TW201945571A - Producing device of mask integrated frame - Google Patents

Abstract

The invention relates to a device for manufacturing a frame-integrated mask. The device for manufacturing a frame-integrated mask according to the present invention includes: a table portion for mounting and supporting a frame; a clamping portion for clamping a template, the template being adhered to and supporting the mask; and clamping movement The head moves the clamping portion along at least one of the X, Y, Z, and θ axes; the head irradiates the welding portion of the mask with laser light, and senses the alignment state of the mask; and the head moving portion, along the The head is moved in at least one of the X, Y, and Z directions, and the clamping portion is configured to clamp at least a part of the upper surface of the template.

Description

Device for manufacturing frame-integrated mask

FIELD OF THE INVENTION The present invention relates to a device for manufacturing a frame-integrated mask. More specifically, it relates to a frame that can stably support and move without deforming the mask, can form the mask into a frame, and can accurately align the masks. Device for manufacturing an integrated mask.

BACKGROUND OF THE INVENTION As a technology for forming pixels in an OLED (Organic Light Emitting Diode) manufacturing process, an FMM (Fine Metal Mask, fine metal mask) method is mainly used. This method uses a thin film metal mask (Shadow Mask, shadow mask). ) Close to the substrate and deposit the organics on the desired location.

In the existing OLED manufacturing process, after the mask is manufactured into a strip shape, a plate shape, etc., the mask is welded and fixed to the OLED pixel deposition frame and used. A plurality of units corresponding to one display may be provided on one mask. In addition, in order to manufacture a large-area OLED, a plurality of masks may be fixed to the OLED pixel deposition frame. During the process of fixing to the frame, each mask is stretched to make it flat. It is very difficult to adjust the tensile force so that the entire portion of the mask becomes flat. In particular, in order to make each unit flat and align a mask pattern having a size of only several μm to several tens μm, it is necessary to fine-tune the tensile force applied to each side of the mask and confirm the high-level operation requirements in real time .

However, in the process of fixing multiple masks to one frame, there is still a problem of poor alignment between masks and between mask units. In addition, during the process of welding and fixing the mask to the frame, the thickness of the mask film is too thin and the area is large, so there is a problem that the mask sags or twists due to the load, and wrinkles and burrs occur in the welded part during the welding process. ), Etc., and the problem that the alignment of the mask unit is staggered.

In ultra-high-definition OLEDs, the current QHD (Quarter High Definition) image quality is 500-600 PPI (pixel per inch), and the pixel size reaches about 30-50 μm, while 4K UHD ( Ultra High Definition (Ultra High Definition) and 8K UHD have higher resolutions of ~ 860PPI, ~ 1600PPI, etc. In this way, considering the pixel size of the ultra-high-definition OLED, it is necessary to reduce the alignment error between the units to several μm, beyond which the product will be defective, so the yield may be extremely low. Therefore, it is necessary to develop a technique capable of preventing deformation of the mask from sagging or twisting, and achieving accurate alignment, a technique of fixing the mask to a frame, and the like.

SUMMARY OF THE INVENTION Accordingly, the present invention has been made in order to solve the above-mentioned problems in the prior art, and an object thereof is to provide a manufacturing apparatus for a frame-integrated mask capable of forming an integrated structure of a mask and a frame.

Another object of the present invention is to provide a device for manufacturing a frame-integrated mask, which can prevent deformation of the mask such as sagging or distortion, and enable accurate alignment.

Another object of the present invention is to provide a manufacturing apparatus of a frame-integrated mask, which significantly shortens the manufacturing time and significantly improves the yield.

Another object of the present invention is to provide a device for manufacturing a frame-integrated mask, which can stably support and move the mask without deformation.
Technical solutions

The above object of the present invention is achieved by a manufacturing device of a frame-integrated mask. The device includes: a table portion for mounting and supporting a frame; a clamping portion for gripping a template, and the template is glued together. The mask is supported; the moving part is clamped to move the clamping part along at least one of the X, Y, Z, and θ axes; the head part is irradiated with laser light to the welding part of the mask, and the Measuring the alignment state of the mask; and a head moving part that moves the head along at least one of the X, Y, and Z directions, wherein the clamping part is configured to attract an upper surface of the template. At least part of the way to clamp.

The stage portion may include a frame alignment unit for aligning a position of the frame.

The stage portion may include a heating unit for heating the frame.

The clamping unit may include: a clamping unit for clamping the template; a clamping moving unit that moves the clamping unit along at least one of the X, Y, Z, and θ axes; and a connection unit , Connecting the clamping moving unit to the clamping moving part.

The clamping unit may be formed with a plurality of adsorption units spaced apart from each other, and the plurality of adsorption units are configured to apply suction pressure to the template.

A plurality of the adsorption units may be arranged so as not to overlap the region on the Z axis of the welding portion of the mask.

The grip moving unit includes: a base unit; a grip supporting unit configured on the base unit to support the grip; and a grip track unit for moving the base unit, wherein, The base unit can be moved in a region spaced from the stage portion along the Z-axis direction so that the clamping portion enters an upper portion of the stage portion.

The head may include a laser unit that irradiates the mask with laser light to weld the mask to the frame, or irradiates the mask with laser light to perform laser trimming .

A pair of the laser units are spaced apart from each other, and each of the laser units irradiates laser light to the soldering portions on one side and the other side of the mask, respectively.

The frame may include an edge frame portion including a hollow region, and a mask unit sheet portion including a plurality of mask unit regions and connected to the edge frame portion.

The frame may include a plurality of the mask unit regions along at least one of a first direction and a second direction perpendicular to the first direction.

A plurality of suction holes are formed in a portion of the mask unit sheet portion having the mask unit region at a predetermined distance from the corner portion.

The table portion may further include a lower support unit that generates a suction pressure on a lower portion of the frame.

The lower support unit is formed with at least one vacuum flow path, and the vacuum flow path can transmit the suction pressure generated from an external suction pressure generating device to the suction hole.

A mask pattern is formed on the mask, and the mask may be adhered to the template through a temporary adhesive portion.
Invention effect

According to the present invention configured as described above, the mask and the frame can form an integrated structure.

In addition, according to the present invention, it is possible to prevent deformation of the mask from sagging or twisting, and to make alignment accurate.

In addition, according to the present invention, the manufacturing time can be significantly shortened, and the yield can be significantly improved.

In addition, according to the present invention, it is possible to stably support and move without deforming the mask.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The detailed description of the present invention described later will be described with reference to the accompanying drawings, which show specific embodiments capable of implementing the invention as examples. These embodiments are described in sufficient detail to enable those skilled in the art to implement the invention. It should be understood that although various embodiments of the present invention are different from each other, they are not necessarily mutually exclusive. For example, the specific shapes, structures, and characteristics described herein are related to one embodiment, and can be implemented in other embodiments without departing from the spirit and scope of the invention. In addition, it should be understood that the position or arrangement of individual constituent elements in each disclosed embodiment can be changed without departing from the spirit and scope of the present invention. Therefore, the detailed description described below should not be regarded as limiting. As long as it is properly described, the scope of the present invention is limited only by the scope of the attached patent application and all equivalent scopes thereof. Similar reference numerals in the figure represent the same or similar functions from various aspects. For convenience, the length, area, thickness, and shape can be exaggerated.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings, so that those skilled in the art can easily implement the present invention.

FIG. 1 and FIG. 2 are schematic diagrams of a process of bonding a conventional mask 1 to a frame 2. FIG. 3 is a schematic diagram of an alignment error between the cells C1 to C3 during the process of stretching the conventional mask 1 by F1 to F2.

Referring to FIG. 1, the existing mask 1 may be manufactured in a stick-type or a plate-type. The mask 1 shown in FIG. 1 is used as a stripe mask, and both sides of the stripe can be welded and fixed to the OLED pixel deposition frame 2 and used.

The main body (body or mask film 1a) of the mask 1 includes a plurality of display units C. One unit C corresponds to one display such as a smartphone. A pixel pattern P is formed in the unit C so as to correspond to each pixel of the display. When the unit C is enlarged, a plurality of pixel patterns P corresponding to R, G, and B are displayed. As an example, a pixel pattern P is formed in the cell C so as to have a resolution of 70 × 140. That is, a large number of pixel patterns P are formed to form a unit C, and a plurality of units C may be formed on the mask 1. In the following, a strip mask 1 having six cells C (C1 to C6) will be described by way of example.

Referring to FIG. 1 (a), FIG. 2 (a), and FIG. 2 (b), first, the strip mask 1 should be unfolded flat. A pair of opposing grippers 3 which are spaced apart from each other between the frame 2 are clamped on both sides of the mask 1 and stretched by applying tensile forces F1 to F2 along the major axis direction of the mask 1, The mask 1 is unfolded flat. Then, the rail 4 is moved along the y-axis occupying the outside of the frame 2, and the holder 3 is moved to a position corresponding to the frame 2. The size of the frame 2 may be sufficient to allow the cells C1 to C6 of the stripe mask 1 to be located in a blank area inside the frame, and the size of the frame 2 may be sufficient to allow the cells C1 to C6 of the plurality of stripe masks 1 to be located in a blank area inside the frame.

Next, referring to FIG. 2 (c), the mask 1 is mounted on the frame 2 in a rectangular shape while the pair of holders 3 are lowered along the Z-axis moving rail 5 to stretch the mask 1. The cells C1 to C6 of the mask 1 will be located in a blank area inside the frame of the frame 2. The size of the frame 2 may be sufficient to allow cells C1 to C6 of one mask 1 to be located in a blank area inside the frame, and the size of the frame 2 may be sufficient to allow cells C1 to C6 of multiple masks 1 to be located in a blank area inside the frame.

Next, referring to FIGS. 1 (b) and 2 (d), after finely adjusting and aligning the tensile forces F1 to F2 applied to each side of the mask 1, the W mask 1 is welded with a laser L or the like. A part of the side surface connects the mask 1 and the frame 2 to each other. Then, the holder 3 releases the holding of the mask 1. (C) of FIG. 1 is a side section showing the mask 1 and the frame 2 connected to each other.

Referring to FIG. 3, although the tensile forces F1 to F2 applied to the sides of the stripe mask 1 are fine-tuned, the problem that the mask units C1 to C3 are not aligned with each other is shown. For example, the distances D1 to D1 ″, D2 to D2 ″ between the patterns P of the cells C1 to C3 are different from each other, or the patterns P are skewed. Since the stripe mask 1 has a large area including a plurality of (for example, six) cells C1 to C6 and has a very thin thickness of several tens of μm, it is easy to sag or twist due to a load. In addition, it is very difficult to adjust the tensile forces F1 to F2 so that all the units C1 to C6 become flat, and at the same time to confirm the alignment state between the units C1 to C6 through the microscope in real time.

Therefore, a slight error in the tensile forces F1 to F2 may cause an error in the stretching or unfolding degree of each unit C1 to C3 of the strip mask 1, thereby causing the distance D1 to D1 between the mask patterns P, D2 ~ D2 '' are different. Although it is very difficult to perfectly align so that the error is zero, in order to avoid the mask pattern P having a size of several μm to several tens μm from adversely affecting the pixel process of the ultra-high-definition OLED, it is preferable that the alignment error is not greater than 3 μm. The alignment error between such adjacent units is referred to as pixel position accuracy (PPA).

In addition, approximately 6-20 stripe masks 1 are connected to a frame 2 respectively, and alignment between a plurality of stripe masks 1 and a plurality of cells C-C6 of the stripe mask 1 are simultaneously performed. Precise state is a very difficult task and can only increase the process time based on alignment, which is an important reason for reducing productivity.

On the other hand, after the stripe mask 1 is connected and fixed to the frame 2, tensile forces F1 to F2 applied to the stripe mask 1 can be reversely applied to the frame 2. That is, after the strip mask 1 stretched and stretched due to the tensile forces F1 to F2 is connected to the frame 2, a tension can be applied to the frame 2. Generally, this tension is not large and does not have a large effect on the frame 2. However, when the size of the frame 2 is reduced in size and the strength becomes low, the tension may slightly deform the frame 2. As such, a problem may occur in which the alignment state between the plurality of cells C to C6 is destroyed.

In view of this, the present invention proposes a frame 200 and a frame-integrated mask capable of forming the mask 100 and the frame 200 into an integrated structure. The mask 100 integrated with the frame 200 can prevent deformation such as sagging or distortion, and can be accurately aligned with the frame 200. When the mask 100 is connected to the frame 200, no tensile force is applied to the mask 100. Therefore, after the mask 100 is connected to the frame 200, the mask 200 may not be subjected to a tension that causes deformation. Also, it is possible to significantly shorten the manufacturing time of integrally connecting the mask 100 to the frame 200 and significantly improve the yield.

4 is a front view ((a) of FIG. 4) and a side cross-sectional view ((b) of FIG. 4) of a frame-integrated mask according to an embodiment of the present invention; and FIG. 5 is a view of an embodiment of the present invention. A front view ((a) of FIG. 5) and a side cross-sectional view (b) of the frame.

4 and 5, the frame-integrated mask may include a plurality of masks 100 and a frame 200. In other words, the plurality of masks 100 are each adhered to the frame 200. In the following, for convenience of explanation, a quadrangular mask 100 is used as an example for explanation. Before the mask 100 is adhered to the frame 200, the mask 100 may have a stripe mask shape with protrusions on both sides for clamping. After the frame 200, the protruding portion can be removed.

Each mask 100 is formed with a plurality of mask patterns P, and one mask 100 may be formed with one cell C. One mask unit C may correspond to one display of a smartphone or the like.

The mask 100 may be an invar having a thermal expansion coefficient of about 1.0 × 10 ⁻⁶ / ° C. or a super invar material of about 1.0 × 10 ⁻⁷ / ° C. Since the thermal expansion coefficient of the mask 100 made of this material is very low, the possibility of deformation of the pattern shape of the mask due to thermal energy is small, and it can be used as an FMM and a shadow mask in manufacturing a high-resolution OLED. In addition, in consideration of a recently developed technology for performing a pixel deposition process in a range where a temperature change value is not large, the mask 100 may also be a material having a slightly larger thermal expansion coefficient than nickel (Ni), nickel-cobalt (Ni-Co), or the like. . The mask 100 may use a metal sheet produced by a rolling process or electroforming.

The frame 200 may be formed by bonding a plurality of masks 100. Including the outermost edge, the frame 200 may include a plurality of corners formed in a first direction (for example, a lateral direction) and a second direction (for example, a vertical direction). Such a plurality of corners may divide an area of the mask 200 to be bonded on the frame 200.

The frame 200 may include an edge frame portion 210 having a substantially rectangular shape and a rectangular frame shape. The inside of the edge frame portion 210 may be a hollow shape. That is, the edge frame portion 210 may include a hollow region R. The frame 200 may be formed of a metallic material such as Invar, Super Invar, Aluminum, Titanium. In consideration of thermal deformation, it is preferably made of Invar, Super Invar, Nickel, Nickel-Cobalt having the same thermal expansion coefficient as the mask And other materials, and these materials can be applied to all the edge frame portions 210 and the mask unit sheet portion 220 which are the constituent elements of the frame 200.

In addition, the frame 200 is provided with a plurality of mask unit regions CR, and may include a mask unit sheet portion 220 connected to the edge frame portion 210. The mask unit sheet portion 220 may be formed by rolling in the same manner as the mask 100, or may be formed by another film forming process such as electroforming. In addition, the mask unit sheet portion 220 may be connected to the edge frame portion 210 after a plurality of mask unit regions CR are formed on a planar sheet by laser scribing, etching, or the like. Alternatively, the mask unit sheet portion 220 may connect a planar sheet to the edge frame portion 210 and then form a plurality of mask unit regions CR by laser scribing, etching, or the like. In this specification, a case where a plurality of mask unit regions CR are first formed in the mask unit sheet portion 220 and then connected to the edge frame portion 210 will be described.

The mask unit sheet portion 220 may include an edge sheet portion 221 and at least one of a first grid sheet portion 223 and a second grid sheet portion 225. The edge sheet portion 221, the first grid sheet portion 223, and the second grid sheet portion 225 refer to respective portions divided on the same sheet, and they are formed as one body with each other.

The edge sheet portion 221 may be substantially connected to the edge frame portion 210. Therefore, the edge sheet portion 221 may have a substantially quadrangular shape or a square shape corresponding to the edge frame portion 210.

In addition, the first grid sheet portion 223 may be formed to extend in a first direction (lateral direction). The first grid sheet portion 223 is formed in a linear form, and both ends thereof may be connected to the edge sheet portion 221. When the mask unit sheet portion 220 includes a plurality of first grid sheet portions 223, each of the first grid sheet portions 223 preferably has the same pitch.

In addition, further, the second grid sheet portion 225 may be formed to extend along the second direction (vertical), the second grid sheet portion 225 is formed in a linear form, and both ends thereof may be connected to the edge sheet portion 221 . The first grid sheet portion 223 and the second grid sheet portion 225 may cross each other perpendicularly. When the mask unit sheet portion 220 includes a plurality of second grid sheet portions 225, each of the second grid sheet portions 225 preferably has the same pitch.

On the other hand, the pitch between the first grid sheet portion 223 and the pitch between the second grid sheet portion 225 may be the same or different depending on the size of the mask unit C.

Although the first grid sheet portion 223 and the second grid sheet portion 225 have a thin thickness in the form of a film, the shape of a cross section perpendicular to the length direction may be a rectangular shape, a quadrangular shape, a parallelogram, a triangular shape, or the like. A part of the sides and corners can form a circle. The cross-sectional shape can be adjusted during laser scribing and etching.

The thickness of the edge frame portion 210 may be larger than the thickness of the mask unit sheet portion 220. Since the edge frame portion 210 is responsible for the overall rigidity of the frame 200, it can be formed in a thickness of several mm to several tens of cm.

The mask unit sheet portion 220 is actually difficult to manufacture a thick sheet, and if it is too thick, the organic matter source 600 (see FIG. 20) may block the path through the mask 100 during the OLED pixel deposition process. Conversely, if it is too thin, it may be difficult to ensure rigidity sufficient to support the mask 100. Accordingly, the mask unit sheet portion 220 is preferably thinner than the edge frame portion 210 but thicker than the mask 100. The thickness of the mask unit sheet portion 220 may be about 0.1 mm to 1 mm. In addition, the width of the first grid sheet portion 223 and the second grid sheet portion 225 may be about 1 to 5 mm.

In the planar sheet, in addition to the area occupied by the edge sheet portion 221, the first grid sheet portion 223, and the second grid sheet portion 225, a plurality of mask unit regions CR (CR11 to CR56) can be provided. . From another perspective, the mask unit region CR may refer to the hollow region R of the edge frame portion 210, except for the edge sheet portion 221, the first grid sheet portion 223, and the second grid sheet portion 225. A blank area outside the occupied area.

As the cell C of the mask 100 corresponds to the mask cell region CR, it can actually be used as a channel for depositing pixels of the OLED through the mask pattern P. As described above, one mask unit C corresponds to one display such as a smartphone. A mask 100 may be formed with a mask pattern P for forming a unit C. Alternatively, a mask 100 includes multiple cells C and each cell C can correspond to each cell region CR of the frame 200. However, in order to accurately align the mask 100, a large area mask 100 needs to be avoided. Small area mask 100. Alternatively, one mask 100 having a plurality of cells C may correspond to one cell region CR of the mask 200. At this time, in order to accurately align, it is considered that the mask 100 having 2-3 cells C corresponds to one cell region CR of the mask 200.

The mask 200 includes a plurality of mask unit regions CR, and each mask 100 may be bonded so that each mask unit C and each mask unit region CR correspond to each other. Each mask 100 may include a mask unit C in which a plurality of mask patterns P are formed, and a dummy portion (corresponding to a portion of the mask film 110 other than the unit C) around the mask unit C. The dummy portion may include only the mask film 110 or may include the mask film 110 formed with a predetermined dummy pattern similar to the mask pattern P. The mask unit C corresponds to the mask unit region CR of the frame 200, and a part or all of the dummy portion may be adhered to the frame 200 (the mask unit sheet portion 220). Thereby, the mask 100 and the frame 200 may form an integrated structure.

On the other hand, according to another embodiment, the frame is not manufactured in such a manner that the mask unit sheet portion 220 is adhered to the edge frame portion 210, but may be directly formed with the edge frame using the hollow region R portion of the edge frame portion 210. The portion 210 is a frame of an integrated grid frame (corresponding to the grid sheet portions 223 and 225). The frame in this form also includes at least one mask unit region CR, and the mask 100 can correspond to the mask unit region CR to manufacture a frame-integrated mask.

Hereinafter, a manufacturing process of the frame-integrated mask will be described.

First, the frame 200 described in FIGS. 4 and 5 may be provided. FIG. 6 is a schematic diagram of a manufacturing process of a frame 200 according to an embodiment of the present invention.

Referring to (a) of FIG. 6, an edge frame portion 210 is provided. The edge frame portion 210 may have a square shape including a hollow region R.

Next, referring to FIG. 6 (b), a mask unit sheet portion 220 is manufactured. The mask unit sheet portion 220 can be manufactured by using a rolling, electroforming, or other film forming process to manufacture a planar sheet, and then removing the CR portion of the mask unit region by laser scribing, etching, or the like. In this specification, a description is given by taking the formation of a 6 × 5 mask cell region CR (CR11 to CR56) as an example. There may be five first grid sheet portions 223 and four second grid sheet portions 225.

Then, the mask unit sheet portion 220 may correspond to the edge frame portion 210. In the corresponding process, the edge sheet portion 221 and the edge frame portion 210 may be stretched in a state where all the side portions of the F1 to F4 mask unit sheet portion 220 are stretched so that the mask unit sheet portion 220 is flat and stretched. correspond. The mask unit sheet portion 220 can also be stretched by sandwiching the mask unit sheet portion 220 at a plurality of points (as an example of (b) of FIG. 6, 1 to 3 points) on one side. On the other hand, the F1 and F2 mask unit sheet portions 220 may be stretched not in all the side portions but in a part of the side direction.

Then, when the mask unit sheet portion 220 is made to correspond to the edge frame portion 210, the edge sheet portion 221 of the mask unit sheet portion 220 may be bonded by welding. Preferably, all side portions are welded so that the mask unit sheet portion 220 is firmly adhered to the edge frame portion 210. Welding should be performed as close to the corner side of the frame portion 210 as possible to minimize the warped space between the edge frame portion 210 and the mask unit sheet portion 220 and improve adhesion. The welding W portion can be generated in a line or spot shape, has the same material as the mask unit sheet portion 220, and can be formed by connecting the edge frame portion 210 and the mask unit sheet portion 220 into one body. medium.

FIG. 7 is a schematic diagram of a manufacturing process of a frame according to another embodiment of the present invention. The embodiment of FIG. 6 first manufactures a mask unit sheet portion 220 having a mask unit region CR and then adheres it to the edge frame portion 210, while the embodiment of FIG. 7 adheres a planar sheet to the edge frame portion 210. A mask unit region CR portion is formed.

First, the edge frame portion 210 including the hollow region R is provided in the same manner as in (a) of FIG. 6.

Then, referring to (a) of FIG. 7, a planar sheet (planar mask unit sheet portion 220 ′) can be made to correspond to the edge frame portion 210. The mask unit sheet portion 220 'is a planar state in which the mask unit region CR has not been formed. In the corresponding process, all the side portions of the F1 to F4 mask unit sheet portion 220 'may be stretched to make the mask unit sheet portion 220' flat and stretched so as to correspond to the edge frame portion 210. The unit sheet portion 220 'can also be stretched by sandwiching the unit sheet portion 220' at a plurality of points (as an example in Fig. 7 (a), 1 to 3 points). On the other hand, the F1 and F2 mask unit sheet portions 220 'may be stretched not in all the side portions but in a part of the side direction.

Then, when the mask unit sheet portion 220 'is made to correspond to the edge frame portion 210, the edge portion of the mask unit sheet portion 220' can be adhered by welding. Preferably, all side portions are welded so that the mask unit sheet portion 220 'is firmly adhered to the edge frame portion 220. Welding should be performed as close to the corner side of the edge frame portion 210 as possible to minimize the warped space between the edge frame portion 210 and the mask unit sheet portion 220 'and improve adhesion. The welding W portion may be generated in a line or spot shape, and has the same material as the mask unit sheet portion 220 ′, and may be a unitary connection between the edge frame portion 210 and the mask unit sheet portion 220 ′. Media.

Then, referring to FIG. 7 (b), a mask unit region CR is formed on a planar sheet (planar mask unit sheet portion 220 '). The mask unit region CR can be formed by removing a sheet of the CR unit region CR by laser scribing, etching, or the like. In this specification, a description is given by taking the formation of a 6 × 5 mask cell region CR (CR11 to CR56) as an example. When the mask unit region CR is formed, a mask unit sheet portion 220 may be configured, in which a portion welded to the edge frame portion 210 becomes the edge sheet portion 221 and includes five first grid sheet portions 223 and Four second grid sheet portions 225.

8 and 9 are a schematic plan view and a front view of a manufacturing apparatus 10 for a frame-integrated mask according to an embodiment of the present invention. FIG. 10 is a partially enlarged schematic view of a manufacturing apparatus 10 for a frame-integrated mask according to an embodiment of the present invention. 8 to 10, the frame 200 has a 2 × 5 mask unit region CR (CR11 to CR52).

8 to 10, the frame-integrated mask device 10 includes a table 15, a table portion 20, a clamping portion 30, a clamping moving portion 40, a head portion 60, a head moving portion 70, a vibration isolator 80, and the like.

First, a table 15 called a gantry is provided on a structure, and the structure is firmly installed on the ground, thereby preventing external vibration or impact. In order to perform a more reliable process, the upper surface of the table 15 needs to be precisely leveled.

The table 15 is provided with a table portion 20 for mounting and supporting the frame 200. The stage portion 20 may include a loading portion 21, a frame alignment unit 23, and a frame support unit 25. In addition, it may further include a heating unit (not shown) and a backlight unit (not shown).

The loading section 21 may correspond to the main body of the table section 20 and may have a wide plate shape, so that an area for loading the frame 200 can be provided. The table 15 may further include a table moving portion 27, and the table moving portion 27 may move the table portion 20 (or the loading portion 21) in at least one of the X, Y, Z, and θ directions. The θ-axis direction may refer to an angle of rotation on the XY plane, the YZ plane, and the XZ plane. 8 and 9 show that the stage moving section 27 has a track shape so that the loading section 21 can be moved in the Y-axis direction. However, the present invention is not limited to this, and known moving / rotating devices such as a rail shape, a belt shape, a hinge shape, a motor, and a gear may be used so as to be able to move / rotate in different directions.

The frame alignment unit 23 may be disposed on each side and corner of the frame support portion 25 or the frame 200 to align the position of the frame 200.

The frame support unit 25 may have a frame shape similar to the frame 200 so that the frame 200 can be mounted and supported, and may be disposed on the loading portion 21 or the frame alignment portion 23. The frame supporting unit 25 can prevent the edge frame portion 210 and the mask unit sheet portion 220 from being deformed by tension during the process of adhering the mask 100 to the frame 200. The frame supporting unit 25 may be configured to abut against the frame 200 from a lower portion of the frame 200. The upper surface of the frame supporting unit 25 may be formed with a plurality of grooves that are inserted into the edge frame portion 210 and the grid frame portion 220 in a close fit manner, and the mounting frame 200 may be inserted into the grooves. Therefore, the frame 200 can be prevented from being deformed even in a state where tension is applied due to the mask being stuck to the frame 200. The frame support unit 25 may have a structure integrally formed with a lower support unit 90 described later in FIG. 17.

Thereafter, when the mask 100 is adhered to the adjacent unit C, the adjacent masks 100 apply opposite forces to the frame 200 disposed therebetween. As a result, the tension applied to the frame 200 can be applied. offset. Until such a tension is canceled, that is, when only one mask 100 is adhered, the frame 200 can be prevented from being deformed in the mask 100 adhesion process as the frame support unit 25 is mounted and stored.

In the step of bonding the mask 100 to the frame 200, a heating unit (not shown) can control a process temperature or heat the frame.

As the backlight unit (not shown) emits light in a vertical upper (Z-axis) direction, the camera unit 65 of the head 60 can help confirm the alignment pattern of the mask pattern P. The light emitting toward the vertical upper direction can be a transmissive type that emits light directly, and a reflection type that emits light toward the upper direction after reflecting light emitted toward the vertical lower direction.

The clamping unit 30 includes a clamping unit 31, a clamping moving unit 35, and a connection unit 37. The clamping portion 30 can clamp the template 50, and the template 50 is adhered to and supports the mask 100. At this time, the clamping may be performed by sucking at least a part of the upper surface of the template 50. Alternatively, the clamping may be performed by fixing a part of the template 50 within a range that does not affect the mask 100.

The gripping unit 31 can grip the upper surface of the template 50. The holding unit 31 is formed in a horizontal shape on the XY plane, and a plurality of suction units 32 are formed on a lower surface thereof.

The adsorption unit 32 may be separately connected to a lower portion of the clamping unit 31 or may be a portion formed in the form of an adsorption hole in the clamping unit 31. As suction pressure is applied to the upper surface of the template 50 by the suction unit 32, the template 50 may be suctioned onto the lower surface of the clamping unit 31. Although there is no limitation on the arrangement form of the adsorption unit 32, it is preferable not to overlap the region on the Z axis of the welding portion (the region where the laser welding is performed) of the mask 100 to prevent the laser light from entering the path.

The clamp moving unit 35 can move the clamp unit 31 in at least one of the X, Y, Z, and θ axes. In the present invention, the gripping and moving unit 40 replaces the movement of the gripping unit 31 in the X-axis and Y-axis directions. Therefore, it is assumed that the gripping and moving unit moves in the directions of the Z and θ axes, and this will be described. . The clamp moving unit 35 may use a known moving / rotating device that can move / rotate in different directions without limitation. On the other hand, an auxiliary unit 33 for connecting the clamping unit 31 and the clamping moving unit 35 may be further included.

The connection unit 37 may connect the clamp moving unit 35 to the clamp moving portion 40 (or the clamp support unit 43).

The clamp moving portion 40 can move the clamp portion 30 in at least one of the X, Y, Z, and θ axes. It should be understood that, in addition to the state in which the gripping portion 30 is fixed to the gripping moving portion 40, the gripping moving portion 40 moves along at least one of the X, Y, Z, and θ axes to move the gripping portion. The concept of 30 moving together may also include the concept of moving only the gripping part 30 in a state where the gripping moving part 40 is not moving. In the present invention, it is assumed that the gripping and moving portion 40 moves along the X and Y axis directions of the gripping portion 30 and the gripping and moving unit 35 or gripping support unit 43 moves along the Z and θ axis directions of the gripping portion 30 Move and explain this.

The clamp moving portion 40 may include a base unit 41, a clamp support unit 43, and a clamp rail unit 45.

The base unit 41 has a wide plate shape, and a space for arranging the clamping and supporting unit 43 may be provided in the upper portion. In addition, both side portions thereof are connected to the clamping rail unit 45 so as to be movable along the forming direction of the clamping rail unit 45.

The clamp support unit 43 is disposed on the base unit 41 so that the clamp portion 30 can be supported. The clamp support unit 43 is movable along the formation direction of the base rail unit 44 formed on the base unit 41.

The clamping rail unit 45 may be formed on both sides of the table portion 20 along the formation direction of the table portion 20 (or the loading portion 21), and the base unit 41 may be moved on the clamping rail unit 45.

According to an embodiment, the stage portion 20 is formed substantially along the X-axis direction, and a pair of clamping rail units 45 may be formed along the X-axis direction on a long side portion of the stage portion 20. In addition, the base unit 41 is formed to extend along the Y-axis direction, and its two ends are respectively connected to a pair of clamping rail units 45 so as to be movable along the X-axis direction. In addition, a base rail unit 44 is formed on the base unit 41 along the Y-axis direction, and the clamp support unit 43 is connected to the base rail unit 44 so as to be movable in the Y-axis direction.

The frame 200 may be disposed on the left portion of the table portion 20, and the clamping portion 30 and the clamping moving portion 40 may be disposed on the right portion. The base unit 41 and the stage portion 20 are spaced apart from each other on the Z axis. Therefore, even if the base unit 41 is moved to the area on the left side where the frame 200 is arranged by the clamp rail unit 45 in the X-axis direction, the frame 200 and the base unit 41 may not interfere with each other. Accordingly, the tray 50 held by the holding unit 30 supported on the base unit 41 can be made to correspond to the specific unit region CR on the frame 200.

The head 60 is disposed on the upper portion of the table portion 20 and the clamping portion 30. The head 60 is provided with a laser unit 61 (61a, 61b), a camera unit 65, a gap sensor, a failure analysis unit 67, and the like.

The laser unit 61 may generate a laser L for welding the mask and the frame 200. Alternatively, the laser unit 61 may generate a cutting laser that irradiates the mask 100 for laser trimming. A pair of laser units 61 (61a, 61b) are opposed to each other, and can be set to be able to adjust the positions on the X and Y axes. The spaced-apart distance may correspond to the distance between the left welding portion and the right welding portion of the mask 100. When the laser light L is irradiated in order to adhere the mask to the frame 200, it is not necessary to irradiate the laser light L to the left / right welding portion of the mask 100 separately, but the welding can be performed by irradiating the laser L at one time. As a result, both sides of the mask 100 are adhered to the frame 200 at the same time. Therefore, compared with the process of adhering one side each time, the process time can be shortened, and the mask 100 can be stably adhered to the frame 200 without being deformed. on.

The camera unit 65 can capture and sense the alignment state of the mask 100 and the mask pattern P. The gap sensor unit can measure the Z-axis shift, or the distance between the head 60 and the mask 100, the frame 200, and the like. The failure analysis unit can detect a failure state of the mask 100.

The head moving section 70 (71, 75) can move the head 60 in at least one of the X, Y, Z, and θ directions. In the present invention, it is assumed that the head moving section 70 moves the head 60 only along the X axis, and this will be described. The first head moving part 71 is connected to the upper part of the head 60 so as to receive moving power. The main structure of the head 60 is connected to the second head moving part 75 provided separately from the lower part of the first head moving part 71. It can be guided to move in the X-axis direction along the X-axis guide 76.

The vibration isolator 80 may be provided in order to prevent the table 15 from vibrating. When the mask 100 is adhered to the frame 200, the alignment error PPA of the mask pattern P is affected even in an environment where very little vibration occurs. Therefore, it is preferable that the vibration isolator 80 is provided with a passive isolator at the lower portion of the table 15 so that vibration can be prevented.

11 to 12 are schematic diagrams of a process of manufacturing a mask supporting template by bonding a mask metal film 110 to a template 50 and forming a mask 100 according to an embodiment of the present invention.

Referring to (a) of FIG. 11, a template 50 may be provided. The template 50 may be a medium that moves while the mask 100 is attached and supported on a surface. Preferably, one surface of the template 50 is flat so that the flat mask 100 can be supported and moved. The center portion 50 a may correspond to the mask unit C of the mask metal film 110, and the edge portion 50 b may correspond to a dummy portion of the mask metal film 110. The template 50 may have a large flat plate shape having an area larger than that of the mask metal film 110 so as to be able to support the entirety of the mask metal film 110.

Preferably, the template 50 is a transparent material in order to easily observe a vision or the like during the process of aligning the mask 100 with the frame 200 and adhering it. In addition, transparent materials can also transmit laser light. As the transparent material, glass, silica, heat-resistant glass, quartz, Al ₂ O ₃ , borosilicate glass, and zirconia can be used. ) And other materials. As an example, BOROFLOAT ^® 33 material having excellent heat resistance, chemical durability, mechanical strength, transparency, etc. can be used for the template 50 in borosilicate glass. In addition, the thermal expansion coefficient of BOROFLOAT ^® 33 is approximately 3.3, and the thermal expansion coefficient of the Invar alloy mask metal film 110 is small, so it is easy to control the mask metal film 110.

On the other hand, a surface of the template 50 that is in contact with the mask metal film 110 may be a mirror surface so that an air gap does not occur between an interface with the mask metal film 110 (or the mask 100). In view of this, the surface roughness Ra of one surface of the template 50 may be 100 nm or less. In order to realize the template 50 having a surface roughness Ra of 100 nm or less, a wafer may be used as the template 50. The surface roughness Ra of the wafer is about 10 nm, there are many products on the market, and the surface treatment process is widely known, so it can be used as a template 50. The surface roughness Ra of the template 50 is in the order of nm, so there are no voids or almost no gaps, and the weld seam WB is easily generated by laser welding, so that it does not affect the alignment error of the mask pattern P.

The template 50 may be formed with a laser passing hole 51 so that the laser light L irradiated from the upper portion of the template 50 reaches the welding portion (area to be welded) of the mask 100. The laser passing holes 51 can be formed in the template 50 so as to correspond to the position and number of the welded portions. Since the plurality of soldering portions are arranged at a predetermined pitch on the edge of the mask 100 or the dummy portion DM, the plurality of laser light passing holes 51 may be formed at a predetermined pitch in a corresponding manner. As an example, since the plurality of soldering portions 100 are arranged at a predetermined pitch on both sides (left / right) of the dummy portion DM on the mask 100, a plurality of lasers may be formed on both sides (left / right) of the template 50 at a predetermined pitch. Through the hole 51.

The laser light passing holes 51 do not necessarily correspond to the positions and numbers of the welded portions. For example, only a part of the laser light passing hole 51 may be irradiated with the laser light L to perform welding. In addition, when the mask 100 is aligned with the template 50, a part of the laser light passing hole 51 that does not correspond to the welded portion may be used instead of the alignment mark. If the material of the template 50 is transparent to the laser light L, the laser light passing hole 51 may not be formed.

A temporary adhesive portion 55 may be formed on one surface of the template 50. Until the mask 100 is adhered to the frame 200, the temporary adhesive portion 55 can temporarily adhere the mask 100 (or the mask metal film 110) to one surface of the template 50 so as to be supported on the template 50.

The temporary adhesive portion 55 may be an adhesive or an adhesive sheet that can be separated by heating, an adhesive or an adhesive sheet that can be separated by UV (ultraviolet) irradiation.

As an example, a liquid wax may be used as the temporary adhesive portion 55. The liquid wax can be the same as the wax used in the polishing step of the wafer or the like, and its type is not particularly limited. The liquid wax may contain substances such as acrylic resin, vinyl acetate, nylon, and various polymers, as well as solvents, as a resin component mainly used to control the adhesive force, impact resistance, and the like related to the holding force. As an example, the temporary adhesive portion 55 may use a nitrile rubber (ABR, Acrylonitrile butadiene rubber) as a resin component, and use SKYLIQUID ABR-4016 containing n-propanol as a solvent component. The liquid wax may be formed on the temporary adhesive portion 55 by a spin coating method.

As a liquid wax temporary bonding portion 55, the viscosity decreases at a temperature higher than 85 ° C to 100 ° C, and the viscosity increases at a temperature lower than 85 ° C, and can be partially solidified like a solid, so that the mask metal film can be 110 'and the template 50 are fixed and glued together.

The mask metal film 110 may be prepared before or after the template 50 is prepared.

As an example, the mask metal film 110 may be prepared in a rolling manner. The metal sheet manufactured by the rolling process may have a thickness of several tens to several hundreds of μm in the manufacturing process. For UHD level high resolution, a thin mask metal film 110 with a thickness of less than 20 μm should be used for fine patterning. For ultra high resolution above UHD, a thinner mask with a thickness of 10 μm should be used Metal film 110. However, since the thickness of the mask metal film 110 ′ manufactured by the rolling process is about 25 to 500 μm, it is necessary to make it thinner.

Therefore, a step of planarizing PS (see FIG. 11 (b)) on one surface of the mask metal film 110 ′ can be further performed. Here, the flattening PS means that while one surface (upper surface) of the mask metal film 110 ′ is mirror-finished, a part of the upper portion of the mask metal film 110 ′ is removed, thereby reducing the thickness. The planarization PS can be performed by a CMP (Chemical Mechanical Polishing) method, and a known CMP method can be used without limitation. In addition, the thickness of the mask metal film 110 ′ can be reduced by a chemical wet etching method or a dry etching method. In addition, a planarization step capable of reducing the thickness of the mask metal film 110 'can be used without limitation.

During the implementation of the planarization PS, the surface roughness R _{a of the} upper surface of the mask metal film 110 ′ can be controlled in the CMP process as an example. Preferably, specularization can be performed to further reduce the surface roughness. After Or, as another example, may be performed wet chemical etching or dry etching in the planarization process PS, a CMP process is to add other polishing step, to reduce the surface roughness R _a.

In this way, the thickness of the mask metal film 110 ′ can be reduced to about 50 μm or less. Therefore, preferably, the thickness of the mask metal film 110 is formed to be about 2 μm to 50 μm, and more preferably, the thickness may be formed to be about 5 μm to 20 μm. However, it is not necessarily limited to this.

As another embodiment, the mask metal film 110 may be prepared by an electroforming method.

The base material of the motherboard may be a conductive material so that electroforming can be performed. The motherboard can be used as a cathode body in electroforming.

As a conductive material, metal can generate metal oxides on the surface, impurities can flow during the metal manufacturing process, polycrystalline silicon substrates can have inclusions or grain boundaries, and conductive polymer substrates may contain impurities. It is high-strength, and may be weak in strength and acid resistance. Factors such as metal oxides, impurities, inclusions, grain boundaries, etc., which hinder the uniform formation of an electric field on the surface of a motherboard (or cathode body) are called "Defects". Due to a defect, a uniform electric field cannot be applied to the cathode of the material, which may cause a part of the plating film 110 (or the mask metal film 110) to be unevenly formed.

In the realization of ultra-high-definition pixels above UHD level, the unevenness of the coating film and the coating pattern (mask pattern P) may have a bad influence on the formation of pixels. For example, the current QHD picture quality is 500-600PPI (pixel per inch) and the pixel size is about 30-50μm. It has higher quality of 4K UHD and 8K UHD than ~ 860PPI, ~ 1600PPI Resolution. Mini-displays directly applied to VR devices, or micro-displays used after being inserted into VR devices, aim at high resolutions above 2000PPI, and the pixel size is about 5-10 μm. The pattern width of the FMM and the shadow mask applied thereto can be formed to a size of several μm to several tens of μm, preferably less than 30 μm. Therefore, a defect of a few μm size also occupies a large proportion in the pattern size of the mask. In addition, in order to remove defects of the cathode of the material, an additional process for removing metal oxides, impurities, and the like may be performed, and other defects such as etching of the cathode material may be caused in the process.

Therefore, the present invention can use a mother board (or cathode body) of a single crystal silicon material. In particular, a single crystal silicon material is preferred. The mother board of the single crystal silicon material can be doped at a high concentration of 10 ¹⁹ / cm ³ or more so as to have conductivity. Doping can be performed on the entire mother board or only on a partial surface of the mother board.

On the other hand, for single crystal materials, metals such as Ti, Cu, and Ag, semiconductors such as GaN, SiC, GaAs, GaP, AlN, InN, InP, Ge, carbon materials such as graphite and graphene, comprising a _{CH 3 NH 3 PbCl 3, CH} 3 NH 3 PbBr 3, CH 3 NH 3 PbI 3, SrTiO 3 perovskite-like (Transition of perovskite) crystal structure with a superconducting ceramics, single crystal superalloy aircraft parts Alloys, etc. Metal and carbon materials are usually conductive materials. The semiconductor material can be doped at a high concentration of 10 ¹⁹ / cm ³ or more so as to have conductivity. Other materials may be doped or formed with oxygen vacancy to form conductivity. Doping may be performed on the entire motherboard or only on a part of the surface of the motherboard.

Since the single crystal material has no defects, a uniform plating film 110 is generated due to the formation of a uniform electric field on the entire surface during electroforming. The frame-integrated masks 100 and 200 manufactured by uniform coating can further improve the picture quality level of the OLED pixels. In addition, since no additional steps for removing and eliminating defects are required, it is possible to reduce process costs and improve productivity.

A conductive substrate is used as a mother substrate (cathode body), an anode body (not shown) is disposed at a distance, and a plating film 110 (or a mask metal film 110) can be formed on the conductive substrate by electroforming. ).

Then, the plating film 110 can be separated from the conductive substrate.

On the other hand, before the plating film 110 is separated from the conductive substrate, heat treatment may be performed. In order to reduce the thermal expansion coefficient of the mask 100 and prevent thermal deformation of the mask 100 and the mask pattern P, heat treatment is performed before the plating film 110 (or the mother board, the cathode body) is separated from the conductive substrate. The heat treatment may be performed at a temperature of 300 ° C to 800 ° C.

Generally, the thermal expansion coefficient of an Invar sheet produced by electroforming is higher than that of an Invar sheet produced by rolling. Therefore, heat treatment of the Invar alloy sheet can reduce the thermal expansion coefficient. However, during the heat treatment, the Invar alloy sheet may be peeled and deformed. This is because in the state of being adhered to the conductive substrate, in addition to the upper surface of the conductive substrate, the plating film 110 is formed to the side surface and a portion to the lower surface, and even if heat treatment is performed, peeling, deformation, etc. do not occur. Heat treatment can be performed stably.

The thickness of the mask metal film 110 generated by the electroforming process can be thinner than that of the rolling process. Therefore, it is possible to omit the planarization PS step of reducing the thickness, but the etching characteristics may be different depending on the composition of the surface layer and the crystal structure / microstructure of the plating mask metal film 110 ′. Therefore, it is necessary to control the surface characteristics by planarizing the PS. ,thickness.

Then, referring to FIG. 11 (b), the metal film 110 ′ may be adhered to the template 50. After the liquid wax is heated to 85 ° C. or higher, the mask metal film 110 ′ is brought into contact with the template 50, and then the mask metal film 110 ′ and the template 50 are allowed to pass between the rollers so as to be bonded.

According to an embodiment, baking is performed at about 120 ° C. for 60 seconds at the template 50 to vaporize the solvent of the temporary bonding portion 55, and a mask metal film lamination step can be directly performed. The lamination may be performed by placing a mask metal film 110 ′ on a template 50 having a temporary adhesive portion 55 formed on a surface thereof, and passing the mask metal film 110 ′ between an upper roll at approximately 100 ° C. and a lower roll at approximately 0 ° C. As a result, the mask metal film 110 ′ can be in contact with the template 50 through the temporary adhesive portion 55.

FIG. 13 is an enlarged cross-sectional schematic view of a temporary adhesive portion 55 according to an embodiment of the present invention. As another example, a thermal release tape may be used as the temporary adhesive portion 55. The thermal release tape may include a core film 56 such as a PET film in the middle, thermally peelable adhesive layers (thermal release adhesives) 57a, 57b disposed on both surfaces of the core film 56, and adhesive layers 57a, 57b. The shape of the release film / release film 58a, 58b is arrange | positioned outside. The adhesive layers 57 a and 57 b disposed on both surfaces of the core film 56 may have different peeling temperatures from each other.

According to an embodiment, in a state where the release film / release film 58a, 58b is removed, the lower surface of the thermal release tape (second adhesive layer 57b) may be adhered to the template 50, and the upper surface of the thermal release tape (first adhesive layer) The layer 57a) is adhered to the mask metal film 110 '. The first adhesive layer 57a and the second adhesive layer 57b have different peeling temperatures from each other. Therefore, when the template 50 is separated from the mask 100 in FIG. 18 to be described later, heat is applied to thermally peel off the first adhesive layer 57a. 100 may be separated from the template 50 and the temporary bonding portion 55.

Next, referring to (b) of FIG. 11, one surface of the mask metal film 110 ′ may be planarized with PS. As described above, the thickness of the mask metal film 110 'made by the rolling process can be reduced (110'-> 110) by the planarization PS process. In addition, the mask metal film 110 produced by the electroforming process may be subjected to a planarization PS process in order to control the surface characteristics and thickness.

Thus, as shown in (c) of FIG. 11, as the thickness of the mask metal film 110 ′ is reduced (110 ′-> 110), the thickness of the mask metal film 110 may be formed to about 5 μm to 20 μm.

Then, referring to (d) of FIG. 12, a patterned insulating portion 25 may be formed on the mask metal film 110. The insulating portion 25 may be formed of a photoresist material by a printing method or the like.

Next, the mask metal film 110 can be etched. A method such as dry etching, wet etching, or the like may be used without limitation. As a result of the etching, a portion of the mask metal film 110 exposed from the hollow space 26 between the insulating portions 25 may be etched. The etched portion of the mask metal film 110 may constitute a mask pattern P, and a mask 100 in which a plurality of mask patterns P are formed is manufactured.

Then, referring to (e) of FIG. 12, the insulating portion 25 may be removed, thereby completing the manufacture of the template 50 for supporting the mask 100.

The mask 100 may include a mask unit C on which a plurality of mask patterns P are formed, and a dummy portion DM around the mask unit C. The dummy portion DM corresponds to a portion of the mask film 110 (mask metal film 110) other than the cell C, and may include only the mask film 110 or a mask formed with a predetermined dummy portion pattern similar in shape to the mask pattern P.模 膜 110。 The film 110. The dummy portion DM corresponds to an edge of the mask 100, and a part or all of the dummy portion DM may be adhered to the frame 200 (mask unit sheet portion 220).

The width of the mask pattern P may be less than 40 μm, and the thickness of the mask 100 may be about 5 to 20 μm. Since the frame 200 has a plurality of mask unit regions CR, it may include a plurality of masks 100 and the mask units C included in the plurality of masks correspond to the respective mask unit regions CR. In addition, a plurality of templates 50 for supporting each mask 100 may be provided.

FIG. 14 is a schematic diagram of a process in which a mask supporting template 50 according to an embodiment of the present invention is mounted on a frame 200.

Referring to FIG. 14, the template 50 may be transferred by the clamping portion 30. The suction unit 32 of the gripping portion 30 can suck the opposite surface of the surface of the template 50 to which the mask 100 is adhered and transfer it. The clamping portion 30 sucks and transfers the template 50, and the mask 100 is adhered and supported by the template 50 through the temporary bonding portion 55. Therefore, even when the template 50 is transferred on the frame 200, the adhesion state of the mask 100 and Alignment.

FIG. 15 is a schematic diagram of a state in which a template 50 according to an embodiment of the present invention is mounted on a frame 200 so that the mask 100 corresponds to a cell region CR (CR11 to CR52) of the frame 200. Hereinafter, the frame 200 has 2 × 5 mask unit regions CR (CR11 to CR52).

Next, referring to FIG. 15, the mask 100 may correspond to one mask unit region CR of the frame 200. By mounting the template 50 on the frame 200 (or the mask unit sheet portion 220), the mask 100 can be made to correspond to the mask unit region CR. While controlling the position of the gripping portion 30, whether or not the mask 100 corresponds to a mask unit area can be observed by the camera unit 65 of the head 60. Since the template 50 presses the mask 100, the mask 100 and the frame 200 can be in close contact.

On the other hand, a lower support unit 90 (see FIG. 17) may be further disposed below the frame 200. The lower support unit 90 may be a structure integrally formed with the frame support unit 26. The lower support unit 90 may have a size capable of entering into the hollow region of the frame edge portion 210 and may be a flat plate shape. In addition, a predetermined support groove (not shown) corresponding to the shape of the mask unit sheet portion 220 may be formed on the upper surface of the lower support unit 90. At this time, the edge sheet portion 221, the first grid sheet portion 223, and the second grid sheet portion 225 can be inserted into the support groove, and the mask unit sheet portion 220 can be better fixed.

The lower support unit 90 may press the opposite surface of the mask unit region CR contacted by the mask 100. That is, the lower support unit 90 supports the mask unit sheet portion 220 in the upper direction, so that the mask unit sheet portion 220 can be prevented from sagging in the lower direction during the bonding process of the mask 100. At the same time, the lower support unit 90 and the template 50 press the edges of the mask 100 and the frame 200 (or the mask unit sheet portion 220) in opposite directions, so that the alignment state of the mask 100 can be maintained and avoided. Scattered.

In this way, only by attaching the mask 100 to the template 50 and loading the template 50 on the frame 200, the process of making the mask 100 correspond to the mask unit region CR of the frame can be completed. The mask 100 applies any tensile force.

16 is a schematic diagram of a process of bonding a mask according to an embodiment of the present invention to a frame.

Then, the mask 100 is irradiated with laser light L, and the mask 100 can be adhered to the frame 200 by laser welding. A welding seam WB is generated at the welding portion of the mask to be laser-welded, and the welding seam WB and the mask 100 / frame 200 can be made of the same material and connected to the same. A pair of laser units 61 a and 61 b spaced apart from each other can simultaneously irradiate the laser light L to the left welding portion and the right welding portion of the mask 100 to perform welding.

FIG. 17 is a schematic diagram of a state where an adsorption force is applied to the mask 100 through the adsorption hole 229 according to an embodiment of the present invention.

On the other hand, according to another embodiment, a plurality of suction holes 229 may be formed near a corner of the frame 200 having the mask unit region CR. Specifically, the plurality of suction holes 229 may be formed in a portion of the mask unit sheet portion 220 spaced apart from its corner by a predetermined distance, and more specifically, may be formed in a predetermined distance away from the inner corner portion of the edge sheet portion 221. And a portion separated from a corner of the first grid sheet portion 223 and the second grid sheet portion 225 by a predetermined distance.

The shape, size, and the like of the plurality of adsorption holes 229 are not limited within the range in which the vacuum suction pressure can be applied. However, it is preferable that the positions of the plurality of suction holes 229 do not overlap with the welding portions (welding target regions) of the mask 100. When the welding portion overlaps with the suction hole 229, the mask 100 and the frame 200 (or the mask unit sheet portion 220) cannot be in close contact with each other, which may result in a failure to form a laser weld WB smoothly. Preferably, a plurality of suction holes 229 may be formed in a portion adjacent to the welding portion so that the welding portion portion of the mask 100 is more closely attached to the frame 200 (or the mask unit sheet portion 220).

As shown in FIG. 17, when the template 50 is mounted on the frame 200 (or the mask unit sheet portion 220), a part of the lower surface of the mask 100 is in contact with the upper portion of the frame 200 (or the mask unit sheet portion 220). The upper portion of the suction hole 229 formed in the frame 200 (or the mask unit sheet portion 220) corresponds to the lower surface of the mask 100. The suction force (suction pressure) application device corresponding to the lower portion of the suction hole 229 can pass through the suction hole. 229 applies a suction force VS (or suction pressure VS) to the mask 100 so that a part of the mask 100 corresponding to the suction hole 229 can be suctioned. Therefore, the mask 100 is more closely attached to the frame 200, and when laser welding is performed, the weld seam WB can be generated more stably.

An upper portion of the lower support unit 90 may be formed with an adsorption portion 95. Preferably, the suction part 95 is arranged so as to correspond to the position of the suction hole 229 formed in the frame 200 (or the mask unit sheet part 200). In other words, the suction part 95 can be arranged at a position on the lower support unit 90 where the suction force VS (or suction pressure VS) can be concentratedly applied to the suction hole 229. The suction unit 95 may use a known device capable of sucking a vacuum, and may be connected to an external suction pressure generating device. As an example, the vacuum flow path 96 is formed inside the lower support unit 90, the other end is connected to an external suction pressure generating device (not shown) such as a pump, and one end may be connected to the suction portion 95. A plurality of holes, cracks, and the like are formed on the upper surface of the suction part 95 connected to the vacuum flow path 96, and can be used as a passage for applying suction pressure. An external suction pressure generating device can be connected to each vacuum flow path 96 of the lower support unit 90, so that the suction pressure of each vacuum flow path 96 can be controlled individually, and the suction pressures of all the vacuum flow paths 96 can be controlled simultaneously.

The suction force VS (or suction pressure VS) is provided from the suction portion 95 of the lower support unit 90, and as the suction force VS is applied to the mask 100 through the suction hole 229, the mask 100 can be moved toward the suction portion 95 (lower side). Being absorbed. At this time, the interface between the mask 100 and the frame 200 (or the mask unit sheet portion 220) can be brought into close contact.

Since the adsorption part 95 strongly adsorbs the mask 100, there is no minute gap between the interface between the mask 100 and the frame 200. As a result, the mask 100 is in close contact with the frame 200 (in the enlarged view of FIG. 17, the first grid sheet portion 223). Therefore, the laser beam L can be irradiated to any portion of the welding portion. Can well generate welds WB. The welding seam WB connects the mask 100 and the frame 200 into one body, and finally, welding can be performed stably.

FIG. 18 is a schematic diagram of a process of separating the mask 100 and the template 50 after the mask 100 according to an embodiment of the present invention is adhered to the frame 200.

Referring to FIG. 18, after the mask 100 is adhered to the frame 200, the mask 100 and the template 50 can be debonded. The mask 100 and the template 50 can be separated by at least one of heating ET, chemically treating CM, applying ultrasonic waves US, and applying UV to the temporary adhesive portion 55. Since the mask 100 remains adhered to the frame 200, only the template 50 can be lifted. As an example, when the ET is heated to a temperature higher than 85 ° C. to 100 ° C., the viscosity of the temporary adhesive portion 55 decreases, and the adhesive force between the mask 100 and the template 50 is reduced, so that the mask 100 and the template 50 can be separated. As another example, the CM temporary adhesive portion 55 is immersed in a chemical substance such as IPA, acetone, or ethanol, so that the mask 100 and the template 50 can be separated by dissolving and removing the temporary adhesive portion 55. As another example, when ultrasonic wave US or UV is applied, the adhesive force between the mask 100 and the template 50 becomes weak, and the mask 100 and the template 50 can be separated.

More specifically, the temporary bonding portion 55 for bonding the mask 100 and the template 50 is a TBDB bonding material (temporary bonding & debonding adhesive), so various debonding methods can be used.

As an example, a solvent debonding (Solvent Debonding) method based on chemical treatment of CM can be used. As the temporary adhesive portion 55 is dissolved by the penetration of the solvent, debonding can be achieved. At this time, since the mask 100 is formed with the pattern P, the solvent can penetrate through the mask pattern P and the interface between the mask 100 and the template 50. Solvent debonding can be debonded at room temperature, and does not require other debonding equipment with complicated design, so it is relatively economical compared with other debonding methods.

As another example, a heat debonding method based on heated ET may be used. Decomposition of the temporary adhesive portion 55 is guided by high-temperature heat, and when the adhesive force between the mask 100 and the template 50 is reduced, it can be separated in the up-down direction or the left-right direction.

As another example, a peelable adhesive debonding method by heating ET, applying UV, or the like can be used. When the temporary adhesive portion 55 is a thermal release tape, the adhesive can be removed by a release adhesive debonding method, which does not require high-temperature heat treatment and expensive heat treatment equipment like the thermal debonding method, and the process is relatively simple.

As another example, a room temperature debonding method based on chemical treatment of CM, application of ultrasound US, application of UV, and the like can be used. When a non-sticky process is performed on a part (central portion) of the mask 100 or the template 50, the temporary adhesive portion 55 can be adhered to only the edge portion. In addition, at the time of debonding, the solvent penetrates to the edge portion, thereby debonding is achieved by dissolving the temporary bonding portion 55. The advantage of this method is that during the bonding and debonding, in the remaining part except the edge area of the mask 100 and the template 50, no direct loss occurs or no residue due to the adhesive material is caused during debonding. Defects occur, etc. In addition, unlike the thermal debonding method, a high-temperature heat treatment process is not required during debonding, so that the process cost can be saved relatively.

FIG. 19 is a schematic view of a state in which a mask 100 according to an embodiment of the present invention is adhered to a frame 200.

Referring to FIG. 19, a mask 100 may be adhered to a unit region CR.

Since the mask unit sheet portion 220 of the frame 200 has a thin thickness, when a tensile force is applied to the mask 100, the tensile force remaining in the mask 100 acts when the mask unit sheet portion 220 is adhered to the mask unit sheet portion 220. The mask unit sheet portion 220 and the mask unit region CR may deform them. Therefore, the mask 100 should be adhered to the mask unit sheet portion 220 without applying a tensile force to the mask 100. The present invention attaches the mask 100 to the template 50, and only needs to load the template 50 on the frame 200 to complete the process of making the mask 100 correspond to the mask unit region CR of the frame 200. Therefore, in this process It is not necessary to apply any tensile force to the mask 100. Thereby, it is possible to prevent the frame 200 (or the mask unit sheet portion 220) from being deformed due to the tensile force applied to the mask 100 acting as a tension on the frame 200 in the reverse direction.

The existing mask 10 of FIG. 1 includes 6 cells C1 to C6, and thus has a longer length, and the mask 100 of the present invention includes one cell C, and therefore has a shorter length, so that the degree of PPA distortion can be reduced. . Assuming that the length of the mask 10 including a plurality of cells C1 to C6,... Is 1 m, and a PPA error of 10 μm occurs in the total length of 1 m, the mask 100 of the present invention can decrease with the relative length (equivalent As the number of cells C decreases), the above error range becomes 1 / n. For example, if the length of the mask 100 of the present invention is 100 mm, it has a length reduced from 1 m to 1/10 of the existing mask 10, so a PPA error of 1 μm occurs in the total length of 100 mm, which significantly reduces the alignment error.

On the other hand, if the mask 100 is provided with a plurality of cells C, and the alignment error is minimized even if each cell C corresponds to each cell region CR of the frame 200, the mask 100 may be aligned with the frame 200. The plurality of mask cell regions CR correspond. Alternatively, the mask 100 having a plurality of cells C may correspond to one mask cell region CR. In this case, also in consideration of the process time and productivity based on the alignment, the mask 100 preferably has as few cells C as possible.

In the present invention, since it is only necessary to make one cell C of the mask 100 correspond to and confirm the alignment state, the conventional method of corresponding to a plurality of cells C (C1 to C6) at the same time and to confirm all the alignment states is required (See Fig. 1) Compared with this, the manufacturing time can be significantly shortened.

That is, the manufacturing method of the frame-integrated mask of the present invention can significantly reduce the time compared with the conventional method. This conventional method requires that each of the cells C11 to C16 included in the six masks 100 and each of the cell regions CR11 to CR11 ~ CR16 corresponds to and confirms the 6 processes of each alignment state, and simultaneously makes 6 cells C1 ~ C6 correspond, and simultaneously confirms the alignment states of 6 cells C1 ~ C6.

In addition, in the method for manufacturing a frame-integrated mask of the present invention, the yield of the product during the 30 times corresponding to and aligning 30 masks 100 with 30 cell regions CR (CR11 to CR56) can be obtained. It is significantly higher than the yield of the existing product during the 5 times that the five masks 10 (refer to (a) in FIG. 1) including the six cells C1 to C6 correspond to the frame and are aligned. Because the existing method of aligning the six cells C1 to C6 to the area corresponding to the six cells C each time is a significantly tedious and difficult operation, the product yield is low.

On the other hand, as described in step (b) of FIG. 11, when the mask metal film 110 is adhered to the template 50 through a lamination process, a temperature of about 100 ° C. may be applied to the mask metal film 110. This allows the mask metal film 110 to be adhered to the template 50 in a state where a part of the tensile force is applied to the mask metal film 110. After that, when the mask 100 is adhered to the frame 200 and the template is separated from the mask 100, the mask 100 may be contracted by a predetermined amount.

After each mask 100 is adhered to the corresponding mask unit region CR, when the template 50 and the mask 100 are separated, the plurality of masks 100 apply a contracting tension in the opposite direction, so the force is cancelled out in the mask unit sheet. The material portion 220 is not deformed. For example, in the first grid sheet portion 223 between the mask 100 attached to the CR11 unit area and the mask 100 attached to the CR12 unit area, the first grid sheet portion 223 acts toward the right side of the mask 100 attached to the CR11 unit area. The tension TS and the tension acting in the left direction of the mask 100 attached to the CR12 unit region can cancel each other. This minimizes the deformation of the frame 200 (or the mask unit sheet portion 220) by the tension TS, and can minimize the alignment error of the mask 100 (or the mask pattern P).

FIG. 20 is a schematic diagram of an OLED pixel deposition apparatus 1000 using frame-integrated masks 100 and 200 according to an embodiment of the present invention.

Referring to FIG. 20, the OLED pixel deposition apparatus 1000 includes: a magnetic plate 300 that houses a magnet 310 and is arranged with cooling water pipes 350; a deposition source supply unit 500 that supplies an organic substance source 600 from a lower portion of the magnetic plate 300.

A target substrate 900 such as glass for depositing an organic material source 600 may be interposed between the magnetic plate 300 and the deposition source deposition portion 500. The target substrate 900 may be provided with a frame-integrated mask 100 or 200 (or FMM) in which the organic source 600 is deposited in different pixels in a close or very close manner. The magnet 310 can generate a magnetic field, and can be closely attached to the target substrate 900 through the magnetic field.

The deposition source supply unit 500 can go back and forth to the left and right paths to supply the organic material source 600, and the organic material source 600 supplied by the deposition source supply unit 500 can be deposited on a target substrate 900 through a pattern P formed on the frame-integrated masks 100 and 200. side. The organic matter source 600 deposited after passing through the pattern P of the frame-integrated masks 100 and 200 can be used as the pixel 700 of the OLED.

In order to prevent uneven deposition of the pixels 700 due to a shadow effect, the pattern of the frame-integrated masks 100 and 200 may be formed S (or formed in a cone S) obliquely. The organic matter source 600 passing the pattern in the diagonal direction along the inclined surface can also contribute to the formation of the pixels 700, and therefore, the pixels 700 can be uniformly deposited throughout the thickness.

As described above, the present invention has illustrated and described preferred embodiments, but is not limited to the above embodiments, and those skilled in the art can make various modifications and changes without departing from the spirit of the present invention. Such deformations and changes fall within the scope of the present invention and the appended patent applications.

1‧‧‧Mask

2‧‧‧ frame

3‧‧‧ Grip

4‧‧‧y-axis moving track

5‧‧‧Z axis moving track

10‧‧‧ Frame manufacturing mask manufacturing device

15‧‧‧Workbench

20‧‧‧ Taiwan

21‧‧‧Y-axis moving loading section

23‧‧‧Frame alignment unit

25‧‧‧Frame support; frame support unit

26‧‧‧Hollow Space

27‧‧‧ mobile units

30‧‧‧Clamping section

31‧‧‧Clamping unit

32‧‧‧ Adsorption unit

33‧‧‧ auxiliary unit

35‧‧‧ Holding mobile unit

37‧‧‧Connecting unit

40‧‧‧Clamping and moving part

41‧‧‧ base unit

43‧‧‧ clamping support unit

44‧‧‧ base track unit

45‧‧‧Clamp rail unit

50, 50a, 50b‧‧‧ template

51‧‧‧laser through hole

55‧‧‧Temporary Adhesive Section

56‧‧‧ core film

57a, 57b‧‧‧Adhesive layer

58a, 58b ‧‧‧ release film / release film

60‧‧‧Head

61, 61a, 61b‧‧‧‧laser unit

65‧‧‧ camera unit

67‧‧‧Bad analysis unit

70, 71, 75‧‧‧ head moving parts

76‧‧‧X-axis guide

80‧‧‧Isolator

90‧‧‧ lower support unit

95‧‧‧ Adsorption Department

96‧‧‧Vacuum flow path

100‧‧‧Mask

110‧‧‧mask film

110'‧‧‧Mask metal film

200‧‧‧ frame

210‧‧‧Edge Frame Department

220、220’‧‧‧‧Mask unit sheet section

221‧‧‧Edge Sheet Department

223‧‧‧First grid sheet department

225‧‧‧Second Grid Sheet Department

300‧‧‧ Magnetic plate

310‧‧‧Magnet

350‧‧‧ cooling water pipe

500‧‧‧Deposition source supply department

600‧‧‧ Organic Source

700‧‧‧ pixels

900‧‧‧ target substrate

1000‧‧‧OLED pixel deposition device

C, C1 ～ C6, C11 ～ C16‧‧‧ units, mask units

CR, CR11 ~ CR56 ‧‧‧ mask unit area

DM‧‧‧Virtual Department, Mask Virtual Department

F1 ~ F4‧‧‧Stretching force

L‧‧‧laser

P‧‧‧Mask pattern

R‧‧‧ hollow area

VS‧‧‧Adsorption

W‧‧‧welding

WB‧‧‧ Weld

1 and 2 are schematic diagrams of a process of bonding a conventional mask to a frame.

FIG. 3 is a schematic diagram of an alignment error occurring between cells during a conventional mask stretching process.

4 is a front view and a side cross-sectional view of a frame-integrated mask according to an embodiment of the present invention.

5 is a front view and a side sectional view of a frame according to an embodiment of the present invention.

6 is a schematic diagram of a manufacturing process of a frame according to an embodiment of the present invention.

FIG. 7 is a schematic diagram of a manufacturing process of a frame according to another embodiment of the present invention.

8 and 9 are a schematic plan view and a front view of a manufacturing apparatus of a frame-integrated mask according to an embodiment of the present invention.

10 is a partially enlarged schematic view of a manufacturing apparatus of a frame-integrated mask according to an embodiment of the present invention.

11 to 12 are schematic diagrams of a process of manufacturing a mask supporting template by bonding a mask metal film to a template and forming a mask according to an embodiment of the present invention.

FIG. 13 is an enlarged cross-sectional schematic view of a temporary adhesive portion according to an embodiment of the present invention.

14 is a schematic diagram of a process of loading a mask supporting template according to an embodiment of the present invention on a frame.

15 is a schematic diagram of a state in which a template according to an embodiment of the present invention is mounted on a frame so that a mask corresponds to a unit region of the frame.

16 is a schematic diagram of a process of bonding a mask according to an embodiment of the present invention to a frame.

FIG. 17 is a schematic diagram of a state where an adsorption force is applied to a mask through an adsorption hole according to an embodiment of the present invention.

18 is a schematic diagram of a process of separating a mask and a template after a mask according to an embodiment of the present invention is adhered to a frame.

FIG. 19 is a schematic view of a state where a mask according to an embodiment of the present invention is adhered to a frame.

20 is a schematic diagram of an OLED pixel deposition apparatus using a frame-integrated mask according to an embodiment of the present invention.

Claims (15)

A device for manufacturing a frame-integrated mask, comprising: Table section for mounting and supporting the frame; A clamping portion for clamping a template, and the template is adhered and supported with the mask; A clamping moving part, which moves the clamping part along at least one of the X, Y, Z, and θ axes; A head part, irradiating a laser to a welding part of the mask, and sensing an alignment state of the mask; and A head moving part that moves the head along at least one of the X, Y, and Z directions, The clamping portion is configured to clamp at least a part of an upper surface of the template. The apparatus for manufacturing a frame-integrated mask according to claim 1, wherein The table portion includes a frame alignment unit for aligning the position of the frame. The apparatus for manufacturing a frame-integrated mask according to claim 1, wherein The table portion includes a heating unit for heating the frame. The apparatus for manufacturing a frame-integrated mask according to claim 1, wherein The clamping portion includes: A clamping unit for clamping the template; A clamping moving unit that moves the clamping unit along at least one of the X, Y, Z, and θ axes; and A connection unit that connects the clamp moving unit to the clamp moving portion. The apparatus for manufacturing a frame-integrated mask according to claim 4, wherein The clamping unit is formed with a plurality of suction units spaced apart from each other, and the plurality of suction units are used to apply suction pressure to the template. The apparatus for manufacturing a frame-integrated mask according to claim 5, wherein A plurality of the adsorption units are arranged so as not to overlap the region on the Z axis of the soldered portion of the mask. The apparatus for manufacturing a frame-integrated mask according to claim 1, wherein The clamping and moving part includes: Base unit A clamping support unit configured on the base unit to support the clamping portion; and A clamping rail unit for moving the base unit, Wherein, the base unit moves in a region spaced apart from the table portion along the Z-axis direction, so that the clamping portion enters an upper portion of the table portion. The apparatus for manufacturing a frame-integrated mask according to claim 1, wherein The head includes a laser unit that irradiates the mask with laser light to weld the mask to the frame or irradiates laser light to the mask to perform laser trimming. The apparatus for manufacturing a frame-integrated mask according to claim 8, wherein A pair of said laser units are spaced apart from each other, Each of the laser units irradiates laser light to the welding portions on one side and the other side of the mask, respectively. The apparatus for manufacturing a frame-integrated mask according to claim 1, wherein The framework includes: An edge frame portion including a hollow region; The mask unit sheet portion includes a plurality of mask unit regions and is connected to the edge frame portion. The apparatus for manufacturing a frame-integrated mask according to claim 10, wherein The frame includes a plurality of the mask unit regions along at least one of a first direction and a second direction perpendicular to the first direction. The apparatus for manufacturing a frame-integrated mask according to claim 10, wherein A plurality of suction holes are formed in a portion of the mask unit sheet portion having the mask unit region at a predetermined distance from the corner portion. The apparatus for manufacturing a frame-integrated mask according to claim 12, wherein The table portion further includes a lower support unit that generates suction pressure on a lower portion of the frame. The apparatus for manufacturing a frame-integrated mask according to claim 13, wherein The lower support unit is formed with at least one vacuum flow path, and the vacuum flow path transmits the suction pressure generated from an external suction pressure generating unit to the suction hole. The apparatus for manufacturing a frame-integrated mask according to claim 1, wherein A mask pattern is formed on the mask, and the mask is adhered to the template through a temporary adhesive portion.