TW201345336A - Method and structure for soldering conductor and printed circuit board - Google Patents
Method and structure for soldering conductor and printed circuit board Download PDFInfo
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- TW201345336A TW201345336A TW101114295A TW101114295A TW201345336A TW 201345336 A TW201345336 A TW 201345336A TW 101114295 A TW101114295 A TW 101114295A TW 101114295 A TW101114295 A TW 101114295A TW 201345336 A TW201345336 A TW 201345336A
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Abstract
Description
本發明係一種導體與電路板的焊接方法及其結構，尤指一種更為節省空間、導電性更佳且成本更為低廉之導體與電路板的焊接方法及其結構。
The invention relates to a welding method and a structure of a conductor and a circuit board, in particular to a welding method and a structure of a conductor and a circuit board which are more space-saving, more conductive and less expensive.
隨著科技的日益進步，電腦、智慧型手機或是筆記型電腦等電子產品均已廣泛的被人們所使用，而以智慧型手機為例，其不僅僅具有傳統通訊裝置之各項通訊功能，且可以藉由內建的作業系統來達到收發電子郵件、使用即時通訊軟體、瀏覽網際網路以及撰寫文件等等目的。如此一來，人們不僅可以利用智慧型手機來撥打電話，還有著如筆記型電腦之多樣化功能，帶給了人們莫大的便利。而不論是電腦、智慧型手機或是筆記型電腦等電子產品，其內部電子零件都必須要藉由印刷電路板來乘載及連接，請參閱第一圖與第二圖所示，係為習用導體與電路板的焊接結構之實施示意圖一與二，由圖中可清楚看出，習用導體與電路板的焊接結構包括一電路板11、一鎳磚12以及一導體13。該電路板11包括一導電區111，該鎳磚12以表面黏著技術（SMT, surface mount technology）設置於該導電區111之上，以及該導體13設置於該鎳磚12之上。藉由前述結構，當該導體13與該電路板11進行連接時，係透過鎳磚12作為介質，再針對欲連接之部分進行點焊製程，即可使得該導體13與該電路板11達到電性連接的目的。然而，為了方便攜帶，對於外型要求輕、薄、短、小的手持電子產品來說，其裝置本身的體積受到相當限制，對於導體與電路板的連接結構則需要更為微小化且精密，以因應目前電子產品的發產趨勢。是以，要如何解決上述習用之問題與缺失，即為本發明之發明人與從事此行業之相關廠商所亟欲研究改善之方向所在者。
With the advancement of technology, electronic products such as computers, smart phones or notebook computers have been widely used by people. For smart phones, for example, they not only have the communication functions of traditional communication devices. And through the built-in operating system to achieve e-mail, use instant messaging software, browse the Internet and write files. In this way, people can not only use smart phones to make calls, but also have the diversified functions of notebook computers, which brings great convenience to people. Whether it is an electronic product such as a computer, a smart phone or a notebook computer, its internal electronic components must be loaded and connected by a printed circuit board. Please refer to the first and second figures for the purpose. A schematic diagram of the construction of the welded structure of the conductor and the circuit board is shown in Figs. 1 and 2. The soldering structure of the conventional conductor and the circuit board includes a circuit board 11, a nickel brick 12 and a conductor 13. The circuit board 11 includes a conductive region 111 disposed on the conductive region 111 by surface mount technology (SMT), and the conductor 13 is disposed on the nickel tile 12. With the foregoing structure, when the conductor 13 is connected to the circuit board 11, the nickel brick 12 is used as a medium, and the spot welding process is performed on the portion to be connected, so that the conductor 13 and the circuit board 11 can be electrically connected. The purpose of sexual connection. However, in order to facilitate carrying, for a hand-held electronic product requiring a light, thin, short, and small appearance, the volume of the device itself is considerably limited, and the connection structure between the conductor and the circuit board needs to be more miniaturized and precise. In response to the current trend of electronic products. Therefore, how to solve the above problems and deficiencies in the above-mentioned applications, that is, the inventors of the present invention and those involved in the industry are eager to study the direction of improvement.
故，本發明之發明人有鑑於上述缺失，乃搜集相關資料，經由多方評估及考量，並以從事於此行業累積之多年經驗，經由不斷試作及修改，始設計出此種發明專利者。本發明之第一目的在於提供一種更為節省空間的導體與電路板的焊接方法及其結構。本發明之第二目的在於提供一種導電性更佳的導體與電路板的焊接方法及其結構。本發明之第三目的在於提供一種成本更為低廉的導體與電路板的焊接方法及其結構。為了達到上述之目的，本發明包括一種導體與電路板的焊接方法，包括：提供一電路板，該電路板包括一導電區；形成一錫層於該導電區之上；置放一導體於該錫層之上；以及對該導體之部分區域進行一點焊製程，使得該導體之部分區域直接連接至該導電區。在一較佳實施例中，該對該導體之部分區域進行一點焊製程步驟，進一步包括：對該導體之兩部分區域進行一點焊製程。以及，本發明還包括一種導體與電路板的焊接結構，包括：一電路板，該電路板包括一導電區；一錫層，該錫層設置於該導電區之部分區域之上；以及一導體，該導體之部分區域設置於該導電區之上，該導體之其餘區域設置於該錫層之上，其中，該導體之部分區域係進行一點焊製程，使得該導體之部分區域直接連接至該導電區。在一較佳實施例中，該導電區為銅。在一較佳實施例中，該導體為銅。在一較佳實施例中，該導體為銅合金、鋁合金或是鎳合金。在一較佳實施例中，該導體連接至一鋰電池。其中，由於本發明進行點焊製程時，不需要額外介質（鎳磚），僅需要預先於該電路板之該導電區形成該錫層，即可以對該導體一次性的進行點焊製程，藉此，相較於先前技術，本發明可以有效節省空間，使得電子產品更為輕薄。且當本發明對該導體之部分區域進行一點焊製程時，位於導體之部分區域下方一部份的錫層的錫層會因為擠壓而擴散到導體之其餘區域，一部份的錫層會因為高溫而汽化，因此，該導體之部分區域會直接連接至該導電區，相較於先前技術，本發明的導電性更佳。最後，由於本發明進行點焊製程時不需要使用額外介質（鎳磚），僅要對該導體部分區域進行一次性點焊製程即完成焊接製程，因此，相較於先前技術，本發明點焊製程更為簡單，進一步的降低了製造成本。
Therefore, in view of the above-mentioned deficiencies, the inventors of the present invention have collected relevant materials, and have evaluated and considered such patents through continuous evaluation and modification through multi-party evaluation and consideration, and through years of experience in the industry. A first object of the present invention is to provide a more space-saving method of soldering a conductor and a circuit board and a structure thereof. A second object of the present invention is to provide a method and a structure for soldering a conductor and a circuit board which are more conductive. A third object of the present invention is to provide a method and a structure for soldering a conductor and a circuit board which are less expensive. In order to achieve the above object, the present invention includes a method of soldering a conductor and a circuit board, comprising: providing a circuit board, the circuit board including a conductive region; forming a tin layer over the conductive region; placing a conductor thereon Above the tin layer; and a portion of the conductor is subjected to a spot welding process such that a portion of the conductor is directly connected to the conductive region. In a preferred embodiment, the step of soldering a portion of the conductor further comprises: performing a one-point soldering process on the two portions of the conductor. And, the present invention also includes a soldering structure of a conductor and a circuit board, comprising: a circuit board including a conductive region; a tin layer disposed on a portion of the conductive region; and a conductor a portion of the conductor is disposed on the conductive region, and a remaining portion of the conductor is disposed on the tin layer, wherein a portion of the conductor is subjected to a spot welding process such that a portion of the conductor is directly connected to the portion Conductive zone. In a preferred embodiment, the conductive region is copper. In a preferred embodiment, the conductor is copper. In a preferred embodiment, the conductor is a copper alloy, an aluminum alloy or a nickel alloy. In a preferred embodiment, the conductor is connected to a lithium battery. Wherein, since the spot welding process of the present invention does not require additional medium (nickel brick), it is only necessary to form the tin layer in advance in the conductive region of the circuit board, that is, the spot welding process can be performed on the conductor at one time. Therefore, compared with the prior art, the present invention can effectively save space and make the electronic product thinner and lighter. When the present invention performs a one-point soldering process on a portion of the conductor, a portion of the tin layer under the portion of the conductor may diffuse into the remaining portion of the conductor due to extrusion, and a portion of the tin layer will Because of the high temperature vaporization, a portion of the conductor is directly connected to the conductive region, and the conductivity of the present invention is better than in the prior art. Finally, since the additional welding medium (nickel brick) is not required in the spot welding process of the present invention, the welding process is completed only by performing a one-time spot welding process on the partial portion of the conductor, and therefore, the spot welding of the present invention is compared with the prior art. The process is simpler and further reduces manufacturing costs.
為達成上述目的及功效，本發明所採用之技術手段及構造，茲繪圖就本發明較佳實施例詳加說明其特徵與功能如下，俾利完全了解。請參閱第三圖至第七圖所示，係為本發明較佳實施例之流程圖、實施示意圖一至四，由第三圖中可清楚看出，本發明一種導體與電路板的焊接方法，包括：（101）提供一電路板，該電路板包括一導電區；（102）形成一錫層於該導電區之上；（103）置放一導體於該錫層之上；以及（104）對該導體之部分區域進行一點焊製程，使得該導體之部分區域直接連接至該導電區。
於該步驟（101）中，如第四圖，該電路板21係為一印刷電路板21，係預先設計有線路的設計以及圖面，而該導電區211為導電效果良好之材料所製成，所屬技術領域中具有通常知識者應可以輕易理解。於該步驟（102）中，該錫層22係以噴塗方式形成於該電路板21上，較佳地，該錫層22厚度為0.017mm，若為較厚或較薄也可以使用，請注意，圖中所示並非為實際之比例，為了詳盡說明，圖示有誇大部分。於該步驟（103）中，如第五圖，於進行點焊製程前，係先置放該導體23於該錫層22之上適當位置處。於該步驟（104）中，如第六圖，於本實施例係利用兩點焊棒24對該導體23之兩部分區域來進行點焊製程，若僅利用一點焊棒24或是三以上點焊棒24也是可行的方案，於常理判斷，越多的點焊棒24，其應可造成更多該導體23與該導電區211的接觸面積。而點焊製程係透過擠壓以及高溫實施於該導體23之部分區域，所屬技術領域中具有通常知識者應可輕易理解。如第七圖，當點焊製程完成後，位於導體23之部分區域下方一部份的錫層22會因為擠壓而擴散到導體23之其餘區域，一部份的錫層22會因為高溫而汽化，因此，該導體23之部分區域會直接連接至該導電區211。請參閱第七圖所示，係為本發明較佳實施例之實施示意圖四，由圖中可清楚看出，藉由本發明導體與電路板的焊接方法之完成物即為一種導體與電路板的焊接結構，包括：一電路板21、一錫層22以及一導體23。該電路板21包括一導電區211，較佳地，該導電區211為銅。
該錫層22設置於該導電區211之部分區域之上，較佳地，該錫層22厚度為0.017mm，若為較厚或較薄也可以使用。該導體23之部分區域設置於該導電區211之上，該導體23之其餘區域設置於該錫層22之上，其中，該導體23之部分區域係進行一點焊製程，使得該導體23之部分區域直接連接至該導電區211，較佳地，該導體23為銅、銅合金、鋁合金或是鎳合金，並且該導體23連接至一鋰電池（圖中未示）。另外，根據本發明之導體23與電路板21的焊接方法及其結構，茲提供實驗數據來佐證本發明確實具有導電性佳之無法預期功效。對照組一：如第一圖與第二圖所示，導體13為鎳合金，該鎳磚12設置於該導電區111之上，透過焊接製程使得該導體13透過該鎳磚連接於電路板11達到電性連接的目的；經過測量，該導體13與該電路板11間之電阻為5.72 mΩ。實驗組一：如第七圖所示，導體23為鎳合金，透過點焊製程使得該導體23之部分區域直接連接至該導電區211；經過測量，該導體23與該電路板21間之電阻為0.21 mΩ。對照組二：圖中未示，導體為銅，透過高溫融化錫膏連接導體至電路板之導電區；經過測量，該導體與該電路板間之電阻為0.42 mΩ。實驗組二：如第七圖所示，導體23為銅，透過點焊製程使得該導體23之部分區域直接連接至該導電區211；經過測量，該導體23與該電路板21間之電阻為0.23 mΩ。請參閱全部附圖所示，相較於習用技術，本發明具有以下優點：一、本發明進行點焊製程時，不需要額外介質（鎳磚），可以有效節省空間，使得電子產品更為輕薄。二、本發明導體23之部分區域直接連接至該導電區211，本發明的導電性更佳。三、本發明僅要對該導體23部分區域進行一次性點焊製程，其製程更為簡單，進一步的降低了製造成本。透過上述之詳細說明，即可充分顯示本發明之目的及功效上均具有實施之進步性，極具產業之利用性價值，且為目前市面上前所未見之新發明，完全符合發明專利要件，爰依法提出申請。唯以上所述著僅為本發明之較佳實施例而已，當不能用以限定本發明所實施之範圍。即凡依本發明專利範圍所作之均等變化與修飾，皆應屬於本發明專利涵蓋之範圍內，謹請貴審查委員明鑑，並祈惠准，是所至禱。
In order to achieve the above objects and effects, the technical means and the structure of the present invention will be described in detail with reference to the preferred embodiments of the present invention. Please refer to the third to seventh embodiments, which are flowcharts and implementation diagrams 1 to 4 of the preferred embodiment of the present invention. As can be clearly seen from the third figure, the present invention relates to a method for soldering a conductor and a circuit board. The method includes: (101) providing a circuit board, the circuit board includes a conductive region; (102) forming a tin layer over the conductive region; (103) placing a conductor over the tin layer; and (104) A partial soldering process is performed on a portion of the conductor such that a portion of the conductor is directly connected to the conductive region.
In the step (101), as shown in the fourth figure, the circuit board 21 is a printed circuit board 21, which is pre-designed with a circuit design and a drawing surface, and the conductive region 211 is made of a material with good electrical conductivity. Those of ordinary skill in the art should be able to easily understand. In the step (102), the tin layer 22 is formed on the circuit board 21 by spraying. Preferably, the tin layer 22 has a thickness of 0.017 mm. If it is thick or thin, it can be used. The figures shown in the figure are not actual ratios. For the sake of detailed explanation, the illustrations are exaggerated. In the step (103), as in the fifth figure, the conductor 23 is placed at an appropriate position on the tin layer 22 before the spot welding process. In the step (104), as in the sixth embodiment, in the embodiment, the two-point welding rod 24 is used to perform the spot welding process on the two portions of the conductor 23, if only a single welding rod 24 or more than three points are used. The welding rod 24 is also a feasible solution. Judging by common sense, the more spot welding rods 24, the more the contact area of the conductor 23 with the conductive area 211 should be caused. The spot welding process is carried out in a portion of the conductor 23 by extrusion and high temperature, which should be readily understood by those of ordinary skill in the art. As shown in the seventh figure, after the spot welding process is completed, a portion of the tin layer 22 located under a portion of the conductor 23 may be diffused into the remaining area of the conductor 23 by extrusion, and a portion of the tin layer 22 may be due to high temperature. Vaporization, therefore, a portion of the conductor 23 is directly connected to the conductive region 211. Please refer to the seventh embodiment, which is a schematic diagram of the implementation of the preferred embodiment of the present invention. It can be clearly seen from the figure that the finished method of the soldering method of the conductor and the circuit board of the present invention is a conductor and a circuit board. The solder structure includes a circuit board 21, a tin layer 22, and a conductor 23. The circuit board 21 includes a conductive region 211. Preferably, the conductive region 211 is copper.
The tin layer 22 is disposed on a portion of the conductive region 211. Preferably, the tin layer 22 has a thickness of 0.017 mm, and may be used if it is thick or thin. A portion of the conductor 23 is disposed over the conductive region 211, and a remaining portion of the conductor 23 is disposed over the tin layer 22, wherein a portion of the conductor 23 is subjected to a spot welding process such that a portion of the conductor 23 The region is directly connected to the conductive region 211. Preferably, the conductor 23 is copper, a copper alloy, an aluminum alloy or a nickel alloy, and the conductor 23 is connected to a lithium battery (not shown). Further, according to the welding method of the conductor 23 and the circuit board 21 of the present invention and the structure thereof, experimental data are provided to confirm that the present invention does have an unpredictable effect of good electrical conductivity. Control group 1: As shown in the first figure and the second figure, the conductor 13 is a nickel alloy, and the nickel brick 12 is disposed on the conductive region 111, and the conductor 13 is connected to the circuit board 11 through the nickel brick through a soldering process. The purpose of electrical connection is achieved; after measurement, the resistance between the conductor 13 and the circuit board 11 is 5.72 mΩ. Experimental group 1: As shown in the seventh figure, the conductor 23 is a nickel alloy, and a portion of the conductor 23 is directly connected to the conductive region 211 through a spot welding process; the resistance between the conductor 23 and the circuit board 21 is measured. It is 0.21 mΩ. Control group 2: The figure is not shown, the conductor is copper, and the conductive paste is connected to the conductive area of the circuit board through a high-temperature melting solder paste; after measurement, the resistance between the conductor and the circuit board is 0.42 mΩ. Experimental group 2: As shown in the seventh figure, the conductor 23 is copper, and a portion of the conductor 23 is directly connected to the conductive region 211 through a spot welding process; after measurement, the resistance between the conductor 23 and the circuit board 21 is 0.23 mΩ. Referring to all the drawings, the present invention has the following advantages compared with the conventional technology: 1. When the spot welding process of the present invention, no additional medium (nickel brick) is needed, which can effectively save space and make the electronic product thinner and lighter. . 2. The partial region of the conductor 23 of the present invention is directly connected to the conductive region 211, and the conductivity of the present invention is better. 3. The present invention only requires a one-time spot welding process for a portion of the conductor 23, which is simpler in process and further reduces manufacturing costs. Through the above detailed description, it can fully demonstrate that the object and effect of the present invention are both progressive in implementation, highly industrially usable, and are new inventions not previously seen on the market, and fully comply with the invention patent requirements. , 提出 apply in accordance with the law. The above is only the preferred embodiment of the present invention, and is not intended to limit the scope of the invention. All changes and modifications made in accordance with the scope of the patent of the invention shall fall within the scope of the patent of the invention. Please ask the reviewer to give a clear explanation and pray for it.
11．．．電路板11. . . Circuit board
111．．．導電區111. . . Conductive zone
12．．．鎳磚12. . . Nickel brick
13．．．導體13. . . conductor
21．．．電路板twenty one. . . Circuit board
211．．．導電區211. . . Conductive zone
22．．．錫層twenty two. . . Tin layer
23．．．導體twenty three. . . conductor
24．．．點焊棒twenty four. . . Spot welding rod
(101)~(104)．．．步驟(101)~(104). . . step
第一圖 係為習用導體與電路板的焊接結構之實施示意圖一。第二圖 係為習用導體與電路板的焊接結構之實施示意圖二。第三圖 係為本發明較佳實施例之流程圖。第四圖 係為本發明較佳實施例之實施示意圖一。第五圖 係為本發明較佳實施例之實施示意圖二。第六圖 係為本發明較佳實施例之實施示意圖三。第七圖 係為本發明較佳實施例之實施示意圖四。
The first figure is a schematic diagram of the implementation of the welded structure of the conventional conductor and the circuit board. The second figure is a schematic diagram 2 of the implementation of the welding structure of the conventional conductor and the circuit board. The third figure is a flow chart of a preferred embodiment of the present invention. The fourth figure is a first embodiment of the preferred embodiment of the present invention. The fifth drawing is a schematic diagram 2 of the preferred embodiment of the present invention. The sixth figure is a third embodiment of the preferred embodiment of the present invention. The seventh figure is a fourth embodiment of the preferred embodiment of the present invention.
(101)~(104)．．．步驟(101)~(104). . . step
Claims (7)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101114295A TW201345336A (en) | 2012-04-20 | 2012-04-20 | Method and structure for soldering conductor and printed circuit board |
| CN2012101291043A CN102781175A (en) | 2012-04-20 | 2012-04-28 | Welding method and structure of conductor and circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101114295A TW201345336A (en) | 2012-04-20 | 2012-04-20 | Method and structure for soldering conductor and printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201345336A true TW201345336A (en) | 2013-11-01 |
Family
ID=47125874
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101114295A TW201345336A (en) | 2012-04-20 | 2012-04-20 | Method and structure for soldering conductor and printed circuit board |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN102781175A (en) |
| TW (1) | TW201345336A (en) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4180855B2 (en) * | 2002-07-22 | 2008-11-12 | ミヤチテクノス株式会社 | Method for controlling movable electrode of bonding apparatus |
| JP4225094B2 (en) * | 2003-03-31 | 2009-02-18 | ミツミ電機株式会社 | Multilayer printed circuit board connection pattern structure and multilayer printed circuit board |
| JP2007005471A (en) * | 2005-06-22 | 2007-01-11 | Mitsumi Electric Co Ltd | Circuit board equipment |
| US8598464B2 (en) * | 2009-04-20 | 2013-12-03 | Panasonic Corporation | Soldering material and electronic component assembly |
| TWM444013U (en) * | 2012-04-20 | 2012-12-21 | Gallopwire Entpr Co Ltd | Soldering structure for conductor and circuit board |
-
2012
- 2012-04-20 TW TW101114295A patent/TW201345336A/en unknown
- 2012-04-28 CN CN2012101291043A patent/CN102781175A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| CN102781175A (en) | 2012-11-14 |
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