TW201929645A - 散熱用銅箔及散熱部件 - Google Patents

散熱用銅箔及散熱部件 Download PDF

Info

Publication number: TW201929645A
Authority: TW; Taiwan
Prior art keywords: copper foil; heat dissipation; layer; plating; thickness
Prior art date: 2017-12-26

Application number

TW107146225A

Other languages

English (en)

Chinese (zh)

Inventor

笹尾一將

三木敦史

Original Assignee

日商Ｊｘ金屬股份有限公司

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2017-12-26

Filing date

2018-12-20

Publication date

2019-07-16

2018-12-20 Application filed by 日商Ｊｘ金屬股份有限公司 filed Critical 日商Ｊｘ金屬股份有限公司

2019-07-16 Publication of TW201929645A publication Critical patent/TW201929645A/zh

Links

RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 186
239000011889 copper foil Substances 0.000 title claims abstract description 160
230000017525 heat dissipation Effects 0.000 claims abstract description 93
239000010410 layer Substances 0.000 claims description 157
238000007747 plating Methods 0.000 claims description 146
239000002245 particle Substances 0.000 claims description 102
239000011247 coating layer Substances 0.000 claims description 81
239000010949 copper Substances 0.000 claims description 71
238000011282 treatment Methods 0.000 claims description 58
229920006254 polymer film Polymers 0.000 claims description 56
230000003746 surface roughness Effects 0.000 claims description 42
238000000576 coating method Methods 0.000 claims description 40
230000005855 radiation Effects 0.000 claims description 37
239000011248 coating agent Substances 0.000 claims description 36
229910052802 copper Inorganic materials 0.000 claims description 31
229910052759 nickel Inorganic materials 0.000 claims description 28
239000004372 Polyvinyl alcohol Substances 0.000 claims description 20
229920002451 polyvinyl alcohol Polymers 0.000 claims description 20
229920000642 polymer Polymers 0.000 claims description 18
-1 polyethylene terephthalate Polymers 0.000 claims description 17
229920005989 resin Polymers 0.000 claims description 15
239000011347 resin Substances 0.000 claims description 15
239000000758 substrate Substances 0.000 claims description 12
229910052725 zinc Inorganic materials 0.000 claims description 10
229910052804 chromium Inorganic materials 0.000 claims description 5
239000003822 epoxy resin Substances 0.000 claims description 5
229910052742 iron Inorganic materials 0.000 claims description 5
229920000647 polyepoxide Polymers 0.000 claims description 5
229910052721 tungsten Inorganic materials 0.000 claims description 5
239000004677 Nylon Substances 0.000 claims description 4
229920002292 Nylon 6 Polymers 0.000 claims description 4
239000004721 Polyphenylene oxide Substances 0.000 claims description 4
229920001778 nylon Polymers 0.000 claims description 4
229920005668 polycarbonate resin Polymers 0.000 claims description 4
239000004431 polycarbonate resin Substances 0.000 claims description 4
229920001225 polyester resin Polymers 0.000 claims description 4
239000004645 polyester resin Substances 0.000 claims description 4
229920000570 polyether Polymers 0.000 claims description 4
229920000298 Cellophane Polymers 0.000 claims description 3
229920002284 Cellulose triacetate Polymers 0.000 claims description 3
239000002033 PVDF binder Substances 0.000 claims description 3
229920003171 Poly (ethylene oxide) Polymers 0.000 claims description 3
NNLVGZFZQQXQNW-ADJNRHBOSA-N [(2r,3r,4s,5r,6s)-4,5-diacetyloxy-3-[(2s,3r,4s,5r,6r)-3,4,5-triacetyloxy-6-(acetyloxymethyl)oxan-2-yl]oxy-6-[(2r,3r,4s,5r,6s)-4,5,6-triacetyloxy-2-(acetyloxymethyl)oxan-3-yl]oxyoxan-2-yl]methyl acetate Chemical compound O([C@@H]1O[C@@H]([C@H]([C@H](OC(C)=O)[C@H]1OC(C)=O)O[C@H]1[C@@H]([C@@H](OC(C)=O)[C@H](OC(C)=O)[C@@H](COC(C)=O)O1)OC(C)=O)COC(=O)C)[C@@H]1[C@@H](COC(C)=O)O[C@@H](OC(C)=O)[C@H](OC(C)=O)[C@H]1OC(C)=O NNLVGZFZQQXQNW-ADJNRHBOSA-N 0.000 claims description 3
125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 claims description 3
125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 3
229920002301 cellulose acetate Polymers 0.000 claims description 3
239000012461 cellulose resin Substances 0.000 claims description 3
125000003700 epoxy group Chemical group 0.000 claims description 3
125000001033 ether group Chemical group 0.000 claims description 3
229910052736 halogen Inorganic materials 0.000 claims description 3
150000002367 halogens Chemical class 0.000 claims description 3
125000005842 heteroatom Chemical group 0.000 claims description 3
125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 3
229920001707 polybutylene terephthalate Polymers 0.000 claims description 3
229920000139 polyethylene terephthalate Polymers 0.000 claims description 3
239000005020 polyethylene terephthalate Substances 0.000 claims description 3
229920001451 polypropylene glycol Polymers 0.000 claims description 3
229920001343 polytetrafluoroethylene Polymers 0.000 claims description 3
239000004810 polytetrafluoroethylene Substances 0.000 claims description 3
229920002215 polytrimethylene terephthalate Polymers 0.000 claims description 3
229920002981 polyvinylidene fluoride Polymers 0.000 claims description 3
239000004841 bisphenol A epoxy resin Substances 0.000 claims description 2
150000002148 esters Chemical class 0.000 claims 1
239000000463 material Substances 0.000 abstract description 11
239000007788 liquid Substances 0.000 description 70
239000000203 mixture Substances 0.000 description 70
230000015572 biosynthetic process Effects 0.000 description 51
QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 40
PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 36
238000010410 dusting Methods 0.000 description 32
238000001931 thermography Methods 0.000 description 25
229910017709 Ni Co Inorganic materials 0.000 description 24
229910003267 Ni-Co Inorganic materials 0.000 description 24
229910003262 Ni‐Co Inorganic materials 0.000 description 24
239000011888 foil Substances 0.000 description 21
JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 16
238000000034 method Methods 0.000 description 12
229910017052 cobalt Inorganic materials 0.000 description 11
239000010941 cobalt Substances 0.000 description 11
GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 11
XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 10
238000005259 measurement Methods 0.000 description 9
229910052751 metal Inorganic materials 0.000 description 9
239000002184 metal Substances 0.000 description 9
239000011701 zinc Substances 0.000 description 9
239000007864 aqueous solution Substances 0.000 description 8
ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 description 8
238000011156 evaluation Methods 0.000 description 8
230000003449 preventive effect Effects 0.000 description 8
238000007788 roughening Methods 0.000 description 8
239000002585 base Substances 0.000 description 7
230000000052 comparative effect Effects 0.000 description 7
239000000243 solution Substances 0.000 description 7
239000002904 solvent Substances 0.000 description 7
229910017868 Cu—Ni—Co Inorganic materials 0.000 description 6
238000004458 analytical method Methods 0.000 description 6
239000011651 chromium Substances 0.000 description 6
238000010438 heat treatment Methods 0.000 description 6
235000019592 roughness Nutrition 0.000 description 6
HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 5
238000010521 absorption reaction Methods 0.000 description 5
230000008569 process Effects 0.000 description 5
239000011787 zinc oxide Substances 0.000 description 5
WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 4
IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
229910000423 chromium oxide Inorganic materials 0.000 description 4
239000000470 constituent Substances 0.000 description 4
239000012528 membrane Substances 0.000 description 4
KMUONIBRACKNSN-UHFFFAOYSA-N potassium dichromate Chemical compound [K+].[K+].[O-][Cr](=O)(=O)O[Cr]([O-])(=O)=O KMUONIBRACKNSN-UHFFFAOYSA-N 0.000 description 4
229910000881 Cu alloy Inorganic materials 0.000 description 3
238000012545 processing Methods 0.000 description 3
GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 2
BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
239000000853 adhesive Substances 0.000 description 2
230000001070 adhesive effect Effects 0.000 description 2
238000001479 atomic absorption spectroscopy Methods 0.000 description 2
230000008859 change Effects 0.000 description 2
230000008878 coupling Effects 0.000 description 2
238000010168 coupling process Methods 0.000 description 2
238000005859 coupling reaction Methods 0.000 description 2
238000011161 development Methods 0.000 description 2
239000004519 grease Substances 0.000 description 2
230000020169 heat generation Effects 0.000 description 2
238000009413 insulation Methods 0.000 description 2
229910017604 nitric acid Inorganic materials 0.000 description 2
230000002265 prevention Effects 0.000 description 2
238000011160 research Methods 0.000 description 2
229910000077 silane Inorganic materials 0.000 description 2
239000000126 substance Substances 0.000 description 2
150000003751 zinc Chemical class 0.000 description 2
NIXOWILDQLNWCW-UHFFFAOYSA-N Acrylic acid Chemical compound OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
229910002482 Cu–Ni Inorganic materials 0.000 description 1
229910001200 Ferrotitanium Inorganic materials 0.000 description 1
YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
JHWNWJKBPDFINM-UHFFFAOYSA-N Laurolactam Chemical compound O=C1CCCCCCCCCCCN1 JHWNWJKBPDFINM-UHFFFAOYSA-N 0.000 description 1
229920000299 Nylon 12 Polymers 0.000 description 1
RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
150000008044 alkali metal hydroxides Chemical class 0.000 description 1
238000000137 annealing Methods 0.000 description 1
DQIPXGFHRRCVHY-UHFFFAOYSA-N chromium zinc Chemical compound [Cr].[Zn] DQIPXGFHRRCVHY-UHFFFAOYSA-N 0.000 description 1
239000011362 coarse particle Substances 0.000 description 1
229910000365 copper sulfate Inorganic materials 0.000 description 1
ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
238000012937 correction Methods 0.000 description 1
238000007598 dipping method Methods 0.000 description 1
239000000428 dust Substances 0.000 description 1
230000000694 effects Effects 0.000 description 1
238000005516 engineering process Methods 0.000 description 1
239000000835 fiber Substances 0.000 description 1
239000012530 fluid Substances 0.000 description 1
239000011737 fluorine Substances 0.000 description 1
229910052731 fluorine Inorganic materials 0.000 description 1
238000007654 immersion Methods 0.000 description 1
239000012774 insulation material Substances 0.000 description 1
230000010354 integration Effects 0.000 description 1
238000004519 manufacturing process Methods 0.000 description 1
150000002739 metals Chemical class 0.000 description 1
238000012986 modification Methods 0.000 description 1
230000004048 modification Effects 0.000 description 1
CFVVSQSFKWLGAX-UHFFFAOYSA-N phenol;propane Chemical compound CCC.OC1=CC=CC=C1 CFVVSQSFKWLGAX-UHFFFAOYSA-N 0.000 description 1
229920003023 plastic Polymers 0.000 description 1
239000004033 plastic Substances 0.000 description 1
229920002689 polyvinyl acetate Polymers 0.000 description 1
239000011118 polyvinyl acetate Substances 0.000 description 1
230000009467 reduction Effects 0.000 description 1
238000012552 review Methods 0.000 description 1
238000005096 rolling process Methods 0.000 description 1
238000007127 saponification reaction Methods 0.000 description 1
239000007787 solid Substances 0.000 description 1
239000007921 spray Substances 0.000 description 1
238000005507 spraying Methods 0.000 description 1
239000010935 stainless steel Substances 0.000 description 1
229910001220 stainless steel Inorganic materials 0.000 description 1
230000002195 synergetic effect Effects 0.000 description 1
239000010936 titanium Substances 0.000 description 1
238000012546 transfer Methods 0.000 description 1
230000037303 wrinkles Effects 0.000 description 1

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
- C25D5/14—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium two or more layers being of nickel or chromium, e.g. duplex or triplex layers
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/16—Electroplating with layers of varying thickness
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
- C25D5/611—Smooth layers
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures

Landscapes

Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Chemical Kinetics & Catalysis (AREA)
Electrochemistry (AREA)
Materials Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Microelectronics & Electronic Packaging (AREA)
Physics & Mathematics (AREA)
Thermal Sciences (AREA)
Electroplating Methods And Accessories (AREA)
Other Surface Treatments For Metallic Materials (AREA)

TW107146225A 2017-12-26 2018-12-20 散熱用銅箔及散熱部件 TW201929645A (zh)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
JP2017249974		2017-12-26
JP2017-249974		2017-12-26

Publications (1)

Publication Number	Publication Date
TW201929645A true TW201929645A (zh)	2019-07-16

Family

ID=67067063

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
TW107146225A TW201929645A (zh)	2017-12-26	2018-12-20	散熱用銅箔及散熱部件

Country Status (5)

Country	Link
JP (1)	JP7068341B2 (ko)
KR (1)	KR102461590B1 (ko)
CN (1)	CN111433393B (ko)
TW (1)	TW201929645A (ko)
WO (1)	WO2019131092A1 (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN110234182A (zh) *	2019-07-29	2019-09-13	惠州市正胜精工科技有限公司	一种发热片的制作流程工艺
CN117604585B (zh) *	2023-11-15	2025-12-16	江西省江铜铜箔科技股份有限公司	一种表面微孔化柔性光亮镀镍铜箔及其制备方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2564771B2 (ja)	1994-09-05	1996-12-18	株式会社後藤製作所	放熱板付き半導体装置及びその製造方法
TW200738913A (en)	2006-03-10	2007-10-16	Mitsui Mining & Smelting Co	Surface treated elctrolytic copper foil and process for producing the same
JP5323677B2 (ja)	2007-03-02	2013-10-23	古河電気工業株式会社	表面粗化銅板の製造方法及び装置、並びに表面粗化銅板
JP5417458B2 (ja) *	2010-01-25	2014-02-12	Ｊｘ日鉱日石金属株式会社	二次電池負極集電体用銅箔
JP6247829B2 (ja) *	2013-03-29	2017-12-13	Ｊｘ金属株式会社	キャリア付銅箔、プリント配線板、プリント回路板、銅張積層板及びプリント配線板の製造方法
CN104125711B (zh) *	2013-04-26	2017-10-24	Jx日矿日石金属株式会社	高频电路用铜箔、覆铜板、印刷布线板、带载体的铜箔、电子设备及印刷布线板的制造方法
TWI515342B (zh) *	2013-09-05	2016-01-01	三井金屬鑛業股份有限公司	表面處理銅箔、使用該表面處理銅箔所得之貼銅積層板以及印刷配線板
JP6867102B2 (ja) *	2014-10-22	2021-04-28	Ｊｘ金属株式会社	銅放熱材、キャリア付銅箔、コネクタ、端子、積層体、シールド材、プリント配線板、金属加工部材、電子機器、及び、プリント配線板の製造方法

2018
- 2018-12-10 KR KR1020207017776A patent/KR102461590B1/ko active Active
- 2018-12-10 JP JP2019562933A patent/JP7068341B2/ja active Active
- 2018-12-10 WO PCT/JP2018/045341 patent/WO2019131092A1/ja not_active Ceased
- 2018-12-10 CN CN201880078512.6A patent/CN111433393B/zh active Active
- 2018-12-20 TW TW107146225A patent/TW201929645A/zh unknown

Also Published As

Publication number	Publication date
JPWO2019131092A1 (ja)	2020-12-03
CN111433393A (zh)	2020-07-17
KR102461590B1 (ko)	2022-11-01
KR20200090207A (ko)	2020-07-28
JP7068341B2 (ja)	2022-05-16
CN111433393B (zh)	2022-12-09
WO2019131092A1 (ja)	2019-07-04

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JP5654416B2 (ja)	2015-01-14	液晶ポリマー銅張積層板及び当該積層板に用いる銅箔
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