TW202000403A - Robot hand equipped with pad member - Google Patents

Abstract

The manipulator (100) for holding a substrate of the present invention is installed on a manipulator arm for transferring a substrate. The manipulator (100) includes: a hand body portion (110); and, a pad for holding a substrate The member (1) is installed in the opening (101) provided on the hand body part (110). The pad member (1) is installed in the opening part (101) of the manipulator (100), and includes: a pad body part (2) with a through hole (5) in the central part; a first ring part (31A), It is provided on the front end side of the pad member (1) to abut the substrate; and, the first flange part (32A), which is provided integrally with the first ring part (31A) and the pad body part (2), and faces The pad body portion (2) is extended outside.

Description

Manipulator with pad member

The present invention relates to a manipulator equipped with a pad member for holding a substrate.

Previously, in the field of semiconductor manufacturing, transfer robots were used to hold and transfer wafers. This transport robot has a hand connected to the front end of the arm. Use its top surface to hold the back of the wafer, and perform wafer delivery between the wafer cassettes that house the wafer. The hands of these transfer robots have a holding portion for holding wafers. Some of the holding parts are formed by directly cutting out the members constituting the hand, or some are formed by attaching a pad made of an elastic material such as natural rubber or synthetic rubber to the hand.

As an example of a pad used on the hand of such a robot arm, Patent Document 1 discloses a pad for suction including: a mounting portion that is connected to the front end of the robot arm through an opening; a basic portion that is continuous until mounting Part; and, the outer cover part, the base part of which is continuously provided as one body. The base part has an approximately circular cross section, and its outer periphery gradually expands in diameter and continues to the outer cover part. The outer cover part has a roughly circular cross section larger than the base part; from the start point of the outer cover part to the end point of the end point (hem), it gradually becomes thinner and integrally formed from the start point of the outer cover part toward the end point. A through hole is provided in the approximate center portion of the surface in contact with the workpiece on the inner bottom surface of the cover portion.

Patent Document 2 discloses a vacuum suction pad which is installed in a first mounting hole formed on a transfer arm of a substrate transfer device and is connected to a vacuum suction channel of the transfer arm to vacuum-absorb the substrate on the transfer arm on.

[Prior Technical Literature] (Patent Literature) Patent Document 1: Japanese New Patent No. 2586261 Patent Document 2: Japanese Patent No. 5379589

[Problems to be solved by the invention] However, in the case of holding and transporting the wafer by the robot using the pad described above, there are the following problems.

The suction pad of Patent Document 1 reduces the contact portion with the work by thickening the edge portion of the cover portion. However, in recent years, there has been a tendency for the contact area between the suction pad and the workpiece to become smaller and smaller, and it is sought to respond.

The vacuum suction pad of Patent Document 2 is installed in the mounting hole of the transfer arm via a sealing member to ensure airtightness by the sealing member. Therefore, it is necessary to exchange the sealing member when exchanging the vacuum adsorption pad, which makes the exchange operation of the vacuum adsorption pad complicated.

The present invention has been completed in view of the above-mentioned problems, and provides a manipulator that can be stably held when a wafer is carried and held on the manipulator, and can easily mount or remove a pad member, etc. Exchange job.

[Technical means to solve the problem] In order to achieve the above object, the manipulator of the present invention is installed on a manipulator arm for transferring a substrate and is used to hold the aforementioned substrate. The manipulator includes: Hand body; and, A pad member, which is installed in the opening portion which has been provided on the hand body portion, and is used to hold the aforementioned substrate; The aforementioned pad member includes: The pad body portion, which is installed in the aforementioned opening portion, and has a through hole in its central portion; A first ring portion, which is provided on the front end side of the pad member to abut the substrate; and, The first flange portion is provided integrally with the first ring portion and the pad body portion, and extends toward the outside of the pad body portion.

According to this configuration, it is possible to insert the pad mounting hole, that is, the opening of the hand body portion, while deforming it by crushing the pad, so the work of installing the pad in the opening and removing the pad from the opening becomes variable It's easy.

In addition, in the manipulator of the present invention, the pad member may further include: A second ring portion provided on the rear end side of the pad member and formed in the same shape as the first ring portion; and, The second flange part is provided integrally with the second ring part and the pad body part, and is seated on the hand body part.

According to this configuration, the first ring portion and the second ring portion have a symmetrical structure, so either of the first ring portion and the second ring portion can be used as the side in contact with the substrate. Further, it is possible to prevent erroneous setting when the pad is mounted on the robot, and it is possible to improve the ease of mounting the pad.

Furthermore, in the robot of the present invention, the pad member may further include a third flange portion, which is provided integrally with the pad body portion at the rear end side of the pad member and faces the pad body portion Set to extend outside.

According to this configuration, by providing the third flange portion, the pad can be easily attached to the opening of the manipulator.

Furthermore, in the manipulator of the present invention, the hand body portion may have a passage portion inside, one end portion of the passage portion communicates with the opening portion, and the other end portion is connected to the intake and exhaust unit.

According to this configuration, when there is no suction and the cycle time is insufficient, a suction and exhaust unit is additionally provided and vacuum suction (vacuuming) is performed through the vacuum suction path, whereby the substrate can be reliably held and Transfer.

In addition, in the robot of the present invention, the pad body portion may be a cylindrical member; The first flange portion has a tapered portion that expands in diameter from the first ring portion side toward the pad body portion side.

In addition, in the manipulator of the present invention, the second flange portion may have a tapered portion that expands in diameter from the second ring portion side toward the pad body portion side.

According to these configurations, the pad can be easily attached to the opening of the manipulator.

In addition, in the manipulator of the present invention, the pad member may be attached to the hand body portion by sandwiching the hand body portion between the first flange portion and the second flange portion.

According to this configuration, it is possible to prevent the pad from falling off from the manipulator.

In addition, in the manipulator of the present invention, the pad member may be attached to the hand body portion by sandwiching the hand body portion between the first flange portion and the third flange portion.

According to this configuration, it is possible to prevent the pad from falling off from the manipulator.

Furthermore, in the robot of the present invention, the pad member may be made of a conductive resin in which conductive particles are dispersed in the resin composition.

According to this configuration, it is possible to prevent the charging of the substrate, to prevent sparks from occurring on the substrate, and to suppress the adhesion of particles to the substrate.

Furthermore, in the manipulator of the present invention, the outer diameter of the first ring portion may be formed to be smaller than the outer diameter of the pad body portion.

According to this configuration, it is possible to reduce the contact area of the contact surface (first ring portion) between the substrate and the pad, and it is possible to suppress the adhesion of particles caused by the pad to the substrate to the substrate.

[Effect of invention] According to the present invention, it is possible to provide a manipulator which can be stably held when carrying and holding a wafer on the manipulator, and which can easily perform exchange work such as attachment or detachment of a pad member.

Hereinafter, the manipulator and the pad member related to this embodiment will be described with reference to the drawings. First, referring to FIGS. 1 to 4, the pad 1 (an example of a pad member) according to the embodiment will be described. The pad 1 is used, for example, as a component for holding a wafer (an example of a substrate), which is a material for manufacturing semiconductor elements. The pad 1 can be used, for example, by being attached to a hand (hereinafter, referred to as a robot) connected to the front end of an arm of a wafer transfer robot (an example of a robot arm), which is used to receive between equipment And deliver wafers. The detailed description of the manipulator is given later.

As shown in FIGS. 1 to 4, the pad 1 includes: a body portion (pad body portion) 2 provided at the central portion, and a height direction (vertical direction in FIG. 2) provided at the body portion 2 ) Holding part 3 at both ends. The holding portion 3 in this embodiment includes a first holding portion 3A provided at one end of the body portion 2 (for example, at the upper end of FIGS. 2 and 4), and provided at The second holding portion 3B of the end portion on the opposite side to the first holding portion 3A (for example, the lower end portion in FIGS. 2 and 4). The body portion 2 and the holding portions 3A and 3B are integrally formed.

The body 2 is a cylindrical member. The height of the body portion 2 is set to be approximately the same as the thickness of the hand body portion 110 (the height in the vertical direction in FIG. 6) in the opening 101 (see FIG. 6) described later, for example. The height of the main body 2 is, for example, about 1 to 2 mm. In addition, the outer diameter R1 of the body portion 2 is formed to have the same diameter as the inner diameter of the opening 101 (refer to FIG. 6) described later or slightly larger. Preferably, the outer diameter R1 of the body portion 2 is formed to have the same diameter as the inner diameter of the opening 101 or slightly larger. Thereby, when the pad 1 described later is attached, the adhesion of the main body 2 to the opening 101 can be improved.

A through hole 5 is formed in the central portion of the main body 2 and the central portion of the holding portion 3 (3A, 3B) so as to communicate the main body portion 2 and the holding portion 3 (3A, 3B). The through hole 5 in this embodiment has a circular cross section and has the same diameter in the height direction of the pad 1.

The holding portion 3 (3A, 3B) has a ring portion 31 (31A, 31B) that abuts on a wafer or the like when holding (mounting) a target member, that is, a wafer or the like. The ring portion 31 (31A, 31B) has a ring shape at the edge of the through hole 5. The ring portions 31A and 31B may have approximately the same shape. In this embodiment, the ring portions 31A and 31B are formed into a ring shape with the same diameter. The outer diameter R2 of the ring portion 31 (31A, 31B) is formed to be smaller than the outer diameter R1 of the body portion 2. In other words, the outer diameter R2 of the ring portion 31 (31A, 31B) is formed to be slightly larger than the diameter R4 of the through-hole 5 (see FIG. 4). The ring portion 31 (31A, 31B) is formed so as to be approximately flat in a manner orthogonal to the height direction of the body portion 2. The wafer is held in contact with either the ring portion 31A of the first holding portion 3A (an example of the first ring portion) or the ring portion 31B of the second holding portion 3B (an example of the second ring portion).

The holding portion 3 (3A, 3B) has a flange portion 32 (32A, 32A, 31A, 31B) provided integrally with the body portion 2 and the ring portion 31 (31A, 31B) between the ring portion 31 (31A, 31B) and the body portion 2 32B). The flange portion 32 (32A, 32B) is composed of a tapered portion 33 (33A, 33B) and a seating surface 34 (34A, 34B). The tapered portion 33 (33A, 33B) is formed so as to expand in diameter from the ring portion 31 (31A, 31B) side toward the body portion 2 side. The seating surface 34 (34A, 34B) is formed in a portion of the flange portion 32 (32A, 32B) that is in contact with the body portion 2 and is formed parallel to a surface orthogonal to the height direction of the body portion 2. That is, the outer diameter R3 of the flange portion 32 (32A, 32B) is formed to be larger than the outer diameter R1 of the body portion 2. When the pad 1 is mounted on the manipulator 100, the seating surface 34 (34A, 34B) is a surface that abuts a part of the manipulator 100.

In this way, the holding portion 3 (3A, 3B) is formed into a frusto-conical shape. The first holding portion 3A provided on the upper end portion of the body portion 2 is formed so as to decrease in diameter as it goes toward the ring portion 31A. Moreover, the second holding portion 3B provided at the lower end portion of the body portion 2 is formed so as to decrease in diameter as it goes toward the ring portion 31B. The first holding portion 3A and the second holding portion 3B are formed such that the body portion 2 is sandwiched between the holding portions to form a symmetrical structure. Although not shown, the bottom view of the pad 1 is the same as the plan view shown in FIG. 3. The back view, left side view, and right side view of the pad 1 are the same as the front view shown in FIG. 2.

The area of the ring portion 31 (31A, 31B) is formed to be, for example, 0.1 to 1 square millimeter (mm ² ). If the area of the ring portion 31 (31A, 31B) is less than 0.1 mm ² , poor contact with the wafer may occur. On the other hand, if the area of the ring portion 31 (31A, 31B) is larger than 1 mm ² , there may be a problem that particles adhere to the wafer. For example, when the diameter R4 of the through hole 5 is formed to be 4 mm, the diameter width W of the ring portion 31 (31A, 31B) is formed to be 0.01 mm to 0.065 mm. Moreover, the area of the ring portion 31 (31A, 31B) changes according to the allowable total contact area S of all the pads 1 mounted on the robot 100 and the wafer, that is, according to the number of pads 1. When the allowable total contact area S of all the pads 1 and the wafer is set to be fixed, the number of pads 1 is increased by 1, 2, 3, ..., and each ring portion 31 (31A, 31B ) Area will be reduced by S, S/2, S/3, ... In other words, when the allowable total contact area S of all the pads 1 and the wafer has been decided, and the number of all the pads 1 to be mounted on the robot 100 has been decided, the ring portion 31 (31A , 31B) area.

Specifically, for example, when the total contact area S is set to 3 mm ² or less, the total number of pads 1 is set to 3, the diameter R4 of the through hole 5 is set to 4 mm, and the outer diameter R2 of the ring portion 31 (31A, 31B) is set to At 4.13 mm, the diameter W of the ring portion 31 (31A, 31B) is 0.065 mm. At this time, the area of the ring portion 31 (31A, 31B) becomes 0.83 mm ² and the total area of the ring portion 31 becomes 2.49 mm ² , which satisfies the total contact area S (3 mm ² ) or less. Also, for example, when the total contact area S is 0.5 mm ² or less, the total number of pads 1 is 3, the diameter R4 of the through-hole 5 is 4 mm, and the outer diameter R2 of the ring portion 31 (31A, 31B) is At 4.02 mm, the diameter width W of the ring portion 31 (31A, 31B) becomes 0.01 mm. At this time, the area of the ring portion 31 (31A, 31B) becomes 0.13 mm ² and the total area of the ring portion 31 becomes 0.39 mm ² , which satisfies the total contact area S (0.5 mm ² ) or less.

The body portion 2 and the holding portion 3 (3A, 3B) constituting the pad 1 are made of conductive resin, which is made by dispersing conductive particles in the resin composition. The body portion 2 and the holding portion 3 (3A, 3B) can be produced by a fluororesin such as polytetrafluoroethylene, perfluoroalkoxy, ethylene tetrafluoroethylene copolymer, or the like. As the resin composition, in addition to this, it is also possible to apply to all resins conventionally used in pads of robots that transport semiconductor wafers.

Next, the robot 100 equipped with the pad 1 will be described with reference to FIGS. 5 and 6. FIG. 5 is a perspective view showing the robot 100 provided with the pad 1. FIG. 6 is a cross-sectional view of the robot 100 taken along the line VI-VI.

As shown in FIG. 5, a plurality of pads 1 (three in the present embodiment) are mounted on the robot 100. The pad 1 is used to hold a wafer at the front end of the robot 100. In addition, the manipulator 100 includes an intake and exhaust unit (not shown), and each pad 1 is connected to an intake and exhaust unit via a passage 102 described later. The pad 1 mounted on the robot 100 vacuum-absorbs the wafer, thereby holding the wafer in a manner that does not cause a positional deviation of the wafer relative to the robot 100 and the wafer does not fall from the robot 100 Wafer. The manipulator 100 is made of ceramic material such as alumina.

As shown in FIG. 6, the manipulator 100 includes: a hand body portion 110; an opening portion 101 for attaching the pad 1; and a passage portion 102 (a part of the intake and exhaust unit), which communicates with the opening portion 101 . The opening 101 is a hole formed in the holding surface 103 (the top surface in FIG. 6) and communicates with the passage portion 102. This holding surface 103 is also used in the hand body portion 110 to hold a wafer, etc. The side of the side. The opening 101 in this embodiment has a circular cross section, and has the same diameter in the thickness direction of the hand body 110 in the opening 101. The diameter of the opening 101 is formed so as to be approximately the same as or slightly smaller than the outer diameter R1 of the main body 2.

The passage portion 102 is formed by sealing a groove formed on a surface (rear surface) 104 on the opposite side of the holding surface 103 in the hand body portion 110 with a cover member (seal member) 105. The end portion (the right end portion in FIG. 6) of the passage portion 102 is connected to an intake and exhaust unit (not shown).

Either one of the holding portions 3 (3A or 3B) of the pad 1 is inserted into the opening 101 from the holding surface 103 side of the hand body portion 110 while being elastically deformed. At this time, since the flange portion 32 (32A, 32B) includes the tapered portion 33 (33A, 33B), the holding portion 3 (3A or 3B) is introduced into the opening 101 while being automatically aligned. In addition, the largest diameter portion 321 (refer to FIG. 6) of the flange portion 32 (32A, 32B) is folded back to the body portion 2 side while being elastically deformed, and after completely passing through the opening portion 101, is elastically deformed back to the original Shape, the holding portion 3 (3A or 3B) closely adheres to the lower edge of the opening 101. For example, when the second holding portion 3B is inserted into the opening 101, the flange portion 32B (tapered portion 33B) of the second holding portion 3B enters the opening 101 to insert the second holding portion 3B (ring portion 31B The flange portion 32B) is disposed in the passage portion 102. Thereby, the seating surface 34B of the second holding portion 3B disposed in the passage portion 102 abuts (seated) the inner wall surface of the passage portion 102 (the upper surface of the passage portion 102 in FIG. 6).

At this time, the body portion 2 of the pad 1 is abutted to the inner peripheral surface of the opening 101, and both are in close contact. Furthermore, the first holding portion 3A is not inserted into the opening 101, but is arranged outside the opening 101 (upper side than the holding surface 103 in FIG. 6) and is installed as the first holding portion 3A The seating surface 34A of the abuts the state where the holding surface 103 is in contact. That is, the hand body portion 110 is clamped by the flange portion 32A of the first holding portion 3A and the flange portion 32B of the second holding portion 3B, thereby attaching the pad 1 to the state in which it is firmly adhered to the hand body portion 110 . In this way, the pad 1 mounted on the manipulator 100 can limit its mounting position to an appropriate position by the flange portion 32A of the first holding portion 3A and the flange portion 32B of the second holding portion 3B.

When the pad 1 is attached to the robot 100 via the opening 101, the through hole 5 of the pad 1 communicates with the passage 102 of the robot 100. In this state, the air in the through-hole 5 and the passage 102 is vacuum-sucked by the operation of the suction and exhaust unit, thereby vacuum-absorbing the wafer placed on the robot 100 to the ring portion 31A of the pad 1 on.

In this embodiment, three pads 1 are attached to one robot 100. Therefore, the contact area between the pad 1 (ring portion 31A) on the robot 100 and the wafer becomes 3 mm ² or less.

As described above, the manipulator 100 of the present embodiment includes: the hand body portion 110; and the pad 1, which is installed in the opening portion 101 provided in the hand body portion 110 and holds the wafer. The pad 1 is installed in the opening 101 and includes: a body 2 (an example of a pad body) having a through hole 5 in the center; a ring 31 provided at both ends of the pad 1; and The portion 32 is provided integrally with the ring portion 31 and the body portion 2 and extends toward the outside of the body portion 2. In addition, the outer diameter R2 of the ring portion 31 is formed to be smaller than the outer diameter R1 of the body portion 2. According to this configuration, the contact area between the wafer and the ring portion 31 of the pad 1 can be reduced, so that it is possible to suppress the adhesion of particles caused by the contact between the wafer and the pad 1 on the substrate. In addition, according to this configuration, the pad 1 can be attached to the robot 100 by inserting it into the pad mounting hole, that is, the opening 101 of the hand body portion 110 while deforming it so as to crush the pad 1. Therefore, when the pad 1 is to be installed in or removed from the opening 101, no special implement or member is required. Therefore, the work of installation and removal becomes easy, and the cost of components required for installation and removal is zero. Furthermore, since the pad 1 is made of a resin composition containing conductive particles, the pad 1 is brought into contact with the wafer, thereby grounding the static electricity charged in the wafer. As a result, no sparks are generated between the pad 1 and the wafer. Therefore, the possibility of wafer damage is eliminated to improve the yield of the wafer.

In the manipulator 100 of the present embodiment, the ring portion 31 includes: a ring portion 31A (an example of the first ring portion), which is provided on the front end side of the pad 1; and, a ring portion 31B (of the second ring portion) One example), which is provided on the rear end side of the pad 1 and has the same shape as the ring portion 31A; It is provided integrally; and, the flange portion 32B (an example of the second flange portion) is provided integrally with the ring portion 31B and the body portion 2. In this way, since the ring portion 31A and the ring portion 31B have a symmetrical structure, any one of the ring portion 31A and the ring portion 31B can be used as the side in contact with the wafer. Further, the flange portion 32A and the flange portion 32B are also of a symmetrical structure, so it is possible to prevent erroneous setting when mounting the pad 1 to the robot 100, and to facilitate the installation of the pad 1.

In addition, in the manipulator 100 of the present embodiment, the hand body portion 110 has a passage portion 102 inside, and one end portion of the passage portion 102 communicates with the opening portion 101, and the other end portion is connected to the intake and exhaust unit. In this way, if the wafer is not adsorbed on the pad and the transfer is desired, when the circulation time of the wafer transfer is insufficient, or the suction force is insufficient, an air suction and exhaust unit is additionally provided and passes through the passage The unit 102 performs vacuum suction (vacuuming), whereby the wafer can be transferred while the wafer is reliably held.

In addition, in the manipulator 100 of this embodiment, when the pad 1 is mounted on the hand body 110, the hand body 110 is clamped by the flange 32A and the flange 32B, and the pad 1 is securely adhered to Is maintained on the hand body 110. With this, it is possible to prevent the pad 1 from falling off from the robot 100.

In addition, according to the robot 100 according to the present embodiment, when the pad 1 is worn out due to use, there is no need to exchange the robot 100 itself, and only the pad 1 needs to be exchanged and installed. In addition, no special tools or components are required for this exchange, and it can be easily removed and installed by hand. Furthermore, when the pad 1 is first installed, the front side and the back side can be distinguished. After the pad 1 is first installed and the front side is used, once the pad 1 is removed, the opposite back side (the side located in the passage 102) can be used again. Therefore, the time required for the exchange operation can be greatly reduced, and there is no component cost required for the exchange. In addition, one pad 1 can be used twice.

In addition, according to the pad 1 of the present embodiment, when the pad 1 is mounted on the robot 100, the installation of a sealing member such as a vacuum suction pad disclosed in Patent Document 2 is not required, so the exchange operation of the pad 1 is further performed Made easy.

In addition, in the above embodiment, the holding portion 3 composed of the ring portion 31 and the flange portion 32 is provided at both end portions of the body portion 2, but it is not limited thereto. The holding portion 3 may be configured to be provided on at least one end of the body portion 2. For example, like the pad 1A shown in FIG. 7, a holding portion having a shape different from the holding portion 3 of the above embodiment may be provided at the end of the body portion 2 on the side to be inserted into the hand body portion 110 ( (Lower end in Figure 7). Specifically, in the pad 1A, the holding portion 3BA on the side to be inserted into the hand body portion 110 includes a flange portion 32BA (an example of a third flange portion) that extends toward the outside of the body portion 2. The flange portion 32BA is composed of a surface 35BA, a surface 33BA, and a surface (seating surface) 34BA; the surface 35BA is formed at the edge of the through hole 5 parallel to the surface orthogonal to the height direction of the body portion 2 The surface 33BA is a surface formed perpendicularly from the outer end portion of the surface 35BA toward the body portion 2 side; the surface (seating surface) 34BA is formed in the flange portion 32BA in contact with the body portion 2 and The surface formed perpendicular to the height direction of the main body 2 is parallel. Even with this configuration, the hand body portion 110 can be sandwiched by the flange portions 32A and 32BA at both ends of the body portion 2, so that the pad 1A can be attached to the robot 100 in a state in which it is securely adhered to. Therefore, it is possible to prevent the pad 1A from falling off from the robot 100.

In addition, in the above-mentioned embodiment, although the shape of the body portion 2 is formed into a cylindrical shape, it is not limited to this. The body portion 2 may be appropriately selected in accordance with the shape of the opening 101, and for example, it may be in the shape of a rectangular column or a polygonal column.

In addition, in the above-described embodiment, the holding portion 3 (3A, 3B) has a frusto-conical shape, but it is not limited thereto. The holding portion 3 may be appropriately selected according to the shape of the opening 101, and for example, it may be a truncated pyramid.

In addition, in the above-mentioned embodiment, although the ring portion 31 (31A, 31B) is formed into a substantially flat shape orthogonal to the axial direction of the body portion 2, it is not limited thereto. The ring portion 31 (31A, 31B) may be formed, for example, as an inclined surface that gradually slopes toward the flange portion 32 (32A, 32B) side toward the inner side (as it approaches the through-hole 5), or further toward the outer side (with The inclined surface gradually inclined toward the flange portion 32 (32A, 32B) side as the distance from the through hole 5) increases. In the former case, the outer peripheral edge portion of the ring portion 31 (31A, 31B) is in contact with the wafer; in the latter case, the inner peripheral edge portion of the ring portion 31 (31A, 31B) is in contact with the wafer.

In addition, in the above-described embodiment, the tapered portion 33 (33A, 33B) is formed so that the ridge shape of the front view becomes a straight line, but it is not limited to this. For example, it may be a tapered portion 33C (see FIG. 8) having a convex bow shape with the ridge shape in the front view (see FIG. 8), or may be a tapered portion 33D with a concave bow shape (see FIG. 8) (Figure 9). In addition, the tapered portion may not have continuity, and the ridge shape of the front view is a stepped tapered portion 33E (see FIG. 10 ).

In addition, the present invention is not limited to the above-mentioned embodiments, and can be freely adjusted, changed, improved, and the like. In addition, the material, shape, size, numerical value, form, number, location, etc. of each constituent element in the above embodiments are not limited as long as the invention can be achieved.

This application is based on Japanese Patent Application No. 2018-122932 filed on June 28, 2018, the contents of which are incorporated herein by reference.

1, 1A‧‧‧ pad (pad member) 2‧‧‧Body part (pad body part) 3. 3BA‧‧‧Maintaining Department 3A‧‧‧ Holder (First Holder) 3B‧‧‧ Holder (Second Holder) 5‧‧‧Through hole 31‧‧‧ Department 31A‧‧‧Ring (First Ring) 31B‧‧‧Ring (second ring) 32, 32A, 32B, 32BA 33, 33A, 33B, 33C, 33D, 33E 34, 34A, 34B‧‧‧ seating surface 33BA, 35BA 34BA‧‧‧face (seating surface) 100‧‧‧manipulator 101‧‧‧ opening 102‧‧‧Access Department 103‧‧‧Keep noodles 104‧‧‧The surface opposite to the holding surface 105‧‧‧ cover member 110‧‧‧Hand body 321‧‧‧The largest diameter part of the flange R1‧‧‧Outer diameter of body R2‧‧‧Outer diameter of ring R3‧‧‧Outer diameter of flange R4‧‧‧Through hole diameter W‧‧‧Diameter width of ring IV-IV, VI-VI‧‧‧hatching

Fig. 1 is a perspective view of the pad of the present invention. Figure 2 is a front view of the pad. Figure 3 is a plan view of the pad. FIG. 4 is a cross-sectional view taken along line IV-IV of FIG. 3. Fig. 5 is a perspective view showing an example of the manipulator of the present invention. FIG. 6 is a cross-sectional view taken along the line VI-VI of FIG. 5. Fig. 7 is a cross-sectional view of a modified example of the pad of the present invention. Fig. 8 is a partially enlarged front view of a modified example of the pad of the present invention. Fig. 9 is a partially enlarged front view of a modified example of the pad of the present invention. Fig. 10 is a partially enlarged front view of a modified example of the pad of the present invention.

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1‧‧‧ pad (pad member)

2‧‧‧Body part (pad body part)

5‧‧‧Through hole

31A‧‧‧Ring (First Ring)

33A, 33B ‧‧‧ tapered part

34A, 34B‧‧‧ seating surface

100‧‧‧manipulator

101‧‧‧ opening

102‧‧‧Access Department

103‧‧‧Keep noodles

104‧‧‧The surface opposite to the holding surface

105‧‧‧ cover member

110‧‧‧Hand body

321‧‧‧The largest diameter part of the flange

Claims (10)

A manipulator, which is installed on a robot arm for transferring substrates and used to hold the aforementioned substrate, is provided with: Hand body; and, A pad member, which is installed in the opening portion which has been provided on the hand body portion, and is used to hold the aforementioned substrate; The aforementioned pad member includes: The pad body portion, which is installed in the aforementioned opening portion, and has a through hole in its central portion; A first ring portion, which is provided on the front end side of the pad member to abut the substrate; and, The first flange portion is provided integrally with the first ring portion and the pad body portion, and extends toward the outside of the pad body portion. The manipulator according to claim 1, wherein the pad member further includes: A second ring portion provided on the rear end side of the pad member and formed in the same shape as the first ring portion; and, The second flange part is provided integrally with the second ring part and the pad body part, and is seated on the hand body part. The manipulator according to claim 1, wherein the pad member further includes a third flange portion that is provided integrally with the pad body portion at the rear end side of the pad member and faces the pad body The outer side of the portion extends. The manipulator according to any one of claims 1 to 3, wherein the hand body portion has a passage portion therein, and one end portion of the passage portion communicates with the opening portion, and the other end portion is connected to the suction exhaust Gas unit. The manipulator according to any one of claims 1 to 3, wherein the pad body portion is a cylindrical member; The first flange portion has a tapered portion that expands in diameter from the first ring portion side toward the pad body portion side. The manipulator according to claim 2, wherein the pad body portion is a cylindrical member; The second flange portion has a tapered portion that expands in diameter from the second ring portion side toward the pad body portion side. The manipulator according to claim 2, wherein the pad member is mounted on the hand body portion by sandwiching the hand body portion with the first flange portion and the second flange portion. The manipulator according to claim 3, wherein the pad member is mounted on the hand body portion by sandwiching the hand body portion with the first flange portion and the third flange portion. The manipulator according to any one of claims 1 to 3, wherein the pad member is made of a conductive resin in which conductive particles are dispersed in a resin composition. The manipulator according to any one of claims 1 to 3, wherein the outer diameter of the first ring portion is formed to be smaller than the outer diameter of the pad body portion.

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