201215977 AU1004041 35648twf.doc/n 六、發明說明： 【發明所屬之技術領域】 本發明是有關於一種雷射修補機台，且特別是有關於 一種具有阻值量測裝置的雷射修補機台。 【先前技術】 一般在製作主動元件陣列基板的過程中，會進行檢查 程序以檢測出缺陷(defect)所在，並對此缺陷(defect)進行雷 射修補(laser repairing)製程。一般而言，雷射化學氣相沈 積製程(laser CVDprocess)是常見的雷射修補製程之一。然 而，於進行雷射修補製程時，常因雷射修補機台中的零組 件位置偏移或損壞，使得雷射光光轴偏移或能量發生變 化，進而導致修補失敗。舉例而言，當雷射化學氣相沈積 裝程所使用之雷射光的能量不穩定時，其在缺陷處形成之 修補線可能無法達成修補之目的，進而導致修補動作失 敗。需特別說明的是，此類型的修補失敗無法被線上工作 人員即時檢出，而需將此修補後的主動元件陣列基板移至 另一檢測機台中量測修補線之阻值，才可判斷主動元件陣 列基板上之缺陷是否已被修復完全，但，於進行上述量測 阻值動作的同時，許多因雷射侧機台異常而導致修復失 敗的主動元件陣列基板已續流至後段製程中，造成彳^段 程之人力與物料的浪費。 承上述，如何在雷射修補製程中，即時地監控雷射修 補機台的機況，以使雷射修補機台機況異常的問題可被及 時地發現’而降低修補失敗之主動元件陣列基板續留至後 201215977 AUl 004041 35648twf.doc/n 段製程中的機率，實騎發者所欲料的問題之一。 【發明内容】 以即==機種=補機台，其具⑽量測裝置 陣列ίί明有台至;適於修補主動元件 線路具有至少_對彼此電接^ =線路’測試 包括载△祕㈣^接趣。f射修補機台 載主動元碰裝置以及阻值量财置。载台適於承 之部測先:斷測試線路 與這對測試，接觸以量:置修針，而探針雜 動梦^本發明的一實施例中’前述之阻值量測裝置包括驅 Li驅動裝置與探針連接以帶動探針上、下移動 在本㈣的—實_中，前叙探針包括底座^ 針座具連接。探針座組裝於底座上，且； 導電前述之測試塾的間距與-對 針座在本發明的一實施例中，前述之探針座為可拆卸式探 調整在本發明的一實施例中’前述之導電端子的間距為可 201215977 AU1004041 35648twf.doc/n 在本發明的一實施例中，前述之探針座為可 針座，且可旋轉式探針座係相對於底座旋轉。 式探 在本發明的一實施例中，前述之阻值量測裝置 補線形成之前與修補線形成之後分別進行阻值之量測，乜 本發明之雷射修補機台具有即時監控自身機^之 能，因此可降低因機況異常而修補失敗的主動元件陣列其 板流至後段製程中的機率，進而減少了後段製程之人力 物料被浪費的機率。 、 為讓本發明之上述特徵和優點能更明顯易懂，下文特 舉實施例，並配合所附圖式作詳細說明如下。 【實施方式】 圖1為本發明一實施例之雷射修補機台示意圖。請參 照圖1，本實施例之雷射修補機台1〇〇可用來修補主動元 件陣列基板200，而主動元件陣列基板200例如是薄膜電 晶體陣列基板(Thin Film Transistor Array Substrate, TFT Array Substrate)。然而，本發明不限定主動元件陣列基板 200之種類。在本實施例中，雷射修補機台1〇〇包括載台 110、雷射修補裝置120以及阻值量測裝置13〇，其中載台 110可用來承載主動元件陣列基板2〇〇，而阻值量測裝置 130配置於雷射修補裝置12〇上。 在本實施例中，阻值量測裝置130可包括至少一探針 132以及驅動裝置134。本實施例之探針132可包括底座 132a以及探針座132b，且此探針座132b具有一對導電端 子132c ’如圖1右下方之圖示所示。在本實施例中，驅動 201215977 AU1004041 35648twf.doc/n 裝置134可包括步進馬達丨34a以及控制單元i34b(例如電 腦）’其中步進馬達134a可由控制單元134b來控制。本實 施例之探針座132b與步進馬達134a連接，因此透過控制 單元134b可控制探針132上、下移動，如圖i中所示:本 實施例之探針132可進一步與電表136電性連接以達 測阻值之功能。 圖2A為本發明一實施例之測試線路示意圖。請先參 照圖2A，在本實施例中，待修補的主動元件陣列基板2⑽ 具有至少一測試線路210。本實施例之測試線路21〇包括 至少-對測試塾212以及連接線路214，其中，此對測試 墊212藉由連接線路214彼此電性連接，如圖2a中所示。 在本實施例中，導電端子132e的間距ρ。 2、 的間j實質上相同，如圖2B中所示。因此，本實施例 之驅動裝置134之控制單元134b可使整個探針132往 量測出測試線路 雷射2A中所示。接著，利用本實施例之 雷射修補裝置120切斷測試線路21〇 2線之:r域)以使測試_201215977 AU1004041 35648twf.doc/n VI. Description of the Invention: [Technical Field] The present invention relates to a laser repairing machine, and more particularly to a laser repairing machine having a resistance measuring device. [Prior Art] Generally, in the process of fabricating an active device array substrate, an inspection process is performed to detect a defect, and a laser repairing process is performed on the defect. In general, laser CVD process is one of the common laser repair processes. However, in the laser repair process, the positional displacement or damage of the components in the laser repairing machine often causes the laser optical axis to shift or the energy changes, which leads to repair failure. For example, when the energy of the laser light used in the laser chemical vapor deposition process is unstable, the repair line formed at the defect may not be repaired, resulting in failure of the repair operation. It should be specially stated that this type of repair failure cannot be detected by the online staff immediately, and the repaired active component array substrate needs to be moved to the resistance of the measurement repair line in another inspection machine to judge the initiative. Whether the defects on the component array substrate have been completely repaired, but while the above-mentioned measurement resistance action is performed, many active device array substrates that have failed to be repaired due to the abnormality of the laser side machine have flowed to the subsequent process. The waste of manpower and materials caused by the 彳^ segment. In view of the above, how to monitor the condition of the laser repairing machine in real time in the laser repairing process, so that the problem of the abnormality of the laser repairing machine can be found in time, and the active component array substrate with reduced repair failure is reduced. The possibility of staying until 201215977 AUl 004041 35648twf.doc/n process is one of the problems that the rider expects. [Summary of the Invention] ??? == model = replacement machine, with (10) measuring device array ί 明 ; ; ;; suitable for repairing active component lines have at least _ electrical connection to each other ^ = line 'test including load △ secret (four) ^Contact. The f-shooting machine is equipped with an active element touch device and a resistance amount. The stage is suitable for the measurement of the part: the test line and the pair of tests, the contact amount: the repair needle, and the probe noise dream ^ in an embodiment of the invention, the aforementioned resistance value measuring device includes the drive The Li driving device is connected with the probe to drive the probe to move up and down in the (4)-solid, and the front probe includes a base and a needle holder. The probe holder is assembled on the base, and the spacing of the test cymbal and the pair of the probe are electrically conductive. In an embodiment of the invention, the probe holder is detachably probed in an embodiment of the invention. The spacing of the aforementioned conductive terminals is 201215977 AU1004041 35648twf.doc/n In an embodiment of the invention, the probe holder is a needle mount and the rotatable probe mount is rotated relative to the base. In an embodiment of the present invention, the resistance value measuring device of the present invention performs the measurement of the resistance value before the formation of the repairing line and the repairing line, and the laser repairing machine of the present invention has the real-time monitoring of the own machine. The ability to reduce the probability of failure of the active component array due to abnormal conditions and the flow of the plate to the back-end process, thereby reducing the chance of wasted human resources in the latter process. The above described features and advantages of the present invention will become more apparent from the description of the appended claims. Embodiments Fig. 1 is a schematic view of a laser repairing machine according to an embodiment of the present invention. Referring to FIG. 1, the laser repairing machine 1 of the present embodiment can be used to repair the active device array substrate 200, and the active device array substrate 200 is, for example, a Thin Film Transistor Array Substrate (TFT Array Substrate). . However, the present invention does not limit the kind of the active device array substrate 200. In this embodiment, the laser repairing machine 1 includes a stage 110, a laser repairing device 120, and a resistance measuring device 13A, wherein the stage 110 can be used to carry the active device array substrate 2 The value measuring device 130 is disposed on the laser repairing device 12A. In the present embodiment, the resistance measuring device 130 may include at least one probe 132 and a driving device 134. The probe 132 of this embodiment may include a base 132a and a probe holder 132b, and the probe holder 132b has a pair of conductive terminals 132c' as shown in the lower right diagram of FIG. In the present embodiment, the drive 201215977 AU1004041 35648twf.doc/n device 134 may include a stepper motor 34a and a control unit i34b (e.g., a computer)' wherein the stepper motor 134a may be controlled by the control unit 134b. The probe holder 132b of the embodiment is connected to the stepping motor 134a. Therefore, the transmission control unit 134b can control the up and down movement of the probe 132. As shown in FIG. i, the probe 132 of the embodiment can be further electrically connected to the electric meter 136. Sexual connection to measure the resistance value. 2A is a schematic diagram of a test circuit according to an embodiment of the present invention. Referring to FIG. 2A, in the embodiment, the active device array substrate 2 (10) to be repaired has at least one test line 210. The test circuit 21A of the present embodiment includes at least a pair of test pads 212 and a connection line 214, wherein the pair of test pads 212 are electrically connected to each other by a connection line 214, as shown in Fig. 2a. In the present embodiment, the pitch ρ of the conductive terminals 132e. 2. The j is substantially the same, as shown in Figure 2B. Therefore, the control unit 134b of the driving device 134 of the present embodiment can cause the entire probe 132 to be measured as shown in the test line laser 2A. Next, the laser repairing device 120 of the present embodiment is used to cut off the test line 21 〇 2 line: r domain) to make the test _
2C中所不。然後，_本實施例之雷射修補裝置⑽ 修補線216以使對測試墊212重新電性連接。^後 :導電端子U2c與測試墊212接觸以量 H ，21〇之阻值R2，如圖2D中所示。將修補後 210之阻值&減去正常測試線路2ι〇之阻值尺卽”: 步估算出修補線216之阻值R。藉由即時監控此修補 之阻…否正常，即可判斷本實施例之雷二線= 201215977 AU1004041 35648twf.doc/n 100之修補功能是否正常，進而可降低因雷射修補機台100 機台狀況異常而導致修補失敗之絲元件_基板20 留至後段製程中的機率。 此外，本實施例之導電端子132c可有多種變化，例 如可為圖3中之&、1)1、（1、6、£所示之不同形狀及大小 的配置，但本發明並不以此為限。 另外，本實施例之探針座132b可為一可拆卸式探針 座。當待修補之主動元件陣列基板200上的對測試墊212 其間距Pt改變時，可將此探針座132b拆下，換上導電端 子132c之間距Pc與對測試塾212之間距pt相同的探針座 132b ’以使量測修補線216阻值R之動作可順利地進行。 然，本發明不限於此，在本發明之另一實施例中，探針座 132b之導電端子132c的間距Pe可透過調整螺絲132d來調 整(如圖4A所示），使得導電端子132c的間距匕與對測試 塾212之間距Pjg同’以使量測修補線216的阻值r之動 作可順利地進行。 在本發明之再一實施例中，探針座132b亦可為一可 旋轉式探針座(如圖4B所示）’此可旋轉式探針座132b可 相對於底座132a旋轉，此可旋轉式探針座132b旋轉後如 圖4B之右上方所示，而可旋轉式探針座132b之上視圖如 圖4B之右下方所示。當待修補之主動元件陣列基板2〇〇 上的測試墊212之排列方向改變時，吾人可將可旋轉式探 針座132b旋轉而使導電端子132c的排列方向與測試墊 212排列方向一致，以使量測修補線216的阻值R之動作 可順利地進行。 201215977 AU1004041 35648twf.d〇c/n 撼所述，本發明之雷射修補機台藉由其上之阻值量 即時地監控其修補魏是否發生異常，進而辦進 雷射修補機台的修補㈣。 运而增進 雖然本發明已以實施例揭露如上，然其 :=:==r識者，在不二 發明之保護範圍當“二本 【圖式簡單說明】 ^為本發明—實施例之雷射修補機台 測試本發明—實施例之 =為本發明—實施例之導電端子示意圖。 、圖犯為本發明-實施例之探針座示意圖。 【主要元件符號說明】 1〇〇:雷射修補機台 110:載台 12〇.雷射修補裝置 130 :阻值量測裝置 132 :探針 132a :底座 132b .探針座 132c :導電端子 201215977 AU1004041 35648twf.doc/n 132d :調整螺絲 134 :驅動裝置 134a :步進馬達 134b :控制單元 136 :電表 200 :主動元件陣列基板 210 :測試線路 212 :測試墊 214 :連接線路 216 :修補線Not in 2C. Then, the laser repairing device (10) of the present embodiment repairs the wire 216 to reconnect the test pad 212 electrically. ^ After: The conductive terminal U2c is in contact with the test pad 212 for an amount H, 21 〇 of resistance R2, as shown in Fig. 2D. After the repaired 210 resistance value & minus the normal test line 2 〇 阻 resistance 卽 : : : : : : : : : : : : : : 修补 修补 修补 修补 修补 修补 修补 修补 修补 修补 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 The lightning protection of the second line of the embodiment = 201215977 AU1004041 35648twf.doc/n 100 is normal, and the wire component _substrate 20 which is repaired due to abnormal condition of the laser repairing machine 100 is reduced to the rear stage process. In addition, the conductive terminals 132c of the present embodiment may have various changes, for example, the configurations of different shapes and sizes shown in &, 1)1, (1, 6, and FIG. 3 in FIG. 3, but the present invention In addition, the probe base 132b of the embodiment may be a detachable probe base. When the pitch Pt of the test pad 212 on the active device array substrate 200 to be repaired is changed, The probe holder 132b is removed, and the probe holder 132b' having the same distance Pc from the conductive terminal 132c and the distance pt between the test pads 212 is replaced, so that the action of measuring the repair line 216 with the resistance value R can be smoothly performed. The present invention is not limited thereto, and in another embodiment of the present invention The pitch Pe of the conductive terminals 132c of the probe holder 132b can be adjusted through the adjusting screw 132d (as shown in FIG. 4A), so that the pitch 导电 of the conductive terminals 132c is the same as the distance Pjg between the test pads 212 to make the repairing line 216 The action of the resistance value r can be smoothly performed. In still another embodiment of the present invention, the probe holder 132b can also be a rotatable probe holder (as shown in FIG. 4B) 'this rotatable probe holder 132b is rotatable relative to the base 132a. The rotatable probe base 132b is rotated as shown in the upper right of FIG. 4B, and the upper view of the rotatable probe base 132b is as shown in the lower right of FIG. 4B. When the arrangement direction of the test pads 212 on the active device array substrate 2 is changed, the rotatable probe holder 132b can be rotated to make the arrangement direction of the conductive terminals 132c coincide with the direction in which the test pads 212 are arranged to make the measurement. The action of the resistance value R of the repairing line 216 can be smoothly performed. 201215977 AU1004041 35648twf.d〇c/n 撼 The laser repairing machine of the present invention instantly monitors whether the repairing Wei is performed by the amount of resistance thereon. An abnormality occurred, and then the laser repair machine was set up. Repair (4). Although the present invention has been disclosed above by way of example, it is: =:==r, in the scope of protection of the invention, "two copies of the drawing" is the invention - the embodiment The laser repairing machine test of the present invention - the embodiment is the schematic diagram of the conductive terminal of the present invention - the embodiment is the schematic diagram of the probe base of the present invention - the main component symbol description 1 Laser repairing machine 110: stage 12 雷. laser repairing device 130: resistance measuring device 132: probe 132a: base 132b. probe holder 132c: conductive terminal 201215977 AU1004041 35648twf.doc/n 132d: adjusting screw 134: driving device 134a: stepping motor 134b: control unit 136: electric meter 200: active device array substrate 210: test line 212: test pad 214: connection line 216: repair line
Pc、Pt :間距Pc, Pt: spacing