TW201902607A - A cutting method and cutting machine of a brittle substrate with a resin layer - Google Patents

Abstract

The invention provides a cutting method and a cutting device capable of neatly cutting a brittle material substrate with a resin layer in a simple step. A burst laser beam L1 including a pulsed laser beam is transmitted through the aberration generating lens 4c to generate an aberration laser beam L2; the most condensing portion of the aberration laser beam L2 is generated The surface of the brittle material substrate W1, which becomes the mother body of the brittle material substrate W with the resin layer, is scanned along a predetermined breaking line, and a modified layer K having a reduced strength is formed on the brittle material substrate W1, and at the same time, a component is formed on the resin layer W2 The groove V is broken; then, the brittle material substrate W with a resin layer is cut along a predetermined breaking line along the reforming layer K via a cracking device.

Description

Method and device for cutting brittle material substrate with resin layer

The invention relates to a cutting method and a cutting device for a brittle material substrate with a resin layer on a resin layer with an area layer of a brittle material substrate. In particular, the present invention relates to a brittle material substrate with a resin layer and a thin resin layer, such as acrylic or epoxy, laminated on one side of a brittle material substrate such as a semiconductor substrate and glass, for the purpose of protecting circuit patterns and the like. Breaking method and breaking device.

Generally speaking, in the case of breaking a brittle material substrate with a resin layer as described above, a breaking method is known, as shown in FIG. 8 (a), by a cutter wheel 15 (also called a scribing wheel) ), Etc., the surface of the brittle material substrate W1 which becomes the mother of the brittle material substrate W with a resin layer is scribed to form a grooved scribe line S, and the resin layer on the opposite side from the surface on which the scribe line S is formed As shown in FIG. 8 (b), the surface of W2 is broken along the scribe line S by bending the brittle material substrate W with a resin layer by pressing the breaking rod 14 (for example, see Patent Documents 1 and 2). Figure 10). In the above-mentioned scribing process, instead of using a mechanical method such as a cutter wheel, a laser beam is generally irradiated on the surface of a brittle material substrate, and cracks are generated along a predetermined line by heat, or a modified layer is formed To form a scribing method. [Prior Art Literature] [Patent Literature] [Patent Literature 1] Japanese Patent Laid-Open No. 2016-000533 [Patent Literature 2] Japanese Patent Laid-Open No. 2015-039872 [Patent Literature 3] Japanese Patent Laid-Open No. 2012-066479 Bulletin

[Problems to be Solved by the Invention] However, when the brittle material substrate with a resin layer is to be divided by the above method, since the physical characteristics of the brittle material substrate and the resin layer serving as a parent body are different, resin is generated. One part of the layer is not completely cut and still connected, or even if it has been cut, it has problems such as scratches, irregularly cut burrs, and debris that cannot be cut cleanly. In addition, in order to surely cut off the resin layer, a method of forming a scribing line along a predetermined breaking line with a cutter wheel or a laser beam on the surface of the resin layer before the cutting step is also known (for example, refer to Patent Document 3). However, in this method, after scribe lines are processed on one side of a brittle material substrate with a resin layer, the substrate needs to be reversed to the opposite side for scribe processing, which increases the number of work steps, consumes procedures, and must be useful. There are problems in that the device is complicated and the cost is high for a mechanism or the like for reversing the substrate. Therefore, an object of the present invention is to provide a cutting method and a cutting device for a brittle material substrate with a resin layer that can solve the above-mentioned problems and can be accurately and neatly separated in a simple procedure. [Technical means for solving the problem] The breaking method of the present invention for achieving the above-mentioned object is a breaking method of a brittle material substrate with a resin layer laminated with a resin layer on one side of a brittle material substrate. The cluster of laser beams generated by the laser beam passes through the aberration generating lens to generate an aberration laser beam, and the most condensing part of the aberration laser beam becomes the brittle material substrate with the resin layer The surface of the substrate of the brittle material of the mother body is scanned along the predetermined breaking line to form a modified layer having a reduced strength on the brittle material substrate and a breaking groove is formed on the resin layer at the same time, and then, a fracture device is passed along the modified layer. The brittle material substrate with a resin layer is divided along the predetermined division line. In the breaking method of the present invention, it is preferable to scan the most condensed part of the aberration laser beam at the middle position of the thickness of the brittle material substrate. Here, the most condensing portion of the aberration laser beam refers to the position along the irradiation direction of the aberration laser beam. When measuring the beam distribution (intensity distribution), the peak power of the beam distribution is highest (along the aberration laser). Position of the irradiation direction of the light beam). As a breaking device for breaking the modified layer of the brittle material substrate, a CO ² laser beam irradiating a wavelength of 10.6 μm or Nd having a wavelength of 1.064 μm; a wavelength having an infrared region such as a YAG laser beam (typically, a wavelength Laser beam (specifically, a laser beam with a wavelength of 0.7 μm to 20 μm) and the substrate is flexed by thermally breaking optical devices or by pressing a breaking rod from the upper surface of the substrate Breaking mechanical device. In addition, the breaking device of the present invention based on another viewpoint is a breaking device of a brittle material substrate with a resin layer laminated with a resin layer on one side of the brittle material substrate, and includes the following: a stage, which The aforesaid brittle material substrate with a resin layer mounted thereon; an aberration laser beam light emitting member that generates a cluster of laser beams including a pulsed laser beam emitted from a light source through an aberration generating lens to generate an image A differential laser beam; a moving mechanism that moves the aberration laser beam light-emitting member relatively along a predetermined breaking line of the brittle material substrate with a resin layer, and reduces the formation strength of the brittle material substrate that becomes the mother And forming a breaking groove in the resin layer at the same time; and a breaking device that breaks the brittle material substrate with the resin layer along the reforming layer. [Effects of the Invention] Since the present invention is structured as described above, it is possible to scan the aberration laser beam to form a modified layer of a substrate of a brittle material, such as a glass substrate, which is a mother, while reducing the processing strength of the substrate. The predetermined breaking line forms a breaking groove. Therefore, in the subsequent cracking step, when an external force is applied to the brittle material substrate with the resin layer to cut the brittle material substrate along the modified layer, the resin layer is cut off in advance at the part of the cutting groove or its thickness is large. The part is removed, so that the resin layer can be surely cut off without generating scratches, burrs, and debris on the resin layer. In addition, because the aberration laser beam is used to form a breaking groove in the resin layer while the modified layer is processed on the brittle material substrate, the complicated steps such as reversing the substrate and processing the scribing on the resin layer can be omitted. In addition, it is possible to reduce processing time or cost. In the present invention, the aberration generating lens is preferably formed of a plano-convex lens. In this case, by making the laser beam incident from the plane side of the plano-convex lens, an aberration laser beam can be emitted from the convex side. In this case, by arranging the diffractive optical element (DOE) on the plane side of the plano-convex lens, the number of focal points of the laser beam emitted from the convex side of the plano-convex lens can be increased, and the condensing path can be reduced. Furthermore, in the present invention, the light source of the aberration laser beam is a near-infrared laser having a wavelength of 0.7 to 2.5 μm (for example, a fundamental wave of Nd: YAG laser), and it is preferable to use a pulse width of 100 pico Bursts of laser beams below seconds.

In the following, details of the present invention will be described based on the embodiment shown in the drawings. FIG. 1 is a diagram showing a scribing device (breaking device) A of the present invention. In the scribing device A, horizontal beams (transverse beams) 3 including guides 2 in the X direction are provided on the left and right pillars 1 and 1. A scribing head 5 having an aberration laser beam light emitting member 4 and a breaking laser beam light emitting member 6 are mounted on the guide 2 of the beam 3 so as to be movable in the X direction by the motor M1. Scribe head 7. The stage 8 on which the processing target substrate W is placed and held is held on a platen 10 via a rotation mechanism 9 with a vertical axis as a fulcrum, and the platen 10 is formed to be Y by a threaded screw 11 driven by a motor M2. Direction (front-back direction in FIG. 1). In addition, in this embodiment, the aberration laser beam light emitting member 4 and the breaking laser beam light emitting member 6 are respectively mounted on the scribing heads 5 and 7, but may be mounted on a common scribing head. The aberration laser beam light-emitting member 4 mounted on the scribing head 5 is shown in FIG. 2, and its pulse width (pulse duration) is 100 picoseconds or less, preferably 50 picoseconds or less (usually 1 picosecond or more). Here, there is a light source 4a that emits a pulse laser beam of 10 picoseconds, a light modulator 4b that emits a pulsed laser beam that oscillates from the light source 4a as a set of divided clusters, and The laser beam L1 emitted from the optical modulator 4b generates an aberration aberration generating lens 4c. In addition, the light source 4a may use a near-infrared laser with a wavelength of 0.7 to 2.5 μm. In this embodiment, a near-infrared laser with a wavelength of 1.064 μm is used. The light modulator 4b that emits a burst of pulsed laser beams is disclosed in, for example, Japanese Patent Publication No. 2012-515450. Here, it is assumed that a pulsed laser is emitted using a well-known light modulator. For those who emit beams of light, the details are omitted. The aberration generating lens 4c for generating aberrations in the laser beam L1 emitted from the optical modulator 4b is not particularly limited, but here the laser beam L1 is used to disperse the focus in the direction of the optical axis and to pass the laser beam L1. A plano-convex lens that condenses light to form a focal point that blurs in the axial direction and produces aberrations. The laser beam L1 passing through the plano-convex lens becomes a focal aberration laser beam L2. By making the laser beam L1 incident from the plane side of the plano-convex lens, the aberration laser beam L2 can be emitted from the convex side. The aberration laser beam L2 generated from the burst of the pulsed laser beam is shown in FIG. 3 (a), and can be formed by condensing the light with the aberration generating lens 4c to form a narrow energy accumulation at each focal point f. And a long high energy distribution area (laser filament) F. FIG. 3 (b) shows a schematic enlarged view of the high-energy distribution area F. FIG. By forming such a high-energy distribution area F, when the surface of the processing target substrate, for example, the surface of the soda glass substrate is irradiated, the modified layer K having a reduced processing strength can be penetrated from the irradiated surface of the soda glass substrate to the inside. (See Figure 5). The breaking laser beam L3 (see FIG. 6) emitted from the breaking laser beam light-emitting member 6 mounted on another scribing head 7 is used to reduce the intensity by the aberration laser beam L2. Laser beam completely broken by reforming layer K. In this embodiment, as the breaking laser beam L3, a CO ₂ laser beam having a wavelength of 10.6 μm is used. In addition, instead of a CO ₂ laser beam, a laser beam having a wavelength of 0.7 to 20 μm, such as a Nd, YAG laser beam having a wavelength of 1.064 μm, may be used. Next, a method for cutting the brittle material substrate W with a resin layer of the present invention using the scribing head device A will be described below. In this embodiment, the brittle material substrate W1 that becomes the mother body is formed of soda glass with a thickness of 1 mm. The brittle material substrate W with a resin layer having an acrylic resin layer W2 with a thickness of 10 to 50 μm in one area is used as a processing object. Substrate. First, as shown in FIG. 5 (a), a substrate W with a brittle material with a resin layer is placed on the stage 8, and the substrate W is irradiated with the aberration laser beam L2 emitted from the aberration laser beam light emitting member 4, One side is moved along a predetermined breaking line of the substrate W by a moving mechanism including the scribing head 5 and the guide 2. At this time, the high-energy distribution area F of the light-concentrating portion of the aberration laser beam L2 extends from the middle of the thickness of the brittle material substrate W1 to the resin layer W2. Thereby, as shown in FIG. 5 (b), the modified layer K having a weakened strength can be processed from the irradiated surface of the brittle material substrate W1 to the lower surface, and at the same time, the resin with a thinner layer can be removed by ablation or the like. The higher energy distribution region F of the layer W2 forms the breaking groove V. In the part of the breaking groove V, the resin layer 2 is completely cut off, or most of the thickness is removed. In addition, it is preferable that a space 8a is provided in advance on the stage 8 for receiving the substrate W so that the laser beam transmitted through the substrate W can be diffused downward when the aberration laser beam L2 is irradiated. Here, an example of a preferable implementation condition of a clustered aberration laser beam L2 (bulk train of pulsed laser beams) is shown below. Laser output: 10.6 W Repetition frequency: 32.5 kHz Pulse width: 10 picosecond pulse interval (irradiation interval of the laser pulse at the irradiation point on the substrate): 4 μm Burst: 2 pulses Pulse energy: 163 μJ / 1 Burst scanning speed: 130 mm / s In addition, the processing depth and processing status can be easily controlled by the laser output, repetition frequency, pulse width, burst number, pulse interval, aberration and other adjustments as described above. FIG. 4 is a pattern diagram showing a burst of pulsed laser beams. Two fine pulses P formed by dividing one pulse laser beam are formed, and are irradiated intermittently at each repetition frequency. As described above, after the aberration laser beam L2 is scanned, the modified layer K is processed on the brittle material substrate W1 of the substrate W and the breaking groove V is processed on the resin layer W2, as shown in FIG. The CO ₂ laser beam L3 is irradiated with the laser beam light-emitting member 6 toward the planned breaking line of the processed modified layer K, and is moved along the planned breaking line by a moving mechanism including the scribing head 7 and the guide 2. The laser irradiation conditions of the CO ₂ laser beam L3 at this time differ depending on the material or thickness of the brittle material substrate W with the resin layer to be processed, but in this embodiment, the output is set to 22 W and the scanning speed Set to 20 mm / s and the repetition frequency to 10 kHz. In this way, by irradiating the CO ₂ laser beam L3 along the predetermined breaking line of the processed reforming layer K, the heat of the laser beam can be used to completely break the weakened strength of the brittle material substrate W1. Stratum K. In addition, before this, because the resin layer W2 was cut off by the aberration laser beam L2 at the breaking groove V, or most of its thickness was removed, an external force was applied by the CO ₂ laser beam L3 It can be reliably cut off along the predetermined cutting line with a sharp end surface, without causing scratches, burrs, and debris on the brittle material substrate W with a resin layer. In the above embodiment, after the modified layer K is processed on the brittle material substrate W1 by the aberration laser beam L2, the laser beam L3 for breaking is used as the self-modified layer K to separate the brittle material substrate W with the resin layer. The breaking device can be replaced with a breaking rod to mechanically apply external force to break. FIG. 7 shows a cracking device using a cracking rod. As shown in FIG. 7 (a), an elastic sheet 13 containing rubber or the like is laid on the stage 12, and the elastic sheet 13 is processed and modified. The brittle material substrate W with the resin layer of the layer K is placed with the resin layer W2 side facing upward. Further, as shown in FIG. 7 (b), by pressing the breaking rod 14 toward the reforming layer K from above, the brittle material substrate W1 can be flexed to break the substrate W from the reforming layer K. As mentioned above, although the typical embodiment of this invention was described, this invention is not necessarily limited only to the said embodiment. For example, in the above embodiment, when the optical system is used as the breaking device, the reforming layer K is formed by irradiating all the cutting lines in advance with the aberration laser beam L2, and then the cutting is irradiated along the reforming layer K. The laser beam L3 is divided, but the laser beam L3 for division may be irradiated following the irradiation of the aberration laser beam L2. In other inventions, appropriate amendments and changes can be made within the scope of achieving the purpose of the invention without departing from the scope of the patent application. [Industrial Applicability] The present invention can be used when breaking a brittle material substrate with a resin layer and a resin layer on an area of a brittle material substrate such as a glass substrate.

1‧‧‧ pillar

2‧‧‧Guide

3‧‧‧ beam (transverse beam)

4‧‧‧ aberration laser beam light emitting member

4a‧‧‧light source

4b‧‧‧light modulator

4c‧‧‧Aberration generating lens

5‧‧‧ crossed head

6‧‧‧ Breaking laser light emitting member

7‧‧‧ crossed head

8‧‧‧ carrier

8a‧‧‧space

9‧‧‧ rotating mechanism

10‧‧‧ substrate

11‧‧‧Threaded Screw

12‧‧‧ carrier

13‧‧‧Elastic sheet

14‧‧‧ split broken rod

15‧‧‧knife wheel

A‧‧‧ scribing device (breaking device)

f‧‧‧ focus

F‧‧‧High Energy Distribution Area

K‧‧‧Modified layer

L1‧‧‧laser beam

L2‧‧‧ aberration laser beam

L3‧‧‧ breaking laser beam (CO ₂ laser beam)

M1‧‧‧Motor

M2‧‧‧Motor

P‧‧‧fine pulse

S‧‧‧ crossed

V‧‧‧ Breaking slot

W‧‧‧ Brittle material substrate with resin layer

W1‧‧‧Fragile material substrate

W2‧‧‧Resin layer

X‧‧‧ direction

Y‧‧‧ direction

FIG. 1 is a schematic explanatory diagram of a breaking device of the present invention. FIG. 2 is a block diagram showing an optical system of the aberration laser beam light emitting member of the present invention. 3 (a) and 3 (b) are enlarged explanatory diagrams showing a condensing state of an image laser beam. Figure 4 is a conceptual diagram showing the burst distribution of a pulsed laser beam. 5 (a) and 5 (b) are explanatory diagrams showing the first stage of the cutting processing step of the present invention. FIG. 6 is an explanatory diagram showing the second stage of the cutting processing step of the present invention. 7 (a) and 7 (b) are explanatory diagrams showing another example of the fracture device of the present invention. 8 (a) and 8 (b) are explanatory diagrams showing an example of a method for cutting a conventional brittle material substrate with a resin layer.

Claims (6)

A method for breaking a brittle material substrate with a resin layer, which is a method for breaking a brittle material substrate with a resin layer laminated on a side of one side of the brittle material substrate. The method is characterized in that: a pulse laser is included. The laser beam of the burst is generated as an aberration laser beam through the aberration generating lens that generates aberrations; the most condensing part of the aberration laser beam becomes the brittle material with the resin layer The surface of the substrate of the brittle material substrate of the substrate is scanned along the predetermined breaking line to form a modified layer with a reduced strength on the brittle material substrate and a breaking groove in the resin layer at the same time; The device divides the brittle material substrate with a resin layer along the predetermined breaking line. For example, the method for breaking a brittle material substrate with a resin layer according to claim 1, wherein the light source of the aberration laser beam is a near-infrared laser with a wavelength of 0.7 to 2.5 μm, and a laser with a pulse width of 100 picoseconds or less is used. Burst of beams. For example, the breaking method for a brittle material substrate with a resin layer according to claim 1 or 2, wherein the breaking device is formed by an optical system including a breaking laser beam, and the breaking device is formed along a predetermined breaking line forming the modified layer. The breaking laser beam is irradiated to break the brittle material substrate with heat. The cutting method for a brittle material substrate with a resin layer according to any one of claims 1 to 3, wherein the laser beam for breaking is a CO ₂ laser beam. The breaking method of the brittle material substrate with a resin layer according to any one of claims 1 to 3, wherein the breaking device is formed by a mechanical system including a breaking rod, and the breaking is planned along the formation of the reforming layer. Pressing the breaking rod with a wire causes the brittle material substrate to flex and break along the predetermined breaking line. A breaking device for a brittle material substrate with a resin layer is a breaking device for a brittle material substrate with a resin layer that is laminated on one side of the brittle material substrate with a resin layer, and includes: a stage, on which The aforesaid brittle material substrate with a resin layer; an aberration laser beam light-emitting member that generates a cluster of laser beams including a pulsed laser beam emitted from a light source through an aberration generating lens to generate an aberration laser A moving mechanism that relatively moves the aberration laser beam light-emitting member along the predetermined breaking line of the brittle material substrate with a resin layer, and a modified layer that reduces the processing strength of the brittle material substrate that becomes the mother body At the same time, the breaking groove is processed in the resin layer; the breaking device breaks the brittle material substrate with the resin layer along the modified layer.