TW201727073A - A determination system used for a vacuum pump and a vacuum pump - Google Patents
A determination system used for a vacuum pump and a vacuum pump Download PDFInfo
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- TW201727073A TW201727073A TW105134243A TW105134243A TW201727073A TW 201727073 A TW201727073 A TW 201727073A TW 105134243 A TW105134243 A TW 105134243A TW 105134243 A TW105134243 A TW 105134243A TW 201727073 A TW201727073 A TW 201727073A
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- 230000005856 abnormality Effects 0.000 claims abstract description 19
- 239000007789 gas Substances 0.000 claims description 85
- 238000012545 processing Methods 0.000 claims description 44
- 238000004140 cleaning Methods 0.000 claims description 18
- 230000008859 change Effects 0.000 claims description 13
- 230000007246 mechanism Effects 0.000 claims description 7
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 5
- 229910052786 argon Inorganic materials 0.000 claims description 3
- 229910052757 nitrogen Inorganic materials 0.000 claims description 2
- 238000005259 measurement Methods 0.000 abstract description 17
- 238000000034 method Methods 0.000 abstract description 16
- 230000008569 process Effects 0.000 abstract description 15
- 230000002159 abnormal effect Effects 0.000 description 35
- 238000012423 maintenance Methods 0.000 description 12
- 238000001784 detoxification Methods 0.000 description 8
- 230000009471 action Effects 0.000 description 6
- 238000004891 communication Methods 0.000 description 6
- 238000004458 analytical method Methods 0.000 description 5
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 4
- 238000011144 upstream manufacturing Methods 0.000 description 4
- 238000001514 detection method Methods 0.000 description 3
- 238000012544 monitoring process Methods 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000007405 data analysis Methods 0.000 description 2
- 230000010365 information processing Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000010926 purge Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 238000003745 diagnosis Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- QKCGXXHCELUCKW-UHFFFAOYSA-N n-[4-[4-(dinaphthalen-2-ylamino)phenyl]phenyl]-n-naphthalen-2-ylnaphthalen-2-amine Chemical compound C1=CC=CC2=CC(N(C=3C=CC(=CC=3)C=3C=CC(=CC=3)N(C=3C=C4C=CC=CC4=CC=3)C=3C=C4C=CC=CC4=CC=3)C3=CC4=CC=CC=C4C=C3)=CC=C21 QKCGXXHCELUCKW-UHFFFAOYSA-N 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000013022 venting Methods 0.000 description 1
- 230000003442 weekly effect Effects 0.000 description 1
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B37/00—Pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B25/00 - F04B35/00
- F04B37/10—Pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B25/00 - F04B35/00 for special use
- F04B37/14—Pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B25/00 - F04B35/00 for special use to obtain high vacuum
- F04B37/16—Means for nullifying unswept space
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B51/00—Testing machines, pumps, or pumping installations
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Compressors, Vaccum Pumps And Other Relevant Systems (AREA)
Abstract
Description
本發明係關於真空泵之判斷系統、及包含該真空泵之判斷系統之真空泵。 詳細而言，係關於可自與真空泵相關之各種參數事先判斷預測將發生之異常狀態之真空泵之判斷系統，以及對異常狀態採取對策，可判斷藉由採取之對策解除該異常狀態之真空泵之判斷系統、及包含該真空泵之判斷系統之真空泵。The present invention relates to a judgment system for a vacuum pump and a vacuum pump including the judgment system of the vacuum pump. Specifically, the determination system of the vacuum pump that can predict the abnormal state that will occur from the various parameters related to the vacuum pump, and the countermeasure against the abnormal state, can determine the vacuum pump that cancels the abnormal state by taking countermeasures. The system, and a vacuum pump including the judgment system of the vacuum pump.
於配設於真空泵之上游之處理裝置為製造例如半導體或太陽能電池、液晶等時之步驟之一即用以成膜之裝置之情形時，係於用以產生Si膜之真空腔室內使用矽烷氣體(SiH4 )等之處理氣體。 於該使用後排出之排氣體係自連接於半導體製造步驟用之裝置即真空腔室之真空泵之反應爐朝外部排氣。因此種排氣而有引起隨著時間之經過而於真空泵之內部堆積堆積物、生成物之情況。 為了除去該堆積物，必須定期保養真空泵。一般而言，該保養係以每三個月一次左右之頻率，取下真空泵而實施。如此取下真空泵花費勞力與時間。 又，於鑒於運用方面、費用方面時，自該保養至進行下一次保養之間隔(不必保養期間)越長越好。或，較佳為於需要取下之保養成為必要之前，可實施即使不取下亦可進行之保養。 進而，若因一些理由對堆積物、生成物之體積視而不見，真空泵緊急停止時，大氣逆流至真空泵，導致莫大之損失，故無論如何必須迴避真空泵之緊急停止。 另一方面，近年來，關於真空泵(乾式泵)之因上述之堆積物、生成物堆積所致之異常檢測，可藉由監控異常發生之各種參數而事先預知、預測真空泵停止般之系統之開發不斷進展。 圖5係顯示由使用電腦之系統進行真空泵之異常發生之參數分析(數據分析)，且提示其之一例之圖。 於該系統中，於特定之圖像顯示參數分析(數據分析)，並對管理者進行提示。 圖5係於橫軸採用時間之值，於縱軸採用參數之值，且監控隨著時間之經過，預先標定之參數顯示何種數值之圖像之一例。 時間之值可設為自真空泵初次運轉起經過之分鐘單位、小時單位、週單位、月單位等，又，於參數中亦可設定運轉中之真空泵之電流之值、壓力之值、溫度之值、及振動之值等。 於圖5中，顯示作為一例，於地點A開始真空泵之監控，於地點B判斷必須根據參數之值進行真空泵之保養(全面檢查)，然後，於地點C中，根據參數之值促使於新的處理中禁止運轉真空泵。 [先前技術文獻] [專利文獻] [專利文獻1]日本專利第5504107號 於專利文獻1中，記述有關於以防止因真空泵之停止所致之向真空腔室(腔室)之逆流且容易回復為目的，於在真空泵之特定部位檢測之檢測電流值超過預先設定之小於以使真空泵緊急停止為目標之異常電流值且大於真空泵之常用電流值之值即電流設定值之情形時，進行閥之關閉之技術。When the processing device disposed upstream of the vacuum pump is one of the steps of manufacturing a semiconductor, a solar cell, a liquid crystal, or the like, that is, a device for film formation, a decane gas is used in a vacuum chamber for generating a Si film. Process gas such as (SiH 4 ). The exhaust system discharged after the use is exhausted to the outside from the reaction furnace connected to the vacuum pump of the vacuum chamber of the apparatus for the semiconductor manufacturing step. Therefore, there is a case where the deposit and the product are accumulated inside the vacuum pump as time passes. In order to remove the deposit, the vacuum pump must be maintained regularly. In general, the maintenance is carried out by removing the vacuum pump at a frequency of about once every three months. It takes labor and time to remove the vacuum pump. In addition, in terms of the application and the cost, the interval from the maintenance to the next maintenance (during the maintenance period) is as long as possible. Or, it is preferable to perform maintenance even if it is not necessary before maintenance that is required to be removed becomes necessary. Further, if the volume of the deposit or the product is ignored for some reason, when the vacuum pump is suddenly stopped, the atmosphere flows back to the vacuum pump, causing a great loss. Therefore, it is necessary to avoid the emergency stop of the vacuum pump anyway. On the other hand, in recent years, in the vacuum pump (dry pump), the abnormality detection due to the above-mentioned deposits and product accumulation can be predicted and predicted in advance by the various parameters of the abnormality. Keep on progress. Fig. 5 is a view showing a parameter analysis (data analysis) of occurrence of an abnormality of a vacuum pump by a system using a computer, and a diagram showing an example thereof. In this system, parameter analysis (data analysis) is displayed on a specific image, and the manager is prompted. Fig. 5 is an example of an image in which the horizontal axis takes the value of time, the value of the parameter is used on the vertical axis, and the value of the pre-calibrated parameter shows which value is displayed over time. The value of the time can be set as the minute unit, the hour unit, the weekly unit, the monthly unit, etc. from the initial operation of the vacuum pump, and the value of the current of the vacuum pump in operation, the value of the pressure, and the value of the temperature can also be set in the parameter. And the value of vibration, etc. In Fig. 5, as an example, the monitoring of the vacuum pump is started at the point A, and it is judged at the point B that the maintenance of the vacuum pump must be performed according to the value of the parameter (full inspection), and then, at the location C, the new value is promoted according to the value of the parameter. It is forbidden to operate the vacuum pump during processing. [Prior Art Document] [Patent Document 1] Japanese Patent No. 5504107, Patent Document 1 describes the prevention of backflow to a vacuum chamber (chamber) due to the stop of the vacuum pump and easy recovery. For the purpose of performing the valve when the detected current value detected at a specific portion of the vacuum pump exceeds a preset current value that is less than the value of the abnormal current value of the vacuum pump and is greater than the value of the common current value of the vacuum pump, that is, the current set value. Close the technology.
[發明所欲解決之問題] 然而，於專利文獻1所記述之技術之前提係於真空泵發生異常狀態時緊急停止真空泵。因此，有無法對關於真空泵之預測即將發生之異常狀態，自參數(例如、電流或電壓、溫度等)事先判斷，且對該異常狀態採取一些對策、或判斷藉由採取對策而解除該異常狀態之問題。 又，由於係於真空泵之緊急停止發生確定之後，故有不可能進行現場保養真空泵(即，不自處理裝置取下而進行保養)之問題。 本發明之目的在於提供一種可自關於真空泵之參數事先判斷預測將發生之異常狀態之真空泵之判斷系統；對異常狀態採取對策，且可判斷藉由採取對策而解除該異常狀態之真空泵之判斷系統；及包含該真空泵之判斷系統之真空泵。 [解決問題之技術手段] 於技術方案1之本案發明中，係提供一種真空泵之判斷系統，其特徵在於其係藉由有關上述真空泵之各種參數，事先判斷於真空泵預測將發生之異常者，且包含：判斷用氣體流入機構，其係於配設有上述真空泵之裝置之非運轉中，流通以於該裝置之運轉中流通於該裝置之量以上之量之判斷用氣體；及參數取得機構，其取得起因於利用上述判斷用氣體流入機構流通之上述判斷用氣體而產生之上述參數。 技術方案2之本案發明係提供技術方案1之真空泵之判斷系統，其包含參數變化取得機構，其取得所取得之上述參數之變化，且進而包含判斷機構，其將藉由上述參數變化取得機構取得之上述參數之變化、與預先記憶之特定之上述參數之變化之基準值進行比較，藉此判斷於真空泵有無發生異常。 技術方案3之本案發明係提供技術方案1或2之真空泵之判斷系統，其包含顯示上述參數或上述參數之變化之顯示機構。 技術方案4之本案發明係提供技術方案1至3中任一項之真空泵之判斷系統，其中上述判斷用氣體係於上述裝置之運轉中流通於該裝置之處理氣體以外之氣體。 技術方案5之本案發明係提供技術方案4之真空泵之判斷系統，其中上述判斷氣體為氮氣或氬氣。 技術方案6之本案發明係提供技術方案1至3中任一項之真空泵之判斷系統，其中上述判斷用氣體係於上述裝置之運轉中流通於該裝置之處理氣體。 技術方案7之本案發明係提供一種真空泵之判斷系統，其特徵在於其係藉由有關上述真空泵之各種參數，事先判斷於真空泵預測將發生之異常者，且包含：清洗氣體流入機構，其係於配設有上述真空泵之裝置之非運轉中，於上述真空泵之內部流通清洗氣體；及參數取得機構，其取得起因於利用上述清洗氣體流入機構流通之上述氣體而產生之上述參數。 技術方案8之本案發明係提供技術方案7之真空泵之判斷系統，其中進而包含顯示以上述參數取得機構取得之上述參數之顯示機構。 技術方案9之本案發明係提供一種真空泵，其特徵在於包含技術方案1至8中任一項之真空泵之判斷系統。 [發明之效果] 根據本發明，可自有關真空泵之參數事先判斷預測將發生之異常狀態。又，可對異常狀態採取對策，並判斷藉由採取之對策而已解除該異常狀態。[Problems to be Solved by the Invention] However, prior to the technique described in Patent Document 1, it is proposed to urgently stop the vacuum pump when an abnormal state occurs in the vacuum pump. Therefore, there is a possibility that the abnormal state about the imminent occurrence of the vacuum pump cannot be determined in advance from the parameter (for example, current, voltage, temperature, etc.), and some countermeasures are taken for the abnormal state, or it is judged that the abnormal state is released by taking countermeasures. The problem. Further, since the emergency stop of the vacuum pump is determined, it is impossible to perform the on-site maintenance of the vacuum pump (that is, the maintenance is not performed by the treatment device). An object of the present invention is to provide a judgment system for a vacuum pump that can predict in advance an abnormal state that will occur from a parameter of a vacuum pump; a countermeasure for a vacuum pump that takes countermeasures against an abnormal state and can determine the abnormal state by taking countermeasures And a vacuum pump including the judgment system of the vacuum pump. [Technical means for solving the problem] In the invention of the first aspect of the invention, there is provided a vacuum pump judging system characterized in that it is determined in advance by an abnormality of a vacuum pump that the vacuum pump predicts that an abnormality will occur, and The determination gas inflow means includes a determination gas that is equal to or larger than the amount of the apparatus that is operated in the operation of the apparatus during non-operation of the apparatus in which the vacuum pump is disposed; and a parameter acquisition mechanism. This is obtained by the above-described parameter which is generated by the above-described determination gas flowing through the above-described determination gas inflow means. According to a second aspect of the invention, there is provided a vacuum pump determination system according to the first aspect of the invention, comprising: a parameter change obtaining unit that acquires a change in the obtained parameter, and further includes a determination unit that is obtained by the parameter change obtaining unit The change of the above parameters is compared with a reference value of the change of the above-mentioned specific parameters which are memorized in advance, thereby determining whether or not an abnormality has occurred in the vacuum pump. The invention of claim 3 provides the judgment system of the vacuum pump of the first aspect or the second aspect, which comprises a display mechanism for displaying the above parameters or variations of the above parameters. The present invention provides the vacuum pump judging system according to any one of claims 1 to 3, wherein the judging gas system flows through a gas other than the processing gas of the apparatus during the operation of the apparatus. The invention of claim 5 provides the judgment system of the vacuum pump of the fourth aspect, wherein the judgment gas is nitrogen or argon. The present invention provides the vacuum pump judging system according to any one of claims 1 to 3, wherein the judging gas system flows through the processing gas of the apparatus during operation of the apparatus. The invention of claim 7 provides a vacuum pump judging system characterized in that it is determined in advance by the various parameters of the vacuum pump that the vacuum pump predicts that an abnormality will occur, and includes: a cleaning gas inflow mechanism, which is tied to In the non-operation of the apparatus in which the vacuum pump is disposed, the cleaning gas is distributed inside the vacuum pump; and the parameter obtaining means obtains the parameter caused by the gas flowing through the cleaning gas inflow means. The invention of claim 8 provides the vacuum pump determination system according to claim 7, further comprising a display means for displaying the parameter obtained by the parameter obtaining means. The invention of claim 9 provides a vacuum pump characterized by comprising the judgment system of the vacuum pump according to any one of claims 1 to 8. [Effects of the Invention] According to the present invention, it is possible to determine in advance from the parameters of the vacuum pump that the abnormal state that will occur will be predicted. Further, it is possible to take countermeasures against the abnormal state and determine that the abnormal state has been released by taking countermeasures.
(i)實施形態之概要 包含本發明之實施形態1之真空泵之判斷系統之真空泵(乾式泵)係設為於未進行處理之狀態時，自配設於該真空泵之處理裝置側使該處理裝置所規定之處理氣體以外之特定之氣體(之後、設為異常測定用氣體(判斷用氣體))流通通常流通量以上之量之構成。即，將該真空泵(乾式泵)設為超負荷之狀態。藉此，自各感測器取得更敏銳反應之各參數。如此，藉由使其敏銳地反應，可更正確地捕捉各參數之變化。 又，包含本發明之實施形態2之真空泵之判斷系統之真空泵(乾式泵)係設為與流通真空腔室用之清洗氣體而進行真空泵(乾式泵)內之清洗同時，監控(監視)該真空泵之參數自增大(放大)之數值返回至原來值之過程之構成。 (ii)實施形態1之詳情 以下，對本發明之較佳實施形態，參照圖1至圖4而詳細地說明。 圖1係顯示用以說明本發明之實施形態1(及後述之實施形態2)之真空泵之判斷系統20(及後述之真空泵之判斷系統21)之概略構成例之圖。 本發明之實施形態1之真空泵之判斷系統20係由真空腔室11、真空泵12、真空配管4、真空泵2、供自真空泵2排出之排出氣體流通之排氣配管5、用以使自排氣配管5排氣之排出氣體去毒化之去毒化裝置3、以及伺服器6等構成。 真空腔室11係晶圓成膜裝置等之處理裝置(處理腔室)、設置於無塵室內。 真空泵12係用以將處理裝置設為真空之真空泵，例如渦輪分子泵。 真空配管4係供自真空泵12排出之排出氣體流通之流路。 真空泵2係發揮如真空泵12之輔助泵般之作用之乾式泵，經由真空配管4而與真空泵12連結。 排氣配管5係供自真空泵2排出之排出氣體流通之流路。 去毒化裝置3係經由排氣配管5而與真空泵2連結之燃燒式、電漿式、或汽油發動機式之去毒化裝置。 自由真空腔室11或真空泵12構成之處理裝置1排出之排出氣體若通過真空配管4而經由真空泵2，通過排氣配管5而向去毒化裝置3搬送，則藉由於去毒化裝置3中氧化，而作為無害之氣體排出。 伺服器6係由CPU(Central Processing Unit:中央處理單元)61、ROM(Read Only Memory:唯讀記憶體)62、RAM(Random Access Memory:隨機存取記憶體)63、顯示裝置64、通信部65、記憶部66及匯流排線67等構成。 CPU61係伺服器6之中央運算處理裝置，藉由保存於ROM62等之本實施形態1之真空泵之判斷系統20用應用程式等之程式，而由RAM63進行各種數值計算或資訊處理、機器控制等。於本實施形態1中，進行關於真空泵之判斷系統20控制之各種運算。 顯示裝置64係用以進行資訊顯示之顯示部，於本實施形態1中，顯示真空泵之判斷系統20之參數之增減。 另，亦可將顯示裝置64設為包含可接收輸入操作之輸入部之構成。 通信部65係用以使伺服器6與真空泵之判斷系統20內之其他裝置(真空泵2等)通信之構成，可由無線通信與有線通信之任一者之構成設計。 記憶部66係由硬碟等構成之大規模記憶裝置，記憶例如使用於各種判斷之基準參數。 上述之各構成為了於伺服器6內交換各者之資料，而由共通之路徑即匯流排線67連接。 該伺服器6可於各真空泵2分別設置，亦可以一台伺服器6與工廠內之複數台真空泵2連接而進行處理。 又，亦可藉由以網際網路等連接，由一台伺服器6進行處理設置於複數個工廠之多個真空泵2。 於本發明之實施形態1之真空泵之判斷系統20中，設為於未進行處理之狀態時，使通常流通於處理裝置1之量以上之量之於該處理裝置1規定之處理氣體以外之特定氣體即異常測定用氣體自配設於真空泵2之處理裝置1側之真空配管4朝真空泵2流通之構成。 於本實施形態1中，於顯示裝置64顯示因流通異常測定用氣體而產生之參數之增減(判斷畫面)。 另，於顯示裝置64，可顯示取得之參數本身，亦可將取得之參數與特定之基準值進行比較，藉此顯示其變化。 圖2係用以說明本發明之真空泵之判斷系統20之判斷(監視)畫面之圖。 於真空泵之判斷系統20中，若於上述般於真空泵2流通以規定以上之量之異常測定用氣體，則如圖2所示般，將針對真空泵2監控之各種參數(例如、電流之數值、電壓之數值、溫度之數值、振動之數值、或將各者組合之數值等)之可變要因增大之狀況顯示於顯示裝置64。於該實施形態1中，流通以較通常量之氣體更多量之氣體。藉此，可藉由檢測之異常測定用氣體敏銳地反應，可提高取得之各參數之精度。 「SURGE」係顯示較流通以通常之量之氣體時之基準值異常高之數值之點。 「DIP」係顯示較流通以通常之量之氣體時之基準值異常低之數值之點。該等基準值係預先記憶於記憶部66。 自如此獲得之參數之變動數值，可事前對預測將發生之真空泵2之異常狀態捕捉其前兆，早期建立異常發生之標準或預定、預測。 另，將「SURGE」位準或「DIP」位準如何設定係採取與裝置(真空泵2)各者之狀況配合，設定最適值之構成。 另，異常測定用氣體較佳為氮氣(N2 )或氬氣(Ar)等之不產生堆積物之氣體、或矽烷(SiH4 、甲矽烷)。 又，異常測定用氣體可設為定期流通之構成，亦可設為不定期流通之構成。另，所謂通常流通之量以上係通常流通之處理氣體之量之數倍、數百倍、數千倍等，可根據狀況而對應。 進而，於上述之構成中，採取自配設於真空泵2之真空配管4流通異常測定用氣體之構成，但並非受此限定。例如，亦可設為經由配設於真空泵2之上游之處理裝置1而使異常測定用氣體流通之構成。 圖3係用以說明本發明之實施形態1之真空泵之判斷系統20之動作之流程圖。 於本實施形態1之真空泵之判斷系統20中，首先，伺服器6(CPU61)判斷配設於真空泵2之上游之處理裝置1是否為處理中(步驟10)。 於判斷處理裝置1為處理中之情形時(步驟10:Y)、伺服器6持續監視是否為處理中。或，亦可設為於此處結束一連串動作之構成(結束)。 未判斷處理裝置1為處理中之情形時(步驟10:N)，伺服器6使異常測定用氣體大量(即、於處理中流通入處理裝置1之氣體量以上之量)流入真空泵2 (步驟20)。 該異常測定用氣體之流入係藉由伺服器6之控制，自設置於真空配管4之流入口(未圖示)自動流入。又，管理者亦可基於來自伺服器6之信號而使異常測定用氣體流入。 進而，亦可藉由伺服器6之控制，自設置於處理裝置1之流入口(未圖示)流入。 接著，伺服器6將顯示因流通異常測定用氣體而增大之真空泵2之參數之分析畫面(圖2)顯示於顯示裝置64(步驟30)。 此時，亦可設為如下構成：判斷增大(即顯示異常值)之參數是否於「SURGE」位準與「DIP」位準之範圍內，於非於範圍內之情形時，發出警告音等之警報。另，於該情形時，亦可設為於伺服器6包含聲音裝置之構成。該警告係分為緊急之警告、及其前階段而進行。 該判斷係基於相對於記憶於記憶部66之各參數之「SURGE」位準與「DIP」位準之基準值而判斷。該基準值係藉由經過多個處理之過程依序更新。即，藉由加入各基準值過高、或過低等之處理之評價，可設定更適當之基準值。 該基準值之更新係使CPU61藉由來自管理者之輸入，變更記憶於記憶部66之基準值之值而進行。 該基準值亦可根據真空泵2之設置場所之條件、使用之氣體種類、該真空泵之使用年數、合計之使用時間等更細緻、詳細地設定。 另，對管理者之警告亦可設為藉由伺服器6之管理者目測顯示裝置64，而判斷真空泵2發生異常之前兆之構成。 接著，伺服器6判斷是否繼續進行流通異常測定用氣體之動作(步驟40)。關於該繼續進行之判斷可設為事先設定自開始流通異常測定用氣體後開始計算之流入持續時間、或事先指定之參數到達事先設定之閾值之時點等之構成，亦可設為接收伺服器6之管理者之動作停止輸入之構成。 於繼續進行動作之情形時(步驟40:Y)、伺服器6使異常測定用氣體持續流通(步驟20)，另一方面，於不持續進行動作之情形時(步驟40:N)，伺服器6結束一連串動作(結束)。 藉由上述之構成，於包含本發明之實施形態1之真空泵之判斷系統20之真空泵2中，藉由流通以規定以上之量之異常測定用氣體，使針對真空泵2而監控之各種參數(例如、電流之數值、電壓之數值、溫度之數值、振動之數值、或使各者組合之數值等)之可變要素增大，然後自獲得之參數之變動數值(圖2)，可事先針對預測將發生之真空泵2之異常狀態而早期建立其標準或預定、預測。 其結果，關於真空泵2之異常發生，可早期檢測，或提高檢測之概率，或提高故障診斷之可靠性。 又，基於該預測，可於發生異常狀態前進行真空泵2之保養，故可使真空泵2之壽命延長。 (iii)實施形態2之詳情 接著，再次使用圖1，對本發明之實施形態2之真空泵之判斷系統21進行說明。 於本發明之實施形體2中，與上述之實施形態1相同，自由真空腔室11、或渦輪分子泵等之真空泵12構成之處理裝置1排出之排出氣體係通過真空配管4而經由乾式泵即真空泵2，通過排氣配管5而向去毒化裝置3搬送。 然而，於本實施形態2中，伺服器6之CPU61藉由保存於ROM62等之真空泵之判斷系統21用應用程式等之程式，於RAM63中進行與真空泵之判斷系統21之控制有關之各種運算即各種數值計算或資訊處理、機器控制等。 又，於本實施形態2中，顯示裝置64顯示真空泵之判斷系統21之參數之增減。 於本發明之實施形態2之真空泵之判斷系統21中，設為真空腔室11用之清洗氣體自配設於該真空泵2之處理裝置1側之真空配管4流通至真空泵2之構成。 即，於真空泵之判斷系統21中，一面使真空腔室11用之清洗氣體朝真空泵2流通，一面進行真空泵2內部之清洗，與此同時，將真空泵2之與通常之數值相比增大(即，顯示真空泵2為異常狀態)之參數恢復至原來數值之過程(例如，於圖2中，超過「SURGE」位準之值或低於「DIP」位準之值恢復為「SURGE」位準與「DIP」位準之範圍內之狀況)顯示於顯示裝置64。 另，使用之清洗氣體較佳為NF3 (三氟化氮)、或F2 (氟)等之減少堆積物之氣體。 進而，於上述之構成中，採取自處理裝置1側之真空配管4流通清洗氣體之構成，但並非限定於此。例如，亦可採取以與於處理裝置1(真空腔室11)流通真空腔室11用之清洗氣體之時點相同之時點，於真空泵2亦流通(沿用)該清洗氣體之構成。 圖4係用以說明本發明之實施形態2之真空泵之判斷系統21之動作之流程圖。 於本實施形態2之真空泵之判斷系統21中，首先，伺服器6判斷配設於真空泵2之上游之處理裝置1是否為處理中(步驟50)。 於判斷處理裝置1為處理中之情形時(步驟50:Y)，伺服器6持續監視是否為處理中。或，亦可設為於此處結束一連串動作之構成(結束)。 另一方面，未判斷處理裝置1為處理中之情形時(步驟50:N)，伺服器6使清洗氣體向真空泵2流入(步驟60)。 接著，伺服器6藉由流通清洗氣體而將顯示下降之(即、回到正常值之)參數之分析畫面顯示於顯示裝置64(步驟70)。 此時，亦可設為如下構成：判斷下降之參數是否於「SURGE」位準與「DIP」位準之範圍內，於未於範圍內之情形時，發出警告音等之警報。該判斷亦可藉由與記憶於記憶部66之基準值比較而進行。 另，該情形係採取於伺服器6包含聲音裝置之構成。 又，亦可設為伺服器6之管理者目測顯示裝置64而進行其判斷之構成。 接著，真空泵之判斷系統21之伺服器6判斷是否繼續進行流通清洗氣體之動作(步驟80)。關於該繼續進行之判斷可設為事先設定自開始流通清洗氣體後開始計算之流入持續時間、或事先指定之參數到達事先設定之閾值之時點等之構成，亦可設為接收伺服器6之管理者之動作停止輸入之構成。 於繼續進行動作之情形時(步驟80:Y)，伺服器6持續流通清洗氣體(步驟60)，另一方面，於不繼續進行動作之情形時(步驟80:N)，伺服器6結束一連串之動作(結束)。 藉由流通清洗氣體，根據真空泵2之參數之變化，亦可判斷該真空泵2之狀態改善何種程度。 藉由上述之構成，於包含本發明之實施形態2之判斷系統21之真空泵2中，可自監控之參數之變化判斷已解除該異常狀態。 其結果，可不取下真空泵2(不更換)而進行保養。又，由於係於發生異常狀態前進行保養，故可使真空泵2之壽命延長。 本發明之特定之氣體係設為除了於處理裝置規定之處理氣體以外，若為流通以於通常之處理裝置之運轉中流通之量以上之流量，則亦可設為處理氣體。 另，亦可設為將本發明之實施形態1及實施形態2組合之構成。(i) Summary of the embodiment The vacuum pump (dry pump) of the vacuum pump determination system according to the first embodiment of the present invention is configured such that the processing device is disposed on the processing device side of the vacuum pump when the processing is not performed. A specific gas other than the predetermined processing gas (hereinafter, an abnormal measurement gas (determination gas)) is configured to flow in an amount equal to or higher than the normal circulation amount. That is, the vacuum pump (dry pump) is placed in an overload state. Thereby, each parameter of the more sensitive reaction is obtained from each sensor. In this way, by making it keenly react, the change of each parameter can be more accurately captured. Further, the vacuum pump (dry pump) including the determination system of the vacuum pump according to the second embodiment of the present invention is configured to monitor (monitor) the vacuum pump while performing the cleaning in the vacuum pump (dry pump) with the cleaning gas for the vacuum chamber. The parameter is a component of the process of returning to the original value from the value of the increase (amplification). (ii) Details of Embodiment 1 Hereinafter, preferred embodiments of the present invention will be described in detail with reference to FIGS. 1 to 4 . Fig. 1 is a view showing a schematic configuration example of a determination system 20 (and a determination system 21 of a vacuum pump to be described later) of the vacuum pump according to the first embodiment (and the second embodiment to be described later) of the present invention. The vacuum pump determination system 20 according to the first embodiment of the present invention is a vacuum chamber 11, a vacuum pump 12, a vacuum pipe 4, a vacuum pump 2, and an exhaust pipe 5 through which the exhaust gas discharged from the vacuum pump 2 flows, for self-venting The detoxification device 3 for detoxification of the exhaust gas of the exhaust gas of the piping 5, and the servo 6 and the like are constituted. The vacuum chamber 11 is a processing device (processing chamber) such as a wafer film forming apparatus, and is installed in a clean room. The vacuum pump 12 is a vacuum pump for setting the processing device to a vacuum, such as a turbo molecular pump. The vacuum piping 4 is a flow path through which the exhaust gas discharged from the vacuum pump 12 flows. The vacuum pump 2 is a dry pump that functions as an auxiliary pump of the vacuum pump 12, and is connected to the vacuum pump 12 via the vacuum pipe 4. The exhaust pipe 5 is a flow path through which the exhaust gas discharged from the vacuum pump 2 flows. The detoxification device 3 is a combustion type, a plasma type, or a gasoline engine type detoxification device that is connected to the vacuum pump 2 via the exhaust pipe 5. When the exhaust gas discharged from the processing apparatus 1 constituted by the free vacuum chamber 11 or the vacuum pump 12 is transported to the detoxification device 3 through the evacuation pipe 5 via the vacuum pipe 2 through the vacuum pipe 4, the deoxidation device 3 is oxidized. It is discharged as a harmless gas. The server 6 is a CPU (Central Processing Unit) 61, a ROM (Read Only Memory) 62, a RAM (Random Access Memory) 63, a display device 64, and a communication unit. 65. The memory unit 66 and the bus bar 67 are configured. The CPU 61 is a central processing unit of the server 6, and is stored in the determination system 20 of the vacuum pump of the first embodiment, such as the ROM 62, by a program such as an application program, and the RAM 63 performs various numerical calculations, information processing, machine control, and the like. In the first embodiment, various calculations relating to the control of the vacuum pump determination system 20 are performed. The display device 64 is a display unit for displaying information, and in the first embodiment, the parameter of the vacuum pump determination system 20 is displayed. Alternatively, the display device 64 may be configured to include an input unit that can receive an input operation. The communication unit 65 is configured to allow the server 6 to communicate with another device (vacuum pump 2 or the like) in the vacuum pump determination system 20, and can be designed by any of wireless communication and wired communication. The memory unit 66 is a large-scale memory device composed of a hard disk or the like, and is used for, for example, a reference parameter for various determinations. Each of the above-described configurations is connected to the common line, that is, the bus bar 67, in order to exchange the data of each of the servers. The server 6 may be provided separately for each of the vacuum pumps 2, or one server 6 may be connected to a plurality of vacuum pumps 2 in the factory for processing. Further, a plurality of vacuum pumps 2 provided in a plurality of factories may be processed by one server 6 by being connected via the Internet or the like. In the determination system 20 of the vacuum pump according to the first embodiment of the present invention, when the processing is not performed, the amount that is normally equal to or larger than the amount of the processing device 1 is equal to the processing gas specified by the processing device 1. The gas which is an abnormal gas for measurement is configured to flow from the vacuum pipe 4 disposed on the processing device 1 side of the vacuum pump 2 to the vacuum pump 2. In the first embodiment, the display device 64 displays an increase or decrease of a parameter (determination screen) generated by the flow of the abnormal measurement gas. Alternatively, the display device 64 may display the acquired parameter itself, or may compare the acquired parameter with a specific reference value to display the change. Fig. 2 is a view for explaining a judgment (monitoring) screen of the judgment system 20 of the vacuum pump of the present invention. In the vacuum pump determination system 20, if the abnormal measurement gas is supplied in a predetermined amount or more to the vacuum pump 2 as described above, various parameters (for example, current values) for the vacuum pump 2 are monitored as shown in FIG. A condition in which the variable factor of the value of the voltage, the value of the temperature, the value of the vibration, or the value of each combination is increased is displayed on the display device 64. In the first embodiment, a larger amount of gas is supplied in a more normal amount of gas. Thereby, the accuracy of each parameter obtained can be improved by keenly reacting the gas for detecting abnormality. "SURGE" indicates the point at which the reference value of the normal amount of gas is abnormally high. "DIP" is a point which shows a value which is abnormally lower than the reference value when a normal amount of gas is circulated. These reference values are stored in advance in the storage unit 66. From the variation value of the parameter thus obtained, the precursor state of the vacuum pump 2 which is predicted to be predicted can be captured in advance, and the criterion for the occurrence of the abnormality or the prediction or prediction can be established in the early stage. In addition, how to set the "SURGE" level or the "DIP" level is to match the condition of each device (vacuum pump 2) and set the optimum value. Further, the gas for abnormal measurement is preferably a gas such as nitrogen (N 2 ) or argon (Ar) which does not generate a deposit, or decane (SiH 4 or formane). Further, the abnormal measurement gas may be configured to be periodically distributed, or may be configured to be irregularly distributed. In addition, the amount of the normal circulation or more is several times, several hundred times, several thousand times, etc. of the amount of the processing gas which normally flows, and can respond according to a situation. Further, in the above-described configuration, the configuration is such that the gas for abnormal measurement is distributed from the vacuum pipe 4 disposed in the vacuum pump 2, but the invention is not limited thereto. For example, the abnormal measurement gas may be configured to flow through the processing device 1 disposed upstream of the vacuum pump 2 . Fig. 3 is a flow chart for explaining the operation of the judgment system 20 of the vacuum pump according to the first embodiment of the present invention. In the determination system 20 of the vacuum pump according to the first embodiment, first, the server 6 (CPU 61) determines whether or not the processing device 1 disposed upstream of the vacuum pump 2 is in process (step 10). When it is judged that the processing device 1 is in the process (step 10: Y), the server 6 continuously monitors whether or not it is in progress. Alternatively, it may be set to end the series of actions (end) here. When it is not determined that the processing device 1 is in the process (step 10: N), the server 6 causes a large amount of abnormal measurement gas (that is, an amount of gas that flows into the processing device 1 during processing) to flow into the vacuum pump 2 (step 20). The inflow of the abnormal measurement gas is automatically introduced from the inlet (not shown) provided in the vacuum pipe 4 by the servo 6. Further, the manager can also cause the abnormal measurement gas to flow in based on the signal from the server 6. Further, it is also possible to flow in from the inlet (not shown) provided in the processing apparatus 1 by the control of the server 6. Next, the server 6 displays an analysis screen (FIG. 2) showing the parameters of the vacuum pump 2 that is increased by the flow of the abnormality measurement gas on the display device 64 (step 30). In this case, it may be configured to determine whether the parameter of the increase (that is, the display of the abnormal value) is within the range of the "SURGE" level and the "DIP" level, and sounds a warning sound when the range is not within the range. Wait for the alarm. Further, in this case, the server 6 may be configured to include an audio device. This warning is divided into an emergency warning and its previous stage. This determination is based on the reference value of the "SURGE" level and the "DIP" level of each parameter stored in the memory unit 66. The reference value is updated sequentially by the process of multiple processes. That is, a more appropriate reference value can be set by adding an evaluation of processing in which each reference value is too high or too low. The update of the reference value is performed by changing the value of the reference value stored in the memory unit 66 by the input from the manager. The reference value may be set in more detail and in detail depending on the conditions of the installation place of the vacuum pump 2, the type of gas used, the number of years of use of the vacuum pump, and the total usage time. Further, the warning to the manager may be made by visually observing the display device 64 by the manager of the server 6, and judging that the vacuum pump 2 is abnormal. Next, the server 6 determines whether or not the operation of the gas for abnormality measurement is continued (step 40). In the determination of the continuation, the inflow duration calculated from the start of the flow of the abnormal measurement gas, or the time when the previously designated parameter reaches the threshold value set in advance may be set, and the receiving server 6 may be used. The manager's action stops the input configuration. When the operation is continued (step 40: Y), the server 6 continues to flow the abnormal measurement gas (step 20), and when the operation is not continued (step 40: N), the server 6 End a series of actions (end). According to the configuration described above, in the vacuum pump 2 including the determination system 20 of the vacuum pump according to the first embodiment of the present invention, various parameters (for example, the vacuum pump 2 are monitored by circulating the abnormal measurement gas in a predetermined amount or more. The variable element of the value of the current, the value of the voltage, the value of the voltage, the value of the vibration, the value of the vibration, or the value of each combination is increased, and then the value of the parameter obtained from the parameter (Fig. 2) can be predicted in advance. The abnormal state of the vacuum pump 2 will occur and its standard or schedule or prediction will be established early. As a result, regarding the abnormality of the vacuum pump 2, early detection can be performed, or the probability of detection can be improved, or the reliability of the failure diagnosis can be improved. Further, based on the prediction, the maintenance of the vacuum pump 2 can be performed before the abnormal state occurs, so that the life of the vacuum pump 2 can be extended. (iii) Details of the second embodiment Next, the determination system 21 of the vacuum pump according to the second embodiment of the present invention will be described with reference to Fig. 1 again. In the embodiment 2 of the present invention, as in the first embodiment, the exhaust gas system discharged from the processing device 1 including the vacuum chamber 11 or the vacuum pump 12 such as a turbo molecular pump is passed through the vacuum pipe 4 via the dry pump. The vacuum pump 2 is transported to the detoxification device 3 through the exhaust pipe 5. However, in the second embodiment, the CPU 61 of the server 6 performs various calculations relating to the control of the vacuum pump determination system 21 in the RAM 63 by the judgment system 21 of the vacuum pump stored in the ROM 62 or the like using an application program or the like. Various numerical calculations or information processing, machine control, etc. Further, in the second embodiment, the display device 64 displays the increase or decrease of the parameters of the determination system 21 of the vacuum pump. In the determination system 21 of the vacuum pump according to the second embodiment of the present invention, the cleaning gas for the vacuum chamber 11 is configured to flow from the vacuum pipe 4 disposed on the processing device 1 side of the vacuum pump 2 to the vacuum pump 2. In other words, in the vacuum pump determination system 21, while the cleaning gas for the vacuum chamber 11 is circulated toward the vacuum pump 2, the inside of the vacuum pump 2 is cleaned, and at the same time, the vacuum pump 2 is increased in comparison with a normal value ( That is, the process of returning the parameter of the vacuum pump 2 to the abnormal state is returned to the original value (for example, in FIG. 2, the value exceeding the "SURGE" level or lower than the "DIP" level is restored to the "SURGE" level. The status within the range of the "DIP" level is displayed on the display device 64. Further, the cleaning gas to be used is preferably a gas which reduces deposits such as NF 3 (nitrogen trifluoride) or F 2 (fluorine). Further, in the above-described configuration, the configuration is such that the cleaning gas is supplied from the vacuum pipe 4 on the processing device 1 side, but the configuration is not limited thereto. For example, it is also possible to adopt a configuration in which the cleaning gas is also circulated (used) in the vacuum pump 2 at the same time as when the cleaning gas for the vacuum chamber 11 is passed through the processing device 1 (vacuum chamber 11). Fig. 4 is a flow chart for explaining the operation of the judgment system 21 of the vacuum pump according to the second embodiment of the present invention. In the determination system 21 of the vacuum pump according to the second embodiment, first, the server 6 determines whether or not the processing device 1 disposed upstream of the vacuum pump 2 is in process (step 50). When it is judged that the processing device 1 is in the process (step 50: Y), the server 6 continuously monitors whether it is in progress. Alternatively, it may be set to end the series of actions (end) here. On the other hand, when it is not determined that the processing device 1 is in the process (step 50: N), the server 6 causes the cleaning gas to flow into the vacuum pump 2 (step 60). Next, the server 6 displays the analysis screen of the parameter which is displayed (i.e., returns to the normal value) on the display device 64 by flowing the cleaning gas (step 70). In this case, it may be configured to determine whether the parameter of the fall is within the range of the "SURGE" level and the "DIP" level, and to give an alarm such as a warning sound when the range is not within the range. This determination can also be made by comparing with the reference value stored in the memory unit 66. In addition, this case is adopted in the case where the server 6 includes a sound device. Further, it is also possible to configure the display unit 64 of the server 6 to perform the determination. Next, the server 6 of the vacuum pump judging system 21 judges whether or not the operation of circulating the purge gas is continued (step 80). The determination of the continuation may be performed by setting the inflow duration calculated from the start of the flow of the purge gas or the time when the predetermined parameter reaches the threshold value set in advance, or may be configured as the management of the receiving server 6. The action of the person stops the input. When the operation is continued (step 80: Y), the server 6 continues to flow the cleaning gas (step 60), and on the other hand, when the operation is not continued (step 80: N), the server 6 ends the series. The action (end). By circulating the cleaning gas, it is also possible to determine to what extent the state of the vacuum pump 2 is improved based on the change in the parameters of the vacuum pump 2. According to the above configuration, in the vacuum pump 2 including the determination system 21 according to the second embodiment of the present invention, it is judged that the abnormal state has been canceled from the change of the monitored parameter. As a result, maintenance can be performed without removing the vacuum pump 2 (not replacing). Further, since the maintenance is performed before the abnormal state occurs, the life of the vacuum pump 2 can be extended. The specific gas system of the present invention may be a processing gas, in addition to the processing gas specified by the processing apparatus, if it is a flow rate equal to or higher than the amount of the normal processing apparatus. Further, the configuration of the first embodiment and the second embodiment of the present invention may be combined.
1‧‧‧處理裝置
2‧‧‧真空泵(乾式泵)
3‧‧‧去毒化裝置
4‧‧‧真空配管
5‧‧‧排氣配管
6‧‧‧伺服器
11‧‧‧真空腔室
12‧‧‧真空泵(渦輪分子泵)
20‧‧‧真空泵之判斷系統
21‧‧‧真空泵之判斷系統
61‧‧‧CPU
62‧‧‧ROM
63‧‧‧RAM
64‧‧‧顯示裝置
65‧‧‧通信部
66‧‧‧記憶部
67‧‧‧匯流排線
S10‧‧‧步驟
S20‧‧‧步驟
S30‧‧‧步驟
S40‧‧‧步驟
S50‧‧‧步驟
S60‧‧‧步驟
S70‧‧‧步驟
S80‧‧‧步驟1‧‧‧Processing device
2‧‧‧Vacuum pump (dry pump)
3‧‧‧Detoxification device
4‧‧‧ Vacuum piping
5‧‧‧Exhaust piping
6‧‧‧Server
11‧‧‧vacuum chamber
12‧‧‧Vacuum pump (turbo molecular pump)
20‧‧‧Vacuum pump judgment system
21‧‧‧Vacuum pump judgment system
61‧‧‧CPU
62‧‧‧ROM
63‧‧‧RAM
64‧‧‧ display device
65‧‧‧Communication Department
66‧‧‧Memory Department
67‧‧‧ bus bar
S10‧‧‧ steps
S20‧‧‧ steps
S30‧‧‧ steps
S40‧‧‧ steps
S50‧‧ steps
S60‧‧ steps
S70‧‧‧ steps
S80‧‧‧ steps
圖1係顯示用以說明本發明之真空泵之判斷系統之概略構成例之圖。 圖2係用以說明本發明之真空泵之判斷系統之監視畫面之圖。 圖3係用以說明本發明之實施形態1之真空泵之判斷系統之動作之流程圖。 圖4係用以說明本發明之實施形態2之真空泵之判斷系統之動作之流程圖。 圖5係顯示用以說明異常發生相關之參數分析之一例之圖。Fig. 1 is a view showing a schematic configuration example of a determination system of a vacuum pump of the present invention. Fig. 2 is a view for explaining a monitoring screen of the judgment system of the vacuum pump of the present invention. Fig. 3 is a flow chart for explaining the operation of the judgment system of the vacuum pump according to the first embodiment of the present invention. Fig. 4 is a flow chart for explaining the operation of the determination system of the vacuum pump according to the second embodiment of the present invention. Fig. 5 is a view showing an example of parameter analysis for explaining the occurrence of an abnormality.
1‧‧‧處理裝置 1‧‧‧Processing device
2‧‧‧真空泵(乾式泵) 2‧‧‧Vacuum pump (dry pump)
3‧‧‧去毒化裝置 3‧‧‧Detoxification device
4‧‧‧真空配管 4‧‧‧ Vacuum piping
5‧‧‧排氣配管 5‧‧‧Exhaust piping
6‧‧‧伺服器 6‧‧‧Server
11‧‧‧真空腔室 11‧‧‧vacuum chamber
12‧‧‧真空泵(渦輪分子泵) 12‧‧‧Vacuum pump (turbo molecular pump)
20‧‧‧真空泵之判斷系統 20‧‧‧Vacuum pump judgment system
21‧‧‧真空泵之判斷系統 21‧‧‧Vacuum pump judgment system
61‧‧‧CPU 61‧‧‧CPU
62‧‧‧ROM 62‧‧‧ROM
63‧‧‧RAM 63‧‧‧RAM
64‧‧‧顯示裝置 64‧‧‧ display device
65‧‧‧通信部 65‧‧‧Communication Department
66‧‧‧記憶部 66‧‧‧Memory Department
67‧‧‧匯流排線 67‧‧‧ bus bar
Claims (9)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015218605A JP2017089462A (en) | 2015-11-06 | 2015-11-06 | Determination system of vacuum pump and vacuum pump |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201727073A true TW201727073A (en) | 2017-08-01 |
Family
ID=58663000
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW105134243A TW201727073A (en) | 2015-11-06 | 2016-10-24 | A determination system used for a vacuum pump and a vacuum pump |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2017089462A (en) |
| TW (1) | TW201727073A (en) |
| WO (1) | WO2017077970A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11371499B2 (en) | 2018-04-17 | 2022-06-28 | Dartpoint Tech. Co., Ltd. | Pump control system and operating method thereof |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019013118A1 (en) * | 2017-07-14 | 2019-01-17 | エドワーズ株式会社 | Vacuum pump, temperature adjustment control device applied to vacuum pump, inspection tool, and diagnosis method for temperature adjustment function unit |
| JP6942610B2 (en) | 2017-07-14 | 2021-09-29 | エドワーズ株式会社 | A method for diagnosing a vacuum pump, a temperature control control device applied to the vacuum pump, an inspection jig, and a temperature control function unit. |
| EP3916231A1 (en) * | 2020-05-29 | 2021-12-01 | Agilent Technologies, Inc. | Vacuum pumping system having a plurality of positive displacement vacuum pumps and method for operating the same |
| JP7374158B2 (en) | 2021-10-15 | 2023-11-06 | 株式会社荏原製作所 | Product removal device, treatment system and product removal method |
| JP7849202B2 (en) * | 2022-03-25 | 2026-04-21 | エドワーズ株式会社 | Cleaning method for vacuum exhaust systems and vacuum pumps |
| JP7681934B2 (en) * | 2022-12-22 | 2025-05-23 | カンケンテクノ株式会社 | Dry vacuum pump cleaning method and dry vacuum pump cleaning device |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003232292A (en) * | 2002-02-08 | 2003-08-22 | Boc Edwards Technologies Ltd | Vacuum pump |
| GB0217494D0 (en) * | 2002-07-29 | 2002-09-04 | Boc Group Plc | Conditioning monitoring of pumps and pump systems |
| DE102004063058A1 (en) * | 2004-12-22 | 2006-07-13 | Leybold Vacuum Gmbh | Method for cleaning a vacuum screw pump |
| GB0607616D0 (en) * | 2006-04-18 | 2006-05-31 | Boc Group Plc | Vacuum pumping system |
| US9777612B2 (en) * | 2012-04-24 | 2017-10-03 | Edwards Japan Limited | Deposit detection device for exhaust pump and exhaust pump |
-
2015
- 2015-11-06 JP JP2015218605A patent/JP2017089462A/en active Pending
-
2016
- 2016-10-24 TW TW105134243A patent/TW201727073A/en unknown
- 2016-10-31 WO PCT/JP2016/082228 patent/WO2017077970A1/en not_active Ceased
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11371499B2 (en) | 2018-04-17 | 2022-06-28 | Dartpoint Tech. Co., Ltd. | Pump control system and operating method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2017089462A (en) | 2017-05-25 |
| WO2017077970A1 (en) | 2017-05-11 |
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