TW201211309A

TW201211309A - Method and device of manufacturing solder plating wire

Info

Publication number: TW201211309A
Application number: TW100120460A
Authority: TW
Inventors: Katsutoshi Wakana; Takatoshi Kamimura; Takayuki Masui; Satoshi Tomimatsu; Katuyoshi Toma; Shun Tsukano; Takamasa Hayashi
Original assignee: Furukawa Electric Co Ltd; Riken Electric Wire Co Ltd
Priority date: 2010-06-11
Filing date: 2011-06-10
Publication date: 2012-03-16
Also published as: JP2012017515A; JP2012017523A; KR20150055098A; WO2011155477A1; JP5255673B2; KR101541790B1; CN102939402A; JP5367752B2; JP5367754B2; CN102939402B; JP2012017517A; JP5367753B2; JP2012017516A; TWI558847B; KR101630309B1; JP5255668B2; JP2012017518A; KR20130040899A

Abstract

The invention provides a method and device of manufacturing solder plating wires, which can obtain plating wires with sufficiently lowered 0.2% proof stress and expected quality by making it steady. According thereto, production yield is improved, and manufacturing efficiency is also improved. The device of manufacturing solder plating wires includes a pre-plating process mechanism, a plating mechanism and a winding mechanism. The pre-plating process mechanism performs a pre-plating process to a copper wire. The plating mechanism performs solder plating to the surface of the copper wire. After the copper wire is performed solder plating, the winding mechanism winds up the copper wire. The pre-plating mechanism includes annealing mechanism, which makes the copper wire soft annealing and lower proof stress. The lowered proof stress copper wire is winded with a winding strength lower than proof stress of the copper wire by the winding mechanism. The soft annealing mechanism, the plating mechanism and the winding mechanism are disposed on the side of the upper stream of the walking direction of the copper wire in a sequence.

Description

201211309 六、發明說明：【發明所屬之技術領域】本發明係有關應用於電氣電子設備或通信設備的鍍銲錫線的製造方法及製造裝置，更詳細的係作為太陽能電池的導線而應用，具有適當低耐力特性的鍍銲錫線的製造方法及製造裝置。【先前技術】應用於電子組件的浸鍍線之中，被要求須具有0.2%耐力值的低耐力特性。例如，太陽能電池用導線亦為其中一例。為了達到構成該太陽能電池之梦材料的低成本’或緩和材料供給不足的影響，太陽電池能單元正追求薄型化。然而，太陽能電池單元薄型化後，其強度變弱，且銲接太陽能電池單元之太陽能電池用導線的連接部分，因彼此的膨脹率差異，具有太陽電池容易產生彎曲或損壞的問題。因此，太陽能電池用導線與太陽能電池單元的連接部分，必須隨著太陽能電池單元變形，而使其0.2%耐力值 (proof stress )降低變為重要。由此，作為太陽能電池用導線，係使用具有低耐力特性的鍍銲錫線。無關於是否具有低耐力特性，專利文獻1所揭露的鍍銲錫線，係經由鍍銲錫工序而對待鍍線形成浸鍍層。 201211309 專利文獻1所揭露的鍍銲錫工序，係將作為待鍍線的金屬素線通過金屬素線導入口，且將其導入注入炼融浸鍵銲錫液的鍍液部，再從鍍銲錫線導出口導出後，以空氣冷卻等而對金屬素線施行浸鐘的工序。更進一步，於鍍銲錫線的製造工序中，除了上述鍍銲錫工序以外，亦對金屬素線的表面施行洗淨或退火等鍍銲錫前處理工序，而鍍銲錫工序的後工序係進行捲取浸鍍線的捲取工序。而連續對已低耐力化的待鍍線進行這樣的工序時，待鍍線容易承受負荷，因此，連續加工變得困難，即使可連續加工，也難以使期望品質的浸鍍線安定而獲得。例如，過於注重抑制已低耐力化之待鐘線所承受的負荷，則無法將待鍵線的表面充份洗淨，而使其表面殘留不純物或氧化層。如此一來，在之後的鍍銲錫工序，於待鍍線的表面形成浸鍍層時，浸鍍層變得容易剝落等，難以使期望品質的浸鍍線安定而獲得。其他方面也是，於製造浸鍍線的途中，為了降低浸鍍線（待鐘線）的耐力，無法提升浸鐘線的行走速度，而大幅花費製造時間，若進行連續加工，反而具有產生製造效率降低之情況的缺點。作為具有低耐力特性的鍍銲錫線的製造方法，例如專利文獻2所提出的，太陽能電池用平角導體的製造方法。於專利文獻2的太陽能電池用平角導體的製造方法， 201211309 係豬由壓延導體等工序而成形為平角狀後，藉由熱處理工序而使0.2%耐力值降低’且在導體表面施行鍍銲錫膜的製造方法。然而，引用文獻2針對進行熱處理方面的溫度設定，或還原爐（軟化退火爐）之内部環境的氣體成份等未有具體的記載，或熱處理工序以外的工序例如洗淨工序等，並無具體地提及。因此，即使假設進行洗淨工序，而這些熱處理工序、洗淨工序或汉鐘工序等各工序是否為獨立的生產線，或假設使這些複數工序係連續進行，則係以怎樣的工序順序進行，並不明確。即，如上所述，引用文獻2使平角導體的〇2%耐力值降低的同時，難以確保其作為太陽能電池導線的品質，另一方面，為了確保〇.2%耐力值降低之浸鍍線的品質，而使製造效率降低的兩相反課題，於引用文獻2未有任何著墨。 [習知技術文獻] [專利文獻] [專利文獻1]日本特開2000-80460號公報 [專利文獻2]日本特開2〇〇6_54355號公報【發明内容】在此，本發明之目的為提供一種鍍銲錫線的製造方法及製造裝置’其可獲得0.2%耐力值充份降低、期望品質的鍵線’藉由使這樣的浸鍍線安定而獲得，可提升製品產 201211309 率，又，可提升製造效率。本發明之一種鍍銲錫線的製造裝置，其可係以一浸鍍前處理機構、一浸鍍機構及一捲取機構而構成，該浸鍍前處理機構係對銅線進行浸鍍前處理，該浸鍍機構係於該銅線的表面施行鍍銲錫，該捲取機構係捲取表面已施行浸鍍的該銅線。其中，於該浸鍍前處理機構具有一軟化退火機構，其將該銅線軟化退火而使該銅線低耐力化；藉由該捲取機構，且以低於該銅線之耐力的捲取力將已低耐力化的該銅線捲取；將該軟化退火機構、該浸鍍機構及該捲取機構，從該銅線的行走方向的上游側依序一連串配置。在此，藉由該捲取機構以低於該銅線之耐力的低捲取力而捲取的構成，並不限於只藉由該捲取機構捲取銅線，亦包含例如將輸送絞盤配置於捲取機構的上游側，其輔助該捲取機構的捲取，藉由該捲取機構及該輸送絞盤作為捲取銅線的構成。該銅線並不限制形狀、尺寸，但較佳為平角線。藉由純銅系導體材料以平角線形成該銅線，且於其表面施行浸鍍處理，以作為連接矽結晶晶圓（矽單元）之指定區域的連接用導線，即，可用於作為太陽能電池用鍍銲錫線而使用。該一連串配置，係表示從行走方向的上游側沿著下游侧，無關是否連續或斷續而成列，即，以串列配置。作為本發明之態樣可以係，以純銅系材料形成該銅線；以一軟化退火爐構成該軟化退火機構，其内部係還原 201211309 該銅線之表面的氧化層的還原氣體環境；將該軟化退火爐傾斜配置’而使其下游侧端部於該銅線行走方向的位置低於其上游側端部於該銅線行走方向的位置；於該軟化退火爐中該銅線行走方向的下游側部分設有一還原氣體供給部’其容許對該軟化退火爐供給還原性氣體。該純銅系材料只要係不純物少，導電率高的純銅系導體材料，並無特別限定，較佳例如無氧銅（OFC)、精銅 (tough pitch copper)、磷脫氧銅（phosphorus Deoxidized Copper)等，且未含有氧化物等不純物、純度為99.9%以上之物。又，作為本發明之態樣’該還原性氣體可係以氮氣氣體與氫氣氣體的混合氣體而構成。又，作為本發明之態樣，可將該氮氣氣體與該氫氣氣體的體積比率設定為4 : 1。又，作為本發明之態樣可以係，於該浸鍍前處理機構具有一加熱處理機構，其對該銅線進行加熱處理；將該加熱處理機構配置於該銅線行走方向中該軟化退火機構的上游側6 又’作為本發明之態樣可以係，以純銅系材料構成該銅線；於該浸鍍前處理機構具有一洗淨機構，其將該銅線洗淨；播該洗淨機構配置於該銅線行走方向中該軟化退火機構的上游側。又，作為本發明之態樣可以係，於該浸鍍前處理機構具有一加熱處理機構，其對該銅線進行加熱處理，且係配 201211309 置於該銅線行走方向中該軟化退火機構的上游側；將該加熱處理機構配置於該銅線行走方向中該洗淨機構的上游側。又，作為本發明之態樣可以係，以一酸洗淨機構及一水洗淨機構構成該洗淨機構係；作為該浸鍍前處理機構，將該加熱處理機構、該酸洗淨機構、該水洗淨機構及該軟化退火機構沿著該銅線行走方向依序配置。又，作為本發明之態樣可以係，該銅線係使用垂直剖面的寬度為0.8〜10.0mm範圍内、厚度為0.05〜0.5mm範圍内大小的平角銅線，垂直剖面係相對其長度方向而垂直的剖面，將該銅線的行走速度設定為約4.0m/min，於酸洗淨機構的酸洗淨時間設定為約12.8秒，且於水洗淨機構的水洗淨時間設定為約13.5秒。又，作為本發明之悲樣可以係，以純銅糸材料構成該銅線；於該銅線行走方向中該捲取機構的上游側具有一銅線輸送辅助機構，其輔助該捲取機構對該銅線的捲取。又，作為本發明之態樣，可將該銅線輸送輔助機構配置於該銅線行走方向中該軟化退火機構的上游側。又，作為本發明之態樣，可將該銅線輸送輔助機構配置於該銅線行走方向中該洗淨機構的下游侧。又，作為本發明之態樣可以係，以貯存熔融浸鍍銲錫液的一溶融浸鐘銲錫槽構成該浸鍍機構；將轉換該銅線之行走方向的方向轉換滾輪，以槽中方向轉換滾輪構成，其係於該熔融浸鐘銲錫槽之内部，且於該銅線通過該溶融浸 201211309 鍍銲錫槽前後，將該銅線之行走方向轉換；以該銅線輸送輔助機構構成該槽中方向轉換滾輪。又，作為本發明之恶樣可以係’以純銅糸材料構成該銅線；以貯存溶融浸鐘銲錫液的一溶融浸鐘銲錫槽構成該浸鐘機構；將轉換該銅線之行走方向的方向轉換滾輪，以槽上方.向轉換滾輪構成，其係於該熔融浸鍍銲錫槽之上方，且於該銅線通過該熔融浸鍍銲錫槽後，將該銅線之行走方向轉換至該捲取機構一侧；於該捲取機構架越該銅線的固定滾輪之中，且配置於上游側的固定滾輪，係以一捲取機構上游側配置滾輪構成，其將通過該槽上方向轉換滾輪後的該銅線導引至該捲取機構的下游側；將該槽上方向轉換滾輪配置在高於該捲取機構上游側配置滾輪的配置高度。又，作為本發明之態樣可以係，將該槽上方向轉換滾輪配置於，相對該熔融浸鍍銲錫槽所貯存的該熔融浸鍍銲錫液之液面的高度約為3m的位置。又，作為本發明之態樣可以係，以貯存熔融浸鍍銲錫液的一熔融浸鍍銲錫槽構成該浸鍍機構；將轉換該銅線之行走方向的方向轉換滚輪，以槽中方向轉換滚輪而構成，其係於該熔融浸鍍銲錫槽之内部，且於該銅線通過該熔融浸鍍銲錫槽前後，將該銅線的行走方向轉換；以該銅線輸送輔助機構構成該槽中方向轉換滾輪，其輔助該捲取機構對該銅線的捲取。又，作為本發明之,¾、樣可以係5以純銅糸材料構成該 11 201211309 銅線；於該浸鍍機構係利用薄浸鍍設定及厚浸鍍設定之任一的設定而進行，該薄浸鍵設定係以薄浸鐘而浸鐘該銅線，該厚浸鍍設定係厚於薄浸鍍設定的浸鍍厚度而形成厚浸鍵厚度；該薄浸鍵設定，係使該銅線的行走速度為低速行走速度之下，對該銅線施行浸鍍的設定；該厚浸鍍設定，係使該銅線的行走速度，為高於該低速行走速度的高速行走速度之下，對該銅線施行浸鍍的設定；於高速行走速度中，係根據銲錫溫度及浸鍍厚度的指定關係，以對應該銲錫溫度的浸鍍厚度對該銅線施行浸鍍的設定。又，作為本發明之態樣可以係，於該洗淨機構與該軟化退火機構之間具有一預先加熱機構，其將通過該軟化退火機構前的該銅線加熱；該浸鍍機構於該厚浸鍍設定的設定中，係對通過該預先加熱機構及該軟化退火機構後的該銅線施行浸鍍。又，本發明之一種鍍銲錫線的製造方法，其可係以一浸鍍前處理工序、一浸鍍工序及一捲取工序而構成，該浸鍍前處理工序對銅線進行浸鍍前處理，該浸鍍工序於該銅線的表面施行鍍銲錫，該捲取工序捲取表面已施行浸鍍的該銅線。其中，於該浸鍍前處理工序，進行一將該銅線軟化退火而使該銅線低耐力化的軟化退火工序；該捲取工序，係以低於已低耐力化的該銅線之耐力的捲取力進行捲取的工序；於該捲取工序期間，連續進行該軟化退火工序及該浸鍍工序。又，作為本發明之態樣可以係，該銅線係使用以純銅 12 201211309 系材料而形成之物；於該軟化退火工序，係其從行走方向之下游側部分所設置的一還原氣體供給部，供給還原性氣體至一軟化退火爐，該軟化退火爐係傾斜配置，而使其下游側端部於行走方向的位置低於其上游側端部於行走方向的位置，還原性氣體係還原該銅線之表面的氧化層；使軟化退火爐之内部為還原性氣體環境，且使該銅線行走於該軟化退火爐。又，作為本發明之態樣，可係該還原性氣體以氮氣氣體與氫氣氣體的混合氣體而構成。又，作為本發明之態樣，可將該氮氣氣體與該氫氣氣體的體積比率設定為4 : 1。 - 又，作為本發明之態樣可以係，於該浸鍍前處理工序中，在該軟化退火工序前，對該銅線進行加熱處理工序。又，作為本發明之態樣可以係，該銅線係使用以純銅系材料而形成之物；於該浸鍍前處理工序中，在該軟化退火工序前，進行一將該銅線洗淨的洗淨工序。又，作為本發明之態樣可以係，於該浸鍍前處理工序包含一加熱處理工序，其在該軟化退火工序前對該銅線進行加熱處理；在該洗淨工序前，進行該加熱處理工序。又，作為本發明之態樣可以係，於該洗淨工序具有一酸洗淨工序及一水洗淨工序；於該浸鍍前處理工序中，依序進行該加熱處理工序、該酸洗淨工序、該水洗淨工序及該軟化退火工序。又，作為本發明之態樣可以係，該銅線係使用垂直剖 13 201211309 面的寬度為0.8〜10.0mm範圍内、厚度為0.05〜0.5mm範圍内大小的平角銅線，垂直剖面係相對其長度方向而垂直的剖面。將該銅線的行走速度設定為約4.0m/min，於該酸洗浄工序的酸洗淨時間設定為約12.8秒，且於該水洗淨工序的水洗淨時間設定為約13.5秒。又，作為本發明之態樣可以係，該銅線係使用以純銅系材料而形成之物；於進行該捲取工序期間，進行銅線輸送輔助工序，其辅助該捲取工序所進行的該銅線的捲取。又，作為本發明之態樣可以係，該銅線係使用以純銅系材料而形成之物；於該浸鍍工序後，在該熔融浸鍍銲錫槽之上方，藉由一槽上方向轉換滾輪，將通過該熔融浸鍍銲錫槽後的該銅線的行走方向，方向轉換至一捲取機構上游側配置滾輪的一侧，該槽上方向轉換滾輪係配置於一將表面已施行浸鍍的該銅線捲取的捲取機構的上游側，且係高於該捲取機構上游侧配置滾輪的配置高度而配置，該捲取機構上游側配置滾輪該銅線導引至該捲取機構的下游侧。又，作為本發明之態樣可以係，該銅線係使用以純銅系材料而形成之物；於該浸鍍工序係利用薄浸鍍設定及厚浸鍍設定之任一的設定而進行，該薄浸鍍設定係以薄浸鍍而浸鍵該銅線，該厚浸鍵設定係厚於薄浸鐘設定的浸鐘厚度而形成厚浸鑛厚度；該薄浸鐘設定，係使該銅線的行走速度為低速行走速度之下，對該銅線施行浸鍍的設定；該厚浸鍍設定，係使該銅線的行走速度，為高於該低速行走 14 201211309 速度的高速行走速度之下，對該銅線施行浸鍍的設定；於高速行走速度中，係根據銲錫溫度及浸鍍厚度的指定關係，以對應該銲錫溫度的浸鍍厚度對銅線施行浸鍍的設定。 - 又，作為本發明之態樣，較佳可將低速行走速度設定 . 為約4m/min左右；較佳可將高速行走速度設定為約 13m/min 左右。又，作為本發明之態樣，於高速行走速度中，可將銲錫溫度設定為約240°C左右。又，作為本發明之態樣可以係，以該厚浸鍍設定進行該浸鍍工序時，於該洗淨工序與該軟化退火工序期間，進行預先加熱工序，其將通過該軟化退火工序前的銅線加熱；於該軟化退火工序後，對已進行該軟化退火工序的銅線進行浸鍍工序。依據本發明，可提供鍍銲錫線的製造方法及製造裝置，其可獲得0.2%耐力值充份降低、期望品質的浸鍍線 lb，藉由使這樣的浸鍍線lb安定而獲得，可提升製品產 •率，又，可提升製造效率。【實施方式】利用以下圖示說明本發明之一實施態樣。如圖1所示，本實施態樣之鍍銲錫線的製造裝置10，係以浸鍍前處理機構2、浸鍍機構61及捲取機構71而構成，浸鍍前處理機構2係對待鍍線la進行浸鍍前處理，浸 15 201211309 鍍機構61係對待鍍線la的表面施行鍍銲錫，捲取機構71 係捲取表面已施行浸鍍的浸鍍線lb。待鍍線la係使用平角銅線，平角銅線係藉由另行準備的平角線（flat square wire)製造機（圖未顯示），將無氧銅（oxygen-free copper)壓延成厚度〇.〇5〜0.5mm、寬度 0.8〜10mm ’較佳係厚度〇·〇8〜0.24mm、寬度1〜2mm。上述浸鍍前處理機構2主要係以供給裝置（suppner) 12、加熱處理爐22、酸洗淨槽31、超音波水洗淨槽41及軟化退水爐51而構成。供給裝置12係藉由將捲曲於滾筒之狀態的待鍍線la 轉動，一邊依序解開一邊供給至製造線。供給裝置12係可對應所需而附有旋轉功能，又，亦可係一般橫向連續輸送的構成。加熱處理爐22的構成係與稍後說明的軟化退火爐51 略同’係相對厚度方向且在行走方向，為長直方體形狀的外觀形狀而構成。加熱處理爐22係沿著行走方向為傾斜配置’而使其下游侧端部於行走方向的位置低於上游侧端部於行走方向的位置。加熱處理爐22之内部係以2〇〇。〇的設定溫度作為蒸氣環境（atmosphere) 〇又，相對加熱處理爐22於行走方向的下游侧，設有冷卻水槽23，冷卻水槽23將通過加熱處理爐22之内:的待鍍線la冷卻。加熱處理爐22的下游侧端部及冷卻水槽 23舞以連結管24相互連結，連結管24將從加熱處_ 22導出的待鍍線la導引至冷卻水槽23，以使待錢線u 16 201211309 不接觸空氣。作為洗淨機構30的酸洗淨槽31貯存有磷酸系洗淨液 32，構酸系洗淨液32酸洗淨待鍵線1 a的表面。作為洗淨機構30的超音波水洗淨槽41貯存有水43，以用於洗淨，藉由另行準備的超音波水洗淨機，洗淨待鍍線1 a之表面所附著的水溶性潤滑劑或其他不純物。超音波水洗淨槽41之底面配置有超音波振動板42a，超音波振動板42a沿著待鍍線la的行走方向而構成超音波水洗浄機 42的一部分。又，超音波水洗淨槽41之上方設置有空氣雨刷（air wiper ) 45，空氣雨刷45從待鐘線1 a行走執道上的側方朝向待鍍線la喷吹空氣。如圖2所示，上述軟化退火爐51係傾斜配置，而使其下游側端部於行走方向的位置缓缓低於其上游側端部於行走方向的位置。上述軟化退火爐51係以軟化退火爐本體52、鞘管53及加熱器54而構成，軟化退火爐本體 52與加熱處理爐22同樣以直方體形狀構成，鞘管53呈管狀，並具有容許待鍍線la插入的内徑，且貫通該軟化退火爐本體52而配置，加熱器54將軟化退火爐本體52的内部加熱。鞘管53係沿著行走方向而配置於軟化退火爐本體52 的内部空間，且於軟化退火爐本體52之長度方向（行走 .方向）的兩端部，即長度方向的上端部及下端部突出。於鞘管53的軟化退火爐本體52中，於其上端部突出的鞘管上侧突出部分55之上端，形成有上端開口部55u。 17 201211309 上端開口部55u容許待鍍線la往鞘管53的内部導入，且如稍後所述，將填充於鞘管53之内部的還原氣體G 排出。於鞘管53的軟化退火爐本體52，於其下端部突出的鞘管下側突出部分56之下端，形成有下端開口部55d。下端開口部55d容許待鍍線la從鞘管53導出。鞘管下側突出部分56與連結管55串聯地連結。更進一步，鞘管下側突出部分56之中間部分構成一分枝部分，該分枝部分係作為還原氣體供給部57而構成，還原氣體供給部 57將供給還原氣體G供給至鞘管53之内部。又，雖圖未顯示，還原氣體供給部57係具有壓力調節閥、壓力計等，且還原氣體供給部57對應上述軟化退火爐51之内部的還原氣體G的濃度，可調節還原氣體G 的流入量。藉由還原氣體G從還原氣體G供給部57流入鞘管53 的内部，而將内部作為還原氣體環境。加熱器54具有複數個構成於直線的棒狀物，且相對鞘管53配置於上方側空間及下方側空間，而於軟化退火爐本體52之内部空間隔著鞘管53相對。加熱器54係設置於相對待鍍線la之行走方向垂直的方向，詳細而言，係正面觀視圖2之紙面時，相當於相對圖2之紙面而垂直的方向，複數個加熱器54分別於上方側空間及下方側空間，沿著行走方向且每隔一指定間隔並列配置。軟化退火爐51之内部係藉由加熱器54設定為800°C 或800°C以上的溫度設定。 18 201211309 藉由鞘管下側突出部分56與連結管55串聯地連結，可使通過軟化退火爐51的待鍍線la在浸入熔融浸鍍銲錫液63中之前，不與空氣接觸而行走。浸鍵機構61係以貯存有溶融浸鐘銲錫液63的溶融浸鍍銲錫槽62而構成，熔融浸鍍銲錫液63係設定為260°C 的設定溫度，且係使用溶融錫（Sn-3.0Ag-0.5Cu )。熔融浸鍍銲錫槽62的内部配置有槽中方向轉換滾輪 64，槽中方向轉換滚輪64係將表面附著有熔融浸鍍銲錫液63的浸鍍線lb的行走方向，轉換為往垂直上方的方向。更進一步，槽中方向轉換滾輪64的垂直上方具有槽上方向轉換滾輪65，槽上方向轉換滾輪65係將浸鍍線lb 從垂直上方的行走方向轉換為朝向捲取機構71的方向。槽中方向轉換滾輪64及槽上方向轉換滾輪65係大於一般0 20mm左右的滾輪，例如係以0 100mm左右的滾輪而構成。更進一步，槽中方向轉換滾輪64及槽上方向轉換滾輪65係藉由各別所具有、圖未顯示的驅動馬達，以略同於捲取機構71所具有、稍後說明的張力擺動輪（dancer roller) 74，或線架（bobbin)的轉動速度，自我積極地主動轉動，使其與捲取機構71的捲取速度同一步調，而進行浸鍵線1 b的方向轉換。接著，針對捲取機構71作說明。捲取機構71係以捲取張力調節機72及橫動線架 (bobbin traverse)方式捲取機75而構成。捲取張力調節機72具有張力擺動輪74，對應架越於 19 201211309 固定滾輪73的浸鍍線lb被施加的張力，使張力擺動輪％於上下方向可動，調節張力的狀態。雖圖未顯示，捲取張力調節機72更係以張力檢測感應器、控制部及滾輪可動機而構成，張力檢測感應器係檢測浸鍍線lb的張力，控制部係對應該張力檢㈣應||所檢測的張力而控制，以使張力安定，滾輪可動機係根據控制部的指令而使張力擺動輪74可動。如圖3 (a)所示，橫動線架方式捲取機乃係以線架 76、馬達77及傳達機構78而構成，線架76係對應浸鐘線]b的寬度而粗寬地構成，馬達77使該線架％沿著該線架76的軸方向擺動，傳達機構乃係傳達馬達之驅動的滾珠螺桿（ball s⑽）等。橫動線架方式捲取機乃更係以捲取力檢測感應器79、控制部81及馬達82而構成，捲取力檢測感應器79係檢測線架76之捲取力，控制部^係對應該捲取張力檢測感應器79所檢測的捲取:而控制’以使該張力安定’馬達82係根據控制部81的指令而使線架76轉動。 7 依此構成的鍍銲錫線的製造裝置1〇，係將浸鍍前處理機構2、浸鍍機構61及捲取機構71，分別從待鍍線“及浸鍍線lb的行走方向的上游侧依序串列地一連串配置，其中供給裝置12、加熱處理爐22、酸洗淨槽3ι、超音波水洗淨槽4丨及軟化退水爐51作為浸鍍前處理機構^炼融浸鍍銲錫槽62作為浸鍍機構61。更進-步，鍍輝錫線的製造裝置1〇的構成，係使施 20 201211309 行浸浸鍍前的待鑛線1 a的0.2%财力值（proof stress )降低，其後，於此已低耐力化的待鍍線la施行浸鍍，在進行這些工序期間，藉由上述捲取機構71，且以低於該浸鍍線 lb之财力的捲取力進行捲取。具體地，作為捲取機構71，係採用上述捲取張力調節機72及橫動線架方式捲取機75，且設置第一輸送絞盤 (capstan) 91及第二輸送絞盤92，其輔助捲取機構71的捲取。第一輸送絞盤91及第二輸送絞盤92皆設置於軟化退火爐51之上游侧，以輔助輸送低财力化前的待鍵線1a 的行走。詳細而言，第一輸送絞盤91係設置於加熱處理爐22 與酸洗淨槽31之間，而第二輸送絞盤92係設置於超音波水洗浄槽41與軟化退火爐51之間。又，浸鐘線1 b的捲取速度太慢或太快時，浸鐘線1 b 所承受的負荷變大。特別係捲取速度太快時，亦會產生線條偏移的問題，因此，第一輸送絞盤91及第二輸送絞盤 92的速度僅稍快於捲取機構71的捲取速度，例如，相對捲取速度係快於+ lm/min左右的輸送速度，將待鐘線la 及浸鍍線lb送出至下游侧。捲取機構71於上述捲取張力調節機72及橫動線架方式捲取機75的附近，適當地具有複數架越浸鍍線lb的固定滾輪73。於捲取機構71所配置的複數固定滾輪73之中，於行走方向最上游側所設置的固定滾輪73，係設定為捲取機構 21 201211309 上游侧配置滚輪73A。捲取機構上游側配置滾輪73A，係浸鐘線lb藉由槽上方向轉換滾輪65方向轉換後，最初將往捲取機構71 —侧行走的浸鍍線lb架越在捲取機構71 一侧的滾輪。槽上方向轉換滾輪65係配置在高於捲取機構上游側配置滾輪73A的位置。接著，針對鍍銲錫線的製造方法作說明。鍍銲錫線的製造方法係經由浸鍍前處理工序、浸鍍工序及捲取工序而製造，浸鍍前處理工序對待鍍線la進行浸鍍前處理，浸鍍工序於待鍍線la的表面施行鍍銲錫，捲取工序捲取表面已施行浸鍍的浸鍍線lb。浸鍍前處理工序係依序進行加熱處理工序、酸洗淨工序、水洗淨工序及軟化退火工序的工序。加熱處理工序依藉由待鍍線la行走於作為蒸氣環境的加熱處理爐22之内部，而將待鐘線1 a的表面蒸氣洗淨的工序。藉由此蒸氣洗淨，可使待鐘線1 a的表面所附著的水溶性潤滑劑或其他不純物從其表面分離，而容易去除待鍍線la之表面所附著的水溶性潤滑劑或其他不純物。加熱處理工序係加熱處理爐22内的退火溫度設定為低於一般650°C左右的200°C退火溫度，將設定為此低溫的加熱處理爐22内作為蒸氣環境，而使待鐘線1 a行走，以對待鍍線1 a進行水蒸氣洗淨。如上所述，加熱處理工序對待鐘線1 a進行水蒸氣洗淨之外，更藉由將待鍵線1 a退火而使其低对力化。但，加熱 22 201211309 處理工序係藉由將退火溫度設定為例如2〇(rc等低溫設疋，而抑制待鐘線1 a低耐力化的程度。又’通過加熱處理爐22後的待鍍線la，係通過連結官24後藉由行走於冷卻水槽23之内部所貯存的冷卻水，而冷卻至指定溫度。酸洗浄工序係藉由待鍍線la行走於酸洗淨槽31所貯存的磷酸系洗淨液32,而對行走於其中之待鍍線la的表面進行酸洗淨。水洗浄工序係於超音波洗淨槽41中超音波水洗淨待鑛線1a的表面’而除去該待鐘線la之表面所附著的水溶性潤滑劑或其他不純物。軟化退火工序係藉由待鍍線la行走於内部作為還原氣體環境的軟化退火爐51之内部，而使待鍍線軟化退火、低耐力化，且還原待鍍線la之表面的氧化層。詳細如圖2所示，軟化退火工序，係從鞘管下側突出邰刀56所設置之還原氣體供給部57，供給還原氣體〇至軟化退火爐51的鞘管53的内部，軟化退火爐51係傾斜配置而使其下游側端部於行走方向的位置低於上游側端 :行走方向的位置，作為還原氣體G，例如係氫氣氣體 # y 〇gen gas)與氮軋氧體（nitr〇gen运⑽）混合的混合乱體H 53之内部作為還原性氣體環境（atm〇sphere)。更進步’藉由加熱器54’使軟化退火爐本體52的内部空間加熱至約800。(：。於作為還原氣體ί哀境的鞘管53之内部中，從上端開 23 201211309 口部55u導入的待鍍線la係往還原氣體G之上升方向dl 的相反方向，即下方向D行走（參照圖2中一部分放大圖所示的箭頭dl、D)。接續的浸鍍工序，係藉由待鍍線la行走於熔融浸鍍銲錫槽62所貯存的溶融浸鐘銲錫液63，而使溶融錫附著於待鐘線1 a的表面。從軟化退水爐51之下端開口部55d導出的待鍍線 la，係藉由行走於連結管55之内部，而不與空氣接觸，在浸入熔融浸鍍銲錫液63之前被引導。浸入溶融浸鍵銲錫液63的待鑛線1 a，係其表面附著熔融浸鍍銲錫液63,而變成表面整體係以熔融浸鍍銲錫液 63覆蓋的浸鍍線lb。浸鍍線lb在行走於熔融浸鍍銲錫槽 62之内部的過程，係藉由炫融浸鐘銲錫槽62中所具有的槽中方向轉換滾輪64，在行走於炫融浸鐘銲錫槽62之過程，方向轉換至垂直上方，而從溶融浸鐘銲錫槽62朝向垂直上方導出。浸鍍線lb係從熔融浸鍍銲錫槽62導出後，藉由槽上方向轉換滾輪65進行方向轉換，往捲取機構71側行走。捲取工序係在待鍍線la進行上述浸鍍前工序與浸鍍工序期間，一邊藉由捲取張力調節機72之張力擺動輪74 的控制，對已經經由這些工序的浸鍍線lb進行張力調節，一邊整列地將浸鍍線lb捲起於橫動線架方式捲取機75所配置的線架76。詳細如圖3 (a)、（b)所示，一邊使橫動線架方式捲 24 201211309 取機75的線架76軸轉動，一邊使線架76往軸方向擺動，可將浸鍍線lb沿著線架76的軸方向並列捲起，且係可複數層重合而捲取。上述鍍銲錫線的製造裝置10及製造方法可獲得如下各式各樣的作用、效果。鍍銲錫線的製造裝置10，係將浸鍍前處理機構2、浸鍍機構61及捲取機構71，分別從浸鍍線lb之行走方向的上游側依序一連串配置，其中供給裝置12、加熱處理爐 22、酸洗淨槽31、超音波水洗淨槽41及軟化退火爐51作為浸鍍前處理機構2，熔融浸鍍銲錫槽62作為浸鍍機構 61° 藉由這樣一連串配置各機構，可防止已低财力化的浸鍍線lb於製造中行走無謂的距離，且可降低浸鍍線lb於行走中所承受的負荷。因此，可獲得0.2%耐力值充份降低、期望品質的浸鍍線lb，藉由使這樣的浸鍍線lb安定而獲得，可提升製品產率，又，可提升製造效率。又更進一步，鍍銲錫線的製造方法，係連續地進行加熱處理工序、酸洗淨工序、超音波水洗淨工序及軟化退火工序、浸鍍處理工序及捲取工序各工序，加熱處理工序、酸洗淨工序、水洗淨工序及軟化退火工序係作為浸鍍前處理工序。藉由這樣連續進行各工序，不需花費將浸鍍線lb (待鍍線la)移行至另一行走線等的時間，例如每經過一指定 25 201211309 工序，為了進行下一工序而中斷浸鍍線lb (待鍍線la)的行走。因此，可大幅地緩和浸鑛線1 b所承受的負荷，且可使期望品質的浸鍍線lb安定而獲得。因此，可獲得0.2%耐力值充份降低、期望品質的浸鍍線lb，藉由使這樣的浸鍍線lb安定而獲得，可提升製品產率，又，可提升製造效率。更進一步，可有效率地製造0.2%财力值充份降低、期望品質的浸鍍線lb，因此，可達到大量生產適合且低耐力化的浸鍍線lb，以作為太陽能電池用導線。又，鍍銲錫線的製造裝置10，係上述軟化退火爐51 係傾斜配置，而使其下游侧端部於行走方向的位置低於其上游侧端部於行走方向的位置，且於上述軟化退火爐51 之行走方向的下游側設有還原氣體供給部57,其容許對鞘管53供給還原氣體G，鞘管53則容許待鍍線la於插入其内部之狀態行走。鍍銲錫線的製造方法，係於軟化退火工序中，且於軟化退火爐51之内部，由通過鞘管53之下端側部分（下游側部分）所設置的還原氣體供給部57,將還原氣體G供給至鞘管53之内部，使待鍍線la於作為還原氣體環境之鞘管5 3的内部，從行走方向的上游侧朝向下游側行走。如圖2所示，藉由上述鍍銲錫線的製造裝置10及製造方法，在作為還原氣體環境的鞘管53的内部中，待鍍線la可朝向還原氣體G上升之方向dl相反的方向，即朝向下方向D行走。 26 201211309 错此’可使行走於鞍營53之允jkrr 地暴露於勒腫G上升的料巾，^待魏la，積極進待錢線U之表面的氧化層的還原=有=率地促再者，於顆管53之内部，行走中的=的低耐力。方向的下端側部分（下游側部分），通過沒其長度 57,可暴露於重新供給至鞍管53之、原士體供給部201211309 VI. Description of the Invention: [Technical Field] The present invention relates to a method and a device for manufacturing a soldering wire for use in an electric or electronic device or a communication device, and more particularly as a wire for a solar cell, suitably A method and a manufacturing apparatus for a solder wire having low endurance characteristics. [Prior Art] The immersion plating line applied to electronic components is required to have 0. Low endurance characteristics of 2% endurance. For example, a wire for solar cells is also an example. In order to achieve the low cost of the dream material constituting the solar cell or the effect of insufficient supply of the absorbing material, the solar cell energy unit is seeking to be thinner. However, when the solar cell is thinned, the strength thereof is weak, and the connection portion of the solar cell wires for soldering the solar cell unit has a problem that the solar cell is liable to be bent or damaged due to the difference in expansion ratio. Therefore, the connection portion between the solar cell wire and the solar cell unit must be deformed as the solar cell unit is deformed. A 2% proof of stress reduction becomes important. Thus, as a wire for a solar cell, a solder wire having low endurance characteristics is used. Regardless of whether or not it has low endurance characteristics, the plated solder wire disclosed in Patent Document 1 is formed by a plating soldering process to form a immersion plating layer. 201211309 The plating process disclosed in Patent Document 1 passes a metal wire as a wire to be plated through a metal wire introduction port, and introduces it into a plating liquid portion which is injected into a molten immersion key solder liquid, and then leads from a solder wire. After the outlet is led out, the metal wire is subjected to a process of immersing the bell by air cooling or the like. Further, in the manufacturing process of the plated solder wire, in addition to the above-described plating process, the surface of the metal wire is subjected to a pre-plating process such as cleaning or annealing, and the post-plating process is performed by coiling and dipping. The coiling process of the plating line. Further, when such a process is continuously performed on the to-be-plated wire which has been low in endurance, the to-be-plated wire is easily subjected to a load, and therefore continuous processing becomes difficult, and even if continuous processing is possible, it is difficult to obtain a desired quality immersion plating line. For example, if the load on the waiting line that has been low-endurance is suppressed too much, the surface of the wire to be bonded cannot be sufficiently washed, and the surface or the oxide layer remains on the surface. In the subsequent plating step, when the immersion plating layer is formed on the surface to be plated, the immersion plating layer is easily peeled off, and it is difficult to obtain a desired quality immersion plating line. In other respects, in order to reduce the endurance of the immersion plating line (to wait for the clock line), the traveling speed of the immersion clock line cannot be increased, and the manufacturing time is greatly consumed, and the continuous processing is performed to have manufacturing efficiency. The disadvantage of reducing the situation. As a method for producing a plated solder wire having low endurance characteristics, for example, a method for producing a flat-angle conductor for a solar cell proposed in Patent Document 2 is known. In the method for producing a flat-angle conductor for a solar cell according to Patent Document 2, the 201211309 pig is formed into a rectangular shape by a process such as a rolling conductor, and is then subjected to a heat treatment step by a heat treatment step. A 2% proof endurance value is lowered and a method of manufacturing a solder film is applied to the surface of the conductor. However, Citation 2 does not specifically describe the temperature setting in the heat treatment or the gas composition in the internal environment of the reduction furnace (softening annealing furnace), or a step other than the heat treatment step, for example, a washing step, etc., without specifically Mentioned. Therefore, even if it is assumed that the washing process is performed, and whether each of the heat treatment process, the washing process, or the gantry process is an independent production line, or in a case where these plural processes are continuously performed, in what order is performed, unclear. That is, as described above, the cited document 2 makes it possible to reduce the 〇2% endurance value of the rectangular conductor while ensuring its quality as a solar battery lead, and on the other hand, to ensure enthalpy. The two opposite problems of the quality of the immersion plating line in which the 2% endurance value is lowered and the manufacturing efficiency are lowered are not inked in the cited document 2. [Patent Document 1] [Patent Document 1] Japanese Laid-Open Patent Publication No. 2000-80460 (Patent Document 2) Japanese Laid-Open Patent Publication No. Hei No. Hei. A method and a device for manufacturing a soldering wire, which can obtain 0. The 2% endurance value is sufficiently reduced, and the desired quality of the key line is obtained by making such a dip plating line stable, which can improve the product production rate of 201211309, and can improve the manufacturing efficiency. The apparatus for manufacturing a soldering wire of the present invention may be configured by a pre-dip coating processing mechanism, a dip plating mechanism and a winding mechanism, wherein the pre-plating processing mechanism performs pre-dip plating treatment on the copper wire. The immersion plating mechanism applies plating solder to the surface of the copper wire, and the winding mechanism winds the copper wire which has been immersed on the surface. Wherein the pre-etching treatment mechanism has a softening annealing mechanism that softens and anneals the copper wire to make the copper wire low endurance; by the winding mechanism, and is wound up below the endurance of the copper wire The copper wire having low endurance is wound up, and the softening annealing mechanism, the immersion plating mechanism, and the winding mechanism are arranged in series from the upstream side in the traveling direction of the copper wire. Here, the configuration in which the winding mechanism is wound up with a low take-up force lower than the endurance of the copper wire is not limited to the winding of the copper wire only by the winding mechanism, and includes, for example, the conveying winch arrangement. On the upstream side of the take-up mechanism, it assists in the winding of the take-up mechanism, and the take-up mechanism and the transport winch are configured to take up the copper wire. The copper wire is not limited in shape and size, but is preferably a flat line. The copper wire is formed by a pure copper-based conductor material in a rectangular line, and is subjected to a immersion plating treatment on the surface thereof to serve as a connection wire for connecting a predetermined region of the germanium crystal wafer (矽 unit), that is, for use as a solar cell. Soldering with solder wire. The series of configurations are shown from the upstream side in the traveling direction to the downstream side, irrespective of whether they are continuously or intermittently arranged, that is, arranged in series. As a aspect of the present invention, the copper wire may be formed of a pure copper-based material; the softening annealing mechanism is configured by a softening annealing furnace, and the interior thereof reduces the reducing gas atmosphere of the oxide layer on the surface of the copper wire of 201211309; The annealing furnace is disposed in an inclined configuration such that a position of the downstream end portion in the traveling direction of the copper wire is lower than a position of the upstream end portion in the traveling direction of the copper wire; and a downstream side of the traveling direction of the copper wire in the softening annealing furnace A portion of a reducing gas supply portion that allows the supply of a reducing gas to the softening annealing furnace is provided. The pure copper-based material is not particularly limited as long as it has less impurities, and the pure copper-based conductor material having high conductivity is preferably, for example, oxygen-free copper (OFC), tough pitch copper, phosphorous deoxidized copper, or the like. And does not contain impurities such as oxides, and the purity is 99. More than 9%. Further, as a mode of the present invention, the reducing gas may be composed of a mixed gas of a nitrogen gas and a hydrogen gas. Further, as a aspect of the present invention, the volume ratio of the nitrogen gas to the hydrogen gas may be set to 4:1. Moreover, as a aspect of the present invention, the pre-dip plating treatment mechanism may have a heat treatment mechanism that heats the copper wire; and the heat treatment mechanism is disposed in the copper wire traveling direction. The upstream side 6 can also be used as the aspect of the present invention, and the copper wire is formed of a pure copper-based material; the pre-plating treatment mechanism has a cleaning mechanism for washing the copper wire; and the cleaning mechanism is broadcasted It is disposed on the upstream side of the softening annealing mechanism in the traveling direction of the copper wire. Moreover, as a aspect of the present invention, the immersion plating processing mechanism may have a heat treatment mechanism that heats the copper wire and is equipped with the 201211309 in the direction of the copper wire in the direction of the softening annealing mechanism. The upstream side; the heat treatment mechanism is disposed on the upstream side of the cleaning mechanism in the traveling direction of the copper wire. Moreover, as an aspect of the present invention, the cleaning mechanism may be configured by an acid cleaning mechanism and a water washing mechanism, and the heat treatment mechanism, the acid cleaning mechanism, and the acid cleaning mechanism may be used as the pre-dip plating treatment mechanism. The water washing mechanism and the softening annealing mechanism are arranged in this order along the traveling direction of the copper wire. Further, as a aspect of the present invention, the copper wire may have a width of 0 in a vertical section. 8~10. Within 0mm, the thickness is 0. 05~0. A rectangular copper wire of a size within a range of 5 mm, the vertical profile being perpendicular to the longitudinal direction, and the traveling speed of the copper wire is set to about 4. 0m/min, the acid cleaning time of the acid cleaning mechanism is set to about 12. 8 seconds, and the water washing time of the water washing mechanism is set to about 13. 5 seconds. Moreover, as a sad example of the present invention, the copper wire may be formed of a pure copper beryllium material; in the traveling direction of the copper wire, the upstream side of the winding mechanism has a copper wire conveying auxiliary mechanism, which assists the winding mechanism Coiling of copper wire. Further, as an aspect of the invention, the copper wire feeding assisting mechanism may be disposed on the upstream side of the softening annealing mechanism in the traveling direction of the copper wire. Further, as a aspect of the invention, the copper wire conveyance assisting mechanism may be disposed on the downstream side of the cleaning mechanism in the traveling direction of the copper wire. Moreover, as a aspect of the present invention, the immersion plating mechanism may be configured by a molten immersion tin solder bath for storing the molten immersion solder liquid; the direction changing roller for converting the traveling direction of the copper wire, and the direction change roller in the groove direction The structure is disposed inside the molten immersion solder bath, and the direction of travel of the copper wire is converted before and after the copper wire is passed through the immersion immersion 201211309 solder bath; and the copper wire feeding auxiliary mechanism forms the direction of the groove Convert the scroll wheel. Moreover, as a bad example of the present invention, the copper wire can be formed by a pure copper ruthenium material; the immersion clock soldering groove for storing the immersion bell immersion solder liquid can constitute the immersion clock mechanism; the direction of the traveling direction of the copper wire will be converted Convert the wheel to the top of the slot. The conversion roller is disposed above the molten immersion solder bath, and after the copper wire passes through the molten immersion solder bath, the traveling direction of the copper wire is switched to the winding mechanism side; The fixed roller disposed on the upstream side of the copper wire is disposed on the upstream side of the winding mechanism, and is configured by a roller disposed on the upstream side of the winding mechanism. To the downstream side of the take-up mechanism; the groove-up direction changing roller is disposed at an arrangement height higher than the upstream side of the take-up mechanism. Further, in the aspect of the invention, the groove upward direction switching roller may be disposed at a position where the height of the liquid surface of the molten immersion solder bath stored in the molten immersion solder bath is about 3 m. Moreover, as a aspect of the present invention, the immersion plating mechanism may be configured by a molten immersion solder bath for storing the molten immersion solder bath; the direction changing roller for converting the traveling direction of the copper wire, and the roller in the groove direction And configured to be inside the molten immersion solder bath, and to switch the traveling direction of the copper wire before and after the copper wire passes through the molten immersion solder bath; and the copper wire feeding auxiliary mechanism forms a direction in the groove A transfer roller that assists the take-up mechanism in winding the copper wire. Further, in the present invention, the 11 201211309 copper wire may be formed of a pure copper ruthenium material, and the immersion plating mechanism may be formed by any of a thin immersion plating setting and a thick immersion plating setting. The dip key setting is to immerse the copper wire in a thin immersion clock, which is thicker than the immersion plating thickness set by the thin immersion plating to form a thick immersion key thickness; the thin immersion key is set to make the copper wire The traveling speed is lower than the low speed walking speed, and the copper wire is set by immersion plating; the thick immersion plating is set such that the traveling speed of the copper wire is lower than the high speed running speed of the low speed walking speed, The setting of the immersion plating of the copper wire is performed. In the high-speed traveling speed, the immersion plating of the copper wire is set according to the immersion plating thickness corresponding to the soldering temperature according to the specified relationship between the soldering temperature and the immersion plating thickness. Moreover, as an aspect of the present invention, a preheating mechanism may be provided between the cleaning mechanism and the softening annealing mechanism, which heats the copper wire before passing through the softening annealing mechanism; the immersion plating mechanism is thick In the setting of the immersion plating setting, the copper wire which has passed through the preheating means and the softening annealing means is subjected to immersion plating. Moreover, the method for producing a plated solder wire according to the present invention may be configured by a pre-coating treatment step, a immersion plating step, and a coiling step, and the pre-dip plating treatment step is performed on the copper wire before immersion plating. The immersion plating process applies a solder to the surface of the copper wire, and the winding process winds the copper wire which has been subjected to immersion plating on the surface. Wherein, in the pre-dip plating treatment step, a softening annealing step of softening and annealing the copper wire to reduce the endurance of the copper wire is performed; and the winding step is lower than the endurance of the copper wire having low endurance The winding force is performed in the winding step; during the winding step, the softening annealing step and the immersion plating step are continuously performed. Further, in the aspect of the invention, the copper wire may be formed of a material of pure copper 12 201211309, and the softening annealing step is a reducing gas supply unit provided from a downstream side portion in the traveling direction. And supplying a reducing gas to a softening annealing furnace, wherein the softening annealing furnace is disposed obliquely such that a position of the downstream end portion in the traveling direction is lower than a position of the upstream end portion in the traveling direction, and the reducing gas system restores the An oxide layer on the surface of the copper wire; the inside of the softening annealing furnace is a reducing gas atmosphere, and the copper wire is allowed to travel in the softening annealing furnace. Further, in the aspect of the invention, the reducing gas may be constituted by a mixed gas of a nitrogen gas and a hydrogen gas. Further, as a aspect of the present invention, the volume ratio of the nitrogen gas to the hydrogen gas may be set to 4:1. Further, as a aspect of the present invention, in the pre-dip plating treatment step, the copper wire may be subjected to a heat treatment step before the softening annealing step. Moreover, as a aspect of the present invention, the copper wire may be formed of a pure copper-based material; in the pre-dip plating treatment step, the copper wire is washed before the softening annealing process. Washing process. Moreover, as a aspect of the present invention, the pre-dip plating treatment step may include a heat treatment step of heat-treating the copper wire before the softening annealing step, and performing the heat treatment before the cleaning step. Process. Moreover, as an aspect of the present invention, the cleaning step may include an acid washing step and a water washing step, and in the pre-plating treatment step, the heat treatment step and the pickling are sequentially performed. The step, the water washing step, and the softening annealing step. Moreover, as a aspect of the present invention, the copper wire system may have a width of 0. 8~10. Within 0mm, the thickness is 0. 05~0. A rectangular copper wire of a size within the range of 5 mm, with a vertical profile perpendicular to its length. The walking speed of the copper wire is set to about 4. 0 m / min, the acid washing time in the acid washing process is set to about 12. 8 seconds, and the water washing time in the water washing process is set to about 13. 5 seconds. Moreover, as a aspect of the present invention, the copper wire may be formed of a pure copper-based material; during the winding process, a copper wire conveyance assisting step may be performed to assist the winding process. Coiling of copper wire. Moreover, as a aspect of the present invention, the copper wire may be formed of a pure copper-based material; after the immersion plating process, a groove-up direction change roller is disposed above the molten-dip solder bath; Passing the direction of travel of the copper wire after the melt-dip solder bath to the side of the upstream side of the winding mechanism, the groove-aligning roller is disposed on the surface to be immersed The upstream side of the winding mechanism for winding the copper wire is disposed higher than the arrangement height of the roller disposed on the upstream side of the winding mechanism, and the upstream side of the winding mechanism is disposed with the roller to guide the copper wire to the winding mechanism Downstream side. Further, as a aspect of the present invention, the copper wire may be formed of a pure copper-based material, and the immersion plating process may be performed by any one of a thin immersion plating setting and a thick immersion plating setting. The thin immersion plating is performed by dipping the copper wire by thin immersion plating, and the thick immersion key is set to be thicker than the thickness of the immersion clock set by the thin immersion clock to form a thick immersion thickness; the thin immersion clock is set to make the copper wire The walking speed is below the low speed walking speed, and the copper wire is set by immersion plating; the thick immersion plating setting is such that the traveling speed of the copper wire is higher than the high speed walking speed of the low speed walking 14 201211309 speed The setting of the immersion plating is performed on the copper wire. In the high-speed traveling speed, the immersion plating of the copper wire is set according to the immersion plating thickness corresponding to the solder temperature according to the specified relationship between the soldering temperature and the immersion plating thickness. Further, as a aspect of the present invention, it is preferable to set the low speed traveling speed. It is about 4 m/min; it is preferable to set the high-speed traveling speed to about 13 m/min. Further, as a aspect of the present invention, the solder temperature can be set to about 240 ° C at a high speed traveling speed. Moreover, in the aspect of the present invention, when the immersion plating step is performed by the thick immersion plating, a preheating step is performed during the cleaning step and the softening annealing step, and the softening annealing step is performed before the softening annealing step. The copper wire is heated; after the softening annealing step, the copper wire which has been subjected to the softening annealing step is subjected to a immersion plating step. According to the present invention, a method and a manufacturing apparatus for a soldered wire can be provided, which can be obtained. The 2% endurance value is sufficiently reduced, and the desired quality immersion plating line lb is obtained by setting such a immersion plating line lb, thereby improving the product production rate and improving the manufacturing efficiency. [Embodiment] An embodiment of the present invention will be described with reference to the following drawings. As shown in Fig. 1, the apparatus 1 for manufacturing a plated solder wire according to the present embodiment is constituted by a pre-coating treatment mechanism 2, a dip plating mechanism 61, and a winding mechanism 71, and the pre-dip plating treatment mechanism 2 is a plating line. La is subjected to immersion plating treatment, and immersion 15 201211309 plating mechanism 61 is to apply plating to the surface of the plating line la, and the winding mechanism 71 is a immersion plating line lb on which the surface has been subjected to immersion plating. The to-be-plated line is a flat-angle copper wire, and the flat-angle copper wire is rolled to a thickness by a separately prepared flat square wire manufacturing machine (not shown) to oxidize the oxygen-free copper to a thickness 〇. 〇5~0. 5mm, width 0. 8~10mm ‘better thickness 〇·〇8~0. 24mm, width 1~2mm. The pre-dip pretreatment mechanism 2 is mainly composed of a supply device 12, a heat treatment furnace 22, an acid cleaning tank 31, an ultrasonic water washing tank 41, and a softening and dewatering furnace 51. The supply device 12 is supplied to the manufacturing line while being sequentially unwound by rotating the wire to be plated la which is curled in the state of the drum. The supply device 12 may be provided with a rotation function as needed, or may be configured to be generally continuously conveyed in the lateral direction. The configuration of the heat treatment furnace 22 is similar to that of the softening annealing furnace 51 to be described later, in a direction opposite to the thickness direction and in the traveling direction, and having a long rectangular parallelepiped shape. The heat treatment furnace 22 is disposed obliquely along the traveling direction, and the position of the downstream end portion in the traveling direction is lower than the position of the upstream end portion in the traveling direction. The inside of the heat treatment furnace 22 is 2 inches. The set temperature of the crucible is used as a vapor atmosphere. Further, a cooling water tank 23 is provided on the downstream side of the heat treatment furnace 22 in the traveling direction, and the cooling water tank 23 is cooled by the to-be-plated line la of the inside of the heat treatment furnace 22. The downstream end portion of the heat treatment furnace 22 and the cooling water tank 23 are connected to each other by a connecting pipe 24, and the connecting pipe 24 guides the to-be-plated line la led from the heating portion 22 to the cooling water tank 23 so that the waiting line u 16 201211309 No contact with air. The acid cleaning tank 31 as the cleaning mechanism 30 stores the phosphate-based cleaning liquid 32, and the acid-based cleaning liquid 32 pickles the surface of the to-be-bonded wire 1a. The ultrasonic water washing tank 41 as the cleaning mechanism 30 stores water 43 for washing, and the water-soluble water adhering to the surface to be plated 1 a is washed by a separately prepared ultrasonic water washing machine. Lubricant or other impurities. The ultrasonic vibration plate 42a is disposed on the bottom surface of the ultrasonic water washing tank 41, and the ultrasonic vibration plate 42a constitutes a part of the ultrasonic water washing machine 42 along the traveling direction of the line to be plated la. Further, an air wiper 45 is disposed above the ultrasonic water washing tank 41, and the air wiper 45 blows air toward the to-be-plated line la from the side on the waiting line of the clock line 1a. As shown in Fig. 2, the softening annealing furnace 51 is disposed obliquely, and the position of the downstream end portion in the traveling direction is gradually lower than the position of the upstream end portion in the traveling direction. The softening annealing furnace 51 is configured by softening the annealing furnace main body 52, the sheath tube 53, and the heater 54, and the softening annealing furnace main body 52 is formed in a rectangular parallelepiped shape similarly to the heating processing furnace 22, and the sheath tube 53 has a tubular shape and has a tolerance The inner diameter of the plating line la is inserted through the softening annealing furnace body 52, and the heater 54 heats the inside of the softening annealing furnace body 52. The sheath tube 53 is disposed in the inner space of the softening annealing furnace body 52 along the traveling direction, and is in the longitudinal direction of the softening annealing furnace body 52 (walking. Both end portions of the direction, that is, the upper end portion and the lower end portion in the longitudinal direction protrude. In the softened annealing furnace body 52 of the sheath tube 53, an upper end opening portion 55u is formed at an upper end of the sheath upper side protruding portion 55 which protrudes at the upper end portion thereof. 17 201211309 The upper end opening portion 55u allows the wire to be plated la to be introduced into the inside of the sheath tube 53, and the reducing gas G filled inside the sheath tube 53 is discharged as will be described later. The lower end opening 55d is formed in the lower end of the sheath lower protruding portion 56 which protrudes from the lower end portion of the softened annealing furnace body 52 of the sheath tube 53. The lower end opening portion 55d allows the wire to be plated la to be led out from the sheath tube 53. The sheath lower protruding portion 56 is coupled to the connecting tube 55 in series. Further, the intermediate portion of the lower projection portion 56 of the sheath constitutes a branch portion which is configured as the reducing gas supply portion 57, and the reducing gas supply portion 57 supplies the supply of the reducing gas G to the inside of the sheath 53 . Further, although not shown, the reducing gas supply unit 57 includes a pressure regulating valve, a pressure gauge, and the like, and the reducing gas supply unit 57 adjusts the inflow of the reducing gas G in accordance with the concentration of the reducing gas G inside the softening annealing furnace 51. the amount. The reducing gas G flows into the inside of the sheath tube 53 from the reducing gas G supply portion 57, and the inside thereof serves as a reducing gas atmosphere. The heater 54 has a plurality of rods formed in a straight line, and is disposed in the upper side space and the lower side space with respect to the sheath tube 53, and is opposed to the sheath tube 53 with the inside of the softening annealing furnace body 52 interposed therebetween. The heater 54 is disposed in a direction perpendicular to the traveling direction of the line to be plated la, and in detail, when it is the paper surface of the front view 2, it corresponds to a direction perpendicular to the paper surface of FIG. 2, and the plurality of heaters 54 respectively The upper side space and the lower side space are arranged side by side at every specified interval along the traveling direction. The inside of the softening annealing furnace 51 is set by the heater 54 to a temperature of 800 ° C or more. 18 201211309 By connecting the sheath lower protruding portion 56 and the connecting pipe 55 in series, the wire to be plated la passing through the softening annealing furnace 51 can be moved without coming into contact with the air before being immersed in the molten immersion solder liquid 63. The dip key mechanism 61 is configured by a molten immersion solder bath 62 in which the immersion immersion solder liquid 63 is stored, and the molten immersion solder liquid 63 is set to a set temperature of 260 ° C, and a molten tin (Sn-3. 0Ag-0. 5Cu). In the inside of the molten dip solder bath 62, a groove direction direction changing roller 64 is disposed, and the groove direction direction changing roller 64 converts the traveling direction of the dip plating line lb to which the molten dip solder liquid 63 adheres to the direction vertically upward. . Further, the in-slot direction changing roller 64 has a groove direction changing roller 65 vertically upward, and the groove up direction switching roller 65 converts the dip plating line lb from the vertically upward traveling direction to the direction toward the winding mechanism 71. The in-slot direction changing roller 64 and the in-slot direction changing roller 65 are larger than a roller of about 20 mm in general, and are formed, for example, by a roller of about 0 100 mm. Further, the in-slot direction changing roller 64 and the in-slot direction changing roller 65 are similar to those of the winding mechanism 71, which will be described later, by a drive motor not shown in the drawings. The rotation speed of the roller 74 or the bobbin is actively and actively rotated to make the same direction as the take-up speed of the take-up mechanism 71, and the direction of the dip key 1 b is switched. Next, the winding mechanism 71 will be described. The take-up mechanism 71 is configured by winding up the tension adjuster 72 and the bobbin traverse type winder 75. The take-up tension adjusting machine 72 has a tension swinging wheel 74, and the tension is applied to the immersion plating line 1b of the fixed roller 73 at 19 201211309, so that the tension swinging wheel is movable in the vertical direction to adjust the tension state. Although not shown, the take-up tension adjuster 72 is further configured by a tension detecting sensor, a control unit, and a roller actuator. The tension detecting sensor detects the tension of the immersion plating line 1b, and the control unit corresponds to the tension check (4). The tension detected is controlled so that the tension is stabilized, and the roller actuator is configured to move the tension swing wheel 74 in accordance with an instruction from the control unit. As shown in Fig. 3 (a), the traverse bobbin type winding machine is constituted by a bobbin 76, a motor 77, and a transmission mechanism 78, and the bobbin 76 is formed to be thick and wide corresponding to the width of the immersion bell line b). The motor 77 swings the bobbin % in the axial direction of the bobbin 76, and the transmission mechanism is a ball screw (ball s (10)) or the like that transmits the motor. The traverse bobbin type reeling machine is configured by a winding force detecting sensor 79, a control unit 81, and a motor 82, and the winding force detecting sensor 79 detects the winding force of the bobbin 76, and the control unit is The winding detected by the tension detecting sensor 79 is taken up: and the control 'to stabilize the tension' motor 82 causes the bobbin 76 to rotate in accordance with an instruction from the control unit 81. 7 The apparatus for manufacturing a plated solder wire according to the above is a pre-dip plating treatment mechanism 2, a dip plating mechanism 61, and a winding mechanism 71, respectively, from the upstream side of the to-be-plated line "and the traveling direction of the dip line lb" A series of arrangements are arranged in series, wherein the supply device 12, the heat treatment furnace 22, the acid cleaning tank 3, the ultrasonic water washing tank 4, and the softening and dewatering furnace 51 are used as a pre-dip plating treatment mechanism. The groove 62 is used as the dip-plating mechanism 61. Further, the structure of the device for manufacturing the tin-plated tin wire is 020, which is 0. 2% proof stress is lowered, and thereafter, the low-endurance to-be-plated line la is subjected to immersion plating, and during the process, the winding mechanism 71 is used, and below the immersion line The cost of lb's financial power is taken up. Specifically, as the take-up mechanism 71, the above-described take-up tension adjusting machine 72 and the traverse bobbin type winding machine 75 are used, and a first conveying winch 91 and a second conveying winch 92 are provided, which are auxiliary winding. The winding of the mechanism 71. The first conveying winch 91 and the second conveying winch 92 are both disposed on the upstream side of the softening annealing furnace 51 to assist in the transportation of the to-be-bonded wire 1a before the low-margin. Specifically, the first conveying winch 91 is disposed between the heat treatment furnace 22 and the pickling tank 31, and the second conveying winch 92 is disposed between the ultrasonic water washing tank 41 and the softening annealing furnace 51. Further, when the winding speed of the immersion clock line 1 b is too slow or too fast, the load on the immersion clock line 1 b becomes large. In particular, when the take-up speed is too fast, the problem of line offset is also generated. Therefore, the speeds of the first transport winch 91 and the second transport winch 92 are only slightly faster than the take-up speed of the take-up mechanism 71, for example, a relative roll. The conveying speed is faster than the conveying speed of about + lm/min, and the waiting line la and the dip plating line lb are sent out to the downstream side. The winding mechanism 71 suitably has a plurality of fixed rollers 73 which are more immersed in the plating line 1b in the vicinity of the winding tension adjusting device 72 and the traverse bobbin winding machine 75. Among the plurality of fixed rollers 73 disposed in the winding mechanism 71, the fixed roller 73 provided on the most upstream side in the traveling direction is set as the winding mechanism 21 201211309. The roller 73A is disposed on the upstream side of the take-up mechanism, and the immersion plating line lb of the immersion bell line lb is moved to the side of the winding mechanism 71 by the direction of the groove-up direction switching roller 65. Roller. The in-slot direction changing roller 65 is disposed at a position higher than the upstream side of the winding mechanism to arrange the roller 73A. Next, a method of manufacturing a plating solder wire will be described. The method for producing a plated solder wire is produced by a pre-dip coating process, a dip plating process, and a coiling process, and the pre-dip plating process is performed by a pre-dip plating process on the plating line la, and the dip plating process is performed on the surface of the to-be-plated line la The soldering is performed, and the winding process is performed on the surface of which the immersion plating line lb has been subjected to immersion plating. The pre-dip plating treatment step is a step of sequentially performing a heat treatment step, an acid washing step, a water washing step, and a softening annealing step. The heat treatment step is a step of washing the surface vapor of the clock line 1 a by the inside of the heat treatment furnace 22 as a vapor atmosphere by the line to be plated la. By the steam cleaning, the water-soluble lubricant or other impurities attached to the surface of the clock line 1 a can be separated from the surface thereof, and the water-soluble lubricant or other impurities attached to the surface of the line to be plated la can be easily removed. . In the heat treatment step, the annealing temperature in the heat treatment furnace 22 is set to be lower than the annealing temperature of 200 ° C which is generally about 650 ° C, and the inside of the heat treatment furnace 22 set to the low temperature is used as a vapor atmosphere to make the waiting line 1 a Walking, wash the water with a water spray of 1 a. As described above, in addition to the steam cleaning of the clock line 1a, the heat treatment step further lowers the force by annealing the wire to be bonded 1a. However, the heating process of 201211309 is performed by setting the annealing temperature to, for example, a low temperature setting such as rc, thereby suppressing the degree of low endurance of the bell line 1 a. Further, the line to be plated after passing through the heat treatment furnace 22 La is cooled to a predetermined temperature by the cooling water stored in the interior of the cooling water tank 23 after the connection of the official unit 24. The acid cleaning step is a phosphoric acid stored in the acid cleaning tank 31 by the line to be plated la. The cleaning liquid 32 is used to pickle the surface of the line to be plated la to be walked in. The water washing process is performed by ultrasonically washing the surface of the ultrasonic line 1a in the ultrasonic cleaning tank 41 to remove the surface. a water-soluble lubricant or other impurity attached to the surface of the clock line la. The softening annealing process is performed by softening and annealing the wire to be plated by the inside of the softening annealing furnace 51 in which the wire to be plated la is to be used as a reducing gas atmosphere. The endurance is reduced, and the oxide layer on the surface of the layer to be plated la is reduced. As shown in detail in Fig. 2, the softening annealing step is to supply the reducing gas supply unit 57 provided by the boring tool 56 from the lower side of the sheath tube to supply the reducing gas to Softening annealing furnace 51 In the inside of the sheath tube 53, the softening annealing furnace 51 is disposed obliquely so that the position of the downstream end portion in the traveling direction is lower than the position of the upstream side end in the traveling direction, and as the reducing gas G, for example, hydrogen gas # y 〇gen gas The inside of the mixed chaotic body H 53 mixed with the nitrogen-rolled oxide (nitr〇gen transport (10)) is used as a reducing gas atmosphere (atm〇sphere). More advanced' the interior space of the softened annealer body 52 is heated to about 800 by the heater 54'. (: In the inside of the sheath tube 53 as the reducing gas ,, the line to be plated la introduced from the upper end opening 23 201211309 mouth portion 55u is in the opposite direction to the rising direction d1 of the reducing gas G, that is, the lower direction D is traveling. (Refer to the arrows dl and D shown in a part of the enlarged view in Fig. 2.) The subsequent immersion plating step is performed by the molten immersion bell solder 63 stored in the molten immersion solder bath 62 by the line la to be plated. The molten tin adheres to the surface of the bell line 1 a. The line to be plated la which is led out from the lower end opening 55d of the softening and dehydrating furnace 51 is moved in the interior of the connecting tube 55 without being in contact with air, and is immersed in molten metal. The dip-plated solder liquid 63 is guided before. The immersion line 1 a of the immersion molten solder paste 63 is adhered to the surface by the molten immersion solder liquid 63, and the surface is entirely immersed by the molten immersion solder liquid 63. The line lb. The process of walking the inside of the molten immersion solder bath 62 by the immersion plating line lb is performed by immersing the immersion clock soldering tube 64 in the immersion clock soldering groove 62. The process of the groove 62, the direction is switched to the vertical above, and from the melting The soldering bath 62 is led out vertically upwards. After the dip plating line lb is led out from the molten dip solder bath 62, the groove is turned by the groove direction switching roller 65, and travels toward the winding mechanism 71. The winding process is waiting During the immersion plating step and the immersion plating step, the plating line la is controlled by the tension oscillating wheel 74 of the winding tension adjusting device 72, and the immersion plating line 1b that has passed through these steps is subjected to tension adjustment, and the entire line will be aligned. The dip plating line lb is rolled up on the wire frame 76 disposed by the traverse wire frame type winding machine 75. As shown in detail in Fig. 3 (a) and (b), the traverse wire frame mode is rolled out 24 201211309. When the wire frame 76 is rotated, the wire frame 76 is swung in the axial direction, and the dip plating line lb can be wound up side by side in the axial direction of the wire frame 76, and the plurality of layers can be overlapped and wound up. The manufacturing apparatus 10 and the manufacturing method can obtain various functions and effects as follows. The soldering wire manufacturing apparatus 10 is a immersion plating processing mechanism 2, a immersion plating mechanism 61, and a winding mechanism 71, respectively, from the immersion plating line. The upstream side of the lb walking direction is sequentially arranged in series. The medium supply device 12, the heat treatment furnace 22, the acid cleaning tank 31, the ultrasonic water washing tank 41, and the softening annealing furnace 51 are used as the pre-coating treatment mechanism 2, and the melt-dip solder bath 62 is used as the dip plating mechanism 61°. By arranging the various mechanisms in this way, it is possible to prevent the dip-plated wire lb, which has low financial resources, from walking an unnecessary distance in the manufacturing process, and to reduce the load on the immersion plating line 1b during walking. The 2% endurance value is sufficiently reduced, and the desired quality immersion plating line lb is obtained by setting such a immersion plating line lb, which can improve the product yield and improve the manufacturing efficiency. Furthermore, the method for producing a plated solder wire is to continuously perform a heat treatment step, an acid cleaning step, an ultrasonic water washing step, a softening annealing step, a dip plating treatment step, and a winding step, and a heat treatment step, The acid washing step, the water washing step, and the softening annealing step are used as a pre-dip plating treatment step. By continuously performing the respective steps in this manner, it is not necessary to spend the time for immersing the immersion plating line lb (the line to be plated la) to another traveling line or the like, for example, every time a designated 25 201211309 process is performed, the immersion plating is interrupted for the next process. The line lb (to be plated la) walks. Therefore, the load on the immersion line 1 b can be greatly alleviated, and the immersion plating line 1b of a desired quality can be obtained by stabilizing. Therefore, 0 is obtained. The 2% endurance value is sufficiently reduced, and the desired quality immersion plating line lb is obtained by setting such a immersion plating line lb, which can improve the product yield and improve the manufacturing efficiency. Further, it can be efficiently manufactured. The 2% financial value is sufficient to reduce the quality of the immersion plating line lb. Therefore, a large-scale production of a suitable and low-endurance immersion plating line lb can be achieved as a wire for solar cells. Further, in the apparatus for manufacturing a solder wire, the softening annealing furnace 51 is disposed obliquely, and the position of the downstream end portion in the traveling direction is lower than the position of the upstream end portion in the traveling direction, and the softening is performed. On the downstream side in the traveling direction of the furnace 51, a reducing gas supply portion 57 is provided which allows the supply of the reducing gas G to the sheath tube 53, and the sheath tube 53 allows the wire to be plated la to be inserted while being inserted therein. The method of producing the soldering wire is in the softening annealing step, and inside the softening annealing furnace 51, the reducing gas G is supplied from the reducing gas supply portion 57 provided through the lower end side portion (downstream side portion) of the sheath tube 53. The inside of the sheath tube 53 is supplied, and the inside of the sheath tube 53 as a reducing gas atmosphere is allowed to travel from the upstream side in the traveling direction toward the downstream side. As shown in FIG. 2, in the inside of the sheath tube 53 which is a reducing gas atmosphere, in the inside of the sheath tube 53 which is a reducing gas atmosphere, the to-be-plated line la can be directed toward the direction in which the reducing gas G rises in the direction d1, as shown in FIG. That is, walking in the downward direction D. 26 201211309 Wrong this can make the jkrr walking in the saddle camp 53 exposed to the towel that rises in the G, and wait for Wei La, actively enter the surface of the money line U to restore the oxide layer = = rate Furthermore, in the interior of the tube 53, the low endurance of walking =. The lower end side portion (downstream side portion) of the direction, by the length 57 thereof, can be exposed to the original body supply portion that is re-supplied to the saddle tube 53

的環境（參照圖2)。的還原氣體G 即，於鞘管53之内部，行走中的待铲氣體供給部57時，可積極地促進待鍍線丨&、&近還原表面的氧化層的還原，待鍍線13通過還原：:：力化及而從軟化退火爐51導出期間，藉由在加熱器$ 給部57 下，可確實地進行待鍍線la的低耐力化及^ 54的加熱之還原。、面的氧化層的又’依此可確實且有效率地進行待鍍線丨& 及表面的氧化層的還原，因此，可達到縮耐力化於軟化退火爐51之内部的行走距離，又、a仃走線la的行走速度。可達到提升待鎮更進-步，於浸㈣處理卫序中，係於中使用軟化退火爐51同時進行待鍍線u的七、火工序表面的氧化層的去除，而相較以各別工序串_ $力化及其待鍍線la之表面所具有的氧化膜的還原^#地進行還原鍍線la之軟化退火的軟化退火工序，本 ^及進行待線U的行走㈣。 ^可達到縮短待因此，可降低低耐力化的待鍍線“所承心文的負何， 27 201211309 可製造高品質的浸鍍線lb。又，於軟化退火工序前所進行的加熱處理工序，係於加熱處理爐22中藉由加熱去除待鐘線la之表面所附著的附著物。例如，附著物係油等液狀附著物的情況，可將其汽化。依此，無關固狀、液狀等附著物的性質，可從待鍍線la之表面去除附著物。特別地，藉由在酸洗淨工序之前進行加熱處理工序，係在加熱處理工序中預先加熱待鍍線la，而可在酸洗淨工序對加熱狀態的待鍍線la進行酸洗淨，因此，更可提升酸洗淨效果。更進一步，於加熱處理爐22中，亦可根據加熱溫度而獲得對待鍍線la的退火效果。然而，依據上述鍍銲錫線的製造裝置10及製造方法，於加熱處理工序，係軟化退火爐51之上游側所配置的加熱處理爐22，於待鍍線la的0.2%耐力值完全降低至指定值前，不對待鑛線1 a進行軟化退火，而係停留在輕度的軟化退火。接著，於加熱處理工序後的洗淨工序，對待鍍線 la完成必要的洗淨，其後，於浸鍍工序之前進行的軟化退火工序，對待鍍線la進行軟化退火，以使其0.2%耐力值降低至指定值。藉此，不須對已低耐力化的待鍍線la進行洗淨工序，因此，可減輕待鍍線1 a所承受的負荷。' 詳細而言，相對一般加熱處理爐進行退火時的設定度溫度約650°C，加熱處理爐22係如上所述，例如設定為約 28 201211309 200°C的低溫，以作為蒸氣環境。更進一步，相對一般軟化退火爐的溫度設定為約530 °C，軟化退火爐51係如上所述，例如設定為約800°C的高溫。藉此，於加熱處理工序抑制待鐘線1 a的低耐力化，而於其後的酸洗淨、超音波水洗淨等洗淨工序之後所進行的軟化退火工序，使用軟化退火爐51，而使待鍍線la之0.2% 财力值降低至指定值而低财力化。因此，藉由對低财力化前的待鐘線1 a進行酸洗淨、超音波水洗淨，相較例如習知係對低财力化後的待鑛線1 a 進行這些工序的情況，前者可減輕帶給待鍍線la負荷的影響，此程度係可達到提升浸鍍線lb的品質。又，加熱處理爐22係其内部作為蒸氣環境，因此，根據加熱溫度，亦可對待鍍線la進行軟化退火，亦可期待蒸氣洗淨的效果。因此，於加熱處理爐22對待鍍線la進行蒸氣洗淨之同時，藉由蒸氣可使待鍍線la之表面所附著之附著物容易去除而表層化，因此，於其後所進行的酸洗淨工序及水洗淨工序，可確實地去除待鍍線la之表面所附著的水溶性潤滑劑或其他不純物。因此，可製造以均勻浸鍍厚度覆蓋、高品質的浸鍍線 lb。以下，針對效果確認實驗作說明。 (效果確認實驗）首先，作為加熱處理工序及軟化退火工序相關的效果 ... .... ... 29 201211309 確認實驗’針對進行的退火效果確認實驗A、B二個實驗作說明。 (退火效果確認實驗A) 退火效果確認實驗A係在加熱處理溫度為ι〇〇度的低溫設定之下’進行加熱處理工序，其後，於軟化退火工序係在各式各樣的退火溫度之下，進行軟化退火。於此情況，使退火溫度的設定與捲取工序後銅線的低耐力值之關係明確’根據此關係，針對為了獲得期望的低耐力值而於軟化退火工序中所須設定的退火溫度作確認。又，退火效果確認實驗A係使用上述製造裝置1〇,且以表1所示的實驗條件進行。 [表1]Environment (see Figure 2). The reducing gas G, that is, inside the sheath tube 53, when the gas supply portion 57 to be shovel is being driven, can actively promote the reduction of the oxide layer of the near-reduction surface to be plated, and the line to be plated 13 During the reduction from the softening annealing furnace 51 by the reduction::: force, the lower endurance of the to-be-plated la and the heating of the heating can be reliably performed by the heater portion 57. The oxide layer of the surface can be used to reliably and efficiently reduce the oxide layer to be plated and the oxide layer on the surface, so that the walking distance of the shrinkage resistance inside the softening annealing furnace 51 can be achieved. , a仃 walking speed la walking speed. It can be improved to wait for the town to go further, in the dip (four) treatment of the order, in the use of the softening annealing furnace 51 while simultaneously performing the plating line u, the removal of the oxide layer on the surface of the fire process, compared to the individual The process string _ $ force and the reduction of the oxide film on the surface of the layer to be plated la, the softening annealing process of the softening annealing of the reduction plating line la, and the walking of the wire U (4). ^ can be shortened to be reduced, therefore, can reduce the low endurance of the to-be-plated line "What is the heart of the heart, 27 201211309 can produce high-quality dip plating line lb. Also, the heat treatment process before the softening annealing process In the heat treatment furnace 22, the adhering matter adhering to the surface of the bell line la is removed by heating. For example, if the deposit is a liquid deposit such as oil, it can be vaporized. The property of the liquid deposit or the like can remove the deposit from the surface of the line to be plated la. In particular, the heat treatment process is performed before the acid cleaning process, and the wire to be plated la is heated in advance in the heat treatment process. The acid to be plated la can be acid-washed in the acid cleaning step, so that the acid cleaning effect can be further improved. Further, in the heat treatment furnace 22, the plating line can be obtained according to the heating temperature. However, according to the manufacturing apparatus 10 and the manufacturing method of the above-mentioned plating solder wire, in the heat treatment process, the heat treatment furnace 22 disposed on the upstream side of the softening annealing furnace 51 is 0.2% of the endurance value of the line to be plated la Before the reduction to the specified value, the softening annealing is not performed on the ore 1 a, but the mild softening annealing is performed. Then, in the washing step after the heat treatment step, the plating line la is cleaned as necessary. Thereafter, in the softening annealing step performed before the immersion plating step, the plating line la is soft-annealed to reduce the 0.2% proof value to a specified value. Therefore, it is not necessary to wash the line to be plated la which has low endurance. In the net process, the load to be applied to the wire 1 a can be reduced. In detail, the set temperature at the time of annealing in the general heat treatment furnace is about 650 ° C, and the heat treatment furnace 22 is as described above, for example, It is a low temperature of about 28 201211309 200 ° C as a vapor environment. Further, the temperature of the general softening annealing furnace is set to about 530 ° C, and the softening annealing furnace 51 is as described above, for example, set to a high temperature of about 800 ° C. Thereby, in the heat treatment step, the low endurance of the bell line 1a is suppressed, and the softening annealing step is performed after the cleaning step such as acid washing or ultrasonic water washing, and the softening annealing furnace 51 is used. , The 0.2% financial value of the to-be-plated line la is lowered to a specified value and the cost is low. Therefore, by washing the acid to be cleaned and the ultrasonic water is cleaned before the low-cost electricity, it is compared with, for example, conventional knowledge. In the case of performing these processes on the low-cost-to-mine line 1 a, the former can reduce the influence of the load on the to-be-plated line, and the degree can be improved to improve the quality of the immersion plating line lb. Since the inside is used as a vapor atmosphere, the plating line la may be subjected to softening annealing depending on the heating temperature, and the steam cleaning effect may be expected. Therefore, the heat treatment furnace 22 is subjected to steam cleaning of the plating line la. By the vapor, the adhering matter adhering to the surface of the layer to be plated la can be easily removed and surface-formed. Therefore, the acid washing step and the water washing step performed thereafter can surely remove the surface of the line to be plated la Water-soluble lubricant or other impurities attached. Therefore, it is possible to manufacture a high-quality immersion plating line lb which is covered with a uniform immersion plating thickness. Hereinafter, an effect confirmation experiment will be described. (Effect Confirmation Test) First, the effects of the heat treatment process and the softening annealing process are as follows. 29 29 201211309 Confirmation experiment 'The experiments of the annealing effects confirmed by the experiments A and B are explained. (Annealing effect confirmation experiment A) The annealing effect confirmation experiment A was performed by the heat treatment process below the low temperature setting of the heat treatment temperature of ι〇〇度, and then the softening annealing process was performed in various annealing temperatures. Next, softening annealing is performed. In this case, the relationship between the setting of the annealing temperature and the low endurance value of the copper wire after the winding process is made clear. According to this relationship, the annealing temperature to be set in the softening annealing process in order to obtain a desired low endurance value is confirmed. . Further, the annealing effect confirmation experiment A was carried out using the above-described production apparatus 1 and under the experimental conditions shown in Table 1. [Table 1]

實驗條件待鍍線（使用銅線）無氧銅 '平角線（0.2x0· 1mm) 加熱處理溫度 100°C 得錫溫度 260〇C 線速 16m/min 捲取張力（tension) 2.8N 又，退火效果確認實驗A的結果表示於表2及圖4。 [表2] 加熱處理溫度 °C 100 100 100 100 100 100 100 100 軟化退火溫度 °c 550 600 650 700 750 800 850 900 引張特性：0.2%耐力值 MPa 99 64 64 58 57 53 54 55 於此，表2係表示浸鍍線lb於捲取工序捲取後，測定其拉張特性之一，0.2%耐力值的結果，係於軟化退火爐 51中每一指定退火溫度的設定之下，對待鍍線la進行退火，再測定浸鍍線lb於捲取工序捲取後的0.2%耐力值。 30 201211309 圖4係根據圖2而將浸鍍線lb於捲取工序捲取後的0.2% 耐力值與軟化退火溫度的關係曲線化。如表2及圖4所示之結果，係於加熱處理工序的加熱處理溫度為100度的低溫之下，進行加熱處理工序的情況，軟化退火工序的退火溫度例如係550°C左右的低溫時，對待鐘線la的退火不充份，而顯示0.2%财力值為偏而傾向的結果。然而，即使加熱處理工序的加熱處理溫度為100度的低溫，若軟化退火工序的退火溫度為800°c〜900°c，可確認捲取後的浸鍍線lb的0.2%耐力值確實地收歛至55MPa 以下，為期望的低耐力值。 (退火效果確認實驗B) 退火效果確認實驗B係在各式各樣的加熱處理溫度之下，進行加熱處理工序，使加熱處理工序後待鍍線la的 0.2%耐力值與加熱處理溫度之關係明確，且於850°C—定的退火溫度設定之下，對這些待鍍線la進行軟化退火工序，而使軟化退火工序後的0.2%耐力值與加熱處理溫度之關係明確。又，本效果確認實驗B係應用上述製造裝置10，且以表3所示的實驗條件進行。 [表3]Experimental conditions to be plated (using copper wire) Oxygen-free copper 'flat angle line (0.2x0·1mm) Heat treatment temperature 100 °C Tin temperature 260 ° C Line speed 16 m / min Coiling tension (tension) 2.8 N Again, annealed The results of the effect confirmation experiment A are shown in Table 2 and Figure 4. [Table 2] Heat treatment temperature °C 100 100 100 100 100 100 100 100 100 Softening annealing temperature °c 550 600 650 700 750 800 850 900 Extension characteristics: 0.2% endurance value MPa 99 64 64 58 57 53 54 55 Here, the table The second system indicates that one of the tensile properties of the dip plating line 1b is taken up after the winding process, and the result of the 0.2% proof value is set under the setting of each specified annealing temperature in the softening annealing furnace 51. The la is annealed, and the 0.2% proof stress value of the dip plating line lb after the coiling process is taken up. 30 201211309 Fig. 4 is a graph showing the relationship between the 0.2% proof stress value and the softening annealing temperature after the dip plating line 1b is taken up in the winding process according to Fig. 2 . As shown in Table 2 and FIG. 4, the heat treatment process is performed at a low temperature of 100 degrees in the heat treatment process, and the annealing temperature in the softening annealing process is, for example, a low temperature of about 550 °C. The annealing of the bell line la is not sufficient, and the result that the 0.2% financial value is biased. However, even if the heat treatment temperature in the heat treatment step is a low temperature of 100 degrees, if the annealing temperature in the softening annealing step is 800 to 900 ° C, it can be confirmed that the 0.2% proof value of the dip plating line 1b after winding is surely converged. Below 55 MPa, the desired low endurance value is obtained. (Annealing effect confirmation experiment B) Annealing effect confirmation experiment B is performed under the various heat treatment temperatures, and the heat treatment process is performed to adjust the relationship between the 0.2% proof stress value of the to-be-plated line la and the heat treatment temperature after the heat treatment process. It is clear that the softening annealing step is performed on the to-be-plated line la at a setting of an annealing temperature of 850 ° C, and the relationship between the 0.2% proof stress value after the softening annealing step and the heat treatment temperature is made clear. Further, this effect confirmation experiment B was carried out by applying the above-described manufacturing apparatus 10 under the experimental conditions shown in Table 3. [table 3]

實驗條件待鍍線（使用銅線）無氧銅、平角線（0.2x0.1 mm) 加熱處理溫度 850〇C 銲錫溫度 260〇C 31 201211309Experimental conditions To be plated (using copper wire) Oxygen-free copper, flat wire (0.2x0.1 mm) Heat treatment temperature 850〇C Solder temperature 260〇C 31 201211309

線速 16m/min 捲取張力（tension) 2.8N 又，退火效果確認實驗B的結果表示於表4及圖5。 [表4] (a)通過加熱處理爐後加熱處理溫度 °C 100 200 300 400 500 600 引張特性：0.2%耐力值 MPa 440 124 115 100 66 43 (b)通過加熱處理爐、軟化退火爐後加熱處理溫度 °C 100 200 300 400 500 600 軟化退火溫度 °C MPa 850 850 850 850 850 850 引張特性：0.2%耐力值 55 54 54 54 52 56 於此，表4 ( a)係表示於每一指定加熱處理溫度的設定，測定進行軟化退火工序前待鍍線la的0.2%耐力值的結果，係於加熱處理工序對待鍍線la進行加熱處理，且為每一指定加熱處理溫度的設定，測定進行軟化退火工序前待鍍線la的0.2%耐力值。表4 (b)係表示測定浸鍍線lb於捲取後的0.2%耐力值的結果，係於上述每一指定加熱處理溫度的設定，且於軟化退火工序中850°C相同退火温度的設定之下，對已進行加熱處理工序的各待鍍線la進行退火，測定浸鍍線lb 於捲取後的0.2%耐力值。圖5係根據表4 (a)所表示的結果而畫出通過加熱處理爐22後的待鍍線la的0.2%耐力值與加熱處理爐溫度之關係，且根據表4(b)所表示的結果而晝出通過軟化退火爐後的待鍍線la的0.2%耐力值與退火溫度之關係的曲線圖。 32 201211309 如表4 (a)、（b)及圖5所示，於加熱處理工序，加熱處理溫度低時退火效果小，且0.2%耐力值未降低。然而，於軟化退火工序退火效果變大，而可使0.2%耐力值降低。另一方面，於加熱處理工序中，若加熱處理溫度高，亦可在該加熱處理工序獲得充份的退火效杲，其程度使軟化退火工序的退火效果變小。即，無關加熱處理工序的加熱處理溫度，利用將軟化退火工序的退火溫度設定為850°C的高溫，可確認0.2%耐力值確實地降低，為約55MPa以下的低值。依此，無關加熱處理工序的加熱處理溫度，藉由將加熱處理工序後所進行的軟化退火工序的退火溫度設定為 850°C，結果可使進行軟化退火工序的待鍍線la充份低耐力化。從此結果，相反地，從加熱處理工序一側來看，加熱處理溫度未必須要設定為高溫，係可對應目的而任意地設定。詳細而言，於加熱處理工序係藉由將加熱處理溫度設定為例如100〜300度左右的低溫，可抑制待鍍線la在加熱處理爐22的低财力化。因此，可碟認於加熱處理工序中可使待鍍線la低耐力化的程度，係在加熱處理工序後、軟化退火工序前所進行的洗淨工序中，即使於待鍍線la 施加負荷，也不至於突然伸長或破壞的程度。於加熱處理工序中，即使將加熱處理溫度設定為例如 100度〜300度左右的情況，亦可在加熱處理工序中達到某 · · -·- .... . . 33 201211309 種程度促料料la的低耐力化。即於加熱處理工序中，藉由將加熱處理溫度設定為例f〜3〇0度’而可使加熱處理工序作為待鍍線1a 低’日、預備退火的機能奏效，且為了使待錢'線ia充份低财力化至約55MPa以下程度，而在軟化退火工序中進行正式退火所須的退火時間，可達到縮短。因此’為了提升太陽能電池用鍍銲錫線的生產性，而提高待鐘線la之線速時’亦不須將軟化退火爐Η的長度長形地，成’而係可順利對應線速提升的要求。接著’於軟化退火工序中，進行退火爐氫濃度驗證實驗A及退火爐氫，辰度驗證實驗B二個實驗，以作為驗證供給至軟化退火爐51内部的還原氣體G所含有的氫氣體濃度的差異，對0.2%耐力值產生的影響。 (退火爐氫氣濃度驗證實驗A) 退火爐氫氣濃度驗證實驗A，係以本發明例之浸鍍線 lb及比較例之鏡線作為試驗樣本，其經由上述製造工序而生成。本發明例之浸鍍線lb及比較例之浸鍍線只有軟化退火工序相異，而其他皆經由相同工序而生成。為了生成本發明例之浸鍍線lb及比較例之浸鍍線而進行的軟化退火工序，兩者皆係以軟化退火爐51之内部作為還原性氣體環境，但還原氣體G的成份相異。即，生成比較例之浸鍍線的情況，係還原氣體G只由氮氣氣體（Nitrogen gas)構成，相對於此，生成本發明例 34 201211309 之浸鍍線lb的情況，還原氣體G係氮氣氣體與氫氣氣體混合的混合氣體。又，本實驗於製造本發明例之浸鍍線lb及比較例之浸鍍線時，係使用無氧銅作為待鍍線la，待鍍線la的尺寸為0.16x2mm，加熱處理爐22的溫度設定為200°C，第一輸送絞盤91及第二輸送絞盤92的各別捲取線速為 + lm/min而進行。又，製造這些浸鍍線lb時，於軟化退火工序前對待鍍線la進行酸洗淨工序及超音波水洗淨工序。又，於酸洗淨工序.係將磷酸系洗淨液的設定溫度設為50°C而進行。於浸鍍工序係將熔融浸鍍銲錫液63的設定溫度設為260°C而進行，作為熔融浸鍍銲錫液63係使用熔融錫 (Sn-3.0Ag-0.5Cu)。又，捲取機構71之構成未具有捲取張力調節機72，而係藉由橫動線架方式捲取機75而直接捲取。本發明例之浸鍍線lb及比較例之浸鍍線分別於上述設定之下，各生成三種浸鍍厚度20/z m、30// m、40# m，針對各別0.2%耐力值作比較，結果如圖6所示的曲線圖。如圖6所示的曲線圖，於浸鐘厚度為SO/zm'SO/zm、 40仁111之任一情況，比較本發明例之浸鑛線lb及比較例之浸鍍線，0.2%耐力值皆低。其中可確認浸鍍厚度為40 // m時，相較比較例之浸鐘線，本發明例之浸鐘線1 b的 0.2%耐力值的降低率係最高的。因此，可確認於退火工序中，藉由待鍍線la行走於軟 35 201211309 化退火爐51之内部，且軟化退火爐51之内部為含有氫氣氣體的還原性氣體環境，更有效率地促進待鍍線la的低耐力化。 (退火爐氫氣濃度驗證實驗B) 退火爐氫氣濃度驗證實驗B，係從還原氣體供給部57 對軟化退火爐51之内部供給的還原氣體G，設為至少含有氮氣與氫氣的混合氣體，且以氫氣氣體相對混合氣體的占有體積比率所表示的混合率·之差異，對浸鍍線lb (待鍍線 la)的0.2%耐力值的影響而進行驗證的實驗，係應用上述製造裝置10,且在表5所表示的實驗條件之下進行。 [表5]Wire speed 16 m/min Winding tension (tension) 2.8 N Further, the results of the annealing effect confirmation experiment B are shown in Table 4 and Fig. 5. [Table 4] (a) Heat treatment temperature after heat treatment furnace °C 100 200 300 400 500 600 Introduction characteristics: 0.2% endurance value MPa 440 124 115 100 66 43 (b) Heating by heating furnace, softening annealing furnace Processing temperature °C 100 200 300 400 500 600 Softening annealing temperature °C MPa 850 850 850 850 850 850 Extension characteristics: 0.2% endurance value 55 54 54 54 52 56 Here, Table 4 (a) is expressed for each specified heating The setting of the treatment temperature is measured as a result of the 0.2% proof stress value of the to-be-plated line la before the softening annealing process, and is heat-treated in the heat treatment process, and is set to be softened for each specified heat treatment temperature setting. 0.2% proof stress value of the plating line la before the annealing process. Table 4 (b) shows the results of measuring the 0.2% proof stress value of the immersion plating line 1b after winding, setting the temperature of each of the above specified heat treatment temperatures, and setting the same annealing temperature at 850 ° C in the softening annealing step. Next, each of the to-be-plated lines 1a which have been subjected to the heat treatment process is annealed, and the 0.2% proof stress value of the dip-plating line lb after winding is measured. Figure 5 is a graph showing the relationship between the 0.2% proof stress value of the line to be plated la after passing through the heat treatment furnace 22 and the temperature of the heat treatment furnace according to the results shown in Table 4 (a), and according to Table 4 (b) As a result, a graph showing the relationship between the 0.2% proof stress value of the to-be-plated line la and the annealing temperature after softening the annealing furnace was taken. 32 201211309 As shown in Table 4 (a), (b) and Fig. 5, in the heat treatment process, when the heat treatment temperature is low, the annealing effect is small, and the 0.2% proof stress value is not lowered. However, the annealing effect in the softening annealing step is increased, and the 0.2% proof stress value is lowered. On the other hand, in the heat treatment step, if the heat treatment temperature is high, a sufficient annealing effect can be obtained in the heat treatment step, to the extent that the annealing effect in the softening annealing step is reduced. In other words, the heat treatment temperature in the heat treatment step was set to a high temperature of 850 ° C in the softening annealing step, and it was confirmed that the 0.2% proof value was reliably lowered to a low value of about 55 MPa or less. According to this, irrespective of the heat treatment temperature in the heat treatment step, the annealing temperature in the softening annealing step performed after the heat treatment step is set to 850 ° C, and as a result, the line to be plated la subjected to the softening annealing step can be sufficiently low-resistance. Chemical. As a result, on the contrary, from the side of the heat treatment process, the heat treatment temperature is not necessarily set to a high temperature, and can be arbitrarily set in accordance with the purpose. Specifically, in the heat treatment step, by setting the heat treatment temperature to a low temperature of, for example, about 100 to 300 degrees, the low cost of the to-be-plated line la in the heat treatment furnace 22 can be suppressed. Therefore, it is possible to discriminate the degree of low endurance of the to-be-plated line la in the heat treatment process, and to apply the load to the plating line la after the heat treatment process and the cleaning process performed before the softening annealing process. Not to the extent of sudden elongation or destruction. In the heat treatment step, even if the heat treatment temperature is set to, for example, about 100 to 300 degrees, it is possible to achieve a certain amount in the heat treatment step. Low endurance of la. That is, in the heat treatment process, by setting the heat treatment temperature to the example f to 3 〇 0 degrees ', the heat treatment process can be used as the function of the low-day, preliminary annealing of the wire 1a to be plated, and in order to make the money The line ia is sufficiently low in energy to about 55 MPa or less, and the annealing time required for the main annealing in the softening annealing step can be shortened. Therefore, in order to improve the productivity of the soldering wire for solar cells, and to increase the line speed of the bell line la, it is not necessary to lengthen the length of the softening annealing furnace, and it can smoothly improve the line speed. Claim. Then, in the softening annealing step, two experiments of the annealing furnace hydrogen concentration verification experiment A and the annealing furnace hydrogen and the elongation verification experiment B are performed to verify the hydrogen gas concentration contained in the reducing gas G supplied to the inside of the softening annealing furnace 51. The difference in the impact on the 0.2% endurance value. (Analysis furnace hydrogen concentration verification experiment A) The annealing furnace hydrogen concentration verification experiment A was carried out by using the immersion plating line lb of the present invention example and the mirror line of the comparative example as a test sample, which was produced through the above-described manufacturing process. The immersion plating line 1b of the present invention and the immersion plating line of the comparative example differ only in the softening and annealing process, and others are formed through the same process. In order to form the immersion plating line lb of the present invention and the softening annealing process performed by the immersion plating line of the comparative example, both of the softening annealing furnace 51 are used as a reducing gas atmosphere, but the composition of the reducing gas G is different. In other words, in the case where the immersion plating line of the comparative example is produced, the reducing gas G is composed only of a nitrogen gas (Nitrogen gas), whereas the immersion plating line 1b of the invention example 34 201211309 is produced, and the reducing gas G is a nitrogen gas. a mixed gas mixed with hydrogen gas. Further, in the present experiment, in the production of the immersion plating line 1b of the present invention and the immersion plating line of the comparative example, oxygen-free copper was used as the line to be plated la, and the size of the line to be plated la was 0.16 x 2 mm, and the temperature of the heat treatment furnace 22 was used. The setting was 200 ° C, and the respective winding win speeds of the first conveying winch 91 and the second conveying winch 92 were + lm/min. Further, when these immersion plating lines 1b are produced, the plating line 1 is subjected to an acid washing step and an ultrasonic water washing step before the softening annealing step. Further, in the acid washing step, the setting temperature of the phosphate-based cleaning liquid was set to 50 °C. In the immersion plating step, the set temperature of the molten immersion solder liquid 63 is 260 ° C, and the molten immersion solder liquid 63 is made of molten tin (Sn-3.0Ag-0.5Cu). Further, the winding mechanism 71 is configured not to have the take-up tension adjusting mechanism 72, but is directly taken up by the traverse bobbin winding machine 75. The immersion plating line 1b of the present invention and the immersion plating line of the comparative example are respectively set under the above settings, and each of the three immersion plating thicknesses is 20/zm, 30//m, 40#m, and is compared for each 0.2% endurance value. The result is a graph as shown in FIG. 6. As shown in the graph of Fig. 6, in the case where the thickness of the dip bell is SO/zm'SO/zm or 40, 111, the dip line lb of the present invention and the immersion line of the comparative example are compared, 0.2% of the endurance line. The values are all low. Among them, it was confirmed that the immersion plating thickness was 40 // m, and the 0.2% proof stress rate of the immersion bell line 1 b of the present invention was the highest as compared with the immersion clock line of the comparative example. Therefore, it can be confirmed that in the annealing step, the wire to be plated la is moved inside the soft 35 201211309 annealing furnace 51, and the inside of the softening annealing furnace 51 is a reducing gas atmosphere containing hydrogen gas, which is more efficiently promoted. Low endurance of the plating line la. (Annealing furnace hydrogen concentration verification test B) The annealing furnace hydrogen concentration verification test B is a mixed gas containing the nitrogen gas and the hydrogen gas supplied from the reducing gas supply unit 57 to the inside of the softening annealing furnace 51, and The experiment for verifying the influence of the difference in the mixing ratio of the hydrogen gas with respect to the volume ratio of the mixed gas to the 0.2% of the immersion plating line lb (the line to be plated la) is applied to the above-described manufacturing apparatus 10, and It was carried out under the experimental conditions shown in Table 5. [table 5]

實驗條件待鍍線（使用銅線）無氧銅、平角線（0.16x2.0mm ) 加熱處理溫度 250〇C 軟化退火溫度 850〇C 還原環境氣體的混合比率 H2/( H2+ N2) [%] 銲錫溫度 260〇C 線速 14m/min 捲取張力（tension) 2.8N 退火爐氫濃度驗證實驗B的結果表示於表6及圖7。 [表6] 混合比率H2/( H2+ N2) % 0 10 20 30 40 50 外觀 OK OK OK OK OK OK 拉張特性：0.2%耐力值 MPa 56 55 53 53 53 52 於此，表6係表示測定浸錁線lb於捲取工序後的0.2% 耐力值的結果，係氫氣氣體相對至少由氮氣氣體構成之還原氣體的占有混合比率，分別設定為〇、10、20、30、40、 50%時，一邊以4.01/min的流量供給還原氣體至軟化退化 36 201211309 爐51之内部，一邊進行退火工序，而測定浸鍍線lb於捲取工序後的0.2%耐力值的結果。圖7係根據表6而晝出氫氣氣體於作為還原氣體之混合氣體的占有混合比率與捲取工序後的浸鍍線lb的0.2% 耐力值之關係的曲線圖。如圖7及表6所示的結果，可確認隨著提高氫氣氣體的混合比率，0.2%而寸力值係相同或變低。由此看來，可確認氫氣氣體的混合比率高者，顯示0.2%耐力值至少有變低的傾向。因此，可確認氫氣氣體具有還原待鍍線la之表面的氧化膜的效杲，對應還原氣體中氫氣氣體的濃度，可提高使 0.2%耐力值降低的效杲程度。接著，根據圖7所示之還原氣體中氫氣氣體的濃度與浸鍍線lb之0.2%耐力值的關係，藉由控制氫氣氣體相對還原氣體的濃度，可看出控制待鍍線la低耐力化程度的可能性。又，本發明之鍍銲錫線的製造裝置及鍍銲錫線的製造方法，並不限於上述鍍銲錫線的製造裝置10及鍍銲錫線的製造方法的構成，係可藉由各式各樣的構成而構成。例如，其他實施態樣的製造裝置10A，係如圖8(a)、 (b)所示，可將預先加熱爐51P設置於超音波水洗淨槽 41與軟化退火爐51之間。如圖8 (b)所示，即使在待鍍線la的行走時間及行走距離短的情況，預先加熱爐51P也急劇提高待鍍線la • · · · ... ..... . 37 201211309 的溫度而為特殊化的構成。具體而言，預先加熱爐51P於預先加熱爐本體up具有鞘管53L。該鞘管53L係沿著待鍍線1&的行走方向而直線狀構成的中空管’將預先加熱爐本體52p及軟化退火爐本體52各自内部作為連通配置的狀態，以使待鍵線“通過預先加熱爐51P及軟化退火爐51時，該待鍍線la不接觸空氣而氧化。預先加熱爐51P的内部與軟化退火爐51相同，預先如熱爐本體52P之内部，沿著鞘管现的長邊方向具有複旅個加熱器54P，且係以狹小於軟化退火爐51之加熱器 54的配置間隔的距離而配置。又，加熱器犯的配置數量 ϋ不限制多於軟化退火爐51之加熱器54p的數量，亦可 #提高其電量（瓦數）等。藉此’即使加速速線使待錢、線la行走，於軟化退火工务之前’可在預先加熱爐51P將待鑛線u加熱，而可將和熱狀態的待鑛線la供給至軟化退火爐51，以作為預先女7熱序。因此，對應待鑛線1&之線速的高速化，於軟化退火工务’可確實使待鍍線la為充份低耐力化的狀離。 H辭53L的軟化退火爐51與預先加熱爐5ip SI: I構成有預先還原氣體供給部57P，其供給還原 t 鞍管说之長度方向的預先加熱爐51P的部勿。上述還原氣體供給部57,係將作為還原氣體g的氮氣 38 201211309 與氮氣之混合氣體供給至鞘管53L，以相當於鞘管53L之軟化退火爐51的内部空間作為混合氣體環境，而預先還原氣體供給部57P係將作為還原氣體G的氮氣氣體或水蒸氣氣體（steam gas )，供給至相當於鞘管53L之預先加熱 - 爐51P的内部空間，使該内部空間為氮氣氣體環境或水蒸 - 氣氣體環境。藉此，可防止待鍍線la通過預先加熱爐51P時，其表面氧化，且預先加熱爐51P未使用氫氣氣體（hydrogen gas)作為還原氣體G，而係使用氮氣氣體或水蒸氣氣體，既安全又容易處理。詳細而言，待鍍線la行走時的線速，為一般設定的 4m/min時，如表7 (a)所示，於任一平角尺寸、溫度設定，皆可確認浸鍍線lb通過浸鍍工序後，其0.2%耐力值可降低至45Mpa以下的低值。 [表7] (a)線速：4/rain 尺寸 02x1.0 0.16x2.0 0.2χ2.0 銲錫溫度 °c 240 260 280 24+0 260 280 240 260 280 成品厚度 mm 0.238〜 0.240 0.234〜 0.238 0.238〜 0.240 0.203〜 0.207 0.199 〜 0.200 0.191〜 0.195 0.235〜 0.242 0.228〜 0.233 0.231〜 0.235 成品寬度 mm 0.993 0.994 1.001 1.998 1.998 2.002 1.976 2 1.973 浸鍍厚度 μ 19.0- 20.0 17.0〜 19.0 19,0〜 20.0 21.5 〜 23.5 19.5 〜 20.0 15.5 〜 17.5 17.5〜 21.0 14·0〜 21.0 15.5〜 17.5 0.2%耐力 MPa 43 45 44 43 44 42 43 42 40 外觀良良良良良良良良良Experimental conditions to be plated (using copper wire) Oxygen-free copper, flat wire (0.16x2.0mm) Heat treatment temperature 250〇C Softening annealing temperature 850〇C Reduction ratio of reducing ambient gas H2/( H2+ N2) [%] Solder Temperature 260 〇 C Linear velocity 14 m/min Winding tension (2.8 N) Annealing furnace hydrogen concentration verification Experiment B The results are shown in Table 6 and Figure 7. [Table 6] Mixing ratio H2/( H2+ N2) % 0 10 20 30 40 50 Appearance OK OK OK OK OK OK Stretching characteristics: 0.2% endurance value MPa 56 55 53 53 53 52 Here, Table 6 shows the measurement dip When the twist line lb is 0.2% of the endurance value after the winding process, the ratio of the hydrogen gas to the reducing gas of at least the nitrogen gas is set to 〇, 10, 20, 30, 40, 50%, respectively. While supplying the reducing gas to the inside of the softening degradation 36 201211309 furnace 51 at a flow rate of 4.01/min, the annealing step was performed, and the result of the 0.2% proof stress value of the dip plating line 1b after the winding step was measured. Fig. 7 is a graph showing the relationship between the ratio of the mixing ratio of the hydrogen gas to the mixed gas as the reducing gas and the 0.2% proof value of the dip plating line 1b after the winding step, according to Table 6. As a result of the results shown in Fig. 7 and Table 6, it was confirmed that the 0.2% strength value was the same or lower as the mixing ratio of the hydrogen gas was increased. From this point of view, it can be confirmed that the mixing ratio of the hydrogen gas is high, indicating that the 0.2% proof stress value tends to be at least low. Therefore, it was confirmed that the hydrogen gas has an effect of reducing the oxide film on the surface of the layer to be plated la, and the concentration of the hydrogen gas in the reducing gas can increase the degree of effectiveness of lowering the 0.2% proof stress value. Next, according to the relationship between the concentration of the hydrogen gas in the reducing gas shown in FIG. 7 and the 0.2% proof stress value of the immersion plating line lb, by controlling the concentration of the hydrogen gas relative to the reducing gas, it can be seen that the control of the to-be-plated line la has low endurance. The possibility of degree. Moreover, the apparatus for manufacturing a plated solder wire and the method for producing a plated solder wire according to the present invention are not limited to the configuration of the above-described plating solder wire manufacturing apparatus 10 and the method of manufacturing a solder wire, and can be formed by various configurations. And constitute. For example, in the manufacturing apparatus 10A of another embodiment, as shown in Figs. 8(a) and 8(b), the preheating furnace 51P can be disposed between the ultrasonic water washing tank 41 and the softening annealing furnace 51. As shown in Fig. 8(b), even in the case where the traveling time and the walking distance of the to-be-plated line la are short, the preheating furnace 51P sharply raises the to-be-plated line la • · · · ..... 37 The temperature of 201211309 is a specialization. Specifically, the preheating furnace 51P has a sheath tube 53L in the preheating furnace body up. The sheath tube 53L is in a state in which the inside of the preheating furnace body 52p and the softening annealing furnace body 52 are arranged in a line in a hollow tube which is linearly formed along the traveling direction of the line to be plated 1& When the furnace 51P and the softening annealing furnace 51 are preheated, the to-be-plated line la is oxidized without contacting the air. The inside of the preheating furnace 51P is the same as the softening annealing furnace 51, and is previously in the interior of the furnace body 52P along the sheath. The longitudinal direction has a complex heater 54P and is disposed at a distance smaller than the arrangement interval of the heaters 54 of the softening annealing furnace 51. Further, the number of configurations of the heater is not limited to more than the softening annealing furnace 51. The number of heaters 54p can also be increased by the amount of electricity (wattage), etc. By this, 'even if the speed line is used to make the money, the line la walks, before the softening annealing work' can be in the preheating furnace 51P will be waiting for the mine line u heating, and the hot state of the line to be la can be supplied to the softening annealing furnace 51 as a pre-female 7 heat sequence. Therefore, corresponding to the high speed of the line speed of the mine line 1 & Really make the line to be plated la The softening annealing furnace 51 of the 53L and the preheating furnace 5ip SI: I constitute a pre-reduction gas supply unit 57P that supplies the preheating furnace 51P in the longitudinal direction of the reduction t-sag tube. The reducing gas supply unit 57 supplies a mixed gas of nitrogen gas 38 201211309 and nitrogen gas as the reducing gas g to the sheath tube 53L, and the internal space of the softening annealing furnace 51 corresponding to the sheath tube 53L serves as a mixed gas atmosphere. The pre-reduced gas supply unit 57P supplies a nitrogen gas or a steam gas as the reducing gas G to the internal space of the preheating furnace 51P corresponding to the sheath tube 53L, and the internal space is a nitrogen gas atmosphere. Or a water vapor-gas atmosphere. Thereby, the surface of the to-be-plated line la is prevented from being oxidized when it passes through the preheating furnace 51P, and the preheating furnace 51P does not use hydrogen gas as the reducing gas G, but uses nitrogen gas. Gas or steam gas is safe and easy to handle. In detail, the line speed when the line to be plated la is 4m/min, as shown in Table 7 (a), Both the angular size and the temperature setting can be confirmed that the 0.2% proof stress value of the dip plating line lb can be reduced to a low value of 45 MPa or less after the immersion plating process. [Table 7] (a) Wire speed: 4/rain Size 02x1.0 0.16x2.0 0.2χ2.0 Soldering temperature °c 240 260 280 24+0 260 280 240 260 280 Finished thickness mm 0.238~ 0.240 0.234~ 0.238 0.238~ 0.240 0.203~ 0.207 0.199 ~ 0.200 0.191~ 0.195 0.235~ 0.242 0.228~ 0.233 0.231~0.235 Finished width mm 0.993 0.994 1.001 1.998 1.998 2.002 1.976 2 1.973 Immersion thickness μ 19.0- 20.0 17.0~ 19.0 19,0~ 20.0 21.5 ~ 23.5 19.5 ~ 20.0 15.5 ~ 17.5 17.5~ 21.0 14·0~ 21.0 15.5~ 17.5 0.2% endurance MPa 43 45 44 43 44 42 43 42 40 Appearance is good, good, good and good

其他條件：退火（anneal)溫度100°C還原爐850QC (b )線速：13/min 尺寸 0.2χ1.0 0.16x2.0 0.2χ2.0 銲錫溫度 °c 240 260 280 240 260 280 240 260 280 成品厚度 mm 0.263〜 0.276 0.257 〜 0.266 0·259〜 0.264 0.255〜 0.307 0.243〜 0.281 0.248〜 0.254 0.275〜 0.33 0.284- 0.334 0.285 〜 0.298 成品寬度 mm 1.003 1.004 0.998 2.001 2.022 2.009 1.965 1.966 1.982 浸鍍厚度 μ 31.5- 28.5 〜 29.5 〜 47.5- 41.5 〜 44.0 〜 37_5 〜 42.0 〜 42.5- 39 201211309 38.0 33.0 32.0 73.5一 0.2%耐力 MPa 49 50 50 52__ 外觀良良良良—Other conditions: Anneal temperature 100 ° C reduction furnace 850QC (b) Line speed: 13 / min Size 0.2 χ 1.0 0.16x2.0 0.2 χ 2.0 Solder temperature °c 240 260 280 240 260 280 240 260 280 Finished product Thickness mm 0.263~0.276 0.257 ~ 0.266 0·259~ 0.264 0.255~0.307 0.243~ 0.281 0.248~ 0.254 0.275~0.33 0.284- 0.334 0.285 ~ 0.298 Finished width mm 1.003 1.004 0.998 2.001 2.022 2.009 1.965 1.966 1.982 Immersion thickness μ 31.5- 28.5 ~ 29.5 ~ 47.5- 41.5 ~ 44.0 ~ 37_5 ~ 42.0 ~ 42.5- 39 201211309 38.0 33.0 32.0 73.5 a 0.2% endurance MPa 49 50 50 52__ Appearance good good -

60^5 47.0 65.0 67.0 49.0 44 51 50 52 良八※ 乂※ 850〇C ※外觀粗糙（平角平面部產生顆粒）又，表7 (a)係表示生如篆鍍線1b時G.2%财力值及浸鍍厚度的值，係使用三種尺寸爲 X2.〇mm、0.2mmx2.0mm 的平角線（flatSquarewire)作為待鐘線la，且分別對這些待鑛線la 4m/mm ’ 三種銲錫溫度為240°C、260°C、28〇C的设疋之下’而生成浸鍍線lb。相對於此，待鍍線la行走時的線速為13m/min的高速設定時，如表7(b)所示，於任，平角尺寸、溫度設定’，浸鍵線ib在大部分的設定，0.2%耐力值皆為50琴以上的值，相較於_般設定線速為4m/min的情況，前者係較高的值。這係因為藉由將待鐘線la的線速高速設定’於軟化退火爐巾，待鐘線la《充份一力化前即通過軟化退火爐51，而產生未充份低对力化的褒鐘線lb之生成的狀況° 又，表7(b)係表示生成褒鑛線lb❹㈣财力值及浸鍍厚度的值，餘線速為的高速歧’平角尺寸、銲錫溫度與表7(a)同樣的設定之T ’而生成浸鍍線lb。即，單純地將待鍍線la之線速設定為高速時，無法達到充份低耐力化，具有無法對應線速之高速化的問題。相對於此，上述製造裝置1〇Α的構成，係軟化退火爐 201211309 51與超音波水洗淨槽41之間設有預先加熱爐51p。在待鍍線la被供給至軟化退火爐51前，藉由預先加熱爐51P，可在短時間將存鐘線la加熱至高溫，而可將高溫化狀態的待鍍線la供給至軟化退火爐51。因此，將線速設定為上述焉速行走速度，即使待鍍線 la相對軟化退火爐51高速通過時’亦可於上述軟化退火工序中，確實地使待减線la低耐力化。具體地，如上所述’藉由設置預先加熱爐51P而進行預先加熱工序，即使線速设疋為13m/min的高速設定，亦可與線速為一般設定的4m/min時相同程度，使待鍍線la 的0.2%耐力值降低’因此，可藉由良好生產效率而獲得 0.2%耐力值低、高品質的浸錄線lb。更進一步，即使待鍍線la以線速13m/min的高速設定行走，亦可於軟化退火爐51確實地還原處理待鍍線u 之表面的氧化層。如上所述，軟化退火爐51的上游側附近所設置的預 ^加熱爐51P,係作為在待錢線1a之加熱性能特殊化的構、’且供給氮氣氣體或水蒸氣氣體至其内部，以作 ^易處理的氣體環境。因此’於軟化退火爐51作為確化退火時間的機構’相較例如僅將軟化退火爐5:、县形化的觀，前打會冑域51長藉由活用既有⑼偌有°又置工間或成本增加的問題，且二=追加設計變更的簡易構成，可對應錦又，作為其他實施態樣’加熱處理爐22非為必要之 41 201211309 j ’如圖9 (a)所示，作為其他實施態樣之製造裝置的冓成’亦可係不將加熱處理爐22設置於行裝置12與酸洗淨槽31之 + 门又進步，加熱處理爐22 、不限於係設置在行走方向中供給裝置12與駿洗淨槽之間’只要係軟化退火爐51的上游侧，設置於其他部位亦可。例如，不將加熱處理爐22設置於酸洗淨槽31之上游側’係只有設置上述預先加熱爐51p，且使用水蒸氣氣體作為還原氣體，供給至預先加熱爐51p之内部亦可。根據此構成，如上所述，預先加熱爐51p可兼具雙方功能，係在軟化退火爐5 i之前進行預先加熱的功能之^卜，再加上上述加熱處理爐22所進行的功能。因此，不用說可達到設備成本的削減，更可進一步地縮短待鍍線la的行走距離，且可生產〇·2%耐力值低、高品質的浸鍍線lb。又，如上所述，軟化退火爐51之内部作為還原氣體環境，而如上所述，此還原氣體〇並不限於氮氣氣體或氮氣氣體與氫氣氣體的混合氣體，亦可含有其他成份。又，亦可係以氮氣氣體或氫氣氣體以外的還原氣體而構成。又，藉由將洗淨機構配置於行走方向中軟化退火爐51 的上游側，藉由軟化退火爐51而低耐力化前的待鍍線la 係可利用洗淨機構30進行洗浄。因此，相較已藉由軟化退火爐51而低耐力化的待鍍線la，利用洗淨機構3〇進行洗淨的情況，前者係可減輕於待鍍線1&所施加的負荷。 42 201211309 因此可獲得0.2%耐力值充份降低、期望品質的浸錢線1b ’特別係可獲得適合的浸鍍線lb，以作為太陽能電池用鐘鲜錫線。少又，依此，相較已藉由軟化退火爐51而低耐力化的待鑛線la彳j用洗淨機構3Q進行洗净的情況，可減輕於待鍵線^所施加的負荷，因此，為了減輕待鍍線h行走時的負何’不須減少輸送絞盤之設置數量，或不須使線速 '因此，為了達到減輕於待鍍線la所施加的負荷，於構 ' 控制方面，更於條件設定方面，可將其對策簡略化，因此，可提升浸鍍線lb的製造效率。又更進一步，藉由如上述之配置具有洗淨機構％，待鍵線1&之表面所附著的不純物藉由洗淨機構3G去除，且藉由其下游側所配置的浸鐘機構61，可對待鑛線U之表面化成均自讀厚度，㈣成請品質的贿錫線U。又/又鍍别處理機構2於行走方向中軟化退火爐51 的上游側’具有對待_ u進行加熱處理的加熱處理爐 2 ’藉由將加熱處理爐22配置於行走方向中洗淨機構3〇的上游側，可在加熱處理爐22對待麟h進行加孰處理工序後，於洗淨機構30洗淨待鍍線u。，此，藉由加熱處理爐22將待鍍線la之表面所附著，附著物加熱時，即使附著物為燒焦的煤等殘留物而殘留待鍍線la之表面的情況，其後，可藉由通過的洗淨機構而洗浄.，確實地去除殘留物。 43 201211309 更進一步，以酸洗淨槽31及超音波水洗淨槽41構成洗淨機構30，而加熱處理爐22、酸洗浄槽31、超音波水洗淨槽41及軟化退水爐51作為浸浸鍍前處理機構2，且沿著行走方向依序配置，藉此，可使未被軟化退火爐51 低耐力化之待鏡線1 a在加熱處理爐22、酸洗淨槽31及超音波水洗淨槽41進行的一連串工序完成。即’依此，作為浸浸鍍前處理機構2，而將加熱處理爐22或洗淨機構3〇配置於於軟化退火爐51之上游側，且於軟化退火爐51使待鑛線la低财力化，而可使待鍍線 la低耐力化後*久’於浸錢構61施行浸鍍處理工序。因此，可極力避免對已低耐力化的浸鍍線lb施加負荷，而可獲得品質良好的浸鐘線lb。特別地，藉由將酸洗淨槽31酉己置於加下游側，在加埶虛理_ …、爽理爐22的 …處理爐22將待鍍線U加埶，二:=態於竣洗淨槽31對其進行酸在= 淨的情況，前者可格二= 且』後件良好的酸洗淨效果。又，如上所述，於加處理設置有冷卻一酼洗净槽31之間 P水槽23。通過加熱處理爐22 冷郃水槽23冷卻徭，待鍍線la藉由 P後’行走至酸洗淨槽31。依此，通過加熱處理爐22之後不久冷卻水槽23冷卻，^ 傻+久的待鍍線la藉由 P 因加熱處理爐22而為知叙山、線la ,其表面难娃* *、、'狀態的待錢、、隹持鬲溫狀態溫度而行走於與酸洗淨槽31之η 定 '加熱處理爐22 間’可再度防止待鑛線。的表面形成氧 44 201211309 化膜 ^ ’冷部水槽23並未使因加熱處理爐κ而加熱的待錢線la的表面冷卻至常温，在冷卻水槽2 =冷卻，較佳係待麟la的表面溫度至少㈣在5f^a 右0 2 ’於酸洗淨槽31中，可對表面溫度至少有％度，鍍線la進行酸洗淨，因此，雜系洗浄液K可發揮更子的酸洗淨效果。依此可有效率地進行酸洗淨，因此， ^使係待麟la高速行走的情況，可確實獲得酸洗果。费丄依據上述鍍銲錫線的製造裝置10及鍍銲錫線的、線1^使用垂直剖面的寬度為0.8,.〇随首已⑽/度為G.G5〜G.5nm範圍内大小的平角銅線，垂二料目對其長度方向而垂直的勤的行走 ^設定為約4.Gm/min’於酸洗淨槽31的酸洗淨時間設 =約以秒’且藉由將超音波水洗淨槽4ι的超音波水 ; ''時間設定為約13.5秒，可獲得良好的洗淨效果。 1〇上述待鍍線1a係使用大小為寬产户0:m乾圍内、厚度〇16~〇2inm範圍内的平角銅ς Mb/、上述之待錢線la的行走速度、酸洗淨槽31的酸的^間及超音波水洗淨槽41的超音波水洗淨時間相同 1的又明H果進行洗淨，如稍後說明的洗淨效果確認實驗的月確、、Ή果’可獲得更良好的洗淨效果。 45 201211309 接著，針對洗淨效果確認實驗作說明。 (洗淨效果確認實驗1) 洗淨效果確認實驗1係對待鍍線la依序進行加熱處理工序、酸洗淨工序、水洗淨工序時，針對其洗淨效杲的差異進行驗證的實驗，如表8所示，係藉由上述製造裝置及製造方法製造浸鍍線lb，且在本發明例及比較例二種設定例之下進行。 [表8] 線速比尺寸 (縱X橫） mm 圓線換算 (ΦΌ) 長度線速通過時Μ 長度有效長度線速通過時間長度有效長度線速通過時間 mm cm m/min sec cm cm π/min sec cm cm m/min sec 平 0.2χ2.0 0.72 230 4 34.5 150 85 4 12.8 115. 90 4__ 13.5 本發明例 1 角 0.1640 0.66 〃 1! π η // // // // n η // 線 0-2χ1.0 0.52 〃 // n η η n // // η η 〃 0.76 // 20 . 6.9 η η 20 2.6 η // 20 2.7 比較例 5 圓線 0.65 〃〃 // η 〃 η η η 〃 η // 0.53 // U π η " η η η // π 〃本發明例相對比較例的線速設定為五分之一。即’如表8所示，本發明係相對習知例五分之一的線速，通過加熱處理爐22、酸洗淨槽31、超音波水洗淨槽41各部的時間設定為5倍。又，比較例係使用直徑0.76mm、0.65mm、0.53mm三種尺寸的圓線作為待鍍線la，相對於此，本發明例係使用縱（厚度）及橫（寬度）為 0.2mmx2_0mm、0.16mmx2.0mm、 0.2mmx 1.0mm三種尺寸的平角線作為待鍍線la。又，洗淨效果確認實驗係本發明例與比較例的待鍍線 la的形狀及線速以外的設定，其他為互相相同的設定。在此，於本實驗所使用的洗淨裝置的構成，係將進行 201211309 加熱處理工序的熱處理爐22、於酸洗淨工序的酸洗淨槽 31、於水洗淨工序的超音波水洗淨槽41以串列配置，且加熱處理爐22、酸洗淨槽31、超音波水洗淨槽41係以圖 10所示的各部分尺寸而構成。又，圖10為概要地顯示在本實驗所使用的洗淨裝置及其週邊部分。於加熱處理爐22中係使用蒸氣作為洗淨劑，可特別地期待對油汙等的洗淨效果。於酸洗淨槽31中係使用酸洗淨液作為洗淨劑，可期待對氧化物等的洗淨效果。超音波水洗淨槽41中係使用水作為洗淨劑，可在酸洗淨工序可特別地期待對待鍍線la之表面所殘留的酸液等的洗淨效果。又，於加熱處理工序中，係以加熱處理爐22的内部作為蒸氣環境，因此，即使加熱處理爐22係一蒸氣機亦可作用。因此，於加熱處理工序中，亦可期待藉由加熱去除待鐘線1 a之表面所附著的附著物的效果，因此，將加熱處理工序視為洗淨工序的一部分而包含在本實驗對象。洗淨效果確認實驗之評價的進行，係根據目視本發明例與比較例於各別水洗淨工序後的待鍍線la之表面狀態以及捲取工序後的浸鍍線lb之表面狀態，所產生的指定基準，而進行比較、辨認。在上述條件之下所進行的結果，首先，針對水洗淨工序後待鍍線la的表面狀態，本發明例的線速設定與比較例的線速設定相異時，完全無法辨認待鍍線la之表面附著有 47 201211309 如斑點或膜般大範圍的油，或離散狀、點狀地的粉塵等附著物，而可確認可達到待鏡線la表面的清淨化。更進一步’根據目視浸鍵線1 b於最後的捲取工序後其表面的浸鍍狀態所產生的指定基準’而進行確認，本發明例之線速設定與比較例之線速設定相異時’無法辨認表面的凹凸，而可確認浸鍍線於長度方向及外周方向的浸鍍厚度均勻。又，有關線速，相對比較例係设疋為20m/niin，本發明例係相對比較例的速度設定而設定為五分之一’即速度為4m/min，可獲得充分的洗淨效果’因而可期待獲得更好的洗淨效果，進而可考慮將線速設定為低於4m/min的低速。但，在線速低於4m/min的低速5又疋之下，嘗試相同的實驗，但無法獲得4m/min之速度设疋時洗淨效果以上的效果，明顯看來並非將線速設定越低速越可提升洗淨效果。更進一步，將待鍍線la之線速設定為低於4m/min的低速時，係使待鍍線la通過各工序的通過時間變長，因此，具有生產性下降之虞。據此，從洗浄工序所獲得的洗淨效果的觀點以及生產效率的觀點，在上述實驗條件之下，可獲得線速較佳係設定為約4m/mm的結果。 (洗淨效果確認實驗2) 洗淨效果確認實驗2係對符鍍線1a進行酸洗浄工序、水洗淨工序時，針對其洗淨效果的差異進行驗證的實驗， 48 201211309 係藉由上述製造裝置10及製造方法製造浸鍍線lb時，在本發明例及比較例二種設定例之下而進行。比較例未進行加熱處理，而係以酸洗淨工序、水洗淨工序的順序進行洗淨工序，相對於此，本發明例係在酸洗淨工序之前進行加熱處理工序，之後再以酸洗淨工序、水洗淨工序的順序進行洗淨工序。洗淨效果確認實驗之評價的進行，係根據目視本發明例與比較例在各別水洗淨工序後待鍍線la的表面狀態以及捲取工序後浸鍍線lb的表面狀態，所產生的指定基準，而進行比較、蜂認。在比較例的設定之下，辨認進行洗淨工序後的待鍍線 1 a，其表面殘留酸化層。更進一步，辨認浸鐘線lb表面的浸鍍狀態，可確認浸鍍線lb的表面變粗。相對於此，在本發明例的設定之下，確認進行洗淨工序後的待鐘線，無法辨認表面的油污等薪汙，氧化層也未殘留。更進一步，確認浸鍍線表面的浸鍍狀態，表面未有凹凸，而可確認形成均勻浸鍍厚度。根據上述，相較在酸洗淨工序前進行加熱處理工序，而對常溫的待鍍線進行酸洗淨工序的情況，可確認本發明例可格外地提升酸洗淨效果，可獲得良好的酸洗淨效果。上述鍍銲錫線的製造裝置10以及鍍銲錫線的製造方法，並不限於上述之構成及製造方法，係可藉由各式各樣的構成及製造方法而構成。作為其他實施態樣，將冷卻水槽23設置於加熱處理 49 201211309 爐22與酸洗淨槽31之間並非必要的構成，如圖％不冷部水槽23亦可係不設置於加熱處理爐^ 槽31之間。、馭冼净敎沾^ 5又置冷部水槽23時，因加熱處理爐22而表面被加線1。係其表面溫度可維持高溫狀態而行走於酸洗净槽31，可餅更有絲的料料果。 4 f造=依據鍍銲錫線的製造裝置ΐΌ續銲锡線的裝化方法，豬由輸送絞盤91 ' 92在扞击， =送捲取機構71的捲取’藉此’因捲取機構Μ於;= △ &施加的捲取力，可相對輸送絞盤91、92，在: =的上游側及下游側分散，進而減輕因捲取機構7 : 生的捲取而在待鍍線la所施加的負荷。產 ^此，可使浸鍍線lb的Q 2%耐力值充份地降低，且制延展率，而可獲得期望品質的浸錢線。盤9Γ、9Γ!3鍍銲錫線的製造裝置1〇,藉由將輸送絞軟化退火爐ΤΙ 向中軟化退火爐的上游側，可在爐51輔助輪送低耐力化前的待鍍線la。鍍線^此拉例如’藉由主動轉動的輸送絞盤而辅助輸送待等負T，不s對已低耐力化的待鍍線la施加拉張張力 ^在，保浸鍍線1]3的品質上，可確實地輔助輸送。構30的別如第二輸送絞盤％係設置於行走方向中洗淨機爐51、下游側、軟化退火爐51的上游側，可在軟化退火此使待链、線la低耐力化之*，辅助輸送待鐘線卜藉鍍線la不會承受負擔，可有效率地輔助通過軟化退 50 201211309 a (浸鍍線lb)的行火爐51，輸送已低耐力化的待鍍線j 走0 又，轉換浸鍍線lb之行走方向的方向轉換滾輪之中，配置於溶融浸鍍銲錫槽62的内部的槽中方向轉換滾輪 64」係與輪:絞盤91、92相同，絲融浸鐘銲錫槽62之㈣所具有的藉由馬達驅動而使滾輪主動轉動，以作為進行辅助輸送浸鍍線lb的輸送絞盤而構成。 *藉由將射方向轉換滾輪64作為輸送絞盤而構成，在浸鍍線ib通聰融浸鍍銲職62前後，將浸鑛線u 的行走方向轉換時，係以與浸鐘線lb的轉動速度而主動韓動，闵4又％U的勃轉動目此，槽中方向轉換滾輪6 鍍線lb的仃走方向轉換之外，還可輔助浸錢線^的行走。因此，藉由槽中方向轉換滾輪64與浸鍵線lb接觸， =動方向的摩擦抵抗所產.生的負荷不會施加於浸錢線 lb，可順暢地將浸鍍線lb送出。詳細㈣’轉換行走方㈣，會㈣施加負荷於浸鐘 L線：：。=線lb之行走方向的轉換會特別成為該、責^这-f、.。耐力值增加的要因。而將浸錢線ib從浸潰於溶融讀觸液63的㈣取出時，浸鍍銲錫槽62中，進行這樣的行走方向轉換。行走因:進浸在浸潰於溶融浸鐘銲錫液63的狀態订方向轉換時，承受來自炫融浸錢銲錫液63 =性抵抗，因此，行走方向轉換時更增加負荷使耐力值的增加量變得明顯。便J/0 201211309 因此，如上所述，藉由將槽中方向轉換滾輪64作為輸送絞盤而構成，即使浸鍍線lb在浸潰於熔融浸鍍銲錫液63的狀態進行方向轉換，可盡量抑制於浸鍍線lb施加的負荷，而可製造0.2%耐力值低的浸鍍線lb。接著，針對捲取浸鍍線lb前所施加之張力作驗證的張力驗證實驗而作說明，作為效果確認實驗。 (張力驗證實驗）張力驗證實驗係根據浸鍍線lb的鬆弛程度對0.2%耐力值的影響進行驗證，係浸鍍線lb從槽上方向轉換滾輪 65到達捲取機構71 (捲取機構上游側配置滾輪73A)前期之間，對浸鐘線1 b施加之張力的施加程度，浸鐘線1 b的鬆弛程度而進行驗證。在浸鍍線lb到達捲取機構上游侧滾輪73A之前，對浸鍍線lb施加之張力的施加程度難以數值化，因此，張力的施加程度，係將影響該張力施加程度的輸送絞盤91、 92的設置數量，以及使熔融浸鍍銲錫槽62之内部的軸桿 (槽中方向轉換滾輪64)為被動轉動或主動轉動參數化，對應這些參數的設定，而驗證0.2%耐力特性。詳細而言，如表9所示，在浸鍍線lb到達捲取機構上游側配置滾輪73A之前，係對浸鍍線lb的張力施加程度設定為第一張力設定至第四張力設定的四階段。 [表9] 52 201211309 張力設定第一第二第三第四輸送絞盤個數 1 1 2 2 槽中方向轉換滾輪隨動轉動滾輪驅動轉動滾輪隨動轉動滾輪驅動轉動滾輪於第一張力設定中，係輸送絞盤的設置數量只有第一輸送絞盤91 一個，且以隨動轉動滾輪構成槽中方向轉換滚輪64的設定。又，隨動轉動滾輪係未具有驅動滾輪的馬達等，係被動地自由轉動的滚輪。第一張力設定係四階段中張力最強，浸鍍線lb呈繃緊伸張的狀態。於第二張力設定中，係輸送絞盤的設置數量只有第一輸送絞盤91 一個，且以驅動轉動滾輪構成槽中方向轉換滾輪64的設定。又，驅動轉動滾輪係藉由馬達等驅動而能主動轉動的滾輪。第二張力設定係相對第一張力設定張力為稍弱的狀態。於第三張力設定中，係輸送絞盤的設置數量為第一輸送絞盤91及第二輸送絞盤92二個，且以隨動轉動滾輪構成槽中方向轉換滾輪64的設定，相對第二張力設定張力為稍弱的狀態。於第四張力設定中，係輸送絞盤的設置數量為第一輸送絞盤91及第二輸送絞盤92二個，且以驅動轉動滾輪構成槽中方向轉換滾輪64的設定，相對第三張力設定張力稍弱，且係四階段中最弱，浸鍍線lb呈最鬆弛的狀態。浸鍍線lb的荷重特性，包含0.2%耐力特性等，在上述第一張力設定至第四張力設定的各別設定的情況，係如 53 201211309 表10及圖11所示的結果。 [表 10] 銅線規格拉張特性張力設定項目單位第一第二第三第四平角線（0.16x2.0mm )、OFC 0.2%耐力 MPa 54 53 52 51 平角線（0.2x1.0mm)、OFC 0.2%耐力 MPa 54 52 50 50 又，針對待鐘線la皆為無氧銅，尺寸分別為0.16mm x2.0mm、0.2mmxl.0mm二種平角線而進行。從表10及圖4的結杲，二種尺寸的待鍍線la之任一情況，輸送絞盤的設置數量係二個比一個更可使0.2%耐力值微低設定。因此，可確認輸送絞盤的設置數量係二個比一個更具有效性。又，輸送絞盤的設置數量係二個時，即，第四張力設定及第三張力設定的情況，如圖11 (b)所示，待鍍線la 係0.2mmxl .0mm大小的平角線時，槽中方向轉換滾輪64 無論是否為驅動轉動滾輪或隨動轉動滾輪，0.2%耐力值皆為相同的值。另一方面，這之外全部設定中，比較以驅動轉動滾輪構成槽中方向轉換滾輪64，與以隨動轉動滾輪構成槽中方向轉換滾輪64的情況，前者的0.2%耐力值為較低的值。由此，比較以驅動轉動滾輪構成槽中方向轉換滾輪64 的情況，與以隨動轉動滾輪構成槽中方向轉換滾輪64，清楚顯示前者的0.2%耐力值有變低的傾向，可確認以驅動轉動滾輪構成槽中方向轉換滾輪64的有效性。特別從表10及圖11的結果，第一張力設定至第四張 54 201211309 力設定之中，第四張力設定的情況’即，浸鍍線lb到達捲取機構71 (捲取機構上游側配置滾輪73A)前，以該浸鍍線lb最鬆弛的狀態捲取該浸鍍線lb時，可降低浸鍍線 lb的負荷’可確認〇·2〇/0而于力值特別降低。更進一步，至少以二個輸送絞盤的設置構成，以及以驅動轉動滾輪構成槽中方向轉換滾輪64的構成之任一，輔助輸送待鍍線la (浸麟lb)的捲取，係可在浸鐘 lb到達捲取機構71 (捲取機構上游侧配使該浸刪呈鬆_狀態，而在可獲得。:二^ 低至指定值、良好品質的浸鐘線lb±，可確認有效。、上述鍍銲錫線的製造裝置10及鍍銲錫線的製造方法’並不限於上述構成及製造方法，係可藉由各式各樣的構成及製造方法而構成。例如，第一輸送絞盤掏迗絞盤92並不限;$ 配置在上述配置位置，亦可配置於行走方向之任一位置又’輸送絞盤亦可只具有第—輸送絞盤91及第二輸㊉盤92之任一的構成。亦可不設置第二輸送具體地，例如，如圖丨2所示絞盤92而構成。㈣t進—步’亦可係具有第—輸送絞盤％及第二輪送盤2以外的複數、設置於適當位置的輪送絞盤。又更進-步’並不限於槽中方向轉換滾輪64 如上所述的，以驅動轉動滾輪而主動轉動，亦可係槽上向轉換滚輪65構成於驅動轉動滾輪而主動轉動。3 55 201211309 又，鍍銲錫線的製造裝置10係如上所述，捲取機構 71配置有捲取機構上游側配置滾輪73A。熔融浸鍍銲錫槽62之上方所具有的槽上方向轉換滾輪65的特徵在於，係配置在高於捲取機構上游側配置滾輪73A的位置。換而言之，上述鍍銲錫線的製造方法的特徵在於，係浸鐘線lb藉由槽上方向轉換滾輪65而方向轉換後，行走至捲取機構71 —侧，再藉由低於槽上方向轉換滾輪65之低位置所配置的捲取機構上游側配置滾輪73A，將浸鍍線開始架越在捲取機構71。藉由這樣鍍銲錫線的製造裝置10及製造方法，可獲得0.2%耐力值充份降低，期望品質的浸鍍線lb，藉由使這樣的浸鍍線lb安定而獲得，可提升產品產率，又可提升製造效率。更進一步，可有效率地製造0.2%耐力值充份降低、期望品質的浸鍍線lb，因此，可達到大量生產適合且低耐力化的浸鍍線lb，以作為太陽能電池用導線。若詳細說明，例如，如圖16 ( a)所示，習知構成係以槽上方向轉換滾輪65與捲取機構上游側配置滾輪73A 略同高度而配置的情況，如圖16(a)中的X部分放大圖所示，作用在浸鍍線lb的重力g只對行走方向略垂直的方向作用。又，如圖16 (b)所示，習知係槽上方向轉換滾輪65 以低於捲取機構上游側配置滾輪73A的高度而配置的情 56 201211309 ；^如=/6 (b)中的X部分放大圖所示，作用在浸鍍線二與浸鐘線1'的行走方向相反方向的成份對浸鐘線ib作用。於上述任一情況，在使浸鍍線ib行滚輪73A„，浸鍍線lb容易承受作用於其本 f機72g/l產生的負荷，而產生必須加大設定捲取張力 == 則的捲取力的必要’產生於浸錄線ib 何變得更大的問題。彳目對於此’槽上方向轉換滾輪65係高於捲 Γ配置滾Μ之配置高度的位㈣相對高度_而配置時，如圖13所示，浸鑛線1b通過溶融浸鍍銲錫槽62後，藉由槽上方向轉換滚輪65而方向轉換的浸鐘線ib，^ 走，以使浸鍍線15行走至捲取機構上游側配置滾輪7从期間，往行走方向的下游側前進、下降。藉由將浸鑛線lb設定為這樣的態樣，如圖13令纽大圖所示，於槽上方向轉換滾輪65與捲取機構上游側配置滾輪73Α期間，作用於浸鍍線lb的重力g之中 =錢線lb的行走方向成份g2係可作為朝向捲取機構上游側配置滚輪73A，輸送浸_ lb的輔助力而作用。作㈣浸舰115本體的重^，係沿著浸錢線 =的長度方向略均勻施加，且在浸鍍線lb不會有局部的 Γ為輸送辅助力而作用，且如滾輪或輸送帶於辅助輸送的元件’並非對浸鐘線lb -邊物理接觸邊辅助輸达，因此，不會對浸麟lb施加摩擦抵抗， 57 201211309 而可有效率地且不給予負荷，輔助輸送。再者，利用作用於浸鍍線lb本體的重力g，可輔助輸送該浸鍍線lb本體的程度，係可使捲取張力調節機72側的捲取力微小設定，而可為簡單的構成。因此，於軟化退火工序中0.2%耐力值降低的浸鍍線 lb，係保持其0.2%耐力值低的狀態，而可在捲取機構上游側配置滾輪73A取得，且可確保均勻浸鍍厚度。因此，可獲得0.2%耐力值充份降低、期望品質的浸鍍線lb。更進一步，在捲取張力調節機72側捲取0.2%耐力值降低的浸鍍線lb時，可未給予浸鍍線lb負荷而捲取，因此，浸鍍線lb不會有破壞等，而可提升製品產率，且可提升製造效率。特別地，槽上方向轉換滾輪65較佳係配置於，相對熔融浸鍍銲錫槽62所貯存的熔融浸鍍銲錫液63之液面的高度約為3m的位置。藉由將槽上方向轉換滾輪65配置於相對熔融浸鍍銲錫液63之液面約3m的高度，從溶融浸鐘銲錫槽62到達槽上方向轉換滾輪65期間，可使浸鍍線lb只行走3m充份高度，因此，在這期間，可使浸鍍線lb之表面所附著的熔融浸鍍銲錫液63確實地凝固（固體化）。因此，浸鍍線lb藉由槽上方向轉換滾輪65方向轉換時，藉由浸鍍線lb與槽上方向轉換滾輪65接觸，不會引起浸鍍厚度的變動，而可確保均勻浸鍍厚度。 58 201211309 另一方面，槽上方向轉換滾輪65的配置高度例如係高於3m高度而配置時，浸鍍線lb不經意地在槽上方向轉換滾輪65不慎行走長距離，使得浸鐘線lb的負擔隨著行走而增加。更進一步，槽上方向轉換滾輪65的配置高度越高，則浸鍍線lb於方向轉換前的行走方向與方向轉換後的行走方向所成的角度越呈銳角，因此，進行方向轉換時，浸錢線lb相對槽上方向轉換滾輪65接觸的長度變長等，對浸鐘線1 b施加負荷，而變得不佳。因此，從確保浸鍍線lb之均勻浸鍍厚度的觀點，以及減輕於浸鍍線lb所施加的負擔的觀點，槽上方向轉換滾輪65的配置高度較佳設定為3m左右。又，熔融浸鍍銲錫槽62的内部配置有槽中方向轉換滾輪64，該槽中方向轉換滾輪64係主動轉動，以使浸鍍線lb的行走方向方向轉換至垂直上方，而積極地輔助輸送浸鍍線lb往下游側。藉由這樣的槽中方向轉換滾輪64,在槽中方向轉換滾輪64所產生的方向轉換後，可大幅減輕在朝向槽上方向轉換滾輪65而上升的浸鍍線lb所施加的負荷，且可抑制 0.2%耐力值的增加。接著，針對進行的浸鍍槽上滾輪配置高度驗證實驗作說明，以作為效果確認實驗。 (浸鍍槽上滾輪配置高度驗證實驗）本實驗係針對浸鍍線lb於捲取工序捲取後的0.2%耐力值的影響而進行驗證的實驗，係根據槽上方向轉換滾輪 59 201211309 65的配置高度相對熔融浸鍍銲錫槽62所貯存的銲錫液之液面之差異而進行。詳細而言，如圖14所示，作為本發明例的情況，係槽上方向轉換滾輪65 (以下稱之「頂部鏈輪65」）的配置高度相對熔融浸鍍銲錫槽62所貯存的熔融浸鍍銲錫液63 的液面，設定為3 m ( h 1 )，以及作為習知例的情況，係設定為lm (h2)，以驗證其與浸鍍線lb於捲取工序捲取後的0.2%耐力值的關係。又，圖14係顯示在本實驗所使用之裝置的一部分的概略圖，圖14中以二點鏈線表示的行走路徑係表示本發明例中浸鍍線lb的行走路徑，圖14中以一點鏈線表示的行走路徑係表示習知例中浸鐘線1 b的行走路徑。又，本發明例及習知例，其捲取機構上游側配置滾輪73A的配置高度，相對銲錫液之液面皆設定為0.9m ( Η )。表11所示的實驗條件之下，浸鍍線lb係對應剖面尺寸，分別使用剖面A及剖面B二種平角線而進行。又，剖面A及剖面B各別剖面的平角尺寸（縱X橫）分別為0.2x 1.0mm 及 0.16x2mm。 [表η] 實驗條件待鍍線（使用銅線）無氧銅、平角線（0.16x2.0mm) 加熱處理溫度 100°C 軟化退火溫度 850〇C 銲錫溫度 250〇C 線速 4m/min(浸鍵厚度20μιη的線速）捲取張力（tension) 1.5Ν 201211309 本實驗結果表示於表12及圖15。 [表 12] 銅線尺寸 (平角線尺寸）對應圖6 中的標記頂部鍵輪的高度3m (本發明例）頂部璉輪的高度lm (習知例） 0.2%耐力值 0.2%耐力值通過鏈輪前通過鏈輪後捲取後通過鏈輪前通過鏈輪後捲取後 Mpa Mpa Mpa Mpa Mpa Mpa 剖面 Α (0·2χ1·0) 〇 36 38 45 38 42 50 剖面 B (0.16x2.0) △ 39 39 44 39 39 47 若著注在平角尺寸為.剖面A時，習知例係頂部鏈輪65 的配置高度為lm，在通過頂部鏈輪65前後，0.2%耐力值從38MPa上升至42MPa，更在捲取工序捲取後，0.2%耐力值上升至50MPa。相對於此，本發明例係頂部鏈輪65的配置高度為 3m，在通過頂部鏈輪65前後，0.2%耐力值由36MPa上升至38MI>a，可抑制0.2%耐力值的上升，在捲取工序捲取後’ 0.2%耐力值上升至45MPa，可抑制0.2%耐力值的上升。因此，平角尺寸為剖面A時，相較習知例的頂部鏈輪 65的配置而度為lm的情況’可確認本發明例可格外抑制 0.2%耐力值的上升。接，，平角尺寸為剖面B時，習知例係頂部鏈輪65 的配置高度為1〇1，在通過頂部鏈輪前後，G.2%耐力值沒有變化H 39MPa，但在捲取工序捲取後，Q 2% 值上升至47MPa。相對於此本發明例係頂部鏈輪65的配置高度為 3m，於通過頂部鏈輪65前後.，◦以耐力值沒有變化，皆為39ΜΡ&，與f知例相同的值，但在捲取工序捲取後，〇.2% 61 201211309 而才力值上升至44MPa，可抑制0.2%对力值的上升。因此，平角尺寸為剖面B時，相較習知例的頂部鏈輪65的配置高度為lm的情況，可確認本發明例亦可在最後的捲取抑制0.2%对力值的上升。根據上述，本發明例的頂部鏈輪65的配置高度為3m 時，而相較習知例的頂部鏈輪65的配置高度為1 m的情況，可確認本發明例不使0.2%耐力值增加，大致為降低。又，根據鍍銲錫線的製造裝置10及製造方法，浸鍍機構61可利用薄浸鍍設定及厚浸鍍設定之任一的設定而進行，薄浸鍵設定係以薄浸鑛浸鍵待鐘線1 a，厚浸鐘設定係厚於薄浸鍍設定的浸鍍厚度而形成厚浸鍍厚度。在此，上述薄浸鍍設定係使待鍍線la的行走速度為低速行走速度時，.對待鍍線la施行浸鍍的設定。另一方面，上述厚浸鍍設定之特徵在於，係使待鍍線 la的行走速度為高於上述低速行走速度的高速行走速度時，對待鍍線la施行浸鍍的設定，且根據銲錫溫度及浸鍍厚的指定關係，以決定的浸鍍厚度，對待鍍線la施行浸鍍的設定。在此，銲錫溫度及浸鍍厚度的指定關係只在高速行走速度中成立，根據此關係，可選擇銲錫溫度所對應的浸鍍厚度。藉由上述鍍銲錫線lb的製造裝置10及製造方法，可獲得0.2%耐力值充份降低，期望品質的浸鍍線lb，藉由使這樣的浸鍍線lb安定而獲得，可提升產品產率，又可 62 201211309 提升製造效率。更進一步，可有效率地製造0.2%耐力值充份降低、期望品質的浸鐘線1 b，因此，可達到大量生產適合且低对力化的浸鍍線lb，以作為太陽能電池用導線。詳細而言，例如藉由捲取機構71或輸送絞盤91、92，調節浸鍍線lb的捲取速度等，於浸鍍工程中，藉由使待鍍線la以低速行走速度或高速行走速度任一線速行走，可對待鍍線la形成厚浸鍍厚度或薄浸鍍厚度。具體地，在設定低速行走速度時，係設定薄浸鍍厚度設定，可對待鍍線la形成薄浸鍍膜的浸鍍厚度。設定高速行走速度的情況，係設定厚浸鍍厚度設定，可對待鍍線la 形成厚浸鍍膜的浸鍍厚度。藉此，對應浸鍍線lb的使用目的、用途，可將浸鍍線1 b構成厚浸鍵設定，或薄浸鐘設定之任一的浸鑛厚度。特別係設定高速行走速度時，由於看出銲錫溫度及浸鍵厚度所表示的指定關係，因此，藉由此關係變更銲錫溫度，即使在厚浸鍵中，可進行更厚，或更薄的浸鐘厚度等厚度的細微調節。根據上述，對應線速或銲錫温度的設定，可獲得0.2% 耐力值充份降低、均勻且具有期望浸鍍厚度的浸鍍線lb，錯由使這樣南品質的浸鐘線lb安定而獲得，因此，可提升產品產率，又可提升製造效率。又，低速行走速度較佳係設定為約4m/min左右。依此，藉由低速行走速度設定為約4m/min左右，可 63 201211309 獲得例如約14.0 另*方面，右0 =4鄭m左右薄科厚度的浸鐘線心阿速·行走速度車父佳係設定為約 13m/min 左形：約=，=定為約一右，可击迷錢定^述低奸走速度，或高速朽速度，可使浸鏡厚度的程度大大相異，因此，可生摘⑼途、祕，且具有㈣綠厚度的浸顧線lb。又更進v，藉由在線速為高速行走速度且厚浸鍍設定之下^行浸I序，可使待鏡線la的表面形成厚浸鐘厚度彳一 &鍍序的銲錫溫度高時，相較薄浸鍍設定的情況’前者具巴容易產生浸鍍線lb表面的外觀粗糙的傾向。因此，藉由將浸鍍工序的銲錫溫度設定為約240〇C左右’可使汉鍵線lb之表面的浸鍍膜不會產生凹凸等，可獲得表Φ 均句浸麟度的浸鐘線lb。接著’作為致果確認實驗，針對銲錫工序之條件差異所產生的低耐力特性的確認試驗，作說明。 (鲜錫工序之條件差異所產生的低耐力特性的確認試驗）本實驗係使_錫溫度與浸鍍厚度，以及引張特性的關係明確’而碟認本實施態樣的製造方法的有效性，其中銲錫溫度作為薄浸鍍彀定及厚浸鍍設定的條件。薄浸鍍設定及厚浸鍍設定各設定銲錫溫度為240°C、 64 201211309 260°C、280°C三種，且銅線皆使用無氧銅、三種尺寸為 0.2mmxl.0mm、0.16mmx2.0mm、0.2mmx2.0mm 的平角線。薄浸鍍設定的情況係在低速行走速度之下，進行浸鍍工序，低速行走速度係線速為4m/min的低速設定。另一方面，厚浸鍍設定的情況係在高速行走速度之下，進行浸鐘工序，高速行走速度係線速為13m/min的低速設定。作為本實驗結果，在上述設定之下，薄浸鍍設定及厚浸鍍設定之條件的銲錫溫度、浸鍍厚度，以及引張特性的關係表示於表13 ( a)、（ b)。 [表 13] (a )線速：4/min (低速行走速度）：薄浸鐘設定尺寸 0.2 χ 1.0 0.16<2.0 0.2χ2.0 銲錫溫度 °c 240 260 280 240 260 280 240 260 280 成品厚度 mm 0.238- 0.240 0.234〜 0.238 0.238〜 0.240 0.203〜 0.207 0.199〜 0.200 0.191- 0.195 0.235〜 0.242 0.228〜 0.233 0.233- 0.235 成品寬度 mm 0.993 0.994 1.001 1.998 1.998 2.002 1.976 2 1.973 浸鍍厚度 μ 19.0 〜 20.0 17.0- 19.0 19.0 〜 20.0 21.5 〜 23.5 19.5 〜 20.0 ]5.5〜 17.5 17.5〜 21.0 14.0 〜 21.0 15.5 〜 17.5 0.2%耐力 MPa 43 45 44 43 44 42 43 42 40 外觀良良良良良良良良良60^5 47. 0 65. 0 67. 0 49. 0 44 51 50 52 Good 8 ※ 乂 ※ 850〇C ※The appearance is rough (granules are produced in the flat surface). Table 7 (a) shows the green plating line 1b. The 2% financial value and the value of the immersion thickness are three sizes X2. 〇mm, 0. 2mmx2. A 0mm flat-line (flatSquarewire) is used as the waiting line la, and immersion plating is formed for the three soldering temperatures of the to-be-stained line la 4m/mm 'four soldering temperatures of 240 ° C, 260 ° C, and 28 ° C. Line lb. On the other hand, when the line speed at which the to-be-plated line la is traveling is 13 m/min, as shown in Table 7 (b), the flat angle size and the temperature are set to ', and the dip key ib is mostly set. , 0. The 2% endurance value is a value of 50 or more, and the former is a higher value than the case where the line speed is 4 m/min. This is because the speed of the line to be lined la is set to be 'softened and annealed at a high speed, and the bell line la is passed through the softening annealing furnace 51 before being fully charged, resulting in an insufficiently low force. The state of the formation of the 褒线 line lb °, Table 7 (b) shows the value of the 褒褒 ❹ 四四四四四四四四四四四四四四四四四四四四四 ❹ ❹ ❹ ❹ ❹ ❹ ❹ ❹ ❹ ❹ ❹ ❹ ❹ ❹ ❹ ❹ ❹ ❹ ❹ ❹ ) The same set of T ' is used to generate the immersion plating line lb. In other words, when the line speed of the line to be plated la is simply set to a high speed, sufficient endurance is not achieved, and there is a problem that the speed of the line speed cannot be increased. On the other hand, in the above-described manufacturing apparatus 1A, a preheating furnace 51p is provided between the softening annealing furnace 201211309 51 and the ultrasonic water washing tank 41. Before the to-be-plated line la is supplied to the softening annealing furnace 51, the pre-heating furnace 51P can heat the bell line la to a high temperature in a short time, and the high-temperature-receiving line to be plated la can be supplied to the softening annealing furnace. 51. Therefore, by setting the line speed to the above-described idle running speed, even when the to-be-plated line la passes through the softening annealing furnace 51 at a high speed, it is possible to surely reduce the endurance of the line to be reduced la in the softening annealing step. Specifically, as described above, the preheating step is performed by providing the preheating furnace 51P, and even if the line speed is set to a high speed setting of 13 m/min, the line speed can be set to the same level as the generally set 4 m/min. 0 to be plated la 2% endurance value is reduced' Therefore, it can be obtained by good production efficiency. 2% low endurance, high quality dip line lb. Further, even if the to-be-plated line la is set to travel at a high speed of 13 m/min, the oxide layer on the surface of the line to be plated u can be surely reduced in the softening annealing furnace 51. As described above, the preheating furnace 51P provided in the vicinity of the upstream side of the softening annealing furnace 51 serves as a structure specializing in the heating performance of the money line 1a, and supplies nitrogen gas or steam gas to the inside thereof. A gas environment that is easy to handle. Therefore, 'the softening annealing furnace 51 as the mechanism for confirming the annealing time' is compared with, for example, only the softening annealing furnace 5: the county is shaped, and the front-end meeting area 51 is long by utilizing the existing (9) The problem of the increase in cost or cost, and the simple configuration of the additional design change, can correspond to Jin, and as another embodiment, 'heat treatment furnace 22 is not necessary 41 201211309 j ' as shown in Figure 9 (a), as The formation of the manufacturing apparatus of other embodiments may be such that the heating treatment furnace 22 is not provided in the row device 12 and the acid cleaning tank 31. The heating treatment furnace 22 is not limited to being disposed in the traveling direction. The "between the supply device 12 and the cleaning tank" may be provided on the upstream side of the softening annealing furnace 51, and may be provided at another portion. For example, the heating furnace 22 is not disposed on the upstream side of the pickling tank 31. The preheating furnace 51p is provided, and the steam gas is used as the reducing gas, and may be supplied to the inside of the preheating furnace 51p. According to this configuration, as described above, the preheating furnace 51p can have both functions, and the function of preheating is performed before the softening annealing furnace 5i, and the function of the heating processing furnace 22 is added. Therefore, it is needless to say that the reduction in equipment cost can be achieved, and the walking distance of the line to be plated la can be further shortened, and the immersion plating line lb having a low 、·2% endurance value and high quality can be produced. Further, as described above, the inside of the softening annealing furnace 51 serves as a reducing gas atmosphere, and as described above, the reducing gas enthalpy is not limited to a nitrogen gas or a mixed gas of a nitrogen gas and a hydrogen gas, and may contain other components. Further, it may be configured by a reducing gas other than a nitrogen gas or a hydrogen gas. Further, by arranging the cleaning mechanism on the upstream side of the softening annealing furnace 51 in the traveling direction, the line to be plated before the endurance is low by the softening annealing furnace 51 can be cleaned by the cleaning mechanism 30. Therefore, compared with the case where the line to be plated la which has been low in endurance by the softening annealing furnace 51 is cleaned by the cleaning mechanism 3, the former can reduce the load applied to the wire 1& 42 201211309 So you get 0. The 2% endurance value is sufficiently reduced, and the desired quality of the money immersion line 1b' is particularly suitable as a immersion plating line lb for use as a corduroy wire for a solar battery. According to this, in comparison with the case where the to-be-smelting line la彳j which has been low in endurance by the softening annealing furnace 51 is cleaned by the cleaning mechanism 3Q, the load applied to the to-be-bonded wire can be reduced, so In order to reduce the load of the wire to be plated h, it is not necessary to reduce the number of the set of the conveying winch, or the wire speed is not required. Therefore, in order to reduce the load applied to the line to be plated la, in terms of control, Further, in terms of condition setting, the countermeasure can be simplified, and therefore, the manufacturing efficiency of the immersion plating line 1b can be improved. Further, by having the cleaning mechanism % as described above, the impurities attached to the surface of the bonding wire 1 & are removed by the cleaning mechanism 3G, and by the dip clock mechanism 61 disposed on the downstream side thereof The surface of the mineral line U is treated as a self-reading thickness, and (4) the quality of the bribe wire U. Further, the plating treatment mechanism 2 is disposed on the upstream side of the softening annealing furnace 51 in the traveling direction. The heating processing furnace 2 having the heat treatment to be treated is disposed in the traveling direction by the heat treatment furnace 2'. On the upstream side, after the heat treatment furnace 22 is subjected to a twisting treatment process, the cleaning mechanism 30 is used to wash the to-be-plated line u. Here, the surface of the line to be plated la is adhered by the heat treatment furnace 22, and when the deposit is heated, the surface of the line to be plated la remains even if the deposit is a residue such as charred coal, and thereafter, Washed by the washing mechanism passed. , the residue is removed. Further, the acid cleaning tank 31 and the ultrasonic water washing tank 41 constitute the cleaning mechanism 30, and the heat treatment furnace 22, the acid cleaning tank 31, the ultrasonic water washing tank 41, and the softening and dewatering furnace 51 are used as the cleaning mechanism 30. The pre-plating treatment mechanism 2 is immersed and arranged in sequence along the traveling direction, whereby the to-be-mirror line 1 a which is not endurable by the softening annealing furnace 51 can be placed in the heat treatment furnace 22, the acid cleaning tank 31 and the super The series of processes performed by the sonic water washing tank 41 is completed. That is, as the immersion plating pretreatment mechanism 2, the heat treatment furnace 22 or the cleaning mechanism 3 is disposed on the upstream side of the softening annealing furnace 51, and the softening annealing furnace 51 makes the mine line la low. After the low-endurance of the to-be-plated line la, the immersion plating process is performed on the dip structure 61. Therefore, it is possible to avoid the application of a load to the immersion plating line 1b which has been low in endurance, and to obtain a good quality immersion clock line lb. In particular, by placing the acid cleaning tank 31 on the downstream side, the processing line 22 of the processing furnace 22 is used to twist the U to be plated, and the second: = state In the case where the cleaning tank 31 is acid-corrected, the former can be latticed = and the latter is good in acid cleaning effect. Further, as described above, the P tank 23 is cooled between the cleaning tanks 31 and the addition processing. The crucible 23 is cooled by the heat treatment furnace 22, and the to-be-plated line la is moved to the acid cleaning tank 31 by P. Accordingly, the cooling water tank 23 is cooled shortly after the heat treatment furnace 22, and the silly+long plating line to be plated la is made of P by the heat treatment furnace 22, and the surface is difficult to be **, *, The state of waiting for money, and maintaining the temperature in the temperature state and walking in the 'cleaning treatment furnace 22' with the acid cleaning tank 31 can prevent the mine line from being again prevented. Surface formation of oxygen 44 201211309 Chemical film ^ 'The cold water tank 23 does not cool the surface of the money line la heated by the heat treatment furnace κ to normal temperature, in the cooling water tank 2 = cooling, preferably the surface of Lin La The temperature is at least (4) in the 5f^a right 0 2 ' in the acid cleaning tank 31, the surface temperature can be at least %, and the plating line la is acid washed. Therefore, the hybrid cleaning solution K can be further washed. effect. According to this, the acid washing can be performed efficiently, and therefore, the pickling fruit can be surely obtained in the case where the line is to be walked at a high speed. According to the above-mentioned plated solder wire manufacturing apparatus 10 and the soldering wire, the width of the vertical section is 0. 8,. 〇 with the first has (10) / degree is G. G5~G. A flat-angle copper wire of a size in the range of 5 nm, and the vertical walking of the vertical material is set to about 4. The acid cleaning time of Gm/min' in the acid cleaning tank 31 is set to about seconds and the ultrasonic water is washed by the ultrasonic water washing tank 4; the time is set to about 13. 5 seconds, a good cleaning effect can be obtained. 1〇The above-mentioned to-be-plated line 1a is a flat angle copper matte Mb/ in the range of 0:m dry circumference, thickness 〇16~〇2inm, the walking speed of the above-mentioned waiting line la, and the acid cleaning tank In the case of the acidity of the 31st and the ultrasonic water washing tank 41, the ultrasonic cleaning time of the same one is the same as that of the H-washing, and the cleaning effect is confirmed as described later. A better cleaning effect can be obtained. 45 201211309 Next, the cleaning effect confirmation experiment will be described. (Washing effect confirmation experiment 1) The cleaning effect confirmation experiment 1 is an experiment for verifying the difference in the cleaning effect when the plating line la is subjected to the heat treatment step, the acid washing step, and the water washing step. As shown in Table 8, the dip plating line 1b was produced by the above-described manufacturing apparatus and manufacturing method, and was carried out under the two setting examples of the present invention example and the comparative example. [Table 8] Line speed ratio size (vertical X horizontal) mm Round line conversion (ΦΌ) Length line speed passage Μ Length effective length Line speed passage time length Effective length Line speed passage time mm cm m/min sec cm cm π/ Min sec cm cm m/min sec flat 0. 2χ2. 0 0. 72 230 4 34. 5 150 85 4 12. 8 115. 90 4__ 13. 5 Inventive Example 1 Angle 0. 1640 0. 66 〃 1! π η // // // // n η // Line 0-2χ1. 0 0. 52 〃 // n η η n // // η η 〃 0. 76 // 20 . 6. 9 η η 20 2. 6 η // 20 2. 7 Comparative example 5 Round wire 0. 65 〃〃 // η 〃 η η η 〃 η // 0. 53 // U π η " η η η // π 〃 The line speed of the comparative example of the present invention is set to one fifth. That is, as shown in Table 8, the present invention is one-fifth of the line speed of the conventional example, and the time period of each of the heat treatment furnace 22, the acid cleaning tank 31, and the ultrasonic water washing tank 41 is set to five times. Also, the comparative example uses a diameter of 0. 76mm, 0. 65mm, 0. The round wire of three sizes of 53 mm is used as the wire to be plated la. In contrast, the example of the present invention uses the longitudinal (thickness) and the transverse (width) of 0. 2mmx2_0mm, 0. 16mmx2. 0mm, 0. 2mmx 1. 0mm three-size flat line is used as the line to be plated la. Further, the cleaning effect confirmation test is a setting other than the shape of the to-be-plated line la and the line speed of the inventive example and the comparative example, and the other settings are the same. Here, the configuration of the cleaning device used in the present experiment is a heat treatment furnace 22 that performs a heat treatment step in 201211309, an acid cleaning tank 31 in an acid washing step, and ultrasonic cleaning in a water washing step. The grooves 41 are arranged in series, and the heat treatment furnace 22, the acid cleaning tank 31, and the ultrasonic water washing tank 41 are configured to have the respective sizes shown in FIG. Further, Fig. 10 is a schematic view showing the cleaning device used in the experiment and its peripheral portion. In the heat treatment furnace 22, steam is used as a detergent, and the effect of cleaning oil stains and the like can be particularly expected. An acid cleaning solution is used as the detergent in the acid cleaning tank 31, and the effect of washing the oxide or the like can be expected. In the ultrasonic water washing tank 41, water is used as a detergent, and in the acid washing step, the cleaning effect of the acid liquid or the like remaining on the surface of the plating line la can be particularly expected. Further, in the heat treatment step, since the inside of the heat treatment furnace 22 is used as a vapor atmosphere, the heat treatment furnace 22 can function as a steam engine. Therefore, in the heat treatment step, the effect of removing the adhering matter adhering to the surface of the clock line 1 a by heating is expected. Therefore, the heat treatment step is included in the test object as a part of the washing step. The evaluation of the cleaning effect confirmation experiment was performed by visually observing the surface state of the line to be plated la after the respective water washing steps and the surface state of the immersion plating line 1b after the winding process in the present invention example and the comparative example. The specified benchmark is generated and compared and identified. As a result of the above conditions, first, the surface state of the line to be plated la after the water washing step, when the line speed setting of the example of the present invention is different from the line speed setting of the comparative example, the line to be plated is completely unrecognizable. The surface of la is attached with 47 201211309 oil such as a large area such as a spot or a film, or a dust or the like in a discrete or spotted manner, and it can be confirmed that the surface of the line to be mirrored can be cleaned. Further, 'the visual dipping line 1 b is confirmed based on the specified reference d generated by the surface immersion state after the last winding step, and the line speed setting of the example of the present invention is different from the line speed setting of the comparative example. 'The unevenness of the surface was not recognized, and it was confirmed that the thickness of the immersion plating line in the longitudinal direction and the outer peripheral direction was uniform. Further, regarding the line speed, the relative setting is set to 20 m/niin, and the example of the present invention is set to one fifth of the speed setting of the comparative example, that is, the speed is 4 m/min, and a sufficient washing effect can be obtained. Therefore, it is expected to obtain a better cleaning effect, and it is conceivable to set the line speed to a low speed of less than 4 m/min. However, the low speed 5 below the line speed of 4m / min, try the same experiment, but can not get the effect of the cleaning effect of 4m / min speed setting, obviously does not seem to set the line speed to lower speed The more the cleaning effect can be improved. Further, when the line speed of the to-be-plated line la is set to a low speed of less than 4 m/min, the passage time of the line to be plated la to pass through each step becomes long, and thus the productivity is lowered. According to this, from the viewpoint of the cleaning effect obtained by the washing step and the production efficiency, it is possible to obtain a result that the linear velocity is preferably set to about 4 m/mm under the above experimental conditions. (Washing effect confirmation test 2) The cleaning effect confirmation test 2 is an experiment for verifying the difference in the washing effect when the pickling line 1a is subjected to the pickling step and the water washing step, 48 201211309 by the above-mentioned manufacturing When the device 10 and the manufacturing method are used to manufacture the immersion plating line 1b, it is performed under the two setting examples of the present invention example and the comparative example. In the comparative example, the heat treatment is not performed, and the washing step is performed in the order of the acid washing step and the water washing step. In contrast, in the present invention, the heat treatment step is performed before the acid washing step, and then the pickling step is performed. The cleaning process is performed in the order of the net process and the water washing process. The evaluation of the cleaning effect confirmation experiment is carried out according to the surface state of the to-be-plated line la after the respective water washing steps and the surface state of the dip plating line 1b after the winding process according to the present invention example and the comparative example. Specify the benchmark, and compare and confirm. Under the setting of the comparative example, the line to be plated 1 a after the cleaning step was identified, and the acidified layer remained on the surface. Further, the immersion plating state of the surface of the immersion bell line lb was recognized, and it was confirmed that the surface of the immersion plating line lb was thick. On the other hand, in the setting of the example of the present invention, the waiting line after the cleaning process was confirmed, and the oil stain on the surface was not recognized, and the oxide layer was not left. Further, the state of the immersion plating on the surface of the immersion plating line was confirmed, and the surface was not uneven, and it was confirmed that the uniform immersion plating thickness was formed. According to the above, when the heat treatment step is performed before the acid washing step, and the acid-washing step is performed on the line to be plated at normal temperature, it can be confirmed that the acid cleaning effect can be particularly enhanced by the example of the present invention, and a good acid can be obtained. Washing effect. The manufacturing apparatus 10 and the method of manufacturing the plating solder wire of the above-described plating solder wire are not limited to the above-described configuration and manufacturing method, and can be configured by various configurations and manufacturing methods. As another embodiment, it is not necessary to provide the cooling water tank 23 between the heat treatment 49 201211309 and the acid cleaning tank 31. For example, the non-cold portion water tank 23 may not be disposed in the heat treatment furnace. Between 31. When the cold water tank 23 is placed again, the surface of the cold treatment tank 22 is heated by the heat treatment furnace 22. The surface temperature can be maintained at a high temperature and travels to the acid cleaning tank 31 to make the cake more silky. 4 f made = according to the welding device of the soldering wire manufacturing device, the welding method of the solder wire is continued, the pig is transported by the winch 91 '92, and the take-up mechanism of the take-up mechanism 71 is taken 'by this' because of the winding mechanismΜ The coiling force applied to the == △ & can be dispersed relative to the conveying winches 91, 92 on the upstream side and the downstream side of the =, thereby reducing the need for the coiling line la to be taken up by the winding mechanism 7 The applied load. In this way, the Q 2% endurance value of the immersion plating line lb can be sufficiently reduced, and the elongation rate can be obtained, and a money immersion line of a desired quality can be obtained. The apparatus for manufacturing a plated solder wire 1〇, by heating the annealing softening annealing furnace ΤΙ to the upstream side of the softening annealing furnace, can assist the rotation of the line to be plated la before the low endurance in the furnace 51. The plating line is pulled, for example, by the active rotating conveying winch to assist in conveying the negative T to be applied, and the tensile tension is applied to the to-be-plated line la having low endurance, and the quality of the immersion plating line 1]3 is maintained. On top, it can be surely assisted in transport. The structure 30 is different from the second conveyor winch % in the traveling direction in the washing machine furnace 51, the downstream side, and the upstream side of the softening annealing furnace 51, and can soften the annealing to make the chain and the line la low endurance*, Auxiliary transport waiting for the clock line will not be burdened by the plating line la, and can efficiently assist the soft-returning 50 201211309 a (dip plating line lb) line furnace 51, conveying the low-endurance to be plated line j go 0 again Among the direction changing rollers for changing the traveling direction of the dip plating line lb, the groove direction changing roller 64" disposed inside the molten dip solder bath 62 is the same as the wheel: the winch 91, 92, and the wire is immersed in the solder bath (4) of (4) 62 is driven by a motor to actively rotate the roller to serve as a conveying winch for assisting the conveyance of the dip plating line lb. * By using the radiation direction changing roller 64 as a conveying winch, the rotation direction of the immersion line u is rotated when the traveling direction of the immersion line u is changed before and after the immersion plating line ib Tong Cong fusion immersion plating job 62 Speed and active Korean movement, 闵4 and %U's twirling purpose, in addition to the direction of the direction of the direction of the transfer roller 6 plating line lb, can also assist the walking of the money line ^. Therefore, by the direction change roller 64 in the groove, it is in contact with the dip key lb, and the frictional resistance in the moving direction is produced. The raw load is not applied to the money immersion line lb, and the immersion plating line lb can be smoothly sent out. Detailed (four) 'converted walking side (four), will (four) apply load on the dip clock L line::. = The conversion of the direction of the line lb will become especially the responsibility of this -f. . The cause of the increase in endurance value. When the money ray ib is taken out from the (four) which is immersed in the molten susceptor 63, the immersion plating tank 62 performs such a change in the traveling direction. Walking factor: When immersed in the state of immersion in the molten immersion clock soldering liquid 63, the bearing is subjected to the resistance from the immersed immersion solder paste 63 = sexual resistance. Therefore, the load is increased when the running direction is changed, and the increase in the endurance value is changed. Obviously. Therefore, as described above, by forming the groove direction changing roller 64 as a conveying winch, even if the dip plating line 1b is immersed in the molten immersion soldering liquid 63, the direction is switched, and it is possible to suppress as much as possible. The load applied to the immersion plating line lb can be manufactured. 2% immersion plating line lb with low endurance value. Next, a tension verification test for verifying the tension applied before the immersion plating line 1b was taken as an effect confirmation experiment. (Tensile verification experiment) The tension verification experiment is based on the degree of relaxation of the immersion plating line lb. The influence of the 2% proof value is verified, and the tension applied to the immersion clock line 1 b is between the immersion plating line lb from the groove up direction switching roller 65 to the winding mechanism 71 (the winding side upstream side arrangement roller 73A). The degree of application, the degree of relaxation of the dip clock line 1 b was verified. Before the immersion plating line 1b reaches the upstream side roller 73A of the winding mechanism, the degree of application of the tension applied to the immersion plating line 1b is difficult to be quantified, and therefore, the degree of application of the tension is the conveying winch 91, 92 which affects the degree of application of the tension. The number of the set, and the inner shaft of the molten dip solder bath 62 (the direction change roller 64 in the groove) is parameterized by passive rotation or active rotation, corresponding to the setting of these parameters, and verified by 0. 2% endurance characteristics. Specifically, as shown in Table 9, before the immersion plating line 1b reaches the upstream side arrangement roller 73A of the winding mechanism, the degree of tension applied to the immersion plating line 1b is set to the four stages of the first tension setting to the fourth tension setting. . [Table 9] 52 201211309 Tension setting number of first, second, fourth and fourth conveying winches 1 1 2 2 In the groove, the direction changing roller follows the rotating roller to drive the rotating roller, and the rotating roller drives the rotating roller in the first tension setting. The number of the conveying winches is only one of the first conveying winches 91, and the setting of the direction changing roller 64 in the groove is formed by the following rotating rollers. Further, the follower rotating roller is a motor that does not have a drive roller, and is a roller that is freely rotatable. The first tension setting is the strongest in the fourth stage, and the immersion plating line lb is in a state of being stretched and stretched. In the second tension setting, the number of the conveying winches is only one of the first conveying winches 91, and the setting of the direction changing roller 64 in the groove is formed by driving the rotating rollers. Further, the driving rotary roller is a roller that can be actively rotated by a motor or the like. The second tension setting is a state in which the tension is slightly weaker relative to the first tension. In the third tension setting, the number of the conveying winches is two, that is, the first conveying winch 91 and the second conveying winch 92, and the setting of the direction changing roller 64 in the groove is formed by the following rotating roller, and the tension is set with respect to the second tension. It is a weaker state. In the fourth tension setting, the number of the delivery winches is two for the first conveying winch 91 and the second conveying winch 92, and the setting of the direction changing roller 64 is formed by driving the rotating roller, and the tension is set relatively with respect to the third tension. It is weak and is the weakest in the four stages, and the immersion plating line lb is in the most relaxed state. The load characteristics of the immersion plating line lb, including 0. The 2% endurance characteristic, etc., in the case of the respective settings of the first tension setting to the fourth tension setting, are as shown in Tables 10 and 11 of 201220121309. [Table 10] Copper wire specifications Tensile characteristics Tension setting Item Unit First Second Third Fourth angled line (0. 16x2. 0mm ), OFC 0. 2% endurance MPa 54 53 52 51 flat angle line (0. 2x1. 0mm), OFC 0. 2% stamina MPa 54 52 50 50 Also, for the bell line la are oxygen-free copper, the size is 0. 16mm x2. 0mm, 0. 2mmxl. 0mm two kinds of flat angle lines. From the knots in Table 10 and Figure 4, in either case of the two sizes of the to-be-plated line la, the number of the setting of the conveying winch is two more than one. 2% endurance value is slightly lower. Therefore, it can be confirmed that the number of the setting of the conveying winch is two more effective than one. Moreover, when the number of the setting of the conveying winch is two, that is, the fourth tension setting and the third tension setting, as shown in Fig. 11 (b), the to-be-plated line is 0. 2mmxl. In the case of a 0 mm-sized flat-angle line, the in-slot direction-changing roller 64 is rotated regardless of whether it is a driving rotating roller or a follow-up rotating roller. The 2% endurance values are all the same value. On the other hand, in all of the other settings, the comparison is made by driving the rotating roller to form the in-slot direction changing roller 64, and in the case of the following rotating roller forming the groove-in-direction switching roller 64, the former is 0. The 2% endurance value is a lower value. Thus, the case of driving the rotating roller to form the direction changing roller 64 in the groove is compared, and the direction changing roller 64 is formed in the groove by the following rotating roller, and the former is clearly displayed. The 2% endurance value tends to be low, and it is confirmed that the driving roller is used to form the groove in the direction changing roller 64. In particular, from the results of Table 10 and FIG. 11, the first tension is set to the fourth sheet 54 201211309, and the fourth tension is set, that is, the dip plating line lb reaches the winding mechanism 71 (the upstream side of the winding mechanism is disposed). Before the roller 73A), when the immersion plating line 1b is wound in the state where the immersion plating line lb is most slack, the load of the immersion plating line 1b can be reduced, and 〇·2〇/0 can be confirmed, and the force value is particularly lowered. Further, at least one of the two conveying winches is arranged, and any one of the components for driving the rotating roller to form the in-slot direction changing roller 64 is provided for assisting the winding of the to-be-plated line la (the lining lb). The bell lb reaches the winding mechanism 71 (the upstream side of the winding mechanism is equipped with the immersion to be in a loose state), and is available. The immersion clock line lb± which is lower than the specified value and of good quality can be confirmed to be effective. The manufacturing apparatus 10 for solder plating and the method of manufacturing a solder wire are not limited to the above-described configuration and manufacturing method, and can be configured by various configurations and manufacturing methods. For example, the first conveying winch winch 92 is not limited; $ is disposed at the above-mentioned configuration position, and may be disposed at any position in the traveling direction, and the 'conveying winch may have only one of the first conveying winch 91 and the second losing ten disk 92. Specifically, the second conveying is configured, for example, as shown in FIG. 2 by the winch 92. (4) The t-step may also have a plurality of the first conveying winch and the second rotating tray 2, and are disposed at appropriate positions. Round winch. Further advance - The step ' is not limited to the in-slot direction changing roller 64 as described above, and the driving roller is driven to rotate actively, or the groove-up switching roller 65 is configured to drive the rotating roller to actively rotate. 3 55 201211309 Moreover, the soldering wire As described above, the winding mechanism 71 is provided with the winding mechanism upstream side arrangement roller 73A. The groove up direction switching roller 65 provided above the molten dip solder bath 62 is characterized in that it is disposed higher than The position of the roller 73A is disposed on the upstream side of the winding mechanism. In other words, the method of manufacturing the soldering wire is characterized in that the immersion clock line 1b is changed in direction by the groove direction switching roller 65, and then travels to the winding mechanism. 71—the side, and the roller 73A is disposed on the upstream side of the winding mechanism disposed at a lower position than the lower position of the groove-up direction switching roller 65, so that the dip-plating line starts to be placed on the winding mechanism 71. The manufacturing apparatus 10 and the manufacturing method can obtain 0. The 2% endurance value is sufficiently lowered, and the desired quality immersion plating line lb is obtained by setting such a immersion plating line lb, which can improve product yield and improve manufacturing efficiency. Further, it can be efficiently manufactured. The 2% endurance value is sufficiently reduced, and the quality of the immersion plating line lb is desired. Therefore, a large-scale production of a suitable and low-endurance immersion plating line lb can be achieved as a wire for a solar cell. As described in detail, for example, as shown in FIG. 16(a), the conventional configuration is such that the groove upward direction switching roller 65 is disposed at a slightly higher height than the upstream side arrangement roller 73A of the winding mechanism, as shown in FIG. 16(a). As shown in the enlarged view of the X portion, the gravity g acting on the dip plating line lb acts only in a direction slightly perpendicular to the traveling direction. Further, as shown in Fig. 16 (b), it is conventional that the groove upper direction changing roller 65 is disposed lower than the height of the roller 73A on the upstream side of the winding mechanism. 201211309; ^==6 (b) As shown in the enlarged view of part X, the component acting on the direction opposite to the traveling direction of the dip-plating line 2 and the dip clock line 1' acts on the immersion clock line ib. In any of the above cases, in the immersion plating line ib roller 73A, the immersion plating line 1b is easily subjected to the load generated by the machine 72g/l, and the roll which must be set to increase the winding tension == The necessity of taking force' arises from the problem that the dip line ib becomes larger. The position of the 'slot-up direction change roller 65 is higher than the position height of the roll arrangement configuration (four) relative height _ As shown in FIG. 13, after the dip line 1b is melted and immersed in the solder bath 62, the immersion clock line ib of the direction change by the groove direction switching roller 65 is moved to make the immersion plating line 15 travel to the winding. The upstream side arrangement roller 7 of the mechanism advances and descends toward the downstream side in the traveling direction from the period. By setting the dip line lb to such a state, as shown in FIG. During the arrangement of the rollers 73 on the upstream side of the winding mechanism, the gravity g acting on the dip-plating line 1b = the traveling direction component g2 of the money line 1b can be used as an auxiliary roller 107A toward the upstream side of the winding mechanism, and assists in conveying the dip_lb The force acts. (4) The weight of the body of the immersion ship 115, along the money line = The degree of direction is applied evenly, and there is no local enthalpy in the immersion plating line lb for the auxiliary force of the conveying, and the element such as the roller or the conveyor belt for auxiliary conveying is not assisted by the physical contact of the immersion clock line lb-side. Therefore, it will not apply frictional resistance to the lining lb, 57 201211309, and can effectively and without load, assist the transportation. Furthermore, the gravity g acting on the body of the immersion plating line lb can assist in conveying the immersion plating. The degree of the body of the wire lb is such that the winding force on the side of the take-up tension adjusting machine 72 can be set minutely, and can be a simple configuration. Therefore, in the softening annealing process, 0. The immersion plating line lb with a 2% proof endurance value is maintained at 0. The 2% endurance value is low, and it can be obtained by arranging the roller 73A on the upstream side of the winding mechanism, and the uniform immersion plating thickness can be ensured. Therefore, 0 is obtained. The 2% endurance value is sufficiently reduced, and the desired quality of the dip plating line lb. Further, the winding tension adjuster 72 side is wound up to 0. 2% endurance value When the immersion plating line lb is lowered, the immersion plating line lb load can be not taken up, so that the immersion plating line lb is not damaged, and the product yield can be improved, and the manufacturing efficiency can be improved. In particular, the groove upward direction switching roller 65 is preferably disposed at a position where the liquid level of the molten immersion solder liquid 63 stored in the molten immersion solder bath 62 is about 3 m. By arranging the groove up direction change roller 65 at a height of about 3 m with respect to the liquid surface of the molten immersion solder liquid 63, the immersion plating line lb can be walked only while the molten immersion bell solder bath 62 reaches the groove up direction change roller 65. Since the height is 3 m, the molten immersion solder liquid 63 adhering to the surface of the immersion plating line lb can be surely solidified (solidified). Therefore, when the dip plating line 1b is switched in the direction of the groove direction changing roller 65, the dip plating line 1b is brought into contact with the groove up direction switching roller 65, so that the variation of the thickness of the immersion plating is not caused, and the uniform immersion plating thickness can be ensured. 58 201211309 On the other hand, when the arrangement height of the groove-on-direction changing roller 65 is, for example, higher than the height of 3 m, the dip plating line lb inadvertently walks the long distance in the groove direction switching roller 65, so that the immersion clock line lb The burden increases with walking. Further, the higher the arrangement height of the groove-up direction changing roller 65, the sharper the angle between the running direction of the dip-plating line 1b before the direction change and the direction of the direction after the direction change, and therefore, when the direction is changed, the dipping is performed. The length of contact of the money line 1b with respect to the groove up direction switching roller 65 becomes long, and the load is applied to the immersion clock line 1b, which is unsatisfactory. Therefore, from the viewpoint of ensuring the uniform immersion plating thickness of the immersion plating line lb and the reduction of the load applied to the immersion plating line 1b, the arrangement height of the groove up direction switching roller 65 is preferably set to about 3 m. Further, a groove middle direction changing roller 64 is disposed inside the molten dip solder bath 62, and the direction changing roller 64 is actively rotated to shift the traveling direction of the dip plating line 1b to the vertical direction, and actively assists the conveyance. The immersion plating line lb is on the downstream side. With such a groove direction direction changing roller 64, after the direction change by the direction changing roller 64 in the groove, the load applied to the dip plating line 1b which is raised toward the groove upward direction switching roller 65 can be greatly reduced, and Suppress 0. 2% increase in endurance value. Next, a height verification experiment was performed on the roller on the immersion plating tank to be used as an effect confirmation experiment. (High-validation test of the roller arrangement on the immersion plating tank) This experiment is for the immersion plating line lb after the coiling process is taken up. The test for verifying the influence of the 2% proof value was carried out based on the difference in the arrangement height of the groove-on-direction change roller 59 201211309 65 with respect to the liquid level of the solder liquid stored in the melt-dip solder bath 62. Specifically, as shown in Fig. 14, in the case of the present invention, the arrangement height of the groove up direction changing roller 65 (hereinafter referred to as "top sprocket 65") is relative to the molten immersion stored in the molten immersion solder tank 62. The liquid level of the plating solder liquid 63 is set to 3 m (h 1 ), and as a conventional example, it is set to lm (h2) to verify that it is 0 after the coiling line lb is taken up in the winding process. . 2% endurance value relationship. Further, Fig. 14 is a schematic view showing a part of the apparatus used in the present experiment, and the traveling path indicated by the two-dot chain line in Fig. 14 indicates the traveling path of the dip plating line lb in the example of the present invention, and a point in Fig. 14 The walking path indicated by the chain line indicates the traveling path of the immersion clock line 1 b in the conventional example. Further, in the present invention and the conventional example, the arrangement height of the upstream side arrangement roller 73A of the winding mechanism is set to 0 with respect to the liquid level of the solder liquid. 9m ( Η ). Under the experimental conditions shown in Table 11, the immersion plating line lb corresponds to the cross-sectional dimension, and is carried out using two kinds of rectangular lines of the cross-section A and the cross-section B, respectively. Further, the flat angle dimensions (vertical X horizontal) of the respective sections of the section A and the section B are respectively 0. 2x 1. 0mm and 0. 16x2mm. [Table η] Experimental conditions To be plated (using copper wire) Oxygen-free copper, flat line (0. 16x2. 0mm) Heat treatment temperature 100°C Softening annealing temperature 850〇C Soldering temperature 250〇C Line speed 4m/min (wire speed of dip key thickness 20μιη) Winding tension (tension) 1. 5Ν 201211309 The results of this experiment are shown in Table 12 and Figure 15. [Table 12] Copper wire size (square wire size) Corresponds to the mark in Fig. 6 The height of the top key wheel is 3 m (Inventive example) The height of the top wheel lm (conventional example) 0. 2% stamina value 0. 2% endurance value is taken through the sprocket before passing through the sprocket and then passed through the sprocket before passing through the sprocket. Mpa Mpa Mpa Mpa Mpa Mpa Profile Α (0·2χ1·0) 〇36 38 45 38 42 50 Section B (0. 16x2. 0) △ 39 39 44 39 39 47 If the note is in the flat angle size. In the case of the section A, the conventional example of the top sprocket 65 is arranged at a height of lm, before and after passing the top sprocket 65, 0. 2% endurance value increased from 38MPa to 42MPa, even after coiling in the coiling process, 0. The 2% endurance value increased to 50 MPa. On the other hand, in the example of the present invention, the top sprocket 65 is disposed at a height of 3 m, before and after passing through the top sprocket 65, 0. The 2% endurance value increases from 36 MPa to 38 MI>a, which can suppress 0. The 2% endurance value rises after the coiling process is taken up. The 2% endurance value rises to 45 MPa, which can suppress 0. 2% endurance value increased. Therefore, when the rectangular angle dimension is the cross-sectional profile A, the degree of the lm is higher than the arrangement of the top sprocket 65 of the conventional example, it can be confirmed that the present invention can be exceptionally suppressed. 2% increase in endurance value. When the angle of the flat angle is the section B, the height of the configuration of the top sprocket 65 of the conventional example is 1〇1, before and after passing the top sprocket, G. The 2% endurance value did not change H 39 MPa, but after the coiling process was taken up, the Q 2% value rose to 47 MPa. In contrast, the top sprocket 65 of the present invention has a height of 3 m, which is before and after passing through the top sprocket 65. , ◦ ◦ ◦ ◦ ◦ ◦ ◦ ◦ ◦ ◦ ◦ ◦ ◦ ◦ ◦ ◦ ◦ ◦ ◦ ◦ ◦ ◦ ◦ ◦ ◦ ◦ ◦ ◦ ◦ ◦ ◦ ◦ ◦ ◦ ◦. 2% 61 201211309 The talent value rises to 44MPa, which can suppress 0. 2% of the increase in the force value. Therefore, when the flat angle dimension is the cross section B, the height of the arrangement of the top sprocket 65 of the conventional example is lm, and it can be confirmed that the example of the present invention can also be suppressed at the last winding. 2% of the increase in the force value. According to the above, when the arrangement height of the top sprocket 65 of the present invention is 3 m, and the arrangement height of the top sprocket 65 of the conventional example is 1 m, it can be confirmed that the present invention does not make 0. The 2% endurance value increases and is roughly reduced. Further, according to the apparatus 4 and the manufacturing method of the plated solder wire, the dip plating mechanism 61 can be performed by any setting of the thin immersion plating setting and the thick immersion plating setting, and the thin immersion key setting is performed by the thin immersion immersion key. Line 1 a, thick immersion clock setting is thicker than the immersion plating thickness set by thin immersion plating to form a thick immersion plating thickness. Here, the thin immersion plating setting is such that the traveling speed of the line to be plated la is a low speed walking speed. The plating line la is subjected to the immersion plating setting. On the other hand, the thick immersion plating is characterized in that, when the traveling speed of the line to be plated la is a high-speed traveling speed higher than the low-speed traveling speed, the plating line 1 is subjected to immersion plating, and according to the solder temperature and The specified relationship of the immersion plating thickness is determined by the immersion plating thickness of the plating line la. Here, the specified relationship between the solder temperature and the immersion plating thickness is established only in the high-speed traveling speed, and depending on the relationship, the immersion plating thickness corresponding to the solder temperature can be selected. By the above-described manufacturing apparatus 10 and the manufacturing method of the soldering wire lb, 0. The 2% endurance value is sufficiently reduced, and the desired quality immersion plating line lb is obtained by making such a immersion plating line lb stable, which can improve the product yield, and can improve the manufacturing efficiency by 62 201211309. Further, it can be efficiently manufactured. The 2% endurance value is sufficiently reduced, and the quality of the immersion clock line 1b is desired, so that a large-scale production of a suitable and low-force immersion plating line lb can be achieved as a wire for solar cells. Specifically, for example, by the winding mechanism 71 or the conveying winches 91, 92, the winding speed of the immersion plating line 1b is adjusted, etc., in the immersion plating process, by making the line to be plated la at a low speed or a high speed traveling speed For any line speed walking, the plating line la may be formed to have a thick immersion plating thickness or a thin immersion plating thickness. Specifically, when the low-speed traveling speed is set, the thin immersion plating thickness setting is set, and the immersion plating thickness of the thin immersion plating film can be formed by the plating line la. When the high-speed travel speed is set, the thickness of the thick immersion plating is set, and the thickness of the immersion plating of the thick immersion coating can be formed. Accordingly, the dip plating line 1 b can be used to set the thickness of the immersion plating line 1 b or the thickness of the immersion time set by any of the thin immersion clocks. In particular, when the high-speed traveling speed is set, the specified relationship between the solder temperature and the thickness of the immersion key is seen. Therefore, by changing the solder temperature by this relationship, thicker or thinner immersion can be performed even in the thick immersion key. Fine adjustment of thickness such as thickness of the clock. According to the above, corresponding to the setting of the line speed or the solder temperature, 0. The 2% endurance value is sufficiently reduced, uniform, and has a desired immersion plating line lb. The erroneous plating line lb is obtained by stabilizing such a south quality immersion clock line lb, thereby improving product yield and improving manufacturing efficiency. Further, the low speed traveling speed is preferably set to about 4 m/min. Accordingly, by setting the low speed walking speed to about 4 m/min, for example, 63 201211309, for example, about 14. 0 other *, right 0 = 4 Zheng m or so thin thickness of the dip clock line A speed · walking speed car father set is about 13m / min left shape: about =, = set to about one right, can be hit The amount of immersion mirror thickness can be greatly different, so it can be picked (9), secret, and has a (four) green thickness of the immersion line lb. Further, v, by the line speed is the high-speed walking speed and the thick immersion plating is set under the immersion I sequence, the surface of the line to be mirrored la can be formed into a thickness of the thickness of the bell. When the soldering temperature of the plating sequence is high In contrast to the case of thin immersion plating, the former has a tendency to have a rough appearance on the surface of the immersion plating line lb. Therefore, by setting the soldering temperature of the immersion plating process to about 240 〇C or so, the immersion plating film on the surface of the slab lb can be free from unevenness and the like, and the immersion bell line lb of the table Φ uniform immersion can be obtained. . Next, as a result of confirming the fruit, a confirmation test for the low endurance characteristic caused by the difference in the conditions of the soldering process will be described. (Confirmation test of low endurance characteristics caused by differences in conditions of the fresh tin process) This experiment is to clarify the relationship between the _ tin temperature and the immersion plating thickness and the tensile characteristics, and to confirm the effectiveness of the manufacturing method of the present embodiment. The solder temperature is set as a condition for thin immersion plating and thick immersion plating. The thinning immersion plating setting and the thick immersion plating setting each set the soldering temperature to 240 ° C, 64 201211309 260 ° C, 280 ° C three, and the copper wire is made of oxygen-free copper, three sizes are 0. 2mmxl. 0mm, 0. 16mmx2. 0mm, 0. 2mmx2. 0mm flat line. In the case of thin immersion plating, the immersion plating process is performed at a low speed traveling speed, and the low speed traveling speed is a low speed setting of a line speed of 4 m/min. On the other hand, in the case of thick immersion plating, the immersion clock step is performed under the high-speed traveling speed, and the high-speed traveling speed is set at a low speed of 13 m/min. As a result of the experiment, the relationship between the solder temperature, the immersion thickness, and the tensile characteristics of the conditions of the thin immersion plating setting and the immersion plating setting under the above setting is shown in Tables 13 (a) and (b). [Table 13] (a) Line speed: 4/min (low speed walking speed): Thin immersion clock setting Size 0. 2 χ 1. 0 0. 16 <2.0 0.2χ2.0 Soldering temperature °c 240 260 280 240 260 280 240 260 280 Finished product thickness mm 0.238- 0.240 0.234~ 0.238 0.238~ 0.240 0.203~ 0.207 0.199~ 0.200 0.191- 0.195 0.235~ 0.242 0.228~ 0.233 0.233- 0.235 Finished product width mm 0.993 0.994 1.001 1.998 1.998 2.002 1.976 2 1.973 Dip plating thickness μ 19.0 ~ 20.0 17.0- 19.0 19.0 ~ 20.0 21.5 ~ 23.5 19.5 ~ 20.0 ] 5.5~ 17.5 17.5 ~ 21.0 14.0 ~ 21.0 15.5 ~ 17.5 0.2% endurance MPa 43 45 44 43 44 42 43 42 40 Appearance, good, good, good, good

其他條件：退火（anneal)溫度100°C還原爐850°C (b)線速：13/min (高速行走速度）：厚浸鍍設定尺寸 0.2xl.0 0.16x2.0 0.2χ2.0 '銲錫溫度 °c 240 260 280 240 260 280 240 260 280 成品厚度 mm 0.263〜 0.276 0.257〜 0.266 0·259〜 0.264 0.255〜 0.307 0.243〜 0.281 0.248〜 0.254 0.275〜 0.33 0.284〜 0.334 0.285〜 0.298 成品寬度 mm 1.003 1.004 0.998 2.001 2.022 2.009 1.965 1.966 1.982 浸鍍厚度 μ 31·5〜 38.0 28.5〜 33.0 29.5〜 32.0 47.5 〜 73.5 41.5 〜 60.5 44.0 〜 47.0 37.5 〜 65.0 42.0 〜 67.0 42.5 〜 49.0 0.2%耐力 MPa 49 50 50 52 52 44 51 50 52 外觀良良良良八※ 乂※ 良八※ 其他條件：退火（anneal)溫度100°C還原爐850°C ※外觀粗糙（平角平面部產生顆粒）又，表13 (a)係表示在薄浸鍍設定之下銲錫溫度與浸鍍厚度，以及引張特性的關係，而表13 (b)係表示在厚浸鍍設定之下，銲錫溫度、浸鍍厚度，以及引張特性的 65 201211309 關係。在線速設定為4m/min的低速行走速度之下，進行浸鍍工序的情況，以及在線速設定為13m/min的高速行走速度之下，進行浸鍍工序的情況，係分別對應每一平角尺寸、溫度的條件，針對浸鐘厚度作比較。其結果，可確認相較高速行走速度的情況，低速行走速度的情況皆為較薄的浸鍵厚度，而可對待鐘線1 a形成浸鍍膜。若著注在薄浸鑛設定之情況的結果5二種平角尺寸或溫度設定不會被影響，而係如上所述，可使浸鍍厚度變薄，又，相較厚浸鍵設定的情況，可使0.2%对力值變低。且，在三種平角尺寸或溫度設定之組合的任一情況，可確認浸鍍膜的表面外觀皆不會產生粗糙，而可獲得高品質的浸鍍線lb。另一方面，若著注在厚浸鍍設定之情況的結果，三種平角尺寸或溫度設定不會被影響，而可使0.2%耐力值變低，皆為50Mpa左右的值。關於厚浸鐘設定的浸鐘厚度，例如尺寸為〇.2mmx 1.0mm的平角線，銲錫溫度為280 °C時，浸鐘厚度為 29.5〜32.0//m。另一方面，銲錫溫度為240°C時，浸鐘厚度為 31.5-38.0 m。更進一步，尺寸為0.16mmx2.0mm的平角線、銲錫溫度為280°C時，浸鍍厚度為44.0〜47.0/zm。另一方面，銲錫溫度為240°〇.時，浸鍍厚度為47.5〜73.5//111。 66 201211309 由這樣的結果，特別係厚浸鐘設定的情況，顯示浸鍵溫度越低浸鍍厚度有變厚的傾向，可看出銲錫溫度及浸鍍厚度的關係。因此，藉由銲錫溫度及浸鍍厚度的關係，即使在厚浸鍍設定中，可確認浸鍍厚度係可對應銲錫溫度的設定而細微調節。例如，尺寸為0.2mmxl.0mm的平角線，在厚浸鐘設定中，比較想將浸鍍厚度變薄時，將銲錫溫度設定為280 °C即可，相反地，在厚浸鍍設定中，比較想將浸鍍厚度變厚時，將銲錫溫度設定為240°C即可，若想設定在這些之間厚度時，將銲錫溫度設定為260°C即可。又，尺寸為0.16mmx2.0mm的平角線，在銲錫溫度設定為260°C或280°C的情況，浸鍍線lb之表面外觀產生粗糙，因此，為了避免這樣的狀況，將銲錫溫度設定為240 °C即可。依此，根據銲錫溫度及浸鍍厚度的指定關係，藉由設定銲錫溫度，可獲得期望浸鍍厚度及外觀高品質的浸鍍線 lb。又，上述鍍銲錫線的製造裝置及鍍銲錫線的製造方法，並不限於上述的構成，係可藉由各式各樣的構成而構成。例如，其他實施態樣的製造裝置10A，係如圖17(a)、 (b)所示，可將預先加熱爐51P設置於超音波水洗淨槽 41與軟化退火爐51之間。 67 201211309 如圖17 (b)所示，即使在待鍍線la的行走時間及行走距離短的情況，預先加熱爐51P也急劇提高待鍍線la 的溫度而為特殊化的構成。具體而言，預先加熱爐51P於預先加熱爐本體52P具有鞘管53L。該鞘管53L係沿著待鍍線la的行走方向而直線狀構成的中空管，待鍍線la通過預先加熱爐51P及軟化退火爐51時，將預先加熱爐本體52P及軟化退火爐本體52各自内部作為連通配置的狀態，以使該待鍍線la不接觸空氣而氧化。預先加熱爐51P之内部與軟化退火爐51相同，預先加熱爐本體52P之内部，沿著鞘管53L的長邊方向具有複複個加熱器5 4P，且係以狹小於軟化退火爐51之加熱器 54的配置間隔的距離而配置。藉此，即使加速速線使待鐘線1 a行走，於軟化退火工序之前，在預先加熱爐51P加熱待鍍線la，以作為預先加熱工序，可將加熱狀態的待鍍線la供給至軟化退火爐51。因此，對應待鍍線la之線速的高速化，於軟化退火工序，可使待鍍線la確實且充份地呈低耐力化的狀態。因此，依據上述鍍銲錫線的製造裝置10A及鍍銲錫線的製造方法，在厚浸鍍設定或薄浸鍍設定任一設定之下所製造的浸鍍線lb，亦可作為要求低耐力特性的太陽能電池導線而應用。又，於鞘管53L的軟化退火爐51與預先加熱爐51P 之間部分構成有預先還原氣體供給部57P，其供給還原氣 68 201211309 體至相當於鞘管53L之長度方向的預先加熱爐51P的部分。上述還原氣體供給部57,係將作為還原氣體G的氫氣與氮氣之混合氣體供給至鞘管53L，以相當於鞘管53L之 * 軟化退火爐51的内部空間作為混合氣體環境，而預先還 • 原氣體供給部57P係將作為還原氣體G的氮氣氣體或水蒸氣氣體（steam gas)，供給至相當於鞘管53L之預先加熱爐51P的内部空間，使該内部空間為氮氣氣體環境或水蒸氣氣體環境。藉此，可防止待鍍線la通過預先加熱爐51P時，其表面氧化，且預先加熱爐51P未使用氫氣氣體作為還原氣體G，.而係使用氮氣氣體或水蒸氣氣體，即安全且容易處理。詳細而言，若著注在上述低耐力特性確認實驗的表13 (a)、（ b )中的0.2%财力值.，相較薄浸鍵設定的情況，厚浸鍍設定於任一平角尺寸、溫度，0.2%耐力值皆為高的結果。其理由係因為，線速為高速行走速度時，一方面可於浸鍍工序設定厚浸鍍，另一方面使線速加快，因此，浸鍍工序前所進行的軟化退火工序在對待鍍線la進行完全的軟化退火前，浸鍍線lb即通過軟化退火爐51，結果產生無法對待鐘線la充份進行軟化退火等情況。於此情況，藉由以厚浸鍍設定進行浸鍍工序，即使可 ..在待鍍線la之表面形成厚浸鍍厚度，由於線速也是高速行 69 201211309 走速度，因此，相較薄浸鐘設定的情況，前者生成〇.2%而寸力值較高的浸鑛線1 b。對此，如上述製造裝置10A，即，如圖17 (a)、（b) 所示，藉由將預先加熱爐51P設置於超音波水洗淨槽41 與軟化退火爐51之間，於預先加熱工序可藉由預先加熱爐51P對待鍍線la充份加熱後，再進行軟化退火工序。因此，即使待鍍線la高速行走，亦可在軟化退火工序，確實地使待鐘線1 a低财力化。因此，最後可獲得0.2%耐力值低，且具有對應厚浸鍍設定的厚浸鍍厚度的浸鍍線lb。軟化退火爐51的上游側附近所設置的預先加熱爐 51P，係加熱器54的配置數量或電量增加，更進一步，内部不為氫氣氣體，而係供給安全又容易處理的氮氣氣體或水黑·氣氣體的氣體環境等’係在待鐘線1a的加熱性能中比軟化退火爐5Γ為更特殊化的構成。因此，即使使待鍍線la高速行走，於軟化退火爐51 作為確保軟化退火時間的機構，例如，不須尋求將軟化退火爐51長形化構成等對策，相較軟化退火爐51長形化的構成，將預先加熱爐51P設置於軟化退火爐51之上游側的當前的構成，不會增加設置空間或成本。因此，藉由活用既有設備、追加設計變更的簡易構成，可對應線速的高速化，且在厚浸鍍設定或薄浸鍍設定任一設定之下所製造的浸鍍線lb，可達成充分低耐力化，可作為要求低耐力特性的太陽能電池導線而應用。 70 201211309 又，加熱處理爐22不限於係設置於行走方向中供給裝置12與酸洗淨槽31之間，只要係軟化退火爐51的上游侧，設置於其他部位亦可。例如，作為其他實施態樣的製造裝置，不設置上述加熱處理爐22，而係可只有設置上述預先加熱爐51P，且使用水蒸氣氣體作為還原氣體，供給至預先加熱爐51P之内部。根據此構成，如上所述，預先加熱爐51P可兼具雙方功能，係在軟化退火爐51之前進行預先加熱的功能之外，再加上上述加熱處理爐22所進行的功能。因此，不用說可達到設備成本的削減，更可進一步地縮短待鑛線la的行走距離，且可生產0.2%财力值低、高品質的浸鍍線lb。於本發明之構成與上述實施態樣的對應，銅線係對應本發明之待鍍線la及浸鍍線lb，以下相同地，加熱處理機構係對應加熱處理爐22,酸洗淨機構係對應酸洗淨槽 31，水洗淨機構係對應超音波水洗淨槽41，銅線輸送輔助工序係對應待鐘線輸送輔助工序’銅線輸送輔助機構係對應第一輸送絞盤91、第二輸送絞盤92及主動轉動的槽中方向轉換滾輪64，預先加熱機構係對應預先加熱爐51P，本發明並不只限於上述實施態樣的構成，係可取得許多實施態樣。 [產業上的可利用性] .本煢明係作為太陽電池的導線而應用，可利用於具有 71 201211309 適當低耐力特性的鍍銲錫線的製造方法及製造裝置。【圖式簡單說明】圖1為鍍銲錫線的製造裝置的概略圖；圖2為軟化退火爐的說明圖；圖3為橫動線架方式捲取機的說明圖；圖4為表示加熱處理溫度為l〇〇〇c時軟化退火爐的軟化退火溫度與〇.2%耐力值的關係的曲線圖；圖5為表示加熱處理溫度與〇 · 2 %耐力值的關係的曲線圖； ' <圖6為表示於軟化退火工序中，待鍍線的〇 2%耐力值在採用對應有無包含氫氣_原氣體的情況的曲線圖；圖7為表示還原氣體的氫氣混合比與0.2%对力值的關係的曲線圖；圖8為表不其他實施態樣中鍍銲錫線的製造裝置的一部分的概略圖；圖9為表不其他實施態樣中鍍銲錫線的製造裝置的一部分的概略圖；圖10為洗淨裝置的概略圖；圖11為π鐘線的G.2%耐力值與其職輸送絞盤及槽中方向轉換滾輪之設置態樣的關係的曲線圖；圖U為表示其他實施態樣中錢焊锡線的製造裝置的一部分的概略圖；圖13為鍍銲錫線的製造裝置的作用說明圖； 201211309 圖 14 ' 為在浸鑛槽上滾輪配置高度的驗證實驗所使用的製造裝置的概略圖；圖15為表示鍍銲錫線的製造裝置的實驗結果的曲線圖16為表示習知鍍銲錫線的製造裝置的概略圖；以及且耵口丨刀圖17為表示其他實施態樣的贿的一部分的概略圖。【主要元件符號說明】 la .待錢線 U :浸鍍線 2:浸鍍前處理機構 1〇 .鐵銲錫線的製造裝置 10A.其他實施態樣的製造裝置 12 :供給裝置 22 :加熱處理爐 23 :冷卻水槽 24 :連結管 30 :洗淨機構 31 :酸洗淨槽 32 :磷酸系洗淨液 41 :超音波水洗淨槽 42 ·超音波水洗淨機 73 201211309 4 2 a .超音波振動板 43 :水 45 :空氣雨刷 51 :軟化退水爐 51P :預先加熱爐 52 :軟化退火爐本體 52P :預先加熱爐本體 53、 53L :鞘管 54、 54P :加熱器 55 :鞘管上側突出部分 55d :下端開口部 55u :上端開口部 56 :鞘管下侧突出部分 57 :還原氣體供給部 57P :預先還原氣體供給部 61 :浸鍍機構 62 :熔融浸鍍銲錫槽 63 :熔融浸鍍銲錫液 64 :槽中方向轉換滾輪 65 :槽上方向轉換滾輪 71 :捲取機構 72 :捲取張力調節機 73 :固定滾輪 73A :捲取機構上游側配置滾輪 74 201211309 74 :張力擺動輪 75 :橫動線架方式捲取機 7 6 .線架 77、82 :馬達 78 :傳達機構 7 9 :捲取力檢測感應器 81 :控制部 91 :第一輸送絞盤 92 :第二輸送絞盤 dl :還原氣體G之上升方向 D:還原氣體G之上升方向的相反方向 g :重力 gl、g2:重力的分力 G:還原氣體 £ 75Other conditions: Anneal temperature 100 ° C reduction furnace 850 ° C (b) Line speed: 13 / min (high speed walking speed): thick immersion plating set size 0.2xl.0 0.16x2.0 0.2 χ 2.0 'solder Temperature °c 240 260 280 240 260 280 240 260 280 Finished product thickness mm 0.263~ 0.276 0.257~ 0.266 0·259~ 0.264 0.255~ 0.307 0.243~ 0.281 0.248~ 0.254 0.275~0.33 0.284~0.334 0.285~ 0.298 Finished width mm 1.003 1.004 0.998 2.001 2.022 2.009 1.965 1.966 1.982 Immersion plating thickness 31·5~38.0 28.5~33.0 29.5~32.0 47.5~73.5 41.5~60.5 44.0~47.0 37.5~65.0 42.0~67.0 42.5~49.0 0.2% endurance MPa 49 50 50 52 52 44 51 50 52 Appearance good and good 8 ※ 乂 ※ Good 8 ※ Other conditions: Anneal temperature 100 ° C reduction furnace 850 ° C ※ Rough appearance (granules produced in the flat plane) Table 13 (a) shows The relationship between solder temperature and immersion thickness and the tensile properties under thin immersion plating, and Table 13 (b) shows the solder temperature, immersion thickness, and extension properties under thick immersion plating. . When the line speed is set to a low speed traveling speed of 4 m/min, the immersion plating process is performed, and the line speed is set to a high speed running speed of 13 m/min, the immersion plating process is performed for each of the flat angle dimensions. The temperature conditions are compared for the thickness of the dip clock. As a result, it can be confirmed that the low-speed traveling speed is a thinner dipping key thickness than the high-speed traveling speed, and the dip coating film can be formed for the clock line 1 a. If the result of the injection in the thin leaching setting is 5, the two flat angle dimensions or the temperature setting will not be affected, and as described above, the thickness of the immersion plating can be made thinner, and in contrast to the setting of the thick immersion key, 0.2% can be made lower. Further, in any of the combinations of the three flat-angle dimensions or the temperature setting, it was confirmed that the surface appearance of the dip coating film was not rough, and a high-quality immersion plating line lb was obtained. On the other hand, if the result of the thick immersion plating is set, the three flat angle sizes or temperature settings are not affected, and the 0.2% proof value is lowered, which is about 50 MPa. Regarding the thickness of the dip bell set by the thick immersion clock, for example, a square line having a size of 〇. 2 mm x 1.0 mm, and a soldering temperature of 280 ° C, the thickness of the immersion clock is 29.5 to 32.0 / / m. On the other hand, when the solder temperature is 240 ° C, the thickness of the immersion clock is 31.5 - 38.0 m. Further, when the size is 0.16 mm x 2.0 mm and the solder temperature is 280 ° C, the immersion plating thickness is 44.0 to 47.0 / zm. On the other hand, when the solder temperature is 240 ° 〇, the immersion plating thickness is 47.5 to 73.5 / / 111. 66 201211309 As a result of this, in particular, when the thick immersion clock is set, it is shown that the lower the immersion key temperature tends to become thicker, the relationship between the solder temperature and the immersion plating thickness can be seen. Therefore, by the relationship between the solder temperature and the immersion plating thickness, even in the thick immersion plating setting, it can be confirmed that the immersion plating thickness can be finely adjusted in accordance with the setting of the solder temperature. For example, a flat angle wire having a size of 0.2 mm x 1.0 mm is used to set the solder temperature to 280 ° C when the thickness of the immersion plating is thinner in the thick immersion clock setting. Conversely, in the thick immersion plating setting, When it is desired to increase the thickness of the immersion plating, the solder temperature may be set to 240 ° C. If the thickness is to be set between these, the solder temperature may be set to 260 ° C. Further, in the case of a rectangular wire having a size of 0.16 mm x 2.0 mm, when the solder temperature is set to 260 ° C or 280 ° C, the surface appearance of the immersion plating line lb is rough. Therefore, in order to avoid such a situation, the solder temperature is set to 240 °C can be. Accordingly, according to the specified relationship between the solder temperature and the immersion plating thickness, by setting the solder temperature, the immersion plating line lb having a desired immersion plating thickness and high appearance quality can be obtained. Further, the manufacturing apparatus of the above-described plating solder wire and the method of manufacturing the plating solder wire are not limited to the above-described configuration, and may be configured by various configurations. For example, in the manufacturing apparatus 10A of another embodiment, as shown in Figs. 17(a) and (b), the preheating furnace 51P can be disposed between the ultrasonic water washing tank 41 and the softening annealing furnace 51. 67 201211309 As shown in Fig. 17 (b), even in the case where the traveling time and the traveling distance of the to-be-plated line la are short, the preheating furnace 51P sharply raises the temperature of the to-be-plated line la to have a special configuration. Specifically, the preheating furnace 51P has a sheath tube 53L in the preheating furnace body 52P. The sheath tube 53L is a hollow tube which is linearly formed along the traveling direction of the line to be plated la. When the to-be-plated line la passes through the preheating furnace 51P and the softening annealing furnace 51, the preheating furnace body 52P and the softening annealing furnace body are provided. Each of the 52 is internally connected to the state so that the to-be-plated line la is oxidized without contacting the air. The inside of the preheating furnace 51P is the same as the softening annealing furnace 51, and the inside of the furnace main body 52P is preliminarily heated, and the heaters 5 4P are provided along the longitudinal direction of the sheath tube 53L, and are heated to be narrower than the softening annealing furnace 51. The arrangement of the devices 54 is configured by the distance of the intervals. Thereby, even if the acceleration speed line causes the clock line 1a to travel, the pre-heating furnace 51P is heated in the preheating furnace 51P to heat the to-be-plated line la as a pre-heating process, and the heated to-be-plated line la can be supplied to soften. Annealing furnace 51. Therefore, in accordance with the high speed of the line speed of the line to be plated la, in the softening annealing step, the line to be plated la can be surely and sufficiently low-endurized. Therefore, according to the above-described method for manufacturing the plated solder wire 10A and the method of manufacturing the soldered wire, the immersion plating line 1b manufactured under the setting of the thick immersion plating or the thin immersion plating can also be used as a low endurance characteristic. Solar cell wires are used. Further, a pre-reduction gas supply unit 57P is partially formed between the softening annealing furnace 51 of the sheath tube 53L and the preheating furnace 51P, and supplies the reducing gas 68 201211309 to the preheating furnace 51P corresponding to the longitudinal direction of the sheath tube 53L. section. The reducing gas supply unit 57 supplies a mixed gas of hydrogen gas and nitrogen gas as the reducing gas G to the sheath tube 53L, and the internal space of the softening annealing furnace 51 corresponding to the sheath tube 53L is used as a mixed gas atmosphere, and is also provided in advance. The raw gas supply unit 57P supplies a nitrogen gas or a steam gas as the reducing gas G to the internal space of the preheating furnace 51P corresponding to the sheath tube 53L, and the internal space is a nitrogen gas atmosphere or water vapor. Gas environment. Thereby, it is possible to prevent the surface to be plated la from being oxidized when passing through the preheating furnace 51P, and the preheating furnace 51P does not use hydrogen gas as the reducing gas G, and uses nitrogen gas or steam gas, which is safe and easy to handle. . Specifically, if the 0.2% financial value in Table 13 (a) and (b) of the low endurance characteristic confirmation test is noted, the thick immersion plating is set to any flat angle size as compared with the case of the thin immersion key setting. Temperature, 0.2% endurance value are high results. The reason is that, when the line speed is a high-speed traveling speed, thick immersion plating can be set in the immersion plating process, and the line speed is accelerated. Therefore, the softening annealing process performed before the immersion plating process is performed on the plating line la Before the completion of the complete softening annealing, the dip plating line lb passes through the softening annealing furnace 51, and as a result, it is impossible to sufficiently soften the annealing of the clock line la. In this case, by performing the immersion plating process with thick immersion plating, even if a thick immersion plating thickness can be formed on the surface of the line to be plated la, since the line speed is also a high speed line 69 201211309, the speed is relatively thin. In the case of the clock setting, the former generates a dip line 1 b with a high value of 2%. On the other hand, in the above-described manufacturing apparatus 10A, that is, as shown in FIGS. 17(a) and (b), the preheating furnace 51P is provided between the ultrasonic water washing tank 41 and the softening annealing furnace 51 in advance. In the heating step, the plating line la can be sufficiently heated by the preheating furnace 51P, and then the softening annealing step is performed. Therefore, even if the to-be-plated line la is traveling at a high speed, it is possible to soften the annealing process and surely make the clock line 1 a low-cost. Therefore, it is finally possible to obtain a dip plating line lb having a low 0.2% endurance value and a thick immersion plating thickness corresponding to the thick immersion plating setting. The preheating furnace 51P provided in the vicinity of the upstream side of the softening annealing furnace 51 increases the number of electric heaters or the amount of electric power, and further, the inside is not hydrogen gas, but supplies nitrogen gas or water black which is safe and easy to handle. The gas atmosphere or the like of the gas gas is configured to be more specialized than the softening annealing furnace 5 in the heating performance of the bell line 1a. Therefore, even if the line to be plated la is to be moved at a high speed, the softening annealing furnace 51 serves as a mechanism for securing the softening annealing time. For example, it is not necessary to seek to increase the length of the softening annealing furnace 51, and the shape is longer than that of the softening annealing furnace 51. In the configuration, the preheating furnace 51P is placed on the upstream side of the softening annealing furnace 51, and the installation space or cost is not increased. Therefore, by using a simple configuration that utilizes existing equipment and additional design changes, the speed of the line speed can be increased, and the dip plating line lb manufactured under any setting of thick immersion plating or thin immersion plating can be achieved. It is sufficiently low-endurance and can be applied as a solar cell wire that requires low endurance characteristics. Further, the heat treatment furnace 22 is not limited to being disposed between the supply device 12 and the pickling tank 31 in the traveling direction, and may be provided at another portion as long as the upstream side of the annealing furnace 51 is softened. For example, in the manufacturing apparatus of another embodiment, the heat treatment furnace 22 is not provided, and only the preheating furnace 51P is provided, and the steam gas is supplied as a reducing gas to the inside of the preheating furnace 51P. According to this configuration, as described above, the preheating furnace 51P can have both functions, and the function of the heating treatment furnace 22 is added in addition to the function of preheating before the softening annealing furnace 51. Therefore, it goes without saying that the reduction in equipment cost can be achieved, and the walking distance of the to-be-lined la can be further shortened, and the dip-plating line lb having a low-cost, high-quality 0.2% can be produced. Corresponding to the above-described embodiment of the present invention, the copper wire corresponds to the to-be-plated line la and the dip-plating line 1b of the present invention. Hereinafter, the heat treatment mechanism corresponds to the heat treatment furnace 22, and the pickling mechanism corresponds to The acid cleaning tank 31, the water washing mechanism corresponds to the ultrasonic water washing tank 41, and the copper wire conveying auxiliary process corresponds to the waiting line clock conveying auxiliary process 'the copper wire conveying auxiliary mechanism corresponds to the first conveying winch 91, the second conveying The winch 92 and the actively rotating groove direction changing roller 64 and the preheating mechanism correspond to the preheating furnace 51P. The present invention is not limited to the configuration of the above embodiment, and many embodiments can be obtained. [Industrial Applicability] The present invention is applied as a wire for a solar cell, and can be used in a method and a device for producing a plated solder wire having an appropriate low endurance characteristic of 71 201211309. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view of a manufacturing apparatus for a soldered wire; Fig. 2 is an explanatory view of a softening annealing furnace; Fig. 3 is an explanatory view of a traverse coiler type winding machine; A graph showing the relationship between the softening annealing temperature of the softening annealing furnace and the 〇.2% proof stress at a temperature of l〇〇〇c; Fig. 5 is a graph showing the relationship between the heat treatment temperature and the 〇·2% proof value; ' < Fig. 6 is a graph showing the 〇2% proof value of the line to be plated in the softening annealing step in the case where the presence or absence of the hydrogen-containing raw gas is used; Fig. 7 is a graph showing the hydrogen mixture ratio of the reducing gas and the 0.2% force. FIG. 8 is a schematic view showing a part of a manufacturing apparatus for plating a solder wire in another embodiment; FIG. 9 is a schematic view showing a part of a manufacturing apparatus for plating a solder wire in another embodiment. Fig. 10 is a schematic view of the cleaning device; Fig. 11 is a graph showing the relationship between the G.2% proof value of the π clock line and the setting state of the steering pulley and the direction changing roller in the groove; Fig. U shows other implementations. Aspect of the manufacturing device of the money solder wire FIG. 13 is an explanatory view of the operation of the apparatus for manufacturing a soldered wire; 201211309 FIG. 14 ' is a schematic view of a manufacturing apparatus used for a verification test of the height of the roller on the immersion tank; FIG. 15 is a diagram showing the plating solder. FIG. 16 is a schematic view showing a manufacturing apparatus of a conventional plating solder wire; and FIG. 17 is a schematic view showing a part of a bribe of another embodiment. [Main component symbol description] la. Money line U: Immersion plating line 2: Pre-coating processing mechanism 1〇. Iron soldering wire manufacturing apparatus 10A. Other embodiment of manufacturing apparatus 12: Supply apparatus 22: Heating processing furnace 23 : Cooling water tank 24 : Connecting pipe 30 : Cleaning mechanism 31 : Acid cleaning tank 32 : Phosphoric acid cleaning liquid 41 : Ultrasonic water washing tank 42 · Ultrasonic water washing machine 73 201211309 4 2 a. Ultrasonic wave Vibrating plate 43: Water 45: Air wiper 51: Softening and dehydrating furnace 51P: Preheating furnace 52: Softening annealing furnace body 52P: Preheating furnace body 53, 53L: Sheath tubes 54, 54P: Heater 55: Sheath tube upper side protruding Part 55d: lower end opening 55u: upper end opening 56: sheath lower protruding portion 57: reducing gas supply portion 57P: pre-reduction gas supply portion 61: dip plating mechanism 62: melt-dip solder bath 63: melt-dip solder Liquid 64: In-slot direction change roller 65: In-slot direction change roller 71: Winding mechanism 72: Winding tension adjuster 73: Fixed roller 73A: Rolling mechanism upstream side arrangement roller 74 201211309 74: Tension swing wheel 75: Horizontal Moving wire frame winding machine 7 6 . Wire frame 77, 82: Motor 78: transmission mechanism 7 9 : winding force detecting sensor 81 : control unit 91 : first conveying winch 92 : second conveying winch dl : rising direction of reducing gas G: opposite direction of rising direction of reducing gas G : Gravity gl, g2: Component of gravity G: reducing gas £ 75

Claims

201211309 VII. Patent application scope: 1. A manufacturing device for plating a solder wire, which is composed of a pre-dip plating treatment mechanism, a dip plating mechanism and a winding mechanism, and the pre-plating processing mechanism is a copper wire. Performing a pre-dip plating process, the immersion plating mechanism is performing immersion soldering on the surface of the copper wire, and the winding mechanism winds the copper wire which has been immersed on the surface, wherein the immersion plating processing mechanism has a a softening annealing mechanism that softens and anneals the copper wire to make the copper wire low-cost; and the copper wire that has been low-forced by the winding mechanism and with a winding force lower than the endurance of the copper wire The winding and the softening annealing mechanism, the immersion plating mechanism, and the winding mechanism are arranged in series from the upstream side in the traveling direction of the copper wire. 2. The apparatus for manufacturing a soldering wire according to claim 1, wherein the copper wire is formed of a pure copper-based material; the softening annealing mechanism is formed by a softening annealing furnace, and the surface of the copper wire is reduced inside a reducing gas atmosphere of the oxide layer; the softening annealing furnace is disposed obliquely such that a position of the downstream end portion in the traveling direction of the copper wire is lower than a position of the upstream end portion in the traveling direction of the copper wire; A downstream portion of the softening annealing furnace in the traveling direction of the copper wire is provided with a reducing gas supply portion that allows supply of a reducing gas to the softening annealing furnace. 3. The apparatus for manufacturing a soldering wire according to item 2 of the patent application, 76 201211309: wherein the reducing gas system is composed of a mixed gas of nitrogen gas and nitrogen gas. 4. The apparatus for manufacturing a briquette wire according to claim 3, wherein the volume of the nitrogen gas and the hydrogen gas is set to 4:1. A soldering and soldering heat treatment mechanism according to any one of the preceding claims, wherein the copper 5, the manufacturing apparatus of the first to the second aspect of the patent application, wherein the pre-dip plating treatment mechanism has a line for heat treatment; And arranging the heat treatment mechanism on the upstream side of the softening annealing mechanism in the traveling direction of the copper wire. A manufacturing apparatus for a soldering wire, as described in claim 1, wherein the copper wire is washed with a pure copper material to form the copper wire, and the copper wire is cleaned by the pretreatment mechanism; The cleaning mechanism is disposed on the upstream side of the copper structure. The apparatus for manufacturing a soldering wire according to the softening annealing machine in the line traveling direction, 7. In the scope of the patent application, the pretreatment processing mechanism has a heat treatment mechanism, and the wire is heat-treated. Further, it is disposed on the upstream side of the softening annealing mechanism in the traveling direction of the copper wire; and the heat treatment mechanism is disposed on the upstream side of the _ line running side (four) of the cleaning-77 201211309 structure. 8. The welding according to item 7 of claim 4 (4), wherein the I 卩-acid cleaning mechanism and the water washing mechanism constitute the cleaning mechanism and the pretreatment mechanism of the shovel, the heat treatment mechanism The acid cleaning mechanism and the water washing system (10) are arranged in sequence along the traveling direction of the copper wire. 9. The manufacturing device for the tin wire described in the seventh or the eighth item of the patent application, in the middle of the copper wire system, the width of the vertical section is in the range of OHO.Omm, and the thickness is 〇.〇5~〇5. The angle of the copper wire with the size of the range, the vertical section is opposite to the longitudinal direction of the section, the traveling speed of the copper wire is set to about 4 〇 m / min, the acid cleaning time of the acid cleaning mechanism is set to It was about 12 8 seconds, and the water washing time of the water washing mechanism was set to about 13.5 seconds. 1. The apparatus for manufacturing a solder wire according to claim 1, wherein the copper wire is made of a pure copper material; and the upper wire of the winding mechanism is in the traveling direction of the copper wire A conveyor assist mechanism 'which assists the take-up mechanism in winding the copper wire. The apparatus for manufacturing a soldering wire according to the above aspect of the invention, wherein the copper wire feeding auxiliary mechanism is disposed on an upstream side of the softening annealing mechanism in the traveling direction of the copper wire. The apparatus for manufacturing a soldering wire according to claim 10, wherein the copper wire feeding auxiliary mechanism is disposed on a downstream side of the cleaning mechanism in the traveling direction of the copper wire. The apparatus for manufacturing a soldering wire according to any one of claims 10 to 12, wherein the immersion plating mechanism is formed by a molten immersion solder bath storing a molten immersion solder bath; The direction changing roller of the traveling direction of the copper wire is formed by a groove middle direction changing roller, which is inside the molten immersion soldering bath, and the copper wire is before and after the copper wire passes through the molten immersion soldering bath The direction of travel is converted; the copper wire feeding auxiliary mechanism constitutes the direction changing roller in the groove. 14. The apparatus for manufacturing a soldering wire according to claim 1, wherein the copper wire is made of a pure copper bismuth material, and the dip-plating mechanism is formed by a molten immersion solder bath for storing the molten immersion solder liquid; a direction changing roller that converts the traveling direction of the copper wire is formed by a groove-up direction changing roller, which is above the molten immersion soldering bath, and after the copper wire passes through the molten immersion soldering bath, The traveling direction of the copper wire is switched to the side of the winding mechanism; the winding roller is disposed in the fixed roller of the copper wire, and the fixed roller disposed on the upstream side is arranged on the upstream side of the winding mechanism. a wheel configuration that guides the copper wire 79 201211309 after the groove up direction shifting roller to the downstream side of the take-up mechanism; and arranges the groove up direction change roller above the upstream side of the take-up mechanism Configure the height of the wheel configuration. The apparatus for manufacturing a soldering wire according to claim 14, wherein the groove up direction switching roller is disposed on the molten immersion solder bath stored in the molten immersion solder bath. The height of the liquid surface is approximately 3 m. The apparatus for manufacturing a soldering wire according to claim 14 or 15, wherein the money immersing mechanism is formed by a molten immersion solder bath for storing the molten immersion solder liquid; The direction-direction change roller is formed by a groove-in-direction change roller, which is inside the molten-dip solder bath, and converts the traveling direction of the copper wire before and after the copper wire passes through the melt-dip solder bath; And the copper wire conveying auxiliary mechanism constitutes the groove middle direction changing roller, which assists the winding mechanism to wind up the copper wire. The manufacturing of the plated solder wire according to the first aspect of the patent application, wherein the copper wire is formed of a pure copper material; and the immersion plating mechanism is set by a thin immersion plating and a thick immersion plating. According to the setting, the thin immersion plating is performed by dip-plating the copper wire 'the m-division' immersion plating (4) the thickness of the immersion plating to form a thick immersion plating thickness; Λ 201211309 The traveling speed of the copper wire is below the low speed walking speed, and the copper wire is set by immersion plating; the thick immersion plating setting is such that the traveling speed of the copper wire is lower than the high speed walking speed of the low speed walking speed The setting of the immersion plating of the copper wire is performed; in the high-speed traveling speed, the copper wire is set by the immersion plating thickness corresponding to the solder temperature according to the specified relationship between the soldering temperature and the immersion plating thickness. The apparatus for manufacturing a soldering wire according to claim 17, wherein the cleaning mechanism and the softening annealing mechanism have a preheating mechanism for heating the copper wire before the softening annealing mechanism. In the setting of the thick immersion plating setting, the immersion plating means applies a immersion clock to the copper wire that has passed through the preheating mechanism and the softening annealing mechanism. 19 . A method for manufacturing a bright tin wire. a pre-dip bonding process, a immersion plating process, and a coiling process, wherein the immersion plating process performs a immersion plating process on the copper wire, and the immersion plating process applies a plating solder to the surface of the copper wire, and the winding The copper wire which has been subjected to immersion plating on the surface of the process is wound, wherein a softening annealing step of softening and annealing the copper wire to reduce the endurance of the copper wire is performed in the pre-dip plating treatment step; a step of winding up with a winding force lower than the endurance of the copper wire having low endurance; and 81 201211309, performing the softening annealing process and the immersion plating process continuously during the winding process. The method for producing a soldering wire according to the item 19, wherein the copper wire is formed of a pure copper-based material; and the softening annealing step is provided from a downstream side portion of the traveling direction. The reducing gas supply unit supplies the reducing gas to a softening annealing furnace, and the softening annealing furnace is disposed obliquely, and the position of the downstream end portion in the traveling direction is lower than the position of the upstream end portion in the traveling direction, and the reducing property The gas system reduces the oxide layer on the surface of the copper wire; and: the interior of the softening annealing furnace is a reducing gas atmosphere, and the copper wire is allowed to walk in the softening annealing furnace. 21, as described in claim 20 The method for producing a soldering wire, wherein the reducing gas system is formed by a mixed gas of a nitrogen gas and a hydrogen gas, and the method for producing a soldering wire according to claim 21, wherein The method for producing a soldering wire according to any one of the items 19 to 22, wherein the volume ratio of the nitrogen gas to the hydrogen gas is set to 4:1, and the method of manufacturing the soldering wire according to any one of claim 19 to 22 The copper wire is subjected to a heat treatment step before the softening annealing step. 24. The method of manufacturing a soldering wire according to claim 19, wherein: 82 201211309 the copper wire is formed using a pure copper material; in the pre-plating pretreatment process, the softening annealing is performed. Before the step, a washing step of washing the copper wire is performed. The method for manufacturing a solder wire according to claim 24, wherein the pre-dip processing step comprises a heat treatment step of heat-treating the copper wire before the softening annealing step; This heat treatment process is performed before this washing process. 26. The method of manufacturing a soldering wire according to claim 25, wherein the cleaning step has an acid cleaning step and a water washing step; and in the pre-plating treatment step, sequentially The heat treatment step, the acid washing step, the water washing step, and the softening annealing step are performed. The method for manufacturing a soldering wire according to claim 25 or claim 26, wherein the copper wire has a width of a vertical section of 0.8 to 10.0 mm and a thickness of 〇〇5 to 〇5 mm. A rectangular copper wire having a size in a range, a vertical cross section perpendicular to the longitudinal direction thereof, a traveling speed of the copper wire is set to about 4.0 m/min, and an acid washing time in the acid washing step is set to about 12 8 seconds, and the water washing time in the water washing step was set to about 13.5 seconds. The method for producing a soldering wire according to claim 19, wherein the copper wire is formed of a pure copper material; 83 201211309 during the winding process, the copper wire feeding auxiliary process is performed. It assists in the winding of the copper wire by the winding process. The method of manufacturing a soldering wire according to claim 19, wherein the copper wire is formed of a pure copper-based material; after the immersion plating process, the molten immersion soldering bath is Above, the direction of the traveling direction of the copper wire passing through the molten dip solder bath is switched to the side of the upstream side of the winding mechanism by a groove up direction switching roller, and the groove direction changing roller system Arranging on an upstream side of the winding mechanism for winding the copper wire on which the surface has been immersed, and disposed above the arrangement height of the roller disposed on the upstream side of the winding mechanism, the roller on the upstream side of the winding mechanism is disposed The copper wire is guided to the downstream side of the take-up mechanism. The method of manufacturing a soldering wire according to claim 19, wherein the copper wire is formed of a pure copper material; the immersion plating process is performed by thin immersion plating and thick immersion plating. Performing any setting of the thin immersion plating, the copper wire is immersed by thin immersion plating, and the thick immersion plating is thicker than the immersion plating thickness set by the thin immersion plating to form a thick immersion plating thickness; The thin immersion clock is set such that the traveling speed of the copper wire is lower than the low speed traveling speed, and the copper wire is subjected to immersion plating setting; the thick immersion plating setting is such that the traveling speed of the copper wire is higher than the low speed Under the high-speed walking speed of the walking speed, the copper wire is immersed in the setting of 201211309 minutes; in the high-speed walking speed, according to the specified relationship between the soldering temperature and the immersion plating thickness, the thickness of the immersion plating corresponding to the soldering temperature is copper. Line the setting of the dip clock. The method of manufacturing a soldered wire according to claim 30, wherein the low speed traveling speed is set to about 4 m/min; and the high speed running speed is set to about 13 m/min. The method of manufacturing a soldered wire according to claim 30, wherein the solder temperature is set to about 240 ° C at a high speed traveling speed. The method for producing a soldering wire according to any one of the items 30 to 32, wherein the immersion plating step is performed by the thick immersion plating, and the cleaning step and the softening annealing are performed. During the process, a preheating step is performed to heat the copper wire before the softening annealing step. After the softening annealing step, the copper wire subjected to the softening annealing step is subjected to a immersion plating step. 85