TW201044963A - Method of forming EMI shield on plastic workpiece - Google Patents

Method of forming EMI shield on plastic workpiece Download PDF

Info

Publication number: TW201044963A
Authority: TW; Taiwan
Prior art keywords: plasma; plastic workpiece; protection layer; interference protection; electromagnetic interference
Prior art date: 2010-06-25

Application number

TW99120810A

Other languages

English (en)

Chinese (zh)

Other versions

TWI407900B (fr

Inventor

Yi-Yuan Huang

pei-jun Lai

Shao-Wei Chen

Original Assignee

Linco Technology Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2010-06-25

Filing date

2010-06-25

Publication date

2010-12-16

2010-06-25 Application filed by Linco Technology Co Ltd filed Critical Linco Technology Co Ltd

2010-06-25 Priority to TW99120810A priority Critical patent/TW201044963A/zh

2010-12-16 Publication of TW201044963A publication Critical patent/TW201044963A/zh

2013-09-01 Application granted granted Critical

2013-09-01 Publication of TWI407900B publication Critical patent/TWI407900B/zh

Links

239000004033 plastic Substances 0.000 title claims abstract description 68
229920003023 plastic Polymers 0.000 title claims abstract description 68
238000000034 method Methods 0.000 title claims abstract description 30
238000004140 cleaning Methods 0.000 claims abstract description 39
238000006116 polymerization reaction Methods 0.000 claims abstract description 30
238000004544 sputter deposition Methods 0.000 claims abstract description 7
238000006243 chemical reaction Methods 0.000 claims description 20
239000007789 gas Substances 0.000 claims description 14
239000010949 copper Substances 0.000 claims description 6
QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 5
239000001301 oxygen Substances 0.000 claims description 5
229910052760 oxygen Inorganic materials 0.000 claims description 5
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
229910052802 copper Inorganic materials 0.000 claims description 4
238000012986 modification Methods 0.000 claims description 4
230000004048 modification Effects 0.000 claims description 4
239000002002 slurry Substances 0.000 claims description 3
229910001220 stainless steel Inorganic materials 0.000 claims description 3
239000010935 stainless steel Substances 0.000 claims description 3
KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims description 2
238000005336 cracking Methods 0.000 claims description 2
239000001307 helium Substances 0.000 claims description 2
229910052734 helium Inorganic materials 0.000 claims description 2
SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 claims description 2
229910052707 ruthenium Inorganic materials 0.000 claims description 2
XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims 4
229910052786 argon Inorganic materials 0.000 claims 2
238000010616 electrical installation Methods 0.000 claims 1
230000005611 electricity Effects 0.000 claims 1
230000005672 electromagnetic field Effects 0.000 claims 1
238000007654 immersion Methods 0.000 claims 1
239000004816 latex Substances 0.000 claims 1
229920000126 latex Polymers 0.000 claims 1
238000009832 plasma treatment Methods 0.000 claims 1
239000002689 soil Substances 0.000 claims 1
239000010410 layer Substances 0.000 description 35
238000004519 manufacturing process Methods 0.000 description 6
230000000694 effects Effects 0.000 description 4
238000005488 sandblasting Methods 0.000 description 4
238000007796 conventional method Methods 0.000 description 3
-1 polyethylene Polymers 0.000 description 3
229910052684 Cerium Inorganic materials 0.000 description 2
239000004698 Polyethylene Substances 0.000 description 2
239000004743 Polypropylene Substances 0.000 description 2
GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 description 2
239000000356 contaminant Substances 0.000 description 2
FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 2
UQEAIHBTYFGYIE-UHFFFAOYSA-N hexamethyldisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)C UQEAIHBTYFGYIE-UHFFFAOYSA-N 0.000 description 2
238000010849 ion bombardment Methods 0.000 description 2
229920000573 polyethylene Polymers 0.000 description 2
229920001155 polypropylene Polymers 0.000 description 2
239000000126 substance Substances 0.000 description 2
238000012360 testing method Methods 0.000 description 2
238000005406 washing Methods 0.000 description 2
ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
229910000831 Steel Inorganic materials 0.000 description 1
238000009825 accumulation Methods 0.000 description 1
239000004676 acrylonitrile butadiene styrene Substances 0.000 description 1
230000002411 adverse Effects 0.000 description 1
230000015572 biosynthetic process Effects 0.000 description 1
239000000460 chlorine Substances 0.000 description 1
229910052801 chlorine Inorganic materials 0.000 description 1
230000006866 deterioration Effects 0.000 description 1
238000011161 development Methods 0.000 description 1
238000005108 dry cleaning Methods 0.000 description 1
239000000428 dust Substances 0.000 description 1
239000002305 electric material Substances 0.000 description 1
229910052741 iridium Inorganic materials 0.000 description 1
GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
239000000463 material Substances 0.000 description 1
239000005416 organic matter Substances 0.000 description 1
239000002957 persistent organic pollutant Substances 0.000 description 1
238000007747 plating Methods 0.000 description 1
239000004417 polycarbonate Substances 0.000 description 1
229920000515 polycarbonate Polymers 0.000 description 1
229920000642 polymer Polymers 0.000 description 1
230000002265 prevention Effects 0.000 description 1
239000011241 protective layer Substances 0.000 description 1
238000005086 pumping Methods 0.000 description 1
150000004756 silanes Chemical class 0.000 description 1
238000001179 sorption measurement Methods 0.000 description 1
238000004611 spectroscopical analysis Methods 0.000 description 1
238000005507 spraying Methods 0.000 description 1
239000010959 steel Substances 0.000 description 1

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Physical Vapour Deposition (AREA)

TW99120810A 2010-06-25 2010-06-25 Method of forming EMI shield on plastic workpiece TW201044963A (en)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
TW99120810A TW201044963A (en)	2010-06-25	2010-06-25	Method of forming EMI shield on plastic workpiece

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
TW99120810A TW201044963A (en)	2010-06-25	2010-06-25	Method of forming EMI shield on plastic workpiece

Publications (2)

Publication Number	Publication Date
TW201044963A true TW201044963A (en)	2010-12-16
TWI407900B TWI407900B (fr)	2013-09-01

Family

ID=45001521

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
TW99120810A TW201044963A (en)	2010-06-25	2010-06-25	Method of forming EMI shield on plastic workpiece

Country Status (1)

Country	Link
TW (1)	TW201044963A (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN103050375A (zh) *	2011-10-14	2013-04-17	晟铭电子科技股份有限公司	屏蔽层制造方法
TWI898368B (zh) *	2023-12-25	2025-09-21	啟端光電股份有限公司	拼接膜和拼接顯示器

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
TW374741B (en) *	1997-09-08	1999-11-21	Ind Tech Res Inst	Formation of a plasma-polymerized anti-fogging film and the manufacturing method
TWI276397B (en) *	2003-03-21	2007-03-11	Hon Hai Prec Ind Co Ltd	EMI-shielding assembly and method for the manufacture of same
TWM256683U (en) *	2004-03-01	2005-02-01	Uvat Technology Co Ltd	The device for the reduction of EMI induced by radio frequency source
US20050241671A1 (en) *	2004-04-29	2005-11-03	Dong Chun C	Method for removing a substance from a substrate using electron attachment
TW200638105A (en) *	2006-06-05	2006-11-01	Mikuni Denshi Kk	A forming apparatus for the plasma polymer film
TWM340684U (en) *	2008-05-15	2008-09-11	Dixen Vacuum Technology Co Ltd	Electronic instrument housing with anti-EMI covering structure

2010
- 2010-06-25 TW TW99120810A patent/TW201044963A/zh unknown

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN103050375A (zh) *	2011-10-14	2013-04-17	晟铭电子科技股份有限公司	屏蔽层制造方法
TWI898368B (zh) *	2023-12-25	2025-09-21	啟端光電股份有限公司	拼接膜和拼接顯示器

Also Published As

Publication number	Publication date
TWI407900B (fr)	2013-09-01

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