TW201425517A - 膠帶 - Google Patents

膠帶 Download PDF

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Publication number
TW201425517A
TW201425517A TW101149437A TW101149437A TW201425517A TW 201425517 A TW201425517 A TW 201425517A TW 101149437 A TW101149437 A TW 101149437A TW 101149437 A TW101149437 A TW 101149437A TW 201425517 A TW201425517 A TW 201425517A
Authority
TW
Taiwan
Prior art keywords
tape
adhesive
adhesion
rubber particles
adhesive layer
Prior art date
Application number
TW101149437A
Other languages
English (en)
Inventor
Ming-Jen Chang
Original Assignee
Hon Hai Prec Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hon Hai Prec Ind Co Ltd filed Critical Hon Hai Prec Ind Co Ltd
Priority to TW101149437A priority Critical patent/TW201425517A/zh
Priority to US14/108,558 priority patent/US20140178669A1/en
Publication of TW201425517A publication Critical patent/TW201425517A/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/16—Solid spheres
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2848—Three or more layers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

一種膠帶,其包括基底、形成於該基底上之膠層及分散於該膠層表面之膠粒,該膠層之黏著力大於該膠粒之黏著力。

Description

膠帶
本發明涉及一種膠帶。
消費型電子產品中目前一般採用黏膠將二工件黏結在一起。一方面,黏膠需具有較好之黏結性以穩固黏結零件;另一方面,重工時,黏膠又需具有較好之易撕離性;即黏膠既需具有較好之黏結性又需具有較好之易撕離性。然,習知之黏膠很難二者兼顧。
鑒於上述狀況,有必要提供一種較易撕離且黏結性較佳之膠帶。
一種膠帶,其包括基底、形成於該基底上之膠層及分散於該膠層表面之膠粒,該膠層之黏著力大於該膠粒之黏著力。
一方面,由於膠粒之黏著力較低,在貼合初期,較易撕離膠帶;另一方面,由於膠層之黏著力較高,待膠層滲透後,膠帶之黏結力較高,從而可保證膠帶之黏結性較好。
請參閱圖1,本發明實施方式之膠帶100包括基底10、形成於基底10上之膠層20及分散於膠層20表面上之膠粒30,膠層20之黏著力大於膠粒30之黏著力。基底10可為塑膠薄膜。可理解,基底10不限於塑膠薄膜,也可為其他用於膠帶之基底,如牛皮紙、美紋紙等。
在本實施方式中,膠層20之黏著力大於或等於10牛頓每英寸(N/in);膠粒30之黏著力範圍大致為1-10N/in。膠粒30在膠層20表面之分佈密度可調節。在本實施方式中,膠粒30採用噴灑方式均勻分佈於膠層20表面上,膠粒30之直徑大致為0.1-100微米(μm),膠粒30之分佈密度大致為10%-80%。
使用時,膠粒30先接觸待黏結工件200,此時,膠帶100與待黏結工件200間之黏結力較低,較易將膠帶100從待黏結工件200表面撕離(請參閱圖1),以方便重工;然後,對膠帶100施加一定壓力或/和加熱,使膠層20經預設時間後通過膠粒30間之縫隙滲透至待黏結工件200表面,從而使膠帶100與待黏結工件200間之黏結力提高,膠帶100與待黏結工件200緊密貼合(請參閱圖2)。膠層20未滲透至待黏結工件200表面,膠帶100與黏結工件200完全緊密貼合前之預設時間即為重工時間。
根據不同之使用需求,可藉由調節施加壓力、加熱溫度、膠粒30之粒徑、黏著力及分佈密度、及膠層20之黏著力來調節重工時間、初始黏著力及最終黏著力,以適應不同之使用需求。
為詳細說明加熱溫度、膠粒30之粒徑、黏著力及分佈密度、及膠層20之黏著力對重工時間、初始黏著力及最終黏著力之影響,下文表1中列舉若干具體實施例進行說明,該若干實施例均未對膠帶100施加額外壓力。
表1 實施例1-9性能測試結果
本發明實施方式之膠帶100,一方面,由於膠粒30之黏著力較低,在貼合初期,較易撕離;另一方面,由於膠層20之黏著力較高,待膠層20滲透後,膠帶100之黏結力較高,從而可保證膠帶100之黏結性較好。同時,可藉由可藉由調節施加壓力、加熱溫度、膠粒30之粒徑、黏著力及分佈密度、及膠層20之黏著力來調節重工時間、初始黏著力及最終黏著力,以適應不同之使用需求
綜上所述,本發明確已符合發明專利之要件,遂依法提出專利申請。惟,以上所述者僅為本發明之較佳實施方式,自不能以此限制本案之申請專利範圍。舉凡熟悉本案技藝之人士爰依本發明之精神所作之等效修飾或變化,皆應涵蓋於以下申請專利範圍內。
100...膠帶
10...基底
20...膠層
30...膠粒
200...待黏結工件
圖1係本發明實施方式之膠帶貼附於待黏結工件貼合初期之示意圖。
圖2係本發明實施方式之膠帶貼附於待黏結工件貼合後期之示意圖。
100...膠帶
10...基底
20...膠層
30...膠粒
200...待黏結工件

Claims (8)

  1. 一種膠帶,其包括基底及形成於該基底上之膠層,其改良在於:該膠帶還包括分散於該膠層表面之膠粒,該膠層之黏著力大於該膠粒之黏著力。
  2. 如申請專利範圍第1項所述之膠帶,其中該膠層之黏著力大於10牛頓每英寸,該膠粒之黏著力範圍為1-10牛頓每英寸。
  3. 如申請專利範圍第1項所述之膠帶,其中該膠粒之分佈密度為10%-80%。
  4. 如申請專利範圍第1項所述之膠帶,其中該膠粒之直徑大致為0.1-100微米。
  5. 如申請專利範圍第1項所述之膠帶,其中該膠粒之直徑大致為1-80微米。
  6. 如申請專利範圍第1項所述之膠帶,其中該膠粒之分佈密度為20%-50%。
  7. 如申請專利範圍第1項所述之膠帶,其中該膠層之黏著力為18-30牛頓每英寸。
  8. 如申請專利範圍第1項所述之膠帶,其中該膠粒之黏著力範圍為2-5牛頓每英寸。
TW101149437A 2012-12-24 2012-12-24 膠帶 TW201425517A (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW101149437A TW201425517A (zh) 2012-12-24 2012-12-24 膠帶
US14/108,558 US20140178669A1 (en) 2012-12-24 2013-12-17 Adhesive tape

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW101149437A TW201425517A (zh) 2012-12-24 2012-12-24 膠帶

Publications (1)

Publication Number Publication Date
TW201425517A true TW201425517A (zh) 2014-07-01

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ID=50974971

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101149437A TW201425517A (zh) 2012-12-24 2012-12-24 膠帶

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US (1) US20140178669A1 (zh)
TW (1) TW201425517A (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111269662A (zh) * 2020-04-02 2020-06-12 南京汇鑫光电材料有限公司 一种返工胶带及其制作方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4049483A (en) * 1976-11-18 1977-09-20 Minnesota Mining And Manufacturing Company Pressure sensitive hot-melt adhesive system
JPH0414434Y2 (zh) * 1985-04-08 1992-03-31
US5141790A (en) * 1989-11-20 1992-08-25 Minnesota Mining And Manufacturing Company Repositionable pressure-sensitive adhesive tape
DE69428116T2 (de) * 1993-02-16 2002-05-02 Minnesota Mining And Mfg. Co., Saint Paul Trennmittel enthaltendes system und wiederverwendbarer klebstoff mit hoher haftung
US5514122A (en) * 1994-05-16 1996-05-07 Minnesota Mining And Manufacturing Company Feminine hygiene pad
US7645355B2 (en) * 2006-11-17 2010-01-12 3M Innovative Properties Company Method of making a microsphere transfer adhesive

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