TW201540747A - 用於聚醯胺醯亞胺和聚醯亞胺的新溶劑 - Google Patents

用於聚醯胺醯亞胺和聚醯亞胺的新溶劑 Download PDF

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Publication number: TW201540747A
Authority: TW; Taiwan
Prior art keywords: methoxy; weight; polyimine; mixture; solvent
Prior art date: 2014-03-26

Application number

TW104106709A

Other languages

English (en)

Chinese (zh)

Inventor

Giovanna Biondi

Giovanni Loggi

Original Assignee

Elantas Italia S R L

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2014-03-26

Filing date

2015-03-03

Publication date

2015-11-01

2015-03-03 Application filed by Elantas Italia S R L filed Critical Elantas Italia S R L

2015-11-01 Publication of TW201540747A publication Critical patent/TW201540747A/zh

Links

239000002904 solvent Substances 0.000 title claims abstract description 30
229920002312 polyamide-imide Polymers 0.000 title claims abstract description 18
229920001721 polyimide Polymers 0.000 title claims abstract description 9
239000004642 Polyimide Substances 0.000 title claims abstract 7
239000004962 Polyamide-imide Substances 0.000 title abstract 3
239000000203 mixture Substances 0.000 claims abstract description 56
LBVMWHCOFMFPEG-UHFFFAOYSA-N 3-methoxy-n,n-dimethylpropanamide Chemical compound COCCC(=O)N(C)C LBVMWHCOFMFPEG-UHFFFAOYSA-N 0.000 claims abstract description 34
238000000034 method Methods 0.000 claims abstract description 7
239000003085 diluting agent Substances 0.000 claims description 24
239000011230 binding agent Substances 0.000 claims description 8
239000004922 lacquer Substances 0.000 claims description 8
238000002156 mixing Methods 0.000 claims description 2
XIPFMBOWZXULIA-UHFFFAOYSA-N pivalamide Chemical compound CC(C)(C)C(N)=O XIPFMBOWZXULIA-UHFFFAOYSA-N 0.000 claims 1
239000011347 resin Substances 0.000 description 22
229920005989 resin Polymers 0.000 description 22
SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 15
125000003118 aryl group Chemical group 0.000 description 15
UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 6
CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 6
YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
125000005442 diisocyanate group Chemical group 0.000 description 6
238000002360 preparation method Methods 0.000 description 6
239000008096 xylene Substances 0.000 description 6
UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 5
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 5
150000008064 anhydrides Chemical class 0.000 description 5
238000001816 cooling Methods 0.000 description 5
150000002430 hydrocarbons Chemical class 0.000 description 5
150000003949 imides Chemical class 0.000 description 5
SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 5
YNQLUTRBYVCPMQ-UHFFFAOYSA-N Ethylbenzene Chemical compound CCC1=CC=CC=C1 YNQLUTRBYVCPMQ-UHFFFAOYSA-N 0.000 description 4
125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 4
RWGFKTVRMDUZSP-UHFFFAOYSA-N cumene Chemical compound CC(C)C1=CC=CC=C1 RWGFKTVRMDUZSP-UHFFFAOYSA-N 0.000 description 4
-1 diimine carboxylic acid Chemical class 0.000 description 4
229930195733 hydrocarbon Natural products 0.000 description 4
150000004060 quinone imines Chemical class 0.000 description 4
239000004215 Carbon black (E152) Substances 0.000 description 3
ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
150000004945 aromatic hydrocarbons Chemical class 0.000 description 3
238000006243 chemical reaction Methods 0.000 description 3
210000003298 dental enamel Anatomy 0.000 description 3
150000004985 diamines Chemical class 0.000 description 3
239000011541 reaction mixture Substances 0.000 description 3
150000003628 tricarboxylic acids Chemical class 0.000 description 3
VZXTWGWHSMCWGA-UHFFFAOYSA-N 1,3,5-triazine-2,4-diamine Chemical compound NC1=NC=NC(N)=N1 VZXTWGWHSMCWGA-UHFFFAOYSA-N 0.000 description 2
CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 2
239000002253 acid Substances 0.000 description 2
125000003277 amino group Chemical group 0.000 description 2
239000004305 biphenyl Substances 0.000 description 2
USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 2
150000002466 imines Chemical class 0.000 description 2
239000004615 ingredient Substances 0.000 description 2
VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
229920000768 polyamine Polymers 0.000 description 2
239000009719 polyimide resin Substances 0.000 description 2
239000011877 solvent mixture Substances 0.000 description 2
VGHSXKTVMPXHNG-UHFFFAOYSA-N 1,3-diisocyanatobenzene Chemical compound O=C=NC1=CC=CC(N=C=O)=C1 VGHSXKTVMPXHNG-UHFFFAOYSA-N 0.000 description 1
IKYNWXNXXHWHLL-UHFFFAOYSA-N 1,3-diisocyanatopropane Chemical compound O=C=NCCCN=C=O IKYNWXNXXHWHLL-UHFFFAOYSA-N 0.000 description 1
239000005059 1,4-Cyclohexyldiisocyanate Substances 0.000 description 1
ALQLPWJFHRMHIU-UHFFFAOYSA-N 1,4-diisocyanatobenzene Chemical compound O=C=NC1=CC=C(N=C=O)C=C1 ALQLPWJFHRMHIU-UHFFFAOYSA-N 0.000 description 1
OVBFMUAFNIIQAL-UHFFFAOYSA-N 1,4-diisocyanatobutane Chemical compound O=C=NCCCCN=C=O OVBFMUAFNIIQAL-UHFFFAOYSA-N 0.000 description 1
DFPJRUKWEPYFJT-UHFFFAOYSA-N 1,5-diisocyanatopentane Chemical compound O=C=NCCCCCN=C=O DFPJRUKWEPYFJT-UHFFFAOYSA-N 0.000 description 1
JOQZTPJJJFIYLN-UHFFFAOYSA-N 1,6-diisocyanato-3,3,4-trimethylhexane Chemical compound O=C=NCCC(C)C(C)(C)CCN=C=O JOQZTPJJJFIYLN-UHFFFAOYSA-N 0.000 description 1
WJEKZKWKSNGXCI-UHFFFAOYSA-N 4-hexyl-1,6-bis(8-isocyanatooctyl)-5-octylcyclohexene Chemical compound CCCCCCCCC1C(CCCCCC)CC=C(CCCCCCCCN=C=O)C1CCCCCCCCN=C=O WJEKZKWKSNGXCI-UHFFFAOYSA-N 0.000 description 1
HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
239000004971 Cross linker Substances 0.000 description 1
239000005057 Hexamethylene diisocyanate Substances 0.000 description 1
UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
239000004952 Polyamide Substances 0.000 description 1
150000007513 acids Chemical class 0.000 description 1
238000007259 addition reaction Methods 0.000 description 1
239000000654 additive Substances 0.000 description 1
238000004220 aggregation Methods 0.000 description 1
230000002776 aggregation Effects 0.000 description 1
150000001412 amines Chemical class 0.000 description 1
150000001491 aromatic compounds Chemical class 0.000 description 1
229910052799 carbon Inorganic materials 0.000 description 1
239000001569 carbon dioxide Substances 0.000 description 1
229910002092 carbon dioxide Inorganic materials 0.000 description 1
150000001244 carboxylic acid anhydrides Chemical class 0.000 description 1
239000011248 coating agent Substances 0.000 description 1
238000000576 coating method Methods 0.000 description 1
230000005494 condensation Effects 0.000 description 1
238000006482 condensation reaction Methods 0.000 description 1
239000004020 conductor Substances 0.000 description 1
150000003972 cyclic carboxylic anhydrides Chemical class 0.000 description 1
230000001419 dependent effect Effects 0.000 description 1
238000001514 detection method Methods 0.000 description 1
229910000071 diazene Inorganic materials 0.000 description 1
150000001991 dicarboxylic acids Chemical class 0.000 description 1
230000007613 environmental effect Effects 0.000 description 1
125000000524 functional group Chemical group 0.000 description 1
RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
229910052739 hydrogen Inorganic materials 0.000 description 1
239000001257 hydrogen Substances 0.000 description 1
239000012535 impurity Substances 0.000 description 1
239000012948 isocyanate Substances 0.000 description 1
IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 1
NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
238000004519 manufacturing process Methods 0.000 description 1
239000000463 material Substances 0.000 description 1
SYSQUGFVNFXIIT-UHFFFAOYSA-N n-[4-(1,3-benzoxazol-2-yl)phenyl]-4-nitrobenzenesulfonamide Chemical class C1=CC([N+](=O)[O-])=CC=C1S(=O)(=O)NC1=CC=C(C=2OC3=CC=CC=C3N=2)C=C1 SYSQUGFVNFXIIT-UHFFFAOYSA-N 0.000 description 1
238000012705 nitroxide-mediated radical polymerization Methods 0.000 description 1
239000003960 organic solvent Substances 0.000 description 1
125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
239000000049 pigment Substances 0.000 description 1
239000002574 poison Substances 0.000 description 1
231100000614 poison Toxicity 0.000 description 1
229920002647 polyamide Polymers 0.000 description 1
239000005056 polyisocyanate Substances 0.000 description 1
229920001228 polyisocyanate Polymers 0.000 description 1
125000004151 quinonyl group Chemical group 0.000 description 1
239000003381 stabilizer Substances 0.000 description 1
230000002110 toxicologic effect Effects 0.000 description 1
231100000027 toxicology Toxicity 0.000 description 1
239000000080 wetting agent Substances 0.000 description 1

Classifications

- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
- C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1003—Preparatory processes
- C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
- C08G73/1028—Preparatory processes from tetracarboxylic acids or derivatives and diamines characterised by the process itself, e.g. steps, continuous
- C08G73/1032—Preparatory processes from tetracarboxylic acids or derivatives and diamines characterised by the process itself, e.g. steps, continuous characterised by the solvent(s) used
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/14—Polyamide-imides
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/202—Applications use in electrical or conductive gadgets use in electrical wires or wirecoating
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure

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Chemical & Material Sciences (AREA)
Chemical Kinetics & Catalysis (AREA)
Organic Chemistry (AREA)
Health & Medical Sciences (AREA)
Medicinal Chemistry (AREA)
Polymers & Plastics (AREA)
Life Sciences & Earth Sciences (AREA)
Engineering & Computer Science (AREA)
Materials Engineering (AREA)
Wood Science & Technology (AREA)
Paints Or Removers (AREA)
Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Compositions Of Macromolecular Compounds (AREA)
Organic Insulating Materials (AREA)
Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)

TW104106709A 2014-03-26 2015-03-03 用於聚醯胺醯亞胺和聚醯亞胺的新溶劑 TW201540747A (zh)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
DE102014104223.9A DE102014104223A1 (de)	2014-03-26	2014-03-26	Neues Lösemittel für Polyamidimide und Polyimide

Publications (1)

Publication Number	Publication Date
TW201540747A true TW201540747A (zh)	2015-11-01

Family

ID=52697452

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
TW104106709A TW201540747A (zh)	2014-03-26	2015-03-03	用於聚醯胺醯亞胺和聚醯亞胺的新溶劑

Country Status (7)

Country	Link
EP (1)	EP3122829A1 (de)
JP (1)	JP2017517582A (de)
KR (1)	KR20160137986A (de)
CN (1)	CN106062107A (de)
DE (1)	DE102014104223A1 (de)
TW (1)	TW201540747A (de)
WO (1)	WO2015144663A1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
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TWI677535B (zh) *	2017-09-14	2019-11-21	南韓商Ｌｇ化學股份有限公司	聚醯亞胺前驅物組成物、使用其製備之聚醯亞胺膜、氧化物薄膜電晶體用透明聚醯亞胺基板及低溫多晶矽用透明聚醯亞胺基板

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP6935982B2 (ja) *	2014-09-29	2021-09-15	旭化成株式会社	樹脂組成物、硬化レリーフパターンの製造方法、及び半導体装置
CN107847965A (zh) *	2015-07-10	2018-03-27	华福涂料公司	用于形成高释放和低摩擦功能涂层的组合物
US10280335B2 (en)	2016-06-06	2019-05-07	Cymer-Dayton, Llc	Preparation of polyamide-imide resins using N-formyl morpholine:3-methoxy N,N-dimethylpropanamide
WO2018002988A1 (ja) *	2016-06-27	2018-01-04	日立化成株式会社	ポリアミドイミド樹脂組成物及び塗料
KR102054546B1 (ko) *	2016-09-26	2019-12-10	주식회사 엘지화학	폴리이미드 전구체 용액 및 이로부터 제조된 폴리이미드 필름
WO2018150566A1 (ja)	2017-02-20	2018-08-23	日立化成株式会社	ポリアミドイミド樹脂組成物及びフッ素塗料
JP2018146635A (ja) *	2017-03-01	2018-09-20	富士ゼロックス株式会社	電子写真装置用無端ベルト、画像形成装置、及び、無端ベルトユニット
KR102350095B1 (ko)	2018-01-03	2022-01-11	주식회사 엘지화학	방향족 폴리(아미드-이미드) 공중합체 필름과 이의 제조 방법
US11807721B2 (en)	2018-04-03	2023-11-07	Hd Microsystems, Ltd.	Method for producing polyimide precursor, method for producing photosensitive resin composition, method for producing pattern cured product, method for producing interlayer insulating film, cover coat layer or surface protective film, and method for producing electronic component
JP7210839B2 (ja) *	2018-07-27	2023-01-24	株式会社レゾナック	耐熱性樹脂組成物
CN110922753A (zh) *	2018-09-20	2020-03-27	住友化学株式会社	光学膜形成用组合物
JP7557847B2 (ja) *	2019-03-06	2024-09-30	Ｋｊケミカルズ株式会社	安定化されたアルコキシ－ｎ－置換プロパンアミド組成物
US12552960B2 (en) *	2019-05-16	2026-02-17	Resonac Corporation	Polyamideimide resin composition and method for producing polyamideimide resin
EP3973018A1 (de) *	2019-05-22	2022-03-30	AdvanSix Resins & Chemicals LLC	Polymerzusammensetzungen zur herstellung einer emailbeschichtung auf einem draht
JP7230161B2 (ja) *	2020-01-29	2023-02-28	旭化成株式会社	樹脂組成物、硬化レリーフパターンの製造方法、及び半導体装置
JP7071669B2 (ja)	2020-07-09	2022-05-19	ダイキン工業株式会社	塗料組成物、塗膜及び塗装物品
EP4212574A4 (de)	2020-09-09	2024-10-09	KJ Chemicals Corporation	Lösungsmittel zur harzsynthese und verfahren zur herstellung von kunstharz unter verwendung des besagten lösungsmittels
JP7593539B2 (ja) *	2020-09-14	2024-12-03	東特塗料株式会社	電気絶縁塗料及び電気絶縁被覆電線に有用なポリアミドイミド樹脂溶液の製法
EP4217413A1 (de)	2020-09-22	2023-08-02	Elantas Europe Srl	Drahtlackzusammensetzung mit polyamidimid
EP4105261A1 (de)	2021-06-14	2022-12-21	Evonik Fibres GmbH	Neue nichttoxische polyimidlösungen
CN117280429A (zh) *	2021-08-24	2023-12-22	住友电气工业株式会社	绝缘电线
WO2023171679A1 (ja)	2022-03-08	2023-09-14	Ｋｊケミカルズ株式会社	高安全性アミド化合物を含有する組成物
KR20250027743A (ko)	2022-06-24	2025-02-27	가부시키가이샤 가네카	폴리아미드산 조성물, 폴리이미드의 제조 방법, 적층체의 제조 방법 및 전자 디바이스의 제조 방법
WO2024181150A1 (ja)	2023-02-28	2024-09-06	株式会社カネカ	ポリアミド酸組成物、ポリイミドの製造方法、積層体の製造方法及び電子デバイスの製造方法
CN116515294A (zh) *	2023-04-14	2023-08-01	哈尔滨理工大学	一种高耐热聚酰亚胺电缆料及其制备方法和应用

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE1420706C3 (de)	1958-09-19	1974-05-09	E.I. Du Pont De Nemours And Co., Wilmington, Del. (V.St.A.)	Verfahren zur Herstellung von Polyamidsäuren
US3207728A (en)	1961-03-31	1965-09-21	Du Pont	Polymides from thiophene tetracar-boxylic acid and diamines
DE1266427B (de)	1963-01-08	1968-04-18	Bayer Ag	Verfahren zur Herstellung von Lackueberzuegen auf Grundlage von Polyisocyanaten
US3554984A (en)	1968-10-16	1971-01-12	George Co P D	Polyamide-imide resins
BE758753A (fr)	1969-11-11	1971-04-16	Bayer Ag	Procede de preparation de polyamide-imides
JPS5128418B2 (de) *	1973-01-26	1976-08-19
DE2441020C3 (de)	1974-08-27	1982-01-07	Basf Ag, 6700 Ludwigshafen	Verfahren zur Herstellung von viskositätsstabilen Polyamidimid-Lösungen
DE2556523C2 (de)	1975-12-16	1982-03-18	Basf Ag, 6700 Ludwigshafen	Aromatische Polyamidimide
JPS63215727A (ja)	1986-12-31	1988-09-08	ゼネラル・エレクトリック・カンパニイ	ポリイミドの製造法
US4835249A (en)	1986-12-31	1989-05-30	General Electric Company	Process for preparing polyimides
JPH1160670A (ja) *	1997-08-08	1999-03-02	Hitachi Chem Co Ltd	ポリアミドイミド樹脂、その製造法及び塗料
WO2008102615A1 (ja) *	2007-02-20	2008-08-28	Idemitsu Kosan Co., Ltd.	β－アルコキシプロピオンアミド類の製造方法
JP5331469B2 (ja) *	2008-12-10	2013-10-30	出光興産株式会社	β−アルコキシプロピオンアミド類の製造方法
US9029441B2 (en) *	2011-12-15	2015-05-12	Fujifilm Hunt Chemicals Us, Inc.	Low toxicity solvent system for polyamideimide and polyamide amic acid resins and coating solutions thereof
CN104144968A (zh) *	2011-12-15	2014-11-12	富士胶片亨特化学品美国有限公司	用于聚酰胺酰亚胺树脂的低毒性溶剂系统和溶剂系统的制备
JPWO2013153754A1 (ja) *	2012-04-11	2015-12-17	出光興産株式会社	β−アルコキシプロピオンアミド類の製造方法
JP6146135B2 (ja) *	2012-08-30	2017-06-14	Jsr株式会社	液晶配向剤、液晶配向膜、液晶配向膜の製造方法及び液晶表示素子
JP6127721B2 (ja) *	2012-09-14	2017-05-17	Jsr株式会社	液晶配向剤、液晶配向膜及び液晶表示素子
JP6557963B2 (ja) *	2014-02-25	2019-08-14	Jsr株式会社	液晶配向剤、液晶配向膜及び液晶表示素子

2014
- 2014-03-26 DE DE102014104223.9A patent/DE102014104223A1/de not_active Withdrawn
2015
- 2015-03-03 TW TW104106709A patent/TW201540747A/zh unknown
- 2015-03-24 CN CN201580011170.2A patent/CN106062107A/zh active Pending
- 2015-03-24 WO PCT/EP2015/056191 patent/WO2015144663A1/de not_active Ceased
- 2015-03-24 JP JP2016555538A patent/JP2017517582A/ja active Pending
- 2015-03-24 KR KR1020167024125A patent/KR20160137986A/ko not_active Withdrawn
- 2015-03-24 EP EP15711237.6A patent/EP3122829A1/de not_active Withdrawn

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
TWI677535B (zh) *	2017-09-14	2019-11-21	南韓商Ｌｇ化學股份有限公司	聚醯亞胺前驅物組成物、使用其製備之聚醯亞胺膜、氧化物薄膜電晶體用透明聚醯亞胺基板及低溫多晶矽用透明聚醯亞胺基板
US11466124B2 (en)	2017-09-14	2022-10-11	Lg Chem, Ltd.	Polyimide precursor composition and polyimide film using same

Also Published As

Publication number	Publication date
CN106062107A (zh)	2016-10-26
WO2015144663A1 (de)	2015-10-01
JP2017517582A (ja)	2017-06-29
EP3122829A1 (de)	2017-02-01
DE102014104223A1 (de)	2015-10-01
KR20160137986A (ko)	2016-12-02

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JP2012171979A (ja)	2012-09-10	電気絶縁用樹脂組成物及びエナメル線
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JPH0327577B2 (de)	1991-04-16