TW201729332A - Substrate processing device - Google Patents

Abstract

The present invention relates to a substrate processing apparatus for processing a substrate by using a plate substrate holder and at least one plate tempering device arranged parallel to the substrate holder, wherein the substrate holder includes at least one layer substrate for supporting The front side of the substrate holder and the back side of the substrate holder facing the tempering device. It is therefore an object of the present invention to provide a substrate processing apparatus that enables the heat distribution in the substrate carrier to be as uniform as possible. According to the present invention, it is an object of the present invention to provide a spacer element for forming a distance between the substrate holder and the tempering device on the back side of the substrate holder and/or facing the substrate holder The surface of the tempering device is achieved.

Description

Substrate processing device

The present invention relates to a substrate processing apparatus for processing a substrate by a plate substrate holder and at least one plate tempering device arranged parallel to the substrate holder, wherein the substrate holder includes at least one layer substrate for supporting The front side of the substrate holder and the back side of the substrate holder facing the tempering device.

The substrate processing apparatus is known, for example, from the document DE 10 2010 000 001 A1. Therein, a layered semiconductor substrate such as a germanium wafer is moved through a processing chamber to a plate substrate carrier for deposition of, for example, a passivation layer on the semiconductor substrate. For this purpose, the semiconductor substrate is placed on the front side of the substrate carrier, however at least one plate-like heating and/or cooling device is arranged to face the back side of the substrate carrier.

For the substrate processing apparatus, there is typically a direct, layered contact between the substrate carrier and the heating and/or cooling device, which may for example be a heating plate. In practice, however, this layered contact never covers the entire surface undesirably, but because of the irregularities within the surface of the substrate carrier and the heating plate, it is often impossible to accurately determine, unevenly, rather than layered applications. . Thus, in In the case of a heating device, the heating of the substrate carrier and thus the heating of the overlapping substrates is typically concentrated on individual regions. This results in a non-homogeneous, uneven heat distribution within the substrate carrier such that distortion and tension can be formed in the substrate carrier such that it can deform itself. Moreover, uneven heat distribution within the substrate carrier results in uneven tempering of at least one substrate provided on the front side of the substrate carrier.

Accordingly, it is an object of the present invention to provide a substrate processing apparatus that makes the heat distribution within the substrate carrier as uniform as possible.

Providing at least one spacer element on a surface of the back side of the substrate holder and/or the tempering device facing the substrate holder, in order to form a distance between the substrate holder and the tempering device, It is achieved according to the object of the invention.

Thus, in accordance with the present invention, at least one spacer element, i.e., a spacer, is provided between the substrate carrier and the tempering device, thus avoiding direct contact between the substrate carrier and the tempering device. In this way, the point-like hot spots within the substrate carrier, that is, the so-called hot spots, the heterogeneity of the distance between the substrate holder and the tempering device can be avoided, which can be caused by, for example, processing tolerances. Can be compensated by at least one spacer element. For example, a pattern of several spacer elements can be provided that accurately compensate for the heterogeneity in its location of occurrence. Through this, a uniform uniform distance between the substrate holder and the tempering device is established. Moreover, with respect to the thickness of the spacer element, the processing tolerance in the thickness direction of the substrate holder, the thickness tolerance of at least one spacer element, and The mounting tolerance of one less spacer element to the sum of the tempering means in the thickness direction of the substrate carrier and/or the substrate carrier is relatively small. The sum number is preferably less than 10% of the thickness of the spacer member, and less than 5% is particularly preferred. As such, unlike the prior art, the heating behavior of the substrate carrier is no longer significantly affected by the local tolerance of the substrate carrier and spacer elements, but the heating behavior is specifically adjustable by the thickness of the at least one spacer element.

Depending on the surrounding medium, the heat transfer between the tempering device and the substrate carrier can thus take place essentially by thermal convection or thermal radiation, and to some extent also by heat conduction by at least one spacer element. This ensures uniform heat input to the substrate carrier so that a homogeneous heat distribution within the substrate carrier can be achieved. As such, the distortion of the substrate carrier and the uneven tempering of the substrate placed on the substrate can be avoided.

Moreover, heat transfer between the substrate holder and the tempering device is throttled. Therefore, in the case of the heating process, the heating of the substrate holder is delayed, particularly when the substrate holder is placed on the heating plate, thermal shock can be avoided by the spacer elements.

The spacer element according to the invention may comprise several geometric figures. For example, the spacer elements can be formed in a cross-section such as a circle, a circular ring, a polygon, or a polygon that is hollow inside. Moreover, the spacer element can comprise a recess and/or a through hole such that the spacer element is as small as possible between the substrate carrier and the tempering device and does not exceed the necessary influence between the tempering device and the substrate carrier. Heat Conduction. Preferably, the at least one spacer element comprises a width and/or length of from 1 mm to 50 mm (preferably from 5 mm to 35 mm) from 15 mm to 25 in a direction parallel to the back side of the substrate carrier. Mm is particularly preferred. The width and/or length thus relate to a continuous area of the spacer element, which can be limited, in particular by a gap in the spacer element or by a curved edge.

At least one spacer element may be arranged on both the back side of the substrate carrier and the surface facing the side of the tempering device of the substrate carrier. For example, at least one spacer element may be included in the surface of the back side of the substrate carrier and/or the surface facing the side of the tempering device of the substrate carrier, which means the form of an integrated embodiment. Or at least one spacer element can be bolted to the back side of the substrate carrier and/or to the side of the tempering device facing the substrate carrier, or can be otherwise tightly coupled to a surface. It is advantageous to form a detachable connection between the substrate holder and the spacer element such that at least one spacer element is interchangeable. Embodiments in which at least one spacer element is free to move on the surface of the back side of the substrate carrier and/or the side of the tempering device facing the substrate carrier are also possible. For example, one or more spacer pads can be applied as spacer elements.

In a particularly preferred embodiment of the substrate processing apparatus according to the present invention, a plurality of spacer elements are provided for forming a distance between the substrate holder and the tempering means. As such, a plurality of small spacer elements are present between the substrate carrier and the tempering device such that the distance between the substrate carrier and the tempering device can remain as large as the central region of the substrate carrier, particularly outside the substrate carrier region. The height of the spacer elements is preferably uniform, which protrudes from the back side of the substrate carrier and/or the side of the tempering device facing the substrate carrier; however, it may also have different heights in order to balance the heterogeneity. By using a plurality of spacer elements, the thermal connection of the substrate carrier to the tempering device can be formed particularly uniformly.

In an advantageous embodiment of the substrate processing apparatus according to the invention, the material providing at least one spacer element comprises a lower thermal conductivity than the material of the substrate holder. As such, heat transfer between the tempering device and the substrate carrier by at least one spacer element can be kept low, and thus local heating of the substrate carrier and/or substrate can be largely prevented. In this case, for example, heating of the substrate carrier occurs when the processing of the substrate occurs under the presence of gas between the tempering device and the substrate carrier, and primarily via the air cushion. Thus, heat transfer between the tempering device and the substrate carrier can be via convection, which results in a uniform warm distribution.

For example, the spacer element can be formed from at least one electrically insulating material and/or coated with at least one electrically insulating material. The largest part of the electrically insulating material is characterized by thermal conductivity. In this case, ceramic, glass and/or synthetic materials such as polyetheretherketone, Teflon, polyimine, and/or polyfluorene can be considered as the material of the spacer element. In the present invention, at least one spacer element can also be formed at least partially from aluminum, another metal material or carbon.

The spacer element can preferably be formed in a mesh or sponge-like pattern for low heat transfer between the tempering device and the substrate carrier. Alternatively, the spacer elements or portions thereof may be formed as a mesh, matrix, and/or pad. The spacer element can be formed to cover the entire surface or individual portions between the tempering device and the substrate carrier. For example, it is possible to use a gasket made of glass wool or polyfluorene as a spacer element. The liner is typically flexible and/or compressible such that the non-uniformity of the distance between the substrate carrier and the tempering device can be compensated for by the compressibility of the spacer element.

A preferred development of the substrate processing apparatus according to the present invention, at least spacer The height of the substrate bracket and/or tempering device between 0.1 mm and 1 mm is particularly preferably between 0.2 mm and 0.5 mm, in particular between 0.3 mm and 0.4 mm. As such, a sufficient and minimal distance between the tempering device and the substrate carrier is formed such that heat transfer in the event of convection in the gas occurs efficiently and uniformly. At the same time, this distance, for example in a vacuum, leads to the maintenance of the temperature of the substrate carrier between the different tempering devices, since the heat loss due to heat conduction is minimized and can only occur due to the small heat loss of the heat radiation.

In a preferred embodiment of the substrate processing apparatus according to the present invention, the at least one spacer element comprises a variable height. The spacer elements can thus be formed, for example, in a style that is telescopic and extendable like a telescope. Moreover, the spacer elements can be formed and/or fixed from the tempering device and/or the back side of the substrate carrier to be extendable and/or height adjustable. The tempering device may comprise, for example, at least one hole or bore, from which the spacer element may be extended and in which the spacer element may be lowered. In this way, the substrate carrier can be first applied by means of at least one spacer element away from the tempering device, for example a distance of 1 mm, so that a limited tempering of the substrate carrier takes place in the first case. Subsequently, the height of the at least one spacer element can be lowered, for example to about 0.3 mm, so that heat transfer between the tempering device and the substrate carrier occurs more efficiently due to the shorter distance thereafter. In this way, the oscillating temper is first prevented, and efficient heat transfer is subsequently ensured.

Moreover, it is advantageous if the substrate carrier is formed from at least one electrically conductive material and/or is coated with at least one electrically conductive material. Due to the optimal thermal conductivity of the electrically conductive material, the temperature of the tempering device can advantageously be transferred thereby To the substrate carrier. Moreover, the conductivity of the substrate carrier supports a homogeneous heat distribution within the substrate carrier such that potentially hot spots in the substrate carrier can be thermally balanced by themselves; such tension and deformation of the substrate carrier can be avoided.

Further, a substrate holder in the form of an electric conductor in the substrate processing apparatus can be used as, for example, an electrode. It is particularly preferable that at least one of the substrates to be processed be adjusted to a specific potential. As materials, for example metals or compositions, in particular aluminum, titanium or compositions of these metals can be considered.

It is appropriate to select the thickness of the substrate holder between the front side of the substrate holder and the back side of the substrate holder as high as possible in order to avoid bulging of the substrate holder due to temperature homogenization. On the one hand, the rigidity of the substrate holder is thus increased, since its substrate holder can be thermally resistive, which includes a lower thickness and better tension. On the other hand, the heat distribution in the substrate carrier is thus improved and accelerated, which also resists the bulging of the substrate carrier. However, because the increased substrate carrier thickness negatively affects the dynamics of the heating and/or cooling process on the substrate carrier, the thickness of the substrate carrier should not exceed the maximum thickness because the thermal mass of the substrate carrier also increases with thickness And increase. The temperature heterogeneity and thus the reduced mechanical tension can be reduced by using at least one spacer element between the substrate carrier and the tempering device, and the thickness - and thus the mass and thermal mass of the substrate - can be kept to a minimum value. The thickness of the substrate carrier thus interacts with the height of the spacer element; the higher the spacer element, the smaller the thickness of the substrate carrier that can be calculated. The minimum mass of the substrate carrier also makes it possible to implement a small transmission substrate possible transport mechanism.

It has proven to be advantageous if the substrate carrier comprises a thickness between 8 mm and 21 mm, preferably between 10 mm and 15 mm, particularly preferably It is between 11 mm and 13 mm between the front side of the substrate tray and the back side of the substrate holder. The width of the substrate carrier between 120 cm and 200 cm thus results in an aspect ratio of thickness and width of about 0.4% to 1.8%. With regard to substrate holders of different lengths and widths, other advantageous substrate holder thicknesses can occur.

In a particularly preferred embodiment of the substrate processing apparatus according to the present invention, the back side of the substrate carrier includes a surface modification and/or surface coating, wherein the surface modification and/or the surface coating is substantially the same as the substrate carrier The material absorbs more heat radiation. This is particularly advantageous if the heat transfer between the tempering device and the substrate carrier occurs primarily by thermal radiation. If the substrate holder or its surface is formed of a metal such as aluminum or a metal composition, most of the heat radiation is reflected, and efficient heat transfer between the tempering device and the substrate holder does not occur. However, if the surface of the back side of the substrate carrier acts as heat radiation, it can be well absorbed, and an effective heat transfer by heat radiation is possible, which is particularly important for the process in vacuum.

Alternatively, it may also provide a substrate carrier having a surface coating and/or surface modification that emits less heat radiation than the base material of the substrate carrier. By this, the heat loss of the substrate holder due to heat radiation can be minimized. For example, it has proven to be advantageous to form the front side of the substrate carrier as a polished aluminum surface comprising an emissivity relative to a black radiator or an absorption level of less than 0.2, while the back side of the substrate carrier can be covered with black. An example of an aluminum surface, in special cases, is an anodized aluminum surface. As such, the back side of the substrate carrier can comprise an emissive or absorption level that is significantly greater than 0.5, particularly preferably greater than 0.9. Thus, the back side of the substrate holder can effectively absorb the tempering device to emit The thermal radiation, while the front side of the substrate carrier emits as little heat radiation as possible.

It is preferred that at least one of the socket modules for including the positive rails be provided on the substrate carrier. As such, the substrate carrier in at least one direction within the substrate processing apparatus is slidable and/or movable. For example, by continuously moving the substrate carrier processed through the substrate processing chamber with the substrate, this enables a continuous mode of operation of the substrate processing apparatus. The socket module is arranged outside the substrate contact area, which means on the back side of the substrate carrier and/or on at least one side of the substrate carrier. Moreover, the socket module can be provided at different locations, for example, the socket module can be provided in at least one lateral outer region of the substrate carrier and/or in a central region on the back side of the substrate carrier.

It has proven to be particularly advantageous if at least one of the socket modules is connected to the substrate carrier by at least one connecting element, wherein the connecting element comprises a socket module in a direction of connection between the substrate carrier and the socket module Smaller sections and / or larger lengths. By selecting a connection module having a small cross-section in a connecting direction, the heat transfer between the substrate carrier and the socket module is reduced in particular geometrically. As such, the formation of the heat sink at the location of the at least one socket module can be minimized, which in turn prevents uneven heat distribution in the substrate carrier.

In an equally suitable embodiment of the substrate processing apparatus according to the present invention, the at least one socket module and/or the connection element is comprised of a material or material compound comprising a lower thermal conductivity than the material of the substrate carrier. . Thereby, the heat transfer between the substrate carrier and the socket module is also effectively reduced, which results in as uniform a heat distribution as possible. Thus, for the substrate carrier and the at least one socket module and/or the at least one connecting component, different materials Provided such that different thermal expansion or contraction of the substrate carrier and the at least one socket module and/or the at least one connecting element may have occurred during cooling or heating. The reason for this is the different thermal expansion coefficients of the substrate holder at different temperatures, the socket module and the connection elements, and the selection materials having different substrate holders, socket modules, and connection elements. Thus, it has proven to be advantageous to mechanically decouple the socket module from the substrate carrier. This means a connection element placed between the substrate carrier and the socket module that balances the different thermal expansion of the substrate carrier, the connection element itself, and the socket module. For example, at least one of the socket modules is shaped like a positive rail, and the substrate carrier can be decoupled from the positive rail by at least one method of moving the connecting elements.

1‧‧‧Substrate bracket

2‧‧‧tempering device

3‧‧‧ front side of the substrate holder

4‧‧‧Substrate

5‧‧‧Back side of the substrate carrier

6‧‧‧ spacer elements

6'‧‧‧ spacer elements

7‧‧‧ socket module

8‧‧‧Connecting components

A‧‧‧ Connection direction

B‧‧‧ profile

B‧‧‧ section

C‧‧‧ distance

L‧‧‧ length

D‧‧‧thickness

H‧‧‧ Height

Advantageous embodiments of the present invention, its structure, function, and benefits are exemplified by way of illustration, in which FIG. 1 schematically illustrates a top view of a substrate carrier according to an embodiment of a substrate processing apparatus, the substrate processing apparatus According to the invention there is a single spacer element provided on the back side of the substrate carrier; FIG. 2 schematically illustrates a top view of a substrate holder according to another embodiment of the substrate carrier, the substrate holder having a plurality of spacer elements provided on the back side of the substrate carrier; and FIG. 3 schematically illustrates an embodiment of a substrate processing apparatus having a substrate carrier and a tempering device and spacer elements disposed therebetween in accordance with the present invention Side view.

In Fig. 1, a schematic plan view of the back side 5 of the substrate holder of the substrate holder 1 of the embodiment of the substrate processing apparatus is illustrated. According to this embodiment, exactly one spacer element 6 is present on the back side 5 of the substrate carrier, which in the illustrated embodiment is formed as a circular ring with 4 gaps in cross section. The spacer element 6 present comprises an outer diameter which is equal to about two-thirds of the length of the side of the substrate carrier 1. The difference between the outer diameter of the spacer element 6 forming the width of the spacer element 6 in the region and an inner diameter is preferably between 1 mm and 30 mm, particularly preferably between 10 mm and 25 mm.

As shown in Figure 1, the spacer element 6 can also comprise recesses and/or gaps. The spacer element 6 may comprise a different thermal expansion than the tempering device 2 or the substrate carrier 1. Due to the gap, as well as the narrow width of the spacer element 6, subsequent deformations due to different thermal expansions can be avoided. Moreover, instead of a spacer element 6, a plurality of spacer elements 6 of a circular ring or arc shape may be arranged concentrically with each other on the back side 5 of the substrate carrier. As such, the spacer element 6 can form a uniform distance C between the substrate carrier 1 and the tempering device 2 not depicted in FIG. 1, thereby achieving a uniform temperature distribution in the substrate carrier 1. Furthermore, since the spacer element causes delayed tempering of the substrate carrier 1, the heat transfer between the tempering device 2 and the substrate carrier 1 is throttled by the spacer element.

In the embodiment illustrated in FIG. 1, two socket modules 7 are arranged on each side of the opposite side of the substrate carrier 1, each of which is connected via a connecting element 8 having a substrate carrier 1. Alternatively, it is possible to use more than two socket modules 7 along the length of the substrate holder 1 in order to avoid substrate support. The deflection of the frame 1, for example, eight to ten socket modules 7 can be arranged along the length of the substrate carrier 1. Compared to the socket module 7 having the section b, the connecting element 8 comprises a smaller section B in a connecting direction A between the substrate carrier 1 and the corresponding socket module 7, so that it can be formed, for example, in the shape of a rod or a cylinder. . Moreover, the length L of the connecting element 8 is greater in the connecting direction A than the length I of the corresponding socket module 7. Due to this geometry of the connecting element 8, heat transfer from the substrate carrier 1 to the socket module 7 is effectively reduced. A positive rail or other transfer mechanism can be combined with the socket module 7 for movement of the substrate carrier 1 for example, through the substrate processing chamber.

In Fig. 2, a plan view of the substrate carrier back side 5 of the substrate carrier 1 of another embodiment of the substrate processing apparatus according to the present invention is illustrated. In order to form a uniform distance C between the substrate carrier 1 and the tempering device 2 not depicted in this figure, a plurality of spacer elements 6' are arranged on the substrate carrier back side 5. The spacer elements 6' here each comprise a circular cross section. Alternatively, it is to be understood that other cross-sectional geometries of the spacer element 6', such as circles, rectangles, triangles, octagons or any other form of polygons, ellipses or other, comprising through holes/recesses. Furthermore, the same features and functions as illustrated in Figure 1 are provided to the socket module 7 and the connecting element 8.

The embodiment according to Fig. 2 is superior to the first embodiment according to Fig. 1 in that a uniform distance C between the substrate carrier 1 and the tempering device 2 can also be formed in the peripheral region as well as in the central region. According to the embodiment according to Fig. 1, it can be understood that the substrate carrier 1 is deflected towards the tempering device 2 in the removal region by the spacer element 6 such that the uniform distance C between the substrate carrier 1 and the tempering device is All locations are different. In the embodiment according to Fig. 2, this can This is avoided by arranging the spacer elements 6' to be evenly distributed across the back side 5 of the substrate carrier, so that even in the peripheral region and the central region of the substrate carrier 1, a uniform distance C to the tempering device 2 can be formed.

An alternative to the embodiment of Figures 1 and 2, which can also be omitted without further effort and thus not specifically depicted, the spacer elements 6, 6' are arranged on the side of the tempering device 2 facing the substrate carrier 1, instead of On the back side 5 of the substrate carrier.

In Fig. 3, a side view according to a second embodiment of Fig. 2 is illustrated. Between the tempering device 2 and the substrate carrier back side 5 of the substrate carrier 1, a plurality of spacer elements 6' are evenly distributed, including a height H. Due to this, a uniform distance C is formed between the tempering device 2 and the substrate holder 1. The substrate holder 1 comprises a thickness D in the region between 8 mm and 21 mm, preferably between 10 mm and 15 mm, particularly preferably between 11 mm and 13 mm, which results in sufficient rigidity of the substrate holder 1 so that it does not Will bend and deform. A larger thickness D of the substrate holder 1 larger than 21 mm is disadvantageous for the rapid tempering of the substrate 4 because a large amount of material of the substrate holder 1 needs to be tempered. For a particular application, the thickness D of the substrate carrier greater than 21 mm may also be advantageous, since the substrate carrier 1 can maintain a corrected temperature, even after tempering, which is between 8 mm and 21 mm. The thin substrate holder 1, which has a thickness D, has a thickness D of the substrate holder 1 having a thickness of less than 15 mm for a longer period of time. A substrate holder 1 having a length and/or width greater than 200 cm, which may have a thickness D greater than 21 mm, may also be advantageous.

On the front side 3 of the substrate holder 1 of the substrate holder 1, a plurality of substrates 4 are arrangement. The substrate 4 should be in thermal equilibrium with the substrate carrier 1 such that the substrate 4 can be directly heated and/or cooled by the tempering device 2. As such, the substrate 4 can be adjusted to the desired temperature during substrate processing. For example, the substrate can apply a semiconductor substrate such as a germanium wafer to the substrate carrier 1.

From the back side 5 of the substrate carrier, the connecting element 8 extends laterally to the socket module 7 and connects it to the substrate carrier 1. Alternatively, it can also be understood that the connecting element 8 is arranged laterally on the substrate carrier 1, or on another area outside the substrate contact area of the substrate carrier 1. In the embodiment illustrated in Figure 3, the connecting element 8 comprises a two-degree deflection of 90° between the substrate carrier 1 and the respective socket module 7 in each case. Thus, the connecting element 8 comprises a greater length L than the possible direct connection between the substrate carrier 1 and the respective socket module 7 along the connection direction A. Due to the increased length L of the connecting element 8, the thermal conductivity by the connecting element 8 is reduced, so that heat transfer between the substrate carrier 1 and the socket module 7 is minimized. In this way, the heat sink formed in the substrate holder 1 is avoided at the position of the connecting member 8.

1‧‧‧Substrate bracket

2‧‧‧tempering device

3‧‧‧ front side of the substrate holder

4‧‧‧Substrate

5‧‧‧Back side of the substrate carrier

6'‧‧‧ spacer elements

7‧‧‧ socket module

8‧‧‧Connecting components

C‧‧‧ distance

D‧‧‧thickness

H‧‧‧ Height

Claims (11)

A substrate processing apparatus for processing a substrate having a plate-like substrate holder (1) and at least one plate-like tempering device (2) arranged in parallel to the substrate holder (1), wherein the substrate holder ( 1) comprising a substrate holder front side (3) for applying at least one layer substrate (4) and a substrate holder back side (5) facing the tempering device (2), characterized in that the substrate holder is On the back side (5) and/or on the surface of the tempering device (2) of the substrate holder (1) for forming a distance (C) on the substrate holder (1) and the back At least one spacer element (6, 6') between the fire devices (2) is provided. The substrate processing apparatus of claim 1, wherein the spacer element (6, 6) for forming the spacer (C) between the substrate holder (1) and the tempering device (2) ')Provided. The substrate processing apparatus of claim 1 or 2, wherein the material of the at least one spacer element (6, 6') comprises a lower thermal conductivity than the material of the substrate holder (1). The substrate processing apparatus according to any one of claims 1 to 3, wherein the at least one spacer element (6, 6') is from the substrate holder (1) and/or from the tempering device (2) ) by a height (H) protrusion between 0.1 mm and 1 mm. The substrate processing apparatus according to any one of claims 1 to 4, wherein the at least one spacer element (6, 6') comprises a variable height (H). The substrate processing apparatus according to any one of claims 1 to 5, wherein the substrate holder (1) is composed of at least one electrically conductive material and/or coated with at least one electrically conductive material. The substrate processing apparatus according to any one of claims 1 to 6, wherein the substrate holder (1) between the front side (3) of the substrate holder and the back side (5) of the substrate holder Contains a thickness (D) between 8mm and 21mm. The substrate processing apparatus according to any one of claims 1 to 7, wherein the substrate carrier back side (5) comprises a surface correction and/or a surface coating such that the surface correction and/or the surface coating The layer absorbs more heat radiation than the base material of the substrate carrier (1). The substrate processing apparatus according to any one of claims 1 to 8, wherein at least one socket module (7) for adjusting the running track on the substrate holder (1) is provided. The substrate processing apparatus of claim 9, wherein the at least one socket module (7) is connected to the substrate holder (1) by at least one connecting component (8), wherein the substrate carrier ( 1) The connecting element (8) in a connecting direction (A) with the socket module (7) comprises a smaller cross section (B) than the socket module (7) and/or a socket module (7) Large length (L). The substrate processing apparatus of claim 9 or 10, wherein the at least one socket module (7) and/or the connecting component (8) is lower than the material comprising the substrate carrier (1) A material consisting of a thermally conductive material or a material compound.