TW202003183A - Workpiece processing method - Google Patents

Abstract

[Problem] To provide a workpiece processing method that can appropriately adjust the height of the cutting blade without greatly reducing the output. [Solution] A workpiece processing method, including: a reference setting step to set the height of the cutting unit as a reference; a target setting step to set the cutting unit as a way of cutting the cutting blade to a predetermined depth of the cutting film The height of the target; the first cutting step, in the state where the cutting unit is positioned at the height of the target, the workpiece is cut by relatively moving the cutting unit and the chuck table; the correction value obtaining step is based on the cutting blade The length of the contact trace formed on the adhesive film to obtain the correction value; and the second cutting step, the cutting unit is positioned at the height of the target after correction according to the correction value, by relatively moving the cutting unit and the chuck table To cut the workpiece.

Description

Workpiece processing method

The invention relates to a processing method of a workpiece, which cuts and processes a plate-shaped workpiece adhered with a cutting glue film.

When processing a plate-shaped workpiece representing a semiconductor wafer or a package substrate, for example, a cutting device with a ring-shaped cutting blade mounted on a main shaft is used. While rotating the main shaft and cutting the cutting blade into the workpiece, the main shaft and the cutting blade and the workpiece are relatively moved, whereby the workpiece can be cut and processed along the direction of this relative movement.

However, when cutting the workpiece with the cutting device as described above, the cutting blade will wear out and its diameter will gradually become smaller. If the cutting blade whose diameter becomes smaller due to wear continues to be used, the cutting blade will cut into the workpiece shallower, and the workpiece cannot be properly cut and processed.

Therefore, the following method has been put into practical use: A method of detecting the position of the front end (lower end) of the cutting blade at an arbitrary point in time and using the position of the front end as a reference to control the cutting of the cutting blade into the workpiece (for example, see Patent Document 1). This method is to make the cutting blade invade the optical sensor provided on the cutting device, and block the optical path in the sensor by the cutting blade to detect the position of the front end of the cutting blade. [Conventional Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2001-298001

[Problems to be solved by the invention] In recent years, along with the miniaturization of wafers cut from workpieces, etc., the number of processing lines (dicing lanes) set on the workpieces has also increased. Therefore, the following situation is likely to occur: the cutting blade is greatly worn out during the cutting of a workpiece, and the height of the cutting blade must be adjusted by confirming the position of the front end of the cutting blade.

Once this happens, the cutting process of the workpiece must be stopped. After detecting the position of the front end of the cutting blade with the sensor described above, the height of the cutting blade is adjusted, and the cutting process is restarted. However, in this case, the cutting blade must be relatively moved between the workpiece and the sensor, so the yield is easily reduced.

The present invention is made in view of such a problem, and as its object, it is to provide a workpiece processing method that can appropriately adjust the height of the cutting blade without greatly reducing the output.

[Technical means to solve the problem] According to one aspect of the present invention, it is a workpiece processing method that uses a cutting device to perform cutting processing on a workpiece to which a cutting adhesive film is attached. The cutting adhesive film is attached to an opening of a ring frame. The cutting device includes: holding the workpiece A chuck table; a cutting unit installed with a cutting blade that cuts the workpiece held on the chuck table; and a setting unit that sets the cutting unit as a reference based on the height of the front end of the outer periphery of the cutting blade The height of the workpiece; the workpiece processing method includes the following steps: a reference setting step, based on the height of the outer peripheral front end of the cutting blade, setting the height of the cutting unit as the reference; a target setting step so that the cutting blade cuts into the cutting film The predetermined height of the cutting unit is used to set the target height of the cutting unit; the first cutting step, in the state of positioning the cutting unit at the target height, by making the cutting unit and the chuck table do Relatively move to cut and process the workpiece; the correction value acquisition step, at the same time as the first cutting step, or after the first cutting step, based on the length of the contact marks formed on the cutting film by the cutting blade, is used for A correction value of the height of the cutting unit as the target; and a second cutting step, by positioning the cutting unit at a height obtained by correcting the height of the target according to the correction value, by making the The cutting unit moves relative to the chuck table to cut and process the workpiece.

In one aspect of the present invention, in the first cutting step, the cutting unit may be lowered in the first area exposed by the cutting glue film between the workpiece and the frame, and then lowered to the height as the target , By moving the cutting blade relative to the workpiece to the second area on the opposite side of the first area from which the cutting glue film is exposed, by relatively moving the cutting unit and the chuck table, While cutting the workpiece, the contact marks are formed on the cutting adhesive film.

In addition, in one aspect of the present invention, a contact mark forming step may be further included, which is to make the cutting unit cut the glue between the workpiece and the frame after the first cutting step and before the correction value obtaining step The exposed area of the film descends, and by descending to the height as the target, the contact mark is formed on the dicing adhesive film.

Furthermore, in one aspect of the present invention, in the correction value obtaining step, the correction value may be obtained based on the depth of the contact mark calculated from the length of the contact mark and the outer diameter of the cutting blade.

[Effect of invention] In the workpiece processing method according to an aspect of the present invention, based on the length of the contact mark formed by the cutting blade on the cutting adhesive film, a correction value for correcting the target height of the cutting unit is obtained, and thereafter, the cutting unit is positioned Based on the height corrected by this correction value, the workpiece is cut and processed.

Therefore, whenever the cutting blade is worn, the height of the cutting unit can be adjusted appropriately even without using the setting unit to detect the height of the front end of the outer periphery of the cutting blade. That is, when the height of the cutting blade is adjusted, the relative moving distance of the cutting blade does not need to be as large as in the past, so the height of the cutting blade can be adjusted appropriately without greatly reducing the output.

The embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing a configuration example of a workpiece 11 and the like that are cut by the workpiece processing method of the present embodiment. As shown in FIG. 1, the workpiece 11 is, for example, a disc-shaped wafer formed using a semiconductor material such as silicon (Si).

The front surface 11a side of the workpiece 11 is divided into a plurality of small areas by a plurality of lines to be processed (cutting lanes) 13 crossing each other, and elements 15 such as an IC (Integrated Circuit) are formed on the small areas. On the back surface 11b side of the workpiece 11, a first surface 21a side of a dicing film 21 having a diameter larger than the workpiece 11 is pasted.

In addition, the outer peripheral portion of the dicing film 21 on the first surface 21a side is adhered to the ring-shaped frame 23 having a substantially circular opening 23a. That is, on the back surface 11 b side of the work 11, a dicing film 21 attached to the opening 23 a of the ring frame 23 is pasted, and the work 11 is supported by the frame 23 through the dicing film 21.

In addition, in this embodiment, although a disc-shaped wafer formed of a semiconductor material such as silicon is used as the workpiece 11, the material, shape, structure, size, and the like of the workpiece 11 are not limited. For example, a substrate formed of other semiconductor, ceramic, resin, metal, or other materials may be used as the workpiece 11. Similarly, the type, number, shape, structure, size, arrangement, etc. of the elements 15 are not limited. The element 15 may not be formed on the work 11.

In addition, in this embodiment, although the example where the dicing film 21 is adhered to the back surface 11b side of the workpiece 11 and the workpiece 11 is cut and processed from the front surface 11a side, the dicing film 21 may be adhered to the workpiece 11 is the front side 11a side. In this case, the work 11 becomes cut from the back surface 11b side.

In the workpiece processing method according to the present embodiment, first, preparation for cutting and processing the workpiece 11 with a cutting device is performed. FIG. 2 is a perspective view showing a configuration example of the cutting device 2 used in the workpiece processing method according to this embodiment. In addition, in FIG. 2, some of the constituent elements are represented by functional blocks. As shown in FIG. 2, the cutting device 2 includes a base 4 that supports each component.

An opening 4a is formed in a corner in front of the base 4, and a cassette elevator 6 that is raised and lowered by a lifting mechanism (not shown) is provided in the opening 4a. A cassette 8 is placed on the upper surface of the cassette elevator 6. The cassette 8 is used to accommodate the workpiece 11 in a state supported by the frame 23 through the cutting film 21. Furthermore, in FIG. 2, for convenience of explanation, only the outline of the cassette 8 is shown.

In the lateral direction of the cassette elevator 6, a long opening 4 b is formed in the X-axis direction (front-rear direction, processing feed direction). A ball screw type X-axis moving mechanism (processing feed mechanism) 10 and a bellows-shaped cover 12 covering the upper part of the X-axis moving mechanism 10 are arranged in the opening 4b. The X-axis moving mechanism 10 includes an X-axis moving table (not shown), and moves the X-axis moving table in the X-axis direction. Furthermore, the upper part of the X-axis moving table is covered by the table cover 10a.

A chuck table (holding table) 14 for holding the workpiece 11 through the dicing film 21 is arranged on the X-axis moving table, and the chuck table 14 is exposed from the table cover 10a. The chuck table 14 is connected to a rotation drive source (not shown) such as a motor, and rotates about a rotation axis substantially parallel to the Z-axis direction (vertical direction). In addition, the chuck table 14 is moved together with the X-axis moving table in the X-axis direction by the above-mentioned X-axis moving mechanism 10 (machining feed).

A part of the upper surface of the chuck table 14 is a holding surface 14a for holding the work 11. The holding surface 14a is formed substantially parallel to the X-axis direction and the Y-axis direction (left-right direction, indexing feed direction), and passes through the suction passage 14b formed inside the chuck table 14 (see FIG. 4(A)), etc. It is connected to the source of attraction (not shown). In addition, four clamps 16 are provided around the chuck table 14, and the clamps 16 are used to fix and support the ring frame 23 of the workpiece 11 from four directions.

Above the opening 4b, a conveying unit (not shown) is arranged for conveying the workpiece 11 (frame 23) to the chuck table 14 or the like. The workpiece 11 transported by the transport unit is placed on the holding surface 14a of the chuck table 14 such that the front surface 11a side is exposed upward. That is, in this embodiment, the dicing film 21 adhered to the back surface 11 b side of the workpiece 11 contacts the holding surface 14 a of the chuck table 14.

A cantilever-shaped support structure 20 is arranged in the lateral direction of the opening 4b. The support structure 20 is used to support the cutting unit 18 that cuts the workpiece 11. A cutting unit moving mechanism (indexing feeding mechanism, cutting feeding mechanism) 22 that moves the cutting unit 18 in the Y-axis direction and the Z-axis direction is provided on the upper front portion of the support structure 20.

The cutting unit moving mechanism 22 includes a pair of Y-axis guide rails 24 arranged in front of the support structure 20 and substantially parallel to the Y-axis direction. A slideable Y-axis moving plate 26 is mounted on the Y-axis guide 24, and the Y-axis moving plate 26 constitutes a cutting unit moving mechanism 22.

A nut portion (not shown) is provided on the back side (rear side) of the Y-axis moving plate 26, and the Y-axis ball screw 28 substantially parallel to the Y-axis guide rail 24 is screwed into this nut portion. A Y-axis pulse motor (not shown) is connected to one end of the Y-axis ball screw 28. When the Y-axis ball screw 28 is rotated by the Y-axis pulse motor, the Y-axis moving plate 26 moves in the Y-axis direction along the Y-axis guide rail 24.

A pair of Z-axis guide rails 30 substantially parallel to the Z-axis direction are provided on the surface (front surface) of the Y-axis moving plate 26. A slideable Z-axis moving plate 32 is installed on the Z-axis guide 30.

A nut portion (not shown) is provided on the back side (rear side) of the Z-axis moving plate 32, and the Z-axis ball screw 34 parallel to the Z-axis guide 30 is screwed into this nut portion. A Z-axis pulse motor 36 is connected to one end of the Z-axis ball screw 34. When the Z-axis ball screw 34 is rotated by the Z-axis pulse motor 36, the Z-axis moving plate 32 moves in the Z-axis direction along the Z-axis guide rail 30.

A cylindrical spindle housing 38 constituting the cutting unit 18 is fixed to the lower part of the Z-axis moving plate 32. In the main shaft housing 38, a main shaft 40 (refer to FIG. 3) as a rotating shaft is accommodated. One end portion of the spindle 40 is exposed to the outside from one end side of the spindle housing 38, and a cutting blade 42 for cutting the workpiece 11 is attached to one end portion of the spindle 40. A rotary drive source (not shown) such as a motor is connected to the other end side of the spindle 40.

At a position adjacent to the cutting unit 18, a camera (photographic unit) 44 is provided for photographing the work 11 and the like held on the chuck table 14. When the cutting unit moving mechanism 22 moves the Y-axis moving plate 26 in the Y-axis direction, the cutting unit 18 and the camera 44 move in the Y-axis direction (index feed). In addition, if the Z-axis moving plate 32 is moved in the Z-axis direction by the cutting unit moving mechanism 22, the cutting unit 18 and the camera 44 will move in the Z-axis direction (cutting feed).

Above the opening 4b and below the cutting unit 18, a blade position detection unit (setting unit) 46 is arranged. This blade position detection unit (setting unit) 46 is used to detect the blade edge (front end of the outer periphery) of the cutting blade 42. The position (height) in the Z axis direction. In addition, an opening 4c is formed at a position opposite to the opening 4b and the opening 4a. In the opening 4c, a cleaning unit 48 is arranged for cleaning the workpiece 11 after cutting and the like.

The control unit (setting unit) 50 is connected to the X-axis moving mechanism 10, the cutting unit 18, the cutting unit moving mechanism 22, the camera 44, and the blade position detection unit 46. The control unit 50 is, for example, controlling each constituent element of the cutting device 2 based on the processing conditions of the workpiece 11 and the like.

FIG. 3 is an enlarged perspective view of the cutting unit 18 and the blade position detection unit 46. In addition, in FIG. 3, some constituent elements of the cutting unit 18 are omitted. As shown in FIG. 3, the blade position detection unit 46 includes a detector 54 located below the cutting unit 18. The detector 54 includes, for example, a support portion 54a configured in a substantially rectangular parallelepiped shape, and a detection portion 54b provided above the rear end side (any side in the X-axis direction) of the support portion 54a.

The upper end portion of the detection portion 54b is formed with a notched blade intrusion portion 54c formed so that the cutting blade 42 can invade. The blade intruding portion 54c includes a pair of inner side surfaces facing each other in the Y-axis direction, and the pair of inner side surfaces are respectively provided with a light emitting portion 56 and a light receiving portion 58 that constitute an optical sensor. That is, the light-emitting portion 56 and the light-receiving portion 58 face each other via the blade intrusion portion 54c.

Two air supply nozzles 60 are provided on the upper surface of the support portion 54a located in front of the detection portion 54b (the other side in the X-axis direction). The air supply nozzles 60 are used to supply air to the light emitting portion 56 and the light receiving portion 58 . In addition, two liquid supply nozzles 62 are provided in front of the air supply nozzle 60. The two liquid supply nozzles 62 are used to supply liquid such as water to the light-emitting portion 56 and the light-receiving portion 58. For example, after cleaning the light-emitting portion 56 and the light-receiving portion 58 with the liquid supplied from the liquid supply nozzle 62, the light-emitting portion 56 and the light-receiving portion 58 are dried using air supplied from the air supply nozzle 60.

A rectangular parallelepiped cover 66 is attached to the rear end surface of the detector 54 through a connector 64 formed by a hinge or the like. The inside of the cover 66 is hollow. Therefore, for example, by rotating the cover 66 around the connector 64, the detection unit 54 b, the air supply nozzle 60, the liquid supply nozzle 62, and the like can be accommodated inside the cover 66.

On the other hand, when the position of the outer peripheral front end of the cutting blade 42 is to be detected by the blade position detection unit 46, the cover 66 is rotated to the position shown in FIG. 3, so that the detection portion 54b, the air supply nozzle 60, and the liquid supply nozzle 62 Wait to reveal. This makes it possible to detect the position of the tip of the outer periphery such that the cutting blade 42 invades the blade intrusion portion 54c.

In the workpiece processing method of the present embodiment, first, based on the height of the front end of the outer periphery of the cutting blade 42, the height (reference height H ₀ ) of the cutting unit 18 as a reference is set to the cutting device 2 (reference setting step). Specifically, first, the cutting blade 42 that has been rotated is positioned above the detector 54 of the blade position detection unit 46. Then, as shown in FIG. 3, in a state where light is emitted from the light emitting portion 56, the cutting unit 18 is lowered, and the rotating cutting blade 42 is made to invade the blade intruding portion 54 c (between the light emitting portion 56 and the light receiving portion 58 ).

As a result, the light radiated from the light-emitting portion 56 to the light-receiving portion 58 is partially blocked by the cutting blade 42, and the amount of light received by the light-receiving portion 58 gradually decreases. The control unit 50 monitors the light receiving amount of the light receiving unit 58 (voltage value equivalent to the light receiving amount, etc.) and the height of the cutting unit 18, for example, the height of the cutting unit 18 when the light receiving amount of the light receiving unit 58 is reduced to a predetermined threshold is used as a reference The height H ₀ makes it memorize in the memory section of the control unit 50.

In the present embodiment, the height of the cutting unit 18 when the front end of the outer periphery of the cutting blade 42 is in contact with the holding surface 14a of the chuck table 14 is set as the reference height H ₀ . That is, the threshold value of the amount of light received by the light receiving unit 58 and the like are adjusted so that the reference height H ₀ is set. However, the reference height H ₀ may not necessarily be set so that the outer peripheral tip of the cutting blade 42 contacts the holding surface 14 a of the chuck table 14.

Furthermore, in the present embodiment, although the example in which the above-mentioned blade position detection unit 46 is used to set the reference height H ₀ in a non-contact manner has been described, the method of setting the reference height H ₀ is not limited. For example, the reference height H ₀ may be set by a method in which a potential difference is formed between the chuck table 14 and the cutting blade 42 to contact these members and confirm conduction.

After setting the reference height H ₀ , the target height (target height H ₁ ) of the cutting unit 18 is set to the cutting device 2 in such a way that the workpiece 11 held by the chuck table 14 can be cut appropriately (target setting step ). More specifically, the target height H _{1 is} set in such a manner that the cutting blade 42 can be cut to a predetermined depth of the cutting adhesive film 21 held by the chuck table 14 together with the workpiece 11.

For example, if the thickness of the cutting film 21 is T ₀ , it is desirable to cut the cutting blade 42 to a position where the depth from the first surface 21 a of the cutting film 21 is D ₀ (that is, between the first surface 21 a and the cutting blade 42 When the distance of the lowest point is D ₀ ), the target height H ₁ becomes H ₀ + T _0- D ₀ .

The control unit 50 memorizes the obtained target height H _{1 in the} memory unit in the control unit 50. Furthermore, the depth D ₀ used for calculating the target height H ₁ is preferably 5 μm to 35 μm, and typically is about 10 μm. However, the value of the depth D ₀ is within a range in which the work 11 can be appropriately cut, and can be arbitrarily adjusted.

After setting the reference height H ₀ and the target height H ₁ , the workpiece 11 is cut and processed (first cutting step). 4(A) and 4(B) are partial cross-sectional side views showing a state where the workpiece 11 is cut and processed. Specifically, first, the dicing film 21 adhered to the back surface 11b side of the work 11 is brought into contact with the holding surface 14a of the chuck table 14 to make the suction source negative pressure act. At the same time, the frame 23 is fixed with the clamp 16. Thereby, the workpiece 11 is held in a state where the front surface 11a side is exposed upward.

Next, for example, the chuck table 14 is rotated, and the target processing line 13 is aligned with the X-axis direction of the cutting device 2. In addition, the chuck table 14 and the cutting unit 18 are relatively moved so that the position of the cutting blade 42 coincides with the extension of the target processing line 13.

Then, as shown in FIG. 4(A), while the cutting blade 42 is rotated, the cutting unit 18 is lowered to the target height H ₁ . As a result, the cutting blade 42 cuts into the cutting film 21 in the first area where the cutting film 21 between the workpiece 11 and the frame 23 is exposed.

Thereafter, the chuck table 14 is moved in the X-axis direction. Specifically, as shown in FIGS. 4(A) and 4(B), the chuck table 14 is positioned at X in such a manner that the cutting blade 42 is relatively moved to the second area opposite to the workpiece 11 and the first area. Move in the axis direction.

Thereby, the workpiece 11 is cut and processed along the planned processing line 13 of the object. In addition, the second area is exposed in the same way as the first area. In this embodiment, the distance that the chuck table 14 moves in the X-axis direction (the distance that the cutting blade 42 moves relatively) is x ₀ .

FIG. 5(A) is a plan view showing the workpiece 11 etc. after being cut. As a result of the cutting process described above, a cut (kerf) 11c is formed on the workpiece 11 along the line to be processed 13 of the object to cut the workpiece 11. In this embodiment, the cutting blade 42 is opposed to the cutting film 21 Do the cutting, and move it from the first area to the second area relatively. Therefore, as shown in FIG. 5(A), the contact marks caused by the contact with the cutting blade 42 will also be formed on the cutting film 21 21b.

For example, while cutting the workpiece 11 along the line to be processed 13 of the object, and after forming the contact mark 21 b on the dicing film 21, a correction value for correcting the target height H ₁ is obtained (correction value obtaining step). In the present embodiment, the correction value is obtained based on the depth of the contact mark 21b calculated from the length of the contact mark 21b and the outer diameter (diameter) of the cutting blade 42.

In addition, for the sake of convenience of explanation, although an example in which the correction value is obtained after cutting the processed workpiece 11 along one planned machining line 13 is described, it is also possible to cut the processed workpiece 11 along multiple planned machining lines 13 After that, get the correction value. Before obtaining the correction value, the number of planned processing lines 13 to be cut (that is, the number of planned processing lines to be cut in the first cutting step), etc., can be adjusted according to the state of wear of the cutting blade 42 and the like.

FIG. 5(B) is a conceptual diagram showing the depth D of the contact trace formed when the cutting blade 42 is cut in the field (that is, when the cutting blade 42 is not relatively moved in the X-axis direction). From the geometric relationship shown in FIG. 5(B), when the cutting blade 42 cuts in on the spot, the depth D of the contact trace formed can be used as the diameter d of the cutting blade 42, and the length of the contact trace (X-axis direction) The length of) is regarded as L ₀ and expressed by formula (1).

【Mathematical Formula 1】

As described above, in the present embodiment, in order to form the contact mark 21b, the relative movement distance of the cutting blade 42 is set to x ₀ . Therefore, if the length of the contact trace 21b (the length in the X-axis direction) is L ₁ , L ₀ becomes L ₁ -x ₀ . That is, the depth D ₁ (≒D) of the contact mark 21b can be expressed by the formula (2) using the length L _{1 of the} contact mark 21b.

【Mathematical Formula 2】

Therefore, to obtain the correction value, first, the length L _{1 of the} contact mark 21b is obtained. In this embodiment, the camera 44 captures the contact trace 21b to form an image, and based on the contact trace 21b reflected on the image, the control unit 50 calculates the length L ₁ . In addition, the image of the contact mark 21b and the length L ₁ may be acquired simultaneously with the cutting process of the workpiece 11 described above. In this case, it becomes part of the correction value acquisition step and the first cutting step is performed simultaneously.

The diameter d of the cutting blade 42 and the relative moving distance x ₀ of the cutting blade 42 are known. Therefore, by calculating the length L _{1 of the} contact mark 21b, the depth D _{1 of the} contact mark 21b can be calculated from the above formula (2). The reduction in the diameter d of the cutting blade 42 due to wear or the like has little effect on the depth D ₁ of the contact mark 21b, so it can be ignored.

After calculating the depth D ₁ of the contact mark 21b, the control unit 50 obtains a correction value based on the depth D ₁ . In the present embodiment, when the target height H ₁ is calculated, the difference D ₀ -D _{1 between the} used depth D ₀ and the depth D ₁ of the contact mark ₂₁ b is used as a correction value. After the control unit 50 obtains the correction value, it stores it in the memory unit in the control unit 50.

After obtaining the correction value, the cutting unit 18 is positioned at the height obtained by correcting the target height H ₁ according to the correction value, and the workpiece 11 is cut (second cutting step). FIG. 6(A) is a partial cross-sectional side view showing a state where the work 11 is cut, and FIG. 6(B) is a plan view showing the work 11 and the like after being cut.

The specific cutting process is the same as the above-mentioned first cutting step. Specifically, first, the chuck table 14 and the cutting unit 18 are relatively moved so that the position of the cutting blade 42 coincides with the extension of the target processing line 13. Moreover, when the direction of the planned processing line 13 just after the cutting process is different from the direction of the target planned processing line 13, the chuck table 14 must be rotated so that the target planned processing line 13 and the X axis direction of the cutting device 2 coincide .

Next, as shown in FIG. 6(A), while rotating the cutting blade 42, the cutting unit 18 is lowered to a predetermined height H ₂ . In this embodiment, for example, the difference H ₁ -(D ₀ -D ₁ ) between the target height H ₁ and the correction values D ₀ -D ₁ is used as the predetermined height H ₂ . This is a portion where only the cut-in becomes shallow due to the wear of the cutting blade 42, which means that the cutting unit 18 is positioned at a lower position.

Then, the chuck table 14 is moved in the X-axis direction. As a result, the workpiece 11 is cut and processed along the planned processing line 13 of the object. FIG. 6(B) is a plan view showing the workpiece 11 etc. after being cut. As a result of the above-mentioned cutting process, a kerf 11d is formed on the workpiece 11 along the line to be processed 13 of the object to cut the workpiece 11.

Here, since the target height H ₁ is corrected according to the correction value obtained by the above procedure, even when the cutting blade 42 is worn, the cutting blade 42 can be cut to an appropriate height to cut the workpiece 11. In addition, when the cutting blade 42 is worn later, etc., after performing the correction value acquisition step again to obtain the correction value, a further cutting step may be performed.

As described above, in the workpiece processing method of the present embodiment, based on the length of the contact mark 21b formed on the dicing film 21 by the cutting blade 42, a correction value for correcting the target height of the cutting unit 18 is obtained, Thereafter, the cutting unit 18 is positioned at the height corrected according to this correction value to cut the workpiece 11.

Therefore, whenever the cutting blade 42 is worn, the height of the cutting unit 18 can be adjusted appropriately even without using the blade position detection unit (setting unit) 46 or the like to detect the height of the front end of the outer periphery of the cutting blade 42. That is, when the height of the cutting blade 42 is adjusted, the relative moving distance of the cutting blade 42 does not need to be as large as in the past, so the height of the cutting blade 42 can be adjusted appropriately without greatly reducing the output.

In addition, the present invention is not limited by the description of the above embodiment, and can be implemented with various changes. For example, in the above embodiment, in the first cutting step of cutting the work piece 11, while forming a cut (kerf) 11 c on the work piece 11, a contact mark 21 b is formed on the dicing film 21, but it may be After a cutting step, contact marks are formed in different steps (contact mark forming step).

FIG. 7 is a plan view showing the dicing adhesive film 21 and the like in which the contact marks 21c are formed in different steps from the above-described embodiment. When such contact marks 21c are to be formed, for example, in the first cutting step, after cutting the workpiece 11 along the planned processing line 13 of the object, the cutting blade 42 is cut to the outside of the second area (ie, the frame 23 side) The third area.

That is, in the first cutting step, after the workpiece 11 is cut, the cutting unit 18 is raised, and then the chuck table 14 is moved in the X-axis direction. Specifically, the chuck table 14 is moved in the X-axis direction so that the cutting blade 42 relatively moves above the third area.

Then, for example, in a state where the chuck table 14 is not moved, the cutting unit 18 is lowered to the target height H ₁ . As a result, the cutting blade 42 cuts into the cutting film 21 in the third area where the cutting film 21 between the workpiece 11 and the frame 23 is exposed.

With this, a contact mark 21c is formed on the dicing film 21. In this way, by the procedure of cutting the cutting blade 42 on the spot, the length (length in the X-axis direction) L ₂ of the formed cutting mark 21 c is equal to the length L ₀ of the contact mark in the above formula (1). Therefore, the control unit 50 can calculate the depth D ₂ (=D) of the contact mark 21c from the formula (1).

In addition, the structure, method, and the like of the above-described embodiment can be appropriately modified and implemented without departing from the scope of the object of the present invention.

11‧‧‧Workpiece 11a‧‧‧Front 11b‧‧‧Back 11c, 11d‧‧‧cut (kerf) 13‧‧‧Scheduled processing line (cutting path) 15‧‧‧ Components 21‧‧‧Cutting film 21a‧‧‧The first side 21b, 21c contact marks 23‧‧‧Frame 23a‧‧‧ opening 2‧‧‧Cutting device 4‧‧‧Abutment 4a, 4b, 4c‧‧‧ opening 6‧‧‧ cassette elevator 8‧‧‧Cassette 10‧‧‧X axis moving mechanism (processing feed mechanism) 10a‧‧‧Workbench cover 12‧‧‧Corrugated cover 14‧‧‧Chuck table (holding table) 14a‧‧‧Keep 14b‧‧‧Attraction 16‧‧‧Fixture 18‧‧‧Cutting unit 20‧‧‧Support structure 22‧‧‧Moving mechanism of cutting unit (indexing feed mechanism, cutting feed mechanism) 24‧‧‧Y axis guide 26‧‧‧Y axis moving board 28‧‧‧Y-axis ball screw 30‧‧‧Z axis guide 32‧‧‧Z moving plate 34‧‧‧Z-axis ball screw 36‧‧‧Z-axis pulse motor 38‧‧‧spindle housing 40‧‧‧spindle 42‧‧‧Cutting blade 44‧‧‧Camera (Photography unit) 46‧‧‧Blade position detection unit (setting unit) 48‧‧‧cleaning unit 50‧‧‧Control unit (setting unit) 54‧‧‧Detector 54a‧‧‧Support 54b‧‧‧Detection Department 54c‧‧‧Blade intrusion 56‧‧‧Lighting Department 58‧‧‧Receiving Department 60‧‧‧Air supply nozzle 62‧‧‧Liquid supply nozzle 64‧‧‧Connector 66‧‧‧Cover

FIG. 1 shows a perspective view of a configuration example of a workpiece and the like. 2 is a perspective view showing a configuration example of a cutting device. 3 is an enlarged perspective view of a cutting unit and a blade position detection unit. 4(A) and 4(B) of FIG. 4 show a partial cross-sectional side view of a state where a workpiece is cut and processed. 5(A) of FIG. 5 shows a plan view of a workpiece and the like after being cut, and FIG. 5(B) shows a conceptual view of the depth of contact marks. 6(A) of FIG. 6 shows a partial cross-sectional side view of a state where a workpiece is cut and processed, and FIG. 6(B) shows a plan view of the workpiece and the like after being cut and processed. FIG. 7 shows a plan view of a dicing film or the like that forms contact marks in different steps.

11‧‧‧Workpiece

11a‧‧‧Front

11c‧‧‧Notch

13‧‧‧Scheduled processing line

15‧‧‧ Components

21‧‧‧Cutting film

21a‧‧‧The first side

21b‧‧‧Contact marks

23‧‧‧Frame

23a‧‧‧ opening

42‧‧‧Cutting blade

L ₁ ‧‧‧ length

Claims (4)

A workpiece processing method, which uses a cutting device to cut a workpiece adhered with a cutting film. The cutting film is attached to an opening of a ring frame. The cutting device includes: a chuck table that holds the workpiece; a cutting unit, which is equipped with a cutting A cutting blade that cuts the workpiece held on the chuck table; and a setting unit that sets the height of the cutting unit as a reference based on the height of the front end of the outer periphery of the cutting blade; it is characterized by including the following steps: The reference setting step is to set the height of the cutting unit as the reference based on the height of the front end of the outer periphery of the cutting blade; The target setting step is to set the target height of the cutting unit in such a manner that the cutting blade cuts into the predetermined depth of the cutting film; In the first cutting step, in a state where the cutting unit is positioned at the height of the target, the workpiece is cut and processed by relatively moving the cutting unit and the chuck table; The correction value obtaining step, at the same time as the first cutting step, or after the first cutting step, based on the length of the contact trace formed on the cutting adhesive film by the cutting blade, obtains the target for correcting the cutting unit as the target The corrected value of the height; and, In the second cutting step, the workpiece is cut and processed by relatively moving the cutting unit and the chuck table in a state where the cutting unit is positioned at a height obtained by correcting the height as the target according to the correction value . The workpiece processing method as described in item 1 of the patent application scope, wherein, in the first cutting step, the cutting unit is caused to descend to the first area exposed by the cutting glue film between the workpiece and the frame to As the height of the target, the cutting unit and the card are moved in such a manner that the cutting blade moves relative to the workpiece to the second area where the cutting adhesive film is exposed on the side opposite to the first area The pallet moves relatively, forming the contact mark on the cutting adhesive film while cutting the workpiece. The workpiece processing method as described in item 1 of the patent application scope, which further includes a contact mark forming step, after the first cutting step and before the correction value obtaining step, the cutting unit is placed between the workpiece and the frame The exposed area of the dicing film decreases, and by dropping to the height as the target, the contact mark is formed on the dicing film. The workpiece processing method according to any one of claims 1 to 3, wherein in the correction value obtaining step, based on the depth of the contact mark calculated from the length of the contact mark and the outer diameter of the cutting blade, Obtain the correction value.

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