201225450 六、發明說明： 【發明所屬之技術領域】 本發明係有關於-種散熱殼體結構，尤其是—種具有導熱件 埋置於本體内的散熱殼體結構。 【先前技術】 電源轉接器(adapter)與電源供應器哪州係為各式電 器設備或資訊產品運作日林可或缺的奸裝置。眾所皆知的是， 這些電子裝置祕_之魏板上轉有許多電子元件，包辟 發熱元件(例如MU、金騎化半導_效電晶體、二極體、電 感等)以及低發熱元件(例如電容器或電阻器）。當電子裝置運作 B夺’上述些電子讀會各概生神不等的熱量，触這些熱 量無法有效地婦至外界或作—適讀移，聽多的缝將逐|軒 累積，而使得電子裝肋部之軒元件轉，進而引起電子裝置 失去運作功能。 承以電源轉接H為例，其可將外部f源整流、㈣後提供電 力於電器設備，例如可攜式電腦，直接使用或供其充電電池進行 充電。然*，隨著積體電路的積集化，電轉接S的黯亦同步 縮小’伴隨而生的是其體積縮小所衍生之散熱問題愈形嚴重。 舉例而δ，當電源轉接器内部之電路板上的高發熱元件，由 於工作而發熱’進而；丨起功率密度過於集中時，傳統之電源轉接 益係由塑賴質之上下殼體所組合，不僅不易傳導出熱量，使得 熱量無法被有效逸散’更容易造成外部殼體局部溫度過高的問 201225450 題。對使用者Μ，彼可能會體外表面之局部高溫而造成费 傷:引起安全上的疑慮。其次，傳狀電源轉接料殼體多存在 有單上m度過一問題，制者在操作或觸摸電源轉_時，人 員在溫度_覺上會更加鮮、，如此將造成錢者於操作上的不 適感。 、目此’ f知電子打若要解糾上溫度造成人體之不舒適 感’則會在殼體_貼附或噴塗導熱物質(例如··邮、銅羯、氮 •化轉），以降低殼體溫度。但是，此種改善效果有限，而且需要 考慮到導熱物質與電子裝置的絕緣。另外，此種製程亦相當繁複， 在無形中造成人力成本的增加。 、是以’如何提供—種可將電子裝置卫作時所產生的熱能，快 逮均勻散逸之散熱殼體結構，實為_技術領域者目前迫切需要 解決的問題。 【發明内容】 Φ ^於以上的問題，本發明在於提供一種散熱殼體結構，藉以 解決習用電子t置内部的發熱元個熱源過度針，進而造成電 -子裝置殼體之局部高溫的問題。 . 本發明係有關於—種散熱殼體結構，適用於-電子裝置，其 電子裝^具有-電路板，且電路板上設置有減個電子零組 件，包含高發熱元件和低發熱元件。 本土明之赖殼體結構包括—本體以及 係以絕緣材料所製成，導熱件的材料，其導熱係數係高 201225450 材料的導熱係數。本體⑽具有—容置空間。電路板係裝設於容 置二門申本體具有相對的一内側面及一外側面，内側面係鄰近 於電路板&置。導熱倾包覆於本翻’且導熱件伽置於内侧 面’、卜侧面m °電路板上之電子零組件所產生的熱能係經由内 側面傳遞至導熱件’熱能婦導並均自地散佈JL導熱件中，之後 位於導熱件巾的熱能再經由外細均勻逸散。 本發明之功效在於，該散熱殼聽獅獅導齡埋置在絕 緣本體中-起射出成型，並且藉由在本體各側壁之_面與外側 面之間埋置導熱件’麟電子裝置之熱能可藉由賴件先均勾散 佈至成體之各側壁，然後再將熱能透過殼體外側面散逸，以達到 均勻散熱之效。. 本發明之另-功效在於，該散熱殼體結構本身即具絕緣效 果，在無綱外加緣構件的前提下，即可達赌止電子裝置 於耐制試(Hi彻㈣時失敗之效用，並且同時減少絕緣構件的 使用，有效節省製作成本。 ^發明之又—功效在於，該散熱鋪結構之導齡係埋置在 祕A制，藉此可有效增加f子裝置讀體強度。 以上«於本發_内容_，細下的實施方式係用以示 乾與解釋本㈣的雜麟理，並域供本發翻申請範圍 _，本發日_徵、實作與功效，_合圖式 作較佳貫施例詳細說明如下。 【實施方式】 「第1 圖」與第2圖」係分別為根據本發明第—實施例之 201225450 散熱殼體結構之分解示意圖與剖面側視圖。根據本發明實施例之 散熱设體結構可適用於一電子裝置，並且利用本發明之散熱殼體 結構取代一般電子裝置的塑膠殼體，以使該電子裝置之殼體溫度 得以均勻散佈，以避免局部溫度過高的情況產生。 其中，電子裝置之種類並非用以限定本發明之發明範圍，舉 例而§，電子裝置可以是電源轉接器(adapter)、電源供應器❻〇wer supply)或變壓器(transformer)等’皆可用以實現本發明之功效。唯 • 以下之詳細說明，係以應用於電源轉接器之散熱殼體結構，作為 本發明一較佳實施例之說明，但並非用以限制本發明。 .請參閱「第1圖」’本發明之散熱殼體結構適用於一電子裝置， 此-電子裝置包括有-電路板10、一輸入元件2〇(或稱一次側端) 與-輸出元件30(或稱二次側端）。於本發明之第一實施例中，輸 入元件2G可以是插頭、触與電源_其巾之—，輸丨元件3〇 則根據輸入元件20亦可變化地選自插頭、插座與電源線等其中之 • 一。為便於說明’以下實施例係以插座為輸入元件2〇(意即插座可 外接-電源線輸人市電），且電源線為輸出元件3G(意即透 過電源線可電性連接至-電子設備，例如可攜式電腦)以說明本案 技術。 電路板10上電性設置有複數個電子零組件，電子零組件包含 高發熱元件和低發熱元件（圖中未示），其可以是變壓器 (transformer)、金屬氧化半導體場效電晶體扣他丨欣池 semiconductor field effect transistor，MOSFET)、二極體(diode)、電 201225450 容器(capacitor)、電阻器(resist〇r)或電感([nduct〇r)等其他被動元 件’並不以此為限。當電路板10透過輸入元件2〇供電時，電路 板10上之電子零組件開始工作而產生熱能。 請一併參閱「第1圖」、「第2圖」與「第6A圖」，根據本 發明第一實施例之散熱殼體結構具有一以低導熱係數之絕緣材料 製成的本體，該絕緣材料可以是但不限於塑膠材質。本體具有上 側壁601、下側壁602、左側壁6〇3、右側壁6〇4、連接輸入元件 20之輸入侧壁605以及連接輸出元件3〇之輸出側壁6〇6，並且該 本體為一中空殼體，其可拆解為一上殼體11〇與一下殼體12〇。當 上殼體110與下殼體12G組合在—触，本體之㈣即形成一容 置空間40，電路板1〇即可裝設於容置空間4〇内，而完全地被本 體所罩覆。上设體110與下殼體120各自具有一内側面12與一外 側面14 ’其中内側面12係定義為本體中朝向且鄰近於電路板 之一侧面’而外侧面14則定義為本體上相對於内側面12且與外 界環境接觸之另一側面。 導熱件130係以向於本體之導熱係數的材料所製成，且導旁 件130係被埋置且包覆在本體的上殼體11〇與下殼體⑽中，^ 形狀與上殼體11G和下殼體m —致。其中，導熱件⑽可以身 出成型(mjectionmolding)方式埋置於上殼體ιι〇與下殼體⑽中 抑或是透過額外之製程步驟黏人 /孙邾口於上设體110與下殼體120 ^ ^詳細而言’請i參閱「第2圖」’導熱件⑽係被爽置名 本體各側__ 12與外側面14之間。是以，根據本請 201225450 ’由於導齡13—本針，並且可藉 間，因此，本發壁的内側面12與外側面14之 子裝置殼《度之構，同時具有可用以增加電 田電路板⑺上之電子额扭作喊生銳…該些孰能即 可 _面12傳遞至導熱件130，再藉由導熱件13〇 ^高導 13〇特:稱w熱傳導辭)將熱驗速料並均勻散佈於導熱件 -中，取後’並以最大散熱面積將該些位於導熱件13〇中的熱能 由卜側面Μ *逸散餅界，藉此有效翻散熱殼體結構均勾散 …及均溫電子裝置之目的。其中，為達成本發明之目的，導熱件 ⑽的材質較佳地可選自但不限於金屬(例如.紹或銅）、陶究或是石 墨等具有高導熱係數的材料。此外，為達成本發明之目的，導熱 件130的形狀可以是但不限於片狀、波浪狀或其他不規則形狀，、 以有效提南導熱件13〇之散熱面積。 立第3圖」係為根據本發明實施例之上殼體，其熱傳導路徑 之示心圖。其中，該熱傳導路徑亦可適用於下殼體120，唯「第3 圖」係以上殼體UG作為-舉例說明，並仰此為限。 由圖中可見，電路板1〇上之電子零組件因工作而產生之熱能 曰先傳遞至内側面12,由於内側面12相對於導熱件1；3〇係為低導 熱係數的材質’ g此論是高發熱元件或低發熱元件工作所產 生的熱能，皆會先朝向一第一方向(例如往垂直面之z轴方向)緩慢 傳遞至内側面12;至於當熱能自内側面12被傳導到具高導熱係數 之導熱件13〇時’熱能會迅速沿著導熱件13〇之導熱面積而朝向 201225450 第二方向均勻散佈(例如往水平面之χ軸與y軸方向），並且透過導 熱件的大導熱面積及高熱傳導鱗，讓熱能均句散佈，達到 初步局部降溫及均溫的效果；最後，當熱能續自導熱件13〇傳遞 至外側面14時’由於外側面14相對於導熱件13〇亦屬低導熱係201225450 VI. Description of the Invention: [Technical Field] The present invention relates to a heat dissipating housing structure, and more particularly to a heat dissipating housing structure having a heat conducting member embedded in the body. [Prior Art] The power adapter and the power supply unit are various devices for the operation of various types of electrical equipment or information products. It is well known that these electronic devices have many electronic components, such as MU, gold riding semi-conducting transistors, diodes, inductors, etc., and low heat. Component (such as a capacitor or resistor). When the electronic device operates, B won't have the heat of the above-mentioned electronic readings, and the heat that can not be effectively touched by the outside world or the work--reading, the more seams will be accumulated, and the electrons will be made. The ribbed component of the rib is turned, which causes the electronic device to lose its function. Taking the power transfer H as an example, it can rectify the external f source, and (4) provide power to the electrical equipment, such as a portable computer, for direct use or for charging the rechargeable battery. However, with the accumulation of the integrated circuit, the enthalpy of the electrical switching S is also reduced synchronously, which is accompanied by the fact that the heat dissipation problem caused by the reduction in size is more serious. For example, δ, when the high-heating component on the circuit board inside the power adapter, generates heat due to work'; and when the power density is too concentrated, the conventional power-supply switching system is made up of a plastic upper body and a lower casing. The combination, not only is not easy to conduct heat, so that the heat can not be effectively dissipated 'more likely to cause the external temperature of the outer casing is too high. 201225450. For the user, he may cause local high temperature on the outer surface of the body and cause injury: cause safety concerns. Secondly, there is a problem that there is a single m-degree over the single-shaped power supply adapter housing. When the system is operated or touched by the power supply, the personnel will be more fresh in the temperature sense, which will cause the money to operate. Uncomfortable feeling. If you want to solve the problem that the temperature is caused by the human body, you will be attached or sprayed with heat-conducting materials (such as postal code, copper enamel, nitrogen, etc.) to reduce Housing temperature. However, this improvement is limited and requires consideration of the insulation of the thermally conductive material from the electronic device. In addition, such a process is also quite complicated, resulting in an increase in labor costs. It is an urgent need to solve the problem of how to provide the heat-generating energy that can be generated when the electronic device is used for the maintenance of the electronic device. SUMMARY OF THE INVENTION In view of the above problems, the present invention provides a heat-dissipating casing structure for solving the problem that the heat source of the heat generating element inside the conventional electronic device is excessively inserted, thereby causing local high temperature of the casing of the electric device. The present invention relates to a heat-dissipating housing structure suitable for an electronic device, the electronic device having a circuit board, and the circuit board being provided with a reduced electronic component comprising a high heat generating component and a low heat generating component. The local shell structure consists of a body and a material made of insulating material. The material of the heat conducting member has a high thermal conductivity coefficient of 201225450. The body (10) has an accommodation space. The circuit board is mounted on the two-door body having opposite inner and outer sides, and the inner side is adjacent to the circuit board & The thermal energy generated by the electronic components that are thermally coated and covered on the inner side of the heat conducting member and on the side of the m ° circuit board are transmitted to the heat conducting member through the inner side surface and are distributed locally. In the JL heat-conducting member, the heat energy of the heat-conducting material towel is then uniformly dispersed through the outer fine. The effect of the invention is that the heat-dissipating shell is embedded in the insulating body and is formed by injection molding, and the thermal energy of the thermal device is embedded between the surface and the outer side of each side wall of the main body. The heat can be dissipated to the side walls of the body by the hooks, and then the heat energy is dissipated through the outer side of the casing to achieve uniform heat dissipation. Another effect of the present invention is that the heat-dissipating casing structure itself has an insulating effect, and on the premise of no externally-added edge members, the utility of the electronic device in the resistance test (Hi-Chip (4) failure can be achieved. At the same time, the use of the insulating member is reduced, and the manufacturing cost is effectively saved. The invention is further characterized in that the guiding structure of the heat-dissipating structure is embedded in the secret A system, thereby effectively increasing the reading body strength of the f-sub-device. In the present _ content _, the following implementation method is used to show and interpret this (four) of the mixed lining, and the domain for the application of the scope of the application _, the date of the _ levy, implementation and efficacy, _ DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS [Embodiment] "First FIG. 1 and FIG. 2" are respectively an exploded schematic view and a cross-sectional side view of a 201225450 heat dissipation housing structure according to a first embodiment of the present invention. The heat dissipation structure of the embodiment of the present invention can be applied to an electronic device, and the plastic housing of the general electronic device is replaced by the heat dissipation housing structure of the present invention, so that the temperature of the housing of the electronic device can be evenly distributed to avoid locality. The situation is too high. The type of the electronic device is not intended to limit the scope of the invention, for example, §, the electronic device may be a power adapter, a power supply, or a transformer ( Transformers and the like can be used to achieve the effects of the present invention. The following detailed description is based on a heat-dissipating housing structure applied to a power adapter as a description of a preferred embodiment of the present invention, but is not intended to limit the present invention. Please refer to "FIG. 1". The heat-dissipating housing structure of the present invention is suitable for an electronic device. The electronic device includes a circuit board 10, an input component 2 (or primary side) and an output component 30. (or called the secondary side). In the first embodiment of the present invention, the input element 2G may be a plug, a contact power source, and a power supply element, and the input element 3 may be variably selected from the group consisting of a plug, a socket, a power cord, and the like according to the input component 20. • One. For convenience of explanation, the following embodiments use the socket as the input component 2 (meaning that the socket can be externally connected - the power line is input to the mains), and the power line is the output component 3G (ie, the power cable can be electrically connected to the electronic device). , for example, a portable computer) to illustrate the technology of the present invention. The circuit board 10 is electrically disposed with a plurality of electronic components, and the electronic components include a high heat generating component and a low heat generating component (not shown), which may be a transformer, a metal oxide semiconductor field effect transistor, and the like. Xinchi semiconductor field effect transistor (MOSFET), diode (diode), electric 201225450 capacitor (capacitor), resistor (resist〇r) or inductor ([nduct〇r) and other passive components 'not limited to this . When the circuit board 10 is powered through the input component 2, the electronic components on the circuit board 10 begin to operate to generate thermal energy. Referring to "FIG. 1", "FIG. 2" and "FIG. 6A", the heat dissipation housing structure according to the first embodiment of the present invention has a body made of an insulating material having a low thermal conductivity, the insulation The material can be, but is not limited to, a plastic material. The body has an upper side wall 601, a lower side wall 602, a left side wall 6〇3, a right side wall 6〇4, an input side wall 605 connecting the input element 20, and an output side wall 6〇6 connecting the output element 3〇, and the body is a middle The empty casing is detachable into an upper casing 11 〇 and a lower casing 12 〇. When the upper casing 110 and the lower casing 12G are combined, the main body (4) forms an accommodating space 40, and the circuit board 1 〇 can be installed in the accommodating space 4 , and completely covered by the body. . The upper body 110 and the lower housing 120 each have an inner side surface 12 and an outer side surface 14', wherein the inner side surface 12 is defined as being oriented toward and adjacent to one side of the circuit board, and the outer side surface 14 is defined as being substantially opposite to the body. The other side of the inner side 12 that is in contact with the outside environment. The heat conducting member 130 is made of a material that has a thermal conductivity to the body, and the guiding member 130 is embedded and covered in the upper casing 11 〇 and the lower casing (10) of the body, and the shape and the upper casing 11G and lower case m. Wherein, the heat conducting member (10) can be embedded in the upper casing ιι and the lower casing (10) by a mjection molding method, or can be adhered to the upper body 110 and the lower casing 120 through an additional process step. ^ ^ In detail, please refer to "Figure 2". The heat-conducting member (10) is between the __ 12 and the outer side 14 of the body. Therefore, according to the present 201225450 'Because of the lead-in 13-pin, and can be borrowed, therefore, the inner side 12 of the hair wall and the sub-device shell of the outer side 14 have the structure of the degree, and have the utility to increase the electric field circuit. The electronic amount on the board (7) is twisted and shouted. These 孰 can be transferred to the heat-conducting member 130, and then by the heat-conducting member 13 高 ^ high-conducting 13 :: called w heat conduction) will be hot test The material is evenly dispersed in the heat-conducting member-, and the heat energy in the heat-conducting member 13〇 is taken out by the maximum heat-dissipating area, and the heat-dissipating shell structure is effectively detached. ...and the purpose of the uniform temperature electronic device. Among them, in order to achieve the object of the present invention, the material of the heat conductive member (10) is preferably selected from materials having high thermal conductivity such as, but not limited to, metal (e.g., sinter or copper), ceramics, or graphite. In addition, for the purpose of the present invention, the shape of the heat conductive member 130 may be, but not limited to, a sheet shape, a wave shape or other irregular shape to effectively increase the heat dissipation area of the heat conducting member 13 . Fig. 3 is a diagram showing the heat conduction path of the upper casing according to the embodiment of the present invention. The heat conduction path can also be applied to the lower casing 120. The "3rd drawing" is the above-mentioned housing UG as an example, and is limited thereto. As can be seen from the figure, the thermal energy generated by the operation of the electronic components on the circuit board 1 is first transmitted to the inner side surface 12, since the inner side surface 12 is opposite to the heat conducting member 1; 3 is a material with low thermal conductivity. The thermal energy generated by the operation of the high heat generating component or the low heat generating component is first transmitted to the inner side surface 12 in a first direction (for example, in the z-axis direction of the vertical plane); as the heat energy is transmitted from the inner side surface 12 to When the heat-conducting member with high thermal conductivity is 13 ', the thermal energy will rapidly spread along the heat-conducting area of the heat-conducting member 13 toward the second direction of the 201225450 (for example, the y-axis and the y-axis direction of the horizontal plane), and the heat transmitting member is large. The heat-conducting area and the high-heat-conducting scale allow the thermal energy to spread evenly, achieving the effect of initial local cooling and uniform temperature. Finally, when the thermal energy continues to be transmitted from the heat-conducting member 13〇 to the outer side 14, 'because the outer side 14 is opposite to the heat-conducting member 13〇 Low thermal conductivity
數的材質’故熱能係緩慢朝向—第三方向傳遞(例如往垂直面之Z 軸方向)至外側面14,讓熱能在導熱件13〇内更平均地分散。於此， 值得注意的是，本發明係利用熱傳導速率的非等向性(致使熱能傳 導的第-方向相同或不相同於第三方向，唯二者皆需不同於第二 方向），以俾利熱能在導熱件130中時能夠被快速且均勾地散佈， 以實現本發明可達到散熱且均溫電子裝置之功效，並且解決習知 因神密度過高、熱源财針所造成的電子元件職及局部過 熱讓使用者產生不適等問題。 其次，為達成防治電子零組件之電磁干擾(Elect_gneticThe number of materials is such that the thermal energy is slowly oriented - the third direction is transmitted (e.g., in the direction of the Z axis of the vertical plane) to the outer side 14 to allow the heat to be more evenly dispersed within the heat conducting member 13A. Here, it is worth noting that the present invention utilizes the anisotropy of the thermal conduction rate (causing the first direction of thermal energy conduction to be the same or not the same as the third direction, but both need to be different from the second direction). The heat energy can be quickly and uniformly spread in the heat conducting member 130, so as to realize the effect of the heat dissipating and temperature-sensing electronic device of the present invention, and solving the electronic components caused by the high density of the gods and the heat source. Jobs and local overheating cause problems such as discomfort to the user. Secondly, in order to achieve electromagnetic interference prevention and control of electronic components (Elect_gnetic
Merference，EMI)之目的，如「第1圖」與「第2圖」所示之本 發明第-實施例的散熱殼體結構，本體中更可包含有至少一屏蔽 罩(shidding漏_〇與-絕緣構件15〇，設置於容置空間4〇内， 但不以此為限。其中，屏蔽罩140係為金屬材質，並且罩覆住電 路板Π)的電子零組件。絕緣構件15〇則配置於電路板ι〇與屏蔽 罩H0之間，以更有效絕緣電路板1〇上的電子零組件。藉此，根 據本發明第-實施例之散熱殼體結構，不僅可㈣有效均溫電子 裝置，更可透過屏蔽罩⑽與絕緣構件丨料到電子零組件之電 磁防護作用。 第4圖」與第5圖」係分別為根據本發明第二實施例之 201225450 散熱殼體結構之分解示意圖與剖面側視圖。根據本發明第二實施 例之散熱殼體結構，亦可適用於具有電路板1〇、輸入元件2〇與輸 出元件30之電子裝置，其包括有上殼體11〇與下殼體⑽組成之 本體'以及導熱片⑽。其中，導熱片⑽同樣是被埋置且包覆在 *本體的上㈣11G與下殼體12G中，並且被夾置於_面12與外 側面14之間。 . 與本發明之第-實施例不_是，根據本發明第二實施例之 散熱殼體結構，其_面12上可開設有至少—孔洞13，以暴露出 部分的導熱件13G。於此，魏板1G上的接地端(g_d)與導熱件 130即可齡孔洞13中穿設之電性傳導件15，例如導線、導電泡 棉，而相互電性導接。是以，根據本發明之第二實施例，散熱殼 體結構無須配置有屏蔽罩140，因其藉由導熱件13〇當作電子零組 件的屏蔽遮罩，亦可達成防治電子零組件之電磁干擾 (Electromagnetic Interference，EMI)的功效。 除此之外’如「第5圖」所示，由於内側面12本身即為絕緣 ⑩材料’例如為歸’但並不以此為限。因此，根據本發明第二實 ^例之政熱奴體結構，更可在無需額外加設絕緣構件或絕緣片的 前提之下，透過内側面12本身之絕緣作用，避免電子農置—次側 與一次側之間電路導通，以藉此進一步縮小電子裝置之體積，並 且兼具防止電子裝置於耐壓測試(Hi-Pot test)時失敗之效用。 其次，承前所述之本發明的第一實施例與第二實施例，皆可 透過「第6A圖」埋置導熱件130之方式達到更佳之熱能逸散效率。 詳細而言，如「第6A圖」所示，散熱殼體結構之本體具有複數個 201225450 相連接之側壁(包括上側壁、下側壁6〇2、左側壁6〇3、右側壁 6〇4輸入側壁⑼5與輸出側壁6〇6)，以構成内部之容置空間， 電路板10即可褒設於容置空間*内完全被該些側壁罩覆。其中， 每-側壁皆具有如前所述之一面向電路板1〇之内側面η與相對 於内側面12之外側面14。於此，導熱件13〇係被包覆於每一側壁 内’也就是說’本體各側壁(上側壁觀、下侧壁6〇2、左側壁綱、 右侧壁604、輸入側壁6〇5以及輸出側壁6〇6)之内側面與外側 面14之間皆埋置有導熱件13〇。在此情況之下，導熱件⑽係完 全罩覆在電路板10之周圍。是以，本發明提出之散熱殼體結構具 有至少六面魏於電路板1G關之導熱件13G，以增加散熱面 積，並藉此達到比習知更佳之熱能逸散效率。 第6B圖」係為根據「第圖」之散熱殼體結構内埋置有 0.5mm導熱件之溫度變化數據圖。由圖中可見，用於同一電子裝 置時，本體内埋置有導熱件130之散熱殼體結構其各側壁之溫度 變化，相較本體内未埋置有導熱件13〇之殼體(意即習用之電子^ 置於其内部額外加設賴⑴，其溫錢化較補烈且趨為平緩， 也就是說，埋置有導熱件130之散熱殼體可以達均溫電子裝置的 效果。其次，具有本發明提出之散熱殼體結構的電子裝置，其殼 溫最熱點亦可被下降約8.8。(：。 除此之外’散熱殼體結構内埋置之導熱件130數量亦非用以 限定本發明之範圍，其可選自單層、多層抑或是具有不同導熱係 數的複合材料所組成。舉例而言，「第7圖」係為根據本發明第 三實施例之散熱殼體結構的剖面側視圖。複數個導熱件13〇係被 12 201225450 疊置於本體之内側面12與外側面14之間，以增加有效導熱面積， 並提高電子裝置之均溫效率。 因此’綜上所述，本發明提出的散熱殼體結構，不僅可藉由 埋置於本體巾的導熱件翻均溫電子裝置殼溫的效果，更可於本 體之内側_設孔洞，藉由埋設其巾的導鮮當作電子零組件的 屏蔽罩’進—步地㈣電子零組件之電磁干_1咖贿gnetic Interference，EMI)。並且，本發明之散熱殼體結構兼具絕緣效果， 可無需額外加設職構件’即達到防止f子裝置於耐壓測試 (Hi-Pottest)時失敗之效用。 其次，根據本發贿出的散熱殼體結構，係藉由配置完全包 覆於電路板周圍之導熱件，抑或是增設—個以上之導熱件，以提 高均勻散佈電子裝置熱能之效。 雖然本發明以前述的較佳實施例揭露如上，財並非用以把 定本發明，任何熟習相像技藝者，在不脫離本發明之精神與範圍 内田可作些坪更動與潤飾，因此本發明之專利保護範圍須視本 說明書所社帽專__衫者鱗。 、 【圖式簡單說明】 第1圖係為根據本發明第一實施例之散熱殼體結 意圖。 畔不The purpose of the Merference, EMI) is the heat-dissipating housing structure of the first embodiment of the present invention shown in FIG. 1 and FIG. 2, and the body may further include at least one shielding cover (shidding leakage_〇 and The insulating member 15 is disposed in the accommodating space 4A, but is not limited thereto. The shielding cover 140 is made of a metal material and covers the electronic components of the circuit board. The insulating member 15 is disposed between the circuit board ι and the shield H0 to more effectively insulate the electronic components on the circuit board 1 。. Thereby, according to the heat dissipating casing structure of the first embodiment of the present invention, not only the (IV) effective temperature equalizing electronic device but also the electromagnetic shielding effect of the shielding member (10) and the insulating member to the electronic component can be transmitted. 4 and 5 are respectively an exploded perspective view and a cross-sectional side view of the 201225450 heat dissipating casing structure according to the second embodiment of the present invention. The heat dissipation housing structure according to the second embodiment of the present invention is also applicable to an electronic device having a circuit board 1 , an input component 2 , and an output component 30 , which includes an upper casing 11 〇 and a lower casing ( 10 ). Body 'and thermal pad (10). Here, the thermally conductive sheet (10) is also embedded and covered in the upper (4) 11G and the lower casing 12G of the body, and is sandwiched between the _ face 12 and the outer side 14. According to a first embodiment of the present invention, in a heat dissipating casing structure according to a second embodiment of the present invention, at least a hole 13 may be formed in the face 12 to expose a portion of the heat conducting member 13G. Herein, the grounding end (g_d) on the Wei plate 1G and the heat conducting member 130 can be electrically conductively connected to each other through the electrical conductive member 15, such as a wire or a conductive foam. Therefore, according to the second embodiment of the present invention, the heat dissipation housing structure does not need to be provided with the shield cover 140, and since the heat conduction member 13 is used as a shield mask of the electronic component, the electromagnetic protection of the electronic component can also be achieved. The effect of interference (Electromagnetic Interference, EMI). In addition, as shown in Fig. 5, since the inner side surface 12 itself is an insulating material 10, for example, it is not limited thereto. Therefore, according to the structure of the second embodiment of the present invention, the insulation of the inner side surface 12 itself can be avoided without the need for additional insulation members or insulating sheets, thereby avoiding the electronic farm-sub-side. The circuit is electrically connected to the primary side to thereby further reduce the volume of the electronic device and also has the effect of preventing the electronic device from failing in the Hi-Pot test. In the first embodiment and the second embodiment of the present invention, the thermal energy dissipation efficiency can be achieved by embedding the heat conducting member 130 through the "Fig. 6A". In detail, as shown in FIG. 6A, the body of the heat dissipation housing structure has a plurality of 201225450 connecting side walls (including an upper side wall, a lower side wall 6〇2, a left side wall 6〇3, and a right side wall 6〇4 input). The side wall (9) 5 and the output side wall 6 6 6) constitute an internal accommodating space, and the circuit board 10 can be disposed in the accommodating space* and completely covered by the side walls. Wherein, each of the side walls has an inner side surface η facing the circuit board 1 与 and an outer side surface 14 opposite to the inner side surface 12 as previously described. Here, the heat conducting member 13 is wrapped in each side wall, that is, the side walls of the body (upper side wall view, lower side wall 〇2, left side wall, right side wall 604, input side wall 〇5) And a heat conducting member 13〇 is embedded between the inner side surface and the outer side surface 14 of the output side wall 6〇6). In this case, the heat conducting member (10) is completely covered around the circuit board 10. Therefore, the heat dissipating casing structure proposed by the present invention has at least six heat conducting members 13G which are closed to the circuit board 1G to increase the heat dissipating area, and thereby achieve better heat dissipation efficiency than the conventional one. Fig. 6B is a graph showing the temperature change data of a 0.5 mm heat-conducting member embedded in the heat-dissipating casing structure according to the "figure". It can be seen from the figure that when used in the same electronic device, the temperature of each side wall of the heat-dissipating shell structure in which the heat-conducting member 130 is embedded in the body is changed, and the shell of the heat-conducting member 13 is not embedded in the body (ie, The conventional electronic ^ is placed in the interior of the additional device (1), which is more gentle and gentler, that is, the heat-dissipating shell embedded with the heat-conducting member 130 can achieve the effect of the uniform temperature electronic device. The electronic device having the heat-dissipating shell structure proposed by the present invention can also reduce the hot spot temperature of the shell by about 8.8. (: In addition, the number of the heat-conducting members 130 embedded in the heat-dissipating shell structure is not used. The scope of the present invention is defined, which may be selected from a single layer, a plurality of layers, or a composite material having different thermal conductivity. For example, "Fig. 7" is a heat-dissipating shell structure according to a third embodiment of the present invention. A cross-sectional side view. A plurality of heat conducting members 13 are stacked between the inner side 12 and the outer side 14 of the body by 12 201225450 to increase the effective heat transfer area and improve the temperature uniform efficiency of the electronic device. Presented by the present invention The heat-shell structure can not only reduce the temperature of the electronic device by the heat-conducting member embedded in the body towel, but also can set the hole on the inner side of the body, and the fresh-keeping of the towel is used as an electronic component. The shielding cover 'into the step (four) electromagnetic components of the electronic components _1 bribe gnetic Interference, EMI). Moreover, the heat-dissipating shell structure of the present invention has an insulating effect, can be prevented without additional installation of components The utility of the f sub-device fails in the pressure test (Hi-Pottest). Secondly, according to the heat-dissipating shell structure of the bribe, it is configured by completely disposing the heat-conducting member around the circuit board, or adding one The above-mentioned heat-conducting member is used to improve the uniformity of the thermal energy of the electronic device. Although the present invention has been disclosed in the foregoing preferred embodiments, the present invention is not intended to be used in any way, and the skilled person can understand without departing from the spirit of the present invention. Within the scope of the field can be used to make some pings and retouching, so the scope of patent protection of the present invention is subject to the specifications of the caps in this specification. [Simplified description of the drawings] Figure 1 is the first according to the present invention. The heat sink of the embodiment is intended to be
第2圖係雜據本發明第一實施例之散熱殼體結構之剖 見圖。 J 第3圖係為根據本發明實施例之上殼體的熱傳導路徑之示音、 13 201225450 圖。 第4圖係為根據本發明第二實施例之散熱殼體結構之分解示 意圖。 •第®係為根據本發明第二實施例之散熱殼體結構之剖面側 視圖。 圖係為根據本發明實施例之散熱殼體結構之立體示意 圖。 第圖係為根據「第6A圖」之散熱殼體結構内埋置有0.5 毫米厚度之導熱件的溫㈣化數據圖。 第7 .圖係為根據本發明第三實施例之散熱殼體結構的剖面側 視圖 【主要元件符號說明】 10 電路板 12 内側面 13 孔洞 14 外側面 15 電性傳導件 20 輸入元件 30 輪出元件 40 容置空間 110 上殼體 120 下殼體 201225450 130 導熱件 140 屏蔽罩 150 絕緣構件 601 上侧壁 ' 602 下側壁 ' 603 左側壁 604 右側壁 φ 605 輸入側壁 606 輸出侧壁Fig. 2 is a cross-sectional view showing the structure of a heat dissipating casing according to a first embodiment of the present invention. J Fig. 3 is a diagram showing the heat conduction path of the upper casing according to an embodiment of the present invention, 13 201225450. Fig. 4 is an exploded perspective view showing the structure of the heat dissipating casing according to the second embodiment of the present invention. • Section® is a cross-sectional side view of a heat dissipating housing structure in accordance with a second embodiment of the present invention. The figure is a perspective view of a heat dissipating housing structure in accordance with an embodiment of the present invention. The figure is a temperature (four) data chart of a heat-conducting member having a thickness of 0.5 mm embedded in the heat-dissipating casing structure according to "Ath. 6A". Figure 7 is a cross-sectional side view of a heat-dissipating casing structure according to a third embodiment of the present invention. [Main component symbol description] 10 Circuit board 12 Inner side 13 Hole 14 Outer side 15 Electrical conduction member 20 Input member 30 Round out Element 40 accommodating space 110 upper housing 120 lower housing 201225450 130 heat conducting member 140 shield 150 insulating member 601 upper side wall '602 lower side wall 603 left side wall 604 right side wall φ 605 input side wall 606 output side wall