TW201445103A - Vapor chamber with heat-conductive block and method of manufacturing the same - Google Patents
Vapor chamber with heat-conductive block and method of manufacturing the same Download PDFInfo
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- TW201445103A TW201445103A TW102117983A TW102117983A TW201445103A TW 201445103 A TW201445103 A TW 201445103A TW 102117983 A TW102117983 A TW 102117983A TW 102117983 A TW102117983 A TW 102117983A TW 201445103 A TW201445103 A TW 201445103A
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- conducting block
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- equalizing plate
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 8
- 239000012530 fluid Substances 0.000 claims abstract description 23
- 238000010438 heat treatment Methods 0.000 claims abstract description 23
- 238000007789 sealing Methods 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 8
- 239000007769 metal material Substances 0.000 claims description 7
- 238000003825 pressing Methods 0.000 claims description 6
- 238000000034 method Methods 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 description 8
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000012935 Averaging Methods 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 239000003245 coal Substances 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
本發明係有關於一種散熱結構，尤指一種具有導熱塊的均溫板及其製造方法。The invention relates to a heat dissipating structure, in particular to a temperature equalizing plate with a heat conducting block and a manufacturing method thereof.
傳統均溫板（Vapor Chamber）包括一平板狀殼體、一毛細結構及一工作流體，平板狀殼體內部具有一容腔，毛細結構設置於容腔內的表面，工作流體，填注於容腔中。藉此，以達到散熱功效。The Vapor Chamber includes a flat shell, a capillary structure and a working fluid. The flat shell has a cavity inside, and the capillary structure is disposed on the surface of the cavity, and the working fluid is filled in the volume. In the cavity. Thereby, to achieve heat dissipation.
進一步說明如下，均溫板接觸到發熱元件的一吸熱面及遠離發熱元件一放熱面，吸熱面處的工作流體吸收發熱元件所產生的熱量而汽化，汽化的工作流體流至放熱面時，因放熱面處的溫度較低，汽化的工作流體會凝結並沿著毛細組織而回流至吸熱面，以形成一散熱循環。
Further, as described below, the temperature equalizing plate contacts a heat absorbing surface of the heat generating component and a heat releasing surface away from the heat generating component, and the working fluid at the heat absorbing surface absorbs heat generated by the heat generating component to vaporize, and when the vaporized working fluid flows to the heat releasing surface, The temperature at the heat release surface is low, and the vaporized working fluid will condense and flow back along the capillary structure to the heat absorption surface to form a heat dissipation cycle.
然而，電路板上佈設有數個發熱元件時，各發熱元件的厚度不盡相同，但上述均溫板的吸熱面為一平坦表面，導致平坦的吸熱面無法同時熱貼接數個發熱元件，必須利用一個均溫板對應一個發熱元件熱貼接，如此不僅提高整體的組裝成本，也會使安裝步驟變得複雜。
However, when a plurality of heat generating components are disposed on the circuit board, the thickness of each heat generating component is not the same, but the heat absorbing surface of the temperature equalizing plate is a flat surface, so that the flat heat absorbing surface cannot simultaneously heat the plurality of heat generating components, and must be The use of a temperature equalizing plate for thermal bonding of a heating element not only increases the overall assembly cost, but also complicates the installation steps.
有鑑於此，本發明人遂針對上述現有技術，特潛心研究並配合學理的運用，盡力解決上述之問題點，即成為本發明人開發之目標。
In view of the above, the inventors of the present invention have made great efforts to solve the above problems by focusing on the above-mentioned prior art, and have made great efforts to solve the above problems, which has become the object of development by the present inventors.
本發明之ㄧ目的，在於提供一種具有導熱塊的均溫板及其製造方法，其係利用導熱塊對特定的單一發熱元件做安裝並進行導熱及散熱功能，進而提高散熱效率。It is an object of the present invention to provide a temperature equalizing plate having a heat conducting block and a method of manufacturing the same, which use a heat conducting block to mount a specific single heat generating component and perform heat conduction and heat dissipation functions, thereby improving heat dissipation efficiency.
為了達成上述之目的，本發明係提供一種具有導熱塊的均溫板，包括：
In order to achieve the above object, the present invention provides a temperature equalizing plate having a heat conducting block, comprising:
一下殼，設有至少一通槽；
a lower shell, provided with at least one through groove;
至少一導熱塊，對應該通槽封合；
At least one heat conducting block, corresponding to the through groove sealing;
一上殼，對應該下殼密封罩蓋，並於該下殼、該導熱塊及該上殼之間圍設形成有一容腔；
An upper case corresponding to the lower case sealing cover, and a cavity formed around the lower case, the heat conducting block and the upper case;
一毛細結構，設置在該下殼、該導熱塊及該上殼形成在該容腔的內表面；以及
a capillary structure disposed on the lower case, the heat conductive block and the upper case formed on an inner surface of the cavity;
一工作流體，填注於該容腔中。
A working fluid is filled in the chamber.
為了達成上述之目的，本發明係提供一種製備如上述之具有導熱塊的均溫板之製造方法，其步驟包括：
In order to achieve the above object, the present invention provides a method of manufacturing a temperature equalizing plate having a thermally conductive block as described above, the steps of which include:
a)提供一壓具，以該壓具壓掣該導熱塊嵌入該通槽；
a) providing a pressing device, wherein the pressing block is pressed to embed the heat conducting block into the through groove;
b)將該上殼對應該下殼罩蓋；以及
b) the upper shell corresponds to the lower casing cover;
c)對該下殼與該上殼、及該導熱塊與該下殼進行封邊作業。
c) sealing the lower shell and the upper shell, and the heat conducting block and the lower shell.
本發明還具有以下功效：
The invention also has the following effects:
第一、下殼具有受熱面，通槽被開設在受熱面上，導熱塊突出於受熱面，使受熱面的表面形成有高低階，讓電路板佈設有數個厚度不同的發熱元件時，單一受熱面可同時對應厚度不同的發熱元件熱貼接，以達到降低組裝成本及步驟之功效。
The first and lower shells have a heating surface, the through grooves are opened on the heating surface, and the heat conducting blocks protrude from the heating surface, so that the surface of the heating surface is formed with high and low steps, and when the circuit board is provided with several heating elements having different thicknesses, the single heating is performed. The surface can be thermally bonded to different heat-generating components at the same time to reduce the assembly cost and the efficiency of the steps.
第二、下殼和導熱塊可為不同金屬材質所構成，故導熱塊可用熱傳導係數大於下殼的金屬材質所構成，讓導熱塊對單一發熱元件熱貼結時，可加快發熱元件的導熱速度，以達到加強均溫板的散熱效率。
The second, the lower shell and the heat conducting block may be made of different metal materials, so that the heat conducting block may be formed by a metal material having a thermal conductivity higher than that of the lower shell, so that when the heat conducting block is thermally bonded to a single heating element, the heat conduction speed of the heating element can be accelerated. In order to achieve enhanced heat dissipation efficiency of the temperature equalization plate.
第三、本發明均溫板可快速將冷凝後的工作流體引流至導熱塊處，以避免導熱塊處的工作流體發生乾燒（dry-out）現象。
Third, the temperature equalizing plate of the invention can quickly drain the condensed working fluid to the heat conducting block to avoid dry-out of the working fluid at the heat conducting block.
10．．．均溫板10. . . Temperature plate
1．．．下殼1. . . Lower case
11．．．通槽11. . . Passage
12．．．受熱面12. . . Heating surface
13．．．基板13. . . Substrate
14．．．環壁14. . . Ring wall
2．．．導熱塊2. . . Thermal block
21．．．突出部twenty one. . . Protruding
3．．．上殼3. . . Upper shell
31．．．延伸突部31. . . Extension protrusion
4．．．容腔4. . . Cavity
5．．．毛細結構5. . . Capillary structure
6．．．凸柱6. . . Tab
第一圖係本發明第一實施例導熱塊欲嵌入通槽之立體示意圖。
第二圖係本發明第一實施例上殼欲對應下殼罩蓋之立體示意圖。
第三圖係本發明第一實施例上殼欲對應下殼罩蓋之剖面示意圖。
第四圖係本發明第一實施例均溫板之剖面示意圖。
第五圖係本發明第二實施例均溫板之剖面示意圖。
第六圖係本發明第三實施例均溫板之剖面示意圖。
第七圖係本發明第四實施例之導熱塊欲嵌入通槽之立體示意圖。
第八圖係本發明第四實施例均溫板之剖面示意圖。
第九圖係本發明第五實施例均溫板之剖面示意圖。
第十圖係本發明第六實施例均溫板之剖面示意圖。
第十一圖係本發明第七實施例均溫板之剖面示意圖。The first figure is a schematic perspective view of a heat conducting block of the first embodiment of the present invention to be embedded in a through groove.
The second figure is a perspective view of the upper case of the first embodiment of the present invention corresponding to the lower case cover.
The third figure is a schematic cross-sectional view of the upper casing of the first embodiment of the present invention corresponding to the lower casing cover.
The fourth figure is a schematic cross-sectional view of a temperature equalizing plate according to a first embodiment of the present invention.
Figure 5 is a schematic cross-sectional view showing a temperature equalizing plate of a second embodiment of the present invention.
Figure 6 is a schematic cross-sectional view showing a temperature equalizing plate of a third embodiment of the present invention.
Figure 7 is a perspective view showing a heat conducting block of a fourth embodiment of the present invention to be embedded in a through groove.
Figure 8 is a schematic cross-sectional view showing a temperature equalizing plate of a fourth embodiment of the present invention.
Figure 9 is a cross-sectional view showing a temperature equalizing plate of a fifth embodiment of the present invention.
Figure 11 is a schematic cross-sectional view showing a temperature equalizing plate of a sixth embodiment of the present invention.
Figure 11 is a schematic cross-sectional view showing a temperature equalizing plate of a seventh embodiment of the present invention.
有關本發明之詳細說明及技術內容，將配合圖式說明如下，然而所附圖式僅作為說明用途，並非用於侷限本發明。The detailed description and technical content of the present invention will be described with reference to the accompanying drawings.
請參考第一至六圖所示，本發明係提供一種具有導熱塊的均溫板及其製造方法，此均溫板10主要包括一下殼1、至少一導熱塊2、一上殼3、一毛細結構5及一工作流體。
Please refer to the first to sixth figures, the present invention provides a temperature equalizing plate having a heat conducting block, and a manufacturing method thereof. The temperature equalizing plate 10 mainly comprises a lower shell 1, at least one heat conducting block 2, an upper shell 3, and a Capillary structure 5 and a working fluid.
下殼1設有一或複數通槽11；詳細說明如下，下殼1具有對應發熱元件配置的一受熱面12，通槽11被開設在受熱面12上，並下殼1具有一基板13及自基板13周緣延伸的環壁14，受熱面12及通槽11形成在基板13上，上殼3對應環壁14密封罩蓋。
The lower case 1 is provided with one or a plurality of through grooves 11; as described in detail below, the lower case 1 has a heat receiving surface 12 corresponding to the heat generating component, the through groove 11 is opened on the heat receiving surface 12, and the lower case 1 has a substrate 13 and A ring wall 14 extending around the periphery of the substrate 13, a heat receiving surface 12 and a through groove 11 are formed on the substrate 13, and the upper case 3 seals the cover corresponding to the ring wall 14.
導熱塊2和通槽11的數量相等，並導熱塊2對應通槽11封合；並且，下殼1和導熱塊2可為相同或不同金屬材質所構成。
The number of the heat conducting block 2 and the through groove 11 is equal, and the heat conducting block 2 is sealed corresponding to the through groove 11; and, the lower case 1 and the heat conducting block 2 may be made of the same or different metal materials.
另外，如第四圖所示，係本發明第一實施例均溫板，其中導熱塊2可突出於受熱面12；又，如第五圖所示，係本發明第二實施例均溫板，其中導熱塊2也可齊平於受熱面12；或者，如第六圖所示，係本發明第三實施例均溫板，其中導熱塊2也可凹陷於受熱面12。
In addition, as shown in the fourth figure, the temperature equalizing plate of the first embodiment of the present invention, wherein the heat conducting block 2 can protrude from the heating surface 12; and, as shown in the fifth figure, the temperature equalizing plate of the second embodiment of the present invention The heat conducting block 2 can also be flush with the heat receiving surface 12; or, as shown in the sixth figure, the temperature equalizing plate of the third embodiment of the present invention, wherein the heat conducting block 2 can also be recessed on the heat receiving surface 12.
上殼3對應下殼1密封罩蓋，並於下殼1、導熱塊2及上殼3之間圍設形成有一容腔4。
The upper case 3 corresponds to the lower case 1 to seal the cover, and a cavity 4 is formed around the lower case 1, the heat conducting block 2 and the upper case 3.
毛細結構5設置在下殼1、導熱塊2及上殼3形成在容腔4的內表面；其中，毛細結構5可為複數溝槽、燒結粉末體、網狀體或纖維體等視實際需求進行調整。
The capillary structure 5 is disposed on the inner surface of the cavity 4, the heat conducting block 2 and the upper shell 3; wherein the capillary structure 5 can be a plurality of grooves, a sintered powder body, a mesh body or a fiber body, etc. according to actual needs. Adjustment.
工作流體填注於容腔4中，此工作流體可為純水、甲醇、丙酮、冷煤或氨等其中之一，並不被任何液體所限制。
The working fluid is filled in the cavity 4, and the working fluid may be one of pure water, methanol, acetone, cold coal or ammonia, and is not limited by any liquid.
本發明均溫板10之組合，如第四圖所示，其係利用下殼1設有通槽11；導熱塊2對應通槽11封合；上殼3對應下殼1密封罩蓋，並於下殼1、導熱塊2及上殼3之間圍設形成有容腔4；毛細結構5設置在下殼1、導熱塊2及上殼3形成在容腔4的內表面；工作流體填注於容腔4中。
The combination of the temperature equalizing plates 10 of the present invention, as shown in the fourth figure, is provided with a through groove 11 by the lower case 1; the heat conducting block 2 is sealed corresponding to the through groove 11; the upper case 3 corresponds to the lower case 1 to seal the cover, and a cavity 4 is formed around the lower case 1, the heat conducting block 2 and the upper case 3; the capillary structure 5 is disposed on the lower surface of the lower case 1, the heat conducting block 2 and the upper case 3 formed on the inner surface of the cavity 4; In the cavity 4.
另外，本發明均溫板10之使用，係將均溫板10安裝在電路板上，導熱塊2對應電路板上的發熱元件熱貼接，並透過導熱塊2對特定的單一發熱元件進行導熱及散熱功能，進而提高散熱效率。
In addition, the use of the temperature equalizing plate 10 of the present invention is to install the temperature equalizing plate 10 on the circuit board, and the heat conducting block 2 is thermally attached to the heat generating component on the circuit board, and conducts heat to the specific single heating element through the heat conducting block 2. And heat dissipation function to improve heat dissipation efficiency.
再者，下殼1具有受熱面12，通槽11被開設在受熱面12上，導熱塊2突出於受熱面12，使受熱面12的表面形成有高低階，讓電路板佈設有數個厚度不同的發熱元件時，單一受熱面12可同時對應厚度不同的發熱元件熱貼接，以達到降低組裝成本及步驟之功效。
Furthermore, the lower case 1 has a heat receiving surface 12, and the through groove 11 is opened on the heat receiving surface 12. The heat conducting block 2 protrudes from the heat receiving surface 12, so that the surface of the heat receiving surface 12 is formed with high and low steps, and the circuit board is provided with several thicknesses. When the heating element is used, the single heating surface 12 can be thermally bonded to the heating elements having different thicknesses at the same time, so as to reduce the assembly cost and the efficiency of the steps.
又，下殼1和導熱塊2可為不同金屬材質所構成，故導熱塊2可用熱傳導係數大於下殼1的金屬材質所構成，讓導熱塊2對單一發熱元件熱貼結時，可加快發熱元件的導熱速度，以達到加強均溫板10的散熱效率。
Moreover, the lower case 1 and the heat conducting block 2 can be made of different metal materials, so that the heat conducting block 2 can be formed by a metal material having a thermal conductivity higher than that of the lower case 1, so that when the heat conducting block 2 is thermally attached to a single heating element, the heating can be accelerated. The heat transfer speed of the component is such as to enhance the heat dissipation efficiency of the temperature equalizing plate 10.
並且，如第一至四圖所示，係一種製備如上所述之具有導熱塊的均溫板之製造方法之步驟，其詳細說明如下。
Further, as shown in the first to fourth figures, there is provided a step of producing a temperature equalizing plate having a thermally conductive block as described above, which is explained in detail below.
首先，如第一圖之步驟a所示，提供一壓具，以壓具壓掣導熱塊2嵌入通槽11，使導熱塊2透過通槽11和下殼1相互鉚合；再者，如第二至三圖之步驟b所示，將上殼3對應下殼1罩蓋；又，如第四圖之步驟c所示，同時對下殼1與上殼3、及導熱塊2與下殼1進行封邊作業，即對下殼1、導熱塊2及上殼3之間的間隙填充焊料，再送入高溫爐中進行加熱，使下殼1、導熱塊2及上殼3透過焊料結合並共同密封容腔4。
First, as shown in step a of the first figure, a pressing tool is provided, and the heat conducting block 2 is inserted into the through groove 11 by the pressing member, so that the heat conducting block 2 is riveted to each other through the through groove 11 and the lower case 1; As shown in step b of the second to third figures, the upper case 3 is corresponding to the lower case 1 cover; and, as shown in step c of the fourth figure, the lower case 1 and the upper case 3, and the heat transfer block 2 and the lower side are simultaneously The shell 1 is subjected to a sealing operation, that is, the gap between the lower shell 1, the heat conducting block 2 and the upper shell 3 is filled with solder, and then sent to a high temperature furnace for heating, so that the lower shell 1, the heat conducting block 2 and the upper shell 3 are welded through the solder. And the cavity 4 is sealed together.
此外，步驟b中毛細組織5已設置在下殼1、導熱塊2及上殼3形成在容腔4內的表面上；並，步驟c中下殼1、導熱塊2及上殼3的封邊作業完成後，再於容腔4中填注工作流體6，且對容腔4進行除氣作業及封口作業。
In addition, in step b, the capillary structure 5 is disposed on the surface of the lower case 1, the heat conducting block 2 and the upper case 3 formed in the cavity 4; and, in step c, the sealing of the lower case 1, the heat conducting block 2 and the upper case 3 After the operation is completed, the working fluid 6 is filled in the cavity 4, and the cavity 4 is subjected to a degassing operation and a sealing operation.
請參考第七至八圖所示，係本發明第四實施例均溫板，其中，導熱塊2朝容腔4方向延伸有抵觸於上殼3的一或複數突出部21，毛細結構5設置在突出部21的表面。藉此，冷凝後的工作流體可透過突出部21外周緣的毛細結構5而快速引流至導熱塊2處，以避免導熱塊2處的工作流體發生乾燒（dry-out）現象。
Referring to the seventh to eighth embodiments, a temperature equalizing plate according to a fourth embodiment of the present invention, wherein the heat conducting block 2 extends in the direction of the cavity 4 with one or a plurality of protrusions 21 that are in contact with the upper casing 3, and the capillary structure 5 is disposed. At the surface of the protrusion 21. Thereby, the condensed working fluid can be quickly drained to the heat conducting block 2 through the capillary structure 5 on the outer periphery of the protruding portion 21 to prevent the dry working of the working fluid at the heat conducting block 2 from dry-out.
請參考第九圖所示，係本發明第五實施例均溫板，其中，本發明均溫板10更包括一或複數凸柱6，凸柱6被夾摯在導熱塊2及上殼3之間，毛細結構5設置在凸柱6的表面。藉此，冷凝後的工作流體可透過突凸柱6外周緣的毛細結構5而快速引流至導熱塊2處，以避免導熱塊2處的工作流體發生乾燒（dry-out）現象。
Referring to FIG. 9 , a temperature equalizing plate according to a fifth embodiment of the present invention, wherein the temperature equalizing plate 10 of the present invention further comprises one or a plurality of studs 6 , and the studs 6 are clamped on the heat conducting block 2 and the upper shell 3 . Between the capillary structures 5 is disposed on the surface of the studs 6. Thereby, the condensed working fluid can be quickly drained to the heat conducting block 2 through the capillary structure 5 on the outer periphery of the protruding post 6 to prevent the dry working of the working fluid at the heat conducting block 2 from dry-out.
請參考第十圖所示，係本發明第六實施例均溫板，其中，上殼3朝容腔4方向延伸有抵觸於導熱塊2的一或複數延伸突部31，毛細結構5設置在延伸突部31的表面。藉此，冷凝後的工作流體可透過延伸突部31外周緣的毛細結構5而快速引流至導熱塊2處，以避免導熱塊2處的工作流體發生乾燒（dry-out）現象。
Referring to FIG. 10, a temperature equalizing plate according to a sixth embodiment of the present invention, wherein the upper casing 3 extends in the direction of the cavity 4 with one or a plurality of extending protrusions 31 which are in contact with the heat conducting block 2, and the capillary structure 5 is disposed at The surface of the protrusion 31 is extended. Thereby, the condensed working fluid can be quickly drained to the heat conducting block 2 through the capillary structure 5 of the outer periphery of the extending protrusion 31 to prevent the dry working of the working fluid at the heat conducting block 2 from dry-out.
請參考第十一圖所示，係本發明第七實施例均溫板，其中，導熱塊2的一端抵觸於上殼3。藉此，冷凝後的工作流體可透過導熱塊2形成在容腔4內的毛細結構5而快速引流至導熱塊2處，以避免導熱塊2處的工作流體發生乾燒（dry-out）現象。
Referring to FIG. 11 , a temperature equalizing plate according to a seventh embodiment of the present invention, wherein one end of the heat conducting block 2 abuts against the upper casing 3 . Thereby, the condensed working fluid can be quickly drained to the heat conducting block 2 through the capillary structure 5 formed in the cavity 4 through the heat conducting block 2, so as to avoid dry-out of the working fluid at the heat conducting block 2. .
綜上所述，本發明之具有導熱塊的均溫板及其製造方法，亦未曾見於同類產品及公開使用，並具有產業利用性、新穎性與進步性，完全符合發明專利申請要件，爰依專利法提出申請，敬請詳查並賜准本案專利，以保障發明人之權利。
In summary, the temperature-averaging plate with the heat-conducting block of the present invention and the manufacturing method thereof have not been seen in the same kind of products and are publicly used, and have industrial utilization, novelty and progress, and fully comply with the requirements for invention patent applications, and convert If the patent law is filed, please check and grant the patent in this case to protect the rights of the inventor.
10．．．均溫板10. . . Temperature plate
1．．．下殼1. . . Lower case
11．．．通槽11. . . Passage
12．．．受熱面12. . . Heating surface
13．．．基板13. . . Substrate
14．．．環壁14. . . Ring wall
2．．．導熱塊2. . . Thermal block
3．．．上殼3. . . Upper shell
4．．．容腔4. . . Cavity
5．．．毛細結構5. . . Capillary structure
Claims (10)
一下殼，設有至少一通槽；
至少一導熱塊，對應該通槽封合；
一上殼，對應該下殼密封罩蓋，並於該下殼、該導熱塊及該上殼之間圍設形成有一容腔；
一毛細結構，設置在該下殼、該導熱塊及該上殼成在該容腔的內表面；以及
一工作流體，填注於該容腔中。A temperature equalizing plate having a heat conducting block, comprising:
a lower shell, provided with at least one through groove;
At least one heat conducting block, corresponding to the through groove sealing;
An upper case corresponding to the lower case sealing cover, and a cavity formed around the lower case, the heat conducting block and the upper case;
a capillary structure disposed on the lower casing, the heat conducting block and the upper casing formed on an inner surface of the cavity; and a working fluid filled in the cavity.
a)提供一壓具，以該壓具壓掣該導熱塊嵌入該通槽；
b)將該上殼對應該下殼罩蓋；以及
c)對該下殼與該上殼、及該導熱塊與該下殼進行封邊作業。A method of manufacturing a temperature equalizing plate having a thermally conductive block according to any one of claims 1 to 9, the method comprising the steps of:
a) providing a pressing device, wherein the pressing block is pressed to embed the heat conducting block into the through groove;
b) the upper shell corresponds to the lower casing cover;
c) sealing the lower shell and the upper shell, and the heat conducting block and the lower shell.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW102117983A TW201445103A (en) | 2013-05-22 | 2013-05-22 | Vapor chamber with heat-conductive block and method of manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW102117983A TW201445103A (en) | 2013-05-22 | 2013-05-22 | Vapor chamber with heat-conductive block and method of manufacturing the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201445103A true TW201445103A (en) | 2014-12-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102117983A TW201445103A (en) | 2013-05-22 | 2013-05-22 | Vapor chamber with heat-conductive block and method of manufacturing the same |
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| Country | Link |
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| TW (1) | TW201445103A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI645150B (en) * | 2017-04-10 | 2018-12-21 | 華碩電腦股份有限公司 | Heat spreader and heat dissipation assembly using the heat spreader |
| CN111059946A (en) * | 2019-12-30 | 2020-04-24 | 深圳兴奇宏科技有限公司 | Temperature equalizing plate structure |
| TWI708038B (en) * | 2019-08-27 | 2020-10-21 | 邁萪科技股份有限公司 | Heat dissipating device using phase changes to transmit heat |
| US11125507B2 (en) | 2019-11-21 | 2021-09-21 | Taiwan Microloops Corp. | Heat dissipating apparatus using phase change heat transfer |
| TWI798515B (en) * | 2019-12-30 | 2023-04-11 | 大陸商深圳興奇宏科技有限公司 | Vapor chamber structure |
-
2013
- 2013-05-22 TW TW102117983A patent/TW201445103A/en unknown
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI645150B (en) * | 2017-04-10 | 2018-12-21 | 華碩電腦股份有限公司 | Heat spreader and heat dissipation assembly using the heat spreader |
| TWI708038B (en) * | 2019-08-27 | 2020-10-21 | 邁萪科技股份有限公司 | Heat dissipating device using phase changes to transmit heat |
| US11125507B2 (en) | 2019-11-21 | 2021-09-21 | Taiwan Microloops Corp. | Heat dissipating apparatus using phase change heat transfer |
| CN111059946A (en) * | 2019-12-30 | 2020-04-24 | 深圳兴奇宏科技有限公司 | Temperature equalizing plate structure |
| TWI798515B (en) * | 2019-12-30 | 2023-04-11 | 大陸商深圳興奇宏科技有限公司 | Vapor chamber structure |
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