201119104 、發明說明： 【發明所屬之技術領域】 本發明係關於半導體發光元件的封裝結構， 特別是關於發光二極體的封裝結構。 【先前技術】 已知發光二極體具有省電及高亮度的特性， 並且已普遍使用於各種照明應用。為了因應高 亮度的照明需求，進而提高發光二極體晶片的 功率及配置密度，如此伴隨了產生光二極體晶 片熱量積蓄的問題。若發光二極體晶片產生的 熱無法有效排出，那麼在發光二極體晶片上積 蓄的熱量，會嚴重的影響發光二極體晶片的發 光性能。已知的發光二極體封裝結構，通常透 過印刷電路板再將熱傳到散熱器上的方式，如 此散熱效果欠佳，最終將有導致發光二極體晶 片損壞縮短使用壽命之虞。 由於為發光二極體晶片所發出的光線具有 點光源、亮度不均勻的特色，因此就有必要在 光線的聚焦以及提高發光效率著手改進其缺 失。 【發明内容】 本發明的目的之一在於提供一種發光二極體 的封裝結構，其可將發光二極體晶片所產生的熱 快速且有效地排出，並且有效的提高發光效率。 為了達成上述及其他目的，因此提出包含兩相 流導熱裝置（two-phase-flow heat transfer 201119104 d e v i c e )之發光二極體的封裝結構，其包含 屬殼體，具有一内周壁、一底部及一開口之 一透鏡，設於該金屬殼體之開口 端；至少 二極體晶片，其係接合在該兩相流導熱裝 少一個平面上；一對外電性連接裝置，該 藉由至少一金屬導線與該至少一發光二極 電性連接；一固定座，其將該兩相流導熱 該對外電性連接裝置以及該至少一發光二 片固定在一起。 根據木發明的另一樣態，所使用的該透 淫爾透鏡（Fresnel lens)或微透鏡 (microlens array)，還有該金屬殼體的内 將點光源的光線折射到該透鏡用以聚焦並 光效率。 根據本發明的另一樣態，兩相流導熱裝 熱管（heat pipe)或熱柱（heat column)0 根據泰發明的另一樣態，熱管之一端具 端面，且此平整端面與發光二極體晶片熱 該熱管可經彎折及/或壓扁，亦可將散熱片 該熱管上。 根據本發明的另一樣態，均溫板 chamber)於一表面上具有至少一個用於與 極體晶片熱接觸的凸部。 根據本發明的另一樣態，熱管之一端具 端面，且此平整端面與發光二極體晶片熱 :一金 罩體； 一發光 置的至 導線架 體晶片 裝置、 極體晶 鏡為非 陣列 部能夠 提升發 置可為 有平整 接觸， 焊接於 (vapor 發光二 有平整 接觸， 7 201119104 該熱管具有螺旋狀凹痕，可安裝另一熱管。 在參 本發 。所 限定 依比 般所 的菲 501 發光 線行 如果 光線 發明 > (未 一開 以呈 點光 本發明所屬技術領域中具有通常知識者， 閱本發明說明書及附圖後，將可最佳地理解 明之技術特點以及其他目的與優點。 【實施方式】 以下將參照附圖，說明本發明之實施例 例示之實施例僅為本發明的範例，並非用來 本發明之請求範圍。應瞭解的是，圖式並未 鲁 例繪製。 本發明所述之透鏡及金屬殼體可以是一 使用之物品，然而較佳的是使用如圖5所示 涅爾透鏡，其背面圖及側視圖分別如 5 0 2及 所示，其特性為聚光效果佳，並且可以提升 效率。如第6圖所示，為一點光源6 01的光 經菲淫爾透鏡的光線折射行進特性。相反的 Φ 是平行的光源其光線在行經菲涅爾透鏡時， 經折射後會聚焦在一起。在實際的應用於本 的封裝結構時，必須在該透鏡背面塗佈螢光却 顯示）並且面對著發光二極體晶片進行封裝。 而金屬殼體為具有一内周壁、一底部及 口之罩體，其中内周壁具有光滑之表面，可 碗狀或圓錐狀，可折射由發光二極體晶片的 源所發出的光線折射到該透鏡使其聚焦並提高發 201119104 光效率，如此可以使整體設計達到最佳的效果。 兩相流導熱裝置典型地包含高度真空的密閉 空間，且至少於其内壁上形成毛細結構。在此密 閉空間填充必要的工作流體，例如水、乙醇、氨 水或其混合物。利用工作流體兩相變化的潛熱， 將兩相流導熱裝置在一位置接受的熱迅速且大量 地傳導至另一位置。在稍後說明的實施例中，兩 相流導熱裝置將以熱管、熱柱及均溫板的形式來 實現。 第1圖顯示根據本發明之發光二極體的封裝 結構的第1實施例。該發光二極體的封裝結構包 含有中空之金屬殼體102,透鏡101置於該金屬殼 體102之開口端，熱管（或熱柱）106具有一平面， 至少一發光二極體晶片1 0 4設置於該熱管1 0 6之 平面上，此外還有對外電性連接裝置1 0 3、固定座 1 0 5設置於此結構中。而在離開該一平面端的另一 方向可設置一散熱裝置，而該散熱裝置為複數個 散熱片。 第2圖顯示根據本發明之發光二極體的封裝 結構的第2實施例。如第2圖所示，該發光二極 體的封裝結構包含有中空之金屬殼體202，透鏡 201置於該金屬殼體202之開口端，熱管206之中 間段具有一平整表面，至少一發光二極體晶片2 0 4 設置於該熱管 2 0 6之平整表面上，此外本實施例 201119104 還有對外電性連接裝置2 0 3、固定座2 0 5設置於此 結構中。而在離開熱管中間的平整表面往兩端口 方向分別設有散熱片2 0 7。 第3圖顯示根據本發明之發光二極體的封裝 結構的第3實施例。如第3圖所示，該發光二極 體的封裝結構包含有中空之金屬殼體 302，透鏡 3 0 1置於該金屬殼體3 0 2之開口端，均熱板3 06 具有一凸出的平整表面，至少一發光二極體晶片 304設置於該均熱板306之平整表面上，此外本實 施例還設有對外電性連接裝置 3 0 3、固定座 3 0 5 設置於此結構中。 第4圖顯示根據本發明之發光二極體的封裝 結構的第4實施例，其中熱管4 0 6為中空的管體， 其内部管壁有銅粉燒結，而熱管之一端口表面具 有平整的端面，而至少一發光二極體晶片4 0 4係 與熱管的平整端面熱接觸，熱管的其餘部位可與 其他導熱構件熱接觸。例如，該熱管4 0 6之外管 壁具有螺旋狀凹痕，可以被額外的熱管纏繞，使 得熱管4 0 6與該額外的熱管作熱接觸。在本例中， 熱管未必要筆直延伸。必要時，熱管4 0 6亦可依 需求進一步彎折成所需造型。此外本實施例還設 有對外電性連接裝置4 0 3、固定座4 0 5設置於此結 構中。 雖然本發明參照較佳實施例而進行說明示 範，惟應了解的是在不脫離本發明之精神及範疇 10 201119104 内，對於本發明所屬技術領域中具有通常知識者 而言，仍得有許多變化及修改。因此，本發明並 不限制於所揭露的實施例，而是以後附申請專利 範圍之文字記載為準，即不偏離本發明申請專利 範圍所為之均等變化與修飾，應仍屬本發明之涵 蓋範圍。 【圖式簡單說明】 第1圖為根據本發明之發光二極體的封裝結 構的第1實施例； φ 第2圖為根據本發明之發光二極體的封裝結 構的第2實施例，其中熱管係焊接有複數個散熱 片； 第3圖為根據本發明之發光二極體的封裝結 構的第3實施例，其中均溫板於其上表面具有與 絕緣層接觸的凸部； 第4圖為根據本發明之發光二極體的封裝結 構的第4實施例，其中熱管具有與發光二極體晶 # 片接觸的平整端面以及管壁具有螺旋狀凹痕，可 以被額外的熱管纏繞； 第5圖為一種應用於本發明之最佳實施例所 使用之菲涅爾透鏡的背面圖及側視圖。 第6圖為一般菲涅爾透鏡的光線行進路徑圖。 11 201119104 【主要元件符號說明】 101 201 301 401 透 鏡 102 202 302 402 金 屬 殼 體 103 203 303 403 對 外 電 性 連 接 裝 置 104 204 304 404 發 光 二 極 體 晶 片 105 205 305 405 固 定 座 106 20 6 306 406 兩 相 流 導 执 裝 置 207 散 執 片 501 菲 涅 爾 透 鏡 的 測 視 圖 502 菲 涅 爾 透 鏡 的 背 面 圖 601 點 光 源201119104, invention description: TECHNICAL FIELD The present invention relates to a package structure of a semiconductor light-emitting element, and more particularly to a package structure of a light-emitting diode. [Prior Art] Light-emitting diodes are known to have power saving and high brightness characteristics, and have been commonly used in various lighting applications. In order to increase the power and arrangement density of the light-emitting diode wafer in response to high-brightness illumination requirements, the problem of heat generation of the photodiode wafer is accompanied. If the heat generated by the light-emitting diode wafer cannot be effectively discharged, the heat accumulated on the light-emitting diode wafer may seriously affect the light-emitting performance of the light-emitting diode wafer. The known light-emitting diode package structure usually passes through the printed circuit board and then transfers heat to the heat sink. Therefore, the heat dissipation effect is not good, and eventually the light-emitting diode wafer is damaged and the service life is shortened. Since the light emitted from the light-emitting diode chip has a point light source and uneven brightness, it is necessary to improve the light focus and improve the light-emitting efficiency to improve the defect. SUMMARY OF THE INVENTION An object of the present invention is to provide a package structure of a light-emitting diode which can quickly and efficiently discharge heat generated by a light-emitting diode wafer and effectively improve luminous efficiency. In order to achieve the above and other objects, a package structure of a light-emitting diode including a two-phase-flow heat transfer device (201119104 device) is proposed, which comprises a housing having an inner peripheral wall, a bottom and a a lens of the opening, disposed at an open end of the metal casing; at least a diode chip coupled to the one of the two-phase flow heat-conducting devices; and an external electrical connection device by the at least one metal wire Electrically connecting with the at least one light-emitting diode; a fixing base that thermally conducts the two-phase flow to fix the external electrical connection device and the at least one light-emitting piece together. According to another aspect of the invention of the wood, the Fresnel lens or the microlens array, and the light of the inner point source of the metal casing are refracted to the lens for focusing and light. effectiveness. According to another aspect of the present invention, a two-phase heat-conducting heat pipe or a heat column is in accordance with another aspect of the invention of the invention, wherein one end of the heat pipe has an end face, and the flat end face and the light-emitting diode chip The heat pipe can be bent and/or flattened, and the heat sink can be placed on the heat pipe. According to another aspect of the invention, the temperature equalization plate chamber has at least one projection for thermal contact with the polar body wafer on a surface. According to another aspect of the present invention, one end of the heat pipe has an end face, and the flat end face is heated with the LED chip: a gold cover; a light-emitting to lead frame wafer device, and the polar body mirror is a non-array portion Can be raised to a flat contact, welded to (vapor light two have a flat contact, 7 201119104 The heat pipe has a spiral dent, can be installed another heat pipe. In the hair of the hair. The limited Philippine 501 If the light line is invented > (not open to highlight the light of the ordinary knowledge in the art to which the present invention pertains, the technical features and other objects and advantages will be best understood after reading the specification and the drawings. The embodiments of the embodiments of the present invention are merely illustrative of the present invention and are not intended to be used in the scope of the present invention. It should be understood that the drawings are not drawn. The lens and the metal casing of the present invention may be an article to be used, but it is preferred to use a Neel lens as shown in FIG. 5, the rear view and the side view thereof. As shown in Fig. 5 and respectively, the characteristic is that the concentrating effect is good, and the efficiency can be improved. As shown in Fig. 6, the light refracting traveling characteristic of the light of the light source 6 01 through the Philippine lens is opposite. Parallel light source, when the light passes through the Fresnel lens, it will be focused after being refracted. In the actual application of the package structure, it must be coated with fluorescent light on the back of the lens and face the light. The diode chip is packaged. The metal case is a cover having an inner peripheral wall, a bottom and a port, wherein the inner peripheral wall has a smooth surface, which can be bowl-shaped or conical, and can refract the source of the light-emitting diode chip. The emitted light is refracted to the lens to focus and improve the light efficiency of 201119104, which can achieve the best effect of the overall design. The two-phase flow heat conduction device typically comprises a highly vacuum-tight space and is formed at least on its inner wall. Capillary structure. Fill the confined space with the necessary working fluid, such as water, ethanol, ammonia or a mixture thereof. Using the latent heat of the two-phase change of the working fluid, the two-phase flow The heat received by the thermal device at one location is rapidly and largely conducted to another location. In the embodiments described later, the two-phase flow heat transfer device will be implemented in the form of a heat pipe, a hot column, and a temperature equalization plate. A first embodiment of a package structure of a light-emitting diode according to the present invention is shown. The package structure of the light-emitting diode includes a hollow metal case 102, and the lens 101 is placed at the open end of the metal case 102, and the heat pipe ( Or the thermal column 106 has a plane, at least one LED chip 104 is disposed on the plane of the heat pipe 106, and there is also an external electrical connection device 10, the fixed seat 105 is disposed here. In the structure, a heat dissipating device may be disposed in another direction away from the plane end, and the heat dissipating device is a plurality of heat sinks. Fig. 2 shows a second embodiment of the package structure of the light-emitting diode according to the present invention. As shown in FIG. 2, the package structure of the LED includes a hollow metal casing 202. The lens 201 is placed at the open end of the metal casing 202. The middle portion of the heat pipe 206 has a flat surface, at least one of which is illuminated. The diode wafer 2 0 4 is disposed on the flat surface of the heat pipe 206. In addition, in the embodiment 201119104, the external electrical connection device 203 and the fixed seat 205 are disposed in the structure. On the flat surface leaving the middle of the heat pipe, fins 2 0 7 are respectively disposed in the direction of the two ports. Fig. 3 shows a third embodiment of the package structure of the light-emitting diode according to the present invention. As shown in FIG. 3, the package structure of the LED includes a hollow metal case 302. The lens 310 is placed at the open end of the metal case 306, and the soaking plate 306 has a protrusion. The flat surface of the light-emitting diode wafer 304 is disposed on the flat surface of the heat-receiving plate 306. In addition, the external electrical connection device 303 is provided in the embodiment, and the fixed seat 305 is disposed in the structure. . Figure 4 is a view showing a fourth embodiment of the package structure of the light-emitting diode according to the present invention, wherein the heat pipe 406 is a hollow pipe body, the inner pipe wall is sintered with copper powder, and the surface of one of the heat pipes has a flat surface. The end surface, and at least one of the light emitting diode wafers 4 4 is in thermal contact with the flat end surface of the heat pipe, and the remaining portion of the heat pipe can be in thermal contact with the other heat conducting members. For example, the outer wall of the heat pipe 406 has a helical indentation that can be wrapped by an additional heat pipe such that the heat pipe 406 is in thermal contact with the additional heat pipe. In this case, the heat pipe does not have to extend straight. If necessary, the heat pipe 406 can be further bent into the desired shape as required. In addition, the present embodiment is further provided with an external electrical connection device 403 and a fixed seat 405 disposed in the structure. While the invention has been described with respect to the preferred embodiments, it is to be understood that many changes in the scope of the invention and the scope of the invention And modify. Therefore, the present invention is not limited to the disclosed embodiments, but the scope of the appended claims is intended to be . BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a first embodiment of a package structure of a light-emitting diode according to the present invention; FIG. 2 is a second embodiment of a package structure of a light-emitting diode according to the present invention, wherein The heat pipe is welded with a plurality of heat sinks; FIG. 3 is a third embodiment of the package structure of the light emitting diode according to the present invention, wherein the temperature equalizing plate has a convex portion in contact with the insulating layer on the upper surface thereof; In a fourth embodiment of the package structure of the light-emitting diode according to the present invention, wherein the heat pipe has a flat end face in contact with the light-emitting diode chip and the pipe wall has a spiral indentation, which can be wound by an additional heat pipe; Figure 5 is a rear view and a side view of a Fresnel lens used in the preferred embodiment of the present invention. Figure 6 is a ray travel path diagram of a general Fresnel lens. 11 201119104 [Description of main component symbols] 101 201 301 401 Lens 102 202 302 402 Metal housing 103 203 303 403 External electrical connection device 104 204 304 404 Light-emitting diode wafer 105 205 305 405 Mounting seat 106 20 6 306 406 Two Phase flow guiding device 207 loose film 501 Fresnel lens view 502 Fresnel lens back view 601 point light source