TW201510285A - 電解金屬箔的連續製造方法及電解金屬箔連續製造裝置 - Google Patents

電解金屬箔的連續製造方法及電解金屬箔連續製造裝置 Download PDF

Info

Publication number: TW201510285A
Authority: TW; Taiwan
Prior art keywords: metal foil; anode; electrolytic; cathode drum; metal
Prior art date: 2013-07-18

Application number

TW103123764A

Other languages

English (en)

Chinese (zh)

Inventor

Takuo Ito

Akihiro Kato

Atsumi Takeuchi

Katsumi Hamaguchi

Yukinori Iguchi

Takamichi Kishi

Original Assignee

Permelec Electrode Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2013-07-18

Filing date

2014-07-10

Publication date

2015-03-16

2014-07-10 Application filed by Permelec Electrode Ltd filed Critical Permelec Electrode Ltd

2015-03-16 Publication of TW201510285A publication Critical patent/TW201510285A/zh

Links

229910052751 metal Inorganic materials 0.000 title claims abstract description 242
239000002184 metal Substances 0.000 title claims abstract description 242
239000011888 foil Substances 0.000 title claims abstract description 131
238000004519 manufacturing process Methods 0.000 title claims abstract description 42
238000000034 method Methods 0.000 claims abstract description 40
238000005868 electrolysis reaction Methods 0.000 claims abstract description 36
239000003792 electrolyte Substances 0.000 claims abstract description 26
239000002253 acid Substances 0.000 claims abstract description 23
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 83
239000000243 solution Substances 0.000 claims description 66
239000011889 copper foil Substances 0.000 claims description 63
QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 38
239000012528 membrane Substances 0.000 claims description 33
238000005341 cation exchange Methods 0.000 claims description 26
229910000365 copper sulfate Inorganic materials 0.000 claims description 24
ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims description 24
239000008151 electrolyte solution Substances 0.000 claims description 12
230000007935 neutral effect Effects 0.000 claims description 7
239000003011 anion exchange membrane Substances 0.000 claims description 6
230000008021 deposition Effects 0.000 claims description 3
238000007599 discharging Methods 0.000 claims 1
239000000654 additive Substances 0.000 abstract description 16
230000009467 reduction Effects 0.000 abstract description 2
230000004888 barrier function Effects 0.000 abstract 2
239000011248 coating agent Substances 0.000 description 25
238000000576 coating method Methods 0.000 description 25
239000010949 copper Substances 0.000 description 21
229910052802 copper Inorganic materials 0.000 description 20
238000007747 plating Methods 0.000 description 14
230000000996 additive effect Effects 0.000 description 11
239000007788 liquid Substances 0.000 description 11
239000000758 substrate Substances 0.000 description 11
229910000978 Pb alloy Inorganic materials 0.000 description 9
RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 8
238000010924 continuous production Methods 0.000 description 8
239000010936 titanium Substances 0.000 description 8
229910052719 titanium Inorganic materials 0.000 description 8
238000003860 storage Methods 0.000 description 7
VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 6
239000003054 catalyst Substances 0.000 description 5
229910000420 cerium oxide Inorganic materials 0.000 description 5
238000007733 ion plating Methods 0.000 description 5
150000002611 lead compounds Chemical class 0.000 description 5
239000000203 mixture Substances 0.000 description 5
BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 5
XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
229920000557 Nafion® Polymers 0.000 description 4
PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
238000009826 distribution Methods 0.000 description 4
229910000464 lead oxide Inorganic materials 0.000 description 4
239000000463 material Substances 0.000 description 4
YEXPOXQUZXUXJW-UHFFFAOYSA-N oxolead Chemical compound [Pb]=O YEXPOXQUZXUXJW-UHFFFAOYSA-N 0.000 description 4
238000003825 pressing Methods 0.000 description 4
108010010803 Gelatin Proteins 0.000 description 3
VMPVEPPRYRXYNP-UHFFFAOYSA-I antimony(5+);pentachloride Chemical compound Cl[Sb](Cl)(Cl)(Cl)Cl VMPVEPPRYRXYNP-UHFFFAOYSA-I 0.000 description 3
239000000470 constituent Substances 0.000 description 3
239000013078 crystal Substances 0.000 description 3
238000004090 dissolution Methods 0.000 description 3
230000000694 effects Effects 0.000 description 3
229920000159 gelatin Polymers 0.000 description 3
239000008273 gelatin Substances 0.000 description 3
235000019322 gelatine Nutrition 0.000 description 3
235000011852 gelatine desserts Nutrition 0.000 description 3
125000006850 spacer group Chemical group 0.000 description 3
239000011345 viscous material Substances 0.000 description 3
229920000663 Hydroxyethyl cellulose Polymers 0.000 description 2
239000004354 Hydroxyethyl cellulose Substances 0.000 description 2
229910045601 alloy Inorganic materials 0.000 description 2
239000000956 alloy Substances 0.000 description 2
239000007864 aqueous solution Substances 0.000 description 2
239000010953 base metal Substances 0.000 description 2
238000005422 blasting Methods 0.000 description 2
230000001680 brushing effect Effects 0.000 description 2
238000001354 calcination Methods 0.000 description 2
150000001768 cations Chemical class 0.000 description 2
230000008859 change Effects 0.000 description 2
230000000052 comparative effect Effects 0.000 description 2
238000007796 conventional method Methods 0.000 description 2
125000004122 cyclic group Chemical group 0.000 description 2
230000002950 deficient Effects 0.000 description 2
238000005516 engineering process Methods 0.000 description 2
235000019447 hydroxyethyl cellulose Nutrition 0.000 description 2
229910052742 iron Inorganic materials 0.000 description 2
229910052759 nickel Inorganic materials 0.000 description 2
238000005554 pickling Methods 0.000 description 2
229920001343 polytetrafluoroethylene Polymers 0.000 description 2
239000004810 polytetrafluoroethylene Substances 0.000 description 2
238000007639 printing Methods 0.000 description 2
230000008569 process Effects 0.000 description 2
239000004576 sand Substances 0.000 description 2
239000006104 solid solution Substances 0.000 description 2
238000005979 thermal decomposition reaction Methods 0.000 description 2
UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 description 2
229910001316 Ag alloy Inorganic materials 0.000 description 1
JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
238000002441 X-ray diffraction Methods 0.000 description 1
230000001133 acceleration Effects 0.000 description 1
230000002378 acidificating effect Effects 0.000 description 1
230000009471 action Effects 0.000 description 1
150000001450 anions Chemical group 0.000 description 1
QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
230000008901 benefit Effects 0.000 description 1
230000015572 biosynthetic process Effects 0.000 description 1
238000006243 chemical reaction Methods 0.000 description 1
238000004140 cleaning Methods 0.000 description 1
239000004020 conductor Substances 0.000 description 1
229910001431 copper ion Inorganic materials 0.000 description 1
238000000151 deposition Methods 0.000 description 1
238000013461 design Methods 0.000 description 1
230000005611 electricity Effects 0.000 description 1
238000000840 electrochemical analysis Methods 0.000 description 1
239000007772 electrode material Substances 0.000 description 1
239000010419 fine particle Substances 0.000 description 1
UQSQSQZYBQSBJZ-UHFFFAOYSA-N fluorosulfonic acid Chemical compound OS(F)(=O)=O UQSQSQZYBQSBJZ-UHFFFAOYSA-N 0.000 description 1
239000007789 gas Substances 0.000 description 1
150000002500 ions Chemical class 0.000 description 1
LWUVWAREOOAHDW-UHFFFAOYSA-N lead silver Chemical compound [Ag].[Pb] LWUVWAREOOAHDW-UHFFFAOYSA-N 0.000 description 1
RVPVRDXYQKGNMQ-UHFFFAOYSA-N lead(2+) Chemical compound [Pb+2] RVPVRDXYQKGNMQ-UHFFFAOYSA-N 0.000 description 1
238000012423 maintenance Methods 0.000 description 1
238000002844 melting Methods 0.000 description 1
230000008018 melting Effects 0.000 description 1
231100000989 no adverse effect Toxicity 0.000 description 1
230000003647 oxidation Effects 0.000 description 1
238000007254 oxidation reaction Methods 0.000 description 1
239000001301 oxygen Substances 0.000 description 1
229910052760 oxygen Inorganic materials 0.000 description 1
239000002245 particle Substances 0.000 description 1
BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical group [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 1
230000010287 polarization Effects 0.000 description 1
-1 polytetrafluoroethylene Polymers 0.000 description 1
238000012545 processing Methods 0.000 description 1
239000002994 raw material Substances 0.000 description 1
230000007420 reactivation Effects 0.000 description 1
238000004064 recycling Methods 0.000 description 1
IREVRWRNACELSM-UHFFFAOYSA-J ruthenium(4+);tetrachloride Chemical compound Cl[Ru](Cl)(Cl)Cl IREVRWRNACELSM-UHFFFAOYSA-J 0.000 description 1
239000012266 salt solution Substances 0.000 description 1
238000007789 sealing Methods 0.000 description 1
238000004904 shortening Methods 0.000 description 1
238000004544 sputter deposition Methods 0.000 description 1
238000006467 substitution reaction Methods 0.000 description 1
HBBBDGWCSBWWKP-UHFFFAOYSA-J tetrachloroantimony Chemical compound Cl[Sb](Cl)(Cl)Cl HBBBDGWCSBWWKP-UHFFFAOYSA-J 0.000 description 1
XJDNKRIXUMDJCW-UHFFFAOYSA-J titanium tetrachloride Chemical compound Cl[Ti](Cl)(Cl)Cl XJDNKRIXUMDJCW-UHFFFAOYSA-J 0.000 description 1
230000004584 weight gain Effects 0.000 description 1
235000019786 weight gain Nutrition 0.000 description 1
238000003466 welding Methods 0.000 description 1

Classifications

- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/04—Wires; Strips; Foils
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Chemical Kinetics & Catalysis (AREA)
Electrochemistry (AREA)
Materials Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Electrolytic Production Of Metals (AREA)

TW103123764A 2013-07-18 2014-07-10 電解金屬箔的連續製造方法及電解金屬箔連續製造裝置 TW201510285A (zh)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP2013149687A JP2015021154A (ja)	2013-07-18	2013-07-18	電解金属箔の連続製造方法及び電解金属箔連続製造装置

Publications (1)

Publication Number	Publication Date
TW201510285A true TW201510285A (zh)	2015-03-16

Family

ID=52346037

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
TW103123764A TW201510285A (zh)	2013-07-18	2014-07-10	電解金屬箔的連續製造方法及電解金屬箔連續製造裝置

Country Status (3)

Country	Link
JP (1)	JP2015021154A (ja)
TW (1)	TW201510285A (ja)
WO (1)	WO2015008564A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
TWI627920B (zh) *	2017-03-23	2018-07-01	Ykk股份有限公司	Electrodeposition coating device

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN108425135B (zh) *	2017-02-15	2020-02-07	金居开发股份有限公司	电解铜箔的生产设备及其电流调整控制装置
CN108649183B (zh) *	2018-05-14	2021-01-22	山东金宝电子股份有限公司	一种锂离子电池负极集流体用微孔铜箔的制备方法
CN114686961B (zh) *	2022-04-21	2023-06-02	河南理工大学	一种电铸成型、打孔一体化的多孔铜箔制造系统及方法
CN115466990A (zh) *	2022-09-15	2022-12-13	江苏安凯特科技股份有限公司	铜箔电解槽及铜箔电解工艺

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS58177487A (ja) *	1982-04-08	1983-10-18	Sumitomo Metal Ind Ltd	隔膜電解メツキ方法および装置
JPS6026689A (ja) *	1983-07-26	1985-02-09	Sumitomo Metal Ind Ltd	電析による金属箔の製造方法および装置
JP2510422B2 (ja) *	1988-05-25	1996-06-26	ペルメレック電極株式会社	プリント基板の銅メッキ方法
JPH0673393B2 (ja) *	1988-09-09	1994-09-14	ペルメレック電極株式会社	プリント基板の銅メッキ方法
JPH0819551B2 (ja) *	1989-03-10	1996-02-28	日新製鋼株式会社	鉄系電着方法及び装置
DE4344387C2 (de) *	1993-12-24	1996-09-05	Atotech Deutschland Gmbh	Verfahren zur elektrolytischen Abscheidung von Kupfer und Anordnung zur Durchführung des Verfahrens
JP3639134B2 (ja) *	1998-12-25	2005-04-20	株式会社荏原製作所	基板めっき装置
JP2003073889A (ja) *	2001-08-29	2003-03-12	Nikko Materials Co Ltd	半導体ウエハの電気銅めっき方法、同装置及びこれらによってめっきされたパーティクル付着の少ない半導体ウエハ
JP2006316328A (ja) *	2005-05-16	2006-11-24	Daiso Co Ltd	２層フレキシブル銅張積層板の製造方法

2013
- 2013-07-18 JP JP2013149687A patent/JP2015021154A/ja active Pending
2014
- 2014-06-13 WO PCT/JP2014/065717 patent/WO2015008564A1/ja not_active Ceased
- 2014-07-10 TW TW103123764A patent/TW201510285A/zh unknown

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
TWI627920B (zh) *	2017-03-23	2018-07-01	Ykk股份有限公司	Electrodeposition coating device
CN110431257B (zh) *	2017-03-23	2021-10-08	Ykk株式会社	电沉积涂装装置

Also Published As

Publication number	Publication date
JP2015021154A (ja)	2015-02-02
WO2015008564A1 (ja)	2015-01-22

Publication	Publication Date	Title
TWI422713B (zh)	2014-01-11	Electrolytic metal foil manufacturing apparatus and manufacturing method of sheet-like insoluble metal electrode used in electrolytic metal foil manufacturing apparatus
TWI432608B (zh)	2014-04-01	Cathode, electrolytic cell for electrolysis of alkali metal chloride, and manufacturing method of cathode
TW201510285A (zh)	2015-03-16	電解金屬箔的連續製造方法及電解金屬箔連續製造裝置
CN104053824A (zh)	2014-09-17	铝膜制造方法和铝箔制造方法
JP2012107266A (ja)	2012-06-07	電解銅箔の製造方法及び製造装置
JP5862917B2 (ja)	2016-02-16	長尺導電性基板の電気めっき方法およびこの方法を用いた銅被覆長尺導電性基板の製造方法並びにロール・ツー・ロールタイプの電気めっき装置
TW490510B (en)	2002-06-11	Method and apparatus for producing electrolytic copper foil
KR101569185B1 (ko)	2015-11-17	불용성 전극 및 이를 구비하는 전해동박장치
JPH05202498A (ja)	1993-08-10	不溶性電極構造体
CN103031578A (zh)	2013-04-10	一种生产镍箔的电解方法
CN202482454U (zh)	2012-10-10	一种用于电解铜箔生箔机的dsa整体钛阳极
CN204474784U (zh)	2015-07-15	生箔电解阳极槽正极铜排导电结构
FI82488B (fi)	1990-11-30	Elektrodkonstruktion foer gasbildande monopolaera elektrolysoerer.
JP2006316328A (ja)	2006-11-24	２層フレキシブル銅張積層板の製造方法
JP2008007836A (ja)	2008-01-17	金属線材メッキ用不溶性陽極及びそれを用いた金属線材メッキ方法
CN113445084B (zh)	2022-05-24	一种电解铜箔生箔装置
JP4465084B2 (ja)	2010-05-19	銅箔の製造方法及び製造装置
JP2002038291A (ja)	2002-02-06	金属箔製造用陽極
JP2774209B2 (ja)	1998-07-09	金属箔連続製造装置用の陽極
JP2002004095A (ja)	2002-01-09	不溶性陽極及びその給電方法
CN105506668B (zh)	2017-08-29	一种萘醌残液的电解综合利用方法
CN222349149U (zh)	2025-01-14	生箔设备
CN113529140B (zh)	2022-08-23	一种新型电解铜箔生产方法
JP6403097B2 (ja)	2018-10-10	不溶性陽極、めっき装置および電気めっき方法ならびに銅張積層板の製造方法
JP2574678B2 (ja)	1997-01-22	過酸化物を含有する水溶液の製造装置