TW201840643A - 樹脂組成物、樹脂片、硬化圖案及半導體電子零件或半導體裝置 - Google Patents

樹脂組成物、樹脂片、硬化圖案及半導體電子零件或半導體裝置 Download PDF

Info

Publication number: TW201840643A
Authority: TW; Taiwan
Prior art keywords: resin; resin composition; component; mass; pattern
Prior art date: 2017-03-03

Application number

TW107106484A

Other languages

English (en)

Chinese (zh)

Inventor

馬場修

奧田良治

Original Assignee

日商東麗股份有限公司

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2017-03-03

Filing date

2018-02-27

Publication date

2018-11-16

2018-02-27 Application filed by 日商東麗股份有限公司 filed Critical 日商東麗股份有限公司

2018-11-16 Publication of TW201840643A publication Critical patent/TW201840643A/zh

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229920005989 resin Polymers 0.000 title claims abstract description 171
239000011347 resin Substances 0.000 title claims abstract description 171
239000011342 resin composition Substances 0.000 title claims abstract description 105
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230000009477 glass transition Effects 0.000 claims abstract description 42
238000000034 method Methods 0.000 claims abstract description 39
239000002243 precursor Substances 0.000 claims abstract description 16
239000003504 photosensitizing agent Substances 0.000 claims abstract description 13
229920001721 polyimide Polymers 0.000 claims abstract description 10
229920001577 copolymer Polymers 0.000 claims abstract description 7
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150000001875 compounds Chemical class 0.000 claims description 37
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238000006116 polymerization reaction Methods 0.000 claims description 19
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239000003112 inhibitor Substances 0.000 claims description 11
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125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 5
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KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 4
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VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
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IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
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Classifications

- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
- C08L25/18—Homopolymers or copolymers of aromatic monomers containing elements other than carbon and hydrogen
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor

Landscapes

Chemical & Material Sciences (AREA)
Physics & Mathematics (AREA)
Medicinal Chemistry (AREA)
Health & Medical Sciences (AREA)
Polymers & Plastics (AREA)
Organic Chemistry (AREA)
Chemical Kinetics & Catalysis (AREA)
General Physics & Mathematics (AREA)
Spectroscopy & Molecular Physics (AREA)
Materials For Photolithography (AREA)
Compositions Of Macromolecular Compounds (AREA)
Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Photosensitive Polymer And Photoresist Processing (AREA)
Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

TW107106484A 2017-03-03 2018-02-27 樹脂組成物、樹脂片、硬化圖案及半導體電子零件或半導體裝置 TW201840643A (zh)

Applications Claiming Priority (4)

Application Number	Priority Date	Filing Date	Title
JP2017040066		2017-03-03
JP2017-040066		2017-03-03
JP2017194282		2017-10-04
JP2017-194282		2017-10-04

Publications (1)

Publication Number	Publication Date
TW201840643A true TW201840643A (zh)	2018-11-16

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Family Applications (1)

Application Number	Title	Priority Date	Filing Date
TW107106484A TW201840643A (zh)	2017-03-03	2018-02-27	樹脂組成物、樹脂片、硬化圖案及半導體電子零件或半導體裝置

Country Status (3)

Country	Link
JP (1)	JP7059927B2 (fr)
TW (1)	TW201840643A (fr)
WO (1)	WO2018159384A1 (fr)

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JP6869078B2 (ja) *	2017-03-31	2021-05-12	太陽インキ製造株式会社	硬化性樹脂組成物、積層構造体、その硬化物、および電子部品
JP7154184B2 (ja)	2019-04-15	2022-10-17	信越化学工業株式会社	ポジ型感光性樹脂組成物、パターン形成方法、硬化被膜形成方法、層間絶縁膜、表面保護膜、及び電子部品
EP4026867B1 (fr) *	2019-09-06	2023-12-06	Resonac Corporation	Résine de polyamide-imide, composition de résine, et dispositif à semi-conducteur
JP7392580B2 (ja) *	2020-06-08	2023-12-06	住友ベークライト株式会社	感光性樹脂組成物、電子デバイスの製造方法および電子デバイス
KR20220130042A (ko) *	2021-03-17	2022-09-26	주식회사 동진쎄미켐	포지티브형 감광성 수지 조성물, 절연막 및 이를 포함하는 표시장치
JP7495897B2 (ja) *	2021-03-23	2024-06-05	信越化学工業株式会社	ポジ型感光性樹脂組成物、ポジ型感光性ドライフィルム、ポジ型感光性ドライフィルムの製造方法、パターン形成方法、硬化被膜形成方法、層間絶縁膜、表面保護膜、及び電子部品
WO2022264934A1 (fr) *	2021-06-14	2022-12-22	東レ株式会社	Composition de résine photosensible, produit durci, procédé de production de produit durci, et dispositif d'affichage
CN114524938B (zh) *	2021-10-28	2024-02-09	江苏三月科技股份有限公司	一种聚合物、感光树脂组合物及其制备的固化膜与电子元件
CN118749088A (zh) *	2022-03-23	2024-10-08	东丽株式会社	正型感光性树脂组合物、固化物、有机el显示装置、固化物的制造方法
CN116333303B (zh) *	2023-05-25	2023-08-04	明士(北京)新材料开发有限公司	一种抗模压的碱性水性显影的光敏胶膜及其应用

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US3642682A (en) *	1968-12-13	1972-02-15	Desoto Inc	Lacquers containing guanamine-based polyimide resins
JP3707879B2 (ja) *	1996-10-21	2005-10-19	住友ベークライト株式会社	ポリイミド樹脂組成物およびフィルム接着剤とその製造方法
JPH10231426A (ja) *	1997-02-18	1998-09-02	Sumitomo Bakelite Co Ltd	ポリイミド樹脂組成物
JP4870173B2 (ja) *	2003-04-07	2012-02-08	三井化学株式会社	ポリイミド金属積層板
JP2012255107A (ja) *	2011-06-09	2012-12-27	Mitsui Chemicals Inc	熱可塑性ポリイミド組成物、それを含む接着剤、積層体、及びデバイス
JP6003663B2 (ja) *	2013-01-16	2016-10-05	東レ株式会社	ポジ型感光性樹脂組成物
JP2017122742A (ja) *	2014-05-09	2017-07-13	日立化成株式会社	ポジ型感光性接着剤組成物、接着剤パターン、接着剤層付半導体ウェハ及び半導体装置
JP2016009159A (ja) *	2014-06-26	2016-01-18	日立化成株式会社	ポジ型感光性接着剤組成物、接着剤パターン、接着剤層付半導体ウェハ及び半導体装置

2018
- 2018-02-20 WO PCT/JP2018/005978 patent/WO2018159384A1/fr not_active Ceased
- 2018-02-20 JP JP2018510541A patent/JP7059927B2/ja active Active
- 2018-02-27 TW TW107106484A patent/TW201840643A/zh unknown

Also Published As

Publication number	Publication date
JP7059927B2 (ja)	2022-04-26
JPWO2018159384A1 (ja)	2019-12-26
WO2018159384A1 (fr)	2018-09-07

Publication	Publication Date	Title
TW201840643A (zh)	2018-11-16	樹脂組成物、樹脂片、硬化圖案及半導體電子零件或半導體裝置
CN109642028B (zh)	2021-06-25	树脂组合物
US8257901B2 (en)	2012-09-04	Polyimide-based polymers, copolymers thereof and positive type photoresist compositions comprising the same
JP5645138B2 (ja)	2014-12-24	ポリイミドおよびこれを含む感光性樹脂組成物
TWI701504B (zh)	2020-08-11	樹脂組成物、其硬化凸紋圖案、及使用其之半導體電子零件或半導體裝置之製造方法
JPWO2016140024A1 (ja)	2017-12-14	感光性樹脂組成物、樹脂硬化膜の製造方法および半導体装置
TWI688825B (zh)	2020-03-21	半導體電子零件或半導體裝置、及此等之製造方法、感光性樹脂組成物、感光性薄片及其製造方法、硬化膜、層間絕緣膜或半導體保護膜、以及硬化起伏圖案的製造方法
CN104662475A (zh)	2015-05-27	正型感光性树脂组合物、含有使用了其的固化膜的半导体器件的制造方法
TW201615696A (zh)	2016-05-01	樹脂及感光性樹脂組成物
CN107407878A (zh)	2017-11-28	感光性树脂组合物
CN108473679A (zh)	2018-08-31	固化膜及其制造方法
KR102445235B1 (ko)	2022-09-20	감광성 수지 조성물, 감광성 시트, 반도체 장치 및 반도체 장치의 제조 방법
KR102015098B1 (ko)	2019-08-27	폴리이미드수지 및 포지티브형 감광성 수지조성물
JP2009258634A (ja)	2009-11-05	ポジ型感光性樹脂組成物
JP6939553B2 (ja)	2021-09-22	樹脂組成物
TWI426093B (zh)	2014-02-11	聚亞醯胺系聚合物、共聚物及包含該聚合物之正型光阻劑
KR20220169913A (ko)	2022-12-28	감광성 폴리이미드 수지 조성물
JP5088169B2 (ja)	2012-12-05	ポジ型感光性樹脂組成物
TWI692490B (zh)	2020-05-01	硬化膜及其製造方法
JP2010072143A (ja)	2010-04-02	ポジ型感光性樹脂組成物
JP5514336B2 (ja)	2014-06-04	耐熱性樹脂組成物
WO2026088942A1 (fr)	2026-04-30	Composition de résine, produit durci et dispositif d'affichage électroluminescent organique
WO2025074871A1 (fr)	2025-04-10	Résine, composition de résine photosensible et ses produits durcis, et composant électronique et dispositif d'affichage utilisant chacun ledit produit durci
JP5213518B2 (ja)	2013-06-19	耐熱性樹脂組成物
KR20140073252A (ko)	2014-06-16	포지형 감광성 바니쉬