201213719 六、發明說明 【發明所屬之技術領域】 本發明係有關對於發光主體使用具備正極端子及負極 端子之發光二極體元件的照明裝置。 【先前技術】 使用發光二極體元件的照明裝置係大致區分爲直流驅 動或交流驅動。直流驅動之發光二極體元件係另外需要將 所供給之商用交流電壓變換爲直流電壓之交流-直流變換 1C或由發光二極體元件之驅動1C等所構成之驅動電路， 但交流驅動之發光二極體元件係從無需前述驅動電路之情 況，期待對於照明裝置之利用。在任何之驅動方式中，對 於作爲照明裝置而將高輸出化作爲目標，亦不得不增加發 光二極體元件之發光量，此情況，不可無視產生於發光二 極體元件之發光主體的熱。發光二極體元件係當發光主體 的熱變高時，從不只發光效率（對於所供給之電力的發光 比例）下降，發光二極體元件其本身的壽命亦變短之情 況’在使用發光二極體元件之照明裝置中，要求熱處理對 策。 專利文獻1係提案有對於使用發光二極體元件之照明 裝置’介紹有考慮.散熱而於金屬基板（PCB)安裝發光二 極體元件’更且對於前述金屬基板而言裝著散熱片之照明 裝置的以往技術（專利文獻1 [〇〇〇8]〜[0011]，[圖11])之 ’更追加水冷手段（水冷套）之照明裝置（專利文獻 -5- 201213719 1 [申請專利範圍第1項])。發光二極體元件之發光主體 係將熱移至水冷手段之熱媒體（冷媒液），由散熱器冷卻 前述熱媒體，重複進行散熱，冷卻前述發光二極體元件之 熱主體（專利文獻1[0026])。由此’抑制發光二極體元 件之發光效率的下降，可長壽命化之外，作爲照明裝置可 實現高輸出化（專利文獻1[〇〇27])。 先前技術文獻 [專利文獻] [專利文獻1]日本特開2009-1 29642號公報 【發明內容】 [發明欲解決之課題] 如上述，將使用發光二極體元件之照明裝置作爲高輸 出化之情況，對於發光二極體元件而言，要求多少的熱對 策，簡易地組合金屬基板與散熱片，以及更亦可利用水冷 手段。但散熱片係因造成使用發光二極體元件之照明裝置 之大型化及重量化之構成之故而並不理想，零件件數的增 加係使製造成本及組裝成本大增。更且，從散熱片更加對 於外部的散熱成爲不充分時，有可能引起熱積存於金屬基 板或散熱片的問題。 對此，如利用水冷手段，對於發光二極體元件之冷卻 係不會產生問題，但只要使用散熱片之情況，將招致照明 裝置的大型化，重量增加，並且成本增加。近年來，作爲 既有的照明裝置之代替手段，使用發光二極體元件之照明 -6- 201213719 裝置備受注目，但爲了作爲更普及而無法避免高輸出化。 因此，謀求高輸出化之同時，將小型化，輕量化，並且成 本降低的實現作爲目標，爲了開發在使用發光二極體元件 之照明裝置之新的冷卻手段而進行檢討。 [爲解決課題之手段] 發展檢討結果之構成則屬於使用對於發光主體具備正 極端子及負極端子之發光二極體元件的照明裝置，其中， 與發光主體熱連接主體散熱體，介入存在於具備供電線之 通常基板或金屬基板與正極端子及負極端子之間，與前述 正極端子及負極端子熱及電性連接端子散熱體而成，主體 散熱體係由平板狀之主體連接板，和從前述主體連接板之 外周緣延伸之筒狀的主體擴散板所成，於主體連接板載置 發光二極體元件之發光主體的照明裝置。本發明之照明裝 置係省略金屬基板，於具備供電線之通常基板（亦可爲另 外的金屬基板）與正極端子及負極端子之間，使端子散熱 體介入存在，更且於發光主體連接主體散熱體之構成。 本發明之照明裝置係將發光二極體元件之正極端子及 負極端子，與端子散熱體熱及電性連接，將產生於前述發 光二極體元件之發光主體的熱，從正極端子及負極端子， 藉由端子散熱體間接地進行散熱之同時，將前述發光主 體，與主體散熱體熱連接，將產生於發光主體的熱，從主 體散熱體直接進行散熱。即，發光二極體元件全體則與端 子散熱體或主體散熱體之任一熱連接，實現高散熱作用’ 201213719 在謀求作爲照明裝置之高輸出化的情況，可抑制或防止發 光二極體元件之溫度上升。 在此，「熱」連接係指：從發光主體藉由正極端子及 負極端子間接，或從發光主體直接加以傳熱的連接形態， 而「電性」連接係指：通過供電線而可將驅動電力進行供 電的連接形態。由此，端子散熱體係熱連接正極端子及負 極端子，從連接前述正極端子及負極端子與供電線之關 係，金屬體，理想爲金屬板，具體而言作爲銅板或銀板。 另外，主體散熱體係從無需將任何與發光主體地性連接之 情況，例如亦可爲熱傳導率高的陶瓷體，但配合端子散熱 體，金屬體，理想爲金屬板，具體而言;作爲銅板或銀板。 發熱的發光主體係藉由金剛石層而載置於主體散熱板 時，從發光主體熱容易移動至主體散熱體，進而容易抑制 或防止主體散熱體之溫度上升。金剛石層係如使金剛石粉 末堆積而形成即可。具體而言，使金剛石粉末直接堆積於 主體散熱體表面，形成金剛石層，以及於熱傳導率優越的 陶瓷混入金剛石粉末，將前述陶瓷塗佈於主體散熱體表 面，經由使其硬化，將混在有金剛石粉末之陶瓷層作爲金 剛石層而形成。 主體散熱體係由熱連接發光主體之主體連接板，和與 前述主體連接板熱連結之主體擴散板所構成。將主體散熱 體作爲板材·而構成時，比表面積（每單位質量之表面積的 比例）增大，而容易進行散熱。另外，經由分爲主體連接 板與主體擴散板而構成主體散熱體之時，主體連接板係可 -8- 201213719 作成容易支持發光主體之構造，另外主體擴散板係適合於 散熱（例如，使其露出於外部），且可作爲容易位置固定 於照明裝置主體之構造。此係意味發光主體則藉由主體擴 散板，主體連接板而支持於照明裝置主體，消除接觸於端 子散熱體之虞（確保絕緣性）。 端子散熱體係由較設置於主體連接板的開口爲小之平 板狀的端子連接板，和從前述端子連接板延伸於主體擴散 板內部之平板狀的端子擴散板所成，於從設置於主體連接 板的開口而視之端子連接板，連接發光二極體元件之正極 端子及負極端子，介入裝設絕緣構件於形成在前述開口與 端子連接板之間的絕緣縫隙，於具備供電線之通常基板或 金屬基板，連接前述端子擴散板即可。將端子散熱體作爲 板材而構成時，比表面積則增大，而容易進行散熱。另 外，經由分爲端子連接板與端子擴散板而構成端子散熱體 之時，端子連接板係可作成容易連接於正極端子及負極端 子之構造，另外端子擴散板係適合於散熱，且可作爲容易 位置固定於照明裝置主體之構造。此係意味正極端子及負 極端子則藉由端子擴散板，端子連接板而支持於照明裝置 主體，消除接觸於主體散熱體之虞（確保絕緣性）。 [發明之效果] 本發明之照明裝置係經由從發光二極體元件通過主體 散熱體及端子散熱體而直接進行散熱之時，容易將產生於 發光二極體元件的熱進行散熱，比較於藉由金屬基板而從 -9 - 201213719 散熱片進行散熱之以往，可抑制或防止發光二極 溫度上升。特別是介入裝置於發光主體與主體散 的金剛石層係容易從發光主體傳熱至主體散熱體 使在主體散熱體的熱之擴散，可抑制或防止發光 度上升。如此，本發明之照明裝置係防止經由發 二極體元件的發光效率之下降或壽命變短之情況 使用發光二極體元件之照明裝置的高輸出化，擴 光二極體元件之照明裝置的利用範圍。 主體散熱體或端子散熱體係從發光二極體元 受到熱，進行散熱之情況，即使比較於在以往同 裝置之散熱片爲小，亦可充分地冷卻發光二極體 將照明裝置小型化或輕量化。照明裝置之小型化 係由以板材而構成，加大比表面積，設置連接板 之作用分擔者，將主體散熱體或端子散熱體作爲 以及經由介入裝置金剛石層而容易從主體散熱體 熱體的熱進行散熱而將前述主體散熱體作爲小型 加以實現。 另外，主體散熱體或端子散熱體係由金屬板 言以銅板或銀板構成時，除了傳熱及散熱變佳之 形成減少了必要之材料的量，並且，從容易進行 況，可抑制材料成本或製造成本。更且，在照明 而視之情況，亦可省略金屬基板，亦帶來材料成 成本之降低。如此作爲，本發明之照明裝置係帶 置之小型化，輕量化，並且成本增加之抑制或成 體元件之 熱體之間 ，更且促 主體的溫 熱之發光 ，可作爲 大使用發 件直接接 種的照明 元件，可 或輕量化 及擴散板 小型化， 將主體散 化者亦可 ，具體而 外，對於 加工之情 裝置全體 本或製造 來照明裝 本減少之 -10- 201213719 效果。 【實施方式】 以下，對於爲了實施本發明之形態加以說明。本發明 係例如如圖1所示’可適用於交流驅動之照明裝置1 °本 例之照明裝置1係如圖2(省略螺絲的圖示）及圖3所 示，由殼體模組1 1、導光體模組1 2、散熱體保持模組 13、主體散熱體14、端子散熱體15，15、燈座模組16及 具備供電線之通常基板1 7加以構成’使發光二極體元件 2保持於前述散熱體保持模組13’將發光主體21熱連接 於主體散熱體14之主體連接板141’另外將正極端子22 及負極端子23，熱及電性連接於各別之端子散熱體15之 各端子連接板151而加以構成。 殼體模組1 1係爲被覆導光體模組1 2而保護之樹脂製 構件，例如使用聚丁烯對苯二甲酸酯（PBT )加以形成。 前端開口 1 1 1係將周緣接合於前述導光體模組1 2之半球 狀導光體121上面，成爲下端之嵌合周緣112係嵌合於散 熱體保持模組13之保持基座131之外周面。使用取代於 導光體模組1 2而將發光二極體元件2配置於底部中心之 碗狀反射材所成之反射材模組之情況，於前述前端開口 111’裝著透光製材質（玻璃或透明之樹脂板）所成之透 光板或透鏡。 導光體模組1 2係一體地形成引導從發光二極體元件 2的發光主體21所發光的發光二極體光，從上述殼體模 -11 - 201213719 組1 1之前端開口 1 1 1使其照射之半球狀導光體1 2 1，和 支持前述半球狀導光體121之平板狀的支持基座122之樹 脂製構件，例如使用聚丁烯對苯二甲酸酯（PBT )加以形 成。半球狀導光體121係於貫通支持基座122所設置之光 導入孔123，插入發光二極體元件2的發光主體21，使發 光二極體光折射或反射之同時，朝向上面使其擴散。本例 之導光體模組12係內接於將支持基座122之周面的一部 分設置於散熱體保持模組13之保持基座131的加強肋部 136加以決定位置，夾持於前述保持基座131與形成殼體 模組1 1之前端開口 1 1 1的周緣加以固定位置。 散熱體保持模組1 3係以絕緣狀態保持主體散熱體1 4 及端子散熱體15之樹脂製構件，例如使用聚丁烯對苯二 甲酸酯（PBT )加以形成。具德而言，由載置於主體散熱 體1 4之平面視圓形之主體連接板1 4 1的一圈小的平面視 圓形之保持基座131，和從前述保持基座131的底面朝下 方之一對的組裝支柱1 3 2，1 3 2加以構成。組裝支柱1 3 2 係螺絲固定於燈座模組1 6之支柱螺絲固定部1 62，將從 散熱體保持模組1 3至燈座模組1 6作爲一體之外，卡合於 主體連接板141及端子連接板151之各支柱接合缺口 143，153，防止主體散熱體14及端子散熱體15之接觸， 且進行決定位置。 保持基座131係於上面周緣設置環狀之加強肋部136 的圓盤，於平面視中央，設置相似於主體連接板141之交 聯部分的平面視長方形之發光主體用開口 1 3 3，夾持前述 -12- 201213719 發光主體用開口 133而設置一對之端子插通孔l35’ 135。另外，沿著前述發光主體用開口 133之長度方向側 緣，於底面側設置絕緣樑134，134 (參照圖4及圖5 ’圖 5係說明上的方便，略圖示主體擴散板142及端子擴散板 152)。絕緣樑134係插入於形成在主體連接板141及端 子連接板1 5 1之間的絕緣縫隙1 8，防止主體散熱體1 4及 端子散熱體15的接觸，且進行決定位置。 主體散熱體14係由厚度0.1mm〜0.5mm的銅（或銀） 製的主體連接板141及主體擴散板142所構成。主體連接 板1 4 1係從接面於散熱體保持模組1 3之保持基座1 3 1的 背面之圓形銅板，設置較端子散熱體15之端子連接板 1 5 1，僅絕緣縫隙1 8的寬度爲大之開口的板材，將從半徑 外側接合於從散熱體保持模組13延伸的組裝支柱132之 支柱接合缺口 143，設置於開口的圓弧部分中央。主體連 接板1 4 1係將插入於開口之直線部分之絕緣縫隙1 8的絕 緣樑134與前述組裝支柱132，從開口的內側壓上加以決 定位置，使主體連接板141接面於散熱體保持模組13之 保持基座1 3 1的背面，且將主體擴散板1 42之下端，外嵌 於燈座模組1 6之主體擴散板嵌合肋部1 6 1而加以固定位 置。 本例之主體連接板1 4 1係爲了與發光二極體元件2的 發光主體21熱連接，而於載置前述發光主體21之部分， 塗佈混入金剛石粉末之陶瓷電糊（例如，氧化鈦（Ti02 ) 9wt%~15wt%，陶瓷珠（Ceramic bead，空隙率（Porosity -13- 201213719 )1 2% 〜20% ) 1 Owt% 〜1 5wt%，金剛石粉末 〇.5wt% 〜 lwt%，其他之石油溶劑油（White sprit)或礦油 (Mineral oil )等），使其燒結，形成金剛石層144。經 由藉由如此作爲之金剛石層144而熱連接發光主體21與 主體連接板141之時，提昇從發光主體21至主體連接板 141之熱傳導率。 主體擴散板142係從主體連接板141的外周緣朝向下 方延伸之圓筒，經由外嵌於燈座模組1 6之主體擴散板嵌 合肋部161而加以決定位置及固定位置。本例之主體擴散 板142係露出於外部（參照圖1及圖2)，使從發光主體 2 1所傳導的熱順利地擴散至外部。如既已敘述，經由藉 由金剛石層144之時，從發光主體21至主體連接板141 係熱傳導率提昇，另外，從主體擴散板1 42爲圓筒之情 況，比表面積大，並且露出於外部之故散熱性優越。如此 作爲而提昇發光主體21之冷卻效率。 端子散熱體15係由厚度0.1 mm〜0.5 mm的銅（或銀） 製的端子連接板1 5 1及端子擴散板1 5 2所構成。端子連接 板1 5 1係較設置於上述主體連接板1 4 1之開口，僅絕緣縫 隙18的寬度爲小之半圓弧的板材，與設置於上述主體連 接板1 4 1之支柱接合缺口 1 43成爲對，將從半徑內側接合 於從散熱體保持模組1 3延伸的組裝支柱1 3 2之支柱接合 缺口 1 5 3，設置於圓弧部分中央。端子連接板1 5 1係在從 設置於主體連接板1 4 1之開口而視的狀態’插入於直線部 分之絕緣縫隙1 8的絕緣樑1 3 4與前述組裝支柱1 3 2加以 -14 - 201213719 決定位置，使端子連接板1 5 1接面於散熱體保持模組1 3 之保持基座1 3 1的背面，經由於固定位置於燈座模組1 6 之通常基板17的插入孔171，插入端子擴散板152之決 定位置突起154之時而加以固定位置。 端子擴散板152係從位置於前述端子連接板151之半 徑內徑的直線部分，彎曲延伸於下方之板面。從端子擴散 板152所釋放的熱係一旦釋放於圓筒狀之主體擴散板142 之內部空間，由前述主體擴散板1 42所吸熱，重新從主體 擴散板M2釋放至外部，但通過正極端子22及負極端子 23而傳達的熱係少之故，並無問題。 本例之端子擴散板1 5 2係經由組裝支柱1 3 2而對於燈 座模組16而言，將插入於設置在固定位置之通常基板17 的插入孔171之決定位置突起154，設置於下緣中央。由 此，端子擴散板152係經由夾持於散熱體保持模組13之 組裝支柱132與絕緣樑134之端子連接板151而固定位置 上緣，前述決定位置突起154則經由插入於通常基板17 的插入孔171而固定位置下緣，而不會接觸於主體散熱體 14。 燈座模組1 6係具備公螺絲狀之燈座1 6 3之構件，例 如將全體由聚丁烯對苯二甲酸酯（PBT)加以形成同時， 僅將前述燈座1 6，由金屬構件而構成。本例之燈座模組 1 6係如既已敘述，於形成於上端周緣之主體擴散板嵌合 肋部1 6 1 ’嵌合主體擴散板1 42而決定位置主體散熱體 1 4，經由於支柱螺絲固定部1 62，螺絲固定組裝支柱1 3 2 -15- 201213719 之時，決定位置散熱體保持模組13，藉由前述散熱體保 持模組1 3而決定位置主體散熱體1 4及端子散熱體1 5 ’ 且進行固定位置。 通常基板17係具備供電線（略圖示）之基板（PCB)或金 屬基板（金屬PCB)。本例之通常基板1 7係連結供電線於 插入孔171，電性連接插入於前述插入孔171之端子擴散 板1 52的決定位置突起1 54與供電線。供電線係藉由導線 1 72而連結於燈座1 63。另外，本例之通常基板1 7係呈藉 由插入於插入孔171之決定位置突起154，可固定位置端 子擴散板152地，固定位置通常基板17本身之故，將螺 絲固定於燈座模組1 6之支柱螺絲固定部1 62的組裝支柱 132，嵌合於支柱貫通孔173。藉由燈座模組16之燈座 1 63所供給之交流電壓係歷經導線1 72，供電線，並且各 端子散熱體15，15,施加於發光二極體元件2之正極端 子22及負極端子23。 從至此的說明所理解地，經由散熱體保持模組1 3之 組裝支柱1 32及絕緣樑1 34，燈座模組1 6之主體擴散板 嵌合肋部161或通常基板17，主體散熱體14及端子散熱 體1 5係在相互絕緣的狀態加以決定位置，且固定位置。 由此，發光二極體元件2係如圖6 (說明之方便上，散熱 體保持模組13之略圖示）所示，將發光主體21壓接於主 體連接板141，進行熱連接之同時，將從前述發光主體21 突出之正極端子22及負極端子23，各接觸於從設置於主 體連接板1 4 1之開口而視之端子連接板1 5 1，例如經由銲 -16 - 201213719 接而加以電性及熱連接。 主體散熱體1 4及端子散熱體1 5係如本例以銅板而構 成時，比表面積則可作爲極大，從熱的觀點，亦可看到直 接連結於發光二極體元件2之散熱片。此情況，主體散熱 體14及端子散熱體15係如本例，分爲主體連接板141及 端子連接板151與主體擴散板142及端子擴散板152而構 成時，可將主體連接板141及端子連接板151，作爲發光 主體21或正極端子22及負極端子23容易連接之構造， 而可將主體擴散板142及端子擴散板152,作爲適合於散 熱或決定位置及固定位置之構造。如此，在本發明之主體 散熱體14及端子散熱體15係作爲對於發光二極體元件2 之散熱片亦爲優越。 【圖式簡單說明】 圖1係顯示適用本發明之照明裝置之一例的斜視圖。 圖2係本例之照明裝置之垂直剖面圖。 圖3係本例之照明裝置之分解斜視圖。 圖4係在本例之照明裝置之發光二極體元件，散熱體 保持模組，主體散熱體及端子散熱體之組裝前斜視圖。 圖5係從下方而視之散熱體保持模組，主體散熱體及 端子散熱體之組裝前斜視圖。 圖6係在本例之照明裝置之發光二極體元件，散熱體 保持模組，主體散熱體及端子散熱體之組裝後斜視圖。 201213719 【主要元件符號說明】 1 :照明裝置 1 1 :殼體模組 1 2 :導光體模組 1 3 :散熱體保持模組 14 :主體散熱體 141 :主體連接板 142 :主體擴散板 1 5 :端子散熱體 1 5 1 :端子連接板 152 :端子擴散板 1 6 :燈座模組 17 :通常基板 1 8 :絕緣縫隙 2 :發光二極體元件 21 :發光主體 22 :正極端子 23 :負極端子201213719 VI. Description of the Invention [Technical Field] The present invention relates to an illumination device using a light-emitting diode element including a positive electrode terminal and a negative electrode terminal for a light-emitting body. [Prior Art] An illumination device using a light-emitting diode element is roughly classified into a DC drive or an AC drive. The DC-driven LED component is additionally required to convert the supplied commercial AC voltage into a DC voltage AC-DC conversion 1C or a driving diode 1C driving circuit, but the AC driving illumination The diode element is expected to be utilized for a lighting device since the above-described driving circuit is not required. In any of the driving methods, it is necessary to increase the amount of light emitted from the light-emitting diode element in order to achieve high output as an illumination device. In this case, the heat generated in the light-emitting body of the light-emitting diode element cannot be ignored. In the case of the light-emitting diode element, when the heat of the light-emitting body becomes high, the luminous efficiency (the ratio of the light-emitting power to the supplied power) decreases, and the life of the light-emitting diode element itself becomes shorter. In the lighting device for the polar body element, heat treatment measures are required. Patent Document 1 proposes illumination for mounting an illuminating device using a light-emitting diode element, heat dissipation, mounting of a light-emitting diode element on a metal substrate (PCB), and mounting of a heat sink for the metal substrate. Conventional technology of the device (Patent Document 1 [〇〇〇8] to [0011], [Fig. 11]) "Lighting device for additional water cooling means (water cooling jacket) (Patent Document-5 - 201213719 1 [Application Patent No. 1 item]). The light-emitting main system of the light-emitting diode element heats the heat medium (refrigerant liquid) of the water-cooling means, and the heat medium is cooled by the heat sink, and heat is repeatedly radiated to cool the heat body of the light-emitting diode element (Patent Document 1 [ 0026]). Thus, the decrease in the luminous efficiency of the light-emitting diode element is suppressed, and the life can be extended, and the output can be increased as an illumination device (Patent Document 1 [〇〇27]). [Problems to be Solved by the Invention] As described above, an illumination device using a light-emitting diode element is used as a high-output device. In the case of the light-emitting diode element, how much heat is required, the metal substrate and the heat sink can be easily combined, and the water cooling means can be used. However, the heat sink is not preferable because of the increase in size and weight of the lighting device using the light-emitting diode element, and the increase in the number of parts increases the manufacturing cost and the assembly cost. Further, when the heat sink is more insufficient for external heat dissipation, there is a possibility that heat is accumulated in the metal substrate or the heat sink. On the other hand, if the water-cooling means is used, there is no problem in the cooling of the light-emitting diode element. However, if a heat sink is used, the size of the lighting device will increase, the weight will increase, and the cost will increase. In recent years, as a substitute for the existing lighting device, the illumination of the light-emitting diode element -6-201213719 has been attracting attention, but in order to be more popular, high output cannot be avoided. Therefore, in order to achieve high output, it is aimed at miniaturization, weight reduction, and cost reduction, and has been reviewed for the development of new cooling means for lighting devices using light-emitting diode elements. [Means for Solving the Problem] The configuration of the development review results is an illumination device using a light-emitting diode element having a positive electrode terminal and a negative electrode terminal for a light-emitting body, wherein the body heat-dissipating body is thermally connected to the light-emitting body, and the intervention is present in the device. The normal substrate or the metal substrate of the electric wire and the positive electrode terminal and the negative electrode terminal are thermally and electrically connected to the terminal heat sink and the negative electrode terminal, and the main body heat dissipation system is connected to the main body through the flat plate. A tubular main diffuser extending from the periphery of the plate is formed on the main body connecting plate to mount the illuminating body of the illuminating body of the illuminating diode element. In the illuminating device of the present invention, the metal substrate is omitted, and between the normal substrate (which may be another metal substrate) having the power supply line and the positive electrode terminal and the negative electrode terminal, the terminal heat sink is interposed, and the heat emitting body is connected to the main body. The composition of the body. In the illumination device of the present invention, the positive terminal and the negative terminal of the light-emitting diode element are thermally and electrically connected to the terminal heat sink, and the heat generated in the light-emitting body of the light-emitting diode element is from the positive terminal and the negative terminal. The heat-dissipating body is indirectly thermally dissipated by the terminal heat sink, and the light-emitting body is thermally connected to the body heat-dissipating body, and heat generated in the light-emitting body is directly radiated from the body heat sink. In other words, the entire light-emitting diode element is thermally connected to any of the terminal heat sink or the main body heat sink to achieve high heat dissipation. 201213719 In order to increase the output of the illumination device, it is possible to suppress or prevent the light-emitting diode element. The temperature rises. Here, the "thermal" connection means a connection form in which the light-emitting body is indirectly transferred from the positive electrode terminal and the negative electrode terminal, or directly from the light-emitting body, and the "electrical" connection means that the drive can be driven by the power supply line. The connection form in which power is supplied. Thereby, the terminal heat dissipation system thermally connects the positive electrode terminal and the negative terminal, and connects the positive electrode terminal and the negative electrode terminal to the power supply line. The metal body is preferably a metal plate, specifically, a copper plate or a silver plate. In addition, the main body heat dissipation system does not need to be connected to any of the light-emitting bodies, for example, a ceramic body having a high thermal conductivity, but a terminal heat sink, a metal body, preferably a metal plate, specifically; as a copper plate or Silver plate. When the heat-generating main system is placed on the main body heat sink by the diamond layer, the heat of the light-emitting body is easily moved to the body heat sink, and the temperature rise of the body heat sink is easily suppressed or prevented. The diamond layer may be formed by depositing diamond powder. Specifically, the diamond powder is directly deposited on the surface of the main body heat sink to form a diamond layer, and the diamond powder is mixed into the ceramic having excellent thermal conductivity, and the ceramic is applied to the surface of the main body heat sink, and is hardened to be mixed with diamond. A ceramic layer of powder is formed as a diamond layer. The main body heat dissipating system is composed of a main body connecting plate that thermally connects the main body and a main body diffusing plate that is thermally coupled to the main body connecting plate. When the main body heat sink is configured as a sheet material, the specific surface area (ratio of surface area per unit mass) is increased, and heat dissipation is facilitated. Further, when the main body heat sink is formed by dividing the main body connecting plate and the main body diffusing plate, the main body connecting plate can be configured to easily support the light emitting body, and the main body diffusing plate is suitable for heat dissipation (for example, It is exposed to the outside and can be fixed as a structure in which the position of the illuminating device is easily located. This means that the illuminating body is supported by the body of the illuminating device by the main body diffusion plate and the main body connecting plate, and the contact with the terminal heat sink is eliminated (ensure insulation). The terminal heat dissipation system is formed by a flat terminal connecting plate which is smaller than an opening provided in the main body connecting plate, and a flat terminal diffusing plate extending from the terminal connecting plate to the inside of the main body diffusing plate, and is connected to the main body. The terminal connection plate of the opening of the board is connected to the positive terminal and the negative terminal of the light emitting diode element, and the insulating member is interposed to form an insulating gap formed between the opening and the terminal connecting plate, and the normal substrate having the power supply line Or the metal substrate may be connected to the terminal diffusion plate. When the terminal heat sink is formed as a plate material, the specific surface area is increased, and heat dissipation is facilitated. Further, when the terminal heat sink is formed by dividing the terminal connection plate and the terminal diffusion plate, the terminal connection plate can be configured to be easily connected to the positive electrode terminal and the negative electrode terminal, and the terminal diffusion plate is suitable for heat dissipation and can be easily used. The position is fixed to the configuration of the main body of the lighting device. This means that the positive terminal and the negative terminal are supported by the terminal of the illuminating device by the terminal diffusion plate and the terminal connection plate, and the contact with the heat sink of the main body is eliminated (ensure insulation). [Effects of the Invention] When the illuminating device of the present invention directly dissipates heat from the light-emitting diode element through the main body heat sink and the terminal heat sink, it is easy to dissipate heat generated in the light-emitting diode element, and In the past, heat dissipation from the -9 - 201213719 heat sink from the metal substrate can suppress or prevent the temperature rise of the light-emitting diode. In particular, the diamond layer in which the interposing device is dispersed in the illuminating body and the main body easily transfers heat from the illuminating body to the main body heat dissipating body to diffuse heat in the main body heat dissipating body, thereby suppressing or preventing an increase in illuminance. As described above, the illuminating device of the present invention prevents the use of the illuminating device of the light-emitting diode element and the use of the illuminating device of the light-emitting diode element in the case where the luminous efficiency of the light-emitting diode element is lowered or the life is shortened. range. When the main body heat sink or the terminal heat dissipation system receives heat from the light emitting diode element and dissipates heat, even if it is smaller than the heat sink of the same device in the past, the light emitting diode can be sufficiently cooled to reduce the size or lightness of the lighting device. Quantify. The miniaturization of the illuminating device is made up of a plate material, the specific surface area is increased, and the function of the connecting plate is provided. The main body heat sink or the terminal heat sink is used as the heat of the body heat body through the diamond layer of the interposer. The heat dissipation of the main body is performed as a small size. In addition, when the main body heat sink or the terminal heat dissipation system is composed of a metal plate or a copper plate or a silver plate, the formation of a necessary material is reduced in addition to heat transfer and heat dissipation, and the material cost can be suppressed or manufactured from the viewpoint of easy operation. cost. Moreover, in the case of illumination, the metal substrate can be omitted, and the cost of the material can be reduced. In this way, the illuminating device of the present invention is compacted, lightweight, and the cost is increased or the thermal elements of the adult components are heated, and the warmth of the main body is promoted. The inoculated lighting element can be lightened and the diffusion plate can be miniaturized, and the main body can be dissipated. Specifically, the effect of the device or the manufacturing of the lighting package is reduced by -10-201213719. [Embodiment] Hereinafter, embodiments for carrying out the invention will be described. The present invention is, for example, as shown in FIG. 1 'A illuminating device 1 that can be applied to an AC drive. The illuminating device 1 of this example is as shown in FIG. 2 (illustration of a screw omitted) and FIG. 3, and the housing module 1 1 The light guide body module 2, the heat sink holding module 13, the main body heat sink 14, the terminal heat sinks 15, 15, the lamp socket module 16, and the normal substrate 17 having the power supply line are configured to make the light emitting diode The component 2 is held in the heat sink holding module 13' to thermally connect the light emitting body 21 to the main body connecting plate 141' of the main body heat sink 14. The positive electrode terminal 22 and the negative electrode terminal 23 are thermally and electrically connected to the respective terminals for heat dissipation. Each of the terminals 15 of the body 15 is connected to the plate 151. The case module 1 1 is a resin member protected by the light guide module 1 2, and is formed, for example, using polybutylene terephthalate (PBT). The front end opening 1 1 1 is formed by bonding the peripheral edge to the upper surface of the hemispherical light guide body 121 of the light guide body module 1 2 , and the fitting peripheral edge 112 of the lower end is fitted to the holding base 131 of the heat sink holding module 13 . The outer perimeter. When the reflector module formed by placing the light-emitting diode element 2 on the bottom center of the light-emitting diode element 2 is used, the front end opening 111' is provided with a light-transmitting material ( A light-transmissive plate or lens made of glass or a transparent resin plate. The light guide body module 1 2 integrally forms the light-emitting diode light that guides the light-emitting body 21 emitted from the light-emitting diode element 2, and the front end opening 1 1 1 from the housing mold -11 - 201213719 group 1 1 The hemispherical light guide body 112 to be irradiated and the resin member supporting the flat support base 122 of the hemispherical light guide body 121, for example, using polybutylene terephthalate (PBT) form. The hemispherical light guide body 121 is inserted through the light introducing hole 123 provided in the support base 122, and is inserted into the light emitting body 21 of the light emitting diode element 2 to refract or reflect the light emitting diode and diffuse toward the top. . The light guide module 12 of the present example is internally connected to a reinforcing rib 136 which is provided on a portion of the peripheral surface of the support base 122 and is provided on the holding base 131 of the heat sink holding module 13 to be positioned and held by the holding. The pedestal 131 is fixed to a periphery of the front end opening 1 1 1 forming the casing module 1 1 . The heat sink holding module 13 is a resin member that holds the main body heat sink 14 and the terminal heat sink 15 in an insulated state, and is formed, for example, using polybutylene terephthalate (PBT). In the case of the German, a circular planar holding base 131 of the main body connecting plate 141 placed in the plane of the main body heat radiating body 14 and the bottom surface of the holding base 131 are provided. The assembly pillars 1 3 2, 1 3 2 are formed toward one of the lower pairs. The assembly post 1 3 2 is fixed to the pillar screw fixing portion 1 62 of the socket module 16 and is engaged with the main body connecting plate from the heat sink holding module 13 to the socket module 16. 141 and each of the post connecting plates 151 are joined to the notches 143 and 153 to prevent contact between the main body heat sink 14 and the terminal heat sink 15, and to determine the position. The holding base 131 is a disk having an annular reinforcing rib 136 disposed on the upper periphery thereof, and a flat-shaped rectangular light-emitting body opening 1 3 3 similar to the cross-linked portion of the main body connecting plate 141 is disposed in the center of the plan view. A pair of terminal insertion holes l35' 135 are provided in the above-described -12-201213719 light-emitting body opening 133. Further, insulating beams 134 and 134 are provided on the bottom surface side along the longitudinal side edge of the opening 133 for the light-emitting body (see FIG. 4 and FIG. 5 FIG. 5 for convenience of illustration, and the main diffusing plate 142 and the terminal are slightly illustrated. Diffuser plate 152). The insulating beam 134 is inserted into the insulating slit 18 formed between the main body connecting plate 141 and the terminal connecting plate 15 1 to prevent contact between the main body heat sink 14 and the terminal heat sink 15, and to determine the position. The main body heat sink 14 is composed of a main body connecting plate 141 made of copper (or silver) having a thickness of 0.1 mm to 0.5 mm and a main body diffusing plate 142. The main body connecting plate 14 1 is a circular copper plate which is connected to the back surface of the holding base 1 3 1 of the heat sink holding module 13 , and is provided with a terminal connecting plate 1 5 1 of the terminal heat sink 15 only to insulate the gap 1 The plate having a large opening of 8 is joined to the pillar joint notch 143 of the assembly post 132 extending from the radiator holding module 13 from the outside of the radius, and is provided at the center of the arc portion of the opening. The main body connecting plate 141 is formed by pressing the insulating beam 134 of the insulating slit 18 inserted in the straight portion of the opening and the assembling post 132 from the inner side of the opening to position the body connecting plate 141 to the heat sink. The module 13 holds the back surface of the base 133, and the lower end of the main diffuser plate 142 is externally fitted to the main diffuser fitting rib 161 of the socket module 16 to be fixed. In the main body connecting plate 141 of the present embodiment, in order to thermally connect to the light-emitting main body 21 of the light-emitting diode element 2, a ceramic electric paste (for example, titanium oxide) mixed with diamond powder is applied to a portion on which the light-emitting body 21 is placed. (Ti02) 9wt%~15wt%, ceramic beads (voidal bead, porosity (Porosity -13 - 201213719) 1 2% ~ 20%) 1 Owt% ~ 1 5wt%, diamond powder 〇.5wt% ~ lwt%, other The white sprit or mineral oil, etc., is sintered to form a diamond layer 144. When the light-emitting main body 21 and the main body connecting plate 141 are thermally connected by the diamond layer 144 as described above, the thermal conductivity from the light-emitting main body 21 to the main body connecting plate 141 is raised. The main body diffusion plate 142 is a cylinder extending downward from the outer peripheral edge of the main body connecting plate 141, and is fitted to the main diffusing plate fitting rib 161 of the socket module 16 to determine the position and the fixed position. The main body diffusion plate 142 of this example is exposed to the outside (see Figs. 1 and 2), and the heat conducted from the light-emitting body 21 is smoothly diffused to the outside. As described above, when the diamond layer 144 is passed, the thermal conductivity is increased from the illuminating body 21 to the main body connecting plate 141, and when the main diffusing plate 142 is a cylinder, the specific surface area is large and exposed to the outside. Therefore, the heat dissipation is superior. In this way, the cooling efficiency of the light-emitting body 21 is improved. The terminal heat sink 15 is composed of a copper (or silver) terminal connecting plate 151 and a terminal diffusing plate 152 having a thickness of 0.1 mm to 0.5 mm. The terminal connecting plate 151 is closer to the opening of the main body connecting plate 141, and only the plate having the width of the insulating slit 18 is a small semicircular arc, and the rib 1 is provided on the main connecting plate 141. 43 is paired, and the pillar joint notch 1 5 3 joined to the assembly pillar 1 3 2 extending from the radiator holding module 13 from the inside of the radius is provided at the center of the arc portion. The terminal connecting plate 151 is attached to the insulating beam 1 34 of the insulating slit 18 of the straight portion in a state viewed from the opening provided in the main body connecting plate 141, and the aforementioned assembling post 1 3 2 is -14 - 201213719 The position is determined such that the terminal connecting plate 1 5 1 is connected to the back surface of the holding base 1 3 1 of the heat sink holding module 1 3 , and is inserted into the insertion hole 171 of the normal substrate 17 of the socket module 16 . When the terminal projection plate 152 is inserted into the terminal diffusion plate 152, the position is raised to a fixed position. The terminal diffusion plate 152 is bent and extends from the lower plate surface from a linear portion positioned at the inner diameter of the half diameter of the terminal connection plate 151. The heat released from the terminal diffusion plate 152 is released from the internal space of the cylindrical main body diffusion plate 142, is absorbed by the main body diffusion plate 142, and is again released from the main body diffusion plate M2 to the outside, but passes through the positive electrode terminal 22. There is no problem in that the heat transmitted by the negative electrode terminal 23 is small. In the terminal diffusion plate 152 of the present example, the lamp holder module 16 is inserted into the position determining projection 154 of the insertion hole 171 of the normal substrate 17 provided at the fixed position via the assembly post 133. Central. Thereby, the terminal diffusion plate 152 is fixed to the upper edge of the position by the assembly post 132 of the heat sink holding module 13 and the terminal connection plate 151 of the insulating beam 134, and the determined position protrusion 154 is inserted through the normal substrate 17. The hole 171 is inserted to fix the lower edge of the position without coming into contact with the body heat sink 14. The socket module 16 is a member having a male screw-shaped socket 163. For example, the whole is formed of polybutylene terephthalate (PBT), and only the lamp holder 16 is made of metal. Constructed by components. In the lamp holder module 16 of the present example, as described above, the main body diffusing plate fitting rib 1 1 1 ' is formed on the peripheral edge of the upper end, and the main body diffusing plate 1 42 is fitted to determine the position main body heat radiating body 1 4 . The pillar screw fixing portion 1 62, the screw fixing assembly pillar 1 3 2 -15- 201213719, determines the position heat sink holding module 13, and determines the position body heat sink 14 and the terminal by the heat sink holding module 13 The heat sink 1 5 ' is fixed. The substrate 17 is usually provided with a substrate (PCB) or a metal substrate (metal PCB) of a power supply line (not shown). In the normal example, the substrate 1 7 is connected to the power supply line in the insertion hole 171, and is electrically connected to the positional projection 1 54 of the terminal diffusion plate 152 inserted into the insertion hole 171 and the power supply line. The power supply line is coupled to the socket 1 63 by a wire 1 72. In addition, in the conventional substrate 17 of the present example, the positional projection 154 is inserted into the insertion hole 171, and the terminal diffusion plate 152 can be fixed. The fixed position is usually the substrate 17 itself, and the screw is fixed to the socket module. The assembly post 132 of the pillar-screw fixing portion 1 62 of 16 is fitted to the pillar through-hole 173. The AC voltage supplied by the socket 163 of the lamp holder module 16 passes through the wire 1 72, the power supply line, and the terminal heat sinks 15, 15 are applied to the positive terminal 22 and the negative terminal of the LED component 2. twenty three. As understood from the description so far, the main body diffusion plate fitting rib 161 or the normal substrate 17 of the socket module 16 is assembled via the heat dissipating body holding module 13 and the insulating beam 134. 14 and the terminal heat sink 1 5 are in a state of being insulated from each other to determine the position and a fixed position. Thereby, the light-emitting diode element 2 is crimped to the main body connecting plate 141 as shown in FIG. 6 (for convenience of description, the heat sink holding module 13 is shown), and is thermally connected. The positive electrode terminal 22 and the negative electrode terminal 23 projecting from the light-emitting body 21 are respectively in contact with the terminal connecting plate 155 from the opening provided in the main body connecting plate 141, for example, via welding-16 - 201213719 Electrical and thermal connections. When the main body heat sink body 14 and the terminal heat sink body 15 are formed of a copper plate in this embodiment, the specific surface area can be made extremely large, and from the viewpoint of heat, a heat sink directly connected to the light-emitting diode element 2 can be seen. In this case, when the main body heat sink 14 and the terminal heat sink 15 are divided into the main body connecting plate 141 and the terminal connecting plate 151, the main body diffusing plate 142, and the terminal diffusing plate 152, the main body connecting plate 141 and the terminal can be used. The connection plate 151 has a structure in which the light-emitting main body 21, the positive electrode terminal 22, and the negative electrode terminal 23 are easily connected, and the main body diffusion plate 142 and the terminal diffusion plate 152 can be configured to be suitable for heat dissipation or to determine a position and a fixed position. As described above, the main body heat sink 14 and the terminal heat sink 15 of the present invention are also excellent as the heat sink for the light emitting diode element 2. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing an example of a lighting device to which the present invention is applied. Figure 2 is a vertical sectional view of the lighting device of this example. Fig. 3 is an exploded perspective view of the lighting device of the present embodiment. Fig. 4 is a perspective view showing the assembly of the light-emitting diode element, the heat sink holding module, the main body heat sink and the terminal heat sink of the lighting device of the present embodiment. Fig. 5 is a front perspective view showing the heat sink holding module, the main body heat sink and the terminal heat sink as viewed from below. Fig. 6 is a perspective view showing the assembly of the light-emitting diode element, the heat sink holding module, the main body heat sink and the terminal heat sink of the lighting device of the present embodiment. 201213719 [Description of main component symbols] 1 : Illumination device 1 1 : Housing module 1 2 : Light guide body module 1 3 : Heat sink retention module 14 : Main body heat sink 141 : Main body connection plate 142 : Main body diffusion plate 1 5: Terminal heat sink 1 5 1 : Terminal connection plate 152 : Terminal diffusion plate 1 6 : Lamp holder module 17 : Normal substrate 1 8 : Insulation slit 2 : Light-emitting diode element 21 : Light-emitting body 22 : Positive terminal 23 : Negative terminal