TW201528399A - 電子元件搬運方法及裝置 - Google Patents

電子元件搬運方法及裝置 Download PDF

Info

Publication number
TW201528399A
TW201528399A TW103100101A TW103100101A TW201528399A TW 201528399 A TW201528399 A TW 201528399A TW 103100101 A TW103100101 A TW 103100101A TW 103100101 A TW103100101 A TW 103100101A TW 201528399 A TW201528399 A TW 201528399A
Authority
TW
Taiwan
Prior art keywords
turntable
electronic component
transported
negative pressure
carrier
Prior art date
Application number
TW103100101A
Other languages
English (en)
Chinese (zh)
Other versions
TWI563585B (2
Inventor
王安田
黃子葳
黃清泰
黃建樺
Original Assignee
萬潤科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 萬潤科技股份有限公司 filed Critical 萬潤科技股份有限公司
Priority to TW103100101A priority Critical patent/TW201528399A/zh
Priority to CN201410304776.2A priority patent/CN104766816B/zh
Publication of TW201528399A publication Critical patent/TW201528399A/zh
Application granted granted Critical
Publication of TWI563585B publication Critical patent/TWI563585B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations

Landscapes

  • Specific Conveyance Elements (AREA)
TW103100101A 2014-01-02 2014-01-02 電子元件搬運方法及裝置 TW201528399A (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW103100101A TW201528399A (zh) 2014-01-02 2014-01-02 電子元件搬運方法及裝置
CN201410304776.2A CN104766816B (zh) 2014-01-02 2014-06-30 电子组件搬送方法及装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW103100101A TW201528399A (zh) 2014-01-02 2014-01-02 電子元件搬運方法及裝置

Publications (2)

Publication Number Publication Date
TW201528399A true TW201528399A (zh) 2015-07-16
TWI563585B TWI563585B (2) 2016-12-21

Family

ID=53648571

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103100101A TW201528399A (zh) 2014-01-02 2014-01-02 電子元件搬運方法及裝置

Country Status (2)

Country Link
CN (1) CN104766816B (2)
TW (1) TW201528399A (2)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106981447A (zh) * 2016-01-18 2017-07-25 天正国际精密机械股份有限公司 晶体管搬运检测的结构

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI640465B (zh) * 2016-02-04 2018-11-11 萬潤科技股份有限公司 Electronic component packaging carrier tape guiding method and device
TWI618666B (zh) * 2017-01-05 2018-03-21 All Ring Tech Co Ltd 載盤及使用該載盤的電子元件量測方法及裝置
TWI752602B (zh) * 2020-08-25 2022-01-11 萬潤科技股份有限公司 電子元件搬送方法及裝置
CN113716278B (zh) * 2021-09-10 2023-04-25 深圳市华腾半导体设备有限公司 一种分光用高效转盘输送系统
CN116553168B (zh) * 2022-01-27 2026-01-27 安益隆展业股份有限公司 用于检测电子元件的取料设备及其方法
CN116705674B (zh) * 2022-02-25 2026-02-06 安益隆展业股份有限公司 元件处理设备及其元件载盘装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4448297B2 (ja) * 2002-12-27 2010-04-07 株式会社荏原製作所 基板研磨装置及び基板研磨方法
TW200521050A (en) * 2003-12-23 2005-07-01 Tokyo Weld Co Ltd Work transferring and transporting apparatus and work transferring and transporting method
JP2010195592A (ja) * 2010-03-18 2010-09-09 Olympus Corp 浮上ユニット及び基板検査装置
WO2013084296A1 (ja) * 2011-12-06 2013-06-13 上野精機株式会社 電子部品搬送装置
JP2013168417A (ja) * 2012-02-14 2013-08-29 Nitto Denko Corp 基板搬送方法および基板搬送装置
TWM445574U (zh) * 2012-08-20 2013-01-21 All Ring Tech Co Ltd 電子元件之搬運載盤構造
TWM487301U (zh) * 2014-01-02 2014-10-01 All Ring Tech Co Ltd 電子元件搬送裝置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106981447A (zh) * 2016-01-18 2017-07-25 天正国际精密机械股份有限公司 晶体管搬运检测的结构
TWI615914B (zh) * 2016-01-18 2018-02-21 天正國際精密機械股份有限公司 晶體管搬運檢測之結構
CN106981447B (zh) * 2016-01-18 2019-10-25 天正国际精密机械股份有限公司 晶体管搬运检测的结构

Also Published As

Publication number Publication date
CN104766816A (zh) 2015-07-08
CN104766816B (zh) 2018-01-02
TWI563585B (2) 2016-12-21

Similar Documents

Publication Publication Date Title
TW201528399A (zh) 電子元件搬運方法及裝置
JP5889537B2 (ja) ダイボンダ
TWM487301U (zh) 電子元件搬送裝置
TWI630852B (zh) 電子元件包裝載帶補料方法及裝置
CN103955992B (zh) 一种用于分离片状材料的方法和装置
JP2017084498A (ja) 電極箔の搬送装置および積層型電池の製造装置
JP3222867U (ja) 除塵装置
KR101647877B1 (ko) 반도체 패키지들을 지지하기 위한 테이블 조립체
JP6228384B2 (ja) 吸着パッド、搬送ロボット及び吸着機構
KR102556329B1 (ko) 반도체 기판을 지지하는 진공척
CN205574869U (zh) 一种倒挂式薄片自动供料装置
CN105080849A (zh) 电子元件检测分选的搬送方法及装置
JP6349194B2 (ja) シート剥離装置
JP2012049430A (ja) 切削装置
CN107665828A (zh) 一种自动键合装置及方法
TWI752602B (zh) 電子元件搬送方法及裝置
CN110002213B (zh) 电子元件的输送装置及其输送方法
JP4901407B2 (ja) 吸着搬送構造
KR20160135457A (ko) 반도체 패키지 픽업 장치
CN210052725U (zh) 传输装置
KR101143348B1 (ko) 테이프 이송용 스프로켓 어셈블리 및 이를 구비한 반도체 패키징 설비
KR101239232B1 (ko) 기판 분류 이송장치
KR20110097419A (ko) 이송장치 및 이송방법
CN114864457A (zh) 一种ic芯片上料检测封装一体机
JP6067091B2 (ja) 異物除去装置及びそれを備えたダイボンダ

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees