TW201614009A - Curable composition and method for manufacturing the same - Google Patents

Curable composition and method for manufacturing the same

Info

Publication number
TW201614009A
TW201614009A TW104114106A TW104114106A TW201614009A TW 201614009 A TW201614009 A TW 201614009A TW 104114106 A TW104114106 A TW 104114106A TW 104114106 A TW104114106 A TW 104114106A TW 201614009 A TW201614009 A TW 201614009A
Authority
TW
Taiwan
Prior art keywords
curable composition
manufacturing
same
average unit
unit formula
Prior art date
Application number
TW104114106A
Other languages
Chinese (zh)
Other versions
TWI558773B (en
Inventor
Chih-Chiang Yang
Hsien-Fan Chen
Feng-Yi Wang
Original Assignee
Eternal Materials Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US14/266,176 external-priority patent/US8895662B2/en
Priority claimed from US14/266,262 external-priority patent/US9045639B2/en
Application filed by Eternal Materials Co Ltd filed Critical Eternal Materials Co Ltd
Publication of TW201614009A publication Critical patent/TW201614009A/en
Application granted granted Critical
Publication of TWI558773B publication Critical patent/TWI558773B/en

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  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Led Device Packages (AREA)

Abstract

A curable composition includes the following: (A) a polymer having an average unit formula (I'): [(R")2SiO2/2]a"[(CH2=CH)(R")2SiO1/2]b"[R"SiO3/2]c"[O1/2Si(R")2(CH2CH2)(R")2SiO1/2]e"; (B) a branched organopolysiloxane having an average unit formula (VI) (R4SiO3/2)x(SiO4/2)y[(R8)3SiO1/2]1-x-y; (C) an organopolysiloxane having an average unit formula (II) being capped with H: (R52SiO2/2)f(R63SiO1/2)g(R7SiO3/2)h(SiO4/2)i(CH2CH2)j; and (D) a catalyst, wherein R", R4 to R8, x, y, a" to c", e" and f to j are as defined in the specification.
TW104114106A 2014-04-30 2015-04-30 Curable composition and method for manufacturing the same TWI558773B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/266,176 US8895662B2 (en) 2010-12-31 2014-04-30 Curable composition and method for manufacturing the same
US14/266,262 US9045639B2 (en) 2010-12-31 2014-04-30 Curable composition and method for manufacturing the same

Publications (2)

Publication Number Publication Date
TW201614009A true TW201614009A (en) 2016-04-16
TWI558773B TWI558773B (en) 2016-11-21

Family

ID=54445242

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104114106A TWI558773B (en) 2014-04-30 2015-04-30 Curable composition and method for manufacturing the same

Country Status (3)

Country Link
JP (1) JP6086396B2 (en)
CN (1) CN105038253B (en)
TW (1) TWI558773B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6452545B2 (en) * 2015-05-20 2019-01-16 株式会社ダイセル Curable silicone resin composition and cured product thereof
JP6496193B2 (en) * 2015-06-02 2019-04-03 株式会社ダイセル Curable silicone resin composition, cured product thereof, and optical semiconductor device
DE102015225906A1 (en) 2015-12-18 2017-06-22 Wacker Chemie Ag Siloxanharzzusammensetzungen
CN106633076B (en) * 2016-12-29 2017-12-19 广州市斯洛柯高分子聚合物有限公司 A kind of silicone elastomer gels and preparation method thereof
JP6981938B2 (en) * 2018-08-28 2021-12-17 信越化学工業株式会社 Additive curable silicone compositions and semiconductor devices
CN115678497B (en) * 2023-01-04 2025-05-06 北京康美特科技股份有限公司 Silicone encapsulation adhesive for micro LED components and encapsulation method and application thereof

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5148088B2 (en) * 2006-08-25 2013-02-20 東レ・ダウコーニング株式会社 Curable organopolysiloxane composition and semiconductor device
JP2010013503A (en) * 2008-07-01 2010-01-21 Showa Highpolymer Co Ltd Curable resin composition and opto device
TWI435914B (en) * 2010-12-31 2014-05-01 Eternal Chemical Co Ltd Curable organic polyoxane composition and preparation method thereof
JP5751214B2 (en) * 2012-03-13 2015-07-22 信越化学工業株式会社 Curable silicone resin composition, cured product thereof and optical semiconductor device

Also Published As

Publication number Publication date
JP6086396B2 (en) 2017-03-01
JP2015212380A (en) 2015-11-26
CN105038253B (en) 2018-07-13
TWI558773B (en) 2016-11-21
CN105038253A (en) 2015-11-11

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