TW201612005A - Resin sheet - Google Patents
Resin sheetInfo
- Publication number
- TW201612005A TW201612005A TW104121694A TW104121694A TW201612005A TW 201612005 A TW201612005 A TW 201612005A TW 104121694 A TW104121694 A TW 104121694A TW 104121694 A TW104121694 A TW 104121694A TW 201612005 A TW201612005 A TW 201612005A
- Authority
- TW
- Taiwan
- Prior art keywords
- metal foil
- resin
- curing agent
- resin layer
- resin sheet
- Prior art date
Links
- 229920005989 resin Polymers 0.000 title abstract 7
- 239000011347 resin Substances 0.000 title abstract 7
- 239000011888 foil Substances 0.000 abstract 5
- 239000002184 metal Substances 0.000 abstract 5
- 239000003795 chemical substances by application Substances 0.000 abstract 3
- 238000000034 method Methods 0.000 abstract 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical group C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 abstract 1
- 239000000654 additive Substances 0.000 abstract 1
- 239000003822 epoxy resin Substances 0.000 abstract 1
- 150000002148 esters Chemical class 0.000 abstract 1
- 238000009413 insulation Methods 0.000 abstract 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 abstract 1
- 229920000647 polyepoxide Polymers 0.000 abstract 1
Landscapes
- Chemical & Material Sciences (AREA)
- Laminated Bodies (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
Abstract
The topic of the present invention is to provide a resin sheet (metal foil attached with resin) to suppress the reduction of peeling strength between the insulation layer and circuits at high temperature and high-humidity environment caused by HAST (Highly Accelerated temperature and humidity Stress Test), even in the condition that the metal foil having the surface with low roughness is applied. The solution of the present invention is to provide a resin sheet by using Subtractive method or Modified semi-additive method to form circuits. Its feature to comprises a metal foil having the first and second main surfaces, a resin layer joining with the first main surface of metal foil. The arithmetic average roughness (Ra) of the first main surface of metal foil is less than 300nm, the thickness of resin layer is 8[mu]m-400[mu]m, the resin layer comprises a curing agent selected from one or more groups from (a) Epoxy resin, (b) Active ester series curing agent, and phenolic curing agent containing the Triazine structure.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014-156976 | 2014-07-31 | ||
| JP2014156976A JP6459279B2 (en) | 2014-07-31 | 2014-07-31 | Resin sheet |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201612005A true TW201612005A (en) | 2016-04-01 |
| TWI677430B TWI677430B (en) | 2019-11-21 |
Family
ID=55357277
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW104121694A TWI677430B (en) | 2014-07-31 | 2015-07-03 | Resin sheet |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6459279B2 (en) |
| KR (1) | KR102387485B1 (en) |
| TW (1) | TWI677430B (en) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6672953B2 (en) * | 2016-03-29 | 2020-03-25 | 味の素株式会社 | Resin sheet |
| JP6724474B2 (en) * | 2016-03-29 | 2020-07-15 | 味の素株式会社 | Resin sheet |
| JP6870544B2 (en) * | 2017-09-04 | 2021-05-12 | 味の素株式会社 | Resin composition |
| KR102196881B1 (en) * | 2017-12-11 | 2020-12-30 | 주식회사 엘지화학 | Thermosetting composition for coating metal thin film and metal film using the same |
| JP7225553B2 (en) * | 2018-03-30 | 2023-02-21 | 住友ベークライト株式会社 | Resin sheet for forming solder resist |
| JP7206613B2 (en) * | 2018-04-02 | 2023-01-18 | 味の素株式会社 | resin composition |
| JP7351080B2 (en) * | 2018-12-06 | 2023-09-27 | 住友ベークライト株式会社 | Semiconductor encapsulant and semiconductor device |
| JP7768121B2 (en) * | 2022-12-28 | 2025-11-12 | 味の素株式会社 | resin composition |
| JP7673762B2 (en) * | 2023-02-24 | 2025-05-09 | 味の素株式会社 | Metal foil laminate for use in current collecting layer and method for producing same |
| WO2025234697A1 (en) * | 2024-05-07 | 2025-11-13 | 주식회사 엘지화학 | Resin composition, and insulating film and printed circuit board including same |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10178253A (en) * | 1996-12-17 | 1998-06-30 | Santa Keikinzoku Kogyo Kk | Laminated body for wiring board and its manufacture |
| JP4407680B2 (en) | 2002-03-05 | 2010-02-03 | 日立化成工業株式会社 | Copper foil with resin, printed wiring board using the same, and manufacturing method thereof |
| JP4725704B2 (en) * | 2003-05-27 | 2011-07-13 | 味の素株式会社 | Resin composition for interlayer insulation of multilayer printed wiring board, adhesive film and prepreg |
| JP5011641B2 (en) * | 2004-01-28 | 2012-08-29 | 味の素株式会社 | Thermosetting resin composition, adhesive film using the same, and multilayer printed wiring board |
| JP2007073834A (en) * | 2005-09-08 | 2007-03-22 | Shinko Electric Ind Co Ltd | Method for forming wiring on insulating resin layer |
| JP5482524B2 (en) * | 2009-07-14 | 2014-05-07 | 味の素株式会社 | Copper clad laminate |
| TWI657730B (en) * | 2012-05-31 | 2019-04-21 | 日商味之素股份有限公司 | Multilayer printed wiring board manufacturing method |
| JP6085919B2 (en) * | 2012-08-31 | 2017-03-01 | 味の素株式会社 | Film with ultra-thin copper layer, adhesive film with ultra-thin copper layer, manufacturing method thereof, copper-clad laminate, and wiring board |
| JP6028587B2 (en) * | 2013-01-18 | 2016-11-16 | 味の素株式会社 | Resin composition |
-
2014
- 2014-07-31 JP JP2014156976A patent/JP6459279B2/en active Active
-
2015
- 2015-07-03 TW TW104121694A patent/TWI677430B/en active
- 2015-07-30 KR KR1020150107985A patent/KR102387485B1/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2016033994A (en) | 2016-03-10 |
| KR102387485B1 (en) | 2022-04-18 |
| JP6459279B2 (en) | 2019-01-30 |
| KR20160016664A (en) | 2016-02-15 |
| TWI677430B (en) | 2019-11-21 |
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