TW201614676A - Conductive composition - Google Patents

Conductive composition

Info

Publication number
TW201614676A
TW201614676A TW104119631A TW104119631A TW201614676A TW 201614676 A TW201614676 A TW 201614676A TW 104119631 A TW104119631 A TW 104119631A TW 104119631 A TW104119631 A TW 104119631A TW 201614676 A TW201614676 A TW 201614676A
Authority
TW
Taiwan
Prior art keywords
conductive composition
epoxy resin
hardener
lactone
electrically conductive
Prior art date
Application number
TW104119631A
Other languages
English (en)
Chinese (zh)
Inventor
Hans-Werner Hagedorn
Yvonne Loewer
Tanja Dickel
Katja Stenger
Ling Xin Yong
qing wei Zhang
Sebastian Fritzsche
Michael Schaefer
Original Assignee
Heraeus Deutschland Gmbh & Co Kg
Heraeus Materials Singapore Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Heraeus Deutschland Gmbh & Co Kg, Heraeus Materials Singapore Pte Ltd filed Critical Heraeus Deutschland Gmbh & Co Kg
Publication of TW201614676A publication Critical patent/TW201614676A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5046—Amines heterocyclic
    • C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
    • C08G59/5073—Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • C08L67/04—Polyesters derived from hydroxycarboxylic acids, e.g. lactones
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0806—Silver

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Conductive Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)
TW104119631A 2014-07-29 2015-06-17 Conductive composition TW201614676A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG10201404443QA SG10201404443QA (en) 2014-07-29 2014-07-29 Conductive composition

Publications (1)

Publication Number Publication Date
TW201614676A true TW201614676A (en) 2016-04-16

Family

ID=53887172

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104119631A TW201614676A (en) 2014-07-29 2015-06-17 Conductive composition

Country Status (3)

Country Link
SG (1) SG10201404443QA (fr)
TW (1) TW201614676A (fr)
WO (1) WO2016018191A1 (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018531317A (ja) * 2015-08-08 2018-10-25 デジグナー モレキュールズ インク． 陰イオン性硬化可能な組成物
JP6983768B2 (ja) * 2015-10-15 2021-12-17 ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング 接着剤配合物中の伝導性充填材としてのニッケル及びニッケル含有合金の使用
DE102017008925A1 (de) * 2017-09-25 2019-03-28 Hexion GmbH Imprägnierharzmischung
CN112371150B (zh) * 2020-10-26 2021-09-17 厦门大学 镍铝双金属氮碳掺杂催化剂及其制备方法和其催化乙酰丙酸加氢制备γ-戊内酯的应用
KR20260030909A (ko) 2023-08-24 2026-03-06 헤라우스 매터리얼즈 싱가포르 피티이 엘티디 은 페이스트
CN118853053B (zh) * 2024-09-25 2025-01-28 上海本诺电子材料有限公司 一种具有缓慢吸收环境水汽效果的胶水及其制备方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5920371A (ja) * 1982-07-27 1984-02-02 Toyo Ink Mfg Co Ltd 導電性接着剤
JPS59130004A (ja) * 1983-01-18 1984-07-26 三井東圧化学株式会社 銀ペ−スト
KR101036353B1 (ko) * 2009-04-14 2011-05-23 엘지이노텍 주식회사 스크린 프린팅이 가능한 반도체 패키징용 접착 페이스트
CN101792627A (zh) * 2010-03-10 2010-08-04 彩虹集团公司 一种屏蔽导电油墨及其制备方法

Also Published As

Publication number Publication date
SG10201404443QA (en) 2016-02-26
WO2016018191A1 (fr) 2016-02-04

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