201210768 六、發明說明： 【發明所屬之技術領域】 本發明是關於-種晶片切割環帶 割晶片電阻器等晶片時被使用。 特疋尺寸分 【先前技術】 产：：已乂°晶么電阻器等晶片，是以-對晶片切判 ，將板（board)挾入而分割製造 3 切割’通常將板沿著-方向分割成細長板後（一= ::、=田長板沿著寬方向分割(二次切割)，成為多 产近Ϊ ^隨著晶片逐漸小型化的使用於晶片分割的 1疋使用於二次分割的環帶，有被小型化，並 極小的滑輪（pulIey)來使用的狀況。因此，做 ^㈣Μ #切割的環帶’較佳為妹性高且厚度薄 列如像專利文獻i所揭露，使用以橡膠或樹脂 feS=被覆織布芯體而構成的環帶（參照專利文獻 今i ,專利文獻1，橡膠或樹脂是例如以浸潰（diP)或 塗佈（，）處理，被覆於織布。 【先前技術文獻】 【專利文獻】 θ【專利文獻1】特開2006-62141號公報 但疋，如專利文獻1，只將橡膠或樹脂被覆於織布 面’由於晶片切割時的g載，橡膠或細旨會有自織布 201210768 ΐ ’有在織布產生編織錯位，織布的經絲 ，=’〜來環帶強度的低落，有縮短環帶壽命之 内"浸潰處理，橡膠糊或樹脂等被含浸於 w i ί =只是這樣並不能充分防止樹脂等的剝離 或、，哉布的編織錯位’又，織布本身有變硬之虞。 【發明内容】 因此，本發明有鑑於以上問題點，其目的在於提供 一種晶片切割環帶，可以防止樹脂自織布剝離或織布的 編織錯位，使環帶壽命提升。 關於本發明的晶片切割環帶，其特徵為具備：帆 布；以及熱可塑性樹脂層，被層積於帆布的一面側，且 壓入帆布内部，而到達至帆布的他面。 上述熱可塑性樹脂層的樹脂是在上述他面渗出，而 被覆該他面為較佳。又，帆布例如是筒狀編織的織布。 關於本發明的晶片切割環帶的製造方法，將熱可塑 性樹脂薄片重疊至帆布的一面而將這些一體化，其特徵 在於：藉由加熱並加壓前述熱可塑性樹脂薄片，使熔解 的熱可塑性樹脂薄片壓入前述帆布内部，而到達至帆布 的他面。 在本發明’藉由使熱可塑性樹脂層壓入至帆布内 4 了以防止在使用中產生帆布的編織錯位或樹脂層的 剝離，並提升帶的壽命。 曰、 201210768 【實施方式】 ，下’參照圖<說明關於本發明的實施形態。 第-圖表示關於本發明的—實施形態的晶片切 割環帶，從-片板（board) 1〇獲得多個晶片12的步驟 的概略圖。 如第-圖所示，板10沿著一方向被分割成多個細 長板U。細長板11再沿著垂直於其長方向的方向被分 割成晶片12。晶# 12是例如長及寬都為lmm以下的 〇.6mmx〇.3mm、〇.4mmx〇.2mm 等的小型晶片。 在本實施形態，細長板U被分割為晶片12時，使 用晶片分割裝置2 0。晶片分割裝置2 〇具備：上側環帶 被安裝圍繞四個滑輪21而運行；下侧環帶24，被 =裝圍繞四個滑輪23而運行，並被配置在上側環帶22 的下方。 =側％帶24，係其外周面的—部分被配置成面對 側％帶2 2㈣周面的一部分。下側環帶2 4的面對上 22的部分，係被小徑滑輪25向上方壓，而一部 := 又’可上下移動的施壓滑輪26被配置成隔著 ▼ 、24而面對小徑滑輪25。 細長板】i被送入至帶22、24彼此面對部分之間的 麸接，時’細長板U的長方向係一致於帶周方向。 二，’、.、田長板11 ’在被小徑滑輪25曲的彎曲部分s， ^側環帶2 2被施壓於施壓滑輪2 6藉此分割成晶片 201210768 帶22、24是平帶，上側環帶22，係成為晶片切割 面的帶外周面是以例如橡膠形成。另一方面，下側環帶 24，係成為晶片切割面的帶外周面，由於是以後述的熱 可塑性樹脂形成，所以下側環帶24的外周面，其硬度 變得比上側環帶22的外周面高。 接下來，用第二圖更詳細地說明關於下側環帶24。 下側環帶（晶片切割環帶）24,是沒有接縫的環狀平帶， 是由構成帶的芯體的帆布31與熱可塑性樹脂層32所組 成者。 帆布31，是以筒狀編織等無接縫環狀編織而成的 織布，是以沿著周方向配置的緯絲與沿著寬方向配置的 經絲所編織者。在此，沿著周方向的絲（緯絲），為了 在帶周方向賦予伸縮性，較佳為伸縮性絲，例如彈性尼 龍絲（wooly nylon )等聚醯胺（polyamide )纖維絲或 聚醋（polyester )纖維絲等。又，沿著寬方向的絲（經 絲），較佳為剛性高的非伸縮性絲，例如芳綸（aramid) 纖維絲。 織布的經絲及緯絲較佳為，絲的粗度為33〜 240dtex，編織密度為50〜190條/inch。若絲的粗度及 編織密度在如此範圍，則以後述的加熱、加壓，變得可 使熱可塑性樹脂層32從帆布31的一面到達至他面。 又，防止上述小型晶片沈入至織物結構（texture )的凹 部，防止晶片的切割不良等。又，也可以對於帆布31 用橡膠糊或RFL等接著劑施加含浸處理。 熱可塑性樹脂層32被層積在為帆布31的外周面的 201210768 一面3ΙΑ，與帆布31 —體化。下側環帶24係熱可塑性 樹脂層32被層積側的面變成帶外周面24Α而構成晶片 切割面，並且其相反側的面變成帶内周面24Β而構成滑 輪接觸面。 熱可塑性樹脂層32是以聚氨酯等熱可塑性樹脂所 構成者。熱可塑性樹脂層32的硬度，考慮晶片切割性 或耐久性等，為例如85〜98度。又，硬度是根據JIS Κ 6253來測量的Α型硬度計（durometer )硬度。 熱可塑性樹脂層32是從一面31A被壓入帆布31 内部，通過構成帆布31的絲之間，到達至帆布31的他 面（内周面）31B。在本實施形態，熱可塑性樹脂到達 至帆布31的他面31B整體，熱可塑性樹脂被浸透於帆 布31内部整體的縫隙。再者，熱可塑性樹脂在帆布31 的他面31B上滲出，變成被覆他面31B整體。 但是，熱可塑性樹脂層32的一部分，未被壓入至 帆布31内部，變成持續被配置在帆布31的一面31A 上。在未被壓入至帆布31而配置於帆布31 —面31A上 的熱可塑性樹脂層的厚度，變得比被覆帆布31的他面 31B的熱可塑性樹脂層的厚度還厚。如此，藉由在晶片 切割面（帶外周面24A)所配置的樹脂厚度變大，晶片 切割時產生的負載不易作用於帆布31，變得容易使帶 的壽命提升。 接下來，用第三圖來說明在本實施形態關於晶片切 割環帶的製造方法。在本實施形態，藉由具有下模40 以及上模41的成形模製造帶。首先，在環狀的帆布31 201210768 的内周側配置下模40，在下模40上載置帆布31的周 方向的一部分。接下來，藉由將熱可塑性樹脂薄片42 筒狀地纏繞在帆布31的外周，在帆布31的一面31A上 重疊熱可塑性樹脂薄片42。 接下來，將下模40以及上模41加熱至特定溫度， 並使在熱可塑性樹脂薄片42的上方所配置的上模41移 動至下方，以上模41以及下模40，將帆布31以及樹 脂薄片42挾著，將這些加熱並在厚度方向加壓。此時， 下模40與上模41被加熱至比構成熱可塑性樹脂薄片 42的熱可塑性樹脂的熔化開始溫度還高的溫度。下模 40與上模41的加熱溫度，為了使樹脂均勻到達至帆布 31的他面31B，較佳為高於熔化開始溫度10°C以上。 再者，為了防止樹脂的發泡等，提高帶的成形性，較佳 為熔化開始溫度與加熱溫度的差在20°C以下程度。 熱可塑性樹脂薄片42藉由上述加熱而熔化，熔化 的熱可塑性樹脂薄片42，藉由被按壓至上模41，壓入 帆布31内部，到達至帆布31的他面31B。此時，帆布 31以織物結構等在表面有凹凸，下模40與帆布31的 他面31B之間有些微空隙。因此，到達至他面31B的 熱可塑性樹脂滲出其縫隙（即他面31B上），變成被覆 帆布31的他面31B。 之後，藉由將冷卻水等冷卻媒體送入上模41以及 下模40的内部，將加熱溶化的熱可塑性樹脂薄片42冷 卻固化，使熱可塑性樹脂薄片42與帆布31的周方向的 一部分一體化。重複複數次如此操作，使熱可塑性樹脂 201210768 H 42與帆布全周—體化，得到如第 切割環帶24。 M | 丁幻日日片 P入2上的本實施形態’藉由將熱可塑性樹脂層32 内部’帆布31的各絲以熱可塑性樹脂被強 =寺:因此，可以防止帆布31與樹脂層32間的剝离^ 或在帆布31的編織錯位，可將帶長壽化。又埶 =性樹脂層32被壓人帆布31的内部，所以帶^、的、 厚度可以變薄，變得容易纏繞於小徑滑輪。 、 θ又，在本實施形態，上側環帶22 (參照第一圖） 是例如使用以往所知的晶片切割環帶，所以省略盆 說明。但是’也可以使用具有與上述的下側王裏帶&相 同結構的晶片切割環帶。 又，用來分割板10成細長板η的裝置，與晶片分 割裝置2G同樣。做為在該裝置的上側環帶以及下側環 帶，雖然使用與上述晶片分割裝置2〇的帶相異者，但 也可以使用相同結構的帶。 實施例 接下來，用實施例更詳細說明關於本發明，但本發 明並不限定於下述實施例。 [成形性評估] 用以下所示的實施例1〜7、比較例卜先實施成形 性評估。 [實施例1] 將絲的粗度llOdtex的芳綸纖維絲做為經絲，將絲 的粗度140dtex的聚酯纖維絲做為緯絲，分別在寬方 201210768 向、周方向配置，準備了環狀的筒狀編織布，該筒狀編 織布係以經絲的編織密度102條/inch、緯絲的編織密度 64條々11〇11編織而成。在該筒狀編織布的外周面上，由 硬度98度的聚碳酸酯系聚氨酯所組成的厚度0.15mm 的熱可塑性樹脂薄片被做為筒狀而重疊。對於重疊的織 布與在樹脂薄片的周方向的一部分，藉由已加熱到210 °C的上模以及下模，在壓力〇.7MPa下加壓加熱3分鐘， 使熱可塑性樹脂薄片軟化、溶化而流動化，壓入至織布 的周方向的一部分。其後，藉由將冷卻水送入上模與下 模内部而冷卻，使熱可塑性樹脂薄片與織布的周方向的 一部分一體化。重複複數次此操作，使熱可塑性樹脂薄 片與織布全周一體化，獲得實施例1的晶片切割環帶。 [實施例2〜7] 實施例2〜5除了經絲的編織密度、加壓時的上模 以及下模的溫度變更如表1所記載的點之外，其他與實 施例1同樣地實施。實施例6、7，做為熱可塑性樹脂 薄片，是使用由硬度85度的聚碳酸酯系聚氨酯所組成 的熱可塑性樹脂薄片，且除了加壓溫度如表1所記載的 點之外，其他與實施例1同樣地實施。 [比較例1] 在比較例1，用單罐式（one-pot)的成形裝置，做 為用來成形帶的裝置。在比較例1，將筒狀編織的織布、 熱可塑性樹脂薄片以這個順序纏繞在成形裝置的心軸 (mandrel)而成者，被放入成形罐内，罐内溫度為175 °C，藉由將這些在壓力l.lOMPa下加壓20分鐘，使熱 201210768 可塑性樹脂薄片與筒狀編織的織布一體化，製造比較例 1的環帶。又，加熱加壓時，熱可塑性樹脂薄片沒有熔 化。又，其他條件與實施例1同樣地實施。 在成形性評價中，關於以上述各實施例、比較例得 到的晶片切割環帶，評價是否樹脂被壓入織布内部，滲 出織布内周面。樹脂滲出於織布的内周面整體並被覆内 周面整體者在表1以〇表示，樹脂滲出於織布的内周面 整體，但未被覆内周面整體者以△表示，樹脂完全未滲 出於織布的内周面整體者以X表示。 表1 樹脂 帆布密度 加壓 一體 硬度 經絲（帶 緯絲（帶 條件 成形性 寬方向） 周方向） 密度（條 密度（條 /inch ) /inch ) 實施例1 98 102 64 210 °C X 〇 實施例2 98 96 64 3分鐘 〇 實施例3 98 86 64 〇 實施例4 98 102 64 200 °C X 〇 3分鐘 實施例5 98 102 64 195 t X Δ 3分鐘 實施例6 85 102 64 200 °C X 〇 3分鐘 201210768201210768 VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to a wafer-cut ring-cut wafer resistor or the like. Special Dimensions [Prior Art] Production:: Wafers such as 晶 晶 电阻 电阻 , , , , , , 电阻 电阻 电阻 电阻 电阻 电阻 电阻 电阻 电阻 电阻 电阻 电阻 电阻 电阻 电阻 电阻 电阻 电阻 电阻 电阻 电阻 电阻 电阻 电阻 电阻 电阻 电阻 电阻 电阻 电阻 电阻After forming a slender plate (1 =::, = field long plate is divided along the width direction (secondary cutting), which becomes prolific near Ϊ ^ used for wafer segmentation as the wafer is gradually miniaturized for use in quadratic segmentation The endless belt is used in a small size and has a very small pulley (pulIey). Therefore, it is preferable to make a ^(4)Μ#cutted loop belt', which is preferably a high-profile and thin-thickness column as disclosed in Patent Document i. An endless belt composed of a rubber or resin feS=coated woven fabric core is used (refer to Patent Document 1, i. Patent Document 1, rubber or resin is treated, for example, by dipping (diP) or coating (,), and is coated with woven fabric. [Patent Document] [Patent Document 1] JP-A-2006-62141. However, as disclosed in Patent Document 1, only rubber or resin is coated on the surface of the woven fabric. , rubber or fine will have self-woven cloth 201210768 ΐ 'has been produced in weaving Weaving the wrong position, weaving the warp yarn, = '~ the strength of the loop belt is low, there is a shortening of the life of the loop belt" "impregnation treatment, rubber paste or resin is impregnated in wi ί = just this does not adequately prevent the resin The peeling or the woven fabric is misaligned, and the woven fabric itself is hardened. [Invention] Therefore, the present invention has been made in view of the above problems, and an object thereof is to provide a wafer cutting ring belt which can prevent resin The woven fabric is peeled off or the woven fabric is misaligned to improve the life of the rim. The wafer dicing tape of the present invention is characterized in that it is provided with: a canvas; and a thermoplastic resin layer which is laminated on one side of the canvas and pressed It is placed inside the canvas and reaches the other side of the canvas. The resin of the thermoplastic resin layer is oozing out on the other surface, and it is preferable to cover the other surface. Further, the canvas is, for example, a tubular woven fabric. In the method for manufacturing a wafer-cut annulus of the invention, the thermoplastic resin sheet is superposed on one side of the canvas to integrate these, characterized in that the thermoplastic tree is heated and pressurized. The sheet causes the melted thermoplastic resin sheet to be pressed into the inside of the canvas to reach the other side of the canvas. In the present invention, the thermoplastic resin is laminated into the canvas 4 to prevent the weaving of the canvas during use. Dislocation or peeling of the resin layer, and the life of the tape is improved. 实施, 201210768 [Embodiment], and the following describes an embodiment of the present invention. The first embodiment shows a wafer cutting ring according to the embodiment of the present invention. A schematic view of a step of obtaining a plurality of wafers 12 from a board 1. As shown in the first figure, the board 10 is divided into a plurality of elongated boards U in one direction. The elongated board 11 is further along The direction perpendicular to the longitudinal direction thereof is divided into wafers 12. The crystal #12 is a small wafer such as 〇.6 mm x 〇.3 mm, 〇.4 mm x 〇. 2 mm having a length and a width of 1 mm or less. In the present embodiment, when the elongated plate U is divided into the wafer 12, the wafer dividing device 20 is used. The wafer dividing device 2 is provided with an upper side belt that is mounted to run around the four pulleys 21, and a lower side belt 24 that is mounted to surround the four pulleys 23 and disposed below the upper side belt 22. The side % band 24 is a portion of its outer peripheral surface that is configured to face a portion of the side % 2 2 (four) circumferential surface. The portion of the lower side belt 24 facing the upper portion 22 is pressed upward by the small diameter pulley 25, and a portion of the pressure pulley 26 that is movable up and down is configured to face each other across the ▼, 24 Small diameter pulley 25. The elongated plate i is fed to the bran between the facing portions of the belts 22, 24, and the long direction of the elongated plate U is consistent with the circumferential direction of the belt. Second, the ', ., and the long board 11' are bent by the curved portion s of the small diameter pulley 25, and the side ring belt 2 2 is pressed against the pressing pulley 26 to be divided into wafers 201210768. The belt, the upper side belt 22, and the belt outer peripheral surface which is the wafer cutting surface are formed of, for example, rubber. On the other hand, the lower endless belt 24 is a belt outer peripheral surface of the wafer cutting surface, and is formed of a thermoplastic resin to be described later, and the outer peripheral surface of the lower side endless belt 24 has a hardness higher than that of the upper side belt 22 The outer circumference is high. Next, the lower side annulus 24 will be explained in more detail with the second diagram. The lower endless belt (wafer cutting endless belt) 24 is an annular flat belt having no seam, and is composed of a canvas 31 constituting a core of the belt and a thermoplastic resin layer 32. The canvas 31 is a woven fabric which is woven by a seamless loop such as a tubular woven fabric, and is a weft which is disposed along the circumferential direction and a warp which is disposed along the width direction. Here, in order to impart stretchability in the circumferential direction of the filaments (weft) in the circumferential direction, a stretchable filament, for example, a polyamide filament such as an elastic nylon or a polyacetate is preferably used. (polyester) fiber filaments, etc. Further, the filament (warp) in the width direction is preferably a non-stretching filament having a high rigidity, such as an aramid filament. The warp and weft of the woven fabric preferably have a wire thickness of 33 to 240 dtex and a weaving density of 50 to 190 pieces/inch. When the thickness and the weaving density of the yarn are in such a range, the heating and pressurization described later can cause the thermoplastic resin layer 32 to reach from the one side of the canvas 31 to the other side. Further, the small wafer is prevented from sinking into the concave portion of the texture of the fabric, and the dicing failure of the wafer or the like is prevented. Further, the canvas 31 may be subjected to an impregnation treatment with an adhesive such as a rubber paste or RFL. The thermoplastic resin layer 32 is laminated on the side of 201210768 which is the outer peripheral surface of the canvas 31, and is formed integrally with the canvas 31. The lower end belt 24 is formed on the side of the laminated side of the thermoplastic resin layer 32 to form a wafer-cut surface, and the surface on the opposite side becomes the inner peripheral surface 24 of the belt to constitute a sliding contact surface. The thermoplastic resin layer 32 is composed of a thermoplastic resin such as polyurethane. The hardness of the thermoplastic resin layer 32 is, for example, 85 to 98 degrees in consideration of wafer cutting property, durability, and the like. Further, the hardness is a durometer hardness measured in accordance with JIS Κ 6253. The thermoplastic resin layer 32 is pressed into the inside of the canvas 31 from the one surface 31A, and passes between the filaments constituting the canvas 31 to reach the other surface (inner peripheral surface) 31B of the canvas 31. In the present embodiment, the thermoplastic resin reaches the entire face 31B of the canvas 31, and the thermoplastic resin is impregnated into the entire gap of the inside of the sail 31. Further, the thermoplastic resin oozes on the other surface 31B of the canvas 31, and becomes the entire surface 31B. However, a part of the thermoplastic resin layer 32 is not pressed into the inside of the canvas 31, and is continuously placed on the one surface 31A of the canvas 31. The thickness of the thermoplastic resin layer disposed on the canvas 31 surface 31A without being pressed into the canvas 31 is thicker than the thickness of the thermoplastic resin layer of the face 31B of the coated canvas 31. As a result, the thickness of the resin disposed on the wafer-cut surface (with the outer peripheral surface 24A) becomes large, and the load generated during the wafer cutting does not easily act on the canvas 31, and the life of the belt can be easily improved. Next, a method of manufacturing the wafer cutting endless belt in the present embodiment will be described using a third diagram. In the present embodiment, a belt is produced by a molding die having a lower mold 40 and an upper mold 41. First, the lower mold 40 is placed on the inner peripheral side of the endless canvas 31 201210768, and a part of the circumferential direction of the canvas 31 is placed on the lower mold 40. Next, the thermoplastic resin sheet 42 is superposed on the one surface 31A of the canvas 31 by winding the thermoplastic resin sheet 42 around the outer circumference of the canvas 31. Next, the lower mold 40 and the upper mold 41 are heated to a specific temperature, and the upper mold 41 disposed above the thermoplastic resin sheet 42 is moved to the lower side, the upper mold 41 and the lower mold 40, and the canvas 31 and the resin sheet are used. 42 licking, these are heated and pressurized in the thickness direction. At this time, the lower mold 40 and the upper mold 41 are heated to a temperature higher than the melting start temperature of the thermoplastic resin constituting the thermoplastic resin sheet 42. The heating temperature of the lower mold 40 and the upper mold 41 is preferably higher than the melting start temperature by 10 ° C or more in order to uniformly reach the resin to the face 31B of the canvas 31. Further, in order to prevent foaming of the resin or the like and to improve the moldability of the belt, it is preferred that the difference between the melting start temperature and the heating temperature is about 20 °C or lower. The thermoplastic resin sheet 42 is melted by the above heating, and the melted thermoplastic resin sheet 42 is pressed into the upper mold 41, pressed into the inside of the canvas 31, and reaches the face 31B of the canvas 31. At this time, the canvas 31 has irregularities on the surface with a woven structure or the like, and there is a slight gap between the lower mold 40 and the other surface 31B of the canvas 31. Therefore, the thermoplastic resin reaching the face 31B oozes out of the gap (i.e., on the face 31B) and becomes the face 31B of the covered canvas 31. After that, the cooling medium such as cooling water is sent to the inside of the upper mold 41 and the lower mold 40, and the thermoplastic resin sheet 42 which is heated and melted is cooled and solidified, and the thermoplastic resin sheet 42 is integrated with a part of the canvas 31 in the circumferential direction. . This operation is repeated a plurality of times to form the thermoplastic resin 201210768 H 42 and the canvas all around to obtain, for example, the first cutting ring belt 24. M | The present embodiment of the Ding singer Japanese P&P> 2 'by the thermoplastic resin layer 32, the inside of the canvas 31 is made of a thermoplastic resin to be strong = Temple: Therefore, the canvas 31 and the resin layer 32 can be prevented. The stripping between the two or the weaving of the canvas 31 can lengthen the strip. Further, the resin layer 32 is pressed against the inside of the canvas 31, so that the thickness of the tape can be reduced and the tape can be easily wound around the small-diameter pulley. Further, in the present embodiment, the upper endless belt 22 (see the first drawing) is, for example, a conventionally used wafer cutting endless belt, and therefore the description of the basin is omitted. However, it is also possible to use a wafer dicing tape having the same structure as the above-described lower kingdom tape & Further, the means for dividing the plate 10 into the elongated plate η is the same as the wafer dividing device 2G. The upper side belt and the lower side belt of the apparatus are different from those of the above-described wafer dividing device 2, but a belt of the same configuration may be used. EXAMPLES Next, the present invention will be described in more detail by way of examples, but the present invention is not limited to the following examples. [Formability Evaluation] The moldability evaluation was carried out by using Examples 1 to 7 and Comparative Examples shown below. [Example 1] Aramid fiber yarn having a thickness of llOdtex of a wire was used as a warp yarn, and a polyester fiber yarn having a yarn thickness of 140 dtex was used as a weft yarn, and was placed in the width direction of the 201210768 direction and the circumferential direction, and prepared. An annular tubular woven fabric obtained by weaving a warp density of 102 pieces/inch and a weft density of 64 々11〇11. On the outer peripheral surface of the tubular woven fabric, a thermoplastic resin sheet having a thickness of 0.15 mm composed of a polycarbonate-based polyurethane having a hardness of 98 degrees was formed into a tubular shape and overlapped. The thermoplastic woven resin sheet was softened and melted by pressurizing and heating at a pressure of 77 MPa for 3 minutes by the upper mold and the lower mold heated to 210 ° C in the circumferential direction of the resin woven fabric. The fluidization is pressed into a part of the circumferential direction of the woven fabric. Thereafter, the cooling water is sent to the upper mold and the inside of the lower mold to be cooled, and the thermoplastic resin sheet is integrated with a part of the woven fabric in the circumferential direction. This operation was repeated a plurality of times to integrate the thermoplastic resin sheet and the woven fabric all the week to obtain the wafer dicing ring of Example 1. [Examples 2 to 7] Examples 2 to 5 were carried out in the same manner as in Example 1 except that the warp density of the warp yarn and the temperature change of the upper mold and the lower mold at the time of pressurization were as shown in Table 1. In the examples 6 and 7, as the thermoplastic resin sheet, a thermoplastic resin sheet composed of a polycarbonate-based polyurethane having a hardness of 85 degrees was used, and the points other than the pressures as shown in Table 1 were Example 1 was carried out in the same manner. [Comparative Example 1] In Comparative Example 1, a one-pot forming apparatus was used as a means for forming a belt. In Comparative Example 1, a tubular woven fabric or a thermoplastic resin sheet was wound around the mandrel of the forming apparatus in this order, and was placed in a forming tank at a temperature of 175 ° C. These loops of Comparative Example 1 were produced by pressurizing these at a pressure of 1.0 MPa for 20 minutes to integrate the heat 201210768 plastic resin sheet with the tubular woven fabric. Further, when heated and pressurized, the thermoplastic resin sheet was not melted. Further, other conditions were carried out in the same manner as in the first embodiment. In the evaluation of the moldability, the wafer-cut endless belt obtained in each of the above Examples and Comparative Examples was evaluated for whether or not the resin was pressed into the inside of the woven fabric to bleed out the inner peripheral surface of the woven fabric. The resin penetrates the entire inner peripheral surface of the woven fabric and covers the entire inner peripheral surface. The whole of the inner peripheral surface is indicated by 〇 in Table 1. The resin penetrates the entire inner peripheral surface of the woven fabric, but the entire inner peripheral surface is not indicated by Δ, and the resin is completely absent. The entire inner peripheral surface of the woven fabric is indicated by X. Table 1 Resin canvas density pressurization integrated hardness warp (with weft (with conditional formability width direction) circumferential direction) Density (bar density (bar/inch) / inch) Example 1 98 102 64 210 °CX 〇Example 2 98 96 64 3 minutes 〇 Example 3 98 86 64 〇 Example 4 98 102 64 200 ° C X 〇 3 minutes Example 5 98 102 64 195 t X Δ 3 minutes Example 6 85 102 64 200 ° C X 〇 3 minutes 201210768
實施例7 85 102 64 195 °C X 3分鐘 Δ 比較例1 98 102 64 175 °C X 20分鐘 X 如上述，使熱可塑性樹脂薄片炫化、流動化，與織 布一體化的實施例1〜7中，樹脂薄片滲出至織布内周 面，可以與織布適當地一體化。但是，在實施例5、7， 加熱溫度相對低，樹脂薄片未充分地流動化，所以不能 以樹脂被覆織布内周面整體。另一方面，在比較例1， 加熱溫度低，未使熱可塑性樹脂薄片流動化，由於使樹 脂薄片與織布一體化，所以樹脂薄片未滲出至織布内周 面。 [耐久性測試] 接下來，用實施例8、比較例2的帶來實施耐久性 測試。 [實施例8] 與樹脂薄片一體化前的筒狀編織的織布，浸潰於接 著處理液後，藉由乾燥進行含浸處理，並且除了加壓加 熱時的壓力為〇.89MPa以外，其他與實施例1同樣地實 施。又，獲得的晶片切割環帶是以長880mm，寬15mm 來裁斷者。 [比較例2] 除了對筒狀編織的織布進行與實施例8同樣的含 浸處理外，其他與比較例1同樣地實施。又，帶長以及 12 201210768 寬係與實施例8同樣。 將實施例8、比較例2的帶，安裝於第四圖所示的 測試機50來評價耐久性。測試機50是假想地重現晶片 分割裝置的測試機。帶51之配置佈局係安裝圍繞於測 試機50的驅動滑輪52、從動滑輪53、54，再以兩個滑 輪55、56賦予拉緊裝置（tensioner)。此時，織布被配 置於帶内周面側、樹脂層被配置在帶外周面側。又，帶 51的安裝伸長率為1%。 配置直徑8mm的小徑滑輪57將帶51往上方按 壓，並配置直徑40mm的施壓滑輪58在面對小徑滑輪 57的位置。施壓滑輪58在其作為帶接觸面之外周面貼 附有晶片。在施壓滑輪58安裝5kg的重物（圖未顯示）， 施壓滑輪58以其重物被往下方拉伸，貼附有晶片的外 周面經常被施壓於帶51的外周面的狀態。在該狀態， 驅動滑輪52的旋轉數為700rpm，使帶51運行2小時 後，目視觀察實施例8、比較例2的帶的外觀。 2小時運行後的實施例8的帶，雖然在晶片被施壓 的部分出現條紋，但沒有發生樹脂層從織布剝離、織布 的絲破損斷裂的情形。另一方面，比較例2的帶，與實 施例8 —樣出現條紋，並出現該條紋的部分的樹脂層從 織布剝離。又，在晶片被施壓的部分，緯絲的一部分已 破損斷裂。又，關於運行前的帶，評價成形性後發現， 實施例8係以上述評價基準為〇，比較例2為X。 如上述，實施例的帶，樹脂層與織布的一體成形性 良好’在晶片分割裝置*樹脂層從織布剝離’絲不易破 13 201210768 才貝斷裂’可以提升帶的耐久性。 【圖式簡單說明】 第I圖.：表示晶片分割裝置的概略圖。 第示概略的晶片切割環帶的剖面圖。 :―圆·表示概略的晶片切割環 圖:表示耐久性測試的測，與;佈局:::: 【主要元件符號說明】 10板 11細長板 12晶片 20晶片分割裝置 21、23、55、56 滑輪 22上側環帶 24下側環帶（晶片切割環帶) 24A帶外周面 24B帶内周面 25、 57小徑滑輪 26、 58施壓滑輪 31帆布 31A 一 面 31B他面 32熱可塑性樹脂層 40下模 201210768 41上模 42熱可塑性樹脂薄片 50測試機 51帶 52驅動滑輪 53、54從動滑輪Example 7 85 102 64 195 ° CX 3 minutes Δ Comparative Example 1 98 102 64 175 ° CX 20 minutes X The thermoplastic resin sheet was smeared and fluidized as described above, and in Examples 1 to 7 integrated with the woven fabric The resin sheet is oozing out to the inner peripheral surface of the woven fabric, and can be appropriately integrated with the woven fabric. However, in Examples 5 and 7, since the heating temperature was relatively low and the resin sheet was not sufficiently fluidized, the entire inner peripheral surface of the woven fabric could not be coated with the resin. On the other hand, in Comparative Example 1, the heating temperature was low, and the thermoplastic resin sheet was not fluidized, and since the resin sheet and the woven fabric were integrated, the resin sheet did not bleed out to the inner peripheral surface of the woven fabric. [Durability Test] Next, durability tests were carried out using the belts of Example 8 and Comparative Example 2. [Example 8] The tubular woven fabric before being integrated with the resin sheet was impregnated with the treatment liquid, and then subjected to impregnation treatment by drying, and the pressure at the time of pressurization heating was 〇.89 MPa, and the like. Example 1 was carried out in the same manner. Further, the obtained wafer cutting ring tape was cut by a length of 880 mm and a width of 15 mm. [Comparative Example 2] The same procedure as in Comparative Example 1 was carried out except that the tubular woven fabric was subjected to the same impregnation treatment as in Example 8. Further, the belt length and the 12 201210768 wide system are the same as in the eighth embodiment. The tapes of Example 8 and Comparative Example 2 were attached to the testing machine 50 shown in Fig. 4 to evaluate the durability. The test machine 50 is a test machine that imaginarily reproduces the wafer dividing device. The layout of the belt 51 is mounted around the drive pulley 52, the driven pulleys 53, 54 of the test machine 50, and the tensioners are provided by the two pulleys 55, 56. At this time, the woven fabric is placed on the inner peripheral surface side of the belt, and the resin layer is disposed on the outer peripheral surface side of the belt. Further, the mounting elongation of the belt 51 was 1%. A small-diameter pulley 57 having a diameter of 8 mm is disposed to press the belt 51 upward, and a pressure pulley 58 having a diameter of 40 mm is disposed at a position facing the small-diameter pulley 57. The pressing pulley 58 has a wafer attached to the peripheral surface thereof as a belt contact surface. A weight of 5 kg (not shown) is attached to the pressing pulley 58, and the pressing pulley 58 is stretched downward with the weight thereof, and the outer peripheral surface to which the wafer is attached is often pressed against the outer peripheral surface of the belt 51. In this state, the number of rotations of the drive pulley 52 was 700 rpm, and after the belt 51 was operated for 2 hours, the appearance of the belts of Example 8 and Comparative Example 2 was visually observed. The tape of Example 8 after the operation for 2 hours showed streaks in the portion where the wafer was pressed, but the resin layer was not peeled off from the woven fabric, and the woven fabric was broken and broken. On the other hand, in the belt of Comparative Example 2, streaks appeared as in Example 8, and the resin layer of the portion where the streaks appeared was peeled off from the woven fabric. Further, in the portion where the wafer is pressed, a part of the weft is broken and broken. Further, regarding the tape before the operation, the moldability was evaluated, and it was found that Example 8 was based on the above evaluation criteria, and Comparative Example 2 was X. As described above, in the belt of the embodiment, the resin layer and the woven fabric are excellent in formability. In the wafer dividing device, the resin layer is peeled off from the woven fabric, and the yarn is not easily broken. BRIEF DESCRIPTION OF THE DRAWINGS Fig. I is a schematic view showing a wafer dividing device. A cross-sectional view of the schematic wafer cutting annulus is shown. : "circle" indicates a rough wafer cutting ring diagram: indicates the durability test, and layout; :::: [Main component symbol description] 10 plate 11 elongated plate 12 wafer 20 wafer dividing device 21, 23, 55, 56 Pulley 22 upper side belt 24 lower side belt (wafer cutting belt) 24A belt outer peripheral surface 24B with inner peripheral surface 25, 57 small diameter pulley 26, 58 pressure pulley 31 canvas 31A one side 31B other surface 32 thermoplastic resin layer 40 Lower mold 201210768 41 upper mold 42 thermoplastic resin sheet 50 test machine 51 belt 52 drive pulley 53, 54 driven pulley