TW201610352A - Led光源模組 - Google Patents

Led光源模組 Download PDF

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Publication number
TW201610352A
TW201610352A TW103130969A TW103130969A TW201610352A TW 201610352 A TW201610352 A TW 201610352A TW 103130969 A TW103130969 A TW 103130969A TW 103130969 A TW103130969 A TW 103130969A TW 201610352 A TW201610352 A TW 201610352A
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TW
Taiwan
Prior art keywords
light
light source
led light
led
light guide
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Application number
TW103130969A
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English (en)
Inventor
林辰翰
Original Assignee
鴻海精密工業股份有限公司
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Priority to TW103130969A priority Critical patent/TW201610352A/zh
Priority to US14/526,156 priority patent/US9405053B2/en
Publication of TW201610352A publication Critical patent/TW201610352A/zh

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0013—Means for improving the coupling-in of light from the light source into the light guide
    • G02B6/0023—Means for improving the coupling-in of light from the light source into the light guide provided by one optical element, or plurality thereof, placed between the light guide and the light source, or around the light source
    • G02B6/0028—Light guide, e.g. taper
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/61—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using light guides
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
    • G02B6/0073—Light emitting diode [LED]
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0085—Means for removing heat created by the light source from the package
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0005—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being of the fibre type
    • G02B6/0008—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being of the fibre type the light being emitted at the end of the fibre

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

一種LED光源模組，包括散熱器、設置在散熱器一側的LED光源及與LED光源間隔設置的導光板，所述的LED光源和導光板之間設置有柔性導光管，所述柔性導光管具有入光口，所述入光口接近LED光源最外端的口徑等於或大於所述LED光源的LED出光頂端的外徑，用於將LED出光頂端完全罩設其內。與習知技術相比，本發明中的LED光源模組具有發光效率高、散熱性能好的優點。

Description

LED光源模組
本發明涉及一種半導體元件，特別涉及一種LED光源模組。
LED作為一種高效的發光源，因具有環保、省電、壽命長等諸多特點已經被廣泛的運用於各種領域。
近年來，車頭照明燈中大量採用LED光源，其主要結構為LED光源搭配導光板設計。這種車頭燈將LED光源安裝在導光板的一側從而使LED光源發出的光線自導光板側邊耦合進入導光板。一般的導光板厚度很薄，為了使LED光源發出的光線能夠盡可能都被耦合進入導光板而提高光利用效率，使得側入式LED光源發光體積較小，其寬度必須小於導光板的厚度。進一步地，為了使光耦合進入導光板的時候每個LED光源之間的混光區域縮短，各 LED光源之間的間距不能過大，導致LED光源排列過於緊密。如此設計的燈條基板過於細長而不利於LED光源的散熱，加上車頭燈的對亮度的特殊性要求，所以一般需要選用發光強度大、超高亮度LED光源，產生的熱量更多，再加上一般的車頭燈都安裝在靠近汽車引擎位置，更加不利於LED光源的散熱，綜合該等因素，若車頭燈中LED光源設計不合理，將會導致LED光源因為散熱不佳而加速老化，容易造成車頭燈壽命大幅度縮減。
有鑑於此，有必要設計一種發光效率高、散熱性能良好的LED光源模組。
一種LED光源模組，包括散熱器、設置在散熱器一側的LED光源及與LED光源間隔設置的導光板，所述LED光源包括至少一個LED，所述的LED光源和導光板之間設置有柔性導光管，所述柔性導光管具有入光口、相對的出光口以及連接於入光口與出光口之間的管體，所述入光口與相應的LED光耦合，所述出光口與導光板耦合，所述入光口的口徑等於或大於所述LED出光頂端的外徑，用於將LED出光頂端完全罩設其內。
本發明所述LED光源模組，藉由在LED光源和導光板之間設置具有可彎曲可延伸性的導光管，導光管和LED光源一對一相應耦合，而且所述導光管根據LED光源之間排列的間隔大小和導光板與LED光源之間的相對位置可相應的彎曲和延伸，而不影響導光板和LED光源之間形成良好的光傳輸通道。如此，可以不因導光板的自身厚度而限制LED光源的發光面積，使得LED光源可以採用於大功率平板型光源，也不會因為LED光源耦光進入導光板後混光區域過大而限制LED光源之間的排列間隔。因此本發明中的LED光源模組不但具有高強度高效率出光，而且具有良好的散熱性能。
圖1係本發明LED光源模組的主視圖。
圖2係圖1所示的LED光源模組的部分放大圖。
圖3係圖1中導光板的立體圖。
如圖1所示，係本發明LED光源模組的主視圖。所述的LED光源模組包括散熱器10、安裝在散熱器10一側的LED光源20、一導光板40、設置在 LED光源20和導光板40之間的導光管30。
參考圖2，所述散熱器10由散熱性能良好的材料或者聚合物材料製成。所述散熱器10包括一縱長的基板102及自所述基板102底面向外凸伸的多個散熱片101。該等散熱片101間隔設置，用於向外散發基板102吸收的熱量。
所述LED光源20位於所述基板102與底面相對的頂面。所述LED光源20由多個間隔的LED組成。該等LED產生的熱量經基板102傳導至散熱片101散發。
同時參考圖3，所述導光板40位於LED光源20的上方，其由反射率極高且不吸光的亞克力或者PC等材料製成。所述導光板40呈平板型，包括兩端的入光面401、402、背面403及相對背面的出光面404。光線自入光面401、402進入導光板40後經過背面403的反射後由出光面404出射。導光板40內部可設置複數導光點（圖未示），以對光線進行擴散，提高自出光面404出射的均勻度。
同時參考圖2，導光管30設置在LED光源20和導光板40之間，用於將LED光源20出射的光耦合進入導光板40，其由高反射率的柔性材料製成。所述導光管30呈管狀，包括管體31和設置於管體31兩端的入光口301和出光口302。所述入光口301同LED光源20的LED連接，出光口302與導光板40的入光面401相連接。所述入光口301呈喇叭形，其口徑自與管體31相連接的一端開始逐漸增大，其遠離管體31的最外端的口徑與LED出光頂端的外徑相等或略微大於LED出光頂端的外徑，用於將LED的出光頂端完全罩設其內。所述導光管30的管體31各處直徑相同，所述出光口302直徑與管體31直徑相同。LED光源20的出射光線經導光管30的入光口301耦合進入導光管30後藉由出光口302及導光板40的入光面401進入導光板40。
可以理解地，在導光板40的另一入光面402也可設置另外的LED光源20和相應的導光管30。
本發明所述LED光源模組，藉由在LED光源20和導光板40之間設置具有可彎曲延伸性的導光管30，導光管30和LED光源20一對一相應耦合，而且所述導光管30根據LED光源20之間排列的間隔大小和導光板40與LED光源20之間的相對位置可相應的彎曲和延伸，而不影響導光板40和LED光源20之間形成良好的光傳輸通道。如此，可以不因導光板40的自身厚度而限制LED光源20的發光面積，使得LED光源20可以採用於大功率平板型光源，也不會因為LED光源20耦光進入導光板40後混光區域過大而限制LED光源20之間的排列間隔。因此本發明中的LED光源模組不但具有高強度高效率出光，而且具有良好的散熱性能。
10‧‧‧散熱器
101‧‧‧散熱片
102‧‧‧基板
20‧‧‧LED光源
30‧‧‧導光管
31‧‧‧管體
301‧‧‧入光口
302‧‧‧出光口
40‧‧‧導光板
401、402‧‧‧入光面
403‧‧‧背面
404‧‧‧出光面
無
10‧‧‧散熱器
101‧‧‧散熱片
102‧‧‧基板
20‧‧‧LED光源
30‧‧‧導光管
31‧‧‧管體
301‧‧‧入光口
302‧‧‧出光口
40‧‧‧導光板
401‧‧‧入光面

Claims (5)

  1. 一種LED光源模組，包括散熱器、設置在散熱器一側的LED光源及與LED光源間隔設置的導光板，所述LED光源包括至少一個LED，其改良在於：所述的LED光源和導光板之間設置有柔性導光管，所述柔性導光管具有入光口、相對的出光口以及連接於入光口與出光口之間的管體，所述入光口與相應的LED光耦合，所述出光口與導光板耦合，所述入光口的口徑等於或大於所述LED出光頂端的外徑，用於將LED出光頂端完全罩設其內。
  2. 如申請專利範圍第1項所述的LED光源模組，其中：所述導光管入光口呈喇叭形，其口徑自與管體相連的一端開始朝向LED的一端逐漸增大。
  3. 如申請專利範圍第1項所述的LED光源模組，其中：所述導光板包括入光面，所述導光管的出光口連接於導光板的入光面。
  4. 如申請專利範圍第1項所述的LED光源模組，其中：所述導光管與LED為多個，每一導光管連接相應的一LED，所述的導光管包括連接在入光口與出光口之間的管體，所述導光管的管體直徑相同且等於所述出光口的直徑。
  5. 如申請專利範圍第1項所述的LED光源模組，其中：所述散熱器包括基板及自所述基板底面向外凸伸的多個散熱片，所述LED光源位於所述基板與底面相對的頂面。
TW103130969A 2014-09-09 2014-09-09 Led光源模組 TW201610352A (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW103130969A TW201610352A (zh) 2014-09-09 2014-09-09 Led光源模組
US14/526,156 US9405053B2 (en) 2014-09-09 2014-10-28 LED module

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Application Number Priority Date Filing Date Title
TW103130969A TW201610352A (zh) 2014-09-09 2014-09-09 Led光源模組

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TW201610352A true TW201610352A (zh) 2016-03-16

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Cited By (1)

* Cited by examiner, † Cited by third party
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TWI933303B (zh) 2025-02-05 2026-07-21 啓碁科技股份有限公司 導光模組及其導光管

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Publication number Priority date Publication date Assignee Title
WO2015031810A1 (en) 2013-08-30 2015-03-05 University Of Kansas Heated lens lighting arrangement
US11138334B1 (en) 2018-10-17 2021-10-05 Medallia, Inc. Use of ASR confidence to improve reliability of automatic audio redaction
US12170082B1 (en) 2019-03-31 2024-12-17 Medallia, Inc. On-the-fly transcription/redaction of voice-over-IP calls

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FI108106B (fi) * 1996-11-25 2001-11-15 Modular Technology Group Engin Menetelmä johde-elementin valmistamiseksi ja johde-elementti
US6290382B1 (en) * 1998-08-17 2001-09-18 Ppt Vision, Inc. Fiber bundle combiner and led illumination system and method
US6921920B2 (en) * 2001-08-31 2005-07-26 Smith & Nephew, Inc. Solid-state light source

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI933303B (zh) 2025-02-05 2026-07-21 啓碁科技股份有限公司 導光模組及其導光管

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US9405053B2 (en) 2016-08-02

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