TW201410092A - Rigid-flexible circuit substrate, rigid-flexible circuit board and method for manufacturing same - Google Patents

Abstract

A rigid-flexible circuit substrate includes a flexible circuit board, a core substrate, a first laminating adhesive sheet, a second laminating adhesive sheet, a third trace layer and a fourth trace layer. The flexible circuit board includes a exposed region and a laminated region connecting the exposed region. The core substrate connects to the laminated region. The first laminating adhesive sheet and the second laminating adhesive sheet are laminated on two opposite side surfaces of the core substrate and the laminated region of the flexible circuit board. A number of electrical conductive blocks are formed in the core substrate, the first laminating adhesive sheet and the second laminating adhesive sheet. Trace layers of the flexible circuit board electrically communicated with the third trace layer and the fourth trace layer by the electrical conductive blocks. The present disclosure also provides a method for manufacturing the rigid-flexible circuit substrate, a rigid-flexible circuit board and a method for manufacturing the rigid-flexible circuit board.

Description

Soft and hard combined circuit board, soft and hard combined circuit board and manufacturing method thereof

The invention relates to the field of circuit board manufacturing, in particular to a soft and hard combined circuit substrate, a manufacturing method thereof, a soft and hard combined circuit board and a manufacturing method thereof.

Printed circuit boards have been widely used due to their high assembly density. For application of the board, please refer to the literature Takahashi, A. Ooki, N. Nagai, A. Akahoshi, H. Mukoh, A. Wajima, M. Res. Lab, High density multilayer printed circuit board for HITAC M-880, IEEE Trans On Components, Packaging, and Manufacturing Technology, 1992, 15(4): 1418-1425.

The hard and soft bonding circuit board is a circuit board structure including both a flexible board and a hard board which are connected to each other, and can have both the flexibility of the flexible circuit board and the hardness of the rigid circuit board. In the manufacturing process of the soft-hard bonded circuit board, the insulating layer and the conductive layer are laminated on the flexible circuit board, and then the conductive layer is formed to form a conductive circuit layer. Thus, in the manufacturing process of the soft and hard combined circuit board, multiple press-fitting and conductive circuit manufacturing steps are required, so that the manufacturing process of the flexible combined circuit board is long, and the efficiency of the hard and soft combined circuit board production is low.

In view of the above, a soft and hard combined circuit substrate, a manufacturing method thereof, a soft and hard combined circuit board, and a manufacturing method thereof are provided, so that it is necessary to provide a soft and hard combined circuit board manufacturing efficiency.

A soft and hard combined circuit substrate comprises a flexible circuit board, a core substrate, a first press film, a second press film, a fifth conductive circuit layer and a sixth conductive circuit layer, wherein the flexible circuit board comprises an exposed area and a connection In the nip area of the exposed area, the core substrate has a first opening corresponding to the flexible circuit board, the flexible circuit board is received in the first opening, the first press film and the second press The film is respectively pressed on opposite sides of the core substrate, and is also located on opposite sides of the nip, the fourth conductive layer is formed on the surface of the first press film away from the core substrate, and the fifth conductive layer is formed on the film The second press-fit film is away from the surface of the core substrate, the first press-fit film comprises a first press-fit film body, a plurality of first electrical connectors and a plurality of second electrical connectors, and the first press-fit film body has a second opening corresponding to the exposed area, the plurality of first electrical connectors and the plurality of second electrical connectors are disposed in the first press film body and are in contact with the sixth conductive circuit layer, The plurality of first electrical connectors are also pressed The plurality of second electrical connectors are further electrically connected to the core substrate, and the second press film comprises a second press film body, a plurality of third electrical connectors, and a plurality of a fourth electrical connector, the second embossed film body has a third opening corresponding to the exposed area, and the plurality of third electrical connectors and the plurality of fourth electrical connectors are disposed in the second embossed film body Each of the plurality of third electrical connectors is in contact with and electrically connected to the nip. The plurality of fourth electrical connectors are also electrically connected to the core substrate.

A manufacturing method of a soft and hard combined circuit substrate, comprising the steps of: providing a flexible circuit board, the flexible circuit board comprising an exposed area and a nip area connected to the exposed area; providing a core substrate, a first press film, a second laminated film, a first copper foil and a second copper foil, wherein the core substrate has a first opening corresponding to the flexible circuit board, the first pressed film comprises a first film body, a plurality of first And a plurality of second electrical connectors, the first film body has a second opening corresponding to the exposed area, and the plurality of first electrical connectors and the plurality of second electrical connectors are respectively disposed on the first pressing a film body, the plurality of first electrical connectors corresponding to the nip area, the second press film comprising a second press film body, a plurality of third electrical connectors, and a plurality of fourth electrical connections The second press-fit film body has a third opening corresponding to the exposed area, and the plurality of third electrical connectors and the plurality of fourth electrical connectors are disposed in the second film body, the plurality of third An electrical connector corresponding to the nip; pressing the soft a circuit board, a core substrate, a first press film, a second press film, a first copper foil and a second copper foil, so that the flexible circuit board is fitted into the first opening of the core substrate, the first The press-fit film and the second press-fit film are respectively pressed on opposite sides of the core substrate, and are also located on opposite sides of the nip, and the first copper foil is formed on the surface of the first press film away from the core substrate. a second copper foil is formed on the surface of the second press film away from the core substrate, the first copper foil is electrically connected to the core substrate through the second electrical connector, and the second copper foil is passed through the fourth electrical connector The core substrate is electrically connected, the first electrical connector electrically connects the nip of the flexible circuit board with the first copper foil, and the third electrical connector electrically connects the nip of the flexible circuit board with the second copper foil; And selectively removing a portion of the first copper foil to form a fifth conductive wiring layer, selectively removing a portion of the second copper foil to form a sixth conductive wiring layer, and the fifth conductive wiring layer is electrically connected to the core substrate through the second electrical connector The sixth conductive circuit layer passes through the fourth electrical connector and the core layer Electrically conductive plate, electrically connected to the first electrical connection region of the flexible circuit board laminated with five conductive circuit layer, the third electrical connector is electrically connected to nip the flexible circuit board and the sixth conductive trace layer.

A soft and hard combined circuit board comprising a soft and hard bonded circuit substrate, a first connecting film and a first outer substrate, which are press-fitted together, the first connecting film being pressed against the first outer substrate and the soft Between the fifth conductive circuit layers of the hard circuit substrate, the first outer substrate includes a seventh conductive circuit layer, a fifth insulating layer, and an eighth conductive circuit layer, which are sequentially disposed, and a plurality of the fifth insulating layer are formed Conducting a second conductive via of the seventh conductive circuit layer and the eighth conductive circuit layer, the first connecting film comprising a first connecting film body and a plurality of fifth electrical connectors disposed in the first film body, The fifth conductive circuit layer and the seventh conductive circuit layer are electrically connected to each other through the plurality of fifth electrical connectors, and the first outer substrate and the first connecting film body are formed with corresponding to the exposed area of the flexible circuit board. Opening to expose the flexible circuit board.

A method for manufacturing a soft and hard combined circuit board, comprising the steps of: forming a soft and hard combined circuit substrate by using the method of manufacturing the soft and hard combined circuit substrate; providing a first outer substrate and a first connecting film, the first outer substrate The seventh conductive circuit layer, the fifth insulating layer and the eighth conductive circuit layer are sequentially disposed, and a plurality of second conductive holes electrically conducting the seventh conductive circuit layer and the eighth conductive circuit layer are formed in the fifth insulating layer. Forming a plurality of fifth electrical connectors penetrating through the first connecting film in the first connecting film; pressing the first outer substrate, the first connecting film, and the soft and hard bonding circuit substrate, the plurality of fifth electrical connections The fifth conductive circuit layer and the seventh conductive circuit layer of the first outer substrate are electrically connected to each other; and a first slit penetrating the first outer substrate and the first connecting film is formed along a boundary line between the exposed region and the nip And removing the portion of the first outer substrate and the first connecting film surrounded by the first slit, thereby obtaining a soft and hard bonding circuit board.

The soft and hard combined circuit board provided by the technical solution and the manufacturing method thereof are formed by using a printed metal conductive paste in the manufacturing process, and the conductive hole can be improved by the method of forming the conductive hole by electroplating in the prior art. Hardly combine the reliability of the board and reduce the manufacturing cost of the hard and soft board. In addition, since the plug hole is formed by printing in the connecting film or the substrate in the prior art, the layer-by-layer lamination and layer-by-layer conduction can reduce the hard and soft bonding circuit board manufacturing process. The number of presses is combined to improve the efficiency of the hard and soft board production.

The method for fabricating a soft-hard combination circuit board provided by the first embodiment of the present technical solution includes the following steps:

In the first step, referring to FIG. 1, a flexible circuit board 110 is provided.

The flexible circuit board 110 is a circuit board on which conductive lines are formed. The flexible circuit board 110 can be a single-sided circuit board or a double-sided circuit board. In the present embodiment, the flexible circuit board 110 is taken as an example of a double-sided circuit board. The flexible circuit board 110 includes a first cover film 118, a first electromagnetic mask layer 116, a second insulating layer 114, a first conductive wiring layer 112, a first insulating layer 111, a second conductive wiring layer 113, and a third layer which are sequentially stacked. The insulating layer 115, the second electromagnetic mask layer 117, and the second cover film 119. The first insulating layer 111 includes an opposite first surface 1111 and a second surface 1112. The first conductive wiring layer 112 is formed on the first surface 1111 of the first insulating layer 111, and the second conductive wiring layer 113 is formed on the first insulating layer 111. The second surface 1112.

The flexible circuit board 110 is substantially rectangular and includes an exposed area 1101 and a first nip 1102 and a second nip 1103 connected to opposite sides of the exposed area 1101. The exposed area 1101 is also rectangular, which is used to form a soft region of the hard and soft bonded circuit board. The first nip 1102 and the second nip 1103 are for fixed connection to the rigid circuit board. In the embodiment, in the plane in which the flexible circuit board 110 is located, the extending direction from the first nip 1102 to the second nip 1103 is defined as a length direction, and the direction perpendicular to the extending direction is defined as a width direction. The first conductive wiring layer 112 and the second conductive wiring layer 113 both extend along the length direction, and both extend from the first nip 1102 through the exposed region 1101 to the second nip region 1103.

In the second insulating layer 114 in the first nip 1102 and the second nip 1103, a plurality of first holes 1141 are formed such that a portion of the first conductive wiring layer 112 is exposed from the first holes 1141. In the third insulating layer 115 in the first nip 1102 and the second nip 1103, a plurality of second holes 1151 are formed such that a portion of the second conductive wiring layer 113 is exposed from the second holes 1151.

The first electromagnetic mask layer 116, the second electromagnetic mask layer 117, the first cover film 118, and the second cover film 119 are located in the entire exposed area 1101, and are also located in a portion of the first nip 1102 adjacent to the exposed area 1101 and A portion of the second nip 1103 adjacent to the exposed region 1101. Both the first electromagnetic mask layer 116 and the second electromagnetic mask layer 117 can be formed by printing a conductive silver paste. The first cover film 118 is formed on the exposed surface of the first electromagnetic mask layer 116, that is, on the surface of the first electromagnetic mask layer 116 away from the second insulating layer 114 and the side of the first electromagnetic mask layer 116, for Covering and protecting the first electromagnetic shielding layer 116, the second covering film 119 is formed on the surface of the second electromagnetic shielding layer 117 away from the third insulating layer 115 and the side of the second electromagnetic shielding layer 117 for covering and protecting A second electromagnetic mask layer 117.

In the second step, please refer to FIG. 2 to FIG. 8 to provide a core substrate 120, a first press film 130, a second press film 140, a first copper foil 150 and a second copper foil 160.

Referring to FIG. 2, the thickness of the core substrate 120 is substantially equal to the thickness of the flexible circuit board 110. A first opening 121 corresponding to the flexible circuit board 110 is formed in the core substrate 120. Correspondingly, the cross-sectional area and shape of the first opening 121 are consistent with the flexible circuit board 110. The core substrate 120 includes, along the length direction, a first molding region 127 and a second molding region 128 that are connected to both ends of the first opening 121. The core substrate 120 includes a fourth insulating layer 124, a third conductive wiring layer 122, and a fourth conductive wiring layer 123. The third conductive wiring layer 122 is formed on one surface of the fourth insulating layer 124, and the fourth conductive wiring layer 123 is formed on the other opposite surface of the fourth insulating layer 124. In the core substrate 120, a plurality of first conductive vias 125 are formed, and the third conductive trace layer 122 is electrically connected to the fourth conductive via layer 123 via the plurality of first conductive vias 125.

Referring to FIG. 3, the first press film 130 may be a low flow semi-cured film. A second opening 131 corresponding to the exposed region 1101 of the flexible circuit board 110 is formed in the first press film 130. The first press film 130 includes a first press film body 130a, a plurality of first electrical connectors 1331, and a plurality of second electrical connectors 1332. A plurality of first through holes 1321 and a plurality of second through holes 1322 are formed in the first press film body 130a. The first through hole 1321 is located closer to the second opening 131 than the second through hole 1322 , and the first through hole 1321 is located between the second opening 131 and the plurality of second through holes 1322 . A first electrical connection body 1331 is formed in each of the first through holes 1321. The first electrical connection body 1331 in each of the first through holes 1321 is disposed coaxially with the first through hole 1321 and penetrates the first through hole 1321. Both ends of the first electrical connector 1331 extend through the first through holes 1321. The first electrical connector 1331 corresponds to the first hole 1141 of the second insulating layer 114. A second electrical connection body 1332 is formed in each of the second through holes 1322. The second electrical connection body 1332 in each of the second through holes 1322 is coaxially disposed with the second through holes 1322 and penetrates the second through holes 1322. Two ends of the second electrical connector 1332 extend through the second through holes 1322, respectively. The first electrical connector 1331 has a one-to-one correspondence with the first hole 1141. In this embodiment, the first electrical connector 1331 and the second electrical connector 1332 are both made of a metal conductive paste. A copper conductive paste is preferred.

Referring to FIG. 4, the structure of the second press film 140 is substantially the same as that of the first press film 130, and the second press film 140 may also be a low-flow semi-cured film. Specifically, a third opening 141 corresponding to the exposed area 1101 of the flexible circuit board 110 is formed in the second press film 140. The second press film 140 includes a second press film body 140a, a plurality of third electrical connectors 1431, and a plurality of fourth electrical connectors 1432. A plurality of third through holes 1421 and a plurality of fourth through holes 1422 are formed in the second pressed film 140 of the second pressed film body 140a. The third through hole 1421 is located closer to the third opening 141 than the fourth through hole 1422 , and the third through hole 1421 is located between the third opening 141 and the plurality of fourth through holes 1422 . A third electrical connection body 1431 is formed in each of the third through holes 1421. The third electrical connection body 1431 in each of the third through holes 1421 is disposed coaxially with the third through hole 1421 and penetrates the third through hole 1421. The two ends of the third electrical connector 1431 extend through the third through holes 1421. The third electrical connector 1431 is in one-to-one correspondence with the second hole 1151 of the third insulating layer 115. A fourth electrical connector 1432 is formed in each of the fourth through holes 1422. The fourth electrical connector 1432 in each of the fourth through holes 1422 is coaxially disposed with the fourth through hole 1422 and extends through the fourth through hole 1422. Both ends of the fourth electrical connector 1432 extend through the fourth through hole 1422, respectively. In this embodiment, the third electrical connector 1431 and the fourth electrical connector 1432 are made of a metal conductive paste. A copper conductive paste is preferred.

The first copper foil 150 and the second copper foil 160 are preferably continuous rolled copper foils, but may be continuous electrolytic copper foils as shown in FIG.

The lengths of the core substrate 120, the first press film 130, the second press film 140, the first copper foil 150, and the second copper foil 160 are all greater than the length of the flexible circuit board 110. In this embodiment, the core substrate 120, the first press film 130, the second press film 140, the first copper foil 150, and the second copper foil 160 have the same length.

Referring to FIG. 5 to FIG. 8, the core substrate 120 can be made by the following method:

First, a copper clad substrate 120a is provided. The copper clad substrate 120a is a double-sided copper clad substrate including a first copper foil layer 122a, a fourth insulating layer 124, and a second copper foil layer 123a. The fourth insulating layer 124 is located between the first copper foil layer 122a and the second copper foil layer 123a. A first opening 121 is formed in the copper clad substrate 120a, and the shape and size of the first opening 121 correspond to the shape and size of the flexible circuit board 110.

Next, a first peelable protective adhesive layer 129 is formed on the surface of the first copper foil layer 122a remote from the fourth insulating layer 124. The first peelable protective adhesive layer 129 may be a peelable polyethylene terephthalate film. In this step, the first peelable protective adhesive layer 129 may also be formed on the surface of the second copper foil layer 123a away from the fourth insulating layer 124 to protect the second copper foil layer 123a.

Thirdly, a first blind hole 125a penetrating only the first peelable protective adhesive layer 129, the first copper foil layer 122a and the fourth insulating layer 124 is formed in the copper clad substrate 120a by laser ablation, and is in the first blind A first conductive material 125b is formed in the hole 125a, thereby obtaining a first conductive hole 125. In this embodiment, a first blind hole 125a may be formed from the first peelable protective adhesive layer 129 to the fourth insulating layer 124 by using a combination of carbon dioxide laser and ultraviolet laser. The first conductive material 125b may be formed by printing a conductive paste and curing. Preferably, the first conductive material 125b is made of a conductive copper paste. The first peelable protective adhesive layer 129 can prevent the conductive paste from being formed on the surfaces of the first copper foil layer 122a and the second copper foil layer 123a when the first conductive material 125b is formed by printing.

Again, the first peelable protective layer 129 is removed. The first peelable protective layer 129 can be removed by direct peeling.

Finally, a portion of the first copper foil layer 122a is selectively removed to form a third conductive wiring layer 122, and a portion of the second copper foil layer 123a is selectively removed to form a fourth conductive wiring layer 123.

In this embodiment, a portion of the first copper foil layer 122a may be selectively removed by an image transfer process and an etching process to form a third conductive wiring layer 122, and a portion of the second copper foil layer 123a may be selectively removed to form a fourth conductive wiring layer 123.

Referring to FIGS. 9 to 12 together, the first press film 130 can be obtained by the following method:

First, a first press-fit film body 130a is provided as shown in FIG. 5, and the second opening 131 is formed in the first press-fit film body 130a, and the second opening 131 is opposite to the exposed area 1101 of the flexible circuit board 110. correspond.

Next, as shown in FIG. 6, a second peelable protective adhesive layer 135 is formed on opposite surfaces of the first press-fit film body 130a, and a second peelable protective adhesive layer 135 covers the second opening 131. The second peelable protective adhesive layer 135 may be a peelable polyethylene terephthalate film.

Thirdly, a plurality of first through holes 1321 and a plurality of second through holes penetrating the second peelable protective adhesive layer 135, the first pressed film body 130a, and the second peeling protective adhesive layer 135 are formed in the first pressed film body 130a by laser ablation. The first through hole 1321 is located closer to the second opening 131 than the second through hole 1322 , and the first through hole 1321 is located between the second opening 131 and the plurality of second through holes 1322 . The conductive paste is printed in the first through hole 1321 and the second through hole 1322, and the conductive paste is cured to form the first electrical connector 1331 and the second electrical connector 1332. Since the second peelable protective adhesive layer 135 has a thickness, the first electrical connector 1331 and the second electrical connector 1332 protrude from the opposite surfaces of the first press-fit film body 130a.

Finally, the second peelable protective layer 135 of the opposite two surfaces of the first press-fit film body 130a is removed to obtain the first press-fit film 130.

The second press film 140 is formed in substantially the same manner as the first press film 130.

In the third step, referring to FIG. 14, the flexible circuit board 110, the core substrate 120, the first press film 130, the second press film 140, the first copper foil 150, and the second copper foil 160 are aligned and pressed. Synthesize into a whole.

When the alignment is performed, the first copper foil 150, the first pressed film 130, the core substrate 120, the second pressed film 140, and the second copper foil 160 are sequentially stacked, and the flexible circuit board 110 is placed on the first pressed film 130. Between the second press film 140 and the first opening 121 of the core substrate 120. The second opening 131 of the first press film 130 and the third opening 141 of the second press film 140 respectively correspond to the exposed area 1101 of the flexible circuit board 110, and the first press film 130 is located at the first of the flexible circuit board 110. The nip area 1102 and the second nip area 1103 and one side surface of the core substrate 120, the second emboss film 140 is located at the first nip 1102 and the second nip 1103 of the flexible circuit board 110 and the core substrate The other side surface of 120.

In this embodiment, the first to fourth electrical connectors are all made of a conductive paste, and deformation can be generated during the heating and pressing process. The first electrical connector 1331 of the first laminated film 130 passes through the first hole 1141 of the flexible circuit board 110, is in contact with the first conductive circuit layer 112, and is electrically connected. The first electrical connector 1331 is pressed. A first conductive via hole electrically conducting the first conductive wiring layer 112 and the first copper foil 150 is formed. The second electrical connector 1332 of the first press film 130 is in contact with and electrically conductive with the first conductive via 125 of the core substrate 120. The third electrical connector 1431 of the second laminated film 140 passes through the second hole 1151 of the flexible circuit board 110, is in contact with the second conductive circuit layer 113, and is electrically connected. The third electrical connector 1431 forms an electrical continuity. The second conductive circuit layer 113 and the second conductive blind hole of the second copper foil 160. The fourth electrical connector 1432 of the second press film 140 is in contact with the first conductive via 125 of the core substrate 120 and is electrically conducted. Therefore, one end of each of the first conductive holes 125 is connected to the second electrical connector 1332, and the other end is connected to the fourth electrical connector 1432. Each of the first conductive vias 125 and the second electrical connector 1332 and the fourth electrical connector 1432 connected thereto are formed with a third conductive via hole electrically conducting the first copper foil 150 and the second copper foil 160.

It can be understood that the second electrical connector 1332 is not directly connected to the first conductive via 125, and the second electrical connector 1332 can be electrically connected to the third conductive trace layer 122. The fourth electrical connector 1432 may not be directly connected to the first conductive via 125, and the fourth electrical connector 1432 may be electrically connected to the fourth conductive trace layer 123.

After pressing, the core substrate 120, the first press film 130, and the second press film 140 are cured to form a hard portion, and the exposed region 1101 of the flexible circuit board 110 forms a soft portion.

In the fourth step, referring to FIG. 15, a portion of the first copper foil 150 is selectively removed to form at least a portion of the first copper foil 150 to form a fifth conductive circuit layer 151 on the surface of the first press film 130, and selectively remove portions. The second copper foil 160 is formed to form at least a portion of the second copper foil 160 on the sixth conductive wiring layer 161 on the surface of the second press film 140, thereby obtaining a soft-hard bonded circuit substrate 100a. The fifth conductive circuit layer 151 and the sixth conductive circuit layer 161 may be formed by an image transfer process and an etching process.

In this embodiment, only the first copper portion corresponding to the first molding region 127, the second molding region 128 of the core substrate 120, the first nip region 1102 and the second nip region 1103 of the flexible circuit board 110 is used. The foil 150 is selectively etched to obtain a fifth conductive wiring layer 151, that is, the first copper foil 150 pressed onto the surface of the first laminated film 130 is selectively etched to obtain a fifth conductive wiring layer 151. Only the second copper foil 160 corresponding to the first molding region 127, the second molding region 128, the first nip region 1102, and the second nip region 1103 of the core substrate 120 is selectively etched to obtain a sixth conductive line. Layer 161. The second copper foil 160 to be pressed against the surface of the second press film 140 is selectively etched to obtain a sixth conductive wiring layer 161. A portion of the first copper foil 150 and a portion of the second copper foil 160 covering the exposed region 1101 are not etched. It can be understood that, in this step, the residual first copper foil 150 and the second copper foil 160 corresponding to the exposed region 1101 can also be completely removed.

In this embodiment, a portion of the first copper foil 150 and a portion of the second copper foil 160 covering the exposed region 1101 are not etched, and the flexible circuit board 110 shielded by the flexible circuit board can be protected when the soft and hard circuit board is subsequently fabricated.

In the soft and hard-bonding circuit substrate 100a, the exposed region 1101 of the flexible circuit board 110 and the first copper foil 150 and the second copper foil 160 on the surface thereof constitute a soft board region of the soft and hard bonded circuit substrate 100a, and the remaining portions constitute a soft and hard region. In combination with the hard plate region of the circuit substrate 100a, the thickness of the soft plate region is smaller than the thickness of the hard plate region, and the material is soft, and can be bent and deformed with respect to the hard plate region, thereby forming the soft and hard bonded circuit substrate 100a.

Referring to FIG. 15 , a second embodiment of the present invention provides a soft and hard bonded circuit substrate 100 a obtained by the above manufacturing method, which comprises the flexible circuit board 110 and the core substrate 120 which are pressed together as described above. The first press film 130, the second press film 140, the fifth conductive circuit layer 151, and the sixth conductive circuit layer 161.

The flexible circuit board 110 includes a first cover film 118, a first electromagnetic mask layer 116, a second insulating layer 114, a first conductive wiring layer 112, a first insulating layer 111, a second conductive wiring layer 113, and a third layer which are sequentially stacked. The insulating layer 115, the second electromagnetic mask layer 117, and the second cover film 119. The first insulating layer 111 includes an opposite first surface 1111 and a second surface 1112. The first conductive wiring layer 112 is formed on the first surface 1111 of the first insulating layer 111, and the second conductive wiring layer 113 is formed on the first insulating layer 111. The second surface 1112.

The flexible circuit board 110 is substantially rectangular and includes an exposed area 1101 and a first nip 1102 and a second nip 1103 connected to opposite sides of the exposed area 1101. The exposed area 1101 is also rectangular, which is used to form a soft region of the hard and soft bonded circuit board. The first nip 1102 and the second nip 1103 are for fixed connection to the rigid circuit board. In the embodiment, in the plane in which the flexible circuit board 110 is located, the extending direction from the first nip 1102 to the second nip 1103 is defined as a length direction, and the direction perpendicular to the extending direction is defined as a width direction. The conductive lines in the first conductive wiring layer 112 and the second conductive wiring layer 113 extend in the length direction and extend from the first bonding region 1102 through the exposed region 1101 to the second pressing region 1103.

In the second insulating layer 114 in the first nip 1102 and the second nip 1103, a plurality of first holes 1141 are formed such that a portion of the first conductive wiring layer 112 is exposed from the first holes 1141. In the third insulating layer 115 in the first nip 1102 and the second nip 1103, a plurality of second holes 1151 are formed such that a portion of the second conductive wiring layer 113 is exposed from the second holes 1151.

The first electromagnetic mask layer 116, the second electromagnetic mask layer 117, the first cover film 118 and the second cover film 119 are attached to a portion of the first nip 1102 located in the entire exposed area 1101 and adjacent to the exposed area 1101. And a portion of the second nip 1103 adjacent to the exposed region 1101. Both the first electromagnetic mask layer 116 and the second electromagnetic mask layer 117 can be formed by printing a conductive silver paste. The first cover film 118 is used to cover and protect the first electromagnetic mask layer 116, and the second cover film 119 is used to cover and protect the second electromagnetic mask layer 117.

The core substrate 120 includes, along the length direction, a first molding region 127 and a second molding region 128 that are connected to both ends of the first opening 121. The core substrate 120 includes a fourth insulating layer 124, a third conductive wiring layer 122, and a fourth conductive wiring layer 123. The third conductive wiring layer 122 is formed on one surface of the fourth insulating layer 124, and the fourth conductive wiring layer 123 is formed on the other opposite surface of the fourth insulating layer 124. In the core substrate 120, a plurality of first conductive vias 125 are formed, and the third conductive trace layer 122 is electrically connected to the fourth conductive via layer 123 via the plurality of first conductive vias 125.

The first press film 130 can be a low flow semi-cured film. A second opening 131 corresponding to the exposed region 1101 of the flexible circuit board 110 is formed in the first press film 130. The first press film 130 includes a first press film body 130a, a plurality of first electrical connectors 1331, and a plurality of second electrical connectors 1332. A plurality of first through holes 1321 and a plurality of second through holes 1322 are formed in the first press film body 130a. The first through hole 1321 is located closer to the second opening 131 than the second through hole 1322 , and the first through hole 1321 is located between the second opening 131 and the plurality of second through holes 1322 . A first electrical connection body 1331 is formed in each of the first through holes 1321. The first electrical connection body 1331 in each of the first through holes 1321 is disposed coaxially with the first through hole 1321 and penetrates the first through hole 1321. Both ends of the first electrical connector 1331 extend through the first through holes 1321. The first electrical connector 1331 corresponds to the first hole 1141 of the second insulating layer 114. A second electrical connection body 1332 is formed in each of the second through holes 1322. The second electrical connection body 1332 in each of the second through holes 1322 is coaxially disposed with the second through holes 1322 and penetrates the second through holes 1322. Two ends of the second electrical connector 1332 extend through the second through holes 1322, respectively. The first electrical connector 1331 has a one-to-one correspondence with the first hole 1141. The second electrical connector 1332 corresponds to the first conductive via 125 of the core substrate 120. In this embodiment, the first electrical connector 1331 and the second electrical connector 1332 are both made of a metal conductive paste. A copper conductive paste is preferred.

Referring to FIG. 3, the structure of the second press film 140 is substantially the same as that of the first press film 130, and the second press film 140 may also be a low-flow semi-cured film. Specifically, a third opening 141 corresponding to the exposed area 1101 of the flexible circuit board 110 is formed in the second press film 140. The second press film 140 includes a second press film body 140a, a plurality of third electrical connectors 1431, and a plurality of fourth electrical connectors 1432. A plurality of third through holes 1421, a third through hole 1421 and a plurality of fourth through holes 1422 are formed in the second pressed film 140 of the second pressed film body 140a. The third through hole 1421 is located closer to the third opening 141 than the fourth through hole 1422, and the third through hole 1421 is located in the third opening 141 and the plurality of fourth through holes. Between 1422. A third electrical connection body 1431 is formed in each of the third through holes 1421 of each of the third through holes 1421. The third electrical connection body 1431 in the third through hole 1421 of each of the third through holes 1421 is disposed coaxially with the third through hole 1421 of the third through hole 1421 and penetrates the third through hole 1421 of the third through hole 1421. The two ends of the third electrical connector 1431 extend through the third through hole 1421 of the third through hole 1421. The third electrical connector 1431 is in one-to-one correspondence with the second hole 1151 of the third insulating layer 115. A fourth electrical connector 1432 is formed in each of the fourth through holes 1422. The fourth electrical connector 1432 in each of the fourth through holes 1422 is coaxially disposed with the fourth through hole 1422 and extends through the fourth through hole 1422. Both ends of the fourth electrical connector 1432 extend through the fourth through hole 1422, respectively. Each of the fourth electrical connectors 1432 corresponds to one of the first conductive vias 125 of the core substrate 120. In this embodiment, the third electrical connector 1431 and the fourth electrical connector 1432 are made of a metal conductive paste. A copper conductive paste is preferred.

The third conductive line 151 is formed on a surface of the first press film 130 away from the core substrate 120. The sixth conductive wiring layer 161 is formed on a surface of the second press film 140 away from the core substrate 120. Both sides of the exposed region 1101 are covered by the first copper foil 150 and the second copper foil 160, respectively.

The first electrical connector 1331 of the first laminated film 130 passes through the first hole 1141 of the flexible circuit board 110, and is electrically connected to the first conductive circuit layer 112. The first electrical connector 1331 forms a conductive first conductive layer. 112 and a first conductive via hole 1104 of the fifth conductive circuit layer 151. The third electrical connector 1431 of the second laminated film 140 passes through the second hole 1151 of the flexible circuit board 110 and is electrically connected to the second conductive circuit layer 113. The third electrical connector 1431 forms a conductive second conductive. The second conductive via 1105 of the circuit layer 113 and the sixth conductive circuit layer 161. One end of each of the first conductive holes 125 is connected to the second electrical connector 1332, and the other end is connected to the fourth electrical connector 1432. Each of the first conductive vias 125 and the second electrical connector 1332 and the fourth electrical connector 1432 connected thereto are formed with a third conductive via 1106 electrically conducting the fifth conductive layer 151 and the sixth conductive layer 161. Thereby, the third conductive circuit layer 122 and the fifth conductive circuit layer 151 of the core substrate 120 are electrically connected to each other. The fourth conductive wiring layer 123 and the sixth conductive wiring layer 161 are electrically connected to each other.

The third embodiment of the present technical solution provides a method for manufacturing a soft and hard combined circuit board, and the manufacturing method includes the following steps:

In the first step, referring to FIG. 15, the soft and hard bonded circuit substrate 100a is provided. The hard and soft combined circuit substrate 100a can be fabricated by using the manufacturing method provided by the first embodiment of the present technical solution.

In the second step, referring to FIG. 16 to FIG. 19, a first connecting film 171, a second connecting film 172, a first outer substrate 181 and a second outer substrate 182 are provided.

The first connecting film 171 and the second connecting film 172 are manufactured in a similar manner to the first pressing film 130 in the first embodiment, except that the first connecting film 171 and the second connecting film 172 have no opening in the middle. .

The first connecting film 171 includes a first connecting film body 1711 and a plurality of fifth electrical connectors 174. A plurality of sixth through holes 173 are formed in the first connecting film body 1711, and a fifth electrical connecting body 174 is formed in each of the sixth through holes 173. The sixth through hole 173 is opened at a position corresponding to the conductive line in the fifth conductive circuit layer 151, and the fifth electrical connector 174 is used to electrically conduct with the fifth conductive circuit layer 151.

The second connecting film 172 includes a second connecting film body 1721 and a plurality of sixth electrical connectors 176. The first connecting film body 1711 is formed with a plurality of seventh through holes 175. A sixth electrical connector 176 is formed in each of the seventh through holes 175. The seventh through hole 175 is opened at a position corresponding to the conductive line in the sixth conductive circuit layer 161, and the sixth electrical connection body 176 is used to electrically conduct with the sixth conductive circuit layer 161.

The first outer substrate 181 includes a fifth insulating layer 183, a seventh conductive wiring layer 184, and an eighth conductive wiring layer 185. The seventh conductive wiring layer 184 is formed on one surface of the fifth insulating layer 183, and the eighth conductive wiring layer 185 is formed on the other opposite surface of the fifth insulating layer 183. The fifth insulating layer 183 is located between the seventh conductive circuit layer 184 and the eighth conductive circuit layer 185. In the first outer substrate 181, a plurality of second conductive vias 1811 are formed, and the seventh conductive trace layer 184 is electrically connected to the eighth conductive via layer 185 through the plurality of second conductive vias 1811. The conductive line in the portion of the seventh conductive wiring layer 184 should correspond to the position where the sixth through hole 173 in the first connecting film 171 is opened.

The second outer substrate 182 includes a sixth insulating layer 186, a ninth conductive wiring layer 187, and a tenth conductive wiring layer 188. The ninth conductive wiring layer 187 is formed on one surface of the sixth insulating layer 186, and the tenth conductive wiring layer 188 is formed on the other opposite surface of the sixth insulating layer 186. The sixth insulating layer 186 is located between the ninth conductive circuit layer 187 and the tenth conductive circuit layer 188. In the second outer substrate 182, a plurality of third conductive vias 1812 are formed, and the ninth conductive trace layer 187 is electrically connected to the tenth conductive trace layer 188 through the plurality of third conductive vias 1812. The conductive lines in the portion of the ninth conductive wiring layer 187 should correspond to the positions at which the seventh via holes 175 in the second connecting film 172 are opened.

The first outer layer substrate 181 and the second outer layer substrate 182 are formed in the same manner as the core layer substrate 120.

In addition, the second conductive via 1811 and the third conductive via 1812 may also be conductive vias, which may be formed by forming a via hole in the copper clad substrate and then filling the via hole with a conductive material.

The third step, referring to FIG. 20, sequentially stacks and presses the first outer substrate 181, the first connecting film 171, the soft and hard bonded circuit substrate 100a, the second connecting film 172, and the second outer substrate 182 to obtain a multilayer circuit. Substrate 100b.

Since the first connecting film 171, the second connecting film 172, the fifth electrical connecting body 174 in the first connecting film 171, and the sixth electrical connecting body 176 in the second connecting film 172 are all deformable when heated and pressurized. Thus, after pressing, the fifth conductive wiring layer 151 is electrically conducted to the seventh conductive wiring layer 184 through the fifth electrical connection body 174 of the first connection film 171. The film material in the first connecting film 171 becomes an insulating layer between the fifth conductive wiring layer 151 and the seventh conductive wiring layer 184. The sixth conductive wiring layer 161 is electrically connected to the ninth conductive wiring layer 187 through the sixth electrical connection body 176 of the second connection film 172. The film material in the second connecting film 172 becomes an insulating layer between the sixth conductive wiring layer 161 and the ninth conductive wiring layer 187.

In the fourth step, referring to FIG. 21 to FIG. 22, along the boundary between the exposed region 1101 of the flexible circuit board 110 and the first nip region 1102 and the second nip region 1103, a first outer substrate 181 is formed. a first slit 191 of the first copper foil 150 corresponding to the first connecting film 171 and the exposed area 1101, and a second slit of the second copper foil 160 corresponding to the second outer substrate 182, the second connecting film 172 and the exposed area 1101 192. The first copper foil 150 corresponding to the portion of the first outer substrate 181 and the first connecting film 171 and the exposed region 1101 in the first slit 191 is removed, and the portion located in the second slit 192 is second. The second copper foil 160 corresponding to the outer substrate 182 and the second connecting film 172 and the exposed region 1101 is removed, thereby exposing the exposed region 1101 of the flexible circuit board 110, and the soft and hard circuit board 100 is obtained.

The first slit 191 and the second slit 192 may be formed by ultraviolet laser deep cut, and the formed first slit 191 and second slit 192 are not penetrated to the flexible circuit board 110.

In this embodiment, the seventh conductive circuit layer 184 and the eighth conductive circuit layer 185 have openings corresponding to the exposed regions 1101, and the portion of the first connecting film 171 corresponding to the exposed regions 1101 is not provided with the fifth electrical connectors 174. Therefore, the first slit 191 can be formed by cutting. The ninth conductive circuit layer 187 and the tenth conductive circuit layer 188 have openings corresponding to the exposed regions 1101, and the portion of the second connecting film 172 corresponding to the exposed regions 1101 is not provided with the sixth electrical connecting body 176, so that it can be conveniently The cutting forms a second slit 192.

In this embodiment, the first slit 191 and the second slit 192 each include two trimming edges as shown in FIG.

The first molding region 127, the first nip region 1102, and the first connecting film 171, the second connecting film 172, the first outer substrate 181, and the second outer substrate 182 corresponding to the two portions form a soft and hard circuit board. A hard region 107 of 100, the hard portion corresponding to the second nip region 1103 of the flexible circuit board 110 forms another hard region 107 of the hard and soft circuit board 100. The exposed region 1101 of the flexible circuit board 110 connected between the two hard regions 107 forms a soft region 108 of the hard and soft bonded circuit board 100.

It can be understood that when the fifth conductive circuit layer 151 and the sixth conductive circuit layer 161 are not provided on both sides of the exposed region 1101, the fifth conductive circuit layer 151 and the sixth conductive circuit layer 161 need not be removed in this step. The first connecting film 171, the second connecting film 172, the first outer substrate 181, and the second outer substrate 182 corresponding to the exposed area 1101 may be removed.

In the fifth step, referring to FIG. 23, a solder resist layer is formed on the outer conductive layer and the outer insulating layer surface of the two hard regions of the hard-and-soft bonded circuit board 100.

In this embodiment, a first solder resist layer 1010 is formed on a surface of the eighth conductive wiring layer 185 and a surface of the exposed fifth insulating layer 183 from the eighth conductive wiring layer 185, and the first solder resist layer 1010 has an opening. A portion of the eighth conductive wiring layer 185 is exposed from the opening. A second solder resist layer 1011 is formed on a surface of the tenth conductive circuit layer 188 and a surface of the sixth insulating layer 186 exposed from the tenth conductive circuit layer 188, and the second solder resist layer 1011 also has an opening, and a tenth conductive line Layer 188 is exposed from the opening.

It can be understood that the first solder resist layer 1010 and the second solder resist layer 1011 can also be formed after the third step.

It can be understood that, in the third step, in the third step, more layers of the outer circuit substrate and the connecting film are pressed on opposite sides of the hard and soft combined circuit substrate 100a. A connecting film is disposed between two adjacent outer circuit boards, and more layers of soft and hard circuit boards can be fabricated.

It can be understood that, in order to prevent the material of the first press film 130 and the second press film 140 from flowing to the first cover film 118 and the second cover film 119 located in the exposed area 1101, in the subsequent process, in the subsequent process It is not easy to remove, and a peelable protective film can be formed on the surfaces of the first cover film 118 and the second cover film 119 located in the exposed region 1101. And in a fourth step, a portion of the first outer substrate 181 and the first connecting film 171 located in the first slit 191 are removed, and a portion of the second outer substrate 182 and the second portion located in the second slit 192 are removed. When the connecting film 172 is removed, it is removed together.

It can be understood that the soft and hard circuit board provided by the technical solution may include only a flexible circuit board and a rigid circuit structure laminated on one side of the flexible circuit board. In the process of making a hard and soft board, it is also possible to perform the lamination operation only on one side of the flexible board.

Referring to FIG. 21, a fourth embodiment of the present invention further provides a soft and hard bonded circuit board 100 obtained by the above manufacturing method, which comprises a soft region 108 and two hard regions 107 connected to both ends of the soft region 108. In this embodiment, the hard and soft bonding circuit board 100 includes the soft and hard bonding circuit substrate 100a, the first connecting film 171, the second connecting film 172, and the first outer substrate 181 which are pressed together as described above. The second outer substrate 182.

The fifth conductive wiring layer 151 is electrically connected to the seventh conductive wiring layer 184 of the first outer substrate 181 through the fifth electrical connection body 174 of the first connection film 171. The fifth electrical connector 174 becomes a conductive blind hole. The sixth conductive wiring layer 161 is electrically connected to the ninth conductive wiring layer 187 through the sixth electrical connection body 176 of the second connection film 172. The sixth electrical connector 176 becomes a conductive blind hole.

It can be understood that the fifth conductive circuit layer 151 may have a plurality of first connecting films 171 and a plurality of first outer substrates 181, and the first connecting film 171 and the plurality of first outer substrates 181 are alternately arranged, each adjacent two layers. There is only one multilayer first outer substrate 181 between the first connecting films 171. There is only one first connecting film 171 between the adjacent two first outer substrates 181, one of the first connecting films 171 is adjacent to the fifth conductive circuit layer 151, and the fifth electrical connecting body 174 is electrically connected thereto Adjacent conductive circuit layers.

The sixth conductive circuit layer 161 may have a plurality of second connecting films 172 and a plurality of second outer substrates 182. The second connecting film 172 and the plurality of second outer substrates 182 are alternately arranged, and each adjacent two layers of the second connecting film 172 There is only one multilayer second outer substrate 182 between them. There is only one second connecting film 172 between the adjacent two second outer substrates 182, one of the second connecting films 172 is adjacent to the sixth conductive circuit layer 161, and the sixth electrical connecting body 176 is electrically connected thereto Adjacent conductive circuit layers.

The soft and hard combined circuit board provided by the technical solution and the manufacturing method thereof are formed by using a printed metal conductive paste in the manufacturing process, and the conductive hole can be improved by the method of forming the conductive hole by electroplating in the prior art. Hardly combine the reliability of the board and reduce the manufacturing cost of the hard and soft board. In addition, since the plug hole is formed by printing in the connecting film or the substrate in the prior art, the layer-by-layer lamination and layer-by-layer conduction can reduce the hard and soft bonding circuit board manufacturing process. The number of presses is combined to improve the efficiency of the hard and soft board production.

However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims.

100. . . Soft and hard combined circuit board

100a. . . Soft and hard combined circuit board

100b. . . Multilayer circuit substrate

107. . . Hard area

108. . . Soft area

110. . . Flexible circuit board

1101. . . Exposed area

1102. . . First nip

1103. . . Second nip

111. . . First insulating layer

1111. . . First surface

1112. . . Second surface

112. . . First conductive circuit layer

113. . . Second conductive circuit layer

114. . . Second insulating layer

1141. . . First hole

115. . . Third insulating layer

1151. . . Second hole

116. . . First electromagnetic mask layer

117. . . Second electromagnetic mask layer

118. . . First cover film

119. . . Second cover film

120. . . Core substrate

124. . . Fourth insulating layer

122. . . Third conductive circuit layer

122a. . . First copper foil layer

123. . . Fourth conductive circuit layer

123a. . . Second copper foil layer

125. . . First conductive hole

125a. . . First blind hole

125b. . . First conductive material

121. . . First opening

127. . . First molding area

128. . . Second molding area

129. . . First peelable protective layer

130. . . First press film

130a. . . First press film body

131. . . Second opening

1321. . . First through hole

1322. . . Second through hole

1331. . . First electrical connector

1332. . . Second electrical connector

135. . . Second peelable protective layer

140. . . Second press film

140a. . . Second press film body

141. . . Third opening

1421. . . Third through hole

1422. . . Fourth through hole

1431. . . Third electrical connector

1432. . . Fourth electrical connector

150. . . First copper foil

160. . . Second copper foil

151. . . Fifth conductive circuit layer

161. . . Sixth conductive layer

171. . . First connecting film

1711. . . First connecting film body

173. . . Sixth through hole

174. . . Fifth electrical connector

172. . . Second connecting film

1721. . . Second connecting film body

175. . . Seventh through hole

176. . . Sixth electrical connector

181. . . First outer substrate

183. . . Fifth insulation layer

184. . . Seventh conductive layer

185. . . Eightth conductive layer

1811. . . Second conductive hole

182. . . Second outer substrate

186. . . Sixth insulation layer

187. . . Ninth conductive layer

188. . . Tenth conductive circuit layer

1812. . . Third conductive hole

191. . . First incision

192. . . Second incision

1010. . . First solder mask

1011. . . Second solder mask

1 is a schematic cross-sectional view of a flexible circuit board provided by an embodiment of the present technical solution.

2 is a schematic cross-sectional view of a core substrate provided by an embodiment of the present technical solution.

FIG. 3 is a schematic cross-sectional view of a first connecting film provided by an embodiment of the present technical solution.

4 is a cross-sectional view of a second connecting film provided by an embodiment of the present technical solution.

FIG. 5 to FIG. 8 are schematic diagrams showing steps of a core substrate manufacturing process provided by an embodiment of the present technical solution.

9 to FIG. 12 are schematic diagrams showing the steps of the first connecting film manufacturing process provided by the technical solution.

13 is a schematic cross-sectional view of a first copper foil and a second copper foil provided by the present technical solution.

14 is a schematic cross-sectional view of a flexible circuit board, a core substrate, a first connecting film, a second connecting film, a first copper foil, and a second copper foil.

15 is a schematic cross-sectional view showing a soft and hard bonded circuit substrate formed by the present technical solution.

16 is a schematic cross-sectional view of a first outer substrate provided by the present technical solution.

17 is a schematic cross-sectional view of a second outer substrate provided by the present technical solution.

18 is a schematic cross-sectional view of a third connecting film provided by the present technical solution.

Figure 19 is a cross-sectional view showing a fourth connecting film provided by the present technical solution.

20 is a schematic cross-sectional view showing a multilayer circuit substrate obtained by pressing a first outer substrate, a third connecting film, an inner substrate, a fourth connecting film, and a second outer substrate.

21 is a schematic cross-sectional view showing the first slit and the second slit formed in the multilayer circuit substrate of FIG. 20.

Figure 22 is a cross-sectional view showing the soft-hardened circuit board obtained by molding the prefabricated circuit board of Figure 21.

Figure 23 is a cross-sectional view showing the outer solder resist layer formed in the soft-hard bonded circuit board of Figure 22.

100a. . . Soft and hard combined circuit board

110. . . Flexible circuit board

122. . . Third conductive circuit layer

123. . . Fourth conductive circuit layer

125. . . First conductive hole

1331. . . First electrical connector

1332. . . Second electrical connector

1431. . . Third electrical connector

1432. . . Fourth electrical connector

151. . . Fifth conductive circuit layer

161. . . Sixth conductive layer

Claims (26)

A soft and hard combined circuit substrate comprises a flexible circuit board, a core substrate, a first press film, a second press film, a fifth conductive circuit layer and a sixth conductive circuit layer, wherein the flexible circuit board comprises an exposed area and a connection In the nip area of the exposed area, the core substrate has a first opening corresponding to the flexible circuit board, the flexible circuit board is received in the first opening, the first press film and the second press The film is respectively pressed on opposite sides of the core substrate, and is also located on opposite sides of the nip, the fourth conductive layer is formed on the surface of the first press film away from the core substrate, and the fifth conductive layer is formed on the film The second press-fit film is away from the surface of the core substrate, the first press-fit film comprises a first press-fit film body, a plurality of first electrical connectors and a plurality of second electrical connectors, and the first press-fit film body has a second opening corresponding to the exposed area, the plurality of first electrical connectors and the plurality of second electrical connectors are disposed in the first press film body and are in contact with the sixth conductive circuit layer, The plurality of first electrical connectors are also pressed The plurality of second electrical connectors are further electrically connected to the core substrate, and the second press film comprises a second press film body, a plurality of third electrical connectors, and a plurality of a fourth electrical connector, the second embossed film body has a third opening corresponding to the exposed area, and the plurality of third electrical connectors and the plurality of fourth electrical connectors are disposed in the second embossed film body Each of the plurality of third electrical connectors is in contact with and electrically connected to the nip. The plurality of fourth electrical connectors are also electrically connected to the core substrate. The flexible and hard-bonding circuit substrate of claim 1, wherein the flexible circuit board comprises a second insulating layer, a first conductive circuit layer, a first insulating layer, a second conductive circuit layer and a third insulating layer which are sequentially disposed. The second insulating layer is formed with a plurality of first openings corresponding to the plurality of first electrical connectors, each of the first electrical connectors passing through a corresponding first opening and the first conductive circuit layer Contacting and electrically connecting, the third insulating layer is formed with a plurality of second openings corresponding to the plurality of third electrical connectors, each of the third electrical connectors passing through a corresponding second opening It is in contact with and electrically connected to the second conductive circuit layer. The soft-hard bonded circuit substrate of claim 2, wherein the flexible circuit board further comprises a first electromagnetic mask layer and a second electromagnetic mask layer, the first electromagnetic mask layer and the second electromagnetic mask The layer is located in the exposed area, the first electromagnetic mask layer is formed on a surface of the second insulating layer, and the second electromagnetic mask layer is formed on a surface of the third insulating layer. The soft-hard-bonding circuit substrate of claim 3, wherein the flexible circuit board further comprises a first cover film and a second cover film, wherein the first cover film and the second cover film are located in the exposed area, The first cover film is formed on the surface of the first electromagnetic mask layer, and the second cover film is formed on the surface of the second electromagnetic mask layer. The soft-hard bonded circuit substrate according to claim 2, wherein the flexible circuit board includes two nip regions, and the exposed region is located between the two nip regions, in the first conductive circuit layer And the conductive lines in the second conductive circuit layer extend from one of the nips through the exposed area to the other nip. The soft-hard bonded circuit substrate according to claim 1, wherein the core substrate comprises a second insulating layer, a third conductive circuit layer formed on a surface of the second insulating layer, and another opposite surface formed on the second insulating layer. a fourth conductive circuit layer on the surface, a plurality of first conductive holes are formed in the core substrate, and the plurality of second electrical connectors are electrically connected to the plurality of first conductive holes in one-to-one correspondence The fourth electrical connector is electrically connected to the plurality of first conductive vias in one-to-one correspondence. The soft-hard bonded circuit substrate according to claim 1, wherein one side surface of the exposed portion of the flexible circuit board is covered with a copper foil, and the other side surface of the exposed portion of the flexible circuit board is also covered with a copper foil. . The soft-hardened circuit board according to claim 1, wherein the first electrical connector, the first electrical connector, the second electrical connector, and the third electrical connector are made of a conductive paste. A method for manufacturing a soft and hard combined circuit substrate, comprising the steps of:
Providing a flexible circuit board, the flexible circuit board including an exposed area and a nip area connected to the exposed area;
Providing a core substrate, a first press film, a second press film, a first copper foil and a second copper foil, wherein the core substrate has a first opening corresponding to the flexible circuit board, the first pressure The film comprises a first film body, a plurality of first electrical connectors and a plurality of second electrical connectors, the first film body having a second opening corresponding to the exposed area, the plurality of first electrical connectors, the plurality of The second electrical connectors are respectively disposed on the first press-fit film body, the plurality of first electrical connectors are corresponding to the nip area, and the second press-fit film comprises a second press-fit film body and a plurality of a third electrical connector and a plurality of fourth electrical connectors, the second laminated film body having a third opening corresponding to the exposed area, wherein the plurality of third electrical connectors and the plurality of fourth electrical connectors are disposed on In the second film body, the plurality of third electrical connectors correspond to the nip area;
Pressing the flexible circuit board, the core substrate, the first press film, the second press film, the first copper foil and the second copper foil to fit the flexible circuit board into the first opening of the core substrate The first press film and the second press film are respectively pressed on opposite sides of the core substrate, and are also located on opposite sides of the nip, and the first copper foil is formed on the first press film away from the core a surface of the layer substrate, the second copper foil is formed on the surface of the second press film away from the core substrate, the first copper foil is electrically connected to the core substrate through the second electrical connector, and the second copper foil passes through The fourth electrical connector is electrically connected to the core substrate, the first electrical connector electrically connects the nip of the flexible circuit board with the first copper foil, and the third electrical connector electrically connects the nip of the flexible circuit board with a second copper foil; and selectively removing a portion of the first copper foil to form a fifth conductive wiring layer, selectively removing a portion of the second copper foil to form a sixth conductive wiring layer, and the fifth conductive wiring layer passes through the second electrical connection body The core substrate is electrically conducted, and the sixth conductive circuit layer passes through the fourth electricity The body is electrically connected to the core substrate, the first electrical connector electrically connects the nip area of the flexible circuit board with the five conductive circuit layer, and the third electrical connector electrically connects the nip area of the flexible circuit board with the sixth Conductive circuit layer. The manufacturing method of the soft and hard bonded circuit substrate according to claim 9, wherein the first electrical connector, the first electrical connector, the second electrical connector, and the third electrical connector are both printed and cured by printing a conductive paste. A conductive paste is formed. The method of fabricating a soft-hardened circuit substrate according to claim 9, wherein the flexible circuit board comprises a second insulating layer, a first conductive circuit layer, a first insulating layer, a second conductive circuit layer, and a second a third insulating layer, the second insulating layer is formed with a plurality of first openings corresponding to the plurality of first electrical connectors, each of the first electrical connectors passing through a corresponding first opening and the first The conductive circuit layer is in contact with and electrically connected, and the third insulating layer is formed with a plurality of second openings corresponding to the plurality of third electrical connectors, and each of the third electrical connectors passes through a corresponding first The two openings are in contact with and electrically connected to the second conductive circuit layer. The method of fabricating a soft-hard bonded circuit substrate according to claim 11, wherein the hard and soft circuit board further comprises a first electromagnetic mask layer and a second electromagnetic mask layer, the first electromagnetic mask layer and the first Two electromagnetic shielding layers are disposed in the exposed area, the first electromagnetic shielding layer is formed on the second insulating layer, and the second electromagnetic shielding layer is formed on the third insulating layer. The method of manufacturing a soft-hard bonded circuit substrate according to claim 9, wherein the flexible circuit board, the core substrate, the first press film, the second press film, the first copper foil, and the second are pressed In the case of copper foil, part of the first copper foil is attached to one side of the exposed area of the flexible circuit board, and part of the second copper foil is attached to the other side of the exposed area, and the fifth conductive layer is obtained by selectively removing part of the first copper foil. When the second copper foil is selectively removed to obtain the sixth conductive wiring layer, the first copper foil and the second copper foil attached to the exposed region are not removed. The method of fabricating a soft-hard bonded circuit substrate according to claim 9, wherein the core substrate comprises a fourth insulating layer, a third conductive circuit layer formed on a surface of the fourth insulating layer, and a fourth insulating layer. a fourth conductive circuit layer on the opposite surface, a plurality of first conductive holes are formed in the core substrate, and the plurality of second electrical connectors are electrically connected to the plurality of first conductive holes in one-to-one correspondence. A plurality of the fourth electrical connectors are electrically connected to the plurality of first conductive holes in one-to-one correspondence. A soft and hard bonded circuit board comprising: a soft and hard bonded circuit substrate as claimed in claim 1, a first connecting film and a first outer substrate, wherein the first connecting film is pressed against the first outer layer Between the substrate and the fifth conductive circuit layer of the flexible circuit board, the first outer substrate includes a seventh conductive circuit layer, a fifth insulating layer and an eighth conductive circuit layer, which are sequentially disposed, the fifth insulating layer Forming a plurality of second conductive holes electrically conducting the seventh conductive circuit layer and the eighth conductive circuit layer, wherein the first connecting film comprises a first connecting film body and a plurality of fifth electric wires disposed in the first film body a connecting body, the fifth conductive circuit layer and the seventh conductive circuit layer are electrically connected to each other through the plurality of fifth electrical connectors, and the first outer substrate and the first connecting film body are formed with the flexible circuit The board exposes an opening corresponding to the area to expose the flexible circuit board. A soft and hard combined circuit board comprising: a soft and hard bonded circuit substrate as claimed in claim 1, a first outer substrate, a second outer substrate, a first connecting film and a second connecting film, the first Connecting the film to be pressed between the first outer substrate and the fifth conductive circuit layer of the flexible circuit board, and the second connecting film is pressed against the second outer substrate and the soft and hard circuit substrate Between the sixth conductive circuit layers, the first outer substrate includes a seventh conductive circuit layer, a fifth insulating layer, and an eighth conductive circuit layer, and a plurality of electrically conductive seventh conductive lines are formed in the fifth insulating layer. And a second conductive via of the eighth conductive circuit layer, the first connecting film comprises a first connecting film body and a plurality of fifth electrical connectors disposed in the first film body, the fifth conductive circuit layer and The seventh conductive circuit layer is electrically connected to each other through the fifth electrical connection body, and the second outer substrate comprises a ninth conductive circuit layer, a sixth insulating layer and a tenth conductive circuit layer, which are sequentially disposed, and formed in the sixth insulating layer Multiple Electrically conducting a third conductive hole of the seventh conductive circuit layer and the eighth conductive circuit layer, wherein the second connecting film comprises a second connecting film body and a plurality of sixth electrical connectors disposed in the second connecting film body, The sixth conductive circuit layer and the ninth conductive circuit layer are electrically connected to each other through the sixth electrical connector, and the first connecting film body, the first outer substrate, the second connecting film body and the second outer substrate are formed An opening corresponding to the exposed area of the flexible circuit board exposes both sides of the exposed area of the flexible circuit board, respectively. A soft and hard combined circuit board comprising a soft and hard bonded circuit substrate as claimed in claim 1, a plurality of first outer substrates, a plurality of second outer substrates, a plurality of first connecting films, and a plurality of The first outer substrate and the first connecting film are pressed against one side of the fifth conductive circuit layer of the flexible circuit board substrate, and the first outer substrate includes a fifth insulating layer and a seventh conductive line. a second conductive hole electrically conducting the seventh conductive circuit layer and the eighth conductive circuit layer is formed in the fifth conductive layer, and the first connecting film is formed with a plurality of through holes. a fifth electrical connector connecting the film, a plurality of first connecting films and a plurality of first outer substrates are alternately arranged, and only one first connecting film is disposed between the adjacent two first outer substrates, the first connecting film Adjacent to the fifth conductive circuit layer, the fifth electrical connector is electrically connected to the adjacent conductive circuit layer, and the second outer substrate and the second connecting film are pressed to the sixth of the soft and hard circuit board substrate. One side of the conductive circuit layer, The second outer substrate includes a sixth insulating layer, a ninth conductive circuit layer and a tenth conductive circuit layer, and the third insulating layer is formed with a plurality of third conductive electrically conductive nin conductive layer and tenth conductive layer a second electrical connection body is formed in the second connecting film, and the plurality of second connecting films and the plurality of second outer substrates are alternately arranged with each other, and two adjacent second outer layers are arranged There is only one second connecting film between the substrates, one of the second connecting films is adjacent to the sixth conductive circuit layer, and the sixth electrical connecting body electrically conducts the conductive layer adjacent thereto. The soft-hardened circuit board according to any one of claims 15 to 17, wherein the material of the fifth electrical connector and the sixth electrical connector is a conductive paste. The soft-hardened circuit board according to any one of claims 15 to 17, wherein the flexible circuit board comprises a second insulating layer, a first conductive circuit layer, a first insulating layer, and a second conductive circuit layer which are sequentially disposed. And a third insulating layer, the second insulating layer is formed with a plurality of first openings corresponding to the plurality of first electrical connectors, each of the first electrical connectors passing through a corresponding first opening and The first conductive circuit layer is in contact with and electrically connected, and the third insulating layer is formed with a plurality of second openings corresponding to the plurality of third electrical connectors, and each of the third electrical connectors passes through a corresponding one. The second opening is in contact with and electrically connected to the second conductive circuit layer. The soft-hardened circuit board of claim 19, wherein the hard and soft circuit board further comprises a first electromagnetic shielding layer and a second electromagnetic shielding layer, the first electromagnetic shielding layer and the second electromagnetic shielding layer The cover layer is located in the exposed area, the first electromagnetic mask layer is formed on the second insulation layer, and the second electromagnetic mask layer is formed on the third insulation layer. The soft-hardened circuit board according to any one of claims 15 to 17, wherein the flexible circuit board includes two nips, and the exposed area is located between the two nips, the The conductive lines in one of the conductive circuit layers and in the second conductive circuit layer extend from one of the nips through the exposed area to the other nip. The soft-hardened circuit board according to any one of claims 15 to 17, wherein the second conductive hole is filled with a conductive paste. The soft-hardened circuit board according to any one of claims 15 to 17, wherein the core substrate comprises a second insulating layer, a third conductive circuit layer formed on a surface of the second insulating layer, and formed in the second a fourth conductive circuit layer on the other opposite surface of the insulating layer, wherein the core substrate is formed with a plurality of first conductive holes, and the plurality of second electrical connectors are electrically connected to the plurality of first conductive holes The plurality of the fourth electrical connectors are electrically connected to the plurality of first conductive holes in one-to-one correspondence. A method for manufacturing a soft and hard combined circuit board, comprising the steps of:
Forming a soft and hard bonded circuit substrate by using the method of manufacturing the soft and hard bonded circuit substrate according to claim 9;
Providing a first outer substrate and a first connecting film, the first outer substrate includes a seventh conductive circuit layer, a fifth insulating layer and an eighth conductive circuit layer, which are sequentially disposed, and a plurality of electrical conduction layers are formed in the fifth insulating layer a second conductive hole of the seventh conductive circuit layer and the eighth conductive circuit layer, wherein the first connecting film is formed with a plurality of fifth electrical connecting bodies penetrating the first connecting film;
Pressing the first outer substrate, the first connecting film and the soft and hard circuit substrate, the plurality of fifth electrical connectors electrically electrically connecting the fifth conductive circuit layer and the seventh conductive circuit layer of the first outer substrate;
Forming a first slit penetrating the first outer layer substrate and the first connecting film along a boundary line between the exposed area and the nip area, removing the portion of the first outer layer substrate and the first connecting film surrounded by the first slit, thereby obtaining Soft and hard combined circuit board. A method for manufacturing a soft and hard combined circuit board, comprising the steps of:
Providing the soft and hard combined circuit substrate as claimed in claim 1;
Providing a first outer substrate, a first connecting film, a second outer substrate and a second connecting film, wherein the first outer substrate comprises a fifth insulating layer, a seventh conductive circuit layer and an eighth conductive circuit layer, and the fifth insulating layer Forming a plurality of second conductive holes electrically conducting the seventh conductive circuit layer and the eighth conductive circuit layer, wherein the first connecting film is formed with a plurality of fifth electrical connectors penetrating the first connecting film, the second The outer substrate includes a sixth insulating layer, a ninth conductive circuit layer and a tenth conductive circuit layer, and a plurality of third conductive holes electrically conducting the ninth conductive circuit layer and the tenth conductive circuit layer are formed in the sixth insulating layer, a plurality of sixth electrical connectors penetrating through the second connecting film are formed in the second connecting film;
Pressing the first outer substrate, the first connecting film, the soft and hard circuit board substrate, the second connecting film and the second outer substrate, the fifth electrical connecting body electrically connecting the fifth conductive circuit layer and the first outer substrate to each other, The sixth electrical connector electrically conducts the sixth conductive circuit layer and the second outer substrate;
Forming a first slit through the first connecting film of the first outer substrate along the boundary line of the exposed region, removing the first outer substrate and the first connecting film surrounded by the first slit, thereby obtaining a soft and hard combined circuit board . A method for manufacturing a soft and hard combined circuit board, comprising the steps of:
Providing the soft and hard combined circuit substrate as claimed in claim 1;
Providing a plurality of first outer substrate, a plurality of first connecting films, a plurality of second outer substrates, and a plurality of second connecting films, each of the first outer substrates including a fifth insulating layer, a seventh conductive circuit layer, and The first conductive film is formed with a plurality of second conductive holes electrically conducting the seventh conductive circuit layer and the eighth conductive circuit layer, and each of the first connecting films is formed with a plurality of first connections. a fifth electrical connector of the film, each of the second outer substrate comprises a sixth insulating layer, a ninth conductive circuit layer and a tenth conductive circuit layer, and a plurality of electrically conductive ninth conductive circuit layers are formed in the sixth insulating layer And a third conductive hole of the tenth conductive circuit layer, each of the second connecting films is formed with a plurality of sixth electrical connectors penetrating the second connecting film;
Pressing a plurality of first outer substrate, a plurality of first connecting films, a hard and soft circuit board substrate, a plurality of second connecting films and a plurality of second outer substrates, a plurality of first outer substrates and a plurality of first connecting film presses On the side of the fifth conductive circuit layer, the plurality of first outer substrate and the plurality of first connecting films are alternately arranged, and there is only one first connecting film between the adjacent two first outer substrates, the first connection The film is adjacent to the fifth conductive circuit layer, the fifth electrical connector electrically conducts the adjacent conductive circuit layer, and the second outer substrate and the second connecting film are pressed against the soft and hard circuit board substrate a side of the sixth conductive circuit layer, the second outer substrate comprises a sixth insulating layer, a ninth conductive circuit layer and a tenth conductive circuit layer, wherein the sixth insulating layer is formed with a plurality of electrically conductive ninth conductive circuit layers and a tenth a third conductive hole of the conductive circuit layer, a plurality of sixth electrical connectors penetrating through the second connecting film are formed in the second connecting film, and the plurality of second connecting films and the plurality of second outer substrates are alternately arranged Two adjacent second There is only one second connecting film between the substrates, one of the second connecting films is adjacent to the sixth conductive circuit layer, the sixth electrical connecting body electrically conducts the conductive layer adjacent thereto; and the boundary along the exposed area And forming a first slit through the first connecting film of the first outer substrate, and removing the first outer substrate and the first connecting film surrounded by the first slit to obtain a soft and hard circuit board.