TW201320833A - 用於壓入印刷電路板中之形成塊 - Google Patents

用於壓入印刷電路板中之形成塊 Download PDF

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Publication number
TW201320833A
TW201320833A TW101123088A TW101123088A TW201320833A TW 201320833 A TW201320833 A TW 201320833A TW 101123088 A TW101123088 A TW 101123088A TW 101123088 A TW101123088 A TW 101123088A TW 201320833 A TW201320833 A TW 201320833A
Authority
TW
Taiwan
Prior art keywords
ribs
circuit board
printed circuit
forming block
forming
Prior art date
Application number
TW101123088A
Other languages
English (en)
Chinese (zh)
Inventor
Thomas Zwick
Original Assignee
Schoeller Electronics Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schoeller Electronics Gmbh filed Critical Schoeller Electronics Gmbh
Publication of TW201320833A publication Critical patent/TW201320833A/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/1059—Connections made by press-fit insertion

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
TW101123088A 2011-11-11 2012-06-27 用於壓入印刷電路板中之形成塊 TW201320833A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE202011107731 2011-11-11

Publications (1)

Publication Number Publication Date
TW201320833A true TW201320833A (zh) 2013-05-16

Family

ID=46545318

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101123088A TW201320833A (zh) 2011-11-11 2012-06-27 用於壓入印刷電路板中之形成塊

Country Status (3)

Country Link
EP (1) EP2777368A1 (de)
TW (1) TW201320833A (de)
WO (1) WO2013068055A1 (de)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110708873A (zh) * 2019-09-20 2020-01-17 深圳崇达多层线路板有限公司 一种实现埋入式铜块定位的制作方法
TWI694756B (zh) * 2018-12-27 2020-05-21 欣興電子股份有限公司 一種具有散熱塊的電路板及其製造方法
US11445596B2 (en) 2018-12-27 2022-09-13 Unimicron Technology Corp. Circuit board having heat-dissipation block and method of manufacturing the same

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014216194B3 (de) 2014-08-14 2015-12-10 Robert Bosch Gmbh Schaltungsträger mit einem Wärmeleitelement, Verbindungsanordnung mit einem Schaltungsträger und Verfahren zum Abführen von Verlustwärme
DE102015204709A1 (de) * 2015-03-16 2016-09-22 Siemens Aktiengesellschaft Leiterplatte mit einem Halbleiterschaltelement

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1709835A (en) * 1925-07-31 1929-04-23 Bottcher Paul Machine for cutting double-helical or double-spiral gears
NL6503858A (de) * 1965-03-25 1966-09-26
GB1279452A (en) * 1969-07-01 1972-06-28 Prec Screw & Mfg Company Ltd Improvements relating to inserts
US4003287A (en) * 1975-07-08 1977-01-18 Yardley Products Corporation Insert of the self-tapping fluted type
DE3016590A1 (de) * 1980-04-30 1981-11-19 Böllhof & Co, 4800 Bielefeld Metallischer gewindeeinsatz zum einbau in werkstuecke aus thermoplatischem kunststoff unter thermischer erweichung des kunststoffmaterials
JPS62251513A (ja) * 1986-04-23 1987-11-02 レツクスノ−ド・インコ−ポレ−テツド 埋込み金具
US5879115A (en) * 1992-05-22 1999-03-09 Unimation, Inc. Method and insert for connecting components to plastic members
US6676352B2 (en) * 2001-03-13 2004-01-13 Ju-Ching Chen-Chi Fasteners with improved retaining effect
EP1276357A3 (de) 2001-07-13 2004-08-25 Behr-Hella Thermocontrol GmbH Leiterplatte für elektrische Schaltungen
DE10214311A1 (de) 2002-03-28 2003-10-09 Marconi Comm Gmbh Kühlanordnung für ein elektronisches Bauelement
ATE437716T1 (de) * 2002-08-08 2009-08-15 Lufkin Ind Inc Pfeilradzähne und verfahren zur herstellung derselben
DE10335129B3 (de) * 2003-07-31 2005-06-23 Kathrein-Werke Kg Kühlanordnung für auf einer Leiterplatte angeordnete elektrische Bauelemente, insbesondere SMD-Bausteine
DE102004036960A1 (de) 2004-07-30 2006-03-23 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Leiterplatte und Verfahren zur Herstellung einer solchen Leiterplatte
DE102007011811A1 (de) * 2007-03-12 2008-10-09 Continental Automotive Gmbh Kupfer-Inlay für Leiterplatten
ES2483742T3 (es) * 2010-03-01 2014-08-07 Illinois Tool Works Inc. Rosca en forma de cascada para insertos

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI694756B (zh) * 2018-12-27 2020-05-21 欣興電子股份有限公司 一種具有散熱塊的電路板及其製造方法
US11445596B2 (en) 2018-12-27 2022-09-13 Unimicron Technology Corp. Circuit board having heat-dissipation block and method of manufacturing the same
US12588135B2 (en) 2018-12-27 2026-03-24 Unimicron Technology Corp. Method of manufacturing circuit board
CN110708873A (zh) * 2019-09-20 2020-01-17 深圳崇达多层线路板有限公司 一种实现埋入式铜块定位的制作方法

Also Published As

Publication number Publication date
EP2777368A1 (de) 2014-09-17
WO2013068055A1 (de) 2013-05-16

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