TW201323154A - Product having abrasive particles and manufacturing method thereof - Google Patents
Product having abrasive particles and manufacturing method thereof Download PDFInfo
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- TW201323154A TW201323154A TW100146373A TW100146373A TW201323154A TW 201323154 A TW201323154 A TW 201323154A TW 100146373 A TW100146373 A TW 100146373A TW 100146373 A TW100146373 A TW 100146373A TW 201323154 A TW201323154 A TW 201323154A
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- metal oxide
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- 239000002245 particle Substances 0.000 title claims abstract description 54
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 16
- 229910044991 metal oxide Inorganic materials 0.000 claims abstract description 58
- 150000004706 metal oxides Chemical group 0.000 claims abstract description 55
- 229920000642 polymer Polymers 0.000 claims abstract description 43
- 239000000758 substrate Substances 0.000 claims abstract description 16
- 239000000463 material Substances 0.000 claims abstract description 14
- 238000000227 grinding Methods 0.000 claims abstract description 12
- 239000006061 abrasive grain Substances 0.000 claims description 83
- 229910052751 metal Inorganic materials 0.000 claims description 52
- 239000002184 metal Substances 0.000 claims description 52
- 239000010432 diamond Substances 0.000 claims description 34
- 229910003460 diamond Inorganic materials 0.000 claims description 28
- 238000000034 method Methods 0.000 claims description 20
- 239000010936 titanium Substances 0.000 claims description 13
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 10
- 239000002861 polymer material Substances 0.000 claims description 10
- 229910052719 titanium Inorganic materials 0.000 claims description 10
- 239000011651 chromium Substances 0.000 claims description 9
- 238000003980 solgel method Methods 0.000 claims description 9
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 7
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 7
- 229910000420 cerium oxide Inorganic materials 0.000 claims description 7
- 229910052804 chromium Inorganic materials 0.000 claims description 7
- NFFIWVVINABMKP-UHFFFAOYSA-N methylidynetantalum Chemical compound [Ta]#C NFFIWVVINABMKP-UHFFFAOYSA-N 0.000 claims description 7
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 claims description 7
- 229910003468 tantalcarbide Inorganic materials 0.000 claims description 7
- MTPVUVINMAGMJL-UHFFFAOYSA-N trimethyl(1,1,2,2,2-pentafluoroethyl)silane Chemical compound C[Si](C)(C)C(F)(F)C(F)(F)F MTPVUVINMAGMJL-UHFFFAOYSA-N 0.000 claims description 7
- 238000005229 chemical vapour deposition Methods 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 6
- 229910052721 tungsten Inorganic materials 0.000 claims description 6
- 239000010937 tungsten Substances 0.000 claims description 6
- 239000004519 grease Substances 0.000 claims description 5
- 229920001169 thermoplastic Polymers 0.000 claims description 5
- 229920001187 thermosetting polymer Polymers 0.000 claims description 5
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 claims description 5
- 229910052582 BN Inorganic materials 0.000 claims description 4
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 4
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 4
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 4
- 229910052750 molybdenum Inorganic materials 0.000 claims description 4
- 239000011733 molybdenum Substances 0.000 claims description 4
- 229910052758 niobium Inorganic materials 0.000 claims description 4
- 239000010955 niobium Substances 0.000 claims description 4
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 claims description 4
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 4
- 238000002207 thermal evaporation Methods 0.000 claims description 4
- 239000004634 thermosetting polymer Substances 0.000 claims description 4
- 229910052720 vanadium Inorganic materials 0.000 claims description 4
- INZDTEICWPZYJM-UHFFFAOYSA-N 1-(chloromethyl)-4-[4-(chloromethyl)phenyl]benzene Chemical compound C1=CC(CCl)=CC=C1C1=CC=C(CCl)C=C1 INZDTEICWPZYJM-UHFFFAOYSA-N 0.000 claims description 3
- 238000000231 atomic layer deposition Methods 0.000 claims description 3
- 150000002739 metals Chemical class 0.000 claims description 3
- 238000002156 mixing Methods 0.000 claims description 3
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 3
- 239000011787 zinc oxide Substances 0.000 claims description 3
- UFGZSIPAQKLCGR-UHFFFAOYSA-N chromium carbide Chemical compound [Cr]#C[Cr]C#[Cr] UFGZSIPAQKLCGR-UHFFFAOYSA-N 0.000 claims description 2
- 238000007654 immersion Methods 0.000 claims description 2
- 238000004062 sedimentation Methods 0.000 claims description 2
- 238000004528 spin coating Methods 0.000 claims description 2
- 239000007921 spray Substances 0.000 claims description 2
- 229910003470 tongbaite Inorganic materials 0.000 claims description 2
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 claims description 2
- 239000002105 nanoparticle Substances 0.000 claims 1
- 238000010422 painting Methods 0.000 claims 1
- 238000011049 filling Methods 0.000 abstract description 7
- 238000005520 cutting process Methods 0.000 abstract description 6
- 235000012431 wafers Nutrition 0.000 description 12
- 235000013339 cereals Nutrition 0.000 description 8
- 238000005498 polishing Methods 0.000 description 8
- 239000011347 resin Substances 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- 239000000919 ceramic Substances 0.000 description 5
- 235000011868 grain product Nutrition 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 238000005245 sintering Methods 0.000 description 5
- 238000001035 drying Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 229910052797 bismuth Inorganic materials 0.000 description 2
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920005596 polymer binder Polymers 0.000 description 2
- 239000002491 polymer binding agent Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000003082 abrasive agent Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000003750 conditioning effect Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 238000001227 electron beam curing Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- FXNGWBDIVIGISM-UHFFFAOYSA-N methylidynechromium Chemical compound [Cr]#[C] FXNGWBDIVIGISM-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- -1 or the like Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Landscapes
- Polishing Bodies And Polishing Tools (AREA)
Abstract
Description
本發明係有關具有磨粒的產品及其製法,尤其是有關應用於晶圓薄基板、TFT-LCD玻璃、陶瓷、模具或金屬等加工作業、或對陶瓷晶圓、矽晶圓、玻璃晶圓、石英晶圓及金屬晶圓等進行抛光作業、或用以填補於電子元件表面與散熱裝置之間的空隙的材料及其製法。The invention relates to a product with abrasive grains and a preparation method thereof, in particular to a processing operation on a wafer thin substrate, a TFT-LCD glass, a ceramic, a mold or a metal, or a ceramic wafer, a germanium wafer or a glass wafer. A material for polishing a quartz wafer or a metal wafer, or a material for filling a gap between the surface of the electronic component and the heat sink, and a method of manufacturing the same.
研磨顆粒(磨粒)可以被固定在芯線上做成線鋸,以進行精密切割或切斷作業。線鋸已廣泛應用於晶圓薄基板、TFT-LCD玻璃、陶瓷、模具或金屬等加工作業。The abrasive particles (abrasive grains) can be fixed to the core wire to form a wire saw for precise cutting or cutting operations. Wire saws have been widely used in wafer thin substrates, TFT-LCD glass, ceramics, molds or metals.
台灣專利M412050揭示一種固定磨粒線鋸結構,係將超磨粒固定於具有高強度之金屬線或耐熱與拉伸強度優良之樹脂線所構成之芯線之表面,以電附著或黏著剤所構成之電鍍接著層來填埋超磨粒,並將被覆蓋之超磨粒從部分電鍍接著層露出,使超磨粒固定分散於芯線之表面。Taiwan Patent No. M412050 discloses a fixed abrasive wire saw structure in which superabrasive particles are fixed on the surface of a core wire composed of a high-strength metal wire or a resin wire excellent in heat resistance and tensile strength, and are electrically adhered or adhered. The electroplating layer is used to fill the superabrasive grains, and the covered superabrasive grains are exposed from the partial electroplating and subsequent layers, so that the superabrasive grains are fixedly dispersed on the surface of the core wire.
台灣公開專利201119772揭示一種具有研磨粒的鋸線,研磨粒部分嵌在金屬核心中且部分在有機黏合劑層中。Taiwan Patent Publication No. 201119772 discloses a saw wire having abrasive grains partially embedded in a metal core and partially in an organic binder layer.
台灣公告專利455521揭示一種線鋸的研磨線及該研磨線的製造方法,研磨顆粒利用於數秒內即可完成固化之光固化樹脂或電子束固化樹脂黏著在芯線上。Taiwan Publication No. 455521 discloses a polishing line for a wire saw and a method of manufacturing the same, wherein the abrasive particles are adhered to the core wire by using a photocurable resin or an electron beam curing resin which is cured in a few seconds.
化學機械拋光的拋光墊用以對陶瓷晶圓、矽晶圓、玻璃晶圓、石英晶圓及金屬晶圓等進行抛光作業。研磨顆粒也可以被固定在金屬盤上做成修整器,用以對化學機械拋光的拋光墊進行修整(Dressing)或者調整(Conditioning),以恢復拋光墊的抛光性能。Chemical mechanical polishing polishing pads are used to polish ceramic wafers, tantalum wafers, glass wafers, quartz wafers, and metal wafers. The abrasive particles can also be fixed to a metal disk to form a dresser for dressing or conditioning the chemical mechanical polishing pad to restore the polishing performance of the polishing pad.
台灣專利I264345 揭示一種CMP修整器及其製造方法。該CMP拋光墊包括一樹脂層、被固定在該樹脂層中以便每一超級磨粒的一外露部分從該樹脂層突出的超級磨粒,及一設置在每一超級磨粒與該樹脂層之間的金屬鍍層,其中該外露的部分實質上在該金屬鍍層之外。Taiwan Patent I264345 discloses a CMP conditioner and a method of manufacturing the same. The CMP polishing pad includes a resin layer, superabrasive grains fixed in the resin layer so that an exposed portion of each superabrasive grain protrudes from the resin layer, and a superabrasive grain and the resin layer are disposed An intermetallic coating wherein the exposed portion is substantially outside the metal coating.
台灣專利 I314497揭示一種電鑄薄砂輪片,係具備於金屬鍍覆相分散磨粒而構成之薄砂輪片磨粒層,此薄砂輪片磨粒層係具有依序積層於該薄砂輪片磨粒層的層厚方向之第1至第5磨粒層,其中第1、第3、第5磨粒層之上述磨粒的含有量係設為比第2、第4磨粒層之上述磨粒的含有量多。Taiwan Patent No. I314497 discloses an electroformed thin grinding wheel piece which is provided with a thin grinding wheel abrasive layer formed by dispersing abrasive grains in a metal plating phase, and the thin grinding wheel abrasive layer has a layer of abrasive grains sequentially laminated on the thin grinding wheel. The first to fifth abrasive layer in the layer thickness direction of the layer, wherein the content of the abrasive grains in the first, third, and fifth abrasive layer is set to be larger than that of the second and fourth abrasive layers More content.
研磨顆粒(磨粒)可以被摻雜於該高分子載體中作成散熱膏之填補材料,用以填補於電子元件表面與散熱裝置之間的空隙,避免散熱裝置無法完全緊密的貼合電子元件,以提升散熱效果。The abrasive particles (abrasive grains) may be doped into the polymer carrier to form a filling material for the heat dissipation paste, so as to fill the gap between the surface of the electronic component and the heat sink, so as to prevent the heat sink from being completely close to the electronic component. To improve the heat dissipation effect.
台灣公開專利201102420揭示一種具有改質鑽石顆粒之散熱膏,包含複數個鑽石顆粒,摻雜於該高分子載體中,該等鑽石顆粒之表面具有一含氧基團;以及一添加劑,摻雜於該高分子載體中,以進一步使各該鑽石顆粒均勻分佈於該高分子載體中。Taiwan Patent Publication No. 201102420 discloses a heat-dissipating paste having modified diamond particles, comprising a plurality of diamond particles doped in the polymer carrier, the surface of the diamond particles having an oxygen-containing group; and an additive doped In the polymer carrier, each of the diamond particles is further uniformly distributed in the polymer carrier.
一般研磨、切割的工具或填補材料中的磨粒,不容易與結合劑或高分子載體直接牢固結合,因此常需要在磨粒的表面做改質。使磨粒的表面改質的方法,包括在磨粒的表面塗佈金屬層,例如鍍上銅、鎳、鈦、銀、鉻等金屬;或是將磨粒陶瓷化,如將鑽石磨粒的表面鍍鈦(Ti)、 矽(Si)、 鉻(Cr)、 鎢(W)等金屬,然後在高溫的環境下形成TiC、 SiC、 CrC、 WC等碳化物形式,以增加磨粒的親水性及與結合劑的結合性;但是金屬與高分子結合劑的結合強度仍然不佳,例如於鋸切加工時,被固定於線芯上鑽石磨粒容易脫落,而減低產品的壽命。Generally, the grinding or cutting tool or the abrasive particles in the filling material are not easily and directly bonded to the bonding agent or the polymer carrier, so it is often necessary to modify the surface of the abrasive grain. A method for modifying the surface of the abrasive grain, comprising coating a metal layer on the surface of the abrasive grain, for example, plating a metal such as copper, nickel, titanium, silver, chromium, or the like; or ceramizing the abrasive grain, such as grinding the diamond The surface is coated with titanium (Ti), bismuth (Si), chromium (Cr), tungsten (W) and other metals, and then forms a carbide form such as TiC, SiC, CrC, WC in a high temperature environment to increase the hydrophilicity of the abrasive particles. And the binding property with the binder; but the bonding strength of the metal and the polymer binder is still not good, for example, when sawing, the diamond abrasive grains fixed on the core are easy to fall off, and the life of the product is reduced.
為了改良習知具有磨粒的產品及其製法,以增加磨粒與高分子聚合物的結合強度,提升產品的效率,而提出本發明。The present invention has been proposed in order to improve a conventional abrasive product and a process for producing the same, to increase the bonding strength between the abrasive particles and the high molecular polymer, and to improve the efficiency of the product.
本發明的主要目的,在提供一種具有磨粒的產品及其製法,使磨粒的表面結合一層奈米金屬氧化物層;多個結合奈米金屬氧化物層的磨粒混合該高分子聚合物披附在一基體的至少一側表面且該多個結合奈米金屬氧化物層的磨粒的一部分突出該高分子聚合物形成研磨或切割工具、或多個結合奈米金屬氧化物層的磨粒混合高分子聚合物形成散熱膏之填補材料;藉由奈米金屬氧化物層增加磨粒與高分子聚合物的結合強度,以提升產品的效率。The main object of the present invention is to provide a product having abrasive grains and a method for preparing the same, wherein a surface of the abrasive particles is bonded to a layer of a nano metal oxide layer; and a plurality of abrasive particles bonded to the nano metal oxide layer are mixed with the high molecular polymer. a portion of the abrasive particles coated on at least one side of the substrate and the plurality of bonded nano-metal oxide layers protrudes from the polymer to form a grinding or cutting tool, or a plurality of abrasives bonded to the nano-metal oxide layer The granular mixed polymer forms a filling material for the thermal grease; the nano metal oxide layer increases the bonding strength between the abrasive particles and the high molecular polymer to improve the efficiency of the product.
本發明的其他目的、功效,請參閱圖式及實施例,詳細說明如下。For other purposes and functions of the present invention, please refer to the drawings and the embodiments, which are described in detail below.
如第1圖所示,本發明第一實施例具有磨粒的產品1,包括多個磨粒10、一基體20及一高分子聚合物30;磨粒10的表面結合一層奈米金屬氧化物層101;多個結合奈米金屬氧化物層101的磨粒10混合高分子聚合物30披附在基體20的至少一側表面201;多個磨粒10的一部分突出高分子聚合物30。本實施例具有磨粒的產品1為砂紙或 修整器,基體20為砂紙或修整器的基體。As shown in Fig. 1, a first embodiment of the present invention has an abrasive grain product 1 comprising a plurality of abrasive grains 10, a substrate 20 and a high molecular polymer 30; the surface of the abrasive particles 10 is bonded to a layer of nano metal oxide. The layer 101; the plurality of abrasive particles 10 bonded to the nano metal oxide layer 101 are mixed with the high molecular polymer 30 on at least one side surface 201 of the substrate 20; and a part of the plurality of abrasive grains 10 protrudes from the polymer 30. The product 1 having abrasive grains in this embodiment is a sandpaper or a dresser, and the base 20 is a base of a sandpaper or a dresser.
高分子聚合物30可為熱塑性高分子材料、熱固性高分子材料或彈性高分子材料。熱塑性高分子材料如壓克力樹脂等,可以利用紫外線固化方式成型。熱固性高分子材料包括環氧樹脂、酚醛樹脂、苯酚(Phenolic)、聚酰亞胺(Polyimide)丙烯酸等或其混合物,經乾燥、加熱反應熟化成形。彈性高分子材料如矽膠等,可以用加熱方式熟化成型。基體20可為金屬材料、高分子材料或陶瓷材料或其複合材料。The polymer 30 can be a thermoplastic polymer material, a thermosetting polymer material or an elastic polymer material. Thermoplastic polymer materials such as acrylic resins can be molded by ultraviolet curing. The thermosetting polymer material includes an epoxy resin, a phenol resin, a phenol (Phenolic), a polyimide (Polyimide) acrylic acid, or the like, or a mixture thereof, which is dried and heated to form a matured reaction. The elastic polymer material such as silicone rubber can be cooked by heating. The substrate 20 may be a metal material, a polymer material or a ceramic material or a composite material thereof.
如第2圖所示,本發明第二實施例具有磨粒的產品2,包括多個磨粒10、一基體21及一高分子聚合物30;磨粒10的表面結合一層奈米金屬氧化物層101;多個結合奈米金屬氧化物層101的磨粒10混合高分子聚合物30披附在基體21的整個表面211;多個磨粒10的一部分突出高分子聚合物30。本實施例具有磨粒的產品2為一線鋸,基體21為線鋸 的基體。線鋸可為切割單晶矽晶圓或太陽能多晶矽或藍寶石用的線鋸。線鋸的製造方式,可利用熱固性或熱塑型高分子材料、金屬粉末(如銅等)或陶瓷粉末與鑽石磨粒、添加劑(如分散劑)及可塑劑等配方設計選定後,將其混合均勻,黏著於線材,經乾燥、加熱反應(或紫外線固化)熟化成形。As shown in Fig. 2, a second embodiment of the present invention has an abrasive grain product 2 comprising a plurality of abrasive grains 10, a substrate 21 and a high molecular polymer 30; the surface of the abrasive particles 10 is bonded to a layer of nano metal oxide. The layer 101; the plurality of abrasive particles 10 bonded to the nano metal oxide layer 101 are mixed with the high molecular polymer 30 on the entire surface 211 of the substrate 21; and a part of the plurality of abrasive grains 10 protrudes from the polymer 30. The product 2 having abrasive grains in this embodiment is a wire saw, and the base 21 is a base of a wire saw. The wire saw can be a wire saw for cutting single crystal germanium wafers or solar polysilicon or sapphire. The wire saw can be made by using thermosetting or thermoplastic polymer materials, metal powders (such as copper) or ceramic powders, diamond abrasive grains, additives (such as dispersants) and plasticizers. Uniform, adhered to the wire, dried and heated (or UV cured) to form.
如第3圖所示,本發明第三實施例具有磨粒的產品3,包括多個磨粒10、一基體22及一高分子聚合物30;磨粒10的表面結合一層奈米金屬氧化物層101;多個結合奈米金屬氧化物層101的磨粒10混合高分子聚合物30披附在基體22的表面221;多個磨粒10的一部分突出高分子聚合物30。本實施例具有磨粒的產品3為一砂輪,基體22為砂輪的基體。As shown in FIG. 3, a third embodiment of the present invention has an abrasive grain product 3 comprising a plurality of abrasive grains 10, a substrate 22 and a high molecular polymer 30; the surface of the abrasive grain 10 is bonded to a layer of nano metal oxide. The layer 101; the plurality of abrasive particles 10 bonded to the nano metal oxide layer 101 are mixed with the high molecular polymer 30 on the surface 221 of the substrate 22; and a part of the plurality of abrasive grains 10 protrudes from the polymer 30. The product 3 having abrasive grains in this embodiment is a grinding wheel, and the base 22 is a base of the grinding wheel.
如第4圖所示,本發明第四實施例具有磨粒的產品4,包括多個磨粒10及高分子聚合物30;磨粒10的表面結合一層奈米金屬氧化物層101;多個磨粒10混合高分子聚合物30形成散熱膏,用以作為填補於電子元件表面與散熱裝置之間的空隙之填補材料,避免散熱裝置無法完全緊密的貼合電子元件,以提升散熱效果。As shown in Fig. 4, a fourth embodiment of the present invention has an abrasive grain product 4 comprising a plurality of abrasive particles 10 and a high molecular polymer 30; the surface of the abrasive grain 10 is bonded to a layer of nano metal oxide layer 101; The abrasive particles 10 are mixed with the high molecular polymer 30 to form a thermal grease, which serves as a filling material for filling the gap between the surface of the electronic component and the heat dissipating device, so as to prevent the heat dissipating device from completely fitting the electronic component to improve the heat dissipating effect.
如第5圖所示,上述各實施例的磨粒10的整個表面結合一層奈米金屬氧化物層101,藉由奈米金屬氧化物層101 增加磨粒10與高分子聚合物的結合強度,以提升產品的效率。As shown in FIG. 5, the entire surface of the abrasive grains 10 of the above embodiments is bonded to a layer of the nano metal oxide layer 101, and the bonding strength of the abrasive grains 10 to the high molecular polymer is increased by the nano metal oxide layer 101. Improve product efficiency.
磨粒10可為天然鑽石、人造鑽石、立方氮化硼、碳化矽、三氧化二鋁或氧化鈰等超硬磨粒或該等超硬磨粒的混合物。奈米金屬氧化物層101可為由奈米氧化鈦(TiO2)、奈米氧化鋁(Al2O3)、奈米氧化矽(SiO2)或奈米氧化鋅(ZnO)等奈米氧化金屬或其混合物構成的奈米金屬氧化物層11。奈米金屬氧化物層101的厚度為30nm(奈米)至500nm,其中以50nm至200nm最佳。The abrasive particles 10 may be superabrasive grains such as natural diamonds, synthetic diamonds, cubic boron nitride, tantalum carbide, aluminum oxide or cerium oxide or a mixture of such superabrasive grains. The nano metal oxide layer 101 may be a nanometer oxide metal such as nano titanium oxide (TiO 2 ), nano alumina (Al 2 O 3 ), nano cerium oxide (SiO 2 ) or nano zinc oxide (ZnO). Or a nano metal oxide layer 11 composed of a mixture thereof. The thickness of the nano metal oxide layer 101 is from 30 nm (nanometer) to 500 nm, with 50 nm to 200 nm being optimal.
奈米金屬氧化物層101係塗佈在磨粒10的整個表面。可利用化學氣相沉積法(CVD)將奈米金屬氧化物101披附於磨粒10的表面;上述化學氣相沉積法(CVD)法是由原子層沈積法(ALD:Atomic Layer Deposition)將上述奈米氧化金屬或其混合物披附於磨粒10的表面。The nano metal oxide layer 101 is coated on the entire surface of the abrasive grain 10. The nano metal oxide 101 may be attached to the surface of the abrasive grain 10 by chemical vapor deposition (CVD); the above chemical vapor deposition (CVD) method is performed by an ALD (Atomic Layer Deposition) method. The above nano oxidized metal or a mixture thereof is attached to the surface of the abrasive grain 10.
也可利用 溶膠凝膠法(Sol-Gel)將奈米金屬氧化物101披附於磨粒10的表面;上述溶膠凝膠法係可選擇以浸漬拉提法及沉降法及旋轉塗佈法及噴霧法及塗刷法及沾濕法其中任一方式。The nano metal oxide 101 may also be attached to the surface of the abrasive grain 10 by a sol-gel method (Sol-Gel); the sol-gel method may be selected by a immersion drawing method, a sedimentation method, a spin coating method, and Spray method and brushing method and wet method.
溶膠-凝膠法係選自由的奈米氧化鈦、奈米氧化鋁、奈米氧化矽或奈米氧化鋅等奈米氧化金屬顆粒所組成之群組,並令溶液及前述任一材質顆粒一同注入一槽體內均勻混合分散,其後將多個磨粒浸泡於Sol-Gel溶液中,再將多個磨粒從Sol-Gel溶液中取出或將Sol-Gel溶液全數由槽體中漏除,令前述奈米金屬氧化物顆粒附著於多個磨粒的表面;然後將多個磨粒置放於烤箱中進行乾燥處理,並將烤箱之溫度設定介於50至200度,乾燥時間10至60 分鐘,乾燥溫度越高即可縮短乾燥作業之時間。為了令磨粒表面的奈米金屬氧化物層可均勻成膜狀及穩固附著於磨粒表面,可進行燒結作業,將磨粒置放於燒結爐內,並將燒結溫度設定於200至800度,燒結時間5至60 分鐘,最後將磨粒由燒結爐內取出。The sol-gel method is selected from the group consisting of nanometer oxidized metal particles such as nano titanium oxide, nano alumina, nano cerium oxide or nano zinc oxide, and the solution is combined with any of the foregoing material particles. The mixture is uniformly mixed and dispersed in a tank, and then a plurality of abrasive grains are immersed in the Sol-Gel solution, and then the plurality of abrasive grains are taken out from the Sol-Gel solution or the Sol-Gel solution is completely removed from the tank. The foregoing nano metal oxide particles are attached to the surface of the plurality of abrasive grains; then the plurality of abrasive grains are placed in an oven for drying, and the temperature of the oven is set to 50 to 200 degrees, and the drying time is 10 to 60. In minutes, the higher the drying temperature, the shorter the drying time. In order to make the nano metal oxide layer on the surface of the abrasive grain uniformly uniform and adhere to the surface of the abrasive grain, the sintering operation can be performed, the abrasive grains are placed in the sintering furnace, and the sintering temperature is set at 200 to 800 degrees. The sintering time is 5 to 60 minutes, and finally the abrasive grains are taken out from the sintering furnace.
如第6圖所示,磨粒10的整個表面與奈米金屬氧化物層101之間可具有一層中間層102,例如包括由鈦(Ti)、 鎢(W)、 鉻(Cr)、鉬(Mo)、 釩(V)或 矽(Si)等金屬層構成的中間層102,其中以鈦或矽材料為最佳。中間層102係利用熱蒸鍍的方式塗佈於磨粒10的表面,然後將奈米金屬氧化物層101塗佈在中間層102的整個表面。As shown in Fig. 6, the entire surface of the abrasive grain 10 and the nano metal oxide layer 101 may have an intermediate layer 102 comprising, for example, titanium (Ti), tungsten (W), chromium (Cr), molybdenum (for example). An intermediate layer 102 composed of a metal layer such as Mo), vanadium (V) or bismuth (Si), wherein a titanium or tantalum material is preferred. The intermediate layer 102 is applied to the surface of the abrasive grain 10 by thermal evaporation, and then the nano metal oxide layer 101 is coated on the entire surface of the intermediate layer 102.
當磨粒10為天然鑽石或人造鑽石且提高熱蒸鍍的溫度時,可以使鈦、 鎢、 鉻、釩或矽等金屬層構成的中間層102與鑽石的接觸面反應形成碳化鈦(TiC)、 碳化鎢(WC)、 碳化鉻(CrC)、碳化釩(VC)或碳化矽(SiC)等金屬碳化物層,使中間層102除了金屬層之外進一步具有一金屬碳化物層;其中以包括有碳化鈦或碳化矽等金屬碳化物層為最佳。金屬碳化物層介於天然鑽石或人造鑽石與該金屬層之間。When the abrasive grain 10 is a natural diamond or an artificial diamond and the temperature of the thermal evaporation is increased, the intermediate layer 102 composed of a metal layer such as titanium, tungsten, chromium, vanadium or niobium may be reacted with the contact surface of the diamond to form titanium carbide (TiC). a metal carbide layer such as tungsten carbide (WC), chromium carbide (CrC), vanadium carbide (VC) or tantalum carbide (SiC), such that the intermediate layer 102 further has a metal carbide layer in addition to the metal layer; A metal carbide layer such as titanium carbide or tantalum carbide is preferred. The metal carbide layer is interposed between the natural diamond or the synthetic diamond and the metal layer.
奈米金屬氧化物層101可以與鑽石結合,但是如果有鈦、 鎢、 鉻、鉬、 釩或 矽等金屬層及金屬碳化物層構成的中間層102,將使磨粒10與奈米金屬氧化物層101的結合更堅固。鑽石磨粒表面的鈦(Ti)層的厚度為0.1μm(微米)至2μm;碳化鈦層的厚度為0.01μm(微米)至0.5μm。The nano metal oxide layer 101 can be combined with a diamond, but if there is a metal layer such as titanium, tungsten, chromium, molybdenum, vanadium or niobium and an intermediate layer 102 composed of a metal carbide layer, the abrasive grains 10 and the nano metal are oxidized. The combination of the layer 101 is stronger. The thickness of the titanium (Ti) layer on the surface of the diamond abrasive grains is from 0.1 μm (micrometers) to 2 μm; the thickness of the titanium carbide layer is from 0.01 μm (micrometers) to 0.5 μm.
如第7圖所示,本發明具有磨粒的產品的製法,包括如下步驟:As shown in Fig. 7, the method for producing a product having abrasive grains of the present invention comprises the following steps:
(1)使磨粒的表面披附一層奈米金屬氧化物層;(1) coating a surface of the abrasive grain with a layer of nano metal oxide;
(2)使多個披附奈米金屬氧化物層的磨粒與高分子聚合物混合;(2) mixing a plurality of abrasive grains coated with a metal oxide layer with a high molecular polymer;
(3)使混合多個披附奈米金屬氧化物層的磨粒後的高分子聚合物披附在一基體的至少一側表面;該多個結合奈米金屬氧化物層的磨粒的一部分突出該高分子聚合物。(3) affixing the abrasive polymer after mixing the plurality of coated nano metal oxide layers to at least one side surface of the substrate; the plurality of abrasive particles of the bonded nano metal oxide layer The polymer is highlighted.
上述步驟(1)之前可進一步包括如下步驟:The above steps (1) may further include the following steps:
以熱蒸鍍的方式使金屬塗佈於磨粒的表面形成一中間層。The metal is applied to the surface of the abrasive particles by thermal evaporation to form an intermediate layer.
上述步驟 (3)可被省略,而步驟(2)中是使多個披附奈米金屬氧化物層磨粒混合高分子聚合物形成散熱膏。The above step (3) can be omitted, and in the step (2), a plurality of coated nano metal oxide layer abrasive particles are mixed with the high molecular polymer to form a thermal grease.
本發明具有磨粒的產品的製法,包括上述本發明具有磨粒的產品記載的技術內容,不再重覆敘述。The method for producing a product having abrasive grains according to the present invention includes the technical contents described in the above-mentioned product having abrasive grains of the present invention, and will not be repeatedly described.
本發明可改良習知具有磨粒的產品及其製法 ,使磨粒的整個表面披附一層奈米金屬氧化物層,以增加磨粒與高分子結合劑的結合強度,提升產品的效率。The invention can improve the conventional abrasive grain product and the preparation method thereof, so that the whole surface of the abrasive grain is covered with a layer of nano metal oxide to increase the bonding strength between the abrasive grain and the polymer binder, and improve the efficiency of the product.
以上所記載,僅為利用本發明技術內容之實施例,任何熟悉本項技藝者運用本發明所為之修飾、變化,皆屬本發明主張之專利範圍,而不限於實施例所揭示者。The above description is only for the embodiments of the present invention, and any modifications and variations made by those skilled in the art using the present invention are the scope of the invention claimed, and are not limited to the embodiments disclosed.
1、2、3、4...具有磨粒的產品1, 2, 3, 4. . . Products with abrasive particles
10...磨粒10. . . Abrasive grain
101...奈米金屬氧化物層101. . . Nano metal oxide layer
102...中間層102. . . middle layer
20、21、22...基體20, 21, 22. . . Matrix
201、211、221...表面201, 211, 221. . . surface
30...高分子聚合物30. . . High molecular polymer
(1)、(2)、(3)...分別為步驟編號(1), (2), (3). . . Step number
圖1為本發明第一實施例具有磨粒的產品的示意圖。BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a schematic view of a product having abrasive grains according to a first embodiment of the present invention.
圖2為本發明第二實施例具有磨粒的產品的示意圖。Figure 2 is a schematic illustration of a product having abrasive particles in accordance with a second embodiment of the present invention.
圖3為本發明第三實施例具有磨粒的產品的示意圖。Figure 3 is a schematic illustration of a product having abrasive particles in accordance with a third embodiment of the present invention.
圖4為本發明第四實施例具有磨粒的產品的示意圖。Figure 4 is a schematic illustration of a product having abrasive particles in accordance with a fourth embodiment of the present invention.
圖5為本發明磨粒的整個表面披附一層奈米金屬氧化物層的示意圖。Figure 5 is a schematic illustration of the coating of a layer of nano metal oxide over the entire surface of the abrasive particles of the present invention.
圖6為本發明磨粒的表面與奈米金屬氧化物層之間具有一層中間層的示意圖。Figure 6 is a schematic illustration of an intermediate layer between the surface of the abrasive particles of the present invention and the nanometal oxide layer.
圖7為本發明具有磨粒的產品的製法的流程圖。Figure 7 is a flow chart showing the process for producing a product having abrasive grains according to the present invention.
(1)、(2)、(3)...分別為步驟編號(1), (2), (3). . . Step number
Claims (16)
多個磨粒,該磨粒的表面結合一層奈米金屬氧化物層;
一高分子聚合物;
其中該多個結合奈米金屬氧化物層的磨粒混合該高分子聚合物形成一散熱膏、或該多個結合奈米金屬氧化物層的磨粒混合該高分子聚合物披附在一基體的至少一側表面且該多個結合奈米金屬氧化物層的磨粒的一部分突出該高分子聚合物其中之一,俾藉由該奈米金屬氧化物層增加該磨粒與該高分子聚合物的結合強度,以提升產品的效率。A product with abrasive particles, including:
a plurality of abrasive grains, the surface of the abrasive particles is combined with a layer of nano metal oxide;
a high molecular polymer;
The plurality of abrasive particles combined with the nano metal oxide layer are mixed with the high molecular polymer to form a thermal grease, or the plurality of abrasive nanoparticles combined with the nano metal oxide layer are mixed and the polymer is attached to a substrate. At least one side surface and a portion of the plurality of abrasive particles bonded to the nano metal oxide layer protrudes from one of the high molecular polymers, and the abrasive particles are polymerized with the polymer by the nano metal oxide layer The strength of the bond to enhance the efficiency of the product.
(1)使磨粒的表面披附一層奈米金屬氧化物層;
(2)使多個披附奈米金屬氧化物層的磨粒與高分子聚合物混合。A method for producing a product having abrasive grains, comprising the steps of:
(1) coating a surface of the abrasive grain with a layer of nano metal oxide;
(2) A plurality of abrasive grains coated with a nano-metal oxide layer are mixed with a high-molecular polymer.
以熱蒸鍍的方式使金屬塗佈於磨粒的表面形成一層包括金屬層構成的中間層。The method for producing a product having abrasive grains according to claim 10, wherein the step (1) further comprises the following steps:
The metal is applied to the surface of the abrasive particles by thermal evaporation to form an intermediate layer comprising a metal layer.
(3)使混合多個披附奈米金屬氧化物層的磨粒後的高分子聚合物披附在一基體的至少一側表面;該多個結合奈米金屬氧化物層的磨粒的一部分突出該高分子聚合物;
其中該基體為砂紙、修整器、線鋸或砂輪中之一的基體;該多個磨粒包括天然鑽石、人造鑽石、立方氮化硼、碳化矽、三氧化二鋁或氧化鈰構成的超硬磨粒中至少一者;該高分子聚合物係由熱塑性高分子材料、熱固性高分子材料或彈性高分子材料中之一者構成的。The method for producing a product having abrasive grains according to any one of claims 8 to 12, wherein the step (2) comprises the following steps:
(3) affixing the abrasive polymer after mixing the plurality of coated nano metal oxide layers to at least one side surface of the substrate; the plurality of abrasive particles of the bonded nano metal oxide layer Highlighting the high molecular polymer;
Wherein the substrate is a substrate of one of a sandpaper, a trimmer, a wire saw or a grinding wheel; the plurality of abrasive grains comprise a superhard composed of natural diamond, synthetic diamond, cubic boron nitride, tantalum carbide, aluminum oxide or cerium oxide. At least one of the abrasive particles; the polymer is composed of one of a thermoplastic polymer material, a thermosetting polymer material, or an elastic polymer material.
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| TW100146373A TW201323154A (en) | 2011-12-15 | 2011-12-15 | Product having abrasive particles and manufacturing method thereof |
| CN201210097781.1A CN102699832B (en) | 2011-12-15 | 2012-04-01 | Product with abrasive particles and preparation method thereof |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100146373A TW201323154A (en) | 2011-12-15 | 2011-12-15 | Product having abrasive particles and manufacturing method thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN102699832B (en) |
| TW (1) | TW201323154A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI580501B (en) * | 2015-12-21 | 2017-05-01 | 銳捷科技股份有限公司 | Cutting wire |
| EP3642294A4 (en) * | 2017-06-21 | 2020-12-30 | Saint-Gobain Ceramics&Plastics, Inc. | Surface modified abrasive particles, abrasive articles and methods of forming thereof |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110842799B (en) * | 2019-11-19 | 2021-03-26 | 郑州磨料磨具磨削研究所有限公司 | Ceramic-metal composite binding agent grinding wheel and preparation method thereof |
| CN111230758B (en) * | 2020-03-05 | 2021-09-21 | 华侨大学 | Method for removing micro-particles on abrasive particle surface of large-particle-size diamond grinding tool and manufacturing method thereof |
| CN112778971A (en) * | 2021-01-14 | 2021-05-11 | 深圳陶陶科技有限公司 | Composite abrasive particle for polishing, grinding fluid and preparation method thereof |
| CN116512145A (en) * | 2023-05-08 | 2023-08-01 | 苏州钜锋砂带研磨有限公司 | High wear-resistant back velvet sand paper |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FI882662L (en) * | 1987-07-24 | 1989-01-25 | Lonza Ag | SLIP MEDEL. |
| ZA200609062B (en) * | 2004-09-23 | 2008-08-27 | Element Six Pty Ltd | Coated abrasive materials and method of manufacture |
| US7258708B2 (en) * | 2004-12-30 | 2007-08-21 | Chien-Min Sung | Chemical mechanical polishing pad dresser |
| CN102413983A (en) * | 2009-04-29 | 2012-04-11 | 贝卡尔特公司 | Cutting wire with abrasive particles partially embedded in a metal wire and partially retained by an organic binder |
| TWI398507B (en) * | 2009-07-03 | 2013-06-11 | Kinik Co | Thermal paste with modified diamond particles and manufacture method thereof |
-
2011
- 2011-12-15 TW TW100146373A patent/TW201323154A/en unknown
-
2012
- 2012-04-01 CN CN201210097781.1A patent/CN102699832B/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI580501B (en) * | 2015-12-21 | 2017-05-01 | 銳捷科技股份有限公司 | Cutting wire |
| EP3642294A4 (en) * | 2017-06-21 | 2020-12-30 | Saint-Gobain Ceramics&Plastics, Inc. | Surface modified abrasive particles, abrasive articles and methods of forming thereof |
| US11731244B2 (en) | 2017-06-21 | 2023-08-22 | Saint-Gobain Ceramics & Plastics, Inc. | Surface modified abrasive particles, abrasive articles and methods of forming thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102699832B (en) | 2015-06-24 |
| CN102699832A (en) | 2012-10-03 |
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