TW201933981A - Grasping device and mounting device - Google Patents

Abstract

The present invention provides a grasping device and a mounting device for an electronic component, in which an occurrence of a bounce of an electronic component from a substrate is suppressed. A grasping device is provided with: a grasping mechanism for grasping an electronic component; and a pressing portion which is provided in the grasping mechanism, and, at a time when the electronic component grasped by the grasping mechanism is mounted on a substrate and grasping of the electronic component is released, presses the electronic component so as to hinder a movement toward a direction distanced from the substrate by the electronic component.

Description

Holding device and mounting device

The present invention relates to a holding device for holding an electronic component of an electronic component and a mounting device for mounting the held electronic component on the substrate.

Previously, there has been proposed a technique of using a robot to hold an electronic component and insert a lead of the electronic component into a via hole of the substrate. Such a mounting device is disclosed in Patent Document 1.
[Prior Art Literature]
[Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. Hei 5-55784

[The problem that the invention wants to solve]

However, when the electronic component mounting apparatus disclosed in Patent Document 1 is used to mount a large number of electronic components in a short time and the robot is moved at a high speed to be mounted on the substrate, when the electronic component is mounted on the substrate, there is The possibility of bouncing electronic parts. Specifically, when the robot is moved at a high speed and the electronic component is placed on the substrate, a large force acts on the substrate, and the substrate is deflected, and the restoring force of the substrate at this time may cause the electronic component to bounce back. When the electronic component springs back and floats, there is a possibility that the floating electronic component falls off from the via hole of the substrate.

Accordingly, the present invention has been made in view of the above circumstances, and an object thereof is to provide a holding device and a mounting device for suppressing generation of an electronic component that springs back from a substrate.
[Means for solving problems]

A gripping device according to the present invention includes: a grip portion that grips an electronic component; and a pressing portion that is provided on the grip portion, and the electronic component held by the grip portion is attached to the substrate to release the grip portion When the electronic component is held, the electronic component is pressed to prevent the electronic component from moving in a direction away from the substrate.

In the holding device of the above configuration, when the pressing portion provided on the grip portion releases the electronic component so as to prevent the electronic component from moving away from the substrate when the electronic component is released, the electronic component can be suppressed from being on the substrate. Bounce back and float. Therefore, when the electronic component is mounted on the substrate, the electronic component can be prevented from falling off the substrate.

Further, the pressing portion is provided at a position opposite to the electronic component in the grip portion, and a front end portion of the pressing portion that is closer to the electronic component may be based on the opposite position in the grip portion The distance from the electronic component is displaced in a direction close to and separated from the electronic component.

Since the front end portion of the electronic component side in the pressing portion can be displaced in the direction of approaching and separating from the electronic component according to the distance between the opposing position of the electronic component and the electronic component in the pressing portion, the holding portion is When the control is released from the electronic component, the pressing portion can continue to abut against the electronic component, and the electronic component can be prevented from floating. Therefore, when the grip portion is released from gripping, it is possible to more reliably suppress the electronic component from falling off from the substrate.

Further, the pressing portion may be an elastic body.

Since the pressing portion is an elastic body, it can be easily configured to suppress the electronic component from floating up from the substrate.

Further, in the grip portion, a passage is provided in a direction in which the electronic component approaches and separates from the electronic component, and the pressing portion is movable inside the passage along a direction in which the passage extends.

Since the pressing portion can move inside the passage along the extending direction of the passage, it can be easily configured to suppress the electronic component from floating up from the substrate.

Further, the mounting device of the present invention includes: a grip portion that grips an electronic component; and a pressing portion that is provided in the grip portion, and the electronic component held by the grip portion is attached to the substrate to release the grip portion When the electronic component is held, the electronic component is pressed to prevent the electronic component from moving away from the substrate; and the control unit controls the holding portion to hold the electronic component, and the holding portion faces the electronic component The release of the grip of the part and the movement of the above-mentioned grip.

The mounting device having the above configuration can control the holding of the electronic component by the grip portion, the release of the holding portion to the electronic component, and the movement of the grip portion by the control of the control unit. Therefore, when the electronic component is mounted on the substrate, the mounting device can be mounted on the substrate. The electronic component is prevented from falling off the substrate, and the mounting of the electronic component can be performed accurately and accurately.

Further, the grip portion may be configured as a hand of a robot.

Since the grip portion is configured as a hand of the robot, the electronic component can be mounted by the mounting device with high precision and high speed.
[Effects of the Invention]

According to the present invention, when the electronic component is mounted on the substrate, the springback of the electronic component from the substrate can be suppressed, so that the electronic component can be surely mounted on the substrate. Therefore, the mounting of the electronic parts can be performed more efficiently.

Hereinafter, an electronic component mounting apparatus according to an embodiment of the present invention will be described with reference to the accompanying drawings.

(mounting device 100)
Fig. 1 is a view showing a schematic configuration of a mounting device 100 according to an embodiment of the present invention. As shown in FIG. 1, the mounting apparatus 100 of this embodiment is comprised by the robot 11.

The robot 11 used in the mounting device 100 includes a susceptor 12 fixed to the cradle, one of the pair of robot arms 13a and 13b (the first robot arm 13a and the second robot arm 13b) supported on the susceptor 12, and the accommodating body. Control unit 14 in base 12. The robot 11 can be placed in a limited space equivalent to one person (for example, 610 mm × 620 mm).

Hereinafter, the direction in which the pair of robot arms are extended is referred to as the left-right direction, the direction parallel to the axis of the base axis is referred to as the vertical direction, and the direction orthogonal to the left-right direction and the vertical direction is referred to as the front-rear direction. The robot 11 of the present embodiment is applied to a mounting site of a wiring board, and performs an operation of mounting an electronic component with a lead on the wiring board.

(a pair of robot arms 13a, 13b)
The first robot arm 13a (the right robot arm in the drawing) and the second robot arm 13b (the left robot arm in the drawing) are each configured as a horizontal articulated robot that can move relative to the susceptor 12. The first robot arm 13a includes an arm portion 15, a wrist portion 17, and a first end effector 18a. The second robot arm 13b includes an arm portion 15, a wrist portion 17, and a second end effector 18b. Further, the pair of robot arms 13a, 13b may be operated independently of each other or may be associated with each other.

In the present embodiment, the arm portion 15 is constituted by the first link 15a and the second link 15b. The first link 15a is rotatably coupled to the base shaft 16 fixed to the upper surface of the base 12 by the rotary joint J1, and is rotatable about a rotation axis L1 passing through the axis of the base shaft 16. The second link 15b is rotatably coupled to the front end of the first link 15a by the rotary joint J2, and is rotatable about a rotation axis L2 defined by the front end of the first link 15a.

A wrist portion 17 is attached to the front end of the second link 15b. The front end of the second link 15b and the wrist portion 17 are coupled via a linear motion joint J3 and a rotary joint J4. The wrist portion 17 is movable up and down with respect to the second link 15b by the linear motion joint J3. The wrist portion 17 is rotatable about a rotation axis L3 perpendicular to the second link 15b by the rotary joint J4. The wrist portion 17 has a mechanical interface 19 on which the first end effector 18a or the second end effector 18b is attached.

The first end effector 18a is coupled to the mechanical interface 19 of the right wrist portion 17. That is, the first end effector 18a is provided at the front end of the first robot arm 13a. Similarly, the second end effector 18b is coupled to the mechanical interface 19 of the left wrist portion 17. In the present embodiment, the second end effector 18b is not used, and nothing is connected to the mechanical interface 19 of the left wrist portion 17.

One of the above configurations has the joints J1 to J4 for the robot arms 13a and 13b, respectively. Further, a pair of robot arms 13a and 13b are provided with a servo motor (not shown) for driving and an encoder for detecting the rotation angle of the servo motor so as to correspond to the joints J1 to J4 (not shown). Illustration) and so on. Further, the rotation axis L1 of the first link 15a of the first robot arm 13a and the rotation axis L1 of the first link 15a of the second robot arm 13b are on the same straight line, and the first link 15a of the first robot arm 13a The first link 15a of the second robot arm 13b is disposed vertically above and below the height difference.

(first end effector 18a)
The first end effector 18a will be described with reference to Fig. 2 . FIG. 2 shows a state in which the robot 11 used in the mounting apparatus 100 of the present embodiment holds a plurality of electronic components E on the holding device 60 provided as an end effector.

The first end effector 18a includes a gripping device 60 that is rotatably provided at a base thereof for holding the electronic component E, and a connecting portion 70 that connects the gripping device 60 to the wrist portion 17. The connecting portion 70 extends from the wrist portion 17 so as to extend downward in the vertical direction.

The gripping device 60 includes a plurality of gripping mechanisms 1 (holding portions) 64. In the present embodiment, the gripping device 60 includes eight gripping mechanisms 64. The gripping mechanism 64 is configured to be able to hold one electronic component E, respectively. In the gripping device 60, the eight gripping mechanisms 64 are radially arranged at intervals in the circumferential direction.

In addition, the gripping device 60 includes a disc member 62. The disc member 62 is attached to the connecting portion 70 such that the central portion is located near the lower end portion of the connecting portion 70. The disc member 62 is configured to be rotatable. In the present embodiment, the disk member 62 is attached so as to be rotatable about the rotation shaft 1 extending in the horizontal direction. Therefore, the disc member 62 is mounted to be rotatable in a plane perpendicular to the horizontal plane.

The gripping mechanism 64 has a clamp portion 80 at the front end portion.

Each of the eight gripping mechanisms 64 holds one electronic component E and mounts the electronic component E on the substrate. Each of the eight gripping mechanisms 64 includes a jig portion 80 extending in the diameter direction of the disc member 62 in the radial direction, and a grip portion 80 provided at the end portion extending in the diameter direction toward the portion 66. The jig unit 80 of the present embodiment holds the electronic component E by restraining the electronic component E so as to be sandwiched from the outer side of the electronic component E.

(Controlling Agency 64)
In FIG. 3, one of the eight gripping mechanisms 64 is shown in an enlarged perspective view. The gripping mechanism 64 includes a plurality of gripping portions 80. In the present embodiment, the grip mechanism 64 includes three grip portions 80a, 80b, and 80c.

The three clamp portions 80a, 80b, and 80c are configured to be movable in a direction in which they approach and separate from each other. The electronic component is sandwiched between the plurality of clamp portions 80 in a state in which the plurality of clamp portions 80 are separated from each other, and the plurality of clamp portions 80 are moved toward each other, whereby the grip mechanism 64 can hold the electronic component E. . Further, by holding the electronic component E between the plurality of clamp portions 80 and moving the plurality of clamp portions 80 in the direction in which they are separated from each other, the grip mechanism 64 can release the grip of the electronic component E.

In the present embodiment, when the holding unit 64 holds the electronic component E, the electronic component E is placed between the three clamp portions 80a, 80b, and 80c in a state of being separated from each other. In the state in which the electronic component E is disposed between the three clamp portions 80a, 80b, and 80c, the three clamp portions 80a, 80b, and 80c are moved in the direction in which they approach each other, and the electronic component E is sandwiched therebetween. The mechanism 64 holds the electronic component E. In addition, the gripping mechanism 64 is moved by the three gripping portions 80a, 80b, and 80c, and the three gripping portions 80a, 80b, and 80c are moved in the direction in which they are separated from each other, whereby the gripping of the gripping mechanism 64 is released.

Further, in the present embodiment, the gripping mechanism 64 has been described as being provided with three clamp portions 80a, 80b, and 80c. However, the present invention is not limited to the above embodiment. The gripping mechanism 64 may also be in the form of two gripping portions. In this case, the electronic component E may be sandwiched and held by the two clamp portions from both sides. Further, the gripping mechanism may have four or more grip portions. Alternatively, the electronic component may be held by sandwiching the electronic components located inside by sandwiching the four or more clamp portions in the direction in which they approach each other.

In the present embodiment, the pressing portion 81 is attached to the clamp portion 80a of the three clamp portions 80. The pressing portion 81 is attached to a position (opposing position) of the grip portion 80a of the gripping mechanism 64 that faces the electronic component E. In the present embodiment, the pressing portion 81 is attached to the front end of the clamp portion 80a. The pressing portion 81 is formed of an elastic body, and in the present embodiment, the pressing portion 81 is formed of a spring.

(control structure)
Next, the control configuration of the mounting device 100 will be described. In Fig. 4, a block diagram showing the control configuration in the mounting device 100 is shown.

As shown in FIG. 4, the control unit 14 in the mounting apparatus 100 includes a calculation unit 14a, a storage unit 14b, and a servo control unit 14c.

The control unit 14 is, for example, a robot controller including a computer such as a microcontroller. Further, the control unit 14 may be constituted by a separate control unit 14 that is collectively controlled, or may be constituted by a plurality of control units 14 that are cooperatively controlled and distributedly controlled.

Information such as a basic program of the robot controller and various fixed materials is stored in the storage unit 14b. The computing unit 14a controls the various operations of the mounting device 100 by reading and executing the software such as the basic program stored in the storage unit 14b. In other words, the computing unit 14a generates a control command for the mounting device 100 and outputs it to the servo control unit 14c. For example, the arithmetic unit 14a is constituted by a processor unit.

The servo control unit 14c is configured to control the driving of the servo motor corresponding to each joint of the robot arms 13a and 13b in the mounting device 100 based on the control command generated by the computing unit 14a.

(Installation of electronic parts E)
Next, the mounting of the electronic component E using the mounting device 100 on the substrate S will be described. In each of the steps of mounting the electronic component E on the substrate S, a configuration diagram showing the configuration of the gripping mechanism 64 and the electronic component E is shown in FIGS. 5(a) to 5(d).

In FIG. 5(a), the gripping mechanism 64 and the electronic component E in a state in which the gripping mechanism 64 holding the electronic component E is moved toward the via holes 90 and 91 to be mounted in the substrate S are shown. As shown in FIG. 5(a), the holding mechanism 64 grips the electronic component E by being sandwiched by the clamp portion 80 in the gripping mechanism 64. The gripping mechanism 64 is moved to the via hole to be mounted on the substrate S in a state in which the electronic component E is held.

When the lead wires 68 and 69 extending from the electronic component E reach the positions corresponding to the via holes 90 and 91 to be mounted in the substrate S, the gripping mechanism 64 moves downward from here, and the electronic component E approaches the substrate S. Lead wires 68, 69 are inserted into the via holes 90, 91. Fig. 5(b) is a view showing a configuration of the gripping mechanism 64 and the electronic component E in a state in which the lead wires 68 and 69 extending from the electronic component E are inserted into the via holes 90 and 91. In this state, the electronic component E is held by the clamp unit 80.

When the leads 68 and 69 of the electronic component E are inserted into the via holes 90 and 91 in the substrate S, the clip portions 80 of the gripping mechanism 64 are moved in the direction in which they are separated from each other. (c) of FIG. 5 is a view showing a configuration of the gripping mechanism 64 and the electronic component E in a state in which the gripper portion 80 of the gripping mechanism 64 is moved in a direction in which they are separated from each other. When the gripper portion 80 of the gripping mechanism 64 is moved in the direction in which they are separated from each other, the gripping mechanism 64 releases the grip of the electronic component E.

At this time, the pressing portion 81 presses the electronic component E from the upper side toward the substrate S. Therefore, the pressing portion 81 presses the electronic component E in a direction in which the electronic component E is prevented from moving upward.

When the gripping mechanism 64 releases the grip of the electronic component E, the gripping mechanism 64 moves in the direction of being separated from the electronic component E. FIG. 5(d) is a view showing a configuration in which the gripping mechanism 64 is moved in the direction of being separated from the electronic component E. When the gripping mechanism 64 is separated from the electronic component E and the electronic component E side front end portion 81a of the pressing portion 81 is separated from the electronic component E, the mounting of the electronic component E on the substrate S is completed.

In the present embodiment, the robot 11 of the mounting device 100 includes the grip device 60 as the first end effector 18a. That is, the grip device 60 functions as a hand of the robot 11 in the mounting device 100. At this time, the gripping device 60 is moved by the control of the control unit 14 of the robot 11, and the gripping mechanism 64 is moved. Therefore, when the gripping device 60 is moved by the control unit 14 of the robot 11, the gripping mechanism 64 moves to hold the electronic component E, and the lead wires 68 and 69 of the electronic component E are inserted into the via holes 90 and 91 of the substrate S. in. Further, the control unit 14 of the robot 11 controls the holding of the electronic component E by the holding device 60 and the release of the grip. Therefore, the control of the electronic component E is released by the control of the control unit 14 of the robot 11, and the gripping mechanism 64 is moved in the direction of being separated from the electronic component E.

Then, the gripping device 60 rotationally moves the disc member 62 so that the next gripping mechanism 64 is disposed at a position opposed to the via hole to which the substrate S is to be mounted. Thereby, the electronic component E is started to be mounted in the next via hole by the next holding mechanism 64.

As the mounting device 100 of the electronic component E, in order to increase the amount of processing during mounting, there is a case where the gripping mechanism 64 is moved at a high speed to mount the electronic component E at a high speed. When the electronic component E is mounted at a high speed, the speed at which the lead wires 68 and 69 of the electronic component E are moved downward by being inserted into the via holes 90 and 91 is large. In this case, it is considered that when the electronic component E is mounted on the substrate S, the bottom surface of the electronic component E abuts on the substrate S, and a relatively large force F1 acts on the bottom surface of the electronic component E to push the substrate S downward. direction.

As shown in FIG. 5(b), when the force F1 acts in the direction in which the substrate S is pushed downward, the substrate S is slightly deflected so as to be convex downward. When the substrate S is bent so as to be convex downward, the substrate S is deflected in a direction in which it is convex upward by the restoring force of the substrate S. With the restoring force of the substrate S at this time, the force F2 acts on the direction in which the electronic component E faces upward.

It is assumed that when the pressing portion 81 does not exist, there is a possibility that the electronic component E floats due to the force F2 in the direction in which the electronic component E faces upward. When the force F2 is large at this time, the leads 68, 69 of the electronic component E move above the via holes 90, 91, and there is a possibility that the electronic component E falls off from the via holes 90, 91.

In the present embodiment, the pressing portion 81 is disposed at a position facing the electronic component E in the clamp portion 80a. Therefore, when the grip portion 80 moves in the direction in which they are separated from each other, and the grip mechanism 64 releases the grip of the electronic component E, the electronic component E can be pressed downward. Therefore, after the grip of the gripping mechanism 64 is released, the electronic component E can be prevented from moving upward.

Since the movement of the electronic component E upward is suppressed, it is possible to prevent the electronic component E from being accidentally detached from the via holes 90 and 91 of the substrate S. Therefore, when the electronic component E is mounted on the substrate S, the leads 68 and 69 of the electronic component E are not detached from the via holes 90 and 91, and the electronic component E can be surely mounted on the substrate S. Since the mounting of the electronic component E is surely performed, the mounting of the electronic component E can be performed more efficiently. Therefore, when the electronic component E is mounted, the running cost can be reduced.

Further, even if the gripping mechanism 64 is moved at a high speed and the electronic component E is mounted at a high speed, the mounting of the electronic component E can be surely performed. Therefore, the number of electronic parts E that can be mounted per unit time can be increased, and the amount of processing for mounting the electronic parts E can be improved.

Further, in the present embodiment, since the pressing portion 81 is formed by a spring, the front end portion 81a on the side close to the electronic component E can be displaced in the direction in which the electronic component E approaches and separates. Therefore, as shown in FIG. 5(c), when the gripping mechanism 64 releases the grip of the electronic component E and the gripping mechanism 64 moves in the direction of being separated from the electronic component E, the pressing portion 81 can continue to abut against the electronic component E.

In the present embodiment, as shown in FIG. 5(b), the electronic component E is held by the gripping mechanism 64 in a state where the pressing portion 81 is compressed. Therefore, the pressing portion 81 is biased toward the electronic component E and attached to the front end of the gripping mechanism 64. Even if the gripping mechanism 64 moves, the grip portion 80 of the gripping mechanism 64 is detached from the electronic component E, and the front end portion 81a of the pressing portion 81 on the electronic component E side is also based on the distance between the grip portion 80 of the gripping mechanism 64 and the electronic component E. It is displaced toward the direction of the electronic component E. Therefore, the pressing portion 81 can continue to abut against the electronic component E. As a result, the front end portion 81a of the pressing portion 81 on the electronic component E side is configured to be displaceable according to the distance between the position of the gripping mechanism 64 opposed to the electronic component E and the electronic component E. Therefore, when the grasping mechanism 64 releases the grip of the electronic component E, the gripping mechanism 64 releases the electronic component E in a state where the pressing portion 81 and the electronic component E have abutted. As a result, when the gripping mechanism 64 releases the grip of the electronic component E, the pressing portion 81 comes into contact with the electronic component E, and the electronic component E is prevented from moving upward.

When the gripping mechanism 64 is released, the gripping mechanism 64 is moved in the direction of being separated from the electronic component E while the end portion 81a of the pressing portion 81 is in contact with the electronic component E, so that the electron can be gradually reduced. The pressing force of the part E releases the grip of the gripping mechanism 64. When the grasping of the electronic component E by the gripping mechanism 64 is released, the pressing force is released while gradually reducing the pressing force in the direction toward the substrate S. Therefore, the pressing force of the electronic component E can be suppressed from being released quickly.

If the pressing force of the gripping mechanism 64 is released suddenly, the elastic energy is suddenly released due to the downward displacement of the substrate S, and the electronic component E is rapidly displaced upward, and the leads 68 and 69 are detached from the via holes 90 and 91. The possibility.

On the other hand, in the present embodiment, even if the grip of the gripping mechanism 64 is released, the pressing portion 81 continues to press the electronic component E in the direction toward the substrate S, and gradually reduces the pressing force in the direction toward the substrate S. The gripping mechanism 64 is separated from the electronic component E. Therefore, when the gripping mechanism 64 is released from gripping, it is possible to suppress the sudden release of the elastic energy from the substrate S due to the displacement of the substrate S. Thereby, it is possible to suppress the electronic component E from bounce and float, and it is possible to suppress the lead wires 68 and 69 of the electronic component E from falling out of the via holes 90 and 91 of the substrate S.

Further, in the present embodiment, since the gripping mechanism 64 is configured as a hand of the robot, the mounting of the electronic component E of the mounting device 100 can be performed with high precision and high speed. Further, in the present embodiment, the control unit 14 of the robot 11 controls the holding of the electronic component E by the gripping mechanism 64, the release of the holding of the electronic component E by the gripping mechanism 64, and the movement of the gripping mechanism 64. These actions are performed correctly and with high precision.

(Second embodiment)
Next, a test apparatus according to a second embodiment of the present invention will be described. It is noted that the same components as those in the first embodiment are denoted by the same reference numerals, and the description thereof will be omitted. Only the different portions will be described.

In the first embodiment described above, the pressing portion 81 is formed of an elastic body. On the other hand, in the second embodiment, the difference from the first embodiment is that the pressing portion is constituted by a columnar body that can move inside the passage.

FIG. 6(a) is a view showing a configuration of the gripping mechanism 64a and the electronic component E in a state in which the electronic component E is gripped by the gripping mechanism 64a of the second embodiment. In addition, FIG. 6(b) is a view showing a configuration of the gripping mechanism 64a and the electronic component E in a state in which the gripping mechanism 64a of the second embodiment releases the grip of the electronic component E.

In the gripping mechanism 64a of the second embodiment, a passage 83 is provided in the grip portion 80a. In the present embodiment, the passage 83 is provided to penetrate the clamp portion 80a in the vertical direction. A pressing portion 82 is provided in the passage 83 in the clamp portion 80a. The pressing portion 82 is configured to be movable inside the passage 83. In the present embodiment, the pressing portion 82 is a columnar body that can move inside the passage 83 along the extending direction of the passage 83. In the present embodiment, the pressing portion 82 is formed in a columnar shape such that the cross section along the horizontal plane is circular.

Further, at the end portion of the pressing portion 82 on the side opposite to the electronic component E, a flange portion 82a having a larger diameter than the cylindrical portion is formed. The pressing portion 82 is configured to abut against the electronic component E on the end portion 82b of the flange portion 82a on the side opposite to the electronic component E. Further, on the end portion of the pressing portion 82 opposite to the side opposite to the side of the electronic component E, a flange portion 82c having a larger diameter than the cylindrical portion is formed.

As shown in Fig. 6 (a), in the state in which the holding unit 64a of the present embodiment holds the electronic component E, the electronic component E is held by the clamp portions 80a, 80b, and 80c and held.

As shown in Fig. 6(b), when the leads 68, 69 of the electronic component E are inserted into the via holes 90, 91 in the substrate S, the clamp portions 80a, 80b, 80c in the gripping mechanism 64a are moved away from each other. The holding of the electronic component E sandwiched by the clamp portions 80a, 80b, and 80c is released.

At this time, the pressing portion 82 presses the electronic component E in the direction toward the substrate S.

In the present embodiment, the passage portion 83 is provided in the clamp portion 80a, and in the passage 83, the pressing portion 82 is disposed to be movable inside the passage 83. Therefore, when the clamp portions 80a, 80b, and 80c of the gripping mechanism 64a release the grip of the electronic component E, the pressing portion 82 can press the electronic component E downward. As a result, when the clamp portions 80a, 80b, and 80c of the gripping mechanism 64a release the grip of the electronic component E, the pressing portion 82 has pressed the electronic component E. In the present embodiment, the pressing portion 82 presses the electronic component E downward by its own weight. Therefore, after the grips of the grip portions 80a, 80b, and 80c of the gripping mechanism 64a are released, the electronic component E can be prevented from moving upward. Thereby, when the electronic component E is mounted on the substrate S, the leads 68 and 69 of the electronic component E are not detached from the through holes 90 and 91, and the electronic component E can be surely mounted on the substrate S. Since the mounting of the electronic component E is surely performed, the mounting of the electronic component E can be performed more efficiently. Therefore, when the electronic component E is mounted, the running cost can be reduced.

Further, even if the gripping mechanism 64a is moved at a high speed to mount the electronic component E at a high speed, the mounting of the electronic component E can be surely performed. Therefore, the number of electronic parts E that can be mounted per unit time can be increased, and the amount of processing for mounting the electronic parts E can be improved.

Further, in the present embodiment, the pressing portion 82 is configured such that the front end portion 82b close to the electronic component E can be displaced in the direction in which the electronic component E approaches and separates. Since the pressing portion 82 is configured to be movable inside the passage 83, even if the gripping mechanism 64a moves in the direction of being separated from the electronic component E, the pressing portion 82 follows the electronic component E and moves in the direction toward the electronic component E. That is, even if the clamp portion 80 of the gripping mechanism 64a is detached from the electronic component E, the electronic component E side front end portion 82b of the pressing portion 82 is also based on the position of the holding mechanism 64a opposite to the electronic component E and the electronic component E. The distance between them is shifted toward the direction of the electronic component E. Therefore, the pressing portion 82 can continue to abut against the electronic component E.

In this way, the electronic component E side front end portion 82b of the pressing portion 82 can be displaced according to the distance between the clamp portion 80 of the gripping mechanism 64 and the electronic component E. Therefore, when the gripping mechanism 64 releases the grip of the electronic component E, the gripping mechanism 64a releases the electronic component E in a state where the pressing section 82 is in contact with the electronic component E. As described above, when the gripping mechanism 64a releases the grip of the electronic component E, the pressing portion 82 comes into contact with the electronic component E, and the electronic component E is prevented from moving upward. Therefore, as shown in FIG. 6(b), when the gripping mechanism 64a releases the grip of the electronic component E and the gripping mechanism 64a moves in the direction of being separated from the electronic component E, the pressing portion 82 can continue to contact the electronic component E. Press the electronic part E.

As shown in FIG. 6(a), the holding mechanism 64a holds the state of the electronic component E, and as shown in FIG. 6(b), the holding mechanism 64a releases the electronic component E, and the electronic component is removed. E is in a state in which it acts only by the pressing of the self-weight of the pressing portion 82.

A flange portion 82c is provided at an end portion of the pressing portion 82 opposite to the side opposite to the electronic component E. When the gripping mechanism 64a is further separated from the electronic component E in the state shown in FIG. 6(b), the flange portion 82c comes into contact with the clip portion 80a, and the pressing portion 82 cannot be further pressed against the electronic component E. When the gripping mechanism 64a is further moved in the direction of being separated from the electronic component E, the pressing portion 82 is detached from the electronic component E.

In the present embodiment, when the gripping mechanism 64a releases the holding of the electronic component E, the pressing force is changed from the pressing of the gripping mechanism 64a to the pressing by the self-weight of the pressing portion 82, and thereafter the pressing force to the electronic component E disappears. At this time, the pressing force by the weight of the pressing portion 82 is smaller than the pressing force of the holding mechanism 64a.

In the present embodiment, when the gripping mechanism 64a releases the grip of the electronic component E, the pressing force acting on the electronic component E changes as follows: the pressing by the gripping mechanism 64a temporarily passes the pressing of the pressing portion 82 by its own weight. It becomes a state in which pressure is no longer effective. Therefore, when the gripping mechanism 64a releases the grip of the electronic component E, the pressing force of the electronic component E is changed stepwise, and the grasping mechanism 64a is released from gripping the electronic component E.

When the gripping of the gripping mechanism 64 is released, the pressing force in the direction toward the substrate S is gradually reduced and the gripping is released. Therefore, the pressing force of the electronic component E can be suppressed from being released quickly. In the present embodiment, even if the gripping mechanism 64a is released, the pressing portion 82 continues to press the electronic component E toward the substrate S, and the pressing force in the direction toward the substrate S is gradually reduced. At the same time, the holding mechanism 64a Separated from the electronic part E. Therefore, when the gripping mechanism 64a is released from gripping, it is possible to suppress the rapid release of the elastic energy from the substrate S due to the displacement of the substrate S. Thereby, the electronic component E can be prevented from floating, and the leads 68 and 69 of the electronic component E can be detached from the via holes 90 and 91 of the substrate S.

Further, in the above-described embodiment, the configuration in which the elastic body and the columnar body movable inside the passage in the clamp portion are used as the pressing portion has been described. However, the present invention is not limited to the above embodiment. The configuration of the other pressing portion can also be applied to the present invention by suppressing the electronic component from being bounced back from the substrate when the holding mechanism releases the electronic component and pressing the electronic component.

60‧‧‧ Holding device

64‧‧‧Control institutions

68, 69‧‧‧ leads

80a, 80b‧‧‧Clamping Department

81, 82‧‧‧ Pressing Department

81a‧‧‧ front end

90, 91‧‧‧through holes

100‧‧‧Installation device

S‧‧‧Substrate

E‧‧‧Electronic parts

F1, F2‧‧‧ force

Fig. 1 is a front view showing a schematic configuration of a mounting device according to a first embodiment of the present invention.

Fig. 2 is a side elevational view showing the holding device of the mounting device of Fig. 1 in an enlarged manner.

Fig. 3 is a perspective view showing the holding mechanism of the holding device of Fig. 2 in an enlarged manner.

Figure 4 is a block diagram showing the construction of the control system of the mounting device of Figure 1.

5(a) to 5(d) are views showing the construction of each step when the electronic component is mounted on the substrate by using the mounting device of Fig. 1.

(a) and (b) of FIG. 6 are configuration diagrams showing respective steps when an electronic component is mounted on a substrate by using the mounting device according to the second embodiment of the present invention.

Claims (6)

A holding device characterized by comprising: a holding unit that holds electronic components; The pressing portion is provided in the grip portion, and is configured to prevent the electronic component from being detached from the substrate when the electronic component held by the grip portion is mounted on the substrate to release the grasping portion to hold the electronic component The above electronic parts are pressed in a moving manner. a holding device as claimed in claim 1, wherein The pressing portion is disposed at a position opposite to the electronic component in the grip portion, The front end portion of the pressing portion that is close to the electronic component may be displaced in a direction approaching and separating from the electronic component based on a distance between the opposing position in the grip portion and the electronic component. The holding device according to claim 1 or 2, wherein The pressing portion is an elastic body. a holding device as claimed in claim 2, wherein Providing a passage along the grip portion in a direction in which the electronic component approaches and separates from the electronic component. The pressing portion is movable inside the passage along the extending direction of the passage. A mounting device characterized by comprising: a holding unit that holds electronic parts; The pressing portion is provided in the grip portion, and is configured to prevent the electronic component from being detached from the substrate when the electronic component held by the grip portion is mounted on the substrate to release the grasping portion to hold the electronic component Pressing the electronic component in a moving manner; The control unit controls the gripping of the electronic component by the gripping portion, the release of the grasping of the electronic component by the gripping portion, and the movement of the gripping portion. The mounting device of claim 5, wherein The grip portion is configured as a hand of a robot.