TW201426838A - 晶圓之加工方法 - Google Patents

晶圓之加工方法 Download PDF

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Publication number
TW201426838A
TW201426838A TW102138449A TW102138449A TW201426838A TW 201426838 A TW201426838 A TW 201426838A TW 102138449 A TW102138449 A TW 102138449A TW 102138449 A TW102138449 A TW 102138449A TW 201426838 A TW201426838 A TW 201426838A
Authority
TW
Taiwan
Prior art keywords
wafer
resin film
dividing
etching
protective member
Prior art date
Application number
TW102138449A
Other languages
English (en)
Chinese (zh)
Inventor
松崎榮
川合章仁
荒井一尙
Original Assignee
迪思科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 迪思科股份有限公司 filed Critical 迪思科股份有限公司
Publication of TW201426838A publication Critical patent/TW201426838A/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • H10W74/017—Auxiliary layers for moulds, e.g. release layers or layers preventing residue

Landscapes

  • Dicing (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW102138449A 2012-12-13 2013-10-24 晶圓之加工方法 TW201426838A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012271969A JP2014120494A (ja) 2012-12-13 2012-12-13 ウエーハの加工方法

Publications (1)

Publication Number Publication Date
TW201426838A true TW201426838A (zh) 2014-07-01

Family

ID=50910349

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102138449A TW201426838A (zh) 2012-12-13 2013-10-24 晶圓之加工方法

Country Status (4)

Country Link
JP (1) JP2014120494A (ko)
KR (1) KR20140077106A (ko)
CN (1) CN103871944A (ko)
TW (1) TW201426838A (ko)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106469681A (zh) * 2015-08-21 2017-03-01 株式会社迪思科 晶片的加工方法
TWI741262B (zh) * 2018-06-04 2021-10-01 美商帕斯馬舍門有限責任公司 切割晶粒附接膜的方法
TWI787481B (zh) * 2018-03-19 2022-12-21 日商迪思科股份有限公司 切削裝置
TWI797154B (zh) * 2018-01-31 2023-04-01 日商三星鑽石工業股份有限公司 膜剝離機構及基板裂斷系統

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105374773A (zh) * 2014-08-25 2016-03-02 万国半导体股份有限公司 Mcsp功率半导体器件及制备方法
KR20160057966A (ko) * 2014-11-14 2016-05-24 가부시끼가이샤 도시바 처리 장치, 노즐 및 다이싱 장치
JP2017038030A (ja) * 2015-08-14 2017-02-16 株式会社ディスコ ウエーハの加工方法及び電子デバイス
JP6512454B2 (ja) 2016-12-06 2019-05-15 パナソニックＩｐマネジメント株式会社 素子チップの製造方法
CN106793456A (zh) * 2016-12-15 2017-05-31 宁波央腾汽车电子有限公司 一种焊盘结构
JP6824581B2 (ja) * 2017-04-04 2021-02-03 株式会社ディスコ 加工方法
JP6994646B2 (ja) * 2018-01-17 2022-01-14 パナソニックＩｐマネジメント株式会社 素子チップの製造方法
JP7109862B2 (ja) * 2018-07-10 2022-08-01 株式会社ディスコ 半導体ウェーハの加工方法
JP7376322B2 (ja) * 2019-11-06 2023-11-08 株式会社ディスコ 樹脂シート固定装置
US20260090308A1 (en) * 2024-09-26 2026-03-26 Texas Instruments Incorporated Plasma dicing with a photo patternable material

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4791843B2 (ja) * 2006-02-14 2011-10-12 株式会社ディスコ 接着フィルム付きデバイスの製造方法
JP4840174B2 (ja) * 2007-02-08 2011-12-21 パナソニック株式会社 半導体チップの製造方法
JP2009141024A (ja) * 2007-12-04 2009-06-25 Furukawa Electric Co Ltd:The 粘着テープ
JP2010206044A (ja) * 2009-03-05 2010-09-16 Toshiba Corp 半導体装置の製造方法
JP2012156339A (ja) * 2011-01-26 2012-08-16 Disco Abrasive Syst Ltd 加工方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106469681A (zh) * 2015-08-21 2017-03-01 株式会社迪思科 晶片的加工方法
TWI797154B (zh) * 2018-01-31 2023-04-01 日商三星鑽石工業股份有限公司 膜剝離機構及基板裂斷系統
TWI787481B (zh) * 2018-03-19 2022-12-21 日商迪思科股份有限公司 切削裝置
TWI741262B (zh) * 2018-06-04 2021-10-01 美商帕斯馬舍門有限責任公司 切割晶粒附接膜的方法

Also Published As

Publication number Publication date
KR20140077106A (ko) 2014-06-23
JP2014120494A (ja) 2014-06-30
CN103871944A (zh) 2014-06-18

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