TW201639654A - 斜角雷射誘發向前轉印（ｌｉｆｔ）噴射裝置 - Google Patents

斜角雷射誘發向前轉印（ｌｉｆｔ）噴射裝置 Download PDF

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Publication number
TW201639654A
TW201639654A TW105101749A TW105101749A TW201639654A TW 201639654 A TW201639654 A TW 201639654A TW 105101749 A TW105101749 A TW 105101749A TW 105101749 A TW105101749 A TW 105101749A TW 201639654 A TW201639654 A TW 201639654A
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TW
Taiwan
Prior art keywords
donor
substrate
facets
donor film
droplets
Prior art date
Application number
TW105101749A
Other languages
English (en)
Chinese (zh)
Inventor
麥可 沙諾
茲維 寇特勒
Original Assignee
奧寶科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 奧寶科技有限公司 filed Critical 奧寶科技有限公司
Publication of TW201639654A publication Critical patent/TW201639654A/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/34—Laser welding for purposes other than joining
    • B23K26/342—Build-up welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/048—Coating on selected surface areas, e.g. using masks using irradiation by energy or particles
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/225—Oblique incidence of vaporised material on substrate
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/28—Vacuum evaporation by wave energy or particle radiation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/18—Deposition of organic active material using non-liquid printing techniques, e.g. thermal transfer printing from a donor sheet
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic materials
    • B23K2103/42—Plastics other than composite materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Optics & Photonics (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • General Chemical & Material Sciences (AREA)
TW105101749A 2015-01-21 2016-01-20 斜角雷射誘發向前轉印（ｌｉｆｔ）噴射裝置 TW201639654A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US201562105761P 2015-01-21 2015-01-21

Publications (1)

Publication Number Publication Date
TW201639654A true TW201639654A (zh) 2016-11-16

Family

ID=56416516

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105101749A TW201639654A (zh) 2015-01-21 2016-01-20 斜角雷射誘發向前轉印（ｌｉｆｔ）噴射裝置

Country Status (7)

Country Link
US (1) US20170306495A1 (fr)
EP (1) EP3247529A4 (fr)
KR (1) KR20170102984A (fr)
CN (1) CN107206548B (fr)
IL (1) IL253169A0 (fr)
TW (1) TW201639654A (fr)
WO (1) WO2016116921A1 (fr)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9925797B2 (en) 2014-08-07 2018-03-27 Orbotech Ltd. Lift printing system
WO2016063270A1 (fr) 2014-10-19 2016-04-28 Orbotech Ltd. Impression par transfert avant induit par laser de tracés conducteurs sur un substrat semi-conducteur
US10633758B2 (en) 2015-01-19 2020-04-28 Orbotech Ltd. Printing of three-dimensional metal structures with a sacrificial support
US10471538B2 (en) 2015-07-09 2019-11-12 Orbotech Ltd. Control of lift ejection angle
WO2017085712A1 (fr) 2015-11-22 2017-05-26 Orbotech Ltd Contrôle des propriétés de surface de structures tridimensionnelles imprimées
TW201901887A (zh) * 2017-05-24 2019-01-01 以色列商奧寶科技股份有限公司 於未事先圖樣化基板上電器互連電路元件
EP3521483A1 (fr) * 2018-02-06 2019-08-07 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO Appareil et procédé de dépôt par lift
JP7424093B2 (ja) * 2019-03-08 2024-01-30 株式会社リコー 立体造形物を造形する装置、立体造形物を造形する方法
CN113906834B (zh) 2019-05-01 2024-09-13 Io技术集团公司 用以使用3d印刷电连接芯片与顶部连接器的方法
CN120645561A (zh) * 2019-05-07 2025-09-16 奥宝科技有限公司 使用薄施体箔的lift印刷
US11446750B2 (en) 2020-02-03 2022-09-20 Io Tech Group Ltd. Systems for printing solder paste and other viscous materials at high resolution
US11622451B2 (en) 2020-02-26 2023-04-04 Io Tech Group Ltd. Systems and methods for solder paste printing on components
EP3893611A1 (fr) * 2020-04-07 2021-10-13 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk Onderzoek TNO Dépôt contrôlé d'un matériau donneur sur une surface cible
US11497124B2 (en) * 2020-06-09 2022-11-08 Io Tech Group Ltd. Methods for printing conformal materials on component edges at high resolution
US11691332B2 (en) 2020-08-05 2023-07-04 Io Tech Group Ltd. Systems and methods for 3D printing with vacuum assisted laser printing machine
CN112916873B (zh) 2021-01-26 2022-01-28 上海交通大学 基于脉冲激光驱动的微滴三维打印系统及方法

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US6805918B2 (en) 1999-01-27 2004-10-19 The United States Of America As Represented By The Secretary Of The Navy Laser forward transfer of rheological systems
US6792326B1 (en) 1999-05-24 2004-09-14 Potomac Photonics, Inc. Material delivery system for miniature structure fabrication
US7277770B2 (en) 2003-07-15 2007-10-02 Huang Wen C Direct write process and apparatus
US20050095367A1 (en) 2003-10-31 2005-05-05 Babiarz Alec J. Method of noncontact dispensing of viscous material
WO2007040141A1 (fr) * 2005-09-30 2007-04-12 Think Laboratory Co., Ltd. Rouleau a graver pour photogravure et procede de production de celui-ci
US20080084611A1 (en) * 2006-10-05 2008-04-10 Bright View Technologies, Inc. Methods and Apparatus for Creating Apertures Through Microlens Arrays Using Curved Cradles, and Products Produced Thereby
US20110089412A1 (en) * 2008-06-16 2011-04-21 Shigeo Fujimori Patterning method, production method of device using the patterning method, and device
WO2009153792A2 (fr) 2008-06-19 2009-12-23 Utilight Ltd. Formation de motifs induite par la lumière
CN102668704A (zh) * 2009-12-03 2012-09-12 东丽株式会社 供体基板、图案化方法和器件的制造方法
KR20120138472A (ko) * 2011-06-15 2012-12-26 삼성디스플레이 주식회사 레이저 열전사 장치, 레이저 열전사 방법, 및 그를 이용한 유기 발광 표시장치의 제조 방법
US9715183B2 (en) * 2012-02-23 2017-07-25 Asml Netherlands B.V. Device, lithographic apparatus, method for guiding radiation and device manufacturing method
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EP2660352A1 (fr) * 2012-05-02 2013-11-06 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Feuille donneuse et procédé de fabrication de transfert avant induit par la lumière
US9925797B2 (en) * 2014-08-07 2018-03-27 Orbotech Ltd. Lift printing system

Also Published As

Publication number Publication date
IL253169A0 (en) 2017-08-31
WO2016116921A1 (fr) 2016-07-28
EP3247529A1 (fr) 2017-11-29
EP3247529A4 (fr) 2019-01-16
KR20170102984A (ko) 2017-09-12
CN107206548B (zh) 2019-08-13
CN107206548A (zh) 2017-09-26
US20170306495A1 (en) 2017-10-26

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