TW201538461A - Polymerizable monomer, polymer compound, photocurable resin composition, sealing element for liquid crystal display element, vertical conduction material, and liquid crystal display element - Google Patents
Polymerizable monomer, polymer compound, photocurable resin composition, sealing element for liquid crystal display element, vertical conduction material, and liquid crystal display element Download PDFInfo
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- TW201538461A TW201538461A TW103141889A TW103141889A TW201538461A TW 201538461 A TW201538461 A TW 201538461A TW 103141889 A TW103141889 A TW 103141889A TW 103141889 A TW103141889 A TW 103141889A TW 201538461 A TW201538461 A TW 201538461A
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- Prior art keywords
- liquid crystal
- compound
- crystal display
- meth
- polymerizable monomer
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- 150000001875 compounds Chemical class 0.000 title claims abstract description 195
- 239000004973 liquid crystal related substance Substances 0.000 title claims abstract description 106
- 229920000642 polymer Polymers 0.000 title claims abstract description 88
- 239000000178 monomer Substances 0.000 title claims abstract description 69
- 239000011342 resin composition Substances 0.000 title claims abstract description 51
- 238000007789 sealing Methods 0.000 title claims abstract description 43
- 239000000463 material Substances 0.000 title claims abstract description 5
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 53
- 239000002253 acid Substances 0.000 claims abstract description 39
- 125000003700 epoxy group Chemical group 0.000 claims abstract description 13
- 125000000524 functional group Chemical group 0.000 claims abstract description 7
- 125000005370 alkoxysilyl group Chemical group 0.000 claims abstract description 3
- 239000004593 Epoxy Substances 0.000 claims description 42
- 239000000565 sealant Substances 0.000 claims description 29
- 239000001257 hydrogen Substances 0.000 claims description 26
- 229910052739 hydrogen Inorganic materials 0.000 claims description 26
- 238000006116 polymerization reaction Methods 0.000 claims description 22
- 229920005989 resin Polymers 0.000 claims description 20
- 239000011347 resin Substances 0.000 claims description 20
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 18
- 239000001301 oxygen Substances 0.000 claims description 15
- 229910052760 oxygen Inorganic materials 0.000 claims description 15
- 229910052717 sulfur Inorganic materials 0.000 claims description 13
- 239000011593 sulfur Substances 0.000 claims description 13
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims description 12
- 239000010419 fine particle Substances 0.000 claims description 10
- 125000003545 alkoxy group Chemical group 0.000 claims description 8
- 125000004432 carbon atom Chemical group C* 0.000 claims description 8
- 239000004020 conductor Substances 0.000 claims description 8
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 8
- 239000003605 opacifier Substances 0.000 claims description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 4
- 125000000217 alkyl group Chemical group 0.000 claims description 4
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- 238000011109 contamination Methods 0.000 abstract description 18
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- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical class C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 abstract 1
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- 238000000034 method Methods 0.000 description 17
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- 239000000378 calcium silicate Substances 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- CJZGTCYPCWQAJB-UHFFFAOYSA-L calcium stearate Chemical compound [Ca+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CJZGTCYPCWQAJB-UHFFFAOYSA-L 0.000 description 1
- 235000013539 calcium stearate Nutrition 0.000 description 1
- 239000008116 calcium stearate Substances 0.000 description 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
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- 230000003197 catalytic effect Effects 0.000 description 1
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- QIWWQTLNHRQHFW-UHFFFAOYSA-N cesium;propan-2-olate Chemical compound [Cs+].CC(C)[O-] QIWWQTLNHRQHFW-UHFFFAOYSA-N 0.000 description 1
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- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
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- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical compound O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 description 1
- 239000012975 dibutyltin dilaurate Substances 0.000 description 1
- KORSJDCBLAPZEQ-UHFFFAOYSA-N dicyclohexylmethane-4,4'-diisocyanate Chemical compound C1CC(N=C=O)CCC1CC1CCC(N=C=O)CC1 KORSJDCBLAPZEQ-UHFFFAOYSA-N 0.000 description 1
- UCQFCFPECQILOL-UHFFFAOYSA-N diethyl hydrogen phosphate Chemical compound CCOP(O)(=O)OCC UCQFCFPECQILOL-UHFFFAOYSA-N 0.000 description 1
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 1
- 125000005442 diisocyanate group Chemical group 0.000 description 1
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- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 1
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- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
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- AYLRODJJLADBOB-QMMMGPOBSA-N methyl (2s)-2,6-diisocyanatohexanoate Chemical compound COC(=O)[C@@H](N=C=O)CCCCN=C=O AYLRODJJLADBOB-QMMMGPOBSA-N 0.000 description 1
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- YWFWDNVOPHGWMX-UHFFFAOYSA-N n,n-dimethyldodecan-1-amine Chemical compound CCCCCCCCCCCCN(C)C YWFWDNVOPHGWMX-UHFFFAOYSA-N 0.000 description 1
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- 125000000864 peroxy group Chemical group O(O*)* 0.000 description 1
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- ZVUVJTQITHFYHV-UHFFFAOYSA-M potassium;naphthalene-1-carboxylate Chemical compound [K+].C1=CC=C2C(C(=O)[O-])=CC=CC2=C1 ZVUVJTQITHFYHV-UHFFFAOYSA-M 0.000 description 1
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- LVZZABGEQTZXHP-UHFFFAOYSA-L strontium;propanedioate Chemical compound [Sr+2].[O-]C(=O)CC([O-])=O LVZZABGEQTZXHP-UHFFFAOYSA-L 0.000 description 1
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- 229910052623 talc Inorganic materials 0.000 description 1
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 1
- WYKYCHHWIJXDAO-UHFFFAOYSA-N tert-butyl 2-ethylhexaneperoxoate Chemical compound CCCCC(CC)C(=O)OOC(C)(C)C WYKYCHHWIJXDAO-UHFFFAOYSA-N 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- JRMUNVKIHCOMHV-UHFFFAOYSA-M tetrabutylammonium bromide Chemical compound [Br-].CCCC[N+](CCCC)(CCCC)CCCC JRMUNVKIHCOMHV-UHFFFAOYSA-M 0.000 description 1
- RKHXQBLJXBGEKF-UHFFFAOYSA-M tetrabutylphosphanium;bromide Chemical compound [Br-].CCCC[P+](CCCC)(CCCC)CCCC RKHXQBLJXBGEKF-UHFFFAOYSA-M 0.000 description 1
- UWHCKJMYHZGTIT-UHFFFAOYSA-N tetraethylene glycol Chemical compound OCCOCCOCCOCCO UWHCKJMYHZGTIT-UHFFFAOYSA-N 0.000 description 1
- WYURNTSHIVDZCO-UHFFFAOYSA-N tetrahydrofuran Substances C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 238000001029 thermal curing Methods 0.000 description 1
- 238000012719 thermal polymerization Methods 0.000 description 1
- RYYWUUFWQRZTIU-UHFFFAOYSA-K thiophosphate Chemical compound [O-]P([O-])([O-])=S RYYWUUFWQRZTIU-UHFFFAOYSA-K 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
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- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- RUELTTOHQODFPA-UHFFFAOYSA-N toluene 2,6-diisocyanate Chemical compound CC1=C(N=C=O)C=CC=C1N=C=O RUELTTOHQODFPA-UHFFFAOYSA-N 0.000 description 1
- QXJQHYBHAIHNGG-UHFFFAOYSA-N trimethylolethane Chemical compound OCC(C)(CO)CO QXJQHYBHAIHNGG-UHFFFAOYSA-N 0.000 description 1
- YFTHZRPMJXBUME-UHFFFAOYSA-N tripropylamine Chemical compound CCCN(CCC)CCC YFTHZRPMJXBUME-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
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Classifications
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- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C229/00—Compounds containing amino and carboxyl groups bound to the same carbon skeleton
- C07C229/52—Compounds containing amino and carboxyl groups bound to the same carbon skeleton having amino and carboxyl groups bound to carbon atoms of six-membered aromatic rings of the same carbon skeleton
- C07C229/54—Compounds containing amino and carboxyl groups bound to the same carbon skeleton having amino and carboxyl groups bound to carbon atoms of six-membered aromatic rings of the same carbon skeleton with amino and carboxyl groups bound to carbon atoms of the same non-condensed six-membered aromatic ring
- C07C229/60—Compounds containing amino and carboxyl groups bound to the same carbon skeleton having amino and carboxyl groups bound to carbon atoms of six-membered aromatic rings of the same carbon skeleton with amino and carboxyl groups bound to carbon atoms of the same non-condensed six-membered aromatic ring with amino and carboxyl groups bound in meta- or para- positions
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- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D335/00—Heterocyclic compounds containing six-membered rings having one sulfur atom as the only ring hetero atom
- C07D335/04—Heterocyclic compounds containing six-membered rings having one sulfur atom as the only ring hetero atom condensed with carbocyclic rings or ring systems
- C07D335/10—Dibenzothiopyrans; Hydrogenated dibenzothiopyrans
- C07D335/12—Thioxanthenes
- C07D335/14—Thioxanthenes with hetero atoms or with carbon atoms having three bonds to hetero atoms with at the most one bond to halogen, e.g. ester or nitrile radicals, directly attached in position 9
- C07D335/16—Oxygen atoms, e.g. thioxanthones
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D311/00—Heterocyclic compounds containing six-membered rings having one oxygen atom as the only hetero atom, condensed with other rings
- C07D311/02—Heterocyclic compounds containing six-membered rings having one oxygen atom as the only hetero atom, condensed with other rings ortho- or peri-condensed with carbocyclic rings or ring systems
- C07D311/04—Benzo[b]pyrans, not hydrogenated in the carbocyclic ring
- C07D311/06—Benzo[b]pyrans, not hydrogenated in the carbocyclic ring with oxygen or sulfur atoms directly attached in position 2
- C07D311/08—Benzo[b]pyrans, not hydrogenated in the carbocyclic ring with oxygen or sulfur atoms directly attached in position 2 not hydrogenated in the hetero ring
- C07D311/16—Benzo[b]pyrans, not hydrogenated in the carbocyclic ring with oxygen or sulfur atoms directly attached in position 2 not hydrogenated in the hetero ring substituted in position 7
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/02—Silicon compounds
- C07F7/08—Compounds having one or more C—Si linkages
- C07F7/18—Compounds having one or more C—Si linkages as well as one or more C—O—Si linkages
- C07F7/1804—Compounds having Si-O-C linkages
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F20/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
- C08F20/02—Monocarboxylic acids having less than ten carbon atoms, Derivatives thereof
- C08F20/10—Esters
- C08F20/34—Esters containing nitrogen, e.g. N,N-dimethylaminoethyl (meth)acrylate
- C08F20/36—Esters containing nitrogen, e.g. N,N-dimethylaminoethyl (meth)acrylate containing oxygen in addition to the carboxy oxygen, e.g. 2-N-morpholinoethyl (meth)acrylate or 2-isocyanatoethyl (meth)acrylate
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F20/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
- C08F20/02—Monocarboxylic acids having less than ten carbon atoms, Derivatives thereof
- C08F20/10—Esters
- C08F20/38—Esters containing sulfur
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
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- C08F220/301—Esters containing oxygen in addition to the carboxy oxygen containing aromatic rings in the alcohol moiety and one oxygen in the alcohol moiety
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
- C08F220/30—Esters containing oxygen in addition to the carboxy oxygen containing aromatic rings in the alcohol moiety
- C08F220/303—Esters containing oxygen in addition to the carboxy oxygen containing aromatic rings in the alcohol moiety and one or more carboxylic moieties in the chain
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur, or oxygen atoms in addition to the carboxy oxygen
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
- C09K3/1006—Materials in mouldable or extrudable form for sealing or packing joints or covers characterised by the chemical nature of one of its constituents
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1339—Gaskets; Spacers; Sealing of cells
-
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Abstract
Description
本發明係關於一種對液晶之污染性低、對長波長之光為高感度且增感效果亦優異之聚合性單體、及使該聚合性單體聚合所獲得之高分子化合物。又,本發明係關於一種含有該聚合性單體及/或該高分子化合物之光硬化性樹脂組成物、使用該光硬化性樹脂組成物而成之液晶顯示元件用密封劑、及使用該液晶顯示元件用密封劑所製造之上下導通材料及液晶顯示元件。 The present invention relates to a polymerizable monomer which is low in contamination to liquid crystal, has high sensitivity to long-wavelength light, and is excellent in sensitizing effect, and a polymer compound obtained by polymerizing the polymerizable monomer. Furthermore, the present invention relates to a photocurable resin composition containing the polymerizable monomer and/or the polymer compound, a sealing agent for a liquid crystal display element using the photocurable resin composition, and a liquid crystal display device using the liquid crystal display device. The upper and lower conductive materials and the liquid crystal display element are used for the display element sealing agent.
近年來,作為液晶顯示單元等液晶顯示元件之製造方法,就縮短產距時間(tact time)、使用液晶量之最佳化等觀點而言,可使用如專利文獻1、專利文獻2中所揭示之使用含有硬化性樹脂、光聚合起始劑及熱硬化劑之光熱併用硬化型密封劑即被稱為滴下法之液晶滴下方式。 In recent years, as a method of manufacturing a liquid crystal display element such as a liquid crystal display unit, as disclosed in Patent Document 1 and Patent Document 2, from the viewpoints of shortening the tact time and optimizing the amount of liquid crystal. A liquid crystal dropping method called a dropping method, which is a photocuring and curing agent containing a curable resin, a photopolymerization initiator, and a thermosetting agent, is used.
於滴下法中,首先,於兩片附電極透明基板之一片藉由滴塗(dispense)而形成長方形之密封圖案。繼而,於密封劑未硬化狀態下將液晶之微滴滴加至透明基板之框內整個面,並立即將另一透明基板重疊,對密封部照射紫外線等光而進行暫時硬化。其後,於液晶退火時進行加熱而進行正式硬 化,製作液晶顯示元件。若欲於減壓下進行基板之貼合,則可以極高之效率製造液晶顯示元件,現在該滴下法成為液晶顯示元件之製造方法之主流。 In the dropping method, first, a rectangular sealing pattern is formed by dispensing on one of the two sheets of the electrode-attached transparent substrate. Then, the liquid crystal droplets are dropped onto the entire surface of the transparent substrate in a state where the sealant is not cured, and the other transparent substrate is immediately superposed, and the sealing portion is temporarily hardened by irradiating light such as ultraviolet rays. Thereafter, heating is performed during liquid crystal annealing to perform formal hardening. Production of liquid crystal display elements. If the substrate is to be bonded under reduced pressure, the liquid crystal display element can be manufactured with extremely high efficiency. Now, the dropping method is the mainstream of the manufacturing method of the liquid crystal display element.
且說,於行動電話、攜帶型遊戲機等各種附液晶面板之移動機器普及之現代,裝置之小型化為最為追求之課題。作為裝置之小型化之方法,可列舉液晶顯示部之窄邊緣化,例如將密封部之位置配置於黑色矩陣下(以下,亦稱為窄邊緣設計)。 In addition, in the modernization of various mobile devices including liquid crystal panels such as mobile phones and portable game machines, the miniaturization of devices is the most sought-after issue. As a method of downsizing the device, a narrow edge of the liquid crystal display portion can be cited. For example, the position of the sealing portion is placed under a black matrix (hereinafter also referred to as a narrow edge design).
然而,於窄邊緣設計中,由於密封劑被配置於黑色矩陣之正下方,故而若進行滴下法,則有於使密封劑進行光硬化時所照射之光被遮斷,光無法到達密封劑內部而硬化變得不充分之問題。若如此般密封劑之硬化變得不充分,則有未硬化之密封劑成分溶出至液晶中而容易產生液晶污染等問題。 However, in the narrow edge design, since the sealant is disposed directly under the black matrix, if the dropping method is performed, the light irradiated when the sealant is photocured is blocked, and the light cannot reach the inside of the sealant. And the problem of hardening becomes insufficient. If the curing of the sealant is insufficient, the uncured sealant component is eluted into the liquid crystal to cause liquid crystal contamination.
專利文獻3中揭示有於密封劑中調配高感度之光聚合起始劑。然而,僅調配高感度之光聚合起始劑時,無法充分地使密封劑進行光硬化。又,專利文獻4中揭示有將高感度之光聚合起始劑與增感劑進行組合而調配於密封劑。然而,因使用增感劑而有容易產生液晶污染之問題。 Patent Document 3 discloses a photopolymerization initiator which is formulated with a high sensitivity in a sealant. However, when only a high-sensitivity photopolymerization initiator is blended, the sealant cannot be sufficiently photocured. Further, Patent Document 4 discloses that a high-sensitivity photopolymerization initiator and a sensitizer are combined and formulated in a sealant. However, there is a problem that liquid crystal contamination is liable to occur due to the use of a sensitizer.
專利文獻1:日本特開2001-133794號公報 Patent Document 1: Japanese Laid-Open Patent Publication No. 2001-133794
專利文獻2:國際公開第02/092718號 Patent Document 2: International Publication No. 02/092718
專利文獻3:國際公開第2011/002028號 Patent Document 3: International Publication No. 2011/002028
專利文獻4:日本特開2010-286640號公報 Patent Document 4: Japanese Laid-Open Patent Publication No. 2010-286640
本發明之目的在於提供一種對液晶之污染性低、對長波長之光為高感度且增感效果亦優異之聚合性單體、及使該聚合性單體聚合所獲得之高分子化合物。又,本發明之目的在於提供一種含有該聚合性單體及/或該高分子化合物之光硬化性樹脂組成物、使用該光硬化性樹脂組成物而成之液晶顯示元件用密封劑、及使用該液晶顯示元件用密封劑所製造之上下導通材料及液晶顯示元件。 An object of the present invention is to provide a polymerizable monomer which is low in pollution to liquid crystal, has high sensitivity to long-wavelength light, and is excellent in sensitizing effect, and a polymer compound obtained by polymerizing the polymerizable monomer. Moreover, an object of the present invention is to provide a photocurable resin composition containing the polymerizable monomer and/or the polymer compound, a sealing agent for a liquid crystal display element using the photocurable resin composition, and the like. The upper and lower conductive materials and the liquid crystal display element are used for the liquid crystal display element sealing agent.
本發明係一種使二烷基胺基苯甲酸系化合物或具有可與環氧基反應之官能基之9-氧硫衍生物、與具有不飽和雙鍵之環氧化合物或具有烷氧基矽基(alkoxysilyl)之環氧化合物進行反應所獲得之聚合性單體。 The present invention is a 2-alkylaminobenzoic acid-based compound or a 9-oxosulfuric acid having a functional group reactive with an epoxy group. A polymerizable monomer obtained by reacting a derivative with an epoxy compound having an unsaturated double bond or an epoxy compound having an alkoxysilyl group.
以下,對本發明詳細敍述。 Hereinafter, the present invention will be described in detail.
本發明人驚奇地發現:具有特定結構之聚合性單體或使該聚合性單體聚合所獲得之高分子化合物對液晶之污染性低,對長波長之光為高感度且增感效果亦優異。因此,本發明人發現:藉由使用將該聚合性單體或該高分子化合物作為光聚合起始劑或增感劑調配而得之光硬化性樹脂組成物,可獲得光硬化性優異、且可抑制液晶污染之液晶顯示元件用密封劑,從而完成本發明。 The present inventors have surprisingly found that a polymerizable monomer having a specific structure or a polymer compound obtained by polymerizing the polymerizable monomer has low contamination to liquid crystal, high sensitivity to long-wavelength light, and excellent sensitization effect. . Therefore, the present inventors have found that a photocurable resin composition obtained by blending the polymerizable monomer or the polymer compound as a photopolymerization initiator or a sensitizer is excellent in photocurability. The present invention can be completed by a sealing agent for a liquid crystal display element which can suppress liquid crystal contamination.
本發明之聚合性單體係使二烷基胺基苯甲酸系化合物或具有可與環氧基反應之官能基之9-氧硫衍生物(以下,簡稱為「9-氧硫衍生物」)、與具有不飽和雙鍵之環氧化合物或具有烷氧基矽基之環氧化合物(以下,併稱為「本發明之環氧化合物」)進行反應而獲 得。 The polymerizable single system of the present invention is a dialkylaminobenzoic acid compound or a 9-oxosulfuric acid having a functional group reactive with an epoxy group. Derivative (hereinafter, referred to as "9-oxygen sulfide" The derivative ") is obtained by a reaction with an epoxy compound having an unsaturated double bond or an epoxy compound having an alkoxyfluorenyl group (hereinafter referred to as "the epoxy compound of the present invention").
作為上述二烷基胺基苯甲酸系化合物,例如可列舉:下述式(1-1)所表示之化合物、下述式(1-2)所表示之化合物、下述式(1-3)所表示之化合物、7-(二甲基胺基)香豆素-3-羧酸等。其中,較佳為下述式(1-1)所表示之化合物、下述式(1-2)所表示之化合物、或下述式(1-3)所表示之化合物,更佳為下述式(2-1)所表示之化合物、下述式(2-2)所表示之化合物、或下述式(2-3)所表示之化合物。 Examples of the dialkylaminobenzoic acid-based compound include a compound represented by the following formula (1-1), a compound represented by the following formula (1-2), and the following formula (1-3). The compound represented, 7-(dimethylamino)coumarin-3-carboxylic acid, and the like. In particular, the compound represented by the following formula (1-1), the compound represented by the following formula (1-2), or the compound represented by the following formula (1-3) is more preferably the following. A compound represented by the formula (2-1), a compound represented by the following formula (2-2), or a compound represented by the following formula (2-3).
上述9-氧硫衍生物具有可與環氧基反應之官能基。作為上述可與環氧基反應之官能基,例如可列舉:羥基、羧基、胺基等。其中,較佳為羥基或羧基。 The above 9-oxygen sulfur The derivative has a functional group reactive with an epoxy group. Examples of the functional group reactive with the epoxy group include a hydroxyl group, a carboxyl group, and an amine group. Among them, a hydroxyl group or a carboxyl group is preferred.
作為上述9-氧硫衍生物,例如可列舉:下述式(3)所表示之化合物、2-胺基-9H-硫-9酮等。其中,較佳為下述式(3)所表示之化合物,更佳為下述式(5-1)所表示之化合物或(5-2)所表示之化合物。 As the above 9-oxygen sulfur The derivative may, for example, be a compound represented by the following formula (3), 2-amino-9H-sulfur -9 ketone and the like. Among them, a compound represented by the following formula (3) is preferred, and a compound represented by the following formula (5-1) or a compound represented by the formula (5-2) is more preferred.
式(3)中,X為氫、羥基、或下述式(4)所表示之基。各個X可相同亦可不同,但至少一個X為羥基或下述式(4)所表示之基。 In the formula (3), X is hydrogen, a hydroxyl group, or a group represented by the following formula (4). Each X may be the same or different, but at least one X is a hydroxyl group or a group represented by the following formula (4).
與上述二烷基胺基苯甲酸系化合物或上述9-氧硫衍生物進行反應的本發明之環氧化合物係具有不飽和雙鍵之環氧化合物或具有烷氧基矽基之環氧化合物。 And the above dialkylaminobenzoic acid compound or the above 9-oxygen sulfur The epoxy compound of the present invention in which the derivative is reacted is an epoxy compound having an unsaturated double bond or an epoxy compound having an alkoxyfluorenyl group.
上述不飽和雙鍵或烷氧基矽基具有作為與本發明之聚合性單體之聚 合相關之聚合性反應基的作用。 The above unsaturated double bond or alkoxyfluorenyl group has a polycondensation as a polymerizable monomer of the present invention The role of the associated polymeric reactive group.
作為上述具有不飽和雙鍵之官能基,例如可列舉:(甲基)丙烯醯氧基、乙烯基、烯丙基等。其中,較佳為(甲基)丙烯醯氧基。 Examples of the functional group having an unsaturated double bond include (meth)acryloxy group, vinyl group, allyl group and the like. Among them, a (meth)acryloxy group is preferred.
再者,於本說明書中,上述所謂「(甲基)丙烯醯氧基」,係指丙烯醯氧基或甲基丙烯醯氧基。 In the present specification, the above-mentioned "(meth)acryloxyloxy group" means an acryloxy group or a methacryloxy group.
作為上述烷氧基矽基,例如可列舉:三甲氧基矽基(trimethoxysilyl group)、三乙氧基矽基、甲基二甲氧基矽基、甲基二乙氧基矽基等。其中,較佳為三甲氧基矽基。 Examples of the alkoxyfluorenyl group include a trimethoxysilyl group, a triethoxysulfonyl group, a methyldimethoxyfluorenyl group, and a methyldiethoxyfluorenyl group. Among them, a trimethoxyindenyl group is preferred.
作為本發明之環氧化合物,可較佳地使用下述式(6-1)或(6-2)所表示之化合物。 As the epoxy compound of the present invention, a compound represented by the following formula (6-1) or (6-2) can be preferably used.
式(6-1)中,R1表示氫或甲基。式(6-2)中,R2表示碳數為1~10之烷基或碳數為1~10之烷氧基。各個R2可相同亦可不同,但至少一個R2為碳數為1~10之烷氧基。 In the formula (6-1), R 1 represents hydrogen or a methyl group. In the formula (6-2), R 2 represents an alkyl group having 1 to 10 carbon atoms or an alkoxy group having 1 to 10 carbon atoms. Each R 2 may be the same or different, but at least one R 2 is an alkoxy group having a carbon number of 1 to 10.
作為使上述二烷基胺基苯甲酸系化合物或上述9-氧硫 衍生物與本發明之環氧化合物反應而獲得本發明之聚合性單體的方 法,可列舉:於鹼性觸媒之存在下,一面將上述二烷基胺基苯甲酸系化合物或上述9-氧硫衍生物與本發明之環氧化合物於80~130℃之條件攪拌6~72小時一面進行反應之方法等。上述二烷基胺基苯甲酸系化合物或上述9-氧硫衍生物與本發明之環氧化合物之反應就反應性之觀點而言,較佳為於三價有機磷酸化合物及/或胺化合物之存在下進行。 As the above dialkylaminobenzoic acid compound or the above 9-oxosulfur The method for obtaining a polymerizable monomer of the present invention by reacting a derivative with the epoxy compound of the present invention includes the above-mentioned dialkylaminobenzoic acid compound or the above 9-side in the presence of a basic catalyst. Oxygen and sulfur A method in which the derivative and the epoxy compound of the present invention are stirred at 80 to 130 ° C for 6 to 72 hours to carry out a reaction. The above dialkylaminobenzoic acid compound or the above 9-oxygen sulfur The reaction of the derivative with the epoxy compound of the present invention is preferably carried out in the presence of a trivalent organic phosphoric acid compound and/or an amine compound from the viewpoint of reactivity.
使上述二烷基胺基苯甲酸系化合物或上述9-氧硫衍生物與本發明之環氧化合物進行反應時,作為上述二烷基胺基苯甲酸系化合物或上述9-氧硫衍生物與本發明之環氧化合物之使用比率,較佳為以莫耳比計,上述二烷基胺基苯甲酸系化合物或上述9-氧硫衍生物:本發明之環氧化合物=1:1~10:1。藉由使上述二烷基胺基苯甲酸系化合物或上述9-氧硫衍生物與本發明之環氧化合物的使用比率在該範圍,可以高產率製造具有光反應性基之本發明之聚合性單體。 Making the above dialkylaminobenzoic acid compound or the above 9-oxygen sulfur When the derivative is reacted with the epoxy compound of the present invention, the above dialkylaminobenzoic acid compound or the above 9-oxygen sulfur The ratio of use of the derivative to the epoxy compound of the present invention is preferably a molar ratio of the above-mentioned dialkylaminobenzoic acid compound or the above 9-oxygen sulfur. Derivative: The epoxy compound of the present invention = 1:1 to 10:1. By using the above dialkylaminobenzoic acid compound or the above 9-oxygen sulfur The ratio of use of the derivative to the epoxy compound of the present invention is in this range, and the polymerizable monomer of the present invention having a photoreactive group can be produced in a high yield.
作為使上述二烷基胺基苯甲酸系化合物或上述9-氧硫 衍生物與本發明之環氧化合物進行反應時使用的鹼性觸媒,例如可列舉:三苯基膦、三乙基胺、三丙基胺、四甲基乙二胺、二甲基月桂胺、氯化三乙基苄基銨、溴化三甲基鯨蠟基銨、溴化四丁基銨、溴化三甲基丁基鏻、溴化四丁基鏻等。其中,較佳為三苯基膦。 As the above dialkylaminobenzoic acid compound or the above 9-oxosulfur The basic catalyst used in the reaction of the derivative with the epoxy compound of the present invention may, for example, be triphenylphosphine, triethylamine, tripropylamine, tetramethylethylenediamine or dimethyllaurylamine. And triethylbenzylammonium chloride, trimethyl cetyl ammonium bromide, tetrabutylammonium bromide, trimethylbutylphosphonium bromide, tetrabutylphosphonium bromide, and the like. Among them, triphenylphosphine is preferred.
又,亦可使上述鹼性觸媒載持於聚合物,作為聚合物載持鹼性觸媒而使用。 Further, the basic catalyst may be carried on a polymer and used as a polymer-supporting alkaline catalyst.
作為使上述二烷基胺基苯甲酸系化合物與本發明之環氧化合物反應所獲得的本發明之聚合性單體(以下,亦稱為「由二烷基胺基苯甲酸系化合物獲得之聚合性單體」),具體而言,例如可列舉下述式(7 -1)~(7-6)所表示之化合物等。 The polymerizable monomer of the present invention obtained by reacting the above-mentioned dialkylaminobenzoic acid-based compound with the epoxy compound of the present invention (hereinafter, also referred to as "polymerization obtained from a dialkylaminobenzoic acid-based compound" The specific monomer "), specifically, for example, the following formula (7) a compound represented by -1) to (7-6).
式(7-1)~(7-3)中,R1表示氫或甲基。式(7-4)~(7-6)中,R2表示碳數為1~10之烷基或碳數為1~10之烷氧基。各個R2可相同亦可不同,但至少一個R2為碳數為1~10之烷氧基。 In the formulae (7-1) to (7-3), R 1 represents hydrogen or a methyl group. In the formulae (7-4) to (7-6), R 2 represents an alkyl group having 1 to 10 carbon atoms or an alkoxy group having 1 to 10 carbon atoms. Each R 2 may be the same or different, but at least one R 2 is an alkoxy group having a carbon number of 1 to 10.
作為使上述9-氧硫衍生物與本發明之環氧化合物反應所獲得的本發明之聚合性單體(以下,亦稱為「由9-氧硫衍生物獲得之聚合性單體」),具體而言,例如可列舉下述式(8-1)~(8-4)所表示之化合物等。 As the above 9-oxygen sulfur The polymerizable monomer of the present invention obtained by reacting a derivative with the epoxy compound of the present invention (hereinafter, also referred to as "from 9-oxosulfuric acid Specific examples of the polymerizable monomer obtained by the derivative are, for example, compounds represented by the following formulas (8-1) to (8-4).
式(8-1)、(8-2)中,R1表示氫或甲基。式(8-3)、(8-4)中,R2表示碳數為1~10之烷基或碳數為1~10之烷氧基。各個R2可相同亦可不同,但至少一個R2為碳數為1~10之烷氧基。 In the formulae (8-1) and (8-2), R 1 represents hydrogen or a methyl group. In the formulae (8-3) and (8-4), R 2 represents an alkyl group having 1 to 10 carbon atoms or an alkoxy group having 1 to 10 carbon atoms. Each R 2 may be the same or different, but at least one R 2 is an alkoxy group having a carbon number of 1 to 10.
使本發明之聚合性單體進行聚合所獲得之高分子化合物(以下,亦稱為「本發明之高分子化合物」)亦係本發明之一。 The polymer compound obtained by polymerizing the polymerizable monomer of the present invention (hereinafter also referred to as "the polymer compound of the present invention") is also one of the present inventions.
作為使本發明之聚合性單體中由上述二烷基胺基苯甲酸系化合物獲得之聚合性單體進行聚合之方法,例如可列舉:陽離子聚合、陰離子聚合、自由基聚合等。其中,較佳為如下方法:將溶解於甲苯溶劑中之化合物於偶氮雙異丁腈等自由基聚合起始劑之存在下一面於60~100℃之條件攪拌4~12小時一面進行反應。 The method of polymerizing the polymerizable monomer obtained from the above-described dialkylaminobenzoic acid-based compound in the polymerizable monomer of the present invention includes, for example, cationic polymerization, anionic polymerization, and radical polymerization. Among them, a method in which a compound dissolved in a toluene solvent is stirred at 60 to 100 ° C for 4 to 12 hours in the presence of a radical polymerization initiator such as azobisisobutyronitrile is preferably carried out.
作為使由上述二烷基胺基苯甲酸系化合物獲得之聚合性單體進行陽離子聚合時使用的陽離子聚合觸媒,例如可列舉:鹽酸、硝酸、硫酸、磷酸等無機酸,或甲酸、乙酸、丙酸等羧酸,或甲磺酸、乙磺酸、苯磺酸、對甲苯磺酸等磺酸等。其中,較佳為鹽酸。 The cationic polymerization catalyst used for cationic polymerization of the polymerizable monomer obtained from the above-mentioned dialkylaminobenzoic acid-based compound may, for example, be a mineral acid such as hydrochloric acid, nitric acid, sulfuric acid or phosphoric acid, or formic acid or acetic acid. A carboxylic acid such as propionic acid or a sulfonic acid such as methanesulfonic acid, ethanesulfonic acid, benzenesulfonic acid or p-toluenesulfonic acid. Among them, hydrochloric acid is preferred.
作為使由上述二烷基胺基苯甲酸系化合物獲得之聚合性單體進行陰離子聚合時使用的陰離子聚合觸媒,例如可列舉:正丁基鋰、第二丁基鋰、第三丁基鋰等烷基鋰,1,4-二鋰丁烷等伸烷基二鋰、苯基鋰、茋鋰、萘鋰、萘鈉、萘鉀、正丁基鎂、正己基鎂、乙氧基鈣(ethoxy calcium)、硬脂酸鈣、第三丁醇鍶、乙氧基鋇、異丙氧基鋇、乙基巰基鋇、第三丁氧基鋇、苯氧基鋇、二乙基胺基鋇、硬脂酸鋇等。其中,較佳為正丁基鋰。 The anionic polymerization catalyst used for anionic polymerization of the polymerizable monomer obtained from the above dialkylaminobenzoic acid-based compound may, for example, be n-butyllithium, second butyllithium or t-butyllithium. Alkali lithium, 1,4-dilithium butane, etc. alkyl dilithium, phenyl lithium, ruthenium lithium, lithium naphthalene, sodium naphthalene, potassium naphthalate, n-butyl magnesium, n-hexyl magnesium, calcium ethoxylate Ethoxy calcium), calcium stearate, barium butoxide, barium ethoxylate, cesium isopropoxide, hydrazinium ethoxide, cesium oxyhydroxide, phenoxy hydrazine, diethylamino hydrazine, Barium stearate and the like. Among them, n-butyllithium is preferred.
作為使由上述二烷基胺基苯甲酸系化合物獲得之聚合性單體進行自由基聚合時使用的自由基聚合起始劑,例如可列舉:偶氮雙異 丁腈、偶氮雙環己腈、偶氮雙(2,4-二甲基戊腈)等偶氮系化合物,或過氧化苯甲醯、過氧化月桂醯、鄰氯過氧化苯甲醯、鄰甲氧基過氧化苯甲醯、過氧化3,5,5-三甲基己醯、過氧化(2-乙基己酸)第三丁酯、過氧化二-第三丁基等有機過氧化物等。其中,較佳為偶氮雙異丁腈。 The radical polymerization initiator used for radical polymerization of the polymerizable monomer obtained from the above dialkylaminobenzoic acid-based compound may, for example, be azobisiso An azo compound such as nitrile, azobiscyclohexanenitrite or azobis(2,4-dimethylvaleronitrile), or benzamidine peroxide, lauric acid peroxide, ortho-benzyl peroxybenzoate, ortho Organic peroxidation of benzamidine methoxybenzoate, 3,5,5-trimethylhexyl peroxide, tert-butyl peroxy-2-ethylhexanoate, di-tert-butyl peroxide Things and so on. Among them, azobisisobutyronitrile is preferred.
作為使本發明之聚合性單體中由上述9-氧硫衍生物獲得之聚合性單體進行聚合之方法,例如可列舉:於酸性觸媒或鹼性觸媒之存在下藉由溶膠凝膠法之聚合等,較佳為將溶解於乙醇溶劑中之本發明之聚合性單體與水進行混合,並於酸性觸媒下一面於60~120℃之條件攪拌2~24小時一面進行反應的方法。 As the polymerizable monomer of the present invention, the above-mentioned 9-oxosulfur The method of polymerizing the polymerizable monomer obtained by the derivative is, for example, polymerization by a sol-gel method in the presence of an acidic catalyst or a basic catalyst, and preferably dissolved in an ethanol solvent. The method wherein the polymerizable monomer of the invention is mixed with water and stirred under an acidic catalyst at 60 to 120 ° C for 2 to 24 hours.
作為使由上述9-氧硫衍生物獲得之聚合性單體進行聚合時使用的酸性觸媒,例如可列舉:鹽酸、硝酸、硫酸、磷酸等無機酸,或甲酸、乙酸、丙酸等羧酸,或甲磺酸、乙磺酸、苯磺酸、對甲苯磺酸等磺酸等。其中,較佳為鹽酸。 As a result of the above 9-oxosulfur Examples of the acidic catalyst used for the polymerization of the polymerizable monomer obtained by the derivative include inorganic acids such as hydrochloric acid, nitric acid, sulfuric acid, and phosphoric acid, or carboxylic acids such as formic acid, acetic acid, and propionic acid, or methanesulfonic acid or ethyl sulfonate. A sulfonic acid such as acid, benzenesulfonic acid or p-toluenesulfonic acid. Among them, hydrochloric acid is preferred.
作為使由上述9-氧硫衍生物獲得之聚合性單體進行聚合時使用的鹼性觸媒,可列舉:氫氧化鈉、氫氧化鉀、氨等無機化合物,或胺化合物等有機化合物等。其中,較佳為氫氧化鈉。 As a result of the above 9-oxosulfur The basic catalyst used for the polymerization of the polymerizable monomer obtained by the derivative may, for example, be an inorganic compound such as sodium hydroxide, potassium hydroxide or ammonia, or an organic compound such as an amine compound. Among them, sodium hydroxide is preferred.
本發明之高分子化合物之聚合度之較佳下限為3。若本發明之高分子化合物之聚合度為2、即二聚物,則於作為光聚合起始劑或增感劑而用於液晶顯示元件用密封劑之情形時有無法充分抑制液晶污染之情況。本發明之高分子化合物之聚合度之更佳下限為10。 A preferred lower limit of the degree of polymerization of the polymer compound of the present invention is 3. When the degree of polymerization of the polymer compound of the present invention is 2, that is, a dimer, when it is used as a photopolymerization initiator or a sensitizer for a sealing agent for a liquid crystal display element, liquid crystal contamination cannot be sufficiently suppressed. . A more preferred lower limit of the degree of polymerization of the polymer compound of the present invention is 10.
又,本發明之高分子化合物之聚合度之較佳上限為1000。若本發明之高分子化合物之聚合度超過1000,則於作為光聚合起始劑或增感劑而用於 液晶顯示元件用密封劑之情形時有塗佈性變差之情況。本發明之高分子化合物之聚合度之更佳上限為100。 Further, a preferred upper limit of the degree of polymerization of the polymer compound of the present invention is 1,000. When the polymerization degree of the polymer compound of the present invention exceeds 1,000, it is used as a photopolymerization initiator or sensitizer In the case of a sealant for a liquid crystal display element, the coatability may be deteriorated. A more preferable upper limit of the degree of polymerization of the polymer compound of the present invention is 100.
本發明之高分子化合物之數量平均分子量之較佳下限為2000,較佳上限為3萬。若本發明之高分子化合物之數量平均分子量未達2000,則於作為光聚合起始劑或增感劑而用於液晶顯示元件用密封劑之情形時有無法充分抑制液晶污染之情況。若本發明之高分子化合物之數量平均分子量超過3萬,則於作為光聚合起始劑或增感劑而用於液晶顯示元件用密封劑之情形時有塗佈性變差之情況。本發明之高分子化合物之數量平均分子量之更佳下限為5000,更佳上限為1萬。 A preferred lower limit of the number average molecular weight of the polymer compound of the present invention is 2,000, and a preferred upper limit is 30,000. When the number average molecular weight of the polymer compound of the present invention is less than 2,000, the liquid crystal contamination may not be sufficiently suppressed when it is used as a photopolymerization initiator or a sensitizer for a sealing agent for a liquid crystal display device. When the number average molecular weight of the polymer compound of the present invention is more than 30,000, the coating property may be deteriorated when it is used as a photopolymerization initiator or a sensitizer for a sealing agent for a liquid crystal display device. The lower limit of the number average molecular weight of the polymer compound of the present invention is 5,000, and the upper limit is more preferably 10,000.
再者,於本說明書中,上述數量平均分子量係利用凝膠滲透層析法(GPC)進行測定並藉由聚苯乙烯換算所求出之值。作為利用GPC測定藉由聚苯乙烯換算所得之數量平均分子量時之管柱,例如可列舉Shodex LF-804(昭和電工公司製造)等。 In the present specification, the above-mentioned number average molecular weight is a value measured by gel permeation chromatography (GPC) and determined by polystyrene conversion. For example, Shodex LF-804 (manufactured by Showa Denko KK) can be used as the column for measuring the number average molecular weight in terms of polystyrene by GPC.
本發明之高分子化合物對長波長之光為高感度且增感效果亦優異,故而可較佳地用作光聚合起始劑或增感劑。 The polymer compound of the present invention is highly sensitive to long-wavelength light and excellent in sensitizing effect, and thus can be preferably used as a photopolymerization initiator or a sensitizer.
含有硬化性樹脂與本發明之聚合性單體及/或本發明之高分子化合物的光硬化性樹脂組成物亦係本發明之一。 A photocurable resin composition containing a curable resin, a polymerizable monomer of the present invention, and/or a polymer compound of the present invention is also one of the present inventions.
本發明之光硬化性樹脂組成物就於剛塗佈在基板等後未與硬化性樹脂反應、且防止液晶污染之觀點而言,較佳為含有本發明之高分子化合物。本發明之高分子化合物具有作為光聚合起始劑或增感劑之作用。 The photocurable resin composition of the present invention preferably contains the polymer compound of the present invention from the viewpoint of not reacting with a curable resin immediately after application to a substrate or the like and preventing liquid crystal contamination. The polymer compound of the present invention has a function as a photopolymerization initiator or a sensitizer.
本發明之光硬化性樹脂組成物中,本發明之高分子化合物 之含量係相對於硬化性樹脂100重量份而較佳之下限為0.5重量份,較佳之上限為20重量份。若本發明之高分子化合物之含量未達0.5重量份,則有所獲得之光硬化性樹脂組成物成為光硬化性較差者之情況。若本發明之高分子化合物之含量超過20重量份,則有所獲得之光硬化性樹脂組成物成為耐候性或保存穩定性較差者,或於用於液晶顯示元件用密封劑之情形時產生液晶污染之情況。本發明之高分子化合物之含量之更佳下限為2重量份,更佳上限為10重量份。 In the photocurable resin composition of the present invention, the polymer compound of the present invention The content is preferably 0.5 parts by weight, and preferably 20 parts by weight, based on 100 parts by weight of the curable resin. When the content of the polymer compound of the present invention is less than 0.5 part by weight, the photocurable resin composition obtained may be inferior in photocurability. When the content of the polymer compound of the present invention exceeds 20 parts by weight, the photocurable resin composition obtained may have poor weather resistance or storage stability, or may be used in the case of a sealant for a liquid crystal display element. The situation of pollution. A more preferred lower limit of the content of the polymer compound of the present invention is 2 parts by weight, and a more preferred upper limit is 10 parts by weight.
本發明之光硬化性樹脂組成物較佳為將使由上述二烷基胺基苯甲酸系化合物獲得之聚合性單體聚合所獲得的本發明之高分子化合物(以下,亦稱為「由二烷基胺基苯甲酸系化合物獲得之高分子化合物」)、與使由上述9-氧硫衍生物獲得之聚合性單體聚合所獲得的本發明之高分子化合物(以下,亦稱為「由9-氧硫衍生物獲得之高分子化合物」)兩者組合含有,更佳為將由上述二烷基胺基苯甲酸系化合物獲得之高分子化合物用作光聚合起始劑,且將由上述9-氧硫衍生物獲得之高分子化合物用作增感劑。 The photocurable resin composition of the present invention is preferably a polymer compound of the present invention obtained by polymerizing a polymerizable monomer obtained from the above dialkylaminobenzoic acid-based compound (hereinafter also referred to as "two a polymer compound obtained by an alkylaminobenzoic acid compound"), and a 9-oxosulfuric acid obtained by the above The polymer compound of the present invention obtained by polymerizing a polymerizable monomer obtained by a derivative (hereinafter, also referred to as "from 9-oxosulfuric acid The polymer compound obtained by the derivative") is contained in combination, and it is more preferable to use the polymer compound obtained from the above dialkylaminobenzoic acid compound as a photopolymerization initiator, and the above 9-oxygen sulfur The polymer compound obtained by the derivative is used as a sensitizer.
於本發明之光硬化性樹脂組成物將由上述二烷基胺基苯甲酸系化合物獲得之高分子化合物與由上述9-氧硫衍生物獲得之高分子化合物兩者組合含有之情形時,由上述二烷基胺基苯甲酸系化合物獲得之高分子化合物與由上述9-氧硫衍生物獲得之高分子化合物的含有比率,較佳以重量比計,為由二烷基胺基苯甲酸系化合物獲得之高分子化合物:由9-氧硫衍生物獲得之高分子化合物=1:1~5:1。藉由使由二烷基胺基苯甲酸系化合物獲得之高分子化合物與由9-氧硫衍生 物獲得之高分子化合物的含有比率在該範圍,而所獲得之光硬化性樹脂組成物利用長波長之光之光硬化性尤其優異。 In the photocurable resin composition of the present invention, the polymer compound obtained from the above dialkylaminobenzoic acid compound and the above 9-oxosulfuric acid When the polymer compound obtained by the derivative is contained in combination, the polymer compound obtained from the above dialkylaminobenzoic acid compound and the above-mentioned 9-oxosulfuric acid The content ratio of the polymer compound obtained by the derivative is preferably a polymer compound obtained from a dialkylaminobenzoic acid compound by weight ratio: 9-oxosulfur The polymer compound obtained by the derivative = 1:1~5:1. By polymerizing a polymer compound obtained from a dialkylaminobenzoic acid compound with 9-oxosulfur The content ratio of the polymer compound obtained by the derivative is in this range, and the photocurable resin composition obtained is particularly excellent in photocurability using light of a long wavelength.
本發明之光硬化性樹脂組成物於用於液晶顯示元件用密封劑之情形時,除本發明之高分子化合物以外,亦可於不引起液晶污染等不良影響之範圍含有其他光聚合起始劑或其他增感劑。 When the photocurable resin composition of the present invention is used as a sealing agent for a liquid crystal display device, in addition to the polymer compound of the present invention, other photopolymerization initiators may be contained in a range that does not cause adverse effects such as liquid crystal contamination. Or other sensitizers.
作為上述其他光聚合起始劑,例如可列舉:二苯甲酮系化合物、苯乙酮系化合物、醯基膦氧化物系化合物、二茂鈦系化合物、肟酯系化合物、安息香醚系化合物、苯偶醯、9-氧硫、下述式(9-1)所表示之化合物、下述式(9-2)所表示之化合物等。 Examples of the other photopolymerization initiator include a benzophenone compound, an acetophenone compound, a mercaptophosphine oxide compound, a titanocene compound, an oxime ester compound, and a benzoin ether compound. Benzene oxime, 9-oxo sulphur A compound represented by the following formula (9-1), a compound represented by the following formula (9-2), and the like.
作為上述其他光聚合起始劑中之市售者,例如可列舉:IRGACURE184、IRGACURE369、IRGACURE379、IRGACURE651、IRGACURE819、IRGACURE907、IRGACURE2959、IRGACURE OXE01、LUCIRIN TPO(均為BASF公司製造)、安息香甲醚、安息香乙醚、安息香異丙醚(均為東京化成工業公司製造)、Adeka Optomer-N-1414、Adeka Optomer-N-1717、Adeka Optomer-N-1919、Adeka Optomer-NCI-839、 Adeka Optomer-NCI-930等(均為ADEKA公司製造)。 As a commercially available one of the other photopolymerization initiators, for example, IRGACURE 184, IRGACURE 369, IRGACURE 379, IRGACURE 651, IRGACURE 819, IRGACURE 907, IRGACURE 2959, IRGACURE OXE01, LUCIRIN TPO (all manufactured by BASF Corporation), benzoin methyl ether, benzoin Ether, benzoin isopropyl ether (all manufactured by Tokyo Chemical Industry Co., Ltd.), Adeka Optomer-N-1414, Adeka Optomer-N-1717, Adeka Optomer-N-1919, Adeka Optomer-NCI-839, Adeka Optomer-NCI-930, etc. (all manufactured by ADEKA).
作為上述其他增感劑,例如可列舉:蒽衍生物、蒽醌衍生物、香豆素衍生物、9-氧硫衍生物、酞菁衍生物、下述式(10-1)所表示之化合物、下述式(10-2)所表示之化合物等。 Examples of the other sensitizer include an anthracene derivative, an anthracene derivative, a coumarin derivative, and 9-oxosulfuric acid. A derivative, a phthalocyanine derivative, a compound represented by the following formula (10-1), a compound represented by the following formula (10-2), and the like.
作為上述蒽衍生物,例如可列舉:9,10-二丁氧基蒽、9,10-二丙氧基蒽醌、9,10-乙氧基蒽醌等。 Examples of the above anthracene derivative include 9,10-dibutoxyanthracene, 9,10-dipropoxyanthracene, and 9,10-ethoxyanthracene.
作為上述蒽醌衍生物,例如可列舉:2-乙基蒽醌、1-甲基蒽醌、1,4-二羥基蒽醌、2-(2-羥基乙氧基)-蒽醌等。 Examples of the anthracene derivative include 2-ethylhydrazine, 1-methylhydrazine, 1,4-dihydroxyindole, and 2-(2-hydroxyethoxy)-hydrazine.
作為上述香豆素衍生物,例如可列舉:7-二乙基胺基-4-甲基香豆素等。 Examples of the coumarin derivative include 7-diethylamino-4-methylcoumarin and the like.
作為上述9-氧硫衍生物,例如可列舉:2,4-二乙基9-氧硫、2-氯9-氧硫、4-異丙基9-氧硫、1-氯-4-丙基9-氧硫等。 As the above 9-oxygen sulfur Derivatives, for example, 2,4-diethyl 9-oxosulfur 2-chloro 9-oxosulfur 4-isopropyl 9-oxosulfur 1-chloro-4-propyl 9-oxosulfur Wait.
作為上述酞菁衍生物,例如可列舉:酞菁等。 Examples of the phthalocyanine derivative include phthalocyanine and the like.
又,亦可將上述作為其他光聚合起始劑所列舉之二苯甲酮系化合物用作上述其他增感劑。 Further, the benzophenone-based compound exemplified above as another photopolymerization initiator may be used as the other sensitizer.
本發明之光硬化性樹脂組成物含有硬化性樹脂。 The photocurable resin composition of the present invention contains a curable resin.
上述硬化性樹脂較佳為含有(甲基)丙烯酸樹脂。 The curable resin preferably contains a (meth)acrylic resin.
上述(甲基)丙烯酸樹脂就反應性之高低而言,較佳為於分子中具有2~3個(甲基)丙烯醯氧基。 The (meth)acrylic resin preferably has 2 to 3 (meth)acryloxy groups in the molecule in terms of reactivity.
作為上述(甲基)丙烯酸樹脂,例如可列舉:藉由使具有羥基之化合物與(甲基)丙烯酸反應所獲得之酯化合物、藉由使(甲基)丙烯酸與環氧化合物反應所獲得之環氧(甲基)丙烯酸酯、藉由使具有羥基之(甲基)丙烯酸衍生物與異氰酸酯化合物反應所獲得之(甲基)丙烯酸胺酯(urethane(meth)acrylate)等。其中,較佳為環氧(甲基)丙烯酸酯。再者,於本說明書中,上述所謂「(甲基)丙烯醯」,意指丙烯醯或甲基丙烯醯,上述所謂「(甲基)丙烯酸樹脂」,意指具有(甲基)丙烯醯氧基之樹脂。又,上述所謂「(甲基)丙烯酸酯」,意指丙烯酸酯或甲基丙烯酸酯。進而,上述所謂「環氧(甲基)丙烯酸酯」,意指使環氧樹脂中之全部環氧基與(甲基)丙烯酸進行反應而成之化合物。 Examples of the (meth)acrylic resin include an ester compound obtained by reacting a compound having a hydroxyl group with (meth)acrylic acid, and a ring obtained by reacting (meth)acrylic acid with an epoxy compound. Oxy (meth) acrylate, urethane (meth) acrylate obtained by reacting a (meth)acrylic acid derivative having a hydroxyl group with an isocyanate compound. Among them, epoxy (meth) acrylate is preferred. In the present specification, the above-mentioned "(meth)acryl oxime" means propylene oxime or methacryl oxime, and the above-mentioned "(meth)acrylic resin" means having (meth) propylene oxime Base resin. Moreover, the above-mentioned "(meth) acrylate" means acrylate or methacrylate. Further, the above-mentioned "epoxy (meth) acrylate" means a compound obtained by reacting all of the epoxy groups in the epoxy resin with (meth)acrylic acid.
作為上述酯化合物中之單官能者,例如可列舉:(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸2-羥基丙酯、(甲基)丙烯酸4-羥基丁酯、(甲基)丙烯酸2-羥基丁酯、(甲基)丙烯酸異丁酯、(甲基)丙烯酸第三丁酯、(甲基)丙烯酸異辛酯、(甲基)丙烯酸月桂酯、(甲基)丙烯酸硬脂酯、(甲基)丙烯酸異莰酯、(甲基)丙烯酸環己酯、(甲基)丙烯酸2-甲氧基乙酯、甲氧基乙二醇(甲基)丙烯酸酯、(甲基)丙烯酸2-乙氧基乙酯、(甲基)丙烯酸四氫呋喃甲酯、(甲基)丙烯酸苄酯、乙基卡必醇(甲基)丙烯酸酯、(甲基)丙烯酸苯氧基乙酯、苯氧基二乙二醇(甲基)丙烯酸酯、苯氧基聚乙二醇(甲 基)丙烯酸酯、甲氧基聚乙二醇(甲基)丙烯酸酯、(甲基)丙烯酸2,2,2-三氟乙酯、(甲基)丙烯酸2,2,3,3-四氟丙酯、(甲基)丙烯酸1H,1H,5H-八氟戊酯、醯亞胺(甲基)丙烯酸酯、(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸正丁酯、(甲基)丙烯酸丙酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸正辛酯、(甲基)丙烯酸異壬酯、(甲基)丙烯酸異肉豆蔻酯、(甲基)丙烯酸2-丁氧基乙酯、(甲基)丙烯酸2-苯氧基乙酯、(甲基)丙烯酸雙環戊烯酯、(甲基)丙烯酸異癸酯、(甲基)丙烯酸二乙基胺基乙酯、(甲基)丙烯酸二甲基胺基乙酯、丁二酸2-(甲基)丙烯醯氧基乙酯、六氫鄰苯二甲酸2-(甲基)丙烯醯氧基乙酯、鄰苯二甲酸2-(甲基)丙烯醯氧基乙基2-羥基丙酯、(甲基)丙烯酸縮水甘油酯、磷酸2-(甲基)丙烯醯氧基乙酯等。 Examples of the monofunctional ones of the above ester compounds include 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, and (methyl). ) 2-hydroxybutyl acrylate, isobutyl (meth)acrylate, tert-butyl (meth)acrylate, isooctyl (meth)acrylate, lauryl (meth)acrylate, (meth)acrylic acid Fatty ester, isodecyl (meth)acrylate, cyclohexyl (meth)acrylate, 2-methoxyethyl (meth)acrylate, methoxyethylene glycol (meth) acrylate, (methyl) ) 2-ethoxyethyl acrylate, tetrahydrofuran methyl (meth) acrylate, benzyl (meth) acrylate, ethyl carbitol (meth) acrylate, phenoxyethyl (meth) acrylate, Phenoxydiethylene glycol (meth) acrylate, phenoxy polyethylene glycol (A Acrylate, methoxypolyethylene glycol (meth) acrylate, 2,2,2-trifluoroethyl (meth) acrylate, 2,2,3,3-tetrafluoro (meth) acrylate Propyl ester, (meth)acrylic acid 1H, 1H, 5H-octafluoropentyl ester, quinone imine (meth) acrylate, methyl (meth) acrylate, ethyl (meth) acrylate, (meth) acrylate N-butyl acrylate, propyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, n-octyl (meth) acrylate, isodecyl (meth) acrylate, isomyristate (meth) acrylate Ester, 2-butoxyethyl (meth)acrylate, 2-phenoxyethyl (meth)acrylate, dicyclopentenyl (meth)acrylate, isodecyl (meth)acrylate, (methyl) ) diethylaminoethyl acrylate, dimethylaminoethyl (meth) acrylate, 2-(methyl) propylene methoxyethyl succinate, 2-(methyl hexahydrophthalate) ) propylene methoxyethyl ester, 2-(methyl) propylene oxiranyl 2-hydroxypropyl phthalate, glycidyl (meth) acrylate, 2-(methyl) propylene decyl phosphate Ethyl ester and the like.
又,作為上述酯化合物中之二官能者,例如可列舉:1,4-丁二醇二(甲基)丙烯酸酯、1,3-丁二醇二(甲基)丙烯酸酯、1,6-己二醇二(甲基)丙烯酸酯、1,9-壬二醇二(甲基)丙烯酸酯、1,10-癸二醇二(甲基)丙烯酸酯、2-正丁基-2-乙基-1,3-丙二醇二(甲基)丙烯酸酯、二丙二醇二(甲基)丙烯酸酯、三丙二醇二(甲基)丙烯酸酯、聚丙二醇(甲基)丙烯酸酯、乙二醇二(甲基)丙烯酸酯、二乙二醇二(甲基)丙烯酸酯、四乙二醇二(甲基)丙烯酸酯、聚乙二醇二(甲基)丙烯酸酯、環氧丙烷加成雙酚A二(甲基)丙烯酸酯、環氧乙烷加成雙酚A二(甲基)丙烯酸酯、環氧乙烷加成雙酚F二(甲基)丙烯酸酯、二羥甲基二環戊二烯基二(甲基)丙烯酸酯、新戊二醇二(甲基)丙烯酸酯、環氧乙烷改質異三聚氰酸二(甲基)丙烯酸酯、(甲基)丙烯酸2-羥基-3-(甲基)丙烯醯氧基丙酯、碳酸酯二醇二(甲基)丙烯酸酯、聚醚二醇二(甲基)丙烯酸酯、聚酯二醇二(甲基)丙烯酸酯、聚己內酯 二醇二(甲基)丙烯酸酯、聚丁二烯二醇二(甲基)丙烯酸酯等。 Further, examples of the difunctional one of the above ester compounds include 1,4-butanediol di(meth)acrylate, 1,3-butanediol di(meth)acrylate, and 1,6- Hexanediol di(meth)acrylate, 1,9-nonanediol di(meth)acrylate, 1,10-nonanediol di(meth)acrylate, 2-n-butyl-2-ethyl -1,3-propanediol di(meth)acrylate, dipropylene glycol di(meth)acrylate, tripropylene glycol di(meth)acrylate, polypropylene glycol (meth)acrylate, ethylene glycol di(a) Acrylate, diethylene glycol di(meth)acrylate, tetraethylene glycol di(meth)acrylate, polyethylene glycol di(meth)acrylate, propylene oxide addition bisphenol A (Meth) acrylate, ethylene oxide addition bisphenol A di(meth) acrylate, ethylene oxide addition bisphenol F di(meth) acrylate, dimethylol dicyclopentadiene Di-(meth) acrylate, neopentyl glycol di(meth) acrylate, ethylene oxide modified di(meth) acrylate, 2-hydroxy-3 (meth) acrylate -(Meth)propylene methoxypropyl ester, carbonate diol di(meth) acrylate, polyether Glycol di (meth) acrylate, polyester diol di (meth) acrylate, polycaprolactone Diol (meth) acrylate, polybutadiene diol di (meth) acrylate, and the like.
又,作為上述酯化合物中之三官能以上者,例如可列舉:新戊四醇三(甲基)丙烯酸酯、三羥甲基丙烷三(甲基)丙烯酸酯、環氧丙烷加成三羥甲基丙烷三(甲基)丙烯酸酯、環氧乙烷加成三羥甲基丙烷三(甲基)丙烯酸酯、己內酯改質三羥甲基丙烷三(甲基)丙烯酸酯、環氧乙烷加成異三聚氰酸三(甲基)丙烯酸酯、二新戊四醇五(甲基)丙烯酸酯、二新戊四醇六(甲基)丙烯酸酯、二-三羥甲基丙烷四(甲基)丙烯酸酯、新戊四醇四(甲基)丙烯酸酯、甘油三(甲基)丙烯酸酯、環氧丙烷加成甘油三(甲基)丙烯酸酯、三(甲基)丙烯醯氧基乙基磷酸酯等。 Further, examples of the trifunctional or higher of the above ester compounds include pentaerythritol tri(meth)acrylate, trimethylolpropane tri(meth)acrylate, and propylene oxide addition tris. Propane tri(meth)acrylate, ethylene oxide addition trimethylolpropane tri(meth)acrylate, caprolactone modified trimethylolpropane tri(meth)acrylate, epoxy B Alkane addition of tris(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, di-trimethylolpropane IV (Meth) acrylate, pentaerythritol tetra(meth) acrylate, glycerol tri(meth) acrylate, propylene oxide addition glycerol tri(meth) acrylate, tris(meth) propylene oxime Ethyl ethyl phosphate and the like.
作為上述環氧(甲基)丙烯酸酯,例如可列舉:藉由依據慣例使環氧樹脂與(甲基)丙烯酸於鹼性觸媒之存在下進行反應所獲得者。 Examples of the epoxy (meth) acrylate include those obtained by reacting an epoxy resin with (meth)acrylic acid in the presence of a basic catalyst according to a conventional practice.
作為用以合成上述環氧(甲基)丙烯酸酯之原料即環氧樹脂,例如可列舉:雙酚A型環氧樹脂、雙酚F型環氧樹脂、雙酚S型環氧樹脂、2,2'-二烯丙基雙酚A型環氧樹脂、氫化雙酚型環氧樹脂、環氧丙烷加成雙酚A型環氧樹脂、間苯二酚型環氧樹脂、聯苯型環氧樹脂、硫醚型環氧樹脂、二苯醚型環氧樹脂、二環戊二烯型環氧樹脂、萘型環氧樹脂、苯酚酚醛清漆型環氧樹脂、鄰甲酚酚醛清漆型環氧樹脂、二環戊二烯酚醛清漆型環氧樹脂、聯苯酚醛清漆型環氧樹脂、萘酚酚醛清漆型環氧樹脂、縮水甘油胺型環氧樹脂、烷基多元醇型環氧樹脂、橡膠改質型環氧樹脂、縮水甘油酯化合物等。 Examples of the epoxy resin which is a raw material for synthesizing the above epoxy (meth) acrylate include bisphenol A epoxy resin, bisphenol F epoxy resin, and bisphenol S epoxy resin. 2'-Diallyl bisphenol A type epoxy resin, hydrogenated bisphenol type epoxy resin, propylene oxide addition bisphenol A type epoxy resin, resorcinol type epoxy resin, biphenyl type epoxy Resin, thioether epoxy resin, diphenyl ether epoxy resin, dicyclopentadiene epoxy resin, naphthalene epoxy resin, phenol novolak epoxy resin, o-cresol novolac epoxy resin , dicyclopentadiene novolac type epoxy resin, biphenyl novolac type epoxy resin, naphthol novolac type epoxy resin, glycidylamine type epoxy resin, alkyl polyol type epoxy resin, rubber modification A quality epoxy resin, a glycidyl ester compound, or the like.
作為上述雙酚A型環氧樹脂中之市售者,例如可列舉:jER828EL、jER1004(均為三菱化學公司製造)、EPICLON 850(DIC公司 製造)等。 As a commercial item of the said bisphenol A type epoxy resin, the jER828EL and jER1004 (The manufacture of the Mitsubishi Chemical company), EPICLON 850 (DIC Manufacturing) and so on.
作為上述雙酚F型環氧樹脂中之市售者,例如可列舉:jER806、jER4004(均為三菱化學公司製造)等。 The commercially available one of the bisphenol F-type epoxy resins may, for example, be jER806 or jER4004 (all manufactured by Mitsubishi Chemical Corporation).
作為上述雙酚S型環氧樹脂中之市售者,例如可列舉:EPICLON EXA1514(DIC公司製造)等。 The commercially available one of the bisphenol S-type epoxy resins is, for example, EPICLON EXA1514 (manufactured by DIC Corporation).
作為上述2,2'-二烯丙基雙酚A型環氧樹脂中之市售者,例如可列舉:RE-810NM(日本化藥公司製造)等。 The commercially available one of the 2,2'-diallyl bisphenol A type epoxy resins is, for example, RE-810NM (manufactured by Nippon Kayaku Co., Ltd.).
作為上述氫化雙酚型環氧樹脂中之市售者,例如可列舉:EPICLON EXA7015(DIC公司製造)等。 The commercially available one of the hydrogenated bisphenol type epoxy resins is, for example, EPICLON EXA7015 (manufactured by DIC Corporation).
作為上述環氧丙烷加成雙酚A型環氧樹脂中之市售者,例如可列舉:EP-4000S(ADEKA公司製造)等。 The commercially available one of the above-mentioned propylene oxide-added bisphenol A-type epoxy resins is, for example, EP-4000S (manufactured by Adeka Co., Ltd.).
作為上述間苯二酚型環氧樹脂中之市售者,例如可列舉:EX-201(Nagase ChemteX公司製造)等。 The commercially available one of the resorcinol-type epoxy resins is, for example, EX-201 (manufactured by Nagase ChemteX Co., Ltd.).
作為上述聯苯型環氧樹脂中之市售者,例如可列舉:jER YX-4000H(三菱化學公司製造)等。 As a commercial item of the above-mentioned biphenyl type epoxy resin, jER YX-4000H (made by Mitsubishi Chemical Corporation), etc. are mentioned, for example.
作為上述硫醚型環氧樹脂中之市售者,例如可列舉:YSLV-50TE(新日鐵住金化學公司製造)等。 For example, YSLV-50TE (manufactured by Nippon Steel & Sumitomo Chemical Co., Ltd.) and the like are mentioned as a commercial product of the above-mentioned thioether type epoxy resin.
作為上述二苯醚型環氧樹脂中之市售者,例如可列舉:YSLV-80DE(新日鐵住金化學公司製造)等。 As a commercial item of the above-mentioned diphenyl ether type epoxy resin, YSLV-80DE (made by Nippon Steel & Sumitomo Chemical Co., Ltd.), etc. are mentioned, for example.
作為上述二環戊二烯型環氧樹脂中之市售者,例如可列舉:EP-4088S(ADEKA公司製造)等。 The commercially available one of the above-mentioned dicyclopentadiene type epoxy resins is, for example, EP-4088S (manufactured by Adeka Co., Ltd.).
作為上述萘型環氧樹脂中之市售者,例如可列舉:EPICLON HP4032、 EPICLON EXA-4700(均為DIC公司製造)等。 As a commercially available one of the above-mentioned naphthalene type epoxy resins, for example, EPICLON HP4032 can be cited. EPICLON EXA-4700 (all manufactured by DIC Corporation).
作為上述苯酚酚醛清漆型環氧樹脂中之市售者,例如可列舉:EPICLON N-770(DIC公司製造)等。 As a commercial item of the above-mentioned phenol novolak type epoxy resin, EPICLON N-770 (made by DIC Corporation) etc. are mentioned, for example.
作為上述鄰甲酚酚醛清漆型環氧樹脂中之市售者,例如可列舉:EPICLON N-670-EXP-S(DIC公司製造)等。 As a commercial item of the said o-cresol novolak-type epoxy resin, EPICLON N-670-EXP-S (made by the DIC company) etc. are mentioned, for example.
作為上述二環戊二烯酚醛清漆型環氧樹脂中之市售者,例如可列舉:EPICLON HP7200(DIC公司製造)等。 The commercially available one of the above-mentioned dicyclopentadiene novolac type epoxy resins is, for example, EPICLON HP7200 (manufactured by DIC Corporation).
作為上述聯苯酚醛清漆型環氧樹脂中之市售者,例如可列舉:NC-3000P(日本化藥公司製造)等。 The commercially available one of the above-mentioned biphenol novolak type epoxy resins is, for example, NC-3000P (manufactured by Nippon Kayaku Co., Ltd.).
作為上述萘酚酚醛清漆型環氧樹脂中之市售者,例如可列舉:ESN-165S(新日鐵住金化學公司製造)等。 As a commercial item of the above-mentioned naphthol novolac type epoxy resin, ESN-165S (made by Nippon Steel & Sumitomo Chemical Co., Ltd.), etc. are mentioned, for example.
作為上述縮水甘油胺型環氧樹脂中之市售者,例如可列舉:jER630(三菱化學公司製造)、EPICLON 430(DIC公司製造)、TETRAD-X(三菱瓦斯化學公司製造)等。 For example, jER630 (manufactured by Mitsubishi Chemical Corporation), EPICLON 430 (manufactured by DIC Corporation), TETRAD-X (manufactured by Mitsubishi Gas Chemical Co., Ltd.), and the like are exemplified as the commercially available ones of the glycidylamine-type epoxy resins.
作為上述烷基多元醇型環氧樹脂中之市售者,例如可列舉:ZX-1542(新日鐵住金化學公司製造)、EPICLON 726(DIC公司製造)、Epolight 80MFA(共榮社化學公司製造)、DENACOL EX-611(Nagase ChemteX公司製造)等。 For example, ZX-1542 (manufactured by Nippon Steel & Sumitomo Chemical Co., Ltd.), EPICLON 726 (manufactured by DIC Corporation), and Epolight 80MFA (manufactured by Kyoeisha Chemical Co., Ltd.) are listed as a commercial product of the above-mentioned alkyl polyol type epoxy resin. ), DENACOL EX-611 (manufactured by Nagase ChemteX), and the like.
作為上述橡膠改質型環氧樹脂中之市售者,例如可列舉:YR-450、YR-207(均為新日鐵住金化學公司製造)、Epolead PB(Daicel公司製造)等。 For example, YR-450, YR-207 (all manufactured by Nippon Steel & Sumitomo Chemical Co., Ltd.), Epolead PB (manufactured by Daicel Co., Ltd.), and the like are mentioned as a commercially available one of the rubber-modified epoxy resins.
作為上述縮水甘油酯化合物中之市售者,例如可列舉:DENACOL EX -147(Nagase ChemteX公司製造)等。 As a commercial one of the above glycidyl ester compounds, for example, DENACOL EX can be cited. -147 (manufactured by Nagase ChemteX Co., Ltd.) and the like.
作為上述環氧樹脂中之其他市售者,例如可列舉:YDC-1312、YSLV-80XY、YSLV-90CR(均為新日鐵住金化學公司製造)、XAC4151(旭化成公司製造)、jER7031、jER1032(均為三菱化學公司製造)、EXA-7120(DIC公司製造)、TEPIC(日產化學公司製造)等。 Other commercially available ones of the above-mentioned epoxy resins include YDC-1312, YSLV-80XY, YSLV-90CR (all manufactured by Nippon Steel & Sumitomo Chemical Co., Ltd.), XAC4151 (made by Asahi Kasei Corporation), and jER7031 and jER1032 ( All are manufactured by Mitsubishi Chemical Corporation, EXA-7120 (manufactured by DIC Corporation), TEPIC (manufactured by Nissan Chemical Co., Ltd.), and the like.
作為製造上述環氧(甲基)丙烯酸酯之方法,具體而言,例如,一面對間苯二酚型環氧樹脂(Nagase ChemteX公司製造,「EX-201」)360重量份、作為聚合抑制劑之對甲氧基苯酚2重量份、作為反應觸媒之三乙基胺2重量份、及丙烯酸210重量份送入空氣而進行回流攪拌,一面於90℃反應5小時,藉此可獲得間苯二酚型環氧丙烯酸酯。 As a method of producing the above-mentioned epoxy (meth) acrylate, specifically, for example, 360 parts by weight of a resorcinol type epoxy resin ("EX-201" manufactured by Nagase ChemteX Co., Ltd.) is used as a polymerization inhibitor. 2 parts by weight of p-methoxyphenol, 2 parts by weight of triethylamine as a reaction catalyst, and 210 parts by weight of acrylic acid were sent to air, and refluxed while stirring, and reacted at 90 ° C for 5 hours, thereby obtaining an interval. Hydroquinone type epoxy acrylate.
作為上述環氧(甲基)丙烯酸酯中之市售者,例如可列舉:EBECRYL860、EBECRYL3200、EBECRYL3201、EBECRYL3412、EBECRYL3600、EBECRYL3700、EBECRYL3701、EBECRYL3702、EBECRYL3703、EBECRYL3800、EBECRYL6040、EBECRYLRDX63182(均為Daicel-Allnex公司製造)、EA-1010、EA-1020、EA-5323、EA-5520、EA-CHD、EMA-1020(均為新中村化學工業公司製造)、環氧酯M-600A、環氧酯40EM、環氧酯70PA、環氧酯200PA、環氧酯80MFA、環氧酯3002M、環氧酯3002A、環氧酯1600A、環氧酯3000M、環氧酯3000A、環氧酯200EA、環氧酯400EA(均為共榮社化學公司製造)、Denacol Acrylate DA-141、Denacol Acrylate DA-314、Denacol Acrylate DA-911(均為Nagase ChemteX公司製造)等。 As a commercially available one of the above-mentioned epoxy (meth)acrylates, EBECRYL 860, EBECRYL 3200, EBECRYL 3201, EBECRYL 3412, EBECRYL 3600, EBECRYL 3700, EBECRYL 3701, EBECRYL 3702, EBECRYL 3703, EBECRYL 3800, EBECRYL 6040, EBECRRYLRDX 63182 (both are Daicel-Allnex) Manufactured), EA-1010, EA-1020, EA-5323, EA-5520, EA-CHD, EMA-1020 (all manufactured by Shin-Nakamura Chemical Industry Co., Ltd.), epoxy ester M-600A, epoxy ester 40EM, ring Oxygen ester 70PA, epoxy ester 200PA, epoxy ester 80MFA, epoxy ester 3002M, epoxy ester 3002A, epoxy ester 1600A, epoxy ester 3000M, epoxy ester 3000A, epoxy ester 200EA, epoxy ester 400EA (both It is manufactured by Kyoeisha Chemical Co., Ltd.), Denacol Acrylate DA-141, Denacol Acrylate DA-314, Denacol Acrylate DA-911 (all manufactured by Nagase ChemteX Co., Ltd.) and the like.
作為使具有羥基之(甲基)丙烯酸衍生物與上述異氰酸酯化 合物反應所獲得的(甲基)丙烯酸胺酯,例如可藉由如下方式而獲得:相對於具有兩個異氰酸酯基之異氰酸酯化合物1當量,使具有羥基之(甲基)丙烯酸衍生物2當量於觸媒量之錫系化合物存在下進行反應。 As a (meth)acrylic acid derivative having a hydroxyl group and isocyanate The (meth)acrylic acid amine ester obtained by the reaction of the compound can be obtained, for example, by making 2 equivalents of the (meth)acrylic acid derivative having a hydroxyl group with respect to 1 equivalent of the isocyanate compound having two isocyanate groups. The reaction is carried out in the presence of a catalytic amount of a tin-based compound.
作為上述(甲基)丙烯酸胺酯之原料即異氰酸酯化合物,例如可列舉:異佛酮二異氰酸酯、2,4-甲苯二異氰酸酯、2,6-甲苯二異氰酸酯、六亞甲基二異氰酸酯、三甲基六亞甲基二異氰酸酯、二苯基甲烷-4,4'-二異氰酸酯(MDI)、氫化MDI、聚合MDI、1,5-萘二異氰酸酯、降莰烷二異氰酸酯、聯甲苯胺二異氰酸酯、苯二甲基二異氰酸酯(XDI)、氫化XDI、離胺酸二異氰酸酯(lysine diisocyanate)、三苯基甲烷三異氰酸酯、三(異氰酸酯基苯基)硫代磷酸酯、四甲基二甲苯二異氰酸酯、1,6,11-十一烷三異氰酸酯等。 Examples of the isocyanate compound which is a raw material of the above (meth)acrylic acid amide ester include isophorone diisocyanate, 2,4-toluene diisocyanate, 2,6-toluene diisocyanate, hexamethylene diisocyanate, and trimethyl ketone. Hexamethylene diisocyanate, diphenylmethane-4,4'-diisocyanate (MDI), hydrogenated MDI, polymeric MDI, 1,5-naphthalene diisocyanate, norbornane diisocyanate, tolidine diisocyanate, Benzyl diisocyanate (XDI), hydrogenated XDI, lysine diisocyanate, triphenylmethane triisocyanate, tris(isocyanate phenyl) phosphorothioate, tetramethyl xylene diisocyanate, 1,6,11-undecane triisocyanate or the like.
又,作為上述(甲基)丙烯酸胺酯之原料即異氰酸酯化合物,例如亦可使用藉由乙二醇、甘油、山梨糖醇、三羥甲基丙烷、(聚)丙二醇、碳酸酯二醇、聚醚二醇、聚酯二醇、聚己內酯二醇等多元醇與過量之異氰酸酯化合物之反應所獲得的鏈經延長之異氰酸酯化合物。 Further, as the isocyanate compound which is a raw material of the above (meth)acrylic acid amide, for example, ethylene glycol, glycerin, sorbitol, trimethylolpropane, (poly)propylene glycol, carbonate diol, or polyglycol can also be used. A chain extended isocyanate compound obtained by reacting a polyol such as an ether diol, a polyester diol or a polycaprolactone diol with an excess of an isocyanate compound.
作為上述(甲基)丙烯酸胺酯之原料即具有羥基之(甲基)丙烯酸衍生物,例如可列舉:(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸2-羥基丙酯、(甲基)丙烯酸4-羥基丁酯、(甲基)丙烯酸2-羥基丁酯等(甲基)丙烯酸羥基烷基酯,或乙二醇、丙二醇、1,3-丙二醇、1,3-丁二醇、1,4-丁二醇、聚乙二醇等二元醇之單(甲基)丙烯酸酯,或三羥甲基乙烷、三羥甲基丙烷、甘油等三元醇之單(甲基)丙烯酸酯或二(甲基)丙烯酸酯,或雙酚A型環氧丙烯酸酯等環氧(甲基)丙烯酸酯等。 Examples of the (meth)acrylic acid derivative having a hydroxyl group as a raw material of the above (meth)acrylic acid amide include 2-hydroxyethyl (meth)acrylate and 2-hydroxypropyl (meth)acrylate. Hydroxyalkyl (meth) acrylate such as 4-hydroxybutyl methacrylate or 2-hydroxybutyl (meth) acrylate, or ethylene glycol, propylene glycol, 1,3-propanediol, 1,3-butane a mono (meth) acrylate of a glycol such as an alcohol, 1,4-butanediol or polyethylene glycol, or a monohydric alcohol such as trimethylolethane, trimethylolpropane or glycerin. Epoxy (meth) acrylate such as acrylate or di(meth) acrylate or bisphenol A epoxy acrylate.
上述(甲基)丙烯酸胺酯具體而言例如可藉由如下方式而獲得:添加三羥甲基丙烷134重量份、作為聚合抑制劑之BHT 0.2重量份、作為反應觸媒之二月桂酸二丁基錫0.01重量份、及異佛酮二異氰酸酯666重量份,一面於60℃進行回流攪拌一面反應2小時,繼而,添加丙烯酸2-羥基乙酯51重量份,一面吹入空氣而進行回流攪拌一面於90℃反應2小時。 The above-mentioned (meth)acrylic acid amine ester can be obtained, for example, by adding 134 parts by weight of trimethylolpropane, 0.2 parts by weight of BHT as a polymerization inhibitor, and dibutyltin dilaurate as a reaction catalyst. 0.01 parts by weight and 666 parts by weight of isophorone diisocyanate were reacted under reflux at 60 ° C for 2 hours, and then 51 parts by weight of 2-hydroxyethyl acrylate was added thereto, and air was blown while stirring at 90 °. The reaction was carried out at ° C for 2 hours.
作為上述(甲基)丙烯酸胺酯中之市售者,例如可列舉:M-1100、M-1200、M-1210、M-1600(均為東亞合成公司製造)、EBECRYL230、EBECRYL270、EBECRYL4858、EBECRYL8402、EBECRYL8804、EBECRYL8803、EBECRYL8807、EBECRYL9260、EBECRYL1290、EBECRYL5129、EBECRYL4842、EBECRYL210、EBECRYL4827、EBECRYL6700、EBECRYL220、EBECRYL2220(均為Daicel-Allnex公司製造)、Artresin UN-9000H、Artresin UN-9000A、Artresin UN-7100、Artresin UN-1255、Artresin UN-330、Artresin UN-3320HB、Artresin UN-1200TPK、Artresin SH-500B(均為根上工業公司製造)、U-122P、U-108A、U-340P、U-4HA、U-6HA、U-324A、U-15HA、UA-5201P、UA-W2A、U-1084A、U-6LPA、U-2HA、U-2PHA、UA-4100、UA-7100、UA-4200、UA-4400、UA-340P、U-3HA、UA-7200、U-2061BA、U-10H、U-122A、U-340A、U-108、U-6H、UA-4000(均為新中村化學工業公司製造)、AH-600、AT-600、UA-306H、AI-600、UA-101T、UA-101I、UA-306T、UA-306I(均為共榮社化學公司製造)等。 For example, M-1100, M-1200, M-1210, M-1600 (all manufactured by Toagosei Co., Ltd.), EBECRYL230, EBECRYL270, EBECRYL4858, EBECRYL8402 are exemplified as the commercially available (meth) acrylate. ,EBECRYL8804,EBECRYL8803,EBECRYL8807,EBECRYL9260,EBECRYL1290,EBECRYL5129,EBECRYL4842,EBECRYL210,EBECRYL4827,EBECRYL6700,EBECRYL220,EBECRYL2220 (all manufactured by Daicel-Allnex), Artresin UN-9000H, Artresin UN-9000A, Artresin UN-7100, Artresin UN-1255, Artresin UN-330, Artresin UN-3320HB, Artresin UN-1200TPK, Artresin SH-500B (all manufactured by Gensei Industrial Co., Ltd.), U-122P, U-108A, U-340P, U-4HA, U- 6HA, U-324A, U-15HA, UA-5201P, UA-W2A, U-1084A, U-6LPA, U-2HA, U-2PHA, UA-4100, UA-7100, UA-4200, UA-4400, UA-340P, U-3HA, UA-7200, U-2061BA, U-10H, U-122A, U-340A, U-108, U-6H, UA-4000 (all manufactured by Shin-Nakamura Chemical Industry Co., Ltd.), AH-600, AT-600, UA-306H, AI-600, UA-101T, UA-101I, UA-306T, UA-306I (all manufactured by Kyoeisha Chemical Co., Ltd.).
為了提高所獲得之光硬化性樹脂組成物之接著性,上述硬化性樹脂較佳為進而含有環氧樹脂。作為上述環氧樹脂,例如可列舉:用以合成上述環氧(甲基)丙烯酸酯之原料即環氧樹脂、或部分(甲基)丙烯酸改質環氧樹脂等。 In order to improve the adhesion of the obtained photocurable resin composition, the curable resin preferably further contains an epoxy resin. Examples of the epoxy resin include an epoxy resin which is a raw material for synthesizing the above epoxy (meth)acrylate, or a partially modified (meth)acrylic epoxy resin.
再者,於本說明書中,上述所謂部分(甲基)丙烯酸改質環氧樹脂,意指於1分子中分別具有一個以上環氧基與(甲基)丙烯醯基之樹脂,例如可藉由使具有兩個以上環氧基之環氧樹脂之一部分環氧基與(甲基)丙烯酸進行反應而獲得。 In the present specification, the above-mentioned partial (meth)acrylic acid-modified epoxy resin means a resin having one or more epoxy groups and (meth)acrylonitrile groups in one molecule, for example, by It is obtained by reacting a partial epoxy group of one of epoxy resins having two or more epoxy groups with (meth)acrylic acid.
於本發明之光硬化性樹脂組成物含有上述(甲基)丙烯酸系樹脂與上述環氧樹脂之情形時,較佳為以(甲基)丙烯醯氧基與環氧基之比成為50:50~95:5之方式調配上述(甲基)丙烯酸樹脂與上述環氧樹脂。若(甲基)丙烯醯氧基之比率未達50%,則即便聚合結束亦存在大量未硬化之環氧樹脂成分,故而於用於液晶顯示元件用密封劑之情形時有產生液晶污染之情況。若(甲基)丙烯醯氧基之比率超過95%,則有所獲得之光硬化性樹脂組成物接著性較差之情況。 In the case where the photocurable resin composition of the present invention contains the above (meth)acrylic resin and the above epoxy resin, the ratio of (meth)acryloxy group to epoxy group is preferably 50:50. The above (meth)acrylic resin and the above epoxy resin are blended in a manner of ~95:5. When the ratio of the (meth) propylene methoxy group is less than 50%, a large amount of uncured epoxy resin component is present even after the polymerization is completed, so that liquid crystal contamination occurs in the case of use as a sealing agent for a liquid crystal display device. . When the ratio of the (meth)acryloxy group is more than 95%, the obtained photocurable resin composition may be inferior in adhesion.
上述硬化性樹脂就抑制用於液晶顯示元件用密封劑之情形時之液晶污染方面而言,較佳為具有-OH基、-NH-基、-NH2基等氫鍵結性單元者。 In the case of suppressing liquid crystal contamination in the case of using a sealing agent for a liquid crystal display element, the curable resin preferably has a hydrogen bonding unit such as an -OH group, a -NH- group or a -NH 2 group.
本發明之光硬化性樹脂組成物亦可含有熱自由基聚合起始劑。作為上述熱自由基聚合起始劑,例如可列舉由偶氮化合物、有機過氧化物等構成者。其中,較佳為由高分子偶氮化合物構成之起始劑(以下,亦稱為「高分子偶氮起始劑」)。 The photocurable resin composition of the present invention may further contain a thermal radical polymerization initiator. Examples of the thermal radical polymerization initiator include those composed of an azo compound, an organic peroxide, and the like. Among them, a starter composed of a polymer azo compound (hereinafter also referred to as "polymer azo starter") is preferred.
再者,於本說明書中,所謂高分子偶氮起始劑,意指具有偶氮基、生成可藉由熱而使(甲基)丙烯醯氧基硬化之自由基、且數量平均分子量為300以上的化合物。 In the present specification, the term "polymer azo initiator" means a radical having an azo group to form a (meth) propylene oxime group which is hardened by heat, and has a number average molecular weight of 300. The above compounds.
上述高分子偶氮起始劑之數量平均分子量之較佳下限為1000,較佳上限為30萬。若上述高分子偶氮起始劑之數量平均分子量未達1000,則於用於液晶顯示元件用密封劑之情形時有高分子偶氮起始劑對液晶產生不良影響之情況。若上述高分子偶氮起始劑之數量平均分子量超過30萬,則有難以混合於硬化性樹脂中之情況。上述高分子偶氮起始劑之數量平均分子量之更佳下限為5000,更佳上限為10萬,進而較佳之下限為1萬,進而較佳之上限為9萬。 A preferred lower limit of the number average molecular weight of the above polymer azo initiator is 1000, and a preferred upper limit is 300,000. When the number average molecular weight of the above polymer azo initiator is less than 1,000, the polymer azo initiator may adversely affect the liquid crystal when used in a sealing agent for a liquid crystal display device. When the number average molecular weight of the above polymer azo initiator is more than 300,000, it may be difficult to mix it in the curable resin. A lower limit of the number average molecular weight of the above polymer azo initiator is 5,000, a higher limit is 100,000, and a preferred lower limit is 10,000, and a preferred upper limit is 90,000.
作為上述高分子偶氮起始劑,例如可列舉具有下述結構者:複數個聚環氧烷或聚二甲基矽氧烷等單元經由偶氮基鍵結而成之結構。 Examples of the polymer azo initiator include those having a structure in which a plurality of units such as polyalkylene oxide or polydimethyl siloxane are bonded via an azo group.
作為上述具有複數個聚環氧烷等單元經由偶氮基鍵結而成之結構的高分子偶氮起始劑,較佳為具有聚環氧乙烷結構者。作為此種高分子偶氮起始劑,例如可列舉:4,4'-偶氮雙(4-氰基戊酸)與聚伸烷基二醇之縮聚合物、或4,4'-偶氮雙(4-氰基戊酸)與末端具有胺基之聚二甲基矽氧烷之縮聚合物等,具體而言,例如可列舉:VPE-0201、VPE-4401、VPE-0601、VPS-0501、VPS-1001(均為和光純藥工業公司製造)等。 The polymer azo initiator having a structure in which a plurality of units such as polyalkylene oxide are bonded via an azo group is preferably a polyethylene oxide structure. Examples of such a polymer azo initiator include a condensed polymer of 4,4'-azobis(4-cyanovaleric acid) and a polyalkylene glycol, or a 4,4'-couple. A condensed polymer of nitrogen bis(4-cyanovaleric acid) and polydimethyl methoxy oxane having an amine group at the terminal, and specific examples thereof include VPE-0201, VPE-4401, VPE-0601, and VPS. -0501, VPS-1001 (all manufactured by Wako Pure Chemical Industries, Ltd.) and the like.
又,作為並非高分子之偶氮化合物,例如可列舉:V-65、V-501(均為和光純藥工業公司製造)等。 In addition, examples of the azo compound which is not a polymer include V-65 and V-501 (all manufactured by Wako Pure Chemical Industries, Ltd.).
作為上述有機過氧化物,例如可列舉:過氧化酮、過氧縮 酮、過氧化氫、過氧化二烷基、過氧酯、過氧化二醯基、過氧化二碳酸酯等。 Examples of the organic peroxide include ketone peroxide and peroxy condensate. Ketone, hydrogen peroxide, dialkyl peroxide, peroxyester, dinonyl peroxide, peroxydicarbonate, and the like.
上述熱自由基聚合起始劑之含量係相對於硬化性樹脂100重量份較佳之下限為0.1重量份,較佳之上限為30重量份。若上述熱自由基聚合起始劑之含量未達0.1重量份,則有所獲得之光硬化性樹脂組成物之熱聚合未充分進行之情況。若上述熱自由基聚合起始劑之含量超過30重量份,則在用於液晶顯示元件用密封劑時會有因未反應之熱自由基聚合起始劑而產生液晶污染之情況。上述熱自由基聚合起始劑之含量之更佳下限為0.5重量份,更佳上限為10重量份。 The content of the above-mentioned thermal radical polymerization initiator is preferably 0.1 part by weight, and preferably 30 parts by weight, based on 100 parts by weight of the curable resin. When the content of the above-mentioned thermal radical polymerization initiator is less than 0.1 part by weight, the thermal polymerization of the obtained photocurable resin composition may not sufficiently proceed. When the content of the thermal radical polymerization initiator is more than 30 parts by weight, liquid crystal contamination may occur due to an unreacted thermal radical polymerization initiator in the case of a sealant for a liquid crystal display device. A more preferred lower limit of the content of the above thermal radical polymerization initiator is 0.5 part by weight, and a still more preferred upper limit is 10 parts by weight.
本發明之光硬化性樹脂組成物亦可含有熱硬化劑。 The photocurable resin composition of the present invention may further contain a thermosetting agent.
作為上述熱硬化劑,例如可列舉:有機酸醯肼(organic acid hydrazide)、咪唑衍生物、胺化合物、多元酚系化合物、酸酐等。其中,可較佳地使用有機酸醯肼。 Examples of the above-mentioned thermosetting agent include organic acid hydrazide, an imidazole derivative, an amine compound, a polyhydric phenol compound, and an acid anhydride. Among them, organic acid hydrazine can be preferably used.
作為上述有機酸醯肼,例如可列舉:癸二酸醯肼、間苯二甲酸醯肼、己二酸醯肼、丙二酸醯肼等。 Examples of the organic acid cerium include cerium azelate, bismuth isophthalate, bismuth adipate, and strontium malonate.
作為上述有機酸醯肼中之市售者,例如可列舉:SDH、ADH(均為大塚化學公司製造)、Amicure VDH、Amicure VDH-J、Amicure UDH(均為Ajinomoto Fine-Techno公司製造)等。 For example, SDH, ADH (all manufactured by Otsuka Chemical Co., Ltd.), Amicure VDH, Amicure VDH-J, and Amicure UDH (all manufactured by Ajinomoto Fine-Techno Co., Ltd.) may be mentioned.
上述熱硬化劑之含量係相對於上述硬化性樹脂100重量份較佳之下限為1重量份,較佳之上限為50重量份。若上述熱硬化劑之含量未達1重量份,則有無法使所獲得之光硬化性樹脂組成物充分熱硬化之情況。若上述熱硬化劑之含量超過50重量份,則有所獲得之光硬化性樹 脂組成物之黏度變得過高而塗佈性變差之情況。上述熱硬化劑之含量之更佳上限為30重量份。 The content of the above-mentioned thermosetting agent is preferably 1 part by weight, and preferably 50 parts by weight, based on 100 parts by weight of the curable resin. When the content of the above-mentioned thermosetting agent is less than 1 part by weight, the obtained photocurable resin composition may not be sufficiently thermally cured. If the content of the above thermal hardener exceeds 50 parts by weight, the obtained photohardenability tree The viscosity of the fat composition becomes too high and the coatability deteriorates. A more preferable upper limit of the content of the above thermal curing agent is 30 parts by weight.
為了提高黏度、藉由應力分散效果改善接著性、改善線膨脹率、提高硬化物之耐濕性等,本發明之光硬化性樹脂組成物較佳為含有填充劑。 The photocurable resin composition of the present invention preferably contains a filler in order to improve the viscosity, improve the adhesion by the stress dispersion effect, improve the linear expansion ratio, and improve the moisture resistance of the cured product.
作為上述填充劑,例如可列舉:滑石、石棉、矽土、矽藻土、膨潤石、膨潤土、碳酸鈣、碳酸鎂、氧化鋁、蒙脫石、氧化鋅、氧化鐵、氧化鎂、氧化錫、氧化鈦、氫氧化鎂、氫氧化鋁、玻璃珠、氮化矽、硫酸鋇、石膏、矽酸鈣、絹雲母、活性白土、氮化鋁等無機填充劑,或聚酯微粒子、聚胺酯微粒子、乙烯基聚合物微粒子、丙烯酸系聚合物微粒子等有機填充劑。該等填充劑可單獨使用,亦可併用兩種以上。 Examples of the filler include talc, asbestos, alumina, diatomaceous earth, bentonite, bentonite, calcium carbonate, magnesium carbonate, alumina, montmorillonite, zinc oxide, iron oxide, magnesium oxide, and tin oxide. Inorganic fillers such as titanium oxide, magnesium hydroxide, aluminum hydroxide, glass beads, tantalum nitride, barium sulfate, gypsum, calcium silicate, sericite, activated clay, aluminum nitride, or polyester microparticles, polyurethane microparticles, ethylene An organic filler such as a base polymer fine particle or an acrylic polymer fine particle. These fillers may be used singly or in combination of two or more.
本發明之光硬化性樹脂組成物100重量份中上述填充劑之含量的較佳下限為10重量份,較佳上限為70重量份。若上述填充劑之含量未達10重量份,則有無法充分發揮改善接著性等效果之情況。若上述填充劑之含量超過70重量份,則有所獲得之光硬化性樹脂組成物之黏度過度升高而塗佈性變差之情況。上述填充劑之含量之更佳下限為20重量份,更佳上限為60重量份。 A preferred lower limit of the content of the above filler in 100 parts by weight of the photocurable resin composition of the present invention is 10 parts by weight, and a preferred upper limit is 70 parts by weight. When the content of the filler is less than 10 parts by weight, the effect of improving the adhesion or the like may not be sufficiently exhibited. When the content of the filler exceeds 70 parts by weight, the viscosity of the obtained photocurable resin composition is excessively increased and the coatability is deteriorated. A more preferred lower limit of the content of the above filler is 20 parts by weight, and a still more preferred upper limit is 60 parts by weight.
本發明之光硬化性樹脂組成物較佳為含有矽烷偶合劑。上述矽烷偶合劑主要具有作為用以使本發明之光硬化性樹脂組成物與基板等良好地接著的接著助劑之作用。 The photocurable resin composition of the present invention preferably contains a decane coupling agent. The decane coupling agent mainly functions as a secondary auxiliary agent for allowing the photocurable resin composition of the present invention to adhere well to a substrate or the like.
作為上述矽烷偶合劑,就提高與基板等之接著性的效果優異、抑制用作液晶顯示元件用密封劑之情形時硬化性樹脂流出至液晶中之 觀點而言,例如可較佳地使用:3-胺基丙基三甲氧基矽烷、3-巰基丙基三甲氧基矽烷、3-縮水甘油氧基丙基三甲氧基矽烷、3-異氰酸酯基丙基三甲氧基矽烷等。該等矽烷偶合劑可單獨使用,亦可併用兩種以上。 The decane coupling agent is excellent in the effect of improving the adhesion to a substrate or the like, and the curable resin is discharged into the liquid crystal when it is used as a sealing agent for a liquid crystal display element. From the viewpoint, for example, 3-aminopropyltrimethoxydecane, 3-mercaptopropyltrimethoxydecane, 3-glycidoxypropyltrimethoxydecane, 3-isocyanatepropylpropane can be preferably used. Trimethoxy decane and the like. These decane coupling agents may be used singly or in combination of two or more.
本發明之光硬化性樹脂組成物100重量份中上述矽烷偶合劑之含量之較佳下限為0.1重量份,較佳上限為20重量份。若上述矽烷偶合劑之含量未達0.1重量份,則有無法充分發揮藉由調配矽烷偶合劑而獲得之效果之情況。若上述矽烷偶合劑之含量超過20重量份,則於將所獲得之光硬化性樹脂組成物用於液晶顯示元件用密封劑之情形時有引起液晶污染之情況。上述矽烷偶合劑之含量之更佳下限為0.5重量份,更佳上限為10重量份。 A preferred lower limit of the content of the above decane coupling agent in 100 parts by weight of the photocurable resin composition of the present invention is 0.1 part by weight, and a preferred upper limit is 20 parts by weight. When the content of the above decane coupling agent is less than 0.1 part by weight, the effect obtained by blending a decane coupling agent may not be sufficiently exhibited. When the content of the above-mentioned decane coupling agent exceeds 20 parts by weight, liquid crystal contamination may occur when the obtained photocurable resin composition is used for a sealing agent for a liquid crystal display element. A more preferred lower limit of the content of the above decane coupling agent is 0.5 part by weight, and a more preferred upper limit is 10 parts by weight.
本發明之光硬化性樹脂組成物亦可含有遮光劑。藉由含有上述遮光劑,而本發明之光硬化性樹脂組成物可較佳地用作遮光密封劑。 The photocurable resin composition of the present invention may further contain an opacifier. The photocurable resin composition of the present invention can be preferably used as a light-shielding sealant by containing the above-mentioned opacifier.
作為上述遮光劑,例如可列舉:氧化鐵、鈦黑、苯胺黑、花青黑、富勒烯、碳黑、樹脂被覆型碳黑等。其中,較佳為鈦黑。 Examples of the light shielding agent include iron oxide, titanium black, aniline black, cyanine black, fullerene, carbon black, and resin-coated carbon black. Among them, titanium black is preferred.
上述鈦黑為如下之物質:與對波長300~800nm之光之平均透過率相比,對紫外線區域附近、尤其是波長370~450nm之光之透過率會增高的物質。即,上述鈦黑係藉由充分遮蔽可見光區域之波長之光而對本發明之光硬化性樹脂組成物賦予遮光性,另一方面,具有使紫外線區域附近之波長之光透過的性質者。作為含有於本發明之光硬化性樹脂組成物之遮光劑,較佳為絕緣性較高之物質,作為絕緣性較高之遮光劑,亦較佳為鈦黑。 The titanium black is a substance which has a higher transmittance to light in the vicinity of the ultraviolet region, particularly at a wavelength of 370 to 450 nm, as compared with the average transmittance of light having a wavelength of 300 to 800 nm. In other words, the titanium black is provided with a light-shielding property of the photocurable resin composition of the present invention by sufficiently shielding light of a wavelength in the visible light region, and has a property of transmitting light of a wavelength near the ultraviolet region. The light-shielding agent contained in the photocurable resin composition of the present invention is preferably a material having high insulating properties, and is preferably a titanium black as a light-shielding agent having high insulating properties.
上述鈦黑係每1μm之光學密度(OD值)較佳為3以上,更佳為4 以上。上述鈦黑之遮光性越高越佳,上述鈦黑之OD值並不特別有較佳之上限,通常為5以下。 The optical density (OD value) per 1 μm of the titanium black system is preferably 3 or more, more preferably 4 the above. The higher the light blocking property of the titanium black, the better, and the OD value of the titanium black is not particularly preferably an upper limit, and is usually 5 or less.
上述鈦黑即便為未經表面處理者,亦發揮充分之效果,但亦可使用下述之經表面處理之鈦黑:表面經偶合劑等有機成分處理者、或被氧化矽、氧化鈦、氧化鍺、氧化鋁、氧化鋯、氧化鎂等無機成分所被覆者等。其中,經有機成分處理者就可進一步提高絕緣性方面而言,較佳。 The above-mentioned titanium black exhibits sufficient effects even if it is not surface-treated, but the following surface-treated titanium black may be used: the surface is treated with an organic component such as a coupling agent, or is oxidized by cerium oxide, titanium oxide, or oxidized. A coating of inorganic components such as cerium, alumina, zirconia or magnesia. Among them, it is preferable that the organic component treatment can further improve the insulation property.
又,將含有上述鈦黑作為遮光劑之本發明之光硬化性樹脂組成物用作液晶顯示元件用密封劑所製造的液晶顯示元件具有充分之遮光性,故而可實現並無光之漏出而具有較高之對比度、且具有優異之圖像顯示品質的液晶顯示元件。 In addition, the liquid crystal display element produced by using the photocurable resin composition of the present invention containing the titanium black as a light-shielding agent as a sealing agent for a liquid crystal display element has sufficient light-shielding property, so that it can be realized without leakage of light. A liquid crystal display element with high contrast and excellent image display quality.
作為上述鈦黑中之市售者,例如可列舉:12S、13M、13M-C、13R-N、14M-C(均為Mitsubishi Materials公司製造)、Tilack D(Ako-Kasei公司製造)等。 The commercially available ones of the titanium blacks include, for example, 12S, 13M, 13M-C, 13R-N, and 14M-C (all manufactured by Mitsubishi Materials Co., Ltd.) and Tilack D (manufactured by Ako-Kasei Co., Ltd.).
上述鈦黑之比表面積之較佳下限為13m2/g,較佳上限為30m2/g,更佳下限為15m2/g,更佳上限為25m2/g。 A preferred lower limit of the specific surface area of the above titanium black is 13 m 2 /g, a preferred upper limit is 30 m 2 /g, a more preferred lower limit is 15 m 2 /g, and a more preferred upper limit is 25 m 2 /g.
又,上述鈦黑之體積電阻之較佳下限為0.5Ω‧cm,較佳上限為3Ω‧cm,更佳下限為1Ω‧cm,更佳上限為2.5Ω‧cm。 Further, the preferred lower limit of the volume resistance of the titanium black is 0.5 Ω ‧ cm, the upper limit is preferably 3 Ω ‧ cm, the lower limit is preferably 1 Ω ‧ cm, and the upper limit is more preferably 2.5 Ω ‧ cm
上述遮光劑之一次粒徑只要為液晶顯示元件等之基板間之距離以下,則並無特別限定,較佳之下限為1nm,較佳之上限為5μm。若上述遮光劑之一次粒徑未達1nm,則有所獲得之光硬化性樹脂組成物之黏度或搖變性大幅增大而作業性變差之情況。若上述遮光劑之一次粒徑超過5μm,則有所獲得之光硬化性樹脂組成物之塗佈性變差之情況。上述 遮光劑之一次粒徑之更佳下限為5nm,更佳上限為200nm,進而較佳之下限為10nm,進而較佳之上限為100nm。 The primary particle diameter of the light-shielding agent is not particularly limited as long as it is equal to or less than the distance between the substrates of the liquid crystal display element or the like, and a preferred lower limit is 1 nm, and a preferred upper limit is 5 μm. When the primary particle diameter of the light-shielding agent is less than 1 nm, the viscosity or the shakeability of the obtained photocurable resin composition is greatly increased, and the workability is deteriorated. When the primary particle diameter of the light-shielding agent exceeds 5 μm, the coatability of the obtained photocurable resin composition may be deteriorated. Above A lower limit of the primary particle diameter of the opacifier is 5 nm, a more preferred upper limit is 200 nm, and a further preferred lower limit is 10 nm, and further preferably, the upper limit is 100 nm.
本發明之光硬化性樹脂組成物100重量份中上述遮光劑之含量之較佳下限為5重量份,較佳上限為80重量份。若上述遮光劑之含量未達5重量份,則有無法獲得充分之遮光性之情況。若上述遮光劑之含量超過80重量份,則有所獲得之光硬化性樹脂組成物對基板之密合性或硬化後之強度下降、或描繪性下降之情況。上述遮光劑之含量之更佳下限為10重量份,更佳上限為70重量份,進而較佳之下限為30重量份,進而較佳之上限為60重量份。 A preferred lower limit of the content of the above-mentioned sunscreen agent in 100 parts by weight of the photocurable resin composition of the present invention is 5 parts by weight, and a preferred upper limit is 80 parts by weight. If the content of the above-mentioned sunscreen agent is less than 5 parts by weight, sufficient light-shielding properties may not be obtained. When the content of the light-shielding agent is more than 80 parts by weight, the adhesion of the obtained photocurable resin composition to the substrate or the strength after curing may be lowered or the drawability may be lowered. A more preferred lower limit of the content of the above-mentioned opacifier is 10 parts by weight, more preferably 70 parts by weight, still more preferably 30 parts by weight, and still more preferably 60 parts by weight.
作為製造本發明之光硬化性樹脂組成物之方法,例如可列舉:使用勻相分散機、均質攪拌機、萬能攪拌機、行星式混合機、捏合機、三輥研磨機等混合機,將硬化性樹脂、本發明之聚合性單體及/或本發明之高分子化合物、及視需要添加之其他光聚合起始劑或其他增感劑或矽烷偶合劑等添加劑進行混合之方法等。 The method for producing the photocurable resin composition of the present invention includes, for example, a homogenizer, a homomixer, a universal mixer, a planetary mixer, a kneader, a three-roll mill, and the like, and a curable resin. A method of mixing a polymerizable monomer of the present invention and/or a polymer compound of the present invention, and optionally a photopolymerization initiator or other sensitizer or a decane coupling agent.
本發明之光硬化性樹脂組成物可較佳地用作液晶顯示元件用密封劑。 The photocurable resin composition of the present invention can be preferably used as a sealant for liquid crystal display elements.
使用本發明之光硬化性樹脂組成物而成之液晶顯示元件用密封劑亦係本發明之一。 The sealing agent for liquid crystal display elements which used the photocurable resin composition of this invention is also one of this invention.
藉由在本發明之液晶顯示元件用密封劑中調配導電性微粒子,可製作上下導通材料。此種含有本發明之液晶顯示元件用密封劑與導電性微粒子之上下導通材料亦係本發明之一。 By disposing the conductive fine particles in the sealing agent for liquid crystal display elements of the present invention, the upper and lower conductive materials can be produced. Such a sealing agent for a liquid crystal display element of the present invention and a conductive fine particle upper and lower conductive material are also one of the present inventions.
作為上述導電性微粒子,可使用於金屬球、樹脂微粒子之 表面形成有導電金屬層者等。其中,於樹脂微粒子之表面形成有導電金屬層者可藉由樹脂微粒子之優異彈性而不損傷透明基板等而進行導電連接,故而較佳。 The conductive fine particles can be used for metal balls or resin fine particles. A surface having a conductive metal layer formed thereon. Among them, a conductive metal layer formed on the surface of the resin fine particles can be electrically connected by the excellent elasticity of the resin fine particles without damaging the transparent substrate or the like, which is preferable.
使用本發明之液晶顯示元件用密封劑或本發明之上下導通材料所製造之液晶顯示元件亦係本發明之一。 The liquid crystal display element produced by using the sealing agent for liquid crystal display elements of the present invention or the underlying conductive material of the present invention is also one of the present inventions.
作為製造本發明之液晶顯示元件之方法,例如可列舉具有如下步驟之方法:於附有ITO薄膜等電極之玻璃基板或聚對苯二甲酸乙二酯基板等兩片透明基板之一者,藉由網版印刷、分注器塗佈等而將本發明之液晶顯示元件用密封劑等形成長方形之密封圖案的步驟;於本發明之液晶顯示元件用密封劑等為未硬化之狀態將液晶之微滴滴加塗佈於透明基板之框內整個面,並立即將另一基板重疊之步驟;及對本發明之液晶顯示元件用密封劑等之密封圖案部分照射紫外線等光而使密封劑暫時硬化之步驟;及對經暫時硬化之密封劑進行加熱而使其正式硬化之步驟。 As a method of producing the liquid crystal display element of the present invention, for example, a method in which one of two transparent substrates such as a glass substrate or a polyethylene terephthalate substrate having an electrode such as an ITO film is used is used. a step of forming a rectangular seal pattern by a sealant or the like for a liquid crystal display element of the present invention by screen printing, dispenser application, or the like; and a liquid crystal display in a state in which an encapsulant for a liquid crystal display element of the present invention is uncured. The step of applying the entire surface of the transparent substrate to the surface of the transparent substrate and immediately superposing the other substrate; and irradiating the portion of the sealing pattern of the sealing agent for a liquid crystal display element of the present invention with ultraviolet light or the like to temporarily harden the sealing agent. And a step of heating the temporarily hardened sealant to form a hardening process.
根據本發明,可提供一種對液晶之污染性低、對長波長之光為高感度且增感效果亦優異之聚合性單體、及使該聚合性單體聚合所獲得之高分子化合物。又,根據本發明,可提供含有該聚合性單體及/或該高分子化合物之光硬化性樹脂組成物、使用該光硬化性樹脂組成物而成之液晶顯示元件用密封劑、及使用該液晶顯示元件用密封劑所製造之上下導通材料及液晶顯示元件。 According to the present invention, it is possible to provide a polymerizable monomer which is low in contamination to liquid crystal, has high sensitivity to long-wavelength light, and is excellent in sensitizing effect, and a polymer compound obtained by polymerizing the polymerizable monomer. Moreover, according to the present invention, a photocurable resin composition containing the polymerizable monomer and/or the polymer compound, a sealing agent for a liquid crystal display element using the photocurable resin composition, and the like can be provided. The upper and lower conductive materials and the liquid crystal display element are used for the liquid crystal display element sealing agent.
1‧‧‧密封劑 1‧‧‧Sealant
2‧‧‧黑色矩陣 2‧‧‧Black matrix
3‧‧‧液晶 3‧‧‧LCD
圖1係示意性地表示使用實施例及比較例中所獲得之各液晶顯示元件用密封劑以無遮光部之狀態所製作之液晶顯示元件的剖面圖。 1 is a cross-sectional view schematically showing a liquid crystal display element produced by using each of the sealing agents for liquid crystal display elements obtained in the examples and the comparative examples in a state in which no light shielding portion is provided.
圖2係示意性地表示使用實施例及比較例中所獲得之各液晶顯示元件用密封劑以有遮光部之狀態所製作之液晶顯示元件的剖面圖。 2 is a cross-sectional view schematically showing a liquid crystal display element produced by using a sealing agent for liquid crystal display elements obtained in the examples and the comparative examples in a state in which a light shielding portion is provided.
以下,列舉實施例更詳細地說明本發明,但本發明並不僅限於該等實施例。 Hereinafter, the present invention will be described in more detail by way of examples, but the invention is not limited to the examples.
(聚合性單體A之製作) (Production of Polymerizable Monomer A)
將式(2-1)所表示之化合物16.5重量份、及式(6-1)所表示之R1為氫之化合物6.4重量份,於作為鹼性觸媒之PS-PPH3(Biotage Japan公司製造,於聚苯乙烯(PS)載持有三苯基膦之鹼性觸媒)0.7重量份之存在下,一面於110℃下攪拌48小時一面進行反應,藉此獲得式(7-1)所表示之R1為氫之化合物(聚合性單體A)。 16.5 parts by weight of the compound represented by the formula (2-1) and 6.4 parts by weight of the compound represented by the formula (6-1) wherein R 1 is hydrogen, in the PS-PPH3 (Biotage Japan Co., Ltd.) as an alkaline catalyst The reaction was carried out while stirring at 110 ° C for 48 hours in the presence of 0.7 part by weight of a basic catalyst containing triphenylphosphine supported on polystyrene (PS), thereby obtaining a formula (7-1). A compound (polymerizable monomer A) in which R 1 is hydrogen.
再者,式(2-1)所表示之化合物與式(6-1)所表示之R1為氫之化合物之調配比率以莫耳比計,為式(2-1)所表示之化合物:式(6-1)所表示之R1為氫之化合物=2:1。 Further, the compounding ratio of the compound represented by the formula (2-1) and the compound represented by the formula (6-1) wherein R 1 is hydrogen is a compound represented by the formula (2-1) in terms of a molar ratio: The compound represented by the formula (6-1) wherein R 1 is hydrogen = 2:1.
(高分子化合物A之製作) (Production of Polymer Compound A)
將所獲得之聚合性單體A 10重量份於作為聚合起始劑之偶氮雙異丁腈0.5重量份之存在下,一面進行氮氣置換一面於70℃下攪拌7小時而使其反應,藉此獲得高分子化合物A。所獲得之高分子化合物A之數量平均分子量為14200(聚合度50)。 In the presence of 10 parts by weight of the obtained polymerizable monomer A in an amount of 0.5 part by weight of azobisisobutyronitrile as a polymerization initiator, the mixture was stirred at 70 ° C for 7 hours while reacting with nitrogen to cause a reaction. This gave the polymer compound A. The obtained polymer compound A had a number average molecular weight of 14,200 (degree of polymerization 50).
(聚合性單體B之製作) (Production of Polymerizable Monomer B)
將式(2-2)所表示之化合物16.5重量份、及式(6-1)所表示之R1為氫之化合物5.5重量份,於作為鹼性觸媒之PS-PPH3(Biotage Japan公司製造,於聚苯乙烯(PS)載持有三苯基膦之鹼性觸媒)0.7重量份之存在下,一面於110℃下攪拌48小時一面進行反應,藉此獲得式(7-2)所表示之R1為氫之化合物(聚合性單體B)。 16.5 parts by weight of the compound represented by the formula (2-2) and 5.5 parts by weight of the compound represented by the formula (6-1) wherein R 1 is hydrogen, in the PS-PPH3 (Biotage Japan Co., Ltd.) as an alkaline catalyst The reaction was carried out while stirring at 110 ° C for 48 hours in the presence of 0.7 part by weight of a basic catalyst containing triphenylphosphine supported on polystyrene (PS), thereby obtaining the formula (7-2). A compound (polymerizable monomer B) in which R 1 is hydrogen.
再者,式(2-2)所表示之化合物與式(6-1)所表示之R1為氫之化合物之調配比率以莫耳比計,為式(2-2)所表示之化合物:式(6-1)所表示之R1為氫之化合物=85.3:42.9。 Further, the compounding ratio of the compound represented by the formula (2-2) and the compound represented by the formula (6-1) wherein R 1 is hydrogen is a compound represented by the formula (2-2) in terms of a molar ratio: The compound represented by the formula (6-1) wherein R 1 is hydrogen = 85.3: 42.9.
(高分子化合物B之製作) (Production of Polymer Compound B)
將所獲得之聚合性單體B10重量份於作為聚合起始劑之偶氮雙異丁腈0.5重量份之存在下,一面進行氮氣置換一面於70℃下攪拌7小時而使其反應,藉此獲得高分子化合物B。所獲得之高分子化合物B之數量平均分子量為12900(聚合度40)。 In the presence of 0.5 part by weight of the azobisisobutyronitrile as a polymerization initiator, the obtained polymerizable monomer B was stirred at 70 ° C for 7 hours in the presence of 0.5 part by weight of azobisisobutyronitrile. The polymer compound B was obtained. The obtained polymer compound B had a number average molecular weight of 12,900 (degree of polymerization 40).
(聚合性單體C之製作) (Production of Polymerizable Monomer C)
將式(2-3)所表示之化合物16.5重量份、及式(6-1)所表示之R1為氫之化合物4.1重量份於作為鹼性觸媒之PS-PPH3(Biotage Japan公司製造,於聚苯乙烯(PS)載持有三苯基膦之鹼性觸媒)0.7重量份之存在下,一面於110℃下攪拌48小時一面進行反應,藉此獲得式(7-3)所表示之R1為氫之化合物(聚合性單體C)。 16.5 parts by weight of the compound represented by the formula (2-3) and 4.1 parts by weight of the compound represented by the formula (6-1) wherein R 1 is hydrogen, PS-PPH3 (Biotage Japan Co., Ltd.) as an alkaline catalyst. The reaction was carried out while stirring at 110 ° C for 48 hours in the presence of 0.7 part by weight of a polystyrene (PS)-supported basic catalyst of triphenylphosphine, thereby obtaining the formula (7-3). R 1 is a compound of hydrogen (polymerizable monomer C).
再者,式(2-3)所表示之化合物與式(6-1)所表示之R1為氫之化合物之調配比率以莫耳比計,為式(2-3)所表示之化合物:式(6-1) 所表示之R1為氫之化合物=63.2:32.0。 Further, the compounding ratio of the compound represented by the formula (2-3) and the compound represented by the formula (6-1) wherein R 1 is hydrogen is a compound represented by the formula (2-3) in terms of a molar ratio: The compound represented by the formula (6-1) wherein R 1 is hydrogen = 63.2: 32.0.
(高分子化合物C之製作) (Production of Polymer Compound C)
將所獲得之聚合性單體C 10重量份於作為聚合起始劑之偶氮雙異丁腈0.5重量份之存在下,一面進行氮氣置換一面於70℃下攪拌7小時而使其反應,藉此獲得高分子化合物C。所獲得之高分子化合物C之數量平均分子量為10200(聚合度26)。 In the presence of 10 parts by weight of the obtained polymerizable monomer C in an amount of 0.5 part by weight of azobisisobutyronitrile as a polymerization initiator, the mixture was stirred at 70 ° C for 7 hours while reacting with nitrogen to cause a reaction. This gave the polymer compound C. The obtained polymer compound C had a number average molecular weight of 10,200 (degree of polymerization 26).
(聚合性單體D之製作) (Production of polymerizable monomer D)
將式(2-1)所表示之化合物16.5重量份、及式(6-2)所表示之全部R2為甲氧基之化合物11.8重量份,於作為鹼性觸媒之PS-PPH3(Biotage Japan公司製造,於聚苯乙烯(PS)載持有三苯基膦之鹼性觸媒)0.7重量份之存在下,一面於110℃下攪拌48小時一面進行反應,藉此獲得式(7-4)所表示之化合物(聚合性單體D)。 16.5 parts by weight of the compound represented by the formula (2-1) and 11.8 parts by weight of the compound represented by the formula (6-2) in which all of R 2 is a methoxy group, and PS-PPH3 (Biotage) as a basic catalyst The reaction was carried out by stirring at a temperature of 110 ° C for 48 hours in the presence of 0.7 parts by weight of a basic catalyst containing triphenylphosphine supported on polystyrene (PS), to obtain a formula (7- 4) A compound (polymerizable monomer D) represented.
再者,式(2-1)所表示之化合物與式(6-2)所表示之全部R2為甲氧基之化合物之調配比率以莫耳比計,為式(2-1)所表示之化合物:式(6-2)所表示之全部R2為甲氧基之化合物=2:1。 Further, the compounding ratio of the compound represented by the formula (2-1) and the compound in which all R 2 represented by the formula (6-2) is a methoxy group is expressed by the formula (2-1) in terms of a molar ratio. The compound represented by the formula (6-2) wherein all R 2 is a methoxy group = 2:1.
(高分子化合物D之製作) (Production of Polymer Compound D)
將所獲得之聚合性單體D 10重量份於作為聚合起始劑之偶氮雙異丁腈0.5重量份之存在下,一面進行氮氣置換一面於70℃下攪拌7小時而使其反應,藉此獲得高分子化合物D。所獲得之高分子化合物D之數量平均分子量為8900(聚合度22)。 In the presence of 10 parts by weight of the obtained polymerizable monomer D in an amount of 0.5 part by weight of azobisisobutyronitrile as a polymerization initiator, the mixture was stirred at 70 ° C for 7 hours while reacting with nitrogen to cause a reaction. This gave the polymer compound D. The number average molecular weight of the obtained polymer compound D was 8,900 (degree of polymerization 22).
(聚合性單體E之製作) (Production of polymerizable monomer E)
將式(5-1)所表示之化合物16.5重量份、及式(6-1)所表示之R1 為氫之化合物3.7重量份,於作為鹼性觸媒之PS-PPH3(Biotage Japan公司製造,於聚苯乙烯(PS)載持有三苯基膦之鹼性觸媒)0.7重量份之存在下,一面於110℃下攪拌48小時一面進行反應,藉此獲得式(8-1)所表示之R1為氫之化合物(聚合性單體E)。 16.5 parts by weight of the compound represented by the formula (5-1) and 3.7 parts by weight of the compound represented by the formula (6-1), wherein R 1 is hydrogen, in the PS-PPH3 (Biotage Japan Co., Ltd.) as an alkaline catalyst The reaction was carried out while stirring at 110 ° C for 48 hours in the presence of 0.7 part by weight of a basic catalyst containing triphenylphosphine supported on polystyrene (PS), thereby obtaining the formula (8-1). A compound (polymerizable monomer E) in which R 1 is hydrogen.
再者,式(5-1)所表示之化合物與式(6-1)所表示之R1為氫之化合物之調配比率以莫耳比計,為式(5-1)所表示之化合物:式(6-1)所表示之R1為氫之化合物=57.63:28.9。 Further, the compounding ratio of the compound represented by the formula (5-1) and the compound represented by the formula (6-1) wherein R 1 is hydrogen is a compound represented by the formula (5-1) in terms of a molar ratio: The compound represented by the formula (6-1) wherein R 1 is hydrogen = 57.63: 28.9.
(高分子化合物E之製作) (Production of Polymer Compound E)
將所獲得之聚合性單體E 10重量份於乙醇20.0g、水0.5g、及作為酸觸媒之6N-鹽酸0.6重量份之存在下,一面進行氮氣流動一面於70℃下攪拌4小時而使其反應,藉此獲得高分子化合物E。所獲得之高分子化合物E之數量平均分子量為15200(聚合度37)。 10 parts by weight of the polymerizable monomer E obtained was stirred at 70 ° C for 4 hours while flowing nitrogen gas in the presence of 20.0 g of ethanol, 0.5 g of water, and 0.6 parts by weight of 6N-hydrochloric acid as an acid catalyst. This was allowed to react, whereby a polymer compound E was obtained. The number average molecular weight of the obtained polymer compound E was 15,200 (degree of polymerization 37).
(聚合性單體F之製作) (Production of polymerizable monomer F)
將式(5-2)所表示之化合物16.5重量份、及式(6-1)所表示之R1為氫之化合物4.7重量份,於作為鹼性觸媒之PS-PPH3(Biotage Japan公司製造,於聚苯乙烯(PS)載持有三苯基膦之鹼性觸媒)0.7重量份之存在下,一面於110℃下攪拌48小時一面進行反應,藉此獲得式(8-2)所表示之R1為氫之化合物(聚合性單體F)。 16.5 parts by weight of the compound represented by the formula (5-2) and 4.7 parts by weight of the compound represented by the formula (6-1) wherein R 1 is hydrogen, in the PS-PPH3 (Biotage Japan Co., Ltd.) as an alkaline catalyst The reaction was carried out while stirring at 110 ° C for 48 hours in the presence of 0.7 part by weight of a basic catalyst containing triphenylphosphine supported on polystyrene (PS), thereby obtaining the formula (8-2). A compound (polymerizable monomer F) in which R 1 is hydrogen.
再者,式(5-2)所表示之化合物與式(6-1)所表示之R1為氫之化合物之調配比率以莫耳比計,為式(5-2)所表示之化合物:式(6-1)所表示之R1為氫之化合物=72.3:36.7。 Further, the compounding ratio of the compound represented by the formula (5-2) and the compound represented by the formula (6-1) wherein R 1 is hydrogen is a compound represented by the formula (5-2) in terms of a molar ratio: The compound represented by the formula (6-1) wherein R 1 is hydrogen = 72.3: 36.7.
(高分子化合物F之製作) (Production of Polymer Compound F)
將所獲得之聚合性單體F 10重量份於乙醇20.0g、水0.5g、及作為酸觸媒之6N-鹽酸0.6重量份之存在下,一面進行氮氣流動一面於70℃下攪拌4小時而使其反應,藉此獲得高分子化合物F。所獲得之高分子化合物F之數量平均分子量為16500(聚合度46)。 10 parts by weight of the polymerizable monomer F obtained was stirred at 70 ° C for 4 hours while flowing nitrogen gas in the presence of 20.0 g of ethanol, 0.5 g of water, and 0.6 parts by weight of 6N-hydrochloric acid as an acid catalyst. This is allowed to react, whereby the polymer compound F is obtained. The number average molecular weight of the obtained polymer compound F was 16,500 (degree of polymerization 46).
(聚合性單體G之製作) (Production of polymerizable monomer G)
將式(5-1)所表示之化合物16.5重量份、及式(6-2)所表示之全部R2為甲氧基之化合物6.8重量份,於作為鹼性觸媒之PS-PPH3(Biotage Japan公司製造,於聚苯乙烯(PS)載持有三苯基膦之鹼性觸媒)0.7重量份下,一面於110℃下攪拌48小時一面進行反應,藉此獲得式(8-3)所表示之化合物(聚合性單體G)。 16.5 parts by weight of the compound represented by the formula (5-1) and 6.8 parts by weight of the compound represented by the formula (6-2) in which all of R 2 is a methoxy group, and PS-PPH3 (Biotage) as a basic catalyst Manufactured by Japan Corporation, the reaction was carried out by stirring at 110 ° C for 48 hours under 0.7 parts by weight of a basic catalyst containing triphenylphosphine supported on polystyrene (PS), thereby obtaining the formula (8-3). The compound represented (polymerizable monomer G).
再者,式(5-1)所表示之化合物與式(6-2)所表示之全部R2為甲氧基之化合物之調配比率以莫耳比計,為式(5-1)所表示之化合物:式(6-2)所表示之全部R2為甲氧基之化合物=57.6:28.8。 Further, the compounding ratio of the compound represented by the formula (5-1) and the compound in which all R 2 represented by the formula (6-2) is a methoxy group is expressed by the formula (5-1) in terms of a molar ratio. The compound: the compound represented by the formula (6-2) wherein all R 2 is a methoxy group = 57.6: 28.8.
(高分子化合物G之製作) (Production of Polymer Compound G)
將所獲得之聚合性單體G 10重量份於乙醇20.0g、水0.5g、及作為酸觸媒之6N-鹽酸0.6重量份之存在下,一面進行氮氣流動一面於70℃下攪拌4小時而使其反應,藉此獲得高分子化合物G。所獲得之高分子化合物G之數量平均分子量為7600(聚合度15)。 10 parts by weight of the polymerizable monomer G obtained was stirred at 70 ° C for 4 hours while flowing nitrogen gas in the presence of 20.0 g of ethanol, 0.5 g of water, and 0.6 parts by weight of 6N-hydrochloric acid as an acid catalyst. This was allowed to react, whereby a polymer compound G was obtained. The number average molecular weight of the obtained polymer compound G was 7,600 (degree of polymerization 15).
(實施例1~17、比較例1) (Examples 1 to 17 and Comparative Example 1)
根據表1、2中所記載之調配比,使用行星式攪拌機(Thinky公司製造,「去泡攪拌太郎」)將各個材料進行混合後,進而使用三輥研磨機進行混合,藉此製備實施例1~17、比較例1之各個液晶顯示元件用密封劑。 According to the blending ratios described in Tables 1 and 2, each material was mixed using a planetary mixer ("Drying Stirred Taro" manufactured by Thinky Co., Ltd.), and then mixed using a three-roll mill to prepare Example 1 ~17. Each of the sealing agents for liquid crystal display elements of Comparative Example 1.
<評價> <evaluation>
對實施例及比較例中所獲得之各個液晶顯示元件用密封劑進行以下之評價。將結果示於表1、2。 Each of the sealants for liquid crystal display elements obtained in the examples and the comparative examples was subjected to the following evaluation. The results are shown in Tables 1 and 2.
(光硬化性) (photohardenability)
於玻璃基板上,以貼合玻璃基板後之間隙成為約5μm之方式塗佈實施例及比較例中所獲得之各液晶顯示元件用密封劑,並將相同尺寸之玻璃基板重疊於該基板,繼而,使用金屬鹵化物燈照射10秒100mW/cm2之紫外線(波長365nm)。使用紅外分光裝置(BIORAD公司製造,「FTS3000」),測定源自(甲基)丙烯醯基之峰於光照射前後之變化量,藉此進行光硬化性之評價。將於光照射後源自(甲基)丙烯醯基之峰減少93%以上之情形記為「◎」,將於光照射後源自(甲基)丙烯醯基之峰減少85%以上且未達93%之情形記為「○」,將於光照射後源自(甲基)丙烯醯基之峰減少75%以上且未達85%之情形記為「Δ」,將於光照射後之源自(甲基)丙烯醯基之峰之減少未達75%之情形記為「×」,以評價光硬化性。 Applying the sealing agent for liquid crystal display elements obtained in the examples and the comparative examples to the glass substrate so that the gap after bonding the glass substrate is about 5 μm, and superimposing the glass substrate of the same size on the substrate, and then Ultraviolet light (wavelength 365 nm) of 100 mW/cm 2 was irradiated for 10 seconds using a metal halide lamp. The amount of change in the peak derived from the (meth) acrylonitrile group before and after the light irradiation was measured using an infrared spectroscopic device ("FTS3000" manufactured by BIORAD Co., Ltd.), whereby the photocurability was evaluated. The case where the peak derived from the (meth) acrylonitrile group is reduced by 93% or more after the light irradiation is referred to as "◎", and the peak derived from the (meth) acrylonitrile group after light irradiation is reduced by 85% or more. The case of 93% is recorded as "○", and the case where the peak derived from the (meth) acrylonitrile group is reduced by 75% or more and less than 85% after the light irradiation is recorded as "Δ", which will be after the light irradiation. The case where the decrease in the peak derived from the (meth) acrylonitrile group was less than 75% was referred to as "x" to evaluate the photocurability.
(液晶污染性) (liquid crystal contamination)
使間隔微粒子(積水化學工業公司製造,「Micropearl SI-H050」)1重量份分散於實施例及比較例中所獲得之各液晶顯示元件用密封劑100重量份中,而製成液晶顯示元件用密封劑,利用分注器以密封劑之線寬成為1mm之方式塗佈於兩片經摩擦之配向膜及附透明電極之基板之一者。 1 part by weight of the spacer fine particles ("Micropearl SI-H050", manufactured by Sekisui Chemical Co., Ltd.) was dispersed in 100 parts by weight of each of the sealing agents for liquid crystal display elements obtained in the examples and the comparative examples to prepare a liquid crystal display device. The sealant was applied to one of the two rubbed alignment films and the substrate with the transparent electrode by means of a dispenser in such a manner that the line width of the sealant was 1 mm.
繼而,將液晶(Chisso公司製造,「JC-5004LA」)之微滴滴加塗佈於附透明電極之基板之密封劑之框內整個面,立即將另一附透明電極之彩色濾光片基板進行貼合,使用金屬鹵化物燈對密封劑部分照射30秒100mW /cm2之紫外線(波長365nm)而使其硬化,進而於120℃加熱1小時而獲得液晶顯示元件。 Then, a droplet of liquid crystal (manufactured by Chisso Co., Ltd., "JC-5004LA") was applied dropwise to the entire surface of the sealing agent of the substrate with the transparent electrode, and another color filter substrate with a transparent electrode was immediately applied. The bonding was carried out, and the sealing agent was irradiated with ultraviolet rays (wavelength: 365 nm) of 100 mW/cm 2 for 30 seconds using a metal halide lamp, and further heated at 120 ° C for 1 hour to obtain a liquid crystal display element.
液晶顯示元件係利用分注器來控制密封劑之塗佈位置,製作密封劑完全照射到光之液晶顯示元件(無遮光部)、與密封劑以線寬之50%覆蓋有彩色濾光片基板之黑色矩陣之方式塗佈而成之液晶顯示元件(有遮光部)兩種。圖1係示意性地表示使用實施例及比較例中所獲得之各液晶顯示元件用密封劑以無遮光部之狀態所製作之液晶顯示元件的剖面圖,圖2係示意性地表示使用實施例及比較例中所獲得之各液晶顯示元件用密封劑以有遮光部之狀態所製作之液晶顯示元件的剖面圖。如圖1所示般,密封劑1無遮光部者係使密封劑1完全被光照射之狀態,另一方面,如圖2所示般,密封劑1有遮光部之液晶顯示元件係與液晶3接觸之部分之密封劑1被黑色矩陣2所遮蔽而完全照射不到光。 The liquid crystal display element uses a dispenser to control the application position of the sealant, and the liquid crystal display element (without the light-shielding portion) in which the sealant is completely irradiated to the light, and the color filter substrate is covered with the sealant at 50% of the line width. There are two kinds of liquid crystal display elements (with light-shielding portions) coated by a black matrix. 1 is a cross-sectional view showing a liquid crystal display element produced by using a sealing agent for liquid crystal display elements obtained in Examples and Comparative Examples in a state where no light-shielding portion is formed, and FIG. 2 is a view schematically showing an example of use. And a cross-sectional view of the liquid crystal display element produced by the sealing agent for liquid crystal display elements obtained in the comparative example in the state which has a light-shielding part. As shown in Fig. 1, the sealant 1 has no light-shielding portion, and the sealant 1 is completely irradiated with light. On the other hand, as shown in Fig. 2, the sealant 1 has a light-shielding portion of the liquid crystal display element and liquid crystal. The sealant 1 of the portion 3 in contact is shielded by the black matrix 2 and completely illuminates the light.
針對所獲得之液晶顯示元件,於進行100小時動作試驗後,經過於80℃施加1000小時電壓之狀態,後藉由目視而確認此後密封劑附近之液晶配向混亂。 The liquid crystal display element obtained was subjected to a 100-hour operation test, and after applying a voltage of 1000 hours at 80 ° C, it was confirmed by visual observation that the liquid crystal alignment in the vicinity of the sealant was disordered.
配向混亂係根據顯示部之顏色不均而進行判斷,根據顏色不均之程度,將完全無顏色不均之情形記為「◎」,將稍有顏色不均之情形記為「○」,將有較少顏色不均之情形記為「Δ」,將有相當多顏色不均之情形記為「×」,而評價液晶污染性。 The alignment disorder is judged based on the unevenness of the color of the display portion, and the case where there is no color unevenness is described as "◎" according to the degree of color unevenness, and the case of slight color unevenness is referred to as "○". The case where there is less color unevenness is referred to as "Δ", and the case where there is a considerable amount of color unevenness is referred to as "X", and liquid crystal contamination is evaluated.
再者,評價為「◎」、「○」之液晶顯示元件係於實際使用上完全無問題之等級。 In addition, the liquid crystal display elements evaluated as "◎" and "○" are grades which are completely problem-free in practical use.
[產業上之可利用性] [Industrial availability]
根據本發明,可提供一種對液晶之污染性低、對長波長之光為高感度且增感效果亦優異之聚合性單體、及使該聚合性單體聚合所獲得之高分子化合物。又,根據本發明,可提供含有該聚合性單體及/或該高分子化合物之光硬化性樹脂組成物、使用該光硬化性樹脂組成物而成之液晶顯示元件用密封劑、及使用該液晶顯示元件用密封劑所製造之上下導通材料及液晶顯示元件。 According to the present invention, it is possible to provide a polymerizable monomer which is low in contamination to liquid crystal, has high sensitivity to long-wavelength light, and is excellent in sensitizing effect, and a polymer compound obtained by polymerizing the polymerizable monomer. Moreover, according to the present invention, a photocurable resin composition containing the polymerizable monomer and/or the polymer compound, a sealing agent for a liquid crystal display element using the photocurable resin composition, and the like can be provided. The upper and lower conductive materials and the liquid crystal display element are used for the liquid crystal display element sealing agent.
Claims (11)
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| JPJP2013-252325 | 2013-12-05 | ||
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| KR (1) | KR102256146B1 (en) |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI809206B (en) * | 2018-10-26 | 2023-07-21 | 日商積水化學工業股份有限公司 | Sealant for liquid crystal display element, upper and lower conduction material, and liquid crystal display element |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
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| KR101804108B1 (en) * | 2015-09-02 | 2017-12-01 | 세키스이가가쿠 고교가부시키가이샤 | Sealant for liquid crystal display element, vertical conduction material, and liquid crystal display element |
| KR102467952B1 (en) * | 2016-12-16 | 2022-11-16 | 세키스이가가쿠 고교가부시키가이샤 | Polymerizable compound, sealant for liquid crystal display element, top and bottom conduction material, and liquid crystal display element |
| DE202017101349U1 (en) | 2017-03-09 | 2018-06-12 | Werner Schlüter | isolation mat |
| WO2019013065A1 (en) * | 2017-07-14 | 2019-01-17 | 積水化学工業株式会社 | Sealing agent for liquid crystal display elements, vertical conduction material, and liquid crystal display element |
| KR20230078950A (en) * | 2020-09-30 | 2023-06-05 | 세키스이가가쿠 고교가부시키가이샤 | Thioxanthone compound, photopolymerization initiator, curable resin composition, display element composition, liquid crystal display element sealant, upper and lower conduction material, and liquid crystal display element |
| FR3118965B1 (en) * | 2021-01-20 | 2023-12-01 | Arkema France | POLYMERIZABLE THIOXANTHONE |
| CN114280853B (en) * | 2021-12-24 | 2025-06-20 | 南京华生皓光电科技有限公司 | A sealant for liquid crystal packaging and preparation method thereof |
| CN114805296B (en) * | 2022-05-10 | 2024-07-19 | 艾坚蒙(安庆)科技发展有限公司 | Thioxanthone derivative, preparation method and application thereof |
| EP4310105A1 (en) * | 2022-07-20 | 2024-01-24 | Arkema France | Acrylic copolymers imparting low yellowing after photocuring |
| CN115322328B (en) * | 2022-08-19 | 2023-07-04 | 武汉长盈鑫科技有限公司 | Preparation method of epoxy modified polyurethane acrylate capable of being rapidly cured with low energy |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR1527781A (en) * | 1966-12-23 | 1968-06-07 | Rhone Poulenc Sa | New organosilicon compounds with ester functions |
| JPS6016958A (en) * | 1983-07-07 | 1985-01-28 | Asahi Chem Ind Co Ltd | Novel functional monomer and photo-polymerizable composition containing the same |
| JPS61138610A (en) * | 1984-12-11 | 1986-06-26 | Asahi Chem Ind Co Ltd | Photo-sensitive composition and laminate containing same |
| DE4435487A1 (en) * | 1994-10-04 | 1996-04-11 | Hoechst Ag | Silicon-compatible photoinitiators and light-sensitive mixtures containing them |
| JP3583326B2 (en) | 1999-11-01 | 2004-11-04 | 協立化学産業株式会社 | Sealant for dripping method of LCD panel |
| KR100906926B1 (en) | 2001-05-16 | 2009-07-10 | 세키스이가가쿠 고교가부시키가이샤 | Curable resin composition, sealing agent for display elements, and inlet sealant for display elements |
| JP4010547B2 (en) * | 2003-01-27 | 2007-11-21 | 日本化薬株式会社 | Self-polymerizing photopolymerization initiator and photosensitive resin composition using the same |
| KR100952263B1 (en) * | 2003-06-04 | 2010-04-09 | 세키스이가가쿠 고교가부시키가이샤 | Curable Resin Composition |
| JP4463571B2 (en) * | 2004-01-19 | 2010-05-19 | 積水化学工業株式会社 | Sealant for liquid crystal display element, vertical conduction material, and liquid crystal display element |
| JP5299277B2 (en) * | 2007-07-18 | 2013-09-25 | 旭硝子株式会社 | COMPOUND HAVING FLUORESCENT EMITTING FUNCTIONAL GROUP AND METHOD FOR PRODUCING POLYMER THEREOF |
| WO2009101016A2 (en) * | 2008-02-12 | 2009-08-20 | Basf Se | Modified hybrid nanoparticles |
| EP2161264B1 (en) * | 2008-09-09 | 2019-11-27 | Agfa Nv | Polymerizable photoinitiators and radiation curable compositions |
| ATE537195T1 (en) * | 2008-09-09 | 2011-12-15 | Agfa Graphics Nv | RADIATION CURED COMPOSITIONS |
| JP5152868B2 (en) | 2009-06-11 | 2013-02-27 | 日本化薬株式会社 | Visible light curable liquid crystal sealant and liquid crystal display cell using the same |
| JP5598948B2 (en) | 2009-07-01 | 2014-10-01 | 独立行政法人産業技術総合研究所 | Method for manufacturing piezoelectric thin film and piezoelectric thin film manufactured by the manufacturing method |
| CN102061065A (en) * | 2009-11-12 | 2011-05-18 | 咸阳秦河复合材料有限责任公司 | Photosensitive cured super resin composition for sealing liquid crystal display (LCD) and preparation method thereof |
| JP5651177B2 (en) * | 2010-07-20 | 2015-01-07 | 日本化薬株式会社 | Liquid crystal sealant and liquid crystal display cell using the same |
| WO2012077720A1 (en) * | 2010-12-09 | 2012-06-14 | 協立化学産業株式会社 | Compound suitable for photopolymerization initiator, photopolymerization initiator, and photocurable resin composition |
| CN103026292B (en) * | 2011-04-05 | 2014-03-05 | 积水化学工业株式会社 | Light-shielding sealing agent for liquid crystal display element, top-to-bottom conductive material, and liquid crystal display element |
| JP5340502B2 (en) * | 2012-03-26 | 2013-11-13 | 積水化学工業株式会社 | Liquid crystal dropping method sealing agent, vertical conduction material, and liquid crystal display element |
-
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| Publication number | Priority date | Publication date | Assignee | Title |
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| TWI809206B (en) * | 2018-10-26 | 2023-07-21 | 日商積水化學工業股份有限公司 | Sealant for liquid crystal display element, upper and lower conduction material, and liquid crystal display element |
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| Publication number | Publication date |
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| TWI641582B (en) | 2018-11-21 |
| KR20160094929A (en) | 2016-08-10 |
| WO2015083663A1 (en) | 2015-06-11 |
| JPWO2015083663A1 (en) | 2017-03-16 |
| CN105683225A (en) | 2016-06-15 |
| JP6434901B2 (en) | 2018-12-05 |
| CN105683225B (en) | 2019-09-03 |
| KR102256146B1 (en) | 2021-05-25 |
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