TW201517721A - 化學鍍產品及其成型方法 - Google Patents
化學鍍產品及其成型方法 Download PDFInfo
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- TW201517721A TW201517721A TW102138011A TW102138011A TW201517721A TW 201517721 A TW201517721 A TW 201517721A TW 102138011 A TW102138011 A TW 102138011A TW 102138011 A TW102138011 A TW 102138011A TW 201517721 A TW201517721 A TW 201517721A
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- plating
- electroless
- copper
- chemical
- electroplated
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- 238000007747 plating Methods 0.000 title claims abstract description 48
- 239000000126 substance Substances 0.000 title claims abstract description 29
- 238000000034 method Methods 0.000 title claims abstract description 23
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 31
- 238000000576 coating method Methods 0.000 claims abstract description 31
- 229910052802 copper Inorganic materials 0.000 claims abstract description 31
- 239000010949 copper Substances 0.000 claims abstract description 31
- 239000011248 coating agent Substances 0.000 claims abstract description 30
- 239000003054 catalyst Substances 0.000 claims abstract description 27
- 229910052751 metal Inorganic materials 0.000 claims abstract description 25
- 239000002184 metal Substances 0.000 claims abstract description 25
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 40
- 229910052759 nickel Inorganic materials 0.000 claims description 20
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 12
- 238000007772 electroless plating Methods 0.000 claims description 11
- 238000009713 electroplating Methods 0.000 claims description 11
- 238000000465 moulding Methods 0.000 claims description 11
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 10
- 229910052737 gold Inorganic materials 0.000 claims description 10
- 239000010931 gold Substances 0.000 claims description 10
- 229910052763 palladium Inorganic materials 0.000 claims description 8
- 238000009413 insulation Methods 0.000 claims description 5
- 239000007921 spray Substances 0.000 claims 1
- 238000010147 laser engraving Methods 0.000 abstract description 10
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 239000000047 product Substances 0.000 description 21
- 229920003023 plastic Polymers 0.000 description 10
- 239000004033 plastic Substances 0.000 description 9
- 239000000463 material Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 150000002736 metal compounds Chemical class 0.000 description 2
- 239000011265 semifinished product Substances 0.000 description 2
- GNFTZDOKVXKIBK-UHFFFAOYSA-N 3-(2-methoxyethoxy)benzohydrazide Chemical compound COCCOC1=CC=CC(C(=O)NN)=C1 GNFTZDOKVXKIBK-UHFFFAOYSA-N 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
- C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1651—Two or more layers only obtained by electroless plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
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Abstract
本發明公開一種化學鍍產品及其成型方法，所述化學鍍產品是通過化學方法成型，其包括絕緣件及位於絕緣件上的金屬鍍層，金屬鍍層包括通過塗布觸媒形成有預鍍範圍及覆蓋在塗布觸媒上的化學銅。本發明通過在絕緣件上作塗布觸媒確認預鍍範圍，相對現有的鐳雕技術，可減少鐳雕設備，降低製造成本，且塗佈觸媒也可便於準確確定預鍍產品的結構。
Description
本發明是關於一種化學鍍產品及其成型方法，尤指一種電子產品上的化學鍍產品及其成型方法。
通常電子產品需要通過無線部件做通話、上網等功能，其主要藉由安裝在電子產品上之天線做發射及接收無線資料進行傳輸，目前在電子產品上安裝天線有很多方式，如最初將衝壓成型後的立體金屬天線通過螺釘固持在絕緣本體上，其後演變成在絕緣本體直接通過鐳雕方式成型有三維天線。
鐳雕技術係利用雷射器發射的高強度聚焦雷射光束在焦點處使材料氧化因而對其進行加工的鐳射加工原理，該部分技術可請參閱2004年1月28日公告的中國發明專利申請第02127135.6號，其公開了塑膠表面鐳射雕刻電鍍的方法，具有透明之塑膠材料，並在該塑膠材料的背面塗覆以透光性防鍍油墨印及塑膠材料的正面施以金屬膜塗覆的前處理；最後對該經金屬膜塗覆前處理的塑膠材料上施以鐳射雕刻以定出所需的圖樣。惟，該製造天線模組的方法需要鐳射設備，增加了天線的製造成本。
另外，該傳統雷雕鍍制程，需使用添加金屬化合物的特殊塑膠進行塑膠射出成型，再透過雷射進行雷雕將欲鍍的塑膠表面活化，在表面產生金屬核，之後再進行塑膠化鍍將金屬鍍上雷射活化過的區域，藉此達到控制被鍍圖形或範圍的目的。此方法的缺點為：(1) 需使用添加金屬化合物之塑膠, 成本較一般塑膠高，(2) 需以昂貴的雷射設備進行雷雕, 設備成本及量產成本皆很高。
因此，確有必要提供一種改進的成型方法及其產品以改善先前技術中的上述缺陷。
本發明的目的係提供一種可控制被鍍圖案的化學鍍產品及其成型方法。
本發明電鍍產品可通過以下技術方案實現：一種化學鍍產品，通過化學方法成型，所述化學鍍產品包括絕緣件及位於絕緣件上的金屬鍍層，金屬鍍層包括通過塗布觸媒形成有預鍍範圍及覆蓋在塗布觸媒上的化學銅。
本發明也可通過如下方式實現：一種成型如權利要求1所述化學鍍產品的成型方法，其中主要在於具有如下步驟：
a. 提供絕緣件；
b. 將上述絕緣件放入化學溶液作化學脫膜，之後對絕緣件作化學粗化；
c. 在絕緣件上作塗布觸媒確認預鍍範圍；
d. 在塗布觸媒上作化學鍍銅。
相較於現有技術，本發明藉由在絕緣件上作塗布觸媒確認預鍍範圍，相對現有的鐳雕技術，可減少鐳雕設備，降低製造成本，且塗佈觸媒也可便於準確確定控制預鍍產品的結構。
第一圖係本發明化學鍍產品的絕緣件之平面示意圖；
第二圖係本發明化學鍍產品的絕緣件作塗佈後之平面示意圖；
第三圖是本發明化學鍍產品的半成品之平面示意圖 。
請參閱第一圖至第三圖所示，本發明的化學鍍成型方法，主要在於具有如下步驟：
a. 提供絕緣件1(參第一圖所示)；
b. 將上述絕緣件放入化學溶液作化學脫膜，之後對絕緣件作化學粗化；
c. 在絕緣件上作塗布觸媒確認預鍍範圍2(參第二圖所示)，在本實施方式中，預鍍範圍以“十”字架為例；
d. 在塗布觸媒處作化學鍍銅3，形成半成品(參第三圖所示)。
e. 在c步驟的塗布觸媒成型平面結構的奈米有機鈀金屬導電層。
f. 在c步驟的塗布觸媒成型立體結構的奈米有機鈀金屬導電層。
g. 在d步驟的化學鍍銅上可以依次做厚化鍍銅、化學鍍鎳及化學鍍金等步驟，形成成品。
h. 在d步驟的化學鍍銅上可以依次做電鍍銅、電鍍鎳及電鍍金等步驟，形成成品。
i. 在d步驟的化學鍍銅上可以依次做電鍍銅、電鍍鎳等步驟。
j. 在i步驟上進一步作電鍍黑鎳等金屬。
k. 在i步驟上進一步作電鍍金等金屬。
其中，化學粗化係使絕緣件的表面上形成微觀粗糙之結構，以提高後續金屬鍍層與絕緣件之間結合力。而在g至k步驟時，因在絕緣件未做塗布觸媒的部分不會鍍上金屬元件，所以在塗布觸媒過程中可有效控制後面的金屬鍍的被鍍範圍，相對現有技術無需通過鐳雕設備確定預鍍範圍，有效降低製造成本。
請再參第一圖至第三圖所示，本發明藉由化學方法成型的一種化學鍍產品，包括絕緣件1及位於絕緣件上的金屬鍍層，金屬鍍層包括通過塗布觸媒形成有預鍍範圍2及覆蓋在塗布觸媒上的化學銅3。並在所述絕緣件至少在預鍍範圍區域有作化學粗化。
本發明可以在所述塗布觸媒為平面噴塗方式成型的奈米有機鈀或者在所述塗布觸媒為立體噴塗方式成型的奈米有機鈀。
在本發明的第一種實施方式中，可以在所述化學銅的上層依次覆蓋有化學鎳及化學金。
在本發明的第二種實施方式中，可以在所述化學銅的上層依次覆蓋有電鍍銅、電鍍鎳及電鍍金，因電鍍鎳有利於防止氧化。
在本發明的第三種實施方式中，可以在所述化學銅的上層依次覆蓋有電鍍銅、電鍍鎳及電鍍黑鎳，因電鍍黑鎳可增加產品的射頻。
在本發明的第四種實施方式中，可以在所述化學銅的上層依次覆蓋有電鍍銅、電鍍鎳及電鍍金，增加產品的焊接功能。
綜上前述，本創作確已符合發明專利之要件，爰依法提出專利申請。惟，以上所述者僅係本發明之較佳實施方式，本發明之範圍並不以上述實施方式爲限，舉凡熟習本案技藝之人士援依本發明之精神所作之等效修飾或變化，皆應涵蓋於以下申請專利範圍內。
1‧‧‧絕緣件
2‧‧‧預鍍範圍
3‧‧‧化學鍍銅
1‧‧‧絕緣件
3‧‧‧化學鍍銅
Claims (15)
- 一種化學鍍產品，通過化學方法成型，其中，所述化學鍍產品包括絕緣件及位於絕緣件上的金屬鍍層，前述金屬鍍層包括通過一塗布觸媒形成有預鍍範圍及覆蓋在塗布觸媒上的化學銅。
- 如申請專利範圍第1項所述之化學鍍產品，其中所述絕緣件至少在預鍍範圍內作化學脫模及化學粗化。
- 如申請專利範圍第2項所述的化學鍍產品，其中所述化學銅的上層依次覆蓋有化學鎳及化學金。
- 如申請專利範圍第2項所述的化學鍍產品，其中所述化學銅的上層依次覆蓋有電鍍銅、電鍍鎳及電鍍金。
- 如申請專利範圍第2項所述的化學鍍產品，其中所述化學銅的上層依次覆蓋有電鍍銅、電鍍鎳。
- 如申請專利範圍第5項所述的化學鍍產品，其中所述電鍍鎳上進一步覆蓋有電鍍黑鎳。
- 如申請專利範圍第1項至第6項中任一項所述的化學鍍產品，其中所述塗布觸媒為平面噴塗方式成型的奈米有機鈀。
- 如申請專利範圍第1項至第6項中任一項所述的化學鍍產品，其中所述塗布觸媒為立體噴塗方式成型的奈米有機鈀。
- 一種化學鍍產品的成型方法，其中主要在於具有如下步驟：
a. 提供絕緣件；
b. 將上述絕緣件放入化學溶液作化學脫膜，之後對絕緣件作化學粗化；
c. 在絕緣件上作塗布觸媒確認預鍍範圍；
d. 在塗布觸媒上作化學鍍銅。 - 如申請專利範圍第9項所述的成型方法，其中在c步驟的塗布觸媒係成型平面的奈米有機鈀金屬導電層。
- 如申請專利範圍第9項所述的成型方法，其中在c步驟的塗布觸媒係成型立體結構的奈米有機鈀金屬導電層。
- 如申請專利範圍第10項或第11項所述的成型方法，其中在d步驟的化學鍍銅上可以依次做厚化鍍銅、化學鍍鎳及化學鍍金等步驟。
- 如申請專利範圍第10項或第11項所述的成型方法，其中在d步驟的化學鍍銅上可以依次做電鍍銅、電鍍鎳等步驟。
- 如申請專利範圍第13項所述的成型方法，其中在電鍍鎳上進一步作電鍍黑鎳等金屬。
- 如申請專利範圍第13項所述的成型方法，其中在電鍍鎳上進一步作電鍍金等金屬。
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| TW102138011A TWI544847B (zh) | 2013-10-22 | 2013-10-22 | 化學鍍產品及其成型方法 |
| US14/337,083 US20150111047A1 (en) | 2013-10-22 | 2014-07-21 | Chemical plating product and method forming thereof |
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| US7291380B2 (en) * | 2004-07-09 | 2007-11-06 | Hewlett-Packard Development Company, L.P. | Laser enhanced plating for forming wiring patterns |
| CN102102197B (zh) * | 2005-12-06 | 2014-04-16 | 荏原优莱特科技股份有限公司 | 钯配合物以及使用该配合物的催化剂赋予处理液 |
| JP4478115B2 (ja) * | 2006-01-27 | 2010-06-09 | 三共化成株式会社 | 導電性回路の形成方法 |
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| US8101962B2 (en) * | 2009-10-06 | 2012-01-24 | Kuang Hong Precision Co., Ltd. | Carrying structure of semiconductor |
| WO2013107065A1 (zh) * | 2012-01-18 | 2013-07-25 | 光宏精密股份有限公司 | 线路基板结构及其制作方法 |
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| TWI544847B (zh) | 2016-08-01 |
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