TW201308489A - 基板處理的方法及用於其之裝置 - Google Patents

基板處理的方法及用於其之裝置 Download PDF

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Publication number
TW201308489A
TW201308489A TW101122091A TW101122091A TW201308489A TW 201308489 A TW201308489 A TW 201308489A TW 101122091 A TW101122091 A TW 101122091A TW 101122091 A TW101122091 A TW 101122091A TW 201308489 A TW201308489 A TW 201308489A
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TW
Taiwan
Prior art keywords
substrate
syringe
gases
precursor
channels
Prior art date
Application number
TW101122091A
Other languages
English (en)
Chinese (zh)
Inventor
Christian Schmid
Dirk Habermann
Chuck Attema
Tom Stewart
Kenneth Provancha
Original Assignee
Schmid Gmbh Gebr
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schmid Gmbh Gebr filed Critical Schmid Gmbh Gebr
Publication of TW201308489A publication Critical patent/TW201308489A/zh

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Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45595Atmospheric CVD gas inlets with no enclosed reaction chamber
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/40Oxides
    • C23C16/403Oxides of aluminium, magnesium or beryllium
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45514Mixing in close vicinity to the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Vapour Deposition (AREA)
TW101122091A 2011-06-20 2012-06-20 基板處理的方法及用於其之裝置 TW201308489A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE201110077833 DE102011077833A1 (de) 2011-06-20 2011-06-20 Verfahren zur Bearbeitung von Substraten und Vorrichtung dazu

Publications (1)

Publication Number Publication Date
TW201308489A true TW201308489A (zh) 2013-02-16

Family

ID=46298387

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101122091A TW201308489A (zh) 2011-06-20 2012-06-20 基板處理的方法及用於其之裝置

Country Status (3)

Country Link
DE (1) DE102011077833A1 (de)
TW (1) TW201308489A (de)
WO (1) WO2012175331A1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107623052A (zh) * 2017-09-01 2018-01-23 常州比太科技有限公司 一种太阳能电池片钝化用Al2O3镀膜系统和方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011080202A1 (de) 2011-08-01 2013-02-07 Gebr. Schmid Gmbh Vorrichtung und Verfahren zur Herstellung von dünnen Schichten
CN118480868B (zh) * 2024-07-12 2024-12-03 上海钧乾智造科技有限公司 一种用于电池片切面钝化镀膜的喷淋结构、装置及工作方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5122391A (en) 1991-03-13 1992-06-16 Watkins-Johnson Company Method for producing highly conductive and transparent films of tin and fluorine doped indium oxide by APCVD
US5304398A (en) * 1993-06-03 1994-04-19 Watkins Johnson Company Chemical vapor deposition of silicon dioxide using hexamethyldisilazane
JPH07142394A (ja) * 1993-11-12 1995-06-02 Sony Corp Cvd方法及びcvd装置
US6022414A (en) * 1994-07-18 2000-02-08 Semiconductor Equipment Group, Llc Single body injector and method for delivering gases to a surface
US5944900A (en) * 1997-02-13 1999-08-31 Watkins Johnson Company Protective gas shield for chemical vapor deposition apparatus
US6926920B2 (en) * 2002-06-11 2005-08-09 Taiwan Semiconductor Manufacturing Co., Ltd Chemical vapor deposition (CVD) calibration method providing enhanced uniformity
CN1937175B (zh) * 2005-09-20 2012-10-03 中芯国际集成电路制造(上海)有限公司 用于半导体器件的使用大气压的材料原子层沉积的方法
US7456429B2 (en) * 2006-03-29 2008-11-25 Eastman Kodak Company Apparatus for atomic layer deposition
US7413982B2 (en) * 2006-03-29 2008-08-19 Eastman Kodak Company Process for atomic layer deposition
GB0716653D0 (en) * 2007-08-25 2007-10-03 Eastman Kodak Co Method of reducing dye fade
US20090081356A1 (en) * 2007-09-26 2009-03-26 Fedorovskaya Elena A Process for forming thin film encapsulation layers
NL2003836C2 (en) * 2009-11-19 2011-05-23 Levitech B V Floating wafer track with lateral stabilization mechanism.

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107623052A (zh) * 2017-09-01 2018-01-23 常州比太科技有限公司 一种太阳能电池片钝化用Al2O3镀膜系统和方法
CN107623052B (zh) * 2017-09-01 2023-12-05 常州比太科技有限公司 一种太阳能电池片钝化用Al2O3镀膜系统和方法

Also Published As

Publication number Publication date
DE102011077833A1 (de) 2012-12-20
WO2012175331A1 (de) 2012-12-27

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