TW201614103A - Palladium plating solution and palladium coating obtained using same - Google Patents
Palladium plating solution and palladium coating obtained using sameInfo
- Publication number
- TW201614103A TW201614103A TW104128989A TW104128989A TW201614103A TW 201614103 A TW201614103 A TW 201614103A TW 104128989 A TW104128989 A TW 104128989A TW 104128989 A TW104128989 A TW 104128989A TW 201614103 A TW201614103 A TW 201614103A
- Authority
- TW
- Taiwan
- Prior art keywords
- group
- palladium
- coating
- plating solution
- palladium plating
- Prior art date
Links
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 title abstract 20
- 229910052763 palladium Inorganic materials 0.000 title abstract 10
- 239000011248 coating agent Substances 0.000 title abstract 6
- 238000000576 coating method Methods 0.000 title abstract 6
- 238000007747 plating Methods 0.000 title abstract 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract 2
- 125000000217 alkyl group Chemical group 0.000 abstract 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
- 229910000881 Cu alloy Inorganic materials 0.000 abstract 1
- 229910000990 Ni alloy Inorganic materials 0.000 abstract 1
- 125000004453 alkoxycarbonyl group Chemical group 0.000 abstract 1
- 125000005138 alkoxysulfonyl group Chemical group 0.000 abstract 1
- 125000003282 alkyl amino group Chemical group 0.000 abstract 1
- 125000003277 amino group Chemical group 0.000 abstract 1
- 125000003118 aryl group Chemical group 0.000 abstract 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
- 125000004093 cyano group Chemical group *C#N 0.000 abstract 1
- 230000002950 deficient Effects 0.000 abstract 1
- 125000004663 dialkyl amino group Chemical group 0.000 abstract 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract 1
- 229910052737 gold Inorganic materials 0.000 abstract 1
- 239000010931 gold Substances 0.000 abstract 1
- 229910052759 nickel Inorganic materials 0.000 abstract 1
- 229910052757 nitrogen Inorganic materials 0.000 abstract 1
- 125000004433 nitrogen atom Chemical group N* 0.000 abstract 1
- 150000002940 palladium Chemical class 0.000 abstract 1
- -1 pyridinium compound Chemical class 0.000 abstract 1
- 125000001424 substituent group Chemical group 0.000 abstract 1
- 125000000020 sulfo group Chemical group O=S(=O)([*])O[H] 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
- C23C18/44—Coating with noble metals using reducing agents
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/52—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32 - C23C18/50
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/50—Electroplating: Baths therefor from solutions of platinum group metals
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Electrochemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Chemically Coating (AREA)
- Pyridine Compounds (AREA)
Abstract
The present invention addresses the problem of providing a palladium plating solution in which occurrence of defective parts such as pin holes on a palladium coating is reduced, and in which heat resistance performance equivalent to that obtained conventionally can be obtained even when a gold plating coating formed on the palladium coating is made thinner. The problem was overcome by: a palladium plating solution containing a soluble palladium salt as a palladium source, and a specific pyridinium compound in which an alkyl group is bonded to a nitrogen atom at the 1-position and one to five of the 2- to 6-positions are substituted with one or more specific substituents selected from the group consisting of an alkyl group, an aryl group, a carboxy group, an alkoxycarbonyl group, a sulfo group, an alkoxy sulfonyl group, an amino group, an alkylamino group, a dialkylamino group, and a cyano group; and a palladium coating obtained by performing palladium plating on a nickel, nickel alloy, copper, or copper alloy coating using the palladium plating solution.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014180462 | 2014-09-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201614103A true TW201614103A (en) | 2016-04-16 |
Family
ID=55439710
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW104128989A TW201614103A (en) | 2014-09-04 | 2015-09-02 | Palladium plating solution and palladium coating obtained using same |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP6620103B2 (en) |
| KR (1) | KR102482321B1 (en) |
| CN (1) | CN106661735B (en) |
| TW (1) | TW201614103A (en) |
| WO (1) | WO2016035645A1 (en) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6432575B2 (en) | 2016-08-30 | 2018-12-05 | 日亜化学工業株式会社 | Light emitting device |
| IT201700084504A1 (en) * | 2017-07-25 | 2019-01-25 | Valmet Plating S R L | GALVANIC BATHROOM, ELECTRODEPTIFICATION PROCEDURE USING THE GALVANIC BATH AND METALLIC ALLOY OBTAINABLE THROUGH THAT PROCEDURE |
| US20190382901A1 (en) * | 2018-06-15 | 2019-12-19 | Rohm And Haas Electronic Materials Llc | Electroless copper plating compositions and methods for electroless plating copper on substrates |
| US10590541B2 (en) * | 2018-06-15 | 2020-03-17 | Rohm And Haas Electronic Materials Llc | Electroless copper plating compositions and methods for electroless plating copper on substrates |
| CN109112506B (en) * | 2018-09-18 | 2020-09-04 | 宏维科技（深圳）有限公司 | Activation inhibitor for production of fine line products and preparation method thereof |
| JP7407644B2 (en) * | 2020-04-03 | 2024-01-04 | 上村工業株式会社 | Palladium plating solution and plating method |
| CN112301334B (en) * | 2020-10-30 | 2021-09-10 | 吉安宏达秋科技有限公司 | Chemical palladium plating solution, application thereof and chemical palladium plating method |
| KR102292204B1 (en) * | 2021-01-21 | 2021-08-25 | (주)엠케이켐앤텍 | Non-cyanide electroless gold plating method and non-cyanide electroless gold plating composition |
| CN113005439B (en) * | 2021-02-24 | 2021-11-16 | 深圳市创智成功科技有限公司 | Chemical palladium plating process for electronic packaging carrier plate |
| US11901225B2 (en) * | 2021-09-14 | 2024-02-13 | Applied Materials, Inc. | Diffusion layers in metal interconnects |
| KR102802014B1 (en) * | 2022-10-11 | 2025-04-30 | 주식회사 티앤아이켐 | Palladium Plating Solution Compositions for Inhibiting Whiskers of Multi Layer Ceramic Condenser(MLCC) and Plating Methods Using Thereof |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62124280A (en) | 1985-08-21 | 1987-06-05 | Ishihara Yakuhin Kk | Electroless palladium plating solution |
| JPH05214551A (en) * | 1991-06-19 | 1993-08-24 | Ishihara Chem Co Ltd | Palladium-based electroless plating solution |
| JPH0539580A (en) | 1991-08-02 | 1993-02-19 | Okuno Seiyaku Kogyo Kk | Electroless palladium plating liquid |
| JP3609565B2 (en) * | 1996-12-09 | 2005-01-12 | 株式会社大和化成研究所 | Tin-zinc alloy plating bath |
| GB2382353B (en) * | 1999-10-27 | 2004-10-27 | Kojima Chemicals Co Ltd | Palladium Plating Solution |
| FR2807450B1 (en) * | 2000-04-06 | 2002-07-05 | Engelhard Clal Sas | ELECTROLYTIC BATH FOR ELECTROCHEMICAL DEPOSITION OF PALLADIUM OR ITS ALLOYS |
| JP4880138B2 (en) * | 2001-07-13 | 2012-02-22 | 石原薬品株式会社 | Tin plating bath, tin plating method, and electronic component tin-plated using the plating bath |
| ATE555235T1 (en) * | 2008-05-07 | 2012-05-15 | Umicore Galvanotechnik Gmbh | PD AND PD-NI ELECTROLYTE BATHS |
| JP5583896B2 (en) * | 2008-07-22 | 2014-09-03 | ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． | High-speed plating method of palladium and palladium alloy |
| CN101634021B (en) * | 2008-07-24 | 2012-11-07 | 罗门哈斯电子材料有限公司 | Electroless gold plating solution |
| CN101736330B (en) * | 2008-11-25 | 2011-11-16 | 比亚迪股份有限公司 | Method for metalizing polyimide surface |
| JP4511623B1 (en) | 2009-05-08 | 2010-07-28 | 小島化学薬品株式会社 | Electroless palladium plating solution |
| DE102010011269B4 (en) * | 2009-11-10 | 2014-02-13 | Ami Doduco Gmbh | A method of depositing a palladium layer suitable for wire bonding onto circuit traces of a circuit board and using a palladium bath in the method |
| GB201100447D0 (en) * | 2011-01-12 | 2011-02-23 | Johnson Matthey Plc | Improvements in coating technology |
-
2015
- 2015-08-26 KR KR1020177004224A patent/KR102482321B1/en active Active
- 2015-08-26 CN CN201580044246.1A patent/CN106661735B/en active Active
- 2015-08-26 JP JP2016546588A patent/JP6620103B2/en active Active
- 2015-08-26 WO PCT/JP2015/074073 patent/WO2016035645A1/en not_active Ceased
- 2015-09-02 TW TW104128989A patent/TW201614103A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| KR20170045211A (en) | 2017-04-26 |
| CN106661735B (en) | 2019-12-10 |
| JP6620103B2 (en) | 2019-12-11 |
| CN106661735A (en) | 2017-05-10 |
| JPWO2016035645A1 (en) | 2017-06-15 |
| KR102482321B1 (en) | 2022-12-27 |
| WO2016035645A1 (en) | 2016-03-10 |
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