TW201710384A - 用於滴下式注入法密封劑應用之可固化組合物 - Google Patents
用於滴下式注入法密封劑應用之可固化組合物 Download PDFInfo
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- TW201710384A TW201710384A TW105122091A TW105122091A TW201710384A TW 201710384 A TW201710384 A TW 201710384A TW 105122091 A TW105122091 A TW 105122091A TW 105122091 A TW105122091 A TW 105122091A TW 201710384 A TW201710384 A TW 201710384A
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- aryl
- cycloalkyl
- substrate
- alkyl
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- 239000000203 mixture Substances 0.000 title claims abstract description 66
- 239000000565 sealant Substances 0.000 title claims abstract description 23
- 239000004973 liquid crystal related substance Substances 0.000 claims abstract description 35
- 229920005989 resin Polymers 0.000 claims abstract description 33
- 239000011347 resin Substances 0.000 claims abstract description 33
- 125000003118 aryl group Chemical group 0.000 claims description 118
- 125000000217 alkyl group Chemical group 0.000 claims description 88
- 125000000753 cycloalkyl group Chemical group 0.000 claims description 77
- 239000000758 substrate Substances 0.000 claims description 56
- -1 tricycloalkyl Chemical group 0.000 claims description 50
- 239000003795 chemical substances by application Substances 0.000 claims description 25
- 125000003710 aryl alkyl group Chemical group 0.000 claims description 24
- 239000003999 initiator Substances 0.000 claims description 24
- 125000000592 heterocycloalkyl group Chemical group 0.000 claims description 23
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 18
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 17
- 150000001602 bicycloalkyls Chemical group 0.000 claims description 16
- 125000005647 linker group Chemical group 0.000 claims description 16
- 125000000623 heterocyclic group Chemical group 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 14
- 125000003342 alkenyl group Chemical group 0.000 claims description 13
- 125000002947 alkylene group Chemical group 0.000 claims description 13
- 229910052717 sulfur Inorganic materials 0.000 claims description 13
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 claims description 11
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 10
- 239000000945 filler Substances 0.000 claims description 10
- 150000002430 hydrocarbons Chemical group 0.000 claims description 10
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 10
- 238000007789 sealing Methods 0.000 claims description 10
- 239000007822 coupling agent Substances 0.000 claims description 9
- 238000010438 heat treatment Methods 0.000 claims description 8
- 238000002347 injection Methods 0.000 claims description 8
- 239000007924 injection Substances 0.000 claims description 8
- 230000005855 radiation Effects 0.000 claims description 8
- 239000011342 resin composition Substances 0.000 claims description 8
- 239000003086 colorant Substances 0.000 claims description 7
- 239000003085 diluting agent Substances 0.000 claims description 7
- 150000002148 esters Chemical class 0.000 claims description 7
- 239000000314 lubricant Substances 0.000 claims description 7
- 239000003755 preservative agent Substances 0.000 claims description 7
- 239000004094 surface-active agent Substances 0.000 claims description 7
- 125000001931 aliphatic group Chemical group 0.000 claims description 6
- 235000010290 biphenyl Nutrition 0.000 claims description 6
- 239000004305 biphenyl Substances 0.000 claims description 6
- 239000004014 plasticizer Substances 0.000 claims description 6
- 125000002723 alicyclic group Chemical group 0.000 claims description 5
- 125000002252 acyl group Chemical group 0.000 claims description 4
- 150000005215 alkyl ethers Chemical class 0.000 claims description 4
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 claims description 4
- 229910052736 halogen Inorganic materials 0.000 claims description 4
- 150000002367 halogens Chemical class 0.000 claims description 4
- 125000005842 heteroatom Chemical group 0.000 claims description 4
- 125000001424 substituent group Chemical group 0.000 claims description 4
- 125000000101 thioether group Chemical group 0.000 claims description 4
- 239000003381 stabilizer Substances 0.000 claims description 3
- 125000005587 carbonate group Chemical group 0.000 claims description 2
- 125000004367 cycloalkylaryl group Chemical group 0.000 claims description 2
- 125000001033 ether group Chemical group 0.000 claims description 2
- 125000000524 functional group Chemical group 0.000 claims description 2
- 125000001183 hydrocarbyl group Chemical group 0.000 claims description 2
- 150000003568 thioethers Chemical class 0.000 claims description 2
- 239000013008 thixotropic agent Substances 0.000 claims description 2
- 239000012745 toughening agent Substances 0.000 claims 5
- 230000002335 preservative effect Effects 0.000 claims 4
- 230000006641 stabilisation Effects 0.000 claims 4
- 238000011105 stabilization Methods 0.000 claims 4
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 claims 1
- 150000001335 aliphatic alkanes Chemical class 0.000 claims 1
- 125000005257 alkyl acyl group Chemical group 0.000 claims 1
- 125000006267 biphenyl group Chemical group 0.000 claims 1
- 125000004149 thio group Chemical group *S* 0.000 claims 1
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 abstract 1
- 229920003192 poly(bis maleimide) Polymers 0.000 abstract 1
- 229920000647 polyepoxide Polymers 0.000 description 31
- 239000003822 epoxy resin Substances 0.000 description 23
- 239000004593 Epoxy Substances 0.000 description 19
- 239000000126 substance Substances 0.000 description 19
- 150000001875 compounds Chemical class 0.000 description 15
- FVCSARBUZVPSQF-UHFFFAOYSA-N 5-(2,4-dioxooxolan-3-yl)-7-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C(C(OC2=O)=O)C2C(C)=CC1C1C(=O)COC1=O FVCSARBUZVPSQF-UHFFFAOYSA-N 0.000 description 14
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 13
- 238000001723 curing Methods 0.000 description 11
- 239000002966 varnish Substances 0.000 description 10
- 239000005011 phenolic resin Substances 0.000 description 9
- 238000009472 formulation Methods 0.000 description 7
- 150000003254 radicals Chemical class 0.000 description 7
- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 description 6
- 239000000654 additive Substances 0.000 description 5
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 4
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 4
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 229910000420 cerium oxide Inorganic materials 0.000 description 3
- 238000000354 decomposition reaction Methods 0.000 description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 3
- 239000011256 inorganic filler Substances 0.000 description 3
- 229910003475 inorganic filler Inorganic materials 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 239000012766 organic filler Substances 0.000 description 3
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000000454 talc Substances 0.000 description 3
- 229910052623 talc Inorganic materials 0.000 description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 2
- WOCGGVRGNIEDSZ-UHFFFAOYSA-N 4-[2-(4-hydroxy-3-prop-2-enylphenyl)propan-2-yl]-2-prop-2-enylphenol Chemical compound C=1C=C(O)C(CC=C)=CC=1C(C)(C)C1=CC=C(O)C(CC=C)=C1 WOCGGVRGNIEDSZ-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- DJUWPHRCMMMSCV-UHFFFAOYSA-N bis(7-oxabicyclo[4.1.0]heptan-4-ylmethyl) hexanedioate Chemical compound C1CC2OC2CC1COC(=O)CCCCC(=O)OCC1CC2OC2CC1 DJUWPHRCMMMSCV-UHFFFAOYSA-N 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- RWGFKTVRMDUZSP-UHFFFAOYSA-N cumene Chemical compound CC(C)C1=CC=CC=C1 RWGFKTVRMDUZSP-UHFFFAOYSA-N 0.000 description 2
- HGCIXCUEYOPUTN-UHFFFAOYSA-N cyclohexene Chemical compound C1CCC=CC1 HGCIXCUEYOPUTN-UHFFFAOYSA-N 0.000 description 2
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 2
- 239000008393 encapsulating agent Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 230000005012 migration Effects 0.000 description 2
- 238000013508 migration Methods 0.000 description 2
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 2
- 150000001451 organic peroxides Chemical class 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 239000004848 polyfunctional curative Substances 0.000 description 2
- 229920005862 polyol Polymers 0.000 description 2
- 230000009257 reactivity Effects 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- 239000012812 sealant material Substances 0.000 description 2
- 238000003786 synthesis reaction Methods 0.000 description 2
- GJBRNHKUVLOCEB-UHFFFAOYSA-N tert-butyl benzenecarboperoxoate Chemical compound CC(C)(C)OOC(=O)C1=CC=CC=C1 GJBRNHKUVLOCEB-UHFFFAOYSA-N 0.000 description 2
- HGTUJZTUQFXBIH-UHFFFAOYSA-N (2,3-dimethyl-3-phenylbutan-2-yl)benzene Chemical compound C=1C=CC=CC=1C(C)(C)C(C)(C)C1=CC=CC=C1 HGTUJZTUQFXBIH-UHFFFAOYSA-N 0.000 description 1
- ORMDVQRBTFCOGC-UHFFFAOYSA-N (2-hydroperoxy-4-methylpentan-2-yl)benzene Chemical compound CC(C)CC(C)(OO)C1=CC=CC=C1 ORMDVQRBTFCOGC-UHFFFAOYSA-N 0.000 description 1
- HGXJDMCMYLEZMJ-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy 2,2-dimethylpropaneperoxoate Chemical compound CC(C)(C)OOOC(=O)C(C)(C)C HGXJDMCMYLEZMJ-UHFFFAOYSA-N 0.000 description 1
- HCXVPNKIBYLBIT-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy 3,5,5-trimethylhexaneperoxoate Chemical compound CC(C)(C)CC(C)CC(=O)OOOC(C)(C)C HCXVPNKIBYLBIT-UHFFFAOYSA-N 0.000 description 1
- KDGNCLDCOVTOCS-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy propan-2-yl carbonate Chemical compound CC(C)OC(=O)OOC(C)(C)C KDGNCLDCOVTOCS-UHFFFAOYSA-N 0.000 description 1
- ZEMGLXWBJVLTKT-UHFFFAOYSA-N (6-methyl-7-oxabicyclo[4.1.0]heptan-4-yl)methyl 6-methyl-7-oxabicyclo[4.1.0]heptane-4-carboxylate Chemical compound C1CC2OC2(C)CC1C(=O)OCC1CC(C)(O2)C2CC1 ZEMGLXWBJVLTKT-UHFFFAOYSA-N 0.000 description 1
- HSLFISVKRDQEBY-UHFFFAOYSA-N 1,1-bis(tert-butylperoxy)cyclohexane Chemical compound CC(C)(C)OOC1(OOC(C)(C)C)CCCCC1 HSLFISVKRDQEBY-UHFFFAOYSA-N 0.000 description 1
- BEQKKZICTDFVMG-UHFFFAOYSA-N 1,2,3,4,6-pentaoxepane-5,7-dione Chemical compound O=C1OOOOC(=O)O1 BEQKKZICTDFVMG-UHFFFAOYSA-N 0.000 description 1
- CCNDOQHYOIISTA-UHFFFAOYSA-N 1,2-bis(2-tert-butylperoxypropan-2-yl)benzene Chemical compound CC(C)(C)OOC(C)(C)C1=CC=CC=C1C(C)(C)OOC(C)(C)C CCNDOQHYOIISTA-UHFFFAOYSA-N 0.000 description 1
- OKIRBHVFJGXOIS-UHFFFAOYSA-N 1,2-di(propan-2-yl)benzene Chemical compound CC(C)C1=CC=CC=C1C(C)C OKIRBHVFJGXOIS-UHFFFAOYSA-N 0.000 description 1
- PAOHAQSLJSMLAT-UHFFFAOYSA-N 1-butylperoxybutane Chemical compound CCCCOOCCCC PAOHAQSLJSMLAT-UHFFFAOYSA-N 0.000 description 1
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 description 1
- KGRVJHAUYBGFFP-UHFFFAOYSA-N 2,2'-Methylenebis(4-methyl-6-tert-butylphenol) Chemical compound CC(C)(C)C1=CC(C)=CC(CC=2C(=C(C=C(C)C=2)C(C)(C)C)O)=C1O KGRVJHAUYBGFFP-UHFFFAOYSA-N 0.000 description 1
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 1
- CRJIYMRJTJWVLU-UHFFFAOYSA-N 2,4,4-trimethylpentan-2-yl 3-(5,5-dimethylhexyl)dioxirane-3-carboxylate Chemical compound CC(C)(C)CCCCC1(C(=O)OC(C)(C)CC(C)(C)C)OO1 CRJIYMRJTJWVLU-UHFFFAOYSA-N 0.000 description 1
- QNLVSEVOEORLBH-UHFFFAOYSA-N 2,5-bis(2-ethylhexylperoxy)-2,5-dimethylhexane Chemical compound CCCCC(CC)COOC(C)(C)CCC(C)(C)OOCC(CC)CCCC QNLVSEVOEORLBH-UHFFFAOYSA-N 0.000 description 1
- DMWVYCCGCQPJEA-UHFFFAOYSA-N 2,5-bis(tert-butylperoxy)-2,5-dimethylhexane Chemical compound CC(C)(C)OOC(C)(C)CCC(C)(C)OOC(C)(C)C DMWVYCCGCQPJEA-UHFFFAOYSA-N 0.000 description 1
- PFHOSZAOXCYAGJ-UHFFFAOYSA-N 2-[(2-cyano-4-methoxy-4-methylpentan-2-yl)diazenyl]-4-methoxy-2,4-dimethylpentanenitrile Chemical compound COC(C)(C)CC(C)(C#N)N=NC(C)(C#N)CC(C)(C)OC PFHOSZAOXCYAGJ-UHFFFAOYSA-N 0.000 description 1
- WYGWHHGCAGTUCH-UHFFFAOYSA-N 2-[(2-cyano-4-methylpentan-2-yl)diazenyl]-2,4-dimethylpentanenitrile Chemical compound CC(C)CC(C)(C#N)N=NC(C)(C#N)CC(C)C WYGWHHGCAGTUCH-UHFFFAOYSA-N 0.000 description 1
- FIYMNUNPPYABMU-UHFFFAOYSA-N 2-benzyl-5-chloro-1h-indole Chemical compound C=1C2=CC(Cl)=CC=C2NC=1CC1=CC=CC=C1 FIYMNUNPPYABMU-UHFFFAOYSA-N 0.000 description 1
- TZLVUWBGUNVFES-UHFFFAOYSA-N 2-ethyl-5-methylpyrazol-3-amine Chemical compound CCN1N=C(C)C=C1N TZLVUWBGUNVFES-UHFFFAOYSA-N 0.000 description 1
- 239000004808 2-ethylhexylester Substances 0.000 description 1
- WFUGQJXVXHBTEM-UHFFFAOYSA-N 2-hydroperoxy-2-(2-hydroperoxybutan-2-ylperoxy)butane Chemical compound CCC(C)(OO)OOC(C)(CC)OO WFUGQJXVXHBTEM-UHFFFAOYSA-N 0.000 description 1
- LYPGJGCIPQYQBW-UHFFFAOYSA-N 2-methyl-2-[[2-methyl-1-oxo-1-(prop-2-enylamino)propan-2-yl]diazenyl]-n-prop-2-enylpropanamide Chemical compound C=CCNC(=O)C(C)(C)N=NC(C)(C)C(=O)NCC=C LYPGJGCIPQYQBW-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- BIISIZOQPWZPPS-UHFFFAOYSA-N 2-tert-butylperoxypropan-2-ylbenzene Chemical compound CC(C)(C)OOC(C)(C)C1=CC=CC=C1 BIISIZOQPWZPPS-UHFFFAOYSA-N 0.000 description 1
- QPIRYFWCAHUZTB-UHFFFAOYSA-N 3,5,5-trimethyl-1-(3,5,5-trimethylhexylperoxy)hexane Chemical compound CC(C)(C)CC(C)CCOOCCC(C)CC(C)(C)C QPIRYFWCAHUZTB-UHFFFAOYSA-N 0.000 description 1
- XYFRHHAYSXIKGH-UHFFFAOYSA-N 3-(5-methoxy-2-methoxycarbonyl-1h-indol-3-yl)prop-2-enoic acid Chemical compound C1=C(OC)C=C2C(C=CC(O)=O)=C(C(=O)OC)NC2=C1 XYFRHHAYSXIKGH-UHFFFAOYSA-N 0.000 description 1
- BDCLTORUANJIBT-UHFFFAOYSA-N 3-butylperoxy-1,1,5-trimethylcyclohexane Chemical compound CCCCOOC1CC(C)CC(C)(C)C1 BDCLTORUANJIBT-UHFFFAOYSA-N 0.000 description 1
- RLRILSHEPYHXOG-UHFFFAOYSA-N 3-methoxybutoxycarbonyloxy 3-methoxybutyl carbonate Chemical compound COC(C)CCOC(=O)OOC(=O)OCCC(C)OC RLRILSHEPYHXOG-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- ZHKCHSNXUCRFSM-UHFFFAOYSA-N 4-[2-[4,4-bis(tert-butylperoxy)cyclohexyl]propan-2-yl]-1,1-bis(tert-butylperoxy)cyclohexane Chemical compound C1CC(OOC(C)(C)C)(OOC(C)(C)C)CCC1C(C)(C)C1CCC(OOC(C)(C)C)(OOC(C)(C)C)CC1 ZHKCHSNXUCRFSM-UHFFFAOYSA-N 0.000 description 1
- YPIFGDQKSSMYHQ-UHFFFAOYSA-M 7,7-dimethyloctanoate Chemical compound CC(C)(C)CCCCCC([O-])=O YPIFGDQKSSMYHQ-UHFFFAOYSA-M 0.000 description 1
- NHJIDZUQMHKGRE-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]heptan-4-yl 2-(7-oxabicyclo[4.1.0]heptan-4-yl)acetate Chemical compound C1CC2OC2CC1OC(=O)CC1CC2OC2CC1 NHJIDZUQMHKGRE-UHFFFAOYSA-N 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical class C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 1
- DEXQLHHLIPGWGA-UHFFFAOYSA-N C1C(OC=O)C(C)CC2OC21 Chemical compound C1C(OC=O)C(C)CC2OC21 DEXQLHHLIPGWGA-UHFFFAOYSA-N 0.000 description 1
- SVPSQHVJVODCRN-UHFFFAOYSA-N C=CC.C(C(C)C)OOCC(C)C Chemical group C=CC.C(C(C)C)OOCC(C)C SVPSQHVJVODCRN-UHFFFAOYSA-N 0.000 description 1
- SYYUTBXIBOGMAW-UHFFFAOYSA-N CCCCCCCCCCCCOC(=O)OOC(O)=O Chemical compound CCCCCCCCCCCCOC(=O)OOC(O)=O SYYUTBXIBOGMAW-UHFFFAOYSA-N 0.000 description 1
- WSNMPAVSZJSIMT-UHFFFAOYSA-N COc1c(C)c2COC(=O)c2c(O)c1CC(O)C1(C)CCC(=O)O1 Chemical compound COc1c(C)c2COC(=O)c2c(O)c1CC(O)C1(C)CCC(=O)O1 WSNMPAVSZJSIMT-UHFFFAOYSA-N 0.000 description 1
- CTKINSOISVBQLD-UHFFFAOYSA-N Glycidol Chemical compound OCC1CO1 CTKINSOISVBQLD-UHFFFAOYSA-N 0.000 description 1
- 239000005909 Kieselgur Substances 0.000 description 1
- 238000010546 Norrish type I reaction Methods 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- DHXVGJBLRPWPCS-UHFFFAOYSA-N Tetrahydropyran Chemical compound C1CCOCC1 DHXVGJBLRPWPCS-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 241000276425 Xiphophorus maculatus Species 0.000 description 1
- AOWPVIWVMWUSBD-RNFRBKRXSA-N [(3r)-3-hydroxybutyl] (3r)-3-hydroxybutanoate Chemical compound C[C@@H](O)CCOC(=O)C[C@@H](C)O AOWPVIWVMWUSBD-RNFRBKRXSA-N 0.000 description 1
- NIYNIOYNNFXGFN-UHFFFAOYSA-N [4-(hydroxymethyl)cyclohexyl]methanol;7-oxabicyclo[4.1.0]heptane-4-carboxylic acid Chemical compound OCC1CCC(CO)CC1.C1C(C(=O)O)CCC2OC21.C1C(C(=O)O)CCC2OC21 NIYNIOYNNFXGFN-UHFFFAOYSA-N 0.000 description 1
- 239000002318 adhesion promoter Substances 0.000 description 1
- OJMOMXZKOWKUTA-UHFFFAOYSA-N aluminum;borate Chemical compound [Al+3].[O-]B([O-])[O-] OJMOMXZKOWKUTA-UHFFFAOYSA-N 0.000 description 1
- RJZNFXWQRHAVBP-UHFFFAOYSA-I aluminum;magnesium;pentahydroxide Chemical compound [OH-].[OH-].[OH-].[OH-].[OH-].[Mg+2].[Al+3] RJZNFXWQRHAVBP-UHFFFAOYSA-I 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 239000000440 bentonite Substances 0.000 description 1
- 229910000278 bentonite Inorganic materials 0.000 description 1
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- FZTMYIGKWQQJIX-UHFFFAOYSA-N butyl prop-2-enoate;2-methylprop-2-enoic acid Chemical compound CC(=C)C(O)=O.CC(=C)C(O)=O.CCCCOC(=O)C=C FZTMYIGKWQQJIX-UHFFFAOYSA-N 0.000 description 1
- KVNRLNFWIYMESJ-UHFFFAOYSA-N butyronitrile Chemical compound CCCC#N KVNRLNFWIYMESJ-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- FNAQSUUGMSOBHW-UHFFFAOYSA-H calcium citrate Chemical compound [Ca+2].[Ca+2].[Ca+2].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O.[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O FNAQSUUGMSOBHW-UHFFFAOYSA-H 0.000 description 1
- 239000001354 calcium citrate Substances 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 1
- CETPSERCERDGAM-UHFFFAOYSA-N ceric oxide Chemical compound O=[Ce]=O CETPSERCERDGAM-UHFFFAOYSA-N 0.000 description 1
- 229910000422 cerium(IV) oxide Inorganic materials 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- QSAWQNUELGIYBC-UHFFFAOYSA-N cyclohexane-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCCCC1C(O)=O QSAWQNUELGIYBC-UHFFFAOYSA-N 0.000 description 1
- VBWIZSYFQSOUFQ-UHFFFAOYSA-N cyclohexanecarbonitrile Chemical compound N#CC1CCCCC1 VBWIZSYFQSOUFQ-UHFFFAOYSA-N 0.000 description 1
- 125000000596 cyclohexenyl group Chemical group C1(=CCCCC1)* 0.000 description 1
- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical compound O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 150000002118 epoxides Chemical group 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000010440 gypsum Substances 0.000 description 1
- 229910052602 gypsum Inorganic materials 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- YFYSUAZHCKSLCV-UHFFFAOYSA-N methyl 2-[(1-methoxy-2-methyl-1-oxobutan-2-yl)diazenyl]-2-methylbutanoate Chemical compound COC(=O)C(C)(CC)N=NC(C)(CC)C(=O)OC YFYSUAZHCKSLCV-UHFFFAOYSA-N 0.000 description 1
- 150000004702 methyl esters Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 229910052901 montmorillonite Inorganic materials 0.000 description 1
- QYZFTMMPKCOTAN-UHFFFAOYSA-N n-[2-(2-hydroxyethylamino)ethyl]-2-[[1-[2-(2-hydroxyethylamino)ethylamino]-2-methyl-1-oxopropan-2-yl]diazenyl]-2-methylpropanamide Chemical compound OCCNCCNC(=O)C(C)(C)N=NC(C)(C)C(=O)NCCNCCO QYZFTMMPKCOTAN-UHFFFAOYSA-N 0.000 description 1
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- WPPLKRDOKPISSC-UHFFFAOYSA-N pentyl 2,2-dimethylpropaneperoxoate Chemical compound CCCCCOOC(=O)C(C)(C)C WPPLKRDOKPISSC-UHFFFAOYSA-N 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 125000000864 peroxy group Chemical group O(O*)* 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920002239 polyacrylonitrile Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001195 polyisoprene Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- BWJUFXUULUEGMA-UHFFFAOYSA-N propan-2-yl propan-2-yloxycarbonyloxy carbonate Chemical compound CC(C)OC(=O)OOC(=O)OC(C)C BWJUFXUULUEGMA-UHFFFAOYSA-N 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- DCKVNWZUADLDEH-UHFFFAOYSA-N sec-butyl acetate Chemical compound CCC(C)OC(C)=O DCKVNWZUADLDEH-UHFFFAOYSA-N 0.000 description 1
- APSBXTVYXVQYAB-UHFFFAOYSA-M sodium docusate Chemical group [Na+].CCCCC(CC)COC(=O)CC(S([O-])(=O)=O)C(=O)OCC(CC)CCCC APSBXTVYXVQYAB-UHFFFAOYSA-M 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 1
- KXYJPVZMZBJJBZ-UHFFFAOYSA-N tert-butyl 2-ethylbutaneperoxoate Chemical compound CCC(CC)C(=O)OOC(C)(C)C KXYJPVZMZBJJBZ-UHFFFAOYSA-N 0.000 description 1
- WYKYCHHWIJXDAO-UHFFFAOYSA-N tert-butyl 2-ethylhexaneperoxoate Chemical compound CCCCC(CC)C(=O)OOC(C)(C)C WYKYCHHWIJXDAO-UHFFFAOYSA-N 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- CSKKAINPUYTTRW-UHFFFAOYSA-N tetradecoxycarbonyloxy tetradecyl carbonate Chemical compound CCCCCCCCCCCCCCOC(=O)OOC(=O)OCCCCCCCCCCCCCC CSKKAINPUYTTRW-UHFFFAOYSA-N 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- 235000013337 tricalcium citrate Nutrition 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/16—Polyester-imides
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1339—Gaskets; Spacers; Sealing of cells
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F22/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides or nitriles thereof
- C08F22/36—Amides or imides
- C08F22/40—Imides, e.g. cyclic imides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/14—Polycondensates modified by chemical after-treatment
- C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
- C08G59/1438—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
- C08G59/1455—Monocarboxylic acids, anhydrides, halides, or low-molecular-weight esters thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/14—Polycondensates modified by chemical after-treatment
- C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
- C08G59/1477—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/34—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
- C08G65/38—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/12—Unsaturated polyimide precursors
- C08G73/124—Unsaturated polyimide precursors the unsaturated precursors containing oxygen in the form of ether bonds in the main chain
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
- C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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- C—CHEMISTRY; METALLURGY
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- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
- C09K3/1006—Materials in mouldable or extrudable form for sealing or packing joints or covers characterised by the chemical nature of one of its constituents
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1337—Surface-induced orientation of the liquid crystal molecules, e.g. by alignment layers
- G02F1/13378—Surface-induced orientation of the liquid crystal molecules, e.g. by alignment layers by treatment of the surface, e.g. embossing, rubbing or light irradiation
- G02F1/133788—Surface-induced orientation of the liquid crystal molecules, e.g. by alignment layers by treatment of the surface, e.g. embossing, rubbing or light irradiation by light irradiation, e.g. linearly polarised light photo-polymerisation
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1341—Filling or closing of cells
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1341—Filling or closing of cells
- G02F1/13415—Drop filling process
-
- C—CHEMISTRY; METALLURGY
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Abstract
本發明係關於用於滴下式注入法密封劑應用之雙順丁烯二醯亞胺樹脂及可固化組合物,該等樹脂特別用於液晶顯示器裝配應用中。本發明組合物可藉由UV、熱或UV及熱組合進行固化。
Description
本發明係關於適用作密封劑,且特定言之,在液晶應用中適用作滴下式注入法密封劑的單體及寡聚物。特定言之,本發明允許LCD面板的裝配不會在LCD裝配及/或樹脂固化期間發生密封劑樹脂遷移至液晶中或液晶遷移至密封劑樹脂中的情況。
滴下式注入法(「ODF」)方法正變成顯示器應用中LCD面板裝配的主流方法,其替代了習知的真空注入技術,從而滿足了更快的製造方法需求。在ODF方法中,首先將密封劑分配於裝備有電極之基板上,以形成顯示器元件之框架,且將液晶滴入所描繪之框架內部。在裝配之下一步驟中,將另一裝備有電極之基板在真空下與其接合。接著,密封劑藉由UV與熱製程組合或僅藉由熱製程進行固化製程。
ODF方法的幾個問題在於,未固化狀態之密封劑材料在裝配過程中會與液晶接觸。此由於樹脂遷移至液晶中或液晶遷移至樹脂中,或由於可能存在的離子雜質而可導致液晶之電光特性降低。因此,展示良好液晶抗性(較少污染)以及良好黏著性及防濕特性之用於密封劑材料之樹脂系統的設計仍具挑戰性。
本發明係關於特有的樹脂及自其製作之ODF組合物。
在本發明之一個態樣中,提供一種包含以下結構I之樹脂:
其中R為選自以下之多價烴基連接基團:直鏈或分支鏈烷基、直鏈或分支鏈環烷基、伸烷基、伸環烷基、伸二環烷基、伸三環烷基、直鏈或分支鏈伸烷基、直鏈或分支鏈伸環烷基、直鏈或分支鏈伸烯基、伸芳基、伸芳烷基、芳基伸二環烷基、芳基伸三環烷基、二環烷基伸芳基、三環烷基伸芳基、伸聯苯基、環烷基伸芳基、伸雜環烷基或伸雜環芳基;該等烷基、環烷基、伸烷基、伸環烷基、伸烯基、伸芳基、伸芳烷基、芳基伸二環烷基、芳基伸三環烷基、二環烷基伸芳基、三環烷基伸芳基、伸聯苯基、環烷基伸芳基、伸雜環烷基及伸雜環芳基可視情況含有O或S或羥基;n及n1各自獨立地為1-10。
在本發明之另一態樣中,包括具有以下結構II之樹脂:
其中R為選自以下之多價烴基連接基團:直鏈或分支鏈烷基、直鏈或
分支鏈環烷基、伸烷基、伸環烷基、伸二環烷基、伸三環烷基、直鏈或分支鏈伸烷基、直鏈或分支鏈伸環烷基、直鏈或分支鏈伸烯基、伸芳基、伸芳烷基、芳基伸二環烷基、芳基伸三環烷基、二環烷基伸芳基、三環烷基伸芳基、伸聯苯基、環烷基伸芳基、伸雜環烷基或伸雜環芳基;該等烷基、環烷基、伸烷基、伸環烷基、伸烯基、伸芳基、伸芳烷基、芳基伸二環烷基、芳基伸三環烷基、二環烷基伸芳基、三環烷基伸芳基、伸聯苯基、環烷基伸芳基、伸雜環烷基及伸雜環芳基可視情況含有O或S或羥基;且n1、n2、n3及n4各自獨立地為1-10。
在本發明之又一態樣中,包括具有以下結構III之樹脂:
其中X1及X2為獨立地選自視情況具有一或多個雜原子之官能化或未官能化脂環基團的3至10員環;n1及n2各自獨立地為1-10;其中R為選自以下之多價烴基連接基團:直鏈或分支鏈烷基、直鏈或分支鏈環烷基、伸烷基、伸環烷基、伸二環烷基、伸三環烷基、直鏈或分支鏈伸烷基、直鏈或分支鏈伸環烷基、直鏈或分支鏈伸烯基、伸芳基、伸芳烷基、芳基伸二環烷基、芳基伸三環烷基、二環烷基伸芳基、三環烷基伸芳基、伸聯苯基、環烷基伸芳基、伸雜環烷基或伸雜環芳基;該等烷基、環烷基、伸烷基、伸環烷基、伸烯基、伸
芳基、伸芳烷基、芳基伸二環烷基、芳基伸三環烷基、二環烷基伸芳基、三環烷基伸芳基、伸聯苯基、環烷基伸芳基、伸雜環烷基及伸雜環芳基可視情況含有O或S或羥基;且R可在任何位置處鍵聯至環結構X1及X2,其限制條件為X1及X2環上之羥基鄰接於順丁烯二醯亞胺烷醯基。
在本發明之再一態樣中,包括具有以下結構IV之樹脂:
其中R為選自以下之多價烴基連接基團:直鏈或分支鏈烷基、直鏈或分支鏈環烷基、伸烷基、伸環烷基、伸二環烷基、伸三環烷基、直鏈或分支鏈伸烷基、直鏈或分支鏈伸環烷基、直鏈或分支鏈伸烯基、伸芳基、伸芳烷基、芳基伸二環烷基、芳基伸三環烷基、二環烷基伸芳基、三環烷基伸芳基、伸聯苯基、環烷基伸芳基、伸雜環烷基或伸雜環芳基;該等烷基、環烷基、伸烷基、伸環烷基、伸烯基、伸芳基、伸芳烷基、芳基伸二環烷基、芳基伸三環烷基、二環烷基伸芳基、三環烷基伸芳基、伸聯苯基、環烷基伸芳基、伸雜環烷基及伸雜環芳基可視情況含有O或S或羥基;R1可為羰基;脂族或芳族連接基團,且可含有酯、醚、羥基或硫醚基團中之一或多者;R2為芳環上之取代基,其可為H、鹵素、烷基、烷基醚、硫醚基團;且
X1係選自順丁烯二醯亞胺烷醯基或順丁烯二醯亞胺芳醯基。
在本發明之另一態樣中,包括具有以下結構V之樹脂:
其中R1可僅為鍵聯兩個芳族基團之鍵;O;羰基;或選自以下之多價烴基連接基團:直鏈或分支鏈烷基、直鏈或分支鏈環烷基、伸烷基、伸環烷基、伸二環烷基、伸三環烷基、直鏈或分支鏈伸烷基、直鏈或分支鏈伸環烷基、直鏈或分支鏈伸烯基、伸芳基、伸芳烷基、芳基伸二環烷基、芳基伸三環烷基、二環烷基伸芳基、三環烷基伸芳基、伸聯苯基、環烷基伸芳基、伸雜環烷基或伸雜環芳基;該等烷基、環烷基、伸烷基、伸環烷基、伸烯基、伸芳基、伸芳烷基、芳基伸二環烷基、芳基伸三環烷基、二環烷基伸芳基、三環烷基伸芳基、伸聯苯基、環烷基伸芳基、伸雜環烷基及伸雜環芳基可視情況含有O或S或羥基;且R2為可含有酯、醚、羥基、硫醚或碳酸酯基團中之一或多者的脂族或芳族連接基團;R3為芳基上之取代基,其可為H、鹵素、烷基、烷基醚或硫基醚基團;且X為選自順丁烯二醯亞胺烷醯基及順丁烯二醯亞胺芳醯基之可聚合官能基。
在本發明之另一態樣中,包括具有以下結構VI之樹脂:
其中R為選自以下之二價烴基連接基團:直鏈或分支鏈烷基、直鏈或分支鏈環烷基、伸烷基、伸環烷基、伸二環烷基、伸三環烷基、直鏈或分支鏈伸烷基、直鏈或分支鏈伸環烷基、直鏈或分支鏈伸烯基、伸芳基、伸芳烷基、芳基伸二環烷基、芳基伸三環烷基、二環烷基伸芳基、三環烷基伸芳基、伸聯苯基、環烷基伸芳基、伸雜環烷基或伸雜環芳基;該等烷基、環烷基、伸烷基、伸環烷基、伸烯基、伸芳基、伸芳烷基、芳基伸二環烷基、芳基伸三環烷基、二環烷基伸芳基、三環烷基伸芳基、伸聯苯基、環烷基伸芳基、伸雜環烷基及伸雜環芳基可視情況含有O或S或羥基;R1及R2為視情況含有雜原子之直鏈或分支鏈脂族基;n為1-10,且n1及n2各自為1-100。
本發明之聚合物適用於各種應用,包括密封、黏著及塗佈。一個尤其期望的用途為作為ODF密封劑用於裝配LCD面板。
本發明包括多種新穎材料,包括樹脂、寡聚物及聚合物,其適用於製備可用於ODF密封劑之可固化組合物。本發明亦包括由所揭示樹脂製成之新穎組合物。出於本發明之目的,術語「樹脂」將包括前
述新穎材料,亦即樹脂、寡聚物及聚合物。
本發明之一個態樣包括用作ODF密封劑之固化樹脂組合物,其包括由以上所展示之一般結構式表示的樹脂。
適用於合成本文中所描述之本發明混合樹脂的縮水甘油醚/酯化合物不受特別限制,且市場中可供使用之環氧化合物之實例包括:雙酚A類型環氧樹脂,諸如Epikote 828EL及Epikote 1004(均由Japan Epoxy Resin Co.,Ltd.製造);雙酚F類型環氧樹脂,諸如Epikote 806及Epikote 4004(均由Japan Epoxy Resin Co.,Ltd.製造);雙酚S類型環氧樹脂,諸如Epiclon EXA1514(由Dainippon Ink and Chemicals Inc.製造)及由Shin A T&C製造之SE 650;2,2'-二烯丙基雙酚A類型環氧樹脂,諸如RE-81 ONM(由Nippon Kayaku Co.,Ltd.製造);氫化之雙酚類型環氧樹脂,諸如Epiclon EXA7015(由Dainippon Ink and Chemicals Inc.製造);環氧丙烷加成之雙酚A類型環氧樹脂,諸如EP-4000S(由ADEKA Corporation製造);間苯二酚類型環氧樹脂,諸如EX-201(由Nagase ChemteX Corporation製造);聯苯類型環氧樹脂,諸如Epikote YX-4000H(由Japan Epoxy Resin Co.,Ltd.製造);硫化物類型環氧樹脂,諸如YSLV 50TE(由Tohto Kasei Co.,Ltd.製造);醚類型環氧樹脂,諸如YSLV 80DE(由Tohto Kasei Co.,Ltd.製造);二環戊二烯類型環氧樹脂,諸如EP-4088S及EP4088L(由ADEKA Corporation製造);萘類型環氧樹脂,諸如SE-80、SE-90,其由Shin A T&C製造;縮水甘油基胺類型環氧樹脂,諸如Epikote 630(由Japan Epoxy Resin Co.,Ltd.製造)、Epiclon 430(由Dainippon Ink及Chemicals Inc.製造)及TETRAD-X(由Mitsubishi Gas Chemical Company Inc.製造);烷基多元醇類型環氧樹脂,諸如ZX-1542(由Tohto Kasei Co.,Ltd.製造)、Epiclon 726(由Dainippon Ink and Chemicals Inc.製造)、Epolight 8OMFA(由Kyoeisha Chemical Co.,Ltd.製造)及Denacol EX-611(由
Nagase ChemteX Corporation製造);橡膠改質類型環氧樹脂,諸如YR-450、YR-207(均由Tohto Kasei Co.,Ltd.製造)及Epolead PB(由Daicel Chemical Industries,Ltd.製造);縮水甘油酯化合物,諸如Denacol EX-147(由Nagase ChemteX Corporation製造);雙酚A類型環氧硫化物樹脂,諸如Epikote YL-7000(由Japan Epoxy Resin Co.,Ltd.製造);及其他化合物,諸如YDC-1312、YSLV-BOXY、YSLV-90CR(均由Tohto Kasei Co.,Ltd.製造)、XAC4151(由Asahi Kasei Corporation製造)、Epikote 1031、Epikote 1032(均由Japan Epoxy Resin Co.,Ltd.製造)、EXA-7120(由Dainippon Ink and Chemicals Inc.製造)、TEPIC(由Nissan Chemical Industries,Ltd.製造)。市售酚清漆型酚醛樹脂類型環氧化合物之實例包括Epiclon N-740、N-770、N-775(均由Dainippon Ink and Chemicals Inc.製造)、Epikote 152、Epikote 154(均由Japan Epoxy Resin Co.,Ltd.製造)及其類似物。市售甲酚清漆型酚醛樹脂類型環氧化合物之實例包括Epiclon N-660、N-665、N-670、N-673、N-680、N-695、N-665-EXP及N-672-EXP(均由Dainippon Ink and Chemicals Inc.製造);市售聯苯清漆型酚醛樹脂類型環氧化合物之實例為NC-3000P(由Nippon Kayaku Co.,Ltd.製造);市售三酚清漆型酚醛樹脂類型環氧化合物之實例包括EP1032S50及EP1032H60(均由Japan Epoxy Resin Co.,Ltd.製造);市售二環戊二烯清漆型酚醛樹脂類型環氧化合物之實例包括XD-1000-L(由Nippon Kayaku Co.,Ltd.製造)及HP-7200(由Dainippon Ink and Chemicals Inc.製造);市售雙酚A類型環氧化合物之實例包括Epikote 828、Epikote 834、Epikote 1001、Epikote 1004(均由Japan Epoxy Resin Co.,Ltd.製造)、Epiclon 850、Epiclon 860及Epiclon 4055(均由Dainippon Ink and Chemicals Inc.製造);市售雙酚F類型環氧化合物之實例包括Epikote 807(由Japan Epoxy Resin Co.,Ltd.製造)及Epiclon 830(由Dainippon
Ink and Chemicals Inc.製造);市售2,2'-二烯丙基雙酚A類型環氧化合物之實例為RE-81ONM(由Nippon Kayaku Co.,Ltd.製造);市售氫化之雙酚型環氧化合物之實例為ST-5080(由Tohto Kasei Co.,Ltd.製造);市售聚氧丙烯雙酚A類型環氧化合物之實例包括EP-4000及EP-4005(均由ADEKA Corporation製造);及其類似物。HP4032及Epiclon EXA-4700(均由Dainippon Ink and Chemicals Inc.製造);酚清漆型酚醛樹脂類型環氧樹脂,諸如Epiclon N-770(由Dainippon Ink and Chemicals Inc.製造);鄰甲酚清漆型酚醛樹脂類型環氧樹脂,諸如Epiclon N-670-EXP-S(由Dainippon Ink and Chemicals Inc.製造);二環戊二烯清漆型酚醛樹脂類型環氧樹脂,諸如Epiclon HP7200(由Dainippon Ink and Chemicals Inc.製造);聯苯清漆型酚醛樹脂類型環氧樹脂,諸如NC-3000P(由Nippon Kayaku Co.,Ltd.製造);萘酚清漆型酚醛樹脂類型環氧樹脂,諸如ESN-165S(由Tohto Kasei Co.,Ltd.製造)。
適用於合成本發明樹脂之脂環環氧化合物之實例包括(但不限於)具有至少一個脂環之多元醇之聚縮水甘油醚及藉由對含環己烯環或環戊烯環化合物進行環氧化獲得之含環氧環己烯或環氧環戊烯化合物。特定實例包括氫化雙酚A二縮水甘油醚、3,4-環氧基環己烷甲酸3,4-環氧環己基甲酯、環己基-3,4-環氧基-1-甲基環己烷甲酸3,4-環氧基-1-甲酯、6-甲基-3,4-環氧環己基甲基-6-甲基-3,4-環氧基-環己烷甲酸酯、3,4-環氧基-3-甲基環己烷甲酸3,4-環氧基-3-甲基環己基甲酯、3,4-環氧基-5-甲基環己烷甲酸3,4-環氧基-5-甲基環己基甲酯、2-(3,4-環氧環己基-5,5-螺-3,4-環氧基)環己烷-間二噁烷、己二酸雙(3,4-環氧環己基甲基)酯、甲酸3,4-環氧基-6-甲基環己酯、亞甲基雙(3,4-環氧環己烷)、二環戊二烯二環氧化物、伸乙基雙(3,4-環氧基環己烷甲酸酯)、二辛基環氧基六氫鄰苯二甲酸酯及環氧六氫鄰苯二甲酸二2-乙基己
酯。
一些上文所提及之脂環環氧樹脂在以下產品中可購得:UVR-6100、UVR-6105、UVR-6110、UVR-6128及UVR-6200(Union Carbide Corporation之產品);CELLOXIDE 2021、CELLOXIDE 2021P、CELLOXIDE 2081、CELLOXIDE 2083、CELLOXIDE 2085、CELLOXIDE 2000、CELLOXIDE 3000、CYCLMER A200、CYCLMER M100、CYCLMER M101、EPOLEAD GT-301、EPOLEAD GT-302、EPOLEAD 401、EPOLEAD 403、ETHB及EPOLEADHD 300(Daicel Chemical Industries,Ltd.之產品);KRM-2110及KRM-2199(ADEKA Corporation之產品)。
除了本發明之可固化聚合物以外,ODF密封劑組合物亦可包括自由基起始劑(熱或UV生成)及固化劑。ODF組合物可藉由熱機構或UV機構或兩者固化。在存在環氧化物環之實施例中,亦可採用潛在環氧固化劑。
適用的熱自由基起始劑包括例如此項技術中已知之有機過氧化物及偶氮化合物。實例包括:偶氮自由基起始劑,諸如AIBN(偶氮二異丁腈)、2,2'-偶氮雙(4-甲氧基-2,4-二甲基戊腈)、2,2'-偶氮雙(2,4-二甲基戊腈)、2,2'-偶氮雙(2-乙基丙酸)二甲酯、2,2'-偶氮雙(2-甲基丁腈)、1,11-偶氮雙(環己烷-1-甲腈)、2,2'-偶氮雙[N-(2-丙烯基)-2-甲基丙醯胺];過氧化二烷基自由基起始劑,諸如1,1-二(丁基過氧基-3,3,5-三甲基環己烷);烷基過酸酯自由基起始劑,諸如TBPEH(過-2-乙基己酸第三丁酯);過氧化二醯基自由基起始劑,諸如過氧化苯甲醯;過氧基二碳酸酯自由基起始劑,諸如過碳酸乙基己酯;過氧化酮起始劑,諸如過氧化甲基乙基酮、雙(過氧化第三丁基)二異丙基苯、過苯甲酸第三丁酯、過氧基新癸酸第三丁酯及其組合。
有機過氧化物自由基起始劑之其他實例包括:過氧化二月桂醯
基、2,2-二(4,4-二(第三丁基過氧基)環己基)丙烷、二(第三丁基過氧基異丙基)苯、過氧二碳酸二(4-第三丁基環己基)酯、過氧二碳酸三十二烷酯、過氧二碳酸二肉豆蔻酯、2,3-二甲基-2,3-二苯基丁烷、過氧化二異丙苯、過氧化二苯甲醯、過氧二碳酸二異丙酯、單過氧順丁烯二酸第三丁酯、2,5-二甲基-2,5-二(第三丁基過氧基)己烷、碳酸第三丁基過氧基2-乙基己酯、過氧基-2-乙基己酸第三戊酯、過氧特戊酸第三戊酯、碳酸第三戊基過氧基2-乙基己酯、2,5-二甲基-2,5-二(2-乙基己醯基過氧基)己烷2,5-二甲基-2,5-二(第三丁基過氧基)己-3、過氧二碳酸二(3-甲氧基丁基)酯、過氧化二異丁醯基、過氧基-2-乙基己酸第三丁酯(Trigonox 21 S)、1,1-二(第三丁基過氧基)環己烷、過氧新癸酸第三丁酯、過氧特戊酸第三丁酯、過氧新庚酸第三丁酯、過氧基二乙基乙酸第三丁酯、1,1-二(第三丁基過氧基)-3,3,5-三甲基環己烷、3,6,9-三乙基-3,6,9-三甲基-1,4,7-三過氧壬烷、二(3,5,5-三甲基己醯基)過氧化物、己酸第三丁基過氧基-3,5,5-三甲酯、過氧基-2-乙基己酸1,1,3,3-四甲基丁酯、過氧新癸酸1,1,3,3-四甲基丁酯、己酸第三丁基過氧基-3,5,5-三甲酯、過氧新癸酸異丙苯酯、過氧化二第三丁基、碳酸第三丁基過氧基異丙酯、過氧苯甲酸第三丁酯、過氧二碳酸二(2-乙基己基)酯、過氧基乙酸第三丁酯、氫過氧化異丙基異丙苯基及過氧化第三丁基異丙苯。
通常具有更高分解速率之熱自由基起始劑為較佳的,因為此可更易於在常用固化溫度(80-130℃)下生成自由基且提供更快的固化速度,其可減少液體樹脂與液晶之間的接觸時間,且減少液晶污染。另一方面,若起始劑之分解速率過高,則在室溫下之黏度穩定性將受到影響,且因此減小密封劑之使用期限。
表現指定溫度下起始劑之分解速率的適宜方式係關於其半衰期,亦即分解一半初始存在之過氧化物所要的時間。為了比較不同起
始劑之反應性,使用具有10小時半衰期(T1/2)之各起始劑所處的溫度。最具反應性(最快)起始劑應為具有最低10h T1/2溫度之起始劑。
在本發明中,具有30-80℃之10h T1/2溫度的熱自由基起始劑為較佳的,且具有40-70℃之10h T1/2溫度為更佳的。
為了平衡組合物之反應性及黏度穩定性,用於樹脂組合物之熱自由基起始劑以本發明之可固化組合物中100重量份本發明樹脂計通常以0.01重量份至3重量份,且較佳0.5重量份至2重量份之量。
適用的UV自由基起始劑包括可購自CIBA及BASF之Norrish I型分裂光起始劑。此等光起始劑在調配物中係以0.1重量%-5重量%,更佳以約0.2重量%至3重量%之量使用。
適用的環氧固化劑之實例包括(但不限於)獲自Ajinomoto Fine-Techno Co.,Inc.之Ajicure系列硬化劑;獲自Air產品之Amicure系列固化劑及獲自Mitsubushi Chemical之JERCURETM產品。此等固化劑或硬化劑係以約1重量%至約50重量%總組合物,更佳約5重量%至約20重量%總組合物之量使用。
可固化組合物可視情況按需要含有能夠光聚合反應之另一組分,諸如乙烯基醚化合物。另外,可固化組合物可進一步包含添加劑、樹脂組分及其類似物以在固化之後改良或改質諸如以下特性:流動性、分配或印刷特性、儲存特性、固化特性及物理特性。組合物按需要可含有多種添加劑,例如有機或無機填充劑、搖變劑(thixotropic agent)、矽烷偶合劑、稀釋劑、改質劑、著色劑(諸如顏料及染料)、界面活性劑、防腐劑、穩定劑、塑化劑、潤滑劑、去泡劑、流平劑及其類似物;然而不限於此等添加劑。特定言之,組合物較佳包含選自由以下組成之群的添加劑:有機或無機填充劑、搖變劑及矽烷偶合劑。此等添加劑可以約0.1重量%至約50重量%,更佳約2重量%至約10重量%總組合物之量存在。
填充劑可包括(但不限於)無機填充劑,諸如二氧化矽、矽藻土、氧化鋁、氧化鋅、氧化鐵、氧化鎂、氧化錫、氧化鈦、氫氧化鎂、氫氧化鋁碳酸鎂、硫酸鋇、石膏、矽酸鈣、滑石、玻璃珠粒、絹雲母活化之白土、膨潤土、氮化鋁、氮化矽及其類似物;同時有機填充劑,諸如甲基丙烯酸聚(甲基)酯、甲基丙烯酸聚(乙基)酯、甲基丙烯酸聚(丙基)酯、甲基丙烯酸聚(丁基)酯、丁基丙烯酸酯-甲基丙烯酸-甲基丙烯酸(甲基)酯共聚物、聚丙烯腈、聚苯乙烯、聚丁二烯、聚戊二烯、聚異戊二烯、聚異丙烯及其類似物。此等填充劑可單獨或以組合形式使用。此等填充劑可以約1重量%至約80重量%,更佳約5重量%至約30重量%總組合物之量存在。
搖變劑可包括(但不限於)滑石、煙霧狀二氧化矽、精細加工表面處理之碳酸鈣、細粒氧化鋁、板狀氧化鋁;層狀化合物,諸如蒙脫石,針狀化合物,諸如硼酸鋁鬚晶,及其類似物。其中,滑石、煙霧狀二氧化矽及精細氧化鋁為特別需要的。此等製劑可以總組合物之約1重量%至約50重量%,更佳1重量%至約30重量%之量存在。
矽烷偶合劑可包括(但不限於)-胺基丙基三乙氧基矽烷、-巰基丙基三甲氧基矽烷、-甲基丙烯醯氧基丙基三甲氧基矽烷、-縮水甘油氧基丙基三甲氧基矽烷及其類似物。
根據本發明之可固化組合物可藉由將前述各組分藉助於例如混合器(諸如具有攪拌葉片之攪拌器及三輥研磨機)進行混合獲得。組合物在環境下為液體,其在1.5s-1剪切速率下黏度為200-400Pa.s(在25℃下),使得其具有易於分配特性。
亦提供一種藉助於液晶滴下式注入法製造在第一基板與第二基板之間具有液晶層之液晶顯示器的方法。該方法包含以下步驟:(a)將本發明中所描述之可固化組合物塗覆於該第一基板之表面周邊處的密封區域上;
(b)將液晶滴落於由該第一基板之表面之密封區域環繞的中心區域上;(c)將該第二基板覆蓋於該第一基板上;(d)視情況藉由UV輻射該可固化組合物進行部分固化,及(e)藉由加熱該可固化組合物進行最終固化。
本發明中使用之第一基板及第二基板通常為透明玻璃基板。一般而言,透明電極、主動式矩陣元件(諸如TFT)、配向膜、彩色濾光片及其類似物形成於該兩個基板之相對面中之至少一者上。此等構造可根據LCD之類型進行修改。根據本發明之製造方法可認為適用於任何類型的LCD。
在步驟(a)中,可固化組合物塗覆於第一基板之表面之周邊部分,以使以框架形狀包圍住基板外周。可固化組合物以框架形狀塗覆之部分稱為密封區域。可固化組合物可利用已知方法(諸如網板印刷及分配)塗覆。
在步驟(b)中,接著將液晶滴落至由第一基板之表面上呈框架形狀之密封區域包圍的中心區域上。此步驟較佳在減壓下進行。
在步驟(c)中,接著將該第二基板置放在該第一基板上,及在步驟(d)中進行UV輻射。藉由UV照射,可固化組合物部分固化,且展示出不會因操作而出現移位之水準的強度,由此兩個基板暫時經固定。一般而言,輻射時間較佳為短的,例如不長於5分鐘,較佳不長於3分鐘,更佳不長於1分鐘。
在步驟(e)中,加熱可固化組合物使其達成最終固化強度,由此兩個基板最終黏結在一起。步驟(e)中之熱固化一般在80至130℃及較佳100至120℃之溫度下加熱,加熱時間為30分鐘至3小時,通常為1小時。
藉由此方法,LCD面板之主要部分完成。
以下表I展示本發明ODF調配物2-4及含有市售Uvacure 1561(部分丙烯酸化BPA二縮水甘油醚)之對照物調配物1。Irgacure 651為市售光起始劑;A-187為黏著促進劑;EH-4357S為環氧硬化劑;SO-E2為二氧化矽填充劑。與對照調配物相比,數種本發明調配物展示類似的VHR防濕值(Mocon)及改良之角部強度。
Claims (24)
- 一種樹脂組合物,其包含以下結構:
其中R為選自以下之多價烴基連接基團:直鏈或分支鏈烷基、直鏈或分支鏈環烷基、伸烷基、伸環烷基、伸二環烷基、伸三環烷基、直鏈或分支鏈伸烷基、直鏈或分支鏈伸環烷基、直鏈或分支鏈伸烯基、伸芳基、伸芳烷基、芳基伸二環烷基、芳基伸三環烷基、二環烷基伸芳基、三環烷基伸芳基、伸聯苯基、環烷基伸芳基、伸雜環烷基或伸雜環芳基;該等烷基、環烷基、伸烷基、伸環烷基、伸烯基、伸芳基、伸芳烷基、芳基伸二環烷基、芳基伸三環烷基、二環烷基伸芳基、三環烷基伸芳基、伸聯苯基、環烷基伸芳基、伸雜環烷基及伸雜環芳基可視情況含有O或S或羥基;且n及n1各自獨立地為1-10。 - 一種樹脂組合物,其包含以下結構:
其中 R為選自以下之多價烴基連接基團:直鏈或分支鏈烷基、直鏈或分支鏈環烷基、伸烷基、伸環烷基、伸二環烷基、伸三環烷基、直鏈或分支鏈伸烷基、直鏈或分支鏈伸環烷基、直鏈或分支鏈伸烯基、伸芳基、伸芳烷基、芳基伸二環烷基、芳基伸三環烷基、二環烷基伸芳基、三環烷基伸芳基、伸聯苯基、環烷基伸芳基、伸雜環烷基或伸雜環芳基;該等烷基、環烷基、伸烷基、伸環烷基、伸烯基、伸芳基、伸芳烷基、芳基伸二環烷基、芳基伸三環烷基、二環烷基伸芳基、三環烷基伸芳基、伸聯苯基、環烷基伸芳基、伸雜環烷基及伸雜環芳基可視情況含有O或S或羥基;且n1、n2、n3及n4各自獨立地為1-10。 - 一種樹脂組合物,其包含以下結構:
其中X1及X2為獨立地選自視情況具有一或多個雜原子之官能化或未官能化脂環基團的3至10員環;n1及n2各自獨立地為1-10;R為選自以下之多價烴基連接基團:直鏈或分支鏈烷基、直鏈或分支鏈環烷基、伸烷基、伸環烷基、伸二環烷基、伸三環烷基、直鏈或分支鏈伸烷基、直鏈或分支鏈伸環烷基、直鏈或分支鏈伸烯基、伸芳基、伸芳烷基、芳基伸二環烷基、芳基伸三環烷基、二環烷基伸芳基、三環烷基伸芳基、伸聯苯基、環烷 基伸芳基、伸雜環烷基或伸雜環芳基;該等烷基、環烷基、伸烷基、伸環烷基、伸烯基、伸芳基、伸芳烷基、芳基伸二環烷基、芳基伸三環烷基、二環烷基伸芳基、三環烷基伸芳基、伸聯苯基、環烷基伸芳基、伸雜環烷基及伸雜環芳基可視情況含有O或S或羥基;且R可在任何位置處鍵聯至環結構X1及X2,其限制條件為X1及X2環上之羥基與順丁烯二醯亞胺烷醯基相鄰。 - 一種樹脂組合物,其包含以下結構:
其中R為選自以下之多價烴基連接基團:直鏈或分支鏈烷基、直鏈或分支鏈環烷基、伸烷基、伸環烷基、伸二環烷基、伸三環烷基、直鏈或分支鏈伸烷基、直鏈或分支鏈伸環烷基、直鏈或分支鏈伸烯基、伸芳基、伸芳烷基、芳基伸二環烷基、芳基伸三環烷基、二環烷基伸芳基、三環烷基伸芳基、伸聯苯基、環烷基伸芳基、伸雜環烷基或伸雜環芳基;該等烷基、環烷基、伸烷基、伸環烷基、伸烯基、伸芳基、伸芳烷基、芳基伸二環烷基、芳基伸三環烷基、二環烷基伸芳基、三環烷基伸芳基、伸聯苯基、環烷基伸芳基、伸雜環烷基及伸雜環芳基可視情況含有O或S或羥基;R1為連接基團,其可為羰基;脂族或芳族,且可含有酯、醚、羥基或硫醚基團中之一或多者; R2為芳環上之取代基,其可為H、鹵素、烷基、烷基醚、硫醚基團;且X1係選自順丁烯二醯亞胺烷醯基或順丁烯二醯亞胺芳醯基。 - 一種樹脂組合物,其包含以下結構:
其中R1僅為鍵聯兩個芳族基團之鍵;O;羰基;或選自以下之多價烴基連接基團:直鏈或分支鏈烷基、直鏈或分支鏈環烷基、伸烷基、伸環烷基、伸二環烷基、伸三環烷基、直鏈或分支鏈伸烷基、直鏈或分支鏈伸環烷基、直鏈或分支鏈伸烯基、伸芳基、伸芳烷基、芳基伸二環烷基、芳基伸三環烷基、二環烷基伸芳基、三環烷基伸芳基、伸聯苯基、環烷基伸芳基、伸雜環烷基或伸雜環芳基;該等烷基、環烷基、伸烷基、伸環烷基、伸烯基、伸芳基、伸芳烷基、芳基伸二環烷基、芳基伸三環烷基、二環烷基伸芳基、三環烷基伸芳基、伸聯苯基、環烷基伸芳基、伸雜環烷基及伸雜環芳基可視情況含有O或S或羥基;且R2為可含有酯、醚、羥基、硫醚或碳酸酯基團中之一或多者的脂族或芳族連接基團;R3為芳基上之取代基,其可為H、鹵素、烷基、烷基醚或硫基醚基團;且X為選自順丁烯二醯亞胺烷醯基及順丁烯二醯亞胺芳醯基之可聚合官能基。 - 一種樹脂組合物,其包含以下結構:
其中R為選自以下之二價烴基連接基團:直鏈或分支鏈烷基、直鏈或分支鏈環烷基、伸烷基、伸環烷基、伸二環烷基、伸三環烷基、直鏈或分支鏈伸烷基、直鏈或分支鏈伸環烷基、直鏈或分支鏈伸烯基、伸芳基、伸芳烷基、芳基伸二環烷基、芳基伸三環烷基、二環烷基伸芳基、三環烷基伸芳基、伸聯苯基、環烷基伸芳基、伸雜環烷基或伸雜環芳基;該等烷基、環烷基、伸烷基、伸環烷基、伸烯基、伸芳基、伸芳烷基、芳基伸二環烷基、芳基伸三環烷基、二環烷基伸芳基、三環烷基伸芳基、伸聯苯基、環烷基伸芳基、伸雜環烷基及伸雜環芳基可視情況含有O或S或羥基;R1及R2各自為視情況含有雜原子之直鏈或分支鏈脂族基;且n為1-10,且n1及n2各自為1-100。 - 一種可固化滴下式注入法(ODF)密封劑組合物,其包含如請求項1之樹脂結構及選自由自由基起始劑、固化劑、填充劑及其組合組成之群的材料。
- 如請求項7之ODF密封劑組合物,其進一步包含選自由以下組成之群的材料:光起始劑、搖變劑(thixotropic agent)、矽烷偶合劑、稀釋劑、著色劑、界面活性劑、防腐劑、穩定劑、塑化 劑、潤滑劑、去泡劑、流平劑、增韌劑及其組合。
- 一種可固化滴下式注入法(ODF)密封劑組合物,其包含如請求項2之樹脂結構及選自由自由基起始劑、固化劑、填充劑及其組合組成之群的材料。
- 如請求項9之ODF密封劑組合物,其進一步包含選自由以下組成之群的材料:光起始劑、搖變劑、矽烷偶合劑、稀釋劑、著色劑、界面活性劑、防腐劑、穩定劑、塑化劑、潤滑劑、去泡劑、流平劑、增韌劑及其組合。
- 一種可固化滴下式注入法(ODF)密封劑組合物,其包含如請求項3之樹脂結構及選自由自由基起始劑、固化劑、填充劑及其組合組成之群的材料。
- 如請求項11之ODF密封劑組合物,其進一步包含選自由以下組成之群的材料:光起始劑、搖變劑、矽烷偶合劑、稀釋劑、著色劑、界面活性劑、防腐劑、穩定劑、塑化劑、潤滑劑、去泡劑、增韌劑、流平劑及其組合。
- 一種可固化滴下式注入法(ODF)密封劑組合物,其包含如請求項4之樹脂結構及選自由自由基起始劑、固化劑、填充劑及其組合組成之群的材料。
- 如請求項13之ODF密封劑組合物,其進一步包含選自由以下組成之群的材料:光起始劑、搖變劑、矽烷偶合劑、稀釋劑、著色劑、界面活性劑、防腐劑、穩定劑、塑化劑、潤滑劑、去泡劑、增韌劑、流平劑及其組合。
- 一種可固化滴下式注入法(ODF)密封劑組合物,其包含如請求項5之樹脂結構及選自由自由基起始劑、固化劑、填充劑及其組合組成之群的材料。
- 如請求項15之ODF密封劑組合物,其進一步包含選自由以下組成 之群的材料:光起始劑、搖變劑、矽烷偶合劑、稀釋劑、著色劑、界面活性劑、防腐劑、穩定劑、塑化劑、潤滑劑、去泡劑、增韌劑、流平劑及其組合。
- 一種可固化滴下式注入法(ODF)密封劑組合物,其包含如請求項6之樹脂結構及選自由自由基起始劑、固化劑、填充劑及其組合組成之群的材料。
- 如請求項17之ODF密封劑組合物,其進一步包含選自由以下組成之群的材料:光起始劑、搖變劑、矽烷偶合劑、稀釋劑、著色劑、界面活性劑、防腐劑、穩定劑、塑化劑、潤滑劑、去泡劑、增韌劑、流平劑及其組合。
- 一種用於製造在第一基板與第二基板之間具有液晶層之液晶顯示器的方法,其包含:(a)將如請求項1之可固化組合物塗覆於該第一基板之表面周邊處的密封區域上;(b)將液晶滴落於由該第一基板之表面之密封區域環繞的中心區域上;(c)將該第二基板覆蓋於該第一基板上;(d)視情況藉由UV輻射該可固化組合物進行部分固化,及(e)藉由加熱該可固化組合物進行最終固化。
- 一種用於製造在第一基板與第二基板之間具有液晶層之液晶顯示器的方法,其包含:(a)將如請求項2之可固化組合物塗覆於該第一基板之表面周邊處的密封區域上;(b)將液晶滴落於由該第一基板之表面之密封區域環繞的中心區域上;(c)將該第二基板覆蓋於該第一基板上; (d)視情況藉由UV輻射該可固化組合物進行部分固化,及(e)藉由加熱該可固化組合物進行最終固化。
- 一種用於製造在第一基板與第二基板之間具有液晶層之液晶顯示器的方法,其包含:(a)將如請求項3之可固化組合物塗覆於該第一基板之表面周邊處的密封區域上;(b)將液晶滴落於由該第一基板之表面之密封區域環繞的中心區域上;(c)將該第二基板覆蓋於該第一基板上;(d)視情況藉由UV輻射該可固化組合物進行部分固化,及(e)藉由加熱該可固化組合物進行最終固化。
- 一種用於製造在第一基板與第二基板之間具有液晶層之液晶顯示器的方法,其包含:(a)將如請求項4之可固化組合物塗覆於該第一基板之表面周邊處的密封區域上;(b)將液晶滴落於由該第一基板之表面之密封區域環繞的中心區域上;(c)將該第二基板覆蓋於該第一基板上;(d)視情況藉由UV輻射該可固化組合物進行部分固化,及(e)藉由加熱該可固化組合物進行最終固化。
- 一種用於製造在第一基板與第二基板之間具有液晶層之液晶顯示器的方法,其包含:(a)將如請求項5之可固化組合物塗覆於該第一基板之表面周邊處的密封區域上;(b)將液晶滴落於由該第一基板之表面之密封區域環繞的中心區域上; (c)將該第二基板覆蓋於該第一基板上;(d)視情況藉由UV輻射該可固化組合物進行部分固化,及(e)藉由加熱該可固化組合物進行最終固化。
- 一種用於製造在第一基板與第二基板之間具有液晶層之液晶顯示器的方法,其包含:(a)將如請求項6之可固化組合物塗覆於該第一基板之表面周邊處的密封區域上;(b)將液晶滴落於由該第一基板之表面之密封區域環繞的中心區域上;(c)將該第二基板覆蓋於該第一基板上;(d)視情況藉由UV輻射該可固化組合物進行部分固化,及(e)藉由加熱該可固化組合物進行最終固化。
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| PCT/CN2015/083966 WO2017008244A1 (en) | 2015-07-14 | 2015-07-14 | Curable compositions for one drop fill sealant application |
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| Country | Link |
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| US (1) | US20180136499A1 (zh) |
| EP (1) | EP3322745A4 (zh) |
| JP (1) | JP2018529791A (zh) |
| KR (1) | KR20180030846A (zh) |
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| TW201900835A (zh) * | 2017-05-18 | 2019-01-01 | 德商漢高智慧財產控股公司 | 用於滴下式密封劑應用之可固化組合物 |
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| JP2003034708A (ja) * | 2001-07-24 | 2003-02-07 | Nippon Kayaku Co Ltd | 樹脂組成物及びその硬化物 |
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| EP3322745A1 (en) | 2018-05-23 |
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| US20180136499A1 (en) | 2018-05-17 |
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| EP3322745A4 (en) | 2019-06-19 |
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