TW201614082A - Edge exclusion mask, and method and apparatus for layer deposition on substrate by using the same - Google Patents

Edge exclusion mask, and method and apparatus for layer deposition on substrate by using the same

Info

Publication number
TW201614082A
TW201614082A TW104118849A TW104118849A TW201614082A TW 201614082 A TW201614082 A TW 201614082A TW 104118849 A TW104118849 A TW 104118849A TW 104118849 A TW104118849 A TW 104118849A TW 201614082 A TW201614082 A TW 201614082A
Authority
TW
Taiwan
Prior art keywords
substrate
layer deposition
same
exclusion mask
edge exclusion
Prior art date
Application number
TW104118849A
Other languages
Chinese (zh)
Other versions
TWI652361B (en
Inventor
Simon Lau
Ralph Lindenberg
Markus Hanika
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of TW201614082A publication Critical patent/TW201614082A/en
Application granted granted Critical
Publication of TWI652361B publication Critical patent/TWI652361B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/04—Coating on selected surface areas, e.g. using masks
    • C23C16/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)
  • Chemical Vapour Deposition (AREA)

Abstract

An edge exclusion mask for layer deposition on a substrate is described. The edge exclusion mask includes an edge region with an edge, wherein the edge is adapted to have an inclination angle with respect to the substrate of 20 DEG or less.
TW104118849A 2014-06-13 2015-06-11 Edge exclusion mask, and method and apparatus for layer deposition on substrate by using the same TWI652361B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
PCT/EP2014/062422 WO2015188879A1 (en) 2014-06-13 2014-06-13 Flat edge design for better uniformity and increased edge lifetime
??PCT/EP2014/062422 2014-06-13

Publications (2)

Publication Number Publication Date
TW201614082A true TW201614082A (en) 2016-04-16
TWI652361B TWI652361B (en) 2019-03-01

Family

ID=50942285

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104118849A TWI652361B (en) 2014-06-13 2015-06-11 Edge exclusion mask, and method and apparatus for layer deposition on substrate by using the same

Country Status (5)

Country Link
JP (1) JP6357252B2 (en)
KR (1) KR101942011B1 (en)
CN (1) CN106460147B (en)
TW (1) TWI652361B (en)
WO (1) WO2015188879A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11211233B2 (en) 2018-09-28 2021-12-28 Shibaura Mechatronics Corporation Film formation apparatus

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3058075B1 (en) * 2016-11-02 2019-05-10 Commissariat A L'energie Atomique Et Aux Energies Alternatives DETOURAGE PLATFORM HAVING A REMOVABLE PART
US10468221B2 (en) * 2017-09-27 2019-11-05 Applied Materials, Inc. Shadow frame with sides having a varied profile for improved deposition uniformity
JP7013533B1 (en) 2020-08-06 2022-02-15 ヤス カンパニー リミテッド Optimized length mask frame
CN222648077U (en) * 2021-09-20 2025-03-21 应用材料公司 Mask frame support element, edge exclusion mask, mask frame element, substrate support, and substrate processing apparatus

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1060624A (en) * 1996-08-20 1998-03-03 Matsushita Electric Ind Co Ltd Sputtering equipment
JP3449459B2 (en) * 1997-06-02 2003-09-22 株式会社ジャパンエナジー Method for manufacturing member for thin film forming apparatus and member for the apparatus
US6051122A (en) * 1997-08-21 2000-04-18 Applied Materials, Inc. Deposition shield assembly for a semiconductor wafer processing system
JP2000017422A (en) * 1998-07-07 2000-01-18 Toray Ind Inc Mask for patterning conductive film
JP2000119841A (en) * 1998-10-12 2000-04-25 Toray Ind Inc Mask for patterning conductive film
US7670436B2 (en) * 2004-11-03 2010-03-02 Applied Materials, Inc. Support ring assembly
US7579067B2 (en) * 2004-11-24 2009-08-25 Applied Materials, Inc. Process chamber component with layered coating and method
SG177902A1 (en) * 2006-12-19 2012-02-28 Applied Materials Inc Non-contact process kit
DE102009034532A1 (en) * 2009-07-23 2011-02-03 Msg Lithoglas Ag Process for producing a structured coating on a substrate, coated substrate and semifinished product with a coated substrate
EP2423350B1 (en) * 2010-08-27 2013-07-31 Applied Materials, Inc. Carrier for a substrate and a method for assembling the same
CN201826007U (en) * 2010-10-14 2011-05-11 北京京东方光电科技有限公司 Anti-adhesion plate and membrane deposition equipment
CN105177519B (en) * 2010-10-29 2018-03-27 应用材料公司 Deposition ring and electrostatic chuck for physical vapor deposition chamber
CN201962346U (en) * 2010-11-09 2011-09-07 宁波江丰电子材料有限公司 Anti-adhesion plate structure for vacuum sputtering
KR101283315B1 (en) * 2010-12-28 2013-07-09 엘지디스플레이 주식회사 Mask
CN103890226A (en) * 2011-08-09 2014-06-25 应用材料公司 Adjustable mask
EP2748349A1 (en) 2011-08-25 2014-07-02 Applied Materials, Inc. Corner cut mask
US10676817B2 (en) * 2012-04-05 2020-06-09 Applied Materials, Inc. Flip edge shadow frame
WO2013151786A1 (en) * 2012-04-05 2013-10-10 Applied Materials, Inc. Flip edge shadow frame

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11211233B2 (en) 2018-09-28 2021-12-28 Shibaura Mechatronics Corporation Film formation apparatus
TWI783178B (en) * 2018-09-28 2022-11-11 日商芝浦機械電子裝置股份有限公司 Film forming device
TWI817764B (en) * 2018-09-28 2023-10-01 日商芝浦機械電子裝置股份有限公司 Film forming device

Also Published As

Publication number Publication date
TWI652361B (en) 2019-03-01
WO2015188879A1 (en) 2015-12-17
JP2017519109A (en) 2017-07-13
JP6357252B2 (en) 2018-07-11
CN106460147B (en) 2020-02-11
KR20170016968A (en) 2017-02-14
KR101942011B1 (en) 2019-01-25
CN106460147A (en) 2017-02-22

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