TW201510296A - 用於在垂直流電金屬沉積之過程中移動一基板固定器之裝置及使用此裝置於垂直流電金屬沉積之方法 - Google Patents
用於在垂直流電金屬沉積之過程中移動一基板固定器之裝置及使用此裝置於垂直流電金屬沉積之方法 Download PDFInfo
- Publication number
- TW201510296A TW201510296A TW103120621A TW103120621A TW201510296A TW 201510296 A TW201510296 A TW 201510296A TW 103120621 A TW103120621 A TW 103120621A TW 103120621 A TW103120621 A TW 103120621A TW 201510296 A TW201510296 A TW 201510296A
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- substrate holder
- adjustment member
- axial deflection
- drive member
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 122
- 238000000034 method Methods 0.000 title claims abstract description 18
- 238000001465 metallisation Methods 0.000 title description 14
- 239000002184 metal Substances 0.000 claims abstract description 24
- 229910052751 metal Inorganic materials 0.000 claims abstract description 24
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 17
- 229910052802 copper Inorganic materials 0.000 claims abstract description 17
- 239000010949 copper Substances 0.000 claims abstract description 17
- 230000008021 deposition Effects 0.000 claims abstract description 10
- 238000000151 deposition Methods 0.000 claims description 13
- 230000001419 dependent effect Effects 0.000 claims description 7
- 238000006243 chemical reaction Methods 0.000 claims description 4
- 230000008878 coupling Effects 0.000 claims description 3
- 238000010168 coupling process Methods 0.000 claims description 3
- 238000005859 coupling reaction Methods 0.000 claims description 3
- 239000003792 electrolyte Substances 0.000 description 8
- 238000009826 distribution Methods 0.000 description 6
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000007747 plating Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 210000003423 ankle Anatomy 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 230000008901 benefit Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000009828 non-uniform distribution Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/10—Agitating of electrolytes; Moving of racks
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/04—Electroplating with moving electrodes
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Automation & Control Theory (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP13171963.5A EP2813601A1 (fr) | 2013-06-14 | 2013-06-14 | Dispositif pour déplacer un support de substrat pendant un dépôt de métal galvanique vertical et procédé de dépôt de métal galvanique vertical utilisant un tel dispositif |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201510296A true TW201510296A (zh) | 2015-03-16 |
Family
ID=48607151
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW103120621A TW201510296A (zh) | 2013-06-14 | 2014-06-13 | 用於在垂直流電金屬沉積之過程中移動一基板固定器之裝置及使用此裝置於垂直流電金屬沉積之方法 |
Country Status (3)
| Country | Link |
|---|---|
| EP (1) | EP2813601A1 (fr) |
| TW (1) | TW201510296A (fr) |
| WO (1) | WO2014198723A1 (fr) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3176288A1 (fr) | 2015-12-03 | 2017-06-07 | ATOTECH Deutschland GmbH | Procédé de dépôt de métal galvanique |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH683007A5 (de) * | 1990-08-17 | 1993-12-31 | Hans Henig | Verfahren zum kontinuierlichen Austausch der wässrigen Lösungen während einer Oberflächenbehandlung sowie eine Vorrichtung dazu. |
| DE4212045C1 (de) * | 1992-04-07 | 1993-12-02 | Schering Ag | Verfahren und Vorrichtung zur chemischen und/oder galvanischen Behandlung von Werkstücken |
| DE10061226A1 (de) * | 2000-12-08 | 2002-06-20 | Emil Hepting | Verfahren und Vorrichtung zur Behandlung von Waren in einem Tauchbad |
| JP3827627B2 (ja) * | 2002-08-13 | 2006-09-27 | 株式会社荏原製作所 | めっき装置及びめっき方法 |
| JP4303484B2 (ja) * | 2003-01-21 | 2009-07-29 | 大日本スクリーン製造株式会社 | メッキ装置 |
| DE102005024771B4 (de) * | 2005-05-20 | 2008-08-21 | Hansgrohe Ag | Vorrichtung zum Behandeln von Waren |
| DE102007026633B4 (de) | 2007-06-06 | 2009-04-02 | Atotech Deutschland Gmbh | Vorrichtung und Verfahren zum elektrolytischen Behandeln von plattenförmiger Ware |
-
2013
- 2013-06-14 EP EP13171963.5A patent/EP2813601A1/fr not_active Withdrawn
-
2014
- 2014-06-10 WO PCT/EP2014/062031 patent/WO2014198723A1/fr not_active Ceased
- 2014-06-13 TW TW103120621A patent/TW201510296A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2014198723A1 (fr) | 2014-12-18 |
| EP2813601A1 (fr) | 2014-12-17 |
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