred to the flexible process by the imprint process. On the substrate. It can be seen from the above embodiments that another advantage of the present invention is that the method for directly contacting the micro-nano pattern of the present invention to be printed on the flexible substrate utilizes local contact heating of the flexible substrate, thereby effectively solving the temperature generation. The substrate is thermally deformed, and the micro-nano pattern can be smoothly transferred onto the flexible substrate by an imprint process. According to the above embodiments, another advantage of the present invention is that the method for directly contacting the micro-nano pattern of the present invention to be printed on a flexible substrate utilizes direct contact with the transfer transfer material layer to achieve a one-time transfer. The micro-nano pattern can avoid substrate damage caused by development and chemical etching during the optical lithography process, and the micro-nano pattern can be smoothly transferred to the smable substrate by the imprint process. While the present invention has been described above in terms of a preferred embodiment, it is not intended to limit the invention, and any of those skilled in the art can be made in various embodiments without departing from the spirit and scope of the invention. The scope of protection of the present invention is therefore defined by the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS In order to make the above and other objects, features, advantages and embodiments of the present invention more obvious, the description of the drawings is as follows: Figures 1 through 6 show a A roller-assisted micro-nano pattern of a preferred embodiment is directly transferred to a process profile of a flexible substrate 13 201029915. [Main component symbol description] 100: mold core 102: surface 104: surface 106: depressed portion 108: convex portion 110: pattern structure 112: anti-stick layer 112a: portion 112b: portion 114: transfer material layer 114a: portion 114b: portion 116: flexible substrate 118: surface 120: surface 122: heat source 124: heating portion 126: roller 128: transfer pattern structure 14