TW201330731A - Circuit substrate and display device - Google Patents
Circuit substrate and display device Download PDFInfo
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- TW201330731A TW201330731A TW101136708A TW101136708A TW201330731A TW 201330731 A TW201330731 A TW 201330731A TW 101136708 A TW101136708 A TW 101136708A TW 101136708 A TW101136708 A TW 101136708A TW 201330731 A TW201330731 A TW 201330731A
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- 239000000758 substrate Substances 0.000 title claims abstract description 13
- 230000036413 temperature sense Effects 0.000 claims 1
- 238000009877 rendering Methods 0.000 abstract 1
- 239000004519 grease Substances 0.000 description 9
- 239000000499 gel Substances 0.000 description 6
- 238000012545 processing Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000009529 body temperature measurement Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000012937 correction Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000002271 resection Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004986 Cholesteric liquid crystals (ChLC) Substances 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 108010010803 Gelatin Proteins 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
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- 239000003990 capacitor Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000008014 freezing Effects 0.000 description 1
- 238000007710 freezing Methods 0.000 description 1
- 239000008273 gelatin Substances 0.000 description 1
- 229920000159 gelatin Polymers 0.000 description 1
- 235000019322 gelatine Nutrition 0.000 description 1
- 235000011852 gelatine desserts Nutrition 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 230000010365 information processing Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133382—Heating or cooling of liquid crystal cells other than for activation, e.g. circuits or arrangements for temperature control, stabilisation or uniform distribution over the cell
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- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
Description
本發明係關於顯示裝置及其電路基板，特別是安裝了溫度感測器以使其對具有顯示裝置之顯示面板的溫度變動可正確追蹤並測定溫度的電路基板及顯示裝置。 The present invention relates to a display device and a circuit board thereof, and more particularly to a circuit board and a display device in which a temperature sensor is mounted so that the temperature variation of the display panel having the display device can be accurately tracked and the temperature is measured.
以往，已開發有使用電子紙作為顯示裝置之電子機器。電子紙係具有使用具有膽固醇液晶等之依電性之液晶顯示面板來構成，且可進行畫面顯示之重新寫入之特徵，並且具有薄型、柔軟性、輕量之特徵。 In the past, electronic devices using electronic paper as a display device have been developed. The electronic paper has a feature of using a liquid crystal display panel having a liquid crystal display such as a cholesteric liquid crystal, and can be rewritten in a screen display, and is characterized by being thin, flexible, and lightweight.
使用具有如前述特徵之電子紙的顯示裝置可於如紙或書籍這樣的意義上加以利用，可以高解析度進行顯示。又，由於僅於顯示資訊之重新寫入時消耗電力因此具有省電性優異等優點。 The display device using the electronic paper having the above-described features can be utilized in the sense of paper or books, and can be displayed with high resolution. Further, since power is consumed only when the information is rewritten, it has an advantage of being excellent in power saving.
另一方面，由於有顯示特性會依賴溫度而大幅度變化之課題，因此有必要藉由於顯示裝置設置溫度感測器來測定溫度並以顯示控制裝置加以控制，來抑制色不均等俾以安定地進行顯示。例如，已揭示有於電子紙等顯示裝置中設置溫度感測器來測定將顯示裝置驅動時之顯示部之周邊溫度的技術。(例如參考專利文獻1)。 On the other hand, since there is a problem that the display characteristics largely vary depending on the temperature, it is necessary to suppress the color unevenness by the temperature measurement of the display device and the display control device to suppress the color unevenness. Display. For example, a technique in which a temperature sensor is provided in a display device such as an electronic paper to measure the temperature around the display portion when the display device is driven has been disclosed. (For example, refer to Patent Document 1).
第1圖係用以說明習知之顯示裝置之顯示裝置之剖面圖。 BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a cross-sectional view showing a display device of a conventional display device.
使用第1圖針對具有溫度感測器之習知之顯示裝置簡單地進行說明。 A conventional display device having a temperature sensor will be briefly described using FIG.
第1圖中，溫度感測器30係藉由焊接安裝於電路基板20之其中一面。且，電路基板20係於另一面與顯示面板10呈相對向配置。又，電路基板20與顯示面板10有時並非完全密合，而於兩者間存在微小之間隙。 In the first drawing, the temperature sensor 30 is mounted on one side of the circuit substrate 20 by soldering. Further, the circuit board 20 is disposed on the other surface so as to face the display panel 10. Further, the circuit board 20 and the display panel 10 may not be completely in close contact with each other, and there is a slight gap between the two.
溫度感測器30目的係測定顯示面板10之溫度，但由於存在電路基板20與顯示面板10之間隙、以及電路基板20之厚度，因此無法正確測定顯示面板10之溫度。例如，於20℃左右之環境氣體中，有2~3℃的誤差，而於0℃左右之低溫則有將近10℃之誤差。又，在短時間有較大溫度變化產生的環境下，例如由20℃左右之室內移動至冰點以下之室外之情況中，儘管顯示面板10之溫度急遽下降，溫度感測器30所測定之溫度也不會急遽下降。 The temperature sensor 30 is intended to measure the temperature of the display panel 10. However, since the gap between the circuit board 20 and the display panel 10 and the thickness of the circuit board 20 are present, the temperature of the display panel 10 cannot be accurately measured. For example, in an ambient gas of about 20 ° C, there is an error of 2 to 3 ° C, and at a low temperature of about 0 ° C, there is an error of nearly 10 ° C. Further, in an environment in which a large temperature change occurs in a short period of time, for example, in a case where the room is moved to an outdoor area below the freezing point, the temperature measured by the temperature sensor 30 is drastically lowered in spite of a sudden drop in temperature of the display panel 10. It will not drop sharply.
因此，使用如此之電子紙的顯示裝置會安裝有修正電路，使其可藉由一般之電路構成來測定內部之溫度上升或測定環境溫度，並以因應溫度之條件進行顯示驅動。且，於動作時測定溫度並以因應該溫度條件修正之條件進行驅動，藉此進行溫度修正。 Therefore, a display device using such an electronic paper is provided with a correction circuit capable of measuring the internal temperature rise or measuring the ambient temperature by a general circuit configuration, and performing display driving under the conditions of the temperature. Further, the temperature is measured during the operation and the temperature is corrected by driving under the conditions of the temperature condition correction.
【專利文獻1】：日本特許公開公報、特開2010-231號公報 [Patent Document 1]: Japanese Patent Laid-Open Publication No. 2010-231
惟，如前述之電子紙，由於多使用於溫度依賴性高，又或可攜帶之便攜式機器，因此有必要擴大其操作溫度範圍。因此，內部溫度分布不固定且大部份溫度依賴性高之顯示面板之溫度與顯示裝置之驅動條件產生分歧，會有變成無法進行最佳驅動的問題點。 However, as described above, electronic paper is required to be expanded in its operating temperature range because it is often used in a portable device that is highly temperature-dependent or portable. Therefore, the internal temperature distribution is not fixed and the temperature of the display panel having a large temperature dependency is different from the driving condition of the display device, and there is a problem that the optimum driving cannot be performed.
又，使用於像這樣之顯示裝置之溫度感測器，例如數位溫度感測IC(Integrated Circuit；積體電路)係非常高功能性，其內部具有半導體感測器及AD(Analog Digital；類比數位)轉換部，與外部藉由串列通訊傳送溫度資訊。且，溫度感測器大多係以IC晶片之形態安裝於電路基板，且係以基板溫度之測定為前提所設計。因此，大多為與其他一般之IC同樣之封裝形狀，而有無法與電子紙搭載模組織顯示面板密合而難以正確地測量面板溫度的問題點。 Further, a temperature sensor used in a display device such as this, for example, a digital temperature sensing IC (Integrated Circuit) is highly functional, and has a semiconductor sensor and AD (Analog Digital; analog digital) therein. The conversion unit transmits temperature information to the outside by serial communication. Further, the temperature sensor is often mounted on a circuit board in the form of an IC chip, and is designed on the premise that the substrate temperature is measured. Therefore, it is often the same package shape as other general ICs, and there is a problem that it is difficult to accurately measure the panel temperature by being in close contact with the electronic paper-mounted mold structure display panel.
本發明係有鑒於如前述之實際情況者，使顯示面板之溫度與由溫度感測器所測定之溫度之差盡量縮小，並且使由溫度感測器所設定之溫度可正確地追蹤顯示面板之溫度變動，藉此可於顯示面板之溫度中以最適當之驅動條件進行製圖，亦可於使用溫度範圍內之任何溫度中進行顯示品質經確保之顯示。 The present invention is directed to minimizing the difference between the temperature of the display panel and the temperature measured by the temperature sensor as in the foregoing actual situation, and allowing the temperature set by the temperature sensor to correctly track the display panel. The temperature is varied, whereby the temperature of the display panel can be plotted under the most suitable driving conditions, and the display quality can be ensured at any temperature within the temperature range.
本發明為了解決前述課題而採用如以下之構 成。 In order to solve the aforementioned problems, the present invention adopts the following structure to make.
亦即，若從電路基板之觀點來看，係具有依溫度變動顯示狀態之顯示面板的顯示裝置之電路基板，該電路基板之特徵在於：具有前述電路基板之一部分經切除之切除部、及用以測定前述顯示面板之溫度的溫度感測器，且將前述溫度感測器配置於前述切除部。 In other words, from the viewpoint of the circuit board, the circuit board of the display device having the display panel according to the temperature fluctuation display state is characterized in that the circuit board is characterized in that the cut portion having a part of the circuit board is cut and used A temperature sensor for measuring the temperature of the display panel is disposed, and the temperature sensor is disposed in the cutout portion.
前述電路基板宜進一步具有控制部，該控制部可基於前述溫度感測器所檢測出之溫度資訊生成前述顯示面板之驅動訊號。 The circuit board preferably further includes a control unit that generates a driving signal of the display panel based on the temperature information detected by the temperature sensor.
前述溫度感測器宜透過配置於前述顯示面板與前述電路基板間之具有熱傳導性之熱傳導性構件來測定前述顯示面板之溫度。 Preferably, the temperature sensor measures the temperature of the display panel through a thermally conductive member disposed between the display panel and the circuit board.
前述切除部可為切除前述電路基板之邊緣所形成者亦可為形成於前述電路基板之孔。 The cutout portion may be formed by cutting an edge of the circuit board or may be a hole formed in the circuit board.
前述溫度感測器亦可正反反轉配置。 The aforementioned temperature sensor can also be configured in a forward and reverse direction.
前述顯示裝置宜為電子紙。 The aforementioned display device is preferably an electronic paper.
又，若從顯示裝置之觀點來看，係具有依溫度變動顯示裝置之顯示面板的顯示裝置，其特徵在於：具有前述電路基板之一部分經切除之切除部、及用以測定前述顯示面板之溫度的溫度感測器，且將前述溫度感測器配置於前述切除部。 Further, from the viewpoint of the display device, a display device having a display panel of a display device according to a temperature fluctuation is characterized in that: a cut-out portion having a portion of the circuit board removed, and a temperature for measuring the display panel a temperature sensor, and the aforementioned temperature sensor is disposed in the aforementioned cutout.
前述顯示裝置宜更具有控制部，該控制部係基於前述溫度感測器所檢測出之溫度資訊來生成前述顯示面板之驅動訊號。 Preferably, the display device further includes a control unit that generates a driving signal of the display panel based on the temperature information detected by the temperature sensor.
藉由本發明之實施形態所說明之技術，可達成使顯示面板溫度與由溫度感測器所測定之溫度之間的差極力縮小，並且可使由溫度感測器測定之溫度可正確追蹤顯示面板之溫度變動的效果。又，可達成於顯示面板之溫度中以最適當之驅動條件進行製圖，且可於使用溫度範圍內之任何溫度中進行顯示品質經確保之顯示的效果。 According to the technique described in the embodiment of the present invention, it is possible to minimize the difference between the temperature of the display panel and the temperature measured by the temperature sensor, and the temperature measured by the temperature sensor can correctly track the display panel. The effect of temperature changes. Further, it is possible to achieve the most appropriate driving conditions in the temperature of the display panel, and it is possible to perform the display of the display quality at any temperature within the use temperature range.
10‧‧‧顯示面板 10‧‧‧ display panel
20‧‧‧電路基板 20‧‧‧ circuit board
30‧‧‧溫度感測器 30‧‧‧temperature sensor
40‧‧‧顯示裝置 40‧‧‧ display device
41‧‧‧顯示部 41‧‧‧Display Department
42‧‧‧操作部 42‧‧‧Operation Department
50、50A、50B、50C‧‧‧電路基板 50, 50A, 50B, 50C‧‧‧ circuit board
51‧‧‧電子紙電源電路 51‧‧‧Electronic paper power circuit
52‧‧‧電子紙控制電路 52‧‧‧Electronic paper control circuit
53‧‧‧V-RAM(視訊隨機存取記憶 體；Video RAM(Random Access Memory)) 53‧‧‧V-RAM (Video Random Access Memory) Video RAM (Random Access Memory)
54‧‧‧RAM(隨機存取記憶體；Random Access Memory) 54‧‧‧RAM (Random Access Memory)
55‧‧‧主電源電路 55‧‧‧Main power circuit
56‧‧‧CPU(中央處理器；Center Processing Unit) 56‧‧‧CPU (Central Processing Unit; Center Processing Unit)
57‧‧‧快閃記憶體 57‧‧‧Flash memory
58‧‧‧音訊電路 58‧‧‧Optical circuit
61‧‧‧切除部(孔部) 61‧‧‧cutting section (hole)
62‧‧‧切除部 62‧‧‧Resection
63、64‧‧‧貫通孔 63, 64‧‧‧through holes
70‧‧‧滑脂 70‧‧‧ grease
第1圖係用以說明習知之顯示裝置的顯示裝置的剖面圖。 Fig. 1 is a cross-sectional view showing a display device of a conventional display device.
第2圖(A)~(D)係適用於本發明之顯示裝置之概略圖。 Fig. 2 (A) to (D) are schematic views of a display device to which the present invention is applied.
第3圖係顯示電路基板之圖。 Fig. 3 is a view showing a circuit board.
第4圖係顯示第1實施形態之圖。 Fig. 4 is a view showing the first embodiment.
第5圖係顯示第2實施形態之圖。 Fig. 5 is a view showing a second embodiment.
第6圖係顯示第3實施形態之圖。 Fig. 6 is a view showing a third embodiment.
第7圖係顯示第4實施形態之圖。 Fig. 7 is a view showing a fourth embodiment.
以下，針對本發明之實施形態一面參考圖式一面加以說明。 Hereinafter, embodiments of the present invention will be described with reference to the drawings.
第2圖係適用於本發明之顯示裝置之概略圖，其係顯示正面(A)、側面(B)、背面(C)及由背面側來檢視之內部構造(D)。 Fig. 2 is a schematic view of a display device to which the present invention is applied, showing a front surface (A), a side surface (B), a back surface (C), and an internal structure (D) viewed from the back side.
於第2圖中，顯示裝置40具有形成於筐體之其中 一面之矩形之顯示部41。於顯示部41之下方設有包含各種按鈕之操作部42。又，顯示裝置40具有用以建立與個人電腦等外部資訊機器之連接的各種介面、以及用以將記憶卡安裝脫離之記憶體插槽等。又，如第2圖之(D)所示於顯示裝置40之筐體內部安裝有電路基板50。 In FIG. 2, the display device 40 has a body formed therein. A rectangular display portion 41. An operation unit 42 including various buttons is provided below the display unit 41. Further, the display device 40 has various interfaces for establishing connection with an external information device such as a personal computer, and a memory slot for detaching the memory card. Further, as shown in FIG. 2(D), the circuit board 50 is mounted inside the casing of the display device 40.
第3圖係顯示電路基板之圖。 Fig. 3 is a view showing a circuit board.
第3圖中，電路基板50係將積體電路、電阻器、電容器等多數之電子構件固定於表面，並藉由將該等構件之間配線連接而構成電子電路之板狀或薄膜狀者。主要係於對基材浸漬具有絕緣性之樹脂的基板上以銅箔等導電體構成電路(圖案)配線。 In the third embodiment, the circuit board 50 is formed by fixing a plurality of electronic components such as an integrated circuit, a resistor, and a capacitor to the surface, and connecting the members to each other to form a plate shape or a film shape of the electronic circuit. Mainly, a circuit (pattern) wiring is formed on a substrate on which a substrate is impregnated with an insulating resin, such as a copper foil.
第3圖中，電路基板50係搭載於例如電子紙所使用之顯示裝置40。電路基板50係搭載有電子紙電源電路51、電子紙控制電路52、V-RAM(視訊隨機存取記憶體；video RAM(Random Access Memory))53、RAM(隨機存取記憶體；Random Access Memory)54、主電源電路55、CPU(中央處理器；Central Processing Unit)56、快閃記憶體57、音訊電路58及溫度感測器30。 In FIG. 3, the circuit board 50 is mounted on, for example, the display device 40 used for electronic paper. The circuit board 50 is equipped with an electronic paper power supply circuit 51, an electronic paper control circuit 52, a V-RAM (video random access memory; video RAM (Random Access Memory)) 53, and a RAM (random access memory; Random Access Memory). 54. A main power circuit 55, a CPU (Central Processing Unit) 56, a flash memory 57, an audio circuit 58, and a temperature sensor 30.
電子紙電源電路51係於電子紙所顯示之顯示資訊重新寫入時用以供給電力的電路。電子紙控制電路52係控制電子紙電源電路51。 The electronic paper power supply circuit 51 is a circuit for supplying electric power when the display information displayed on the electronic paper is rewritten. The electronic paper control circuit 52 controls the electronic paper power supply circuit 51.
V-RAM53係用以保持於顯示裝置40顯示之內容的記憶體(RAM)，RAM54係於CPU56進行各種演算處理時，將資料或程式暫時展開或儲存的記憶體。 The V-RAM 53 is a memory (RAM) for holding the content displayed on the display device 40, and the RAM 54 is a memory for temporarily expanding or storing data or programs when the CPU 56 performs various arithmetic processing.
主電源電路55係用以對顯示裝置40之全體供給電力的電路，CPU56係進行各種數值演算、資訊處理及機器控制等。 The main power supply circuit 55 is a circuit for supplying electric power to the entire display device 40, and the CPU 56 performs various numerical calculations, information processing, machine control, and the like.
快閃記憶體57係即使切斷電源資料亦不會消失的非依電性半導體記憶體，而使要使用於各種資料或程式之保存。又，音訊電路58係實施聲音資訊之輸出輸入、轉換、聲音之再生、及音量之調整等關於聲音資訊之處理。 The flash memory 57 is a non-electrical semiconductor memory that does not disappear even when the power supply data is cut off, and is used for storage of various materials or programs. Further, the audio circuit 58 performs processing of sound information such as outputting and inputting of sound information, conversion, reproduction of sound, and adjustment of volume.
接著，溫度感測器30係以測定顯示面板10之溫度為目的，例如以固定週期測定顯示面板10乃至顯示面板10附近之溫度，並於每次測定將與該溫度相對應之訊號輸出。 Next, the temperature sensor 30 measures the temperature of the display panel 10 or the vicinity of the display panel 10 at a fixed period for the purpose of measuring the temperature of the display panel 10, and outputs a signal corresponding to the temperature every time.
又，於電子紙控制電路52係輸入溫度感測器30所輸出之顯示面板10之溫度訊號，基於預先記憶於RAM54等之顯示面板10之溫度以及與驅動訊號對應關聯之表資訊來生成驅動訊號，並輸出至顯示面板10。 Further, the electronic paper control circuit 52 inputs the temperature signal of the display panel 10 outputted by the temperature sensor 30, and generates a driving signal based on the temperature of the display panel 10 previously stored in the RAM 54 or the like and the table information associated with the driving signal. And output to the display panel 10.
第4圖係顯示第1實施形態之圖。 Fig. 4 is a view showing the first embodiment.
第4圖中，電路基板50A係包含於顯示狀態依溫度變動之電子紙的顯示裝置40，電路基板50A藉由將其一部分切除形成經貫通之孔部61。 In Fig. 4, the circuit board 50A is a display device 40 for electronic paper whose temperature is changed in a display state, and the circuit board 50A is cut away to form a through-hole portion 61.
再者，用以測定顯示面板10之溫度的溫度感測器30係配置於孔部61。 Further, a temperature sensor 30 for measuring the temperature of the display panel 10 is disposed in the hole portion 61.
又，溫度感測器30通常係形成為由矩形形狀之組件伸出用以連接基板或插槽之多樹之連接端子的形態。像這樣的溫度感測器30，如第4圖所示，可藉由配置使溫度感 測器30之IC晶片收容於孔部61來縮小溫度感測器30與顯示面板10之間的距離，而可更正確地測定顯示面板10之溫度。而，孔部61至少要有可收容溫度感測器30之大小。又，使溫度感測器30之ID晶片之正反(上下)反轉使其仰臥配置於孔部61亦可。溫度感測器30由於係檢測出模具之溫度，因此，會受到組件溫度、接腳溫度、接腳所焊接之焊墊(電極)之溫度等影響。惟，藉由使溫度感測器30更接近顯示面板10，可使溫度感測器30所測定之溫度更接近顯示面板10之溫度。 Further, the temperature sensor 30 is generally formed in a form in which a connection terminal for connecting a plurality of trees of a substrate or a socket is extended by a rectangular-shaped component. The temperature sensor 30 like this can be configured to make a sense of temperature as shown in FIG. The IC chip of the detector 30 is housed in the hole portion 61 to reduce the distance between the temperature sensor 30 and the display panel 10, and the temperature of the display panel 10 can be more accurately measured. However, the hole portion 61 must have at least a size that can accommodate the temperature sensor 30. Further, the ID chip of the temperature sensor 30 may be reversed (up and down) to be placed on the hole 61 in the supine position. Since the temperature sensor 30 detects the temperature of the mold, it is affected by the temperature of the component, the temperature of the pin, the temperature of the pad (electrode) to which the pin is soldered, and the like. However, by bringing the temperature sensor 30 closer to the display panel 10, the temperature measured by the temperature sensor 30 can be brought closer to the temperature of the display panel 10.
第5圖係顯示第2實施形態之圖。 Fig. 5 is a view showing a second embodiment.
第5圖中，電路基板50B係與第1實施形態相同包含於使用依溫度變動顯示狀態之電子紙的顯示裝置40。電路基板50B係藉由將其邊緣之一部份切除形成切除部62。接著，將用以測定顯示面板10之溫度之溫度感測器30配置於切除部62。又，溫度感測器30，與第1實施形態相同，如第5圖所示配置使溫度感測器30之IC晶片收容於切除部62，藉此縮小溫度感測器30與顯示面板10之間之距離，而可更正確地測定顯示面板10之溫度。而，切除部62至少要有可收容溫度感測器30之大小。又，配置使溫度感測器30之IC晶片之正反(上下)反轉而仰臥配置於切除部62亦可。 In the fifth embodiment, the circuit board 50B is included in the display device 40 using electronic paper in a temperature-variable display state as in the first embodiment. The circuit substrate 50B is formed by cutting a portion of its edge to form a cutout portion 62. Next, the temperature sensor 30 for measuring the temperature of the display panel 10 is placed in the cutout portion 62. Further, the temperature sensor 30 is disposed in the same manner as in the first embodiment, and the IC chip of the temperature sensor 30 is placed in the cutout portion 62 as shown in FIG. 5, thereby reducing the temperature sensor 30 and the display panel 10. The distance between the display panels 10 can be more accurately determined. However, the cutout portion 62 must have at least a size that can accommodate the temperature sensor 30. Further, the IC chip of the temperature sensor 30 may be placed in the reverse direction (up and down) and placed on the cut-off portion 62.
第6圖係顯示第3實施形態之圖。 Fig. 6 is a view showing a third embodiment.
如第6圖所示，適用於本發明之第3實施形態係於前述 第1實施形態及第2實施形態中，於顯示面板10與溫度感測器30之間之微小間隙，介入有具有熱傳導性之構件即滑脂70。接著，溫度感測器30係透過配置於顯示面板10與電路基板50A或電路基板50B之間之滑脂70來測定顯示面板10之溫度。而滑脂70亦可使用熱傳導性接著劑、導熱片或散熱橡膠等來取代。 As shown in Fig. 6, the third embodiment applicable to the present invention is as described above. In the first embodiment and the second embodiment, the grease 70, which is a member having thermal conductivity, is interposed in a small gap between the display panel 10 and the temperature sensor 30. Next, the temperature sensor 30 measures the temperature of the display panel 10 through the grease 70 disposed between the display panel 10 and the circuit board 50A or the circuit board 50B. The grease 70 can also be replaced with a thermally conductive adhesive, a thermally conductive sheet, or a heat dissipating rubber.
藉由透過如此之滑脂70等，溫度感測器30可更正確地測定及追蹤顯示面板10之溫度。 By passing such a grease 70 or the like, the temperature sensor 30 can more accurately measure and track the temperature of the display panel 10.
然而，作為滑脂70或片類可使用非矽膠系熱傳導滑脂、散熱矽膠凝膠片、散熱矽膠、片狀熱傳導凝膠、糊狀熱傳導凝膠、散熱非矽膠凝膠、絕緣塗佈劑、超高熱傳導石墨片材或高熱傳導矽膠片等。 However, as the grease 70 or the sheet, non-rubber-based heat-conductive grease, heat-dissipating gel gel sheet, heat-dissipating gel, sheet-like heat-conducting gel, paste-like heat-conducting gel, heat-dissipating non-gelatin gel, insulating coating agent, Ultra-high heat conductive graphite sheet or high heat conductive ruthenium film.
第7圖係顯示第4實施形態之圖。 Fig. 7 is a view showing a fourth embodiment.
第7圖中，電路基板50C係與第1至第3實施形態相同包含於使用依溫度變動顯示狀態之電子紙的顯示裝置40。 In the seventh embodiment, the circuit board 50C is included in the display device 40 using electronic paper in a temperature-variable display state, similarly to the first to third embodiments.
電路基板50C係藉由切除其一部分來形成經貫通之貫通孔63。貫通孔63由於較第1實施形態中所說明之孔部61小，因此無法將溫度感測器30配置於其空隙中。在此溫度感測器30係配置於電路基板50C之表面而覆蓋貫通孔63。換言之，於溫度感測器30所安裝之電路基板50C之下部位置設置貫通孔63，並使顯示面板10密合於溫度感測器30所安裝之對面側之貫通孔63之週邊。藉此，使溫度感測器30所測定之溫度與顯示面板10之溫度之差縮小，而溫度感 測器30可正確地測定顯示面板10之溫度。 The circuit board 50C forms a through-hole 63 that penetrates by cutting a part thereof. Since the through hole 63 is smaller than the hole portion 61 described in the first embodiment, the temperature sensor 30 cannot be disposed in the gap. The temperature sensor 30 is disposed on the surface of the circuit board 50C to cover the through hole 63. In other words, the through hole 63 is provided at a position below the circuit board 50C to which the temperature sensor 30 is mounted, and the display panel 10 is brought into close contact with the periphery of the through hole 63 on the opposite side to which the temperature sensor 30 is mounted. Thereby, the difference between the temperature measured by the temperature sensor 30 and the temperature of the display panel 10 is reduced, and the temperature is sensed. The detector 30 can correctly determine the temperature of the display panel 10.
然而，亦可將第3實施形態中所說明之熱傳導性之滑脂70等具有熱傳導性之構件填充於貫通孔63。 However, a member having thermal conductivity such as the thermally conductive grease 70 described in the third embodiment may be filled in the through hole 63.
又，電路基板50C之貫通孔63以外之部分，即溫度感測器30所安裝之部分之電路圖案，以在多層之情況中針對包含內層之所有層加以排除的方式製造，藉此減小溫度感測器30以外之電子構件(半導體構件)之熱之影響，而可提升溫度測定之精確度。 Further, a portion other than the through hole 63 of the circuit board 50C, that is, a portion of the circuit pattern in which the temperature sensor 30 is mounted, is manufactured in such a manner as to exclude all layers including the inner layer in the case of a plurality of layers, thereby reducing The influence of the heat of the electronic component (semiconductor member) other than the temperature sensor 30 can improve the accuracy of the temperature measurement.
更甚者，如第7圖所示，不僅溫度感測器30之本體部分，針對與溫度感測器30之接腳接觸之焊墊部亦設置貫通孔64，藉此可使由接腳朝溫度感測器30之內部之熱傳導性更佳。當然，亦可將熱傳導性滑脂70等具有熱傳導性之構件填充於貫通孔64。 Moreover, as shown in FIG. 7, not only the body portion of the temperature sensor 30 but also the through hole 64 is provided for the pad portion contacting the pin of the temperature sensor 30, thereby allowing the pin to face The thermal conductivity inside the temperature sensor 30 is better. Of course, a member having thermal conductivity such as the thermally conductive grease 70 may be filled in the through hole 64.
以上，一面參考圖式一面說明本發明之實施形態，但本發明係不限於前述實施形態者，而可採用於不脫離本發明之主旨之範圍內之各種構成或形狀。 The embodiments of the present invention have been described above with reference to the drawings, but the present invention is not limited to the embodiments described above, and various configurations or shapes within the scope of the gist of the invention may be employed.
10‧‧‧顯示面板 10‧‧‧ display panel
30‧‧‧溫度感測器 30‧‧‧temperature sensor
50A‧‧‧電路基板 50A‧‧‧ circuit board
61‧‧‧切除部 61‧‧‧Resection
Claims (9)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2011/074982 WO2013061467A1 (en) | 2011-10-28 | 2011-10-28 | Circuit substrate and display device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201330731A true TW201330731A (en) | 2013-07-16 |
Family
ID=48167330
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101136708A TW201330731A (en) | 2011-10-28 | 2012-10-04 | Circuit substrate and display device |
Country Status (2)
| Country | Link |
|---|---|
| TW (1) | TW201330731A (en) |
| WO (1) | WO2013061467A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI866060B (en) * | 2022-02-10 | 2024-12-11 | 日商鎧俠股份有限公司 | Substrate unit, memory system, and electronic device |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2021118061A (en) * | 2020-01-23 | 2021-08-10 | シャープ株式会社 | Self-luminous display device |
| WO2024221129A1 (en) * | 2023-04-23 | 2024-10-31 | 京东方科技集团股份有限公司 | Display panel and display apparatus |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0232222A (en) * | 1988-07-21 | 1990-02-02 | Matsushita Electric Ind Co Ltd | temperature sensor |
| JP3517967B2 (en) * | 1994-07-27 | 2004-04-12 | カシオ計算機株式会社 | Liquid crystal display |
| JP2006090704A (en) * | 2004-09-21 | 2006-04-06 | Ishizuka Electronics Corp | Temperature sensor |
| JP5131115B2 (en) * | 2008-09-22 | 2013-01-30 | 富士通株式会社 | Display system and display device |
-
2011
- 2011-10-28 WO PCT/JP2011/074982 patent/WO2013061467A1/en not_active Ceased
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2012
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI866060B (en) * | 2022-02-10 | 2024-12-11 | 日商鎧俠股份有限公司 | Substrate unit, memory system, and electronic device |
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