TW201219926A - Backlight unit - Google Patents

Backlight unit Download PDF

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Publication number
TW201219926A
TW201219926A TW100130266A TW100130266A TW201219926A TW 201219926 A TW201219926 A TW 201219926A TW 100130266 A TW100130266 A TW 100130266A TW 100130266 A TW100130266 A TW 100130266A TW 201219926 A TW201219926 A TW 201219926A
Authority
TW
Taiwan
Prior art keywords
light
backlight unit
guide plate
light guide
microstructure
Prior art date
Application number
TW100130266A
Other languages
Chinese (zh)
Other versions
TWI596407B (en
Inventor
Kyoung-Jong Yoo
Kyoung-Soo Ahn
Sang-Jun Park
Original Assignee
Lg Innotek Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lg Innotek Co Ltd filed Critical Lg Innotek Co Ltd
Publication of TW201219926A publication Critical patent/TW201219926A/en
Application granted granted Critical
Publication of TWI596407B publication Critical patent/TWI596407B/en

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133606—Direct backlight including a specially adapted diffusing, scattering or light controlling members
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0013—Means for improving the coupling-in of light from the light source into the light guide
    • G02B6/0015—Means for improving the coupling-in of light from the light source into the light guide provided on the surface of the light guide or in the bulk of it
    • G02B6/002—Means for improving the coupling-in of light from the light source into the light guide provided on the surface of the light guide or in the bulk of it by shaping at least a portion of the light guide, e.g. with collimating, focussing or diverging surfaces
    • G02B6/0021—Means for improving the coupling-in of light from the light source into the light guide provided on the surface of the light guide or in the bulk of it by shaping at least a portion of the light guide, e.g. with collimating, focussing or diverging surfaces for housing at least a part of the light source, e.g. by forming holes or recesses
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133603—Direct backlight with LEDs
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0033—Means for improving the coupling-out of light from the light guide
    • G02B6/005—Means for improving the coupling-out of light from the light guide provided by one optical element, or plurality thereof, placed on the light output side of the light guide
    • G02B6/0055—Reflecting element, sheet or layer
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133611—Direct backlight including means for improving the brightness uniformity

Landscapes

  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Planar Illumination Modules (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Abstract

Provided is a backlight unit. The backlight unit includes a light guide plate, a plurality of side emitting type light emitting devices, a PCB (printed circuit board), and a reflection plate. The light guide plate includes a plurality of grooves. The side emitting type light emitting devices are inserted in the grooves, respectively. The side emitting type light emitting devices are disposed on the PCB. The reflection plate is disposed between the light guide plate and the PCB.

Description

201219926 ‘ 六、發明說明： 【發明所屬之技術領域】 本發明主張於2010年09月03日所申請之韓國專利申請案號 10-2010-0086258的優先權’此全文將併入本案以作為參考。 本發明係關於一種背光單元。 【先前技術】 冷陰極螢光燈(cold cathode fluorescent lamps)，因其低 ❹廉的價格及易組裝之特性，被廣泛地使用作為LCD之背光光源。 然而’冷陰極螢光燈亦具有其缺點’例如汞相關之環境問題、低 反應時間、以及色彩重現能力不足等。 肇因於冷陰極螢光燈之上述缺陷’發光二極體(LEDs)被使用 作為背光光源。 近來，許多針對使用LE1D為光源之背光單元的研究紛紛在進 行，且此配置之背光單元的生產亦顯著增加。 C) 背光單元可分為侧光式（edge type)背光單元與直下式 (direct type)背光單元。在侧光式背光單元中，光是入射於一導 光板之一侧，且係經由該導光板之頂面，被導引至一面板。 而在直下式背光單元中，一 LED係被設置於一擴散片之一背 侧’且自LED發出之光係經由該擴散片被提供給一面板。 雖然側光式背光單元可輕易地被製造為輕薄的形狀，但其在 一 LCD面板的尺寸較大的情況下，很難確保光均勻度。 4 201219926 ^ 另-方面’雖然直下式背光單元可以輕易地製作為大尺寸， 但因- LED與-擴散片間的距離所致，直下式背光單元很難被製 作為薄型。 【發明内容】 本發明之實施例提供—種背光單元，其係包括—較薄的導光 板。 在一實施例中，一種背光單元係包括：一導光板(lightguide f) plate)包含複數個溝槽(grooves);複數個侧面發光型發光裝置 (side emitting type light emitting devices)分別插入於該些 溝槽内’ 一印刷電路板(printed circuh board ’ PCB)，其上設 置有該些侧面發光型發光裝置；以及一反射板(reflecti〇nplate) 於該導光板與該印刷電路板之間。 本發明之一個或多個實施例將詳細敘述於下附圖示及說明 Q 中。其他特徵可見於本發明之圖示及說明，以及申請專利範圍内。 【實施方式】 在下文中，將根據本發明之實施例配合圖示詳細描述與說明 本發明之揭示内容與實例。 圖1係根據一實施例，繪示有一背光單元之剖面圖。 本發明實施例之背光單元係包括：一導光板100，其中形成有 複數個溝槽110;複數個側面發光型發光裝置310分別插入於溝槽 5 201219926 110内；一印刷電路板300，其上設置有側面發光型發光裝置31〇 ; 以及一反射板320設置於導光板1〇〇與印刷電路板3〇〇之間。 導光板100可由一透明材料形成。舉例而言，導光板1〇〇可 由壓克力樹脂基材料(acrylic resin-based material)其中一者 形成，例如：熱塑性樹脂(polymethylmethacrylate，PMMA)、一 聚乙烯對苯二甲酸酯（polyethylene terephthlate，PET)樹脂、 一聚碳酸酯（poly carbonate，PC)樹脂、及一聚萘二甲酸乙二醇 0 酯（Polyethylene naphthalate，PEN)樹脂。 側面發光型發光裝置310可包括發光二極體（iight emitting diodes ， LEDs)。 該LED可為能夠發出紅、藍、綠及白光其中至少一者之彩色201219926 ' VI. EMBODIMENT DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention claims priority to Korean Patent Application No. 10-2010-0086258, filed on Sep. 3, 2010, the entire disclosure of which is hereby incorporated by reference. . The present invention relates to a backlight unit. [Prior Art] Cold cathode fluorescent lamps are widely used as backlight sources for LCDs because of their low cost and ease of assembly. However, 'cold cathode fluorescent lamps also have their disadvantages' such as mercury-related environmental problems, low reaction time, and insufficient color reproduction ability.上述 Due to the above-mentioned defects of cold cathode fluorescent lamps, light-emitting diodes (LEDs) are used as backlight sources. Recently, many studies have been conducted on backlight units using LE1D as a light source, and the production of backlight units in this configuration has also increased significantly. C) The backlight unit can be classified into an edge type backlight unit and a direct type backlight unit. In the edge-lit backlight unit, light is incident on one side of a light guide plate and guided to a panel via a top surface of the light guide plate. In the direct type backlight unit, an LED is disposed on the back side of one of the diffusion sheets, and light emitted from the LED is supplied to a panel via the diffusion sheet. Although the edge-lit backlight unit can be easily fabricated into a thin and light shape, it is difficult to ensure light uniformity in the case where the size of an LCD panel is large. 4 201219926 ^ Another aspect] Although the direct type backlight unit can be easily fabricated into a large size, the direct type backlight unit is difficult to be made thin due to the distance between the LED and the diffusion sheet. SUMMARY OF THE INVENTION Embodiments of the present invention provide a backlight unit that includes a thinner light guide plate. In one embodiment, a backlight unit includes: a light guide f) plate including a plurality of grooves; a plurality of side emitting type light emitting devices are respectively inserted into the light guides a printed circuit board (PCB) on which a side-emitting type light-emitting device is disposed; and a reflective plate between the light-guiding plate and the printed circuit board. One or more embodiments of the present invention will be described in detail in the following figures and descriptions. Other features can be found in the drawings and description of the invention, as well as in the scope of the claims. [Embodiment] Hereinafter, the disclosure and examples of the present invention will be described and illustrated in detail in accordance with the embodiments of the present invention. 1 is a cross-sectional view of a backlight unit, in accordance with an embodiment. The backlight unit of the embodiment of the present invention comprises: a light guide plate 100, wherein a plurality of trenches 110 are formed; a plurality of side-emitting illumination devices 310 are respectively inserted in the trenches 5 201219926 110; a printed circuit board 300 thereon A side-emitting type light-emitting device 31A is disposed; and a reflection plate 320 is disposed between the light guide plate 1A and the printed circuit board 3''. The light guide plate 100 may be formed of a transparent material. For example, the light guide plate 1 may be formed of one of an acrylic resin-based material such as a thermoplastic resin (PMMA) or a polyethylene terephthlate (polyethylene terephthlate). , PET) resin, a polycarbonate (PC) resin, and a polyethylene naphthalate (PEN) resin. The side-emitting type light-emitting device 310 may include iight emitting diodes (LEDs). The LED can be a color capable of emitting at least one of red, blue, green, and white light

LED，或可為紫外光(ultraviolet，UV) UD。舉例而言，彩色LED 可包括紅、藍、綠及白色LED之組合。彩色LED之配置與光的類 〇型可在本發明實施例之技術範圍内做變動。 側面發光型發光裝置310可以其中設置有LED之封裝形式提 供。 設置有侧面發光型發光裝置31〇之印刷電路板300可被設置 於導光板100之下方。 印刷電路板300可為一金屬芯印刷電路板(metal core PCB， MCPCB)、一 FR-4印刷電路板、一典型之一般印刷電路板、一軟性 201219926 印刷電路板mexible PCB，FPCB)、或一陶究電路板。然而，印 刷電路板3GG並不限制於此，而是可在本發明實施例之技術範圍 内作為任何其他種類的印刷電路板。 在本實施例之背光單元巾，溝槽U〇柄自地形成於導光板 100之底面，且勤發光型發光裝置31G係分職人於溝槽110 之中。 反射板320係被設置於導光板1〇〇與印刷電路板3〇〇之間。 反射板320可由包括銀或鋁之合金來形成。 另外，黏著層321、322可被設置於反射板320之頂側及底側， 以將反射板320接合至導光板1〇〇與印刷電路板3〇〇。 黏著層321、322係包括一第一黏著層321於導光板1〇〇與印 刷電路板300之間’以及一第二黏著層322於印刷電路板300與 反射板320之間。 Ο 黏著層321、322可由一透明材料例如一環氧樹脂（epoxy resin)或一石夕基樹脂(siHcon_based resin)來形成。 一凹凸微結構(pattern) 101可被設置於導光板100之底面上 第一黏著層321接合處，以在光入射於導光板1〇〇上時提升導光 板 100 之光釋放效率（light discharge efficiency)。 微結構101係被設置於導光板100上未形成溝槽110之一區 域上’且微結構101不比溝槽110更深。 7 201219926 根據本實施例之背光單元中，因側面發光型發光裝置310係 分別被設置於導光板100之溝槽110中，故導光板100之厚度可 被縮小。 另，在本實施例之背光單元中，因溝槽110係均勻地沿著導 光板100配置，且侧面發光型發光裝置310係分別被設置於溝槽 110中，故均勻的光可自導光板1〇〇被釋放。 圖2係根據另一實施例’繪示有一背光單元之剖面圖。 0 在本實施例之背光單元中，獨立的遮光反射微結構7〇〇 (light shield reflection patterns)係被設置於一導光板 1〇〇 之一出光面（頂面）上，對應於形成在導光板1〇〇中之溝槽11〇 處’如圖2所示。 遮光反射微結構700係被設置於導光板100之出光表面上， 自溝槽110中之側面發光型發光裝置31〇發出之光束被匯聚而產 Ο 生亮點（hot spots)之處。 也就疋說，遮光反射微結構7〇〇係被排列於導光板丨⑼之頂 面上，在部分的遮光反射微結構7〇〇與溝槽11〇沿著自侧面發光 型發光裝置310發出之光的光路徑交疊之處。 遮光反射微結構·可為白色塗覆微結構或金屬微結構。 也就疋況，在本實施例之背^單元中’遮光反射微結構 係被.又置於V光板1GG之出絲面上，對應於形成在導光板1〇〇 8 201219926 中之溝槽110、自細發光型發絲置31G發出之光束被匯聚之 處，以阻止光在該處匯聚。因此，本實施例之背光單元可減少亮 點並避免凴度不均（brightness irregularity)的情況。 在本實施例之背光單元中，遮光反射微結構7⑽係反射侧面 發光型發光裝置310發出之光。然後，被反射的光沿著導光板 中各路徑前進，並被釋放至導光板1〇〇外。因此，自導光板1〇〇 所放出之光束的均勻度可被改善。 C3 圖3係繪示有其他實施例之背光單元之一比較例的剖面圖； 圖4係繪示有說明其他實施例之背光單元之比較例之光前進路徑 之剖面圖；圖5係繪示有說明其他實施例之背光單元之光前進路 徑之剖面圖。 如圖3、4所示，在其他實施例之背光單元之比較例中，遮光 反射微結構700並未被被設置於導光板1〇〇之頂面上。 〇 在比較例中，自側面發光型發光裝置310發出之光束在光束 經由空氣層及導光板100前進後’被匯聚於靠近側面發光型發光 裝置310之區域。因此，亮點會發生於該區域。 也就是說，如圖4所示，自侧面發光型發光裝置310發出之 光束A、B係經由一空氣層入射於導光板1〇〇之上，並通過一區域 K被釋放至外界。 因此，比較例中被發出之光因亮點而可能具有亮度不均的問 9 201219926 然而，根據其他實施例之背光單元，因為遮光反射微結構7〇〇 係被設置於導光板100之頂面上，故自侧面發光型發光裝置310 發出之光束Al、A2係刚進通過一空氣層與導光板1〇〇，同時在空 氣層與導光板1〇〇被折射。然後，光束A1、A2係被遮光反射微結 構700反射回導光板100。 也就是說，光束Al、A2不會被集中至導光板1〇〇之一特定區 域。據此，當光自背光單元發出，可減少亮點，並可進而避免亮 度不均。 因為反射板320 (參閱圖1)係被設置於導光板之下方， 故反射自遮光反射微結構7〇〇之光可再度被反射至導光板1〇〇。 在下文中，將配合圖6來說明另一實施例。 圖6係根據另一實施例，繪示有一背光單元之剖面圖。 在本實把例之背光單元中，獨立的遮光反射微結構係被 設置於-導光板100之一出光表面（頂面上），對應於形成在導光 板100中之溝槽110處，如圖6所示。 遮光反射微結構700係被設置於導光板ι〇〇之出光表面上， 自溝槽U〇中之側面發光型發光裝置310發出之光束被匯聚而產 生亮點之處。 也就是說，遮光反射微結構700係被排列於導光板1〇〇之頂 201219926 面上，在部分的遮光反射微結構與溝槽11〇沿著自側面發光 型發光裝置310發出之光的光路徑交疊之處。 遮光反射微結構700可為白色塗覆微結構或金屬微結構。 -透明保護層710可被進-步設置於導光板⑽之頂面上， 以覆蓋遮光反射微結構觸。透明保護層71G可由一折射率低於導 光板100之折射率的透明樹脂形成。 在本實施例之背光單元中’遮光反射微結構雇係被設置於 〇 、 導光板100之出光表面上，對應於形成在導光板1〇〇中之溝槽 110、自側面發光型發光裝置310發出之光束被匯聚之處，以阻止 光匯聚在該處。因此，本實施例之背光單元可減少亮點並避免亮 度不均的情況。 如上所述，因為發光裝置係被設置於導光板之溝槽中，故可 將導光板之厚度縮小。 〇 另，在本發明之背光單元中，因溝槽係均勻地沿著導光板配 置’且發光裝置係分別被設置於溝槽中’故均勻的光可自導光板 被釋放。 另，在本發明之背光單元中，遮光反射微結構係被設置於導 光板之出光表面上，對應於形成在導光板中之溝槽、自侧面發光 型發光裝置發出之光束被匯聚之處’以阻止光匯聚在該處。因此， 背光單元可減少亮點並避免亮度不均的情況。 11 201219926 又在本發明之背光單元中，自側面發光型發光裝置發出之 光束係被遮歧射微結構反射，然後被反㈣光沿著導光板中各 路徑前進，並被釋放至導歧外。因此，自導光板所放出之光束 的均勻度可被改善。 雖然參考實施例之許多說明性實施例來描述實施例，但應理 解，熟習此徽藝者可想出將落人本發明之顧的精神及範嘴内 的眾多其他修改及實施例。更特定言之，在本發明、圖式及所附 申研專利範圍之範疇内，所主張組合配置之零部件及/或配置的各 種變化及修改為可能的。對於熟悉此項技術者而言，除了零部件 及/或配置之變化及修改外，替代用途亦將顯而易見。 【圖式簡單說明】 圖1係根據一實施例，繪示有一背光單元之剖面圖； 圖2係根據另一實施例，繪示有一背光單元之剖面圖； 圖3係繪示有其他實施例之背光單元之一比較例的剖面圖； 圖4係繪示有說明其他實施例之背光單元之比較例之光前進路徑 之剖面圖； 圖5係繪示有說明其他實施例之背光單元之光前進路徑之剖面 圖；以及 圖6係根據另一實施例，繪示有一背光單元之剖面圖。 12 201219926 【主要元件符號說明】 100 導光板 101 微結構 110 溝槽 300 印刷電路板 310 發光裝置 320 反射板 32 卜 322 黏著層 700 微結構 710 保護層 A、B、Al、A2 光束 K 區域LED, or can be ultraviolet (UV) UD. For example, a color LED can include a combination of red, blue, green, and white LEDs. The arrangement of the color LEDs and the type of light can be varied within the technical scope of the embodiments of the present invention. The side-emitting type light-emitting device 310 can be provided in a package form in which an LED is provided. The printed circuit board 300 provided with the side-emitting type light-emitting device 31 can be disposed under the light guide plate 100. The printed circuit board 300 can be a metal core PCB (MCPCB), a FR-4 printed circuit board, a typical general printed circuit board, a soft 201219926 printed circuit board mexible PCB (FPCB), or a Pottery board. However, the printed circuit board 3GG is not limited thereto, but can be used as any other kind of printed circuit board within the technical scope of the embodiment of the present invention. In the backlight unit of the present embodiment, the groove U shank is formed on the bottom surface of the light guide plate 100 from the ground, and the dimming light-emitting device 31G is divided into the groove 110. The reflection plate 320 is disposed between the light guide plate 1A and the printed circuit board 3A. The reflection plate 320 may be formed of an alloy including silver or aluminum. In addition, the adhesive layers 321, 322 may be disposed on the top side and the bottom side of the reflective plate 320 to bond the reflective plate 320 to the light guide plate 1 and the printed circuit board 3. The adhesive layer 321, 322 includes a first adhesive layer 321 between the light guide plate 1 and the printed circuit board 300 and a second adhesive layer 322 between the printed circuit board 300 and the reflective plate 320.黏 The adhesive layers 321, 322 may be formed of a transparent material such as an epoxy resin or a siHcon_based resin. A concave-convex microstructure 101 may be disposed on the bottom surface of the light guide plate 100 at the junction of the first adhesive layer 321 to enhance light discharge efficiency of the light guide plate 100 when light is incident on the light guide plate 1 ). The microstructure 101 is disposed on a region of the light guide plate 100 where the trench 110 is not formed and the microstructure 101 is not deeper than the trench 110. In the backlight unit of the present embodiment, since the side light-emitting type light-emitting devices 310 are respectively disposed in the grooves 110 of the light guide plate 100, the thickness of the light guide plate 100 can be reduced. In the backlight unit of the present embodiment, since the trenches 110 are uniformly disposed along the light guide plate 100, and the side light emitting type light emitting devices 310 are respectively disposed in the trenches 110, the uniform light can be self-guided. 1〇〇 was released. Figure 2 is a cross-sectional view showing a backlight unit according to another embodiment. In the backlight unit of the embodiment, the light shielding reflection patterns are disposed on one of the light-emitting surfaces (top surface) of the light guide plate 1 , corresponding to the formation of the light guide surface The groove 11' in the light plate 1' is shown in Fig. 2. The light-shielding reflective microstructures 700 are disposed on the light-emitting surface of the light guide plate 100, and the light beams emitted from the side-emitting light-emitting devices 31 in the trenches 110 are concentrated to produce hot spots. That is to say, the light-shielding reflective microstructure 7 is arranged on the top surface of the light guide plate 9 (9), and a part of the light-shielding reflective microstructure 7 〇〇 and the groove 11 〇 are emitted along the self-side illumination type light-emitting device 310. The light path of the light overlaps. Shading reflective microstructures can be white coated microstructures or metal microstructures. In other words, in the back unit of the embodiment, the 'light-shielding reflective microstructure is placed on the exit surface of the V-plate 1GG, corresponding to the trench 110 formed in the light guide plate 1〇〇2012201226. The light beam emitted from the fine-emitting hairline 31G is concentrated to prevent light from converge there. Therefore, the backlight unit of the present embodiment can reduce the number of bright spots and avoid the case of brightness irregularity. In the backlight unit of this embodiment, the light-shielding reflective microstructure 7 (10) reflects the light emitted from the side-light-emitting type light-emitting device 310. Then, the reflected light proceeds along each path in the light guide plate and is released to the outside of the light guide plate 1. Therefore, the uniformity of the light beam emitted from the light guide plate 1 can be improved. 3 is a cross-sectional view showing a comparative example of a backlight unit of another embodiment; FIG. 4 is a cross-sectional view showing a light advancement path of a comparative example of a backlight unit of another embodiment; FIG. There is a cross-sectional view showing the light advancement path of the backlight unit of the other embodiment. As shown in Figs. 3 and 4, in the comparative example of the backlight unit of the other embodiment, the light-shielding reflective microstructure 700 is not disposed on the top surface of the light guide plate 1A. In the comparative example, the light beam emitted from the side light-emitting type light-emitting device 310 is concentrated in a region close to the side-light-emitting type light-emitting device 310 after the light beam is advanced through the air layer and the light guide plate 100. Therefore, bright spots will occur in this area. That is, as shown in Fig. 4, the light beams A and B emitted from the side light-emitting type light-emitting device 310 are incident on the light guide plate 1 through an air layer, and are released to the outside through a region K. Therefore, the emitted light in the comparative example may have brightness unevenness due to the bright spot. 9 201219926 However, according to the backlight unit of other embodiments, since the light-shielding reflective microstructure 7 is disposed on the top surface of the light guide plate 100 Therefore, the light beams A1 and A2 emitted from the side light-emitting type light-emitting device 310 are newly passed through an air layer and the light guide plate 1 while being refracted in the air layer and the light guide plate 1 . Then, the light beams A1, A2 are reflected back to the light guide plate 100 by the light-shielding reflective microstructures 700. That is, the light beams A1, A2 are not concentrated to a specific area of the light guide plate 1''. Accordingly, when light is emitted from the backlight unit, bright spots can be reduced, and uneven brightness can be prevented. Since the reflecting plate 320 (see FIG. 1) is disposed under the light guiding plate, the light reflected from the light-shielding reflecting microstructure 7 can be reflected again to the light guiding plate 1〇〇. In the following, another embodiment will be explained in conjunction with FIG. 6. FIG. 6 is a cross-sectional view showing a backlight unit according to another embodiment. In the backlight unit of the present embodiment, the independent light-shielding reflective microstructure is disposed on one of the light-emitting surfaces (top surface) of the light guide plate 100, corresponding to the groove 110 formed in the light guide plate 100, as shown in the figure. 6 is shown. The light-shielding reflective microstructures 700 are disposed on the light-emitting surface of the light guide plate, and the light beams emitted from the side-emitting light-emitting devices 310 in the trenches U are concentrated to produce bright spots. That is to say, the light-shielding reflective microstructures 700 are arranged on the top of the light-receiving plate 1 2012 201219926, and the light is emitted from the light-emitting reflective microstructures and the grooves 11 〇 along the light emitted from the side-emitting light-emitting device 310. Where the paths overlap. The light-shielding reflective microstructures 700 can be white coated microstructures or metal microstructures. The transparent protective layer 710 can be further disposed on the top surface of the light guide plate (10) to cover the light-shielding reflective microstructure touch. The transparent protective layer 71G may be formed of a transparent resin having a refractive index lower than that of the light guide plate 100. In the backlight unit of the embodiment, the light-shielding reflective microstructure is disposed on the light-emitting surface of the 〇 and the light guide plate 100, corresponding to the trench 110 formed in the light guide plate 1 , and the self-side illumination type light-emitting device 310 Where the emitted beams are concentrated to prevent light from converge there. Therefore, the backlight unit of the present embodiment can reduce the bright spots and avoid uneven brightness. As described above, since the light-emitting device is disposed in the groove of the light guide plate, the thickness of the light guide plate can be reduced. Further, in the backlight unit of the present invention, since the grooves are uniformly disposed along the light guide plate and the light-emitting devices are respectively disposed in the grooves, uniform light can be released from the light guide plate. In addition, in the backlight unit of the present invention, the light-shielding reflective microstructure is disposed on the light-emitting surface of the light guide plate, corresponding to the groove formed in the light guide plate, where the light beam emitted from the side-light-emitting type light-emitting device is concentrated. To stop the light from gathering there. Therefore, the backlight unit can reduce the bright spots and avoid uneven brightness. 11 201219926 In the backlight unit of the present invention, the light beam emitted from the side-emitting type light-emitting device is reflected by the occluded micro-structure, and then the anti-(four) light is advanced along each path in the light guide plate and released to the outside of the guide. . Therefore, the uniformity of the light beam emitted from the light guide plate can be improved. While the embodiments have been described with reference to the preferred embodiments of the embodiments of the present invention, it is understood that those skilled in the art can devise various modifications and embodiments within the spirit and scope of the invention. In particular, various variations and modifications of the components and/or arrangements of the claimed combination are possible in the scope of the invention, the drawings and the scope of the appended claims. For those skilled in the art, alternative uses will be apparent in addition to variations and modifications in parts and/or configurations. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a cross-sectional view showing a backlight unit according to an embodiment; FIG. 2 is a cross-sectional view showing a backlight unit according to another embodiment; FIG. 3 is a view showing another embodiment. FIG. 4 is a cross-sectional view showing a light advancement path of a comparative example of a backlight unit of another embodiment; FIG. 5 is a view showing light of a backlight unit of another embodiment; A cross-sectional view of the advancement path; and FIG. 6 is a cross-sectional view of a backlight unit according to another embodiment. 12 201219926 [Description of main components] 100 Light guide plate 101 Microstructure 110 Groove 300 Printed circuit board 310 Light-emitting device 320 Reflector 32 Bu 322 Adhesive layer 700 Microstructure 710 Protective layer A, B, Al, A2 Beam K area

Claims (1)

201219926 七、申請專利範圍： 1. 一種背光單元包括： 一導光板，包含複數個溝槽； 複數個侧面發光型發光裝置，分別插入於該些溝槽内； 一印刷電路板，其上設置有該些側面發光型發光裝置，·以 及 一反射板於該導光板與該印刷電路板之間。 〇 —2.如申請專利範圍第1項所述之背光單元，其進-步包含有一黏 著層於該導光板與該反射板之間。 3. 如申請專纖圍第丨斯述之f光單元，其進—步包含有一黏 著層於該印刷電路板與該反射板之間。 4. 如申請專利範圍第2項所述之背光單元，其巾該黏著層係由一 透明材料所形成。 〇 5·如申請專利範圍第丨項所述之背光單元，其中—凹陷微結構、 突起微結構、或凹凸微結構系被設置於該導光板之一底面上、 該些溝槽之間的-區域，且該微結構之深度係小於該些溝槽之 深度。 6·如申請專利範圍第i項所述之背光單元，其中該些侧面發光型 發光裝置係一設置有一 LED之封襄。 7·如申請專利範圍第i項所述之背光單元，其中該些溝槽係均勻 14 201219926 … 地排列於該導光板之一底面上。 8·如申請專娜_丨項所述之#光單元，其中該反射板係由包 括銀或銘之一合金形成。 9·如申請專利侧第2項所述之背光單元，其中雜著層係包括 一環氧樹脂或一梦基樹脂。 10. 如申請專利細第丨項所述之背光單元，其進一步包括遮光反 職結構設置於料输之1絲社、職·彡成在該導 歧巾之該些賴處；辑歧射聽構係彼此相隔。 11. 如申請專纖圍㈣項所述之f光單元，其找遮光反射微結 構係為白色塗覆微結構或金屬微結構。 12. 如申請專·圍第1G項所述之背光單元，其中該遮光反射微結 構係被設置於該導光板之一頂面上，且部分的該遮光反紐結 構係與該些賴沿著自該_發光型發光裝置發出之光的光路 〇 徑交疊。 13. 如申請專利第1G項所述之背光單元，其進—步包括一透明 反射層s又置於該導光板之上，以包覆該遮光反射微結構。 14. 如申請專利細第13項所狀縣單元，其中該咖反射層係 由折射率低於該導光板之折射率的材料形成。 15201219926 VII. Patent application scope: 1. A backlight unit comprises: a light guide plate comprising a plurality of grooves; a plurality of side-emitting illumination devices respectively inserted in the grooves; a printed circuit board on which is disposed The side-emitting type light-emitting device, and a reflector are disposed between the light guide plate and the printed circuit board. The backlight unit of claim 1, wherein the step further comprises an adhesive layer between the light guide plate and the reflector. 3. If the application is directed to the F-light unit of Dijon, the further step comprises an adhesive layer between the printed circuit board and the reflector. 4. The backlight unit of claim 2, wherein the adhesive layer is formed of a transparent material. The backlight unit of claim 2, wherein the recessed microstructure, the protruding microstructure, or the concave and convex microstructure is disposed on a bottom surface of the light guide plate, between the trenches - a region, and the depth of the microstructure is less than the depth of the trenches. 6. The backlight unit of claim i, wherein the side-emitting illumination devices are provided with a LED package. 7. The backlight unit of claim i, wherein the trenches are uniformly arranged on a bottom surface of the light guide plate. 8. The light unit according to the application of the invention, wherein the reflector is formed of an alloy comprising silver or one of the alloys. 9. The backlight unit of claim 2, wherein the hybrid layer comprises an epoxy resin or a dream base resin. 10. The backlight unit according to the application of the third aspect of the invention, further comprising a shading anti-service structure disposed in the material of the silk fabric, and the position of the employee in the guide towel; The structures are separated from each other. 11. If the f-light unit described in item (4) of the special fiber is applied, the light-reflecting micro-structure is a white-coated microstructure or a metal microstructure. 12. The backlight unit of claim 1 , wherein the light-shielding reflective microstructure is disposed on a top surface of the light guide plate, and a portion of the light-shielding reverse structure is along the The paths of the light emitted from the light-emitting type light-emitting device overlap. 13. The backlight unit of claim 1G, further comprising a transparent reflective layer s disposed on the light guide plate to encapsulate the light-shielding reflective microstructure. 14. The county unit as claimed in claim 13 wherein the coffee reflective layer is formed of a material having a refractive index lower than a refractive index of the light guide plate. 15
TW100130266A 2010-09-03 2011-08-24 Backlight unit TWI596407B (en)

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CN111830622A (en) * 2019-04-16 2020-10-27 艾欧史密斯(中国)热水器有限公司 Panel assembly and manufacturing method, household appliance
CN113031347A (en) * 2021-03-29 2021-06-25 武汉华星光电技术有限公司 Backlight module and display device

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