TW202003271A - Liquid agent applying device - Google Patents
Liquid agent applying device Download PDFInfo
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- TW202003271A TW202003271A TW108118861A TW108118861A TW202003271A TW 202003271 A TW202003271 A TW 202003271A TW 108118861 A TW108118861 A TW 108118861A TW 108118861 A TW108118861 A TW 108118861A TW 202003271 A TW202003271 A TW 202003271A
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- pressure chamber
- diaphragm
- liquid agent
- piezoelectric element
- intermediate member
- Prior art date
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- 239000007788 liquid Substances 0.000 title claims abstract description 84
- 239000003795 chemical substances by application Substances 0.000 claims description 60
- 239000011248 coating agent Substances 0.000 claims description 30
- 238000000576 coating method Methods 0.000 claims description 30
- 239000000463 material Substances 0.000 claims description 8
- 238000003825 pressing Methods 0.000 claims description 4
- 230000004048 modification Effects 0.000 description 10
- 238000012986 modification Methods 0.000 description 10
- 238000007789 sealing Methods 0.000 description 8
- 238000006073 displacement reaction Methods 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- -1 printing Substances 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000004043 responsiveness Effects 0.000 description 1
- 239000010979 ruby Substances 0.000 description 1
- 229910001750 ruby Inorganic materials 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/17—Ink jet characterised by ink handling
- B41J2/18—Ink recirculation systems
Landscapes
- Coating Apparatus (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
- Reciprocating Pumps (AREA)
Abstract
Description
本發明是有關於一種液劑塗布裝置。The invention relates to a liquid agent coating device.
藉由壓電效應來進行自電能朝機械能的能量轉換的壓電元件由於響應性優異,因此於半導體、印刷、化學藥品等廣泛的領域中,用於將液劑朝對象物的表面噴出的液劑塗布裝置。The piezoelectric element that performs energy conversion from electrical energy to mechanical energy by the piezoelectric effect is excellent in responsiveness. Therefore, it is used to eject a liquid agent toward the surface of an object in a wide range of fields such as semiconductors, printing, and chemicals. Liquid agent coating device.
於專利文獻1中揭示有一種液劑塗布裝置,其包括:頭部模組,具有儲存液劑的壓力室、及與所述壓力室相連的噴嘴;以及壓電元件,藉由使壓力室的壁面變形而自噴嘴中噴出液劑。[現有技術文獻][專利文獻]
[專利文獻1]日本公開公報:日本專利特開2016-187892號公報[Patent Document 1] Japanese Open Gazette: Japanese Patent Laid-Open No. 2016-187892
[發明所欲解決之課題]但是,於專利文獻1中記載的液劑塗布裝置中,因壓縮應力集中地施加至壓電元件,而存在壓電元件破損之虞、或壓電元件的耐久性下降之虞。[Problems to be Solved by the Invention] However, in the liquid coating device described in
本發明的目的在於提供一種可防止壓電元件的破損,且提昇壓電元件的耐久性的液劑塗布裝置。 [解決課題之手段]An object of the present invention is to provide a liquid agent coating device that can prevent damage to a piezoelectric element and improve the durability of the piezoelectric element. [Means to solve the problem]
本發明的一個形態的液劑塗布裝置包括壓力室板、隔膜、及加壓用驅動部。壓力室板具有儲存液劑的壓力室。隔膜配置於壓力室板上。加壓用驅動部對隔膜施加加壓振動。加壓用驅動部具有壓電元件與中間構件。中間構件與壓電元件進行面接觸,且與位於壓電元件的相反側的點接觸對象物進行點接觸。[發明的效果]The liquid agent coating device of one aspect of the present invention includes a pressure chamber plate, a diaphragm, and a driving unit for pressurization. The pressure chamber plate has a pressure chamber for storing liquid agent. The diaphragm is arranged on the pressure chamber plate. The pressure driving unit applies pressure vibration to the diaphragm. The driving unit for pressing has a piezoelectric element and an intermediate member. The intermediate member makes surface contact with the piezoelectric element, and makes point contact with a point-contact object located on the opposite side of the piezoelectric element. [Effect of invention]
根據本發明的一個形態,可提供一種可防止壓電元件的破損,且提昇壓電元件的耐久性的液劑塗布裝置。According to one aspect of the present invention, it is possible to provide a liquid agent coating device that can prevent breakage of a piezoelectric element and improve the durability of the piezoelectric element.
以下,一面參照圖式,一面對本發明的一實施方式的液劑塗布裝置進行說明。但是,本發明的範圍並不限定於以下的實施方式,可於本發明的技術思想的範圍內任意地進行變更。另外,於以下的圖式中,為了容易理解各結構,有時使各結構的比例尺及數量等與實際的結構中的比例尺及數量等不同。Hereinafter, the liquid agent coating device according to an embodiment of the present invention will be described with reference to the drawings. However, the scope of the present invention is not limited to the following embodiments, and can be arbitrarily changed within the scope of the technical idea of the present invention. In the following drawings, in order to easily understand each structure, the scale and number of each structure may be different from the scale and number of actual structures.
於本說明書中,「連接」與「接觸」是不同的概念。所謂「連接」,是指兩個構件相互固定或連結。所謂「接觸」,是指兩個構件處於直接接觸的狀態,但兩個構件未相互固定或連結。In this manual, "connection" and "contact" are different concepts. The so-called "connection" refers to two components fixed or connected to each other. The so-called "contact" means that the two members are in direct contact, but the two members are not fixed or connected to each other.
於本說明書中,所謂「平行」,是指不僅包含以物理上嚴格的意思平行的情況,亦包含實質上平行的情況的概念。所謂實質上平行,是指於15°以下的範圍內傾斜的情況。另外,所謂「垂直」,是指不僅包含以物理上嚴格的意思垂直的情況,亦包含實質上垂直的情況的概念。所謂實質上垂直,是指於15°以下的範圍內傾斜的情況。In this specification, the term "parallel" refers to a concept that includes not only a case that is physically strict but also a case that is substantially parallel. The term "substantially parallel" refers to a case of being inclined within a range of 15° or less. In addition, the term "vertical" refers to a concept that includes not only a case that is physically strictly vertical but also a case that is substantially vertical. The term substantially vertical refers to a case where it is inclined within a range of 15° or less.
(液劑塗布裝置100)一面參照圖式,一面對本實施方式的液劑塗布裝置100的結構進行說明。圖1是液劑塗布裝置100的立體圖。圖2是液劑塗布裝置100的分解立體圖。圖3是液劑塗布裝置100的剖面圖。於圖2中,為了可看見上板6的內部而僅圖示輪廓。(Liquid agent applying device 100) The structure of the liquid
液劑塗布裝置100包括驅動組件200及流路組件300。驅動組件200是產生用於噴出液劑的加壓力的單元。流路組件300是用於供給液劑的單元。The liquid
(驅動組件200)驅動組件200具有底板1及加壓用驅動部2。加壓用驅動部2包含壓電元件3、中間構件4、及鎚構件5。(Drive unit 200) The
[底板1]底板1配置於流路組件300上。底板1是用於相對於流路組件300固定壓電元件3的位置的構件。底板1具有第一柱部11、第二柱部12、樑部13、及收容凹部14。[Bottom plate 1] The
第一柱部11及第二柱部12分別形成為柱狀。樑部13將第一柱部11及第二柱部12各自的上端部連結。第一柱部11及第二柱部12分別與後述的上板6連接。藉此,相對於流路組件300對底板1進行定位。The
收容凹部14是由第一柱部11、第二柱部12、及樑部13包圍的空隙。於收容凹部14收容壓電元件3。The storage recess 14 is a gap surrounded by the
再者,底板1只要可相對於流路組件300固定壓電元件3的位置即可,其形狀並無特別限制。In addition, the shape of the
[壓電元件3]壓電元件3被收容於收容凹部14。壓電元件3配置於樑部13與中間構件4之間。壓電元件3的一端部與樑部13連接,壓電元件3的另一端部與中間構件4連接。例如可使用環氧樹脂等黏著劑將壓電元件3與樑部13及中間構件4分別連接。[Piezoelectric element 3] The
壓電元件3對應於自未圖示的控制部施加的驅動脈衝,於z軸方向上進行位移(伸縮)。壓電元件3的位移經由中間構件4及鎚構件5而傳遞至後述的隔膜7。壓電元件3至少包括一個壓電體與一對電極。壓電元件3亦可具有所謂的部分電極結構。作為壓電元件3,可使用眾所周知的各種壓電元件。本實際形態的壓電元件3形成為方柱狀,但亦可為其他形狀。The
[中間構件4]中間構件4被收容於收容凹部14。中間構件4配置於壓電元件3與鎚構件5之間。中間構件4是用於當壓電元件3進行位移時,抑制應力集中於壓電元件3的一部分的構件。[Intermediate Member 4] The
中間構件4與壓電元件3連接。例如可使用環氧樹脂等黏著劑將中間構件4與壓電元件3連接。中間構件4與壓電元件3進行面接觸。中間構件4與鎚構件5進行點接觸。中間構件4可與鎚構件5分離/連接。中間構件4的詳細的結構將後述。The
[鎚構件5]鎚構件5是與中間構件4進行點接觸的「點接觸對象物」的一例,且是承受來自中間構件4的負荷的「承受構件」的一例。鎚構件5配置於中間構件4與隔膜7之間。鎚構件5配置於上板6的貫穿孔6c內。鎚構件5與中間構件4接觸。鎚構件5可與中間構件4分離/連接。鎚構件5與隔膜7連接。例如可使用環氧樹脂等黏著劑、或藉由焊接來將鎚構件5與隔膜7連接。[Hammer member 5] The
壓電元件3的位移經由中間構件4而傳遞至鎚構件5。若壓電元件3的位移傳遞至鎚構件5,則鎚構件5作為鎚發揮功能而對隔膜7賦予慣性力。藉此,與壓電元件3的微小的位移相比,可使隔膜7相對大地進行位移。The displacement of the
鎚構件5具有抵接於隔膜7的抵接面51c。抵接面51c與隔膜7連接。於本實施方式中,抵接面51c的外緣形狀為圓形。The
本實施方式的鎚構件5形成為於z軸方向上延長的圓柱狀,但鎚構件5只要作為鎚發揮功能即可,其形狀及尺寸等並無限制。The
(流路組件300)流路組件300具有上板6、隔膜7、壓力室板8、及密封件9。(Flow path assembly 300) The
[上板6]上板6配置於隔膜7上。上板6於隔膜側表面6S與隔膜7接觸。本實施方式的隔膜側表面6S是平面。[Upper plate 6] The
上板6具有貫穿孔6c、供液通道6d、排液通道6e、及隔膜側表面6S。The
供液通道6d將自儲存罐(未圖示)經由筒式接頭61所供給的液劑朝後述的壓力室板8的流入通道81引導。於供液通道6d的入口安裝用於連接自儲存罐延長的供液管(未圖示)的筒式接頭61。排液通道6e將自後述的壓力室板8的流出通道84中排出的液劑朝外部引導。於排液通道6e的出口安裝用於連接朝外部延長的排液管(未圖示)的排液接頭62。The
[隔膜7]隔膜7形成為於x軸方向及y軸方向上延長的板狀。x軸方向是與y軸方向及z軸方向垂直的方向。y軸方向是與x軸方向及z軸方向垂直的方向。[Separator 7] The
隔膜7配置於壓力室板8上。隔膜7夾在上板6與壓力室板8之間。隔膜7於上板側表面7S與上板6接觸。隔膜7於壓力室板側表面7T與壓力室板8接觸。The
圖4是自上板側表面7S觀察隔膜7的平面圖。隔膜7具有供液孔7e、排液孔7f、及可撓區域7g。4 is a plan view of the
供液孔7e與上板6的供液通道6d及後述的壓力室板8的流入通道81相連。排液孔7f與上板6的排液通道6e及後述的壓力室板8的流出通道84相連。The
可撓區域7g是隔膜7的一部分。可撓區域7g是隔膜7之中不接觸上板6與壓力室板8的區域。於可撓區域7g上配置加壓用驅動部2。於可撓區域7g連接有鎚構件5的抵接面51c。俯視下的可撓區域7g的外緣形狀是與鎚構件5的抵接面51c相同的圓形。The flexible region 7g is a part of the
可撓區域7g覆蓋後述的壓力室板8的壓力室82。壓電元件3的位移經由中間構件4及鎚構件5而傳遞至可撓區域7g,藉此可撓區域7g於z軸方向上彈性地振動。如此,實質上隔膜7之中作為振動膜發揮功能的僅為可撓區域7g。The flexible region 7g covers the
[壓力室板8]壓力室板8形成為於x軸方向及y軸方向上延長的板狀。於壓力室板8上配置隔膜7。壓力室板8與隔膜7平行地配置。壓力室板8於接觸面8S與隔膜7接觸。於本實施方式中,壓力室板8的尺寸與隔膜7的尺寸相等。[Pressure chamber plate 8] The
圖5是自接觸面8S觀察壓力室板8的平面圖。圖6是自接觸面8S觀察壓力室板8的立體圖。圖7是於圖5的A-A線上,將隔膜7、壓力室板8、及密封件9切斷的剖面圖。圖7是與接觸面8S垂直的剖面。FIG. 5 is a plan view of the
壓力室板8具有流入通道81、壓力室82、噴嘴83、流出通道84、及密封槽85。The
流入通道81包含形成於接觸面8S的第一凹部C1。流入通道81藉由第一凹部C1由隔膜7堵塞來形成。流入通道81沿著接觸面8S延長。本實施方式的流入通道81與x軸方向平行地延長。如此,不於壓力室板8的內部形成貫穿孔,藉由利用隔膜7堵塞形成於壓力室板8的表面的凹部來形成流入通道81。因此,可使壓力室板8薄型化,因此可實現液劑塗布裝置100的小型化。The
如圖7所示,流入通道81具有矩形剖面。與接觸面8S平行的y軸方向(面方向的一例)上的流入通道81的寬度W1比與接觸面8S垂直的z軸方向(厚度方向的一例)上的流入通道81的高度H1大。即,流入通道81的高度H1對於寬度W1的比小於1。因此,藉由將流入通道81形成為扁平,可使壓力室板8進一步薄型化,因此使壓力室82的體積變小,藉此可使與隔膜7的振動量對應的壓力室82的體積變化率變大。其結果,即便隔膜7的加壓力小,亦可對壓力室82內的液劑進行大的加壓,可有效率地傳遞加壓力,因此能夠以更低的功耗自噴嘴83中噴出黏度更高的液劑。As shown in FIG. 7, the
流入通道81的一端部與隔膜7的供液孔7e相連。經由隔膜7的供液孔7e與上板6的供液通道6d而朝流入通道81供給液劑。流入通道81的另一端部與壓力室82相連。已被供給至流入通道81的液劑流入壓力室82。流入通道81的詳細的結構將後述。One end of the
壓力室82包含形成於接觸面8S的第二凹部C2。壓力室82藉由第二凹部C2由隔膜7堵塞來形成。因此,可使壓力室板8薄型化,因此使壓力室82的體積變小,藉此可使與隔膜7的振動量對應的壓力室82的體積變化率變大。第二凹部C2(即,壓力室82)的外緣形狀是與鎚構件5的抵接面51c及隔膜7的可撓區域7g相同的圓形。隔膜7的可撓區域7g的範圍由第二凹部C2的外緣來規定。The
壓力室82儲存自流入通道81流入的液劑。已被儲存於壓力室82的液劑被自噴嘴83噴出。另外,為了去除已混入壓力室82的氣泡,有時自流出通道84排出已被儲存於壓力室82的液劑。壓力室82的詳細的結構將後述。The
噴嘴83與壓力室82相連。噴嘴83是貫穿壓力室板8的孔。噴嘴83於壓力室板8的外表面8T開口。噴嘴83於z軸方向上與隔膜7相向。於俯視接觸面8S時,噴嘴83配置於壓力室82的內側。於俯視接觸面8S時,噴嘴83配置於壓力室82的中央。噴嘴83的外緣形狀是與壓力室82相同的圓形。已被儲存於壓力室82的液劑被自噴嘴83朝外部噴出。噴嘴83的詳細的結構將後述。The
流出通道84包含形成於接觸面8S的第三凹部C3。流出通道84藉由第三凹部C3由隔膜7堵塞來形成。因此,可使壓力室板8薄型化,因此使壓力室82的體積變小,藉此可使與隔膜7的振動量對應的壓力室82的體積變化率變大。流出通道84沿著接觸面8S延長。本實施方式的流出通道84與x軸方向平行地延長。流出通道84的一端部與壓力室82相連。流入通道81的另一端部與隔膜7的排液孔7f相連。當去除已混入壓力室82的氣泡時,自流出通道84經由隔膜7的排液孔7f與上板6的排液通道6e而朝外部排出液劑。The
密封槽85形成於接觸面8S。於俯視接觸面8S時,密封槽85設置於第一凹部C1至第三凹部C3的周圍。密封槽85沿著第一凹部C1至第三凹部C3的外緣來設置。密封槽85包圍第一凹部C1至第三凹部C3的整體。密封槽85形成為環狀。The sealing
[密封件9]如圖7所示,密封件9夾在隔膜7與壓力室板8之間。密封件9配置於壓力室板8的密封槽85。密封件9包圍壓力室板8的流入通道81、壓力室82、及流出通道84。密封件9於已配置於密封槽85的狀態下被按壓在隔膜7。藉此,確保流入通道81、壓力室82、及流出通道84的液密性及氣密性。密封件9例如可包含橡膠等彈性構件。[Seal 9] As shown in FIG. 7, the
(流入通道81及噴嘴83的流路阻力)於本實施方式中,噴嘴83的流路阻力對於流入通道81的流路阻力的比為1以上。即,噴嘴83的流路阻力與流入通道81的流路阻力相同、或比流入通道81的流路阻力大。因此,當自噴嘴83中連續地噴出液劑時,可自流入通道81朝壓力室82順暢地補充液劑。(Flow resistance of the
噴嘴83的流路阻力對於流入通道81的流路阻力的比較佳為2以下。即,噴嘴83的流路阻力較佳為流入通道81的流路阻力的2倍以下。藉此,當自加壓用驅動部2對隔膜7(具體而言,可撓區域7g)施加加壓振動,壓力室82的體積已變小時,可抑制液劑自壓力室82朝流入通道81倒流。其結果,可對應於隔膜7的加壓振動,自噴嘴83中順暢地噴出液劑。The comparison of the flow path resistance of the
流入通道81的流路阻力藉由橫跨流入通道81的全長進行剖面分析來算出。同樣地,噴嘴83的流路阻力藉由橫跨噴嘴83的全長進行剖面分析來算出。於所述剖面分析中,可根據用於算出壓力損失的下述的通式(1)來算出流路阻力。The flow path resistance of the
p1-p2=U×(8×μ×L)/(π×r4 )・・・(1)再者,於式(1)中,p1-p2為壓力損失,p1為流入側的壓力(單位:Pa),p2為流出側的壓力(單位:Pa)。另外,於式(1)中,μ為黏性係數(單位:N・sec/m2 ),L為流路長度(單位:m),r為流路半徑(單位:m),U為流量(單位:m3 /sec)。p1-p2=U×(8×μ×L)/(π×r 4 )... (1) Furthermore, in formula (1), p1-p2 is the pressure loss, and p1 is the pressure on the inflow side ( Unit: Pa), p2 is the pressure on the outflow side (unit: Pa). In addition, in formula (1), μ is the viscosity coefficient (unit: N·sec/m 2 ), L is the flow path length (unit: m), r is the flow path radius (unit: m), and U is the flow rate (Unit: m 3 /sec).
(壓力室82及噴嘴83的形狀)圖8是於圖5的B-B線上將液劑塗布裝置100切斷的剖面圖。圖8是與壓力室板8的接觸面8S垂直的剖面。(Shapes of the
壓力室82(第二凹部C2)朝向噴嘴83整體上形成為錐狀。壓力室82具有朝向噴嘴83前端變細的形狀。因此,與接觸面8S平行的x軸方向(面方向的一例)上的壓力室82的寬度W2自隔膜7越接近噴嘴83,變得越狹窄。The pressure chamber 82 (second recess C2) is formed in a tapered shape toward the
藉此,可使壓力室82的體積變小,因此可使與隔膜7(具體而言,可撓區域7g)的振動量對應的壓力室82的體積變化率變大。其結果,即便隔膜7的加壓力小,亦可對壓力室82內的液劑進行大的加壓,可有效率地傳遞加壓力,因此能夠以更低的功耗自噴嘴83中噴出黏度更高的液劑。尤其,於本實施方式中,藉由第一凹部C1來構成流入通道81,藉此可謀求壓力室板8的薄型化,容易使壓力室82的體積進一步變小,因此可更有效率地將加壓力傳遞至液劑。另外,與將壓力室82形成為圓柱狀的情況相比,可使噴嘴83周邊的壓力室板8的壁厚變厚,因此即便縮短噴嘴83的全長而減少了流路阻力,亦可確保壓力室板8的剛性。With this, the volume of the
另外,x軸方向上的壓力室82的全寬W2max比z軸方向(厚度方向的一例)上的壓力室82的全高H2max大。如此,藉由將壓力室82形成為扁平,可使壓力室板8薄型化,因此可實現液劑塗布裝置100的小型化。再者,壓力室82的全高H2max是z軸方向上的隔膜7與噴嘴83的距離。In addition, the total width W2max of the
壓力室82的全寬W2max對於全高H2max的比較佳為10以上。即,壓力室82的全寬W2max較佳為全高H2max的10倍以上。藉此,可更有效率地對液劑傳遞來自隔膜7的加壓力,並且可實現液劑塗布裝置100的進一步的小型化。The comparison of the full width W2max of the
於本實施方式中,壓力室82的剖面為圓錐台形狀。詳細而言,壓力室82具有將隔膜7的可撓區域7g作為底面的圓錐之中頂點部分已被去除的剖面形狀。因此,壓力室82的內側面82S成為圓錐面之中頂點部分已被去除的部分圓錐面。但是,壓力室82只要朝向噴嘴83形成為錐狀即可,其剖面並不限定於圓錐台形狀。In this embodiment, the cross section of the
噴嘴83朝向外表面8T整體上形成為錐狀。噴嘴83具有朝向外表面8T前端變細的形狀。因此,與接觸面8S平行的x軸方向上的噴嘴83的寬度W3越遠離壓力室82,變得越狹窄。The
於本實施方式中,噴嘴83的剖面為圓錐台形狀。詳細而言,噴嘴83具有將壓力室82作為底面的圓錐之中頂點部分已被去除的剖面形狀。因此,噴嘴83的內側面83S成為圓錐面之中頂點部分已被去除的部分圓錐面。但是,噴嘴83只要朝向外表面8T形成為錐狀即可,其剖面並不限定於圓錐台形狀。In this embodiment, the
此處,與壓力室82的內側面82S相比,噴嘴83的內側面83S相對於接觸面8S的傾斜大。即,噴嘴83的內側面83S相對於x-y平面,比壓力室82的內側面82S更大地傾斜。因此,可使噴嘴83周邊的壓力室板8的壁厚變厚,因此可確保噴嘴83周邊的剛性。Here, the
另外,如圖8所示,噴嘴83的中心軸83A與壓力室82的中心軸82A一致。因此,可有效率地自壓力室82朝噴嘴83傳遞加壓力,因此可更順暢地自噴嘴83中噴出液劑。In addition, as shown in FIG. 8, the
進而,加壓用驅動部2的中心軸2A與壓力室82的中心軸82A及噴嘴83的中心軸83A分別一致。因此,可有效率地自加壓用驅動部2朝壓力室82傳遞加壓力,因此可更順暢地自噴嘴83中噴出液劑。Furthermore, the
(中間構件4的結構)圖9是中間構件4的立體圖。(Structure of the intermediate member 4) FIG. 9 is a perspective view of the
中間構件4與壓電元件3的前端連接。中間構件4具有與壓電元件3連接的平面4S。平面4S形成為平面狀。The
中間構件4具有設置於平面4S的相反側的曲面4T。曲面4T與鎚構件5進行點接觸(參照圖8)。曲面4T可為球面的一部分,亦可為彎曲面。藉由使曲面4T與鎚構件5進行點接觸,可提昇壓電元件3的耐久性。The
再者,本實施方式的中間構件4形成為半球狀,但只要具有平面4S與曲面4T即可,其形狀及尺寸並無特別限制。In addition, the
中間構件4較佳為包含硬度比鎚構件5大的材料。另外,中間構件4較佳為包含耐磨耗性比鎚構件5高的材料。作為此種材料,例如可列舉:麻田散鐵系不銹鋼(例如SUS440等)、陶瓷系材料(例如氧化鋁等)、及紅寶石等。藉此,可減少通常藉由黏著劑來與壓電元件3連接的中間構件4磨耗或變形而將中間構件4與壓電元件3一同更換的次數,因此可抑制維護時間與維護成本。The
(特徵)本實施方式的加壓用驅動部2具有配置於隔膜7上的鎚構件5、配置於鎚構件5上的中間構件4、及配置於中間構件4上的壓電元件3。中間構件4與鎚構件5進行點接觸,與壓電元件3進行面接觸。因此,藉由經由中間構件4,可均等地傳遞自鎚構件5施加至壓電元件3的力。其結果,可抑制於壓電元件3的內部產生集中的壓縮應力,因此可防止壓電元件3的破損,且提昇耐久性。另外,壓電元件3與配置於隔膜7的鎚構件5進行點接觸,因此可放寬相對於隔膜7的壓電元件3的組裝位置,特別是組裝角度的容許誤差,因此可謀求由設計公差的放寬所引起的製作零件的低成本化、以及組裝步驟的簡化。(Features) The pressurizing
(實施方式的變形例)本發明雖然由所述實施方式來記載,但構成本揭示的一部分的論述及圖式不應理解為限定本發明者。對於本領域從業人員而言,各種替代實施方式、實施例及運用技術根據本揭示而變得明確。(Modification of Embodiment) Although the present invention is described by the above-mentioned embodiment, the description and drawings constituting a part of the present disclosure should not be construed as limiting the present inventor. For those skilled in the art, various alternative embodiments, examples, and application techniques will become clear from the present disclosure.
[變形例1]於所述實施方式的壓力室板8中,流入通道81、壓力室82、及流出通道84形成於接觸面8S,但亦可分別形成於壓力室板8的內部。於此情況下,液劑塗布裝置100亦可不包括密封件9。[Modification 1] In the
[變形例2]所述實施方式的壓力室板8具有流出通道84,但亦可不具有流出通道84。[Modification 2] The
[變形例3]所述實施方式的壓力室82的寬度W2越接近噴嘴83越狹窄,但並不限定於此。[Modification 3] The width W2 of the
[變形例4]所述實施方式的噴嘴83的寬度W3越遠離壓力室82越狹窄,但並不限定於此。[Modification 4] The width W3 of the
[變形例5]所述實施方式的隔膜7的尺寸與壓力室板8的尺寸相等,但隔膜7只要是可覆蓋流入通道81、壓力室82、及流出通道84的尺寸即可。[Modification 5] The size of the
[變形例6]於所述實施方式中,將第一柱部11及第二柱部12與上板6連接,藉此相對於流路組件300對底板1進行定位,但底板1的定位方法可適宜變更。[Modification 6] In the above embodiment, the
[變形例7]於所述實施方式中,隔膜7、壓力室板8、及上板6相互連接,但例如亦可藉由螺釘來相互連結。[Modification 7] In the above embodiment, the
[變形例8]於所述實施方式中,加壓用驅動部2具有壓電元件3、中間構件4、及鎚構件5,但亦可不具有鎚構件5。於此情況下,中間構件4與隔膜7直接進行點接觸,因此隔膜7成為「點接觸對象物」。[Modification 8] In the above-described embodiment, the driving
[變形例9] 雖然於所述實施方式中未特別提及,但流路組件300之中與液劑接觸的構件(上板6、隔膜7、及壓力室板8)較佳為包含具有對於液劑的耐蝕性的材料。但是,若利用耐蝕性膜等包覆該些構件之中與液劑接觸的面,則可採用各種構成材料。[Modification 9] Although not specifically mentioned in the above embodiment, the members (
1‧‧‧底板2‧‧‧加壓用驅動部2A、82A、83A‧‧‧中心軸3‧‧‧壓電元件4‧‧‧中間構件4S‧‧‧平面4T‧‧‧曲面5‧‧‧鎚構件6‧‧‧上板6c‧‧‧貫穿孔6d‧‧‧供液通道6e‧‧‧排液通道6S‧‧‧隔膜側表面7‧‧‧隔膜7e‧‧‧供液孔7f‧‧‧排液孔7g‧‧‧可撓區域7S‧‧‧上板側表面7T‧‧‧壓力室板側表面8‧‧‧壓力室板8S‧‧‧接觸面8T‧‧‧外表面9‧‧‧密封件11‧‧‧第一柱部12‧‧‧第二柱部13‧‧‧樑部14‧‧‧收容凹部51c‧‧‧抵接面61‧‧‧筒式接頭62‧‧‧排液接頭81‧‧‧通道82‧‧‧壓力室82S、83S‧‧‧內側面83‧‧‧噴嘴84‧‧‧流出通道85‧‧‧密封槽100‧‧‧液劑塗布裝置200‧‧‧驅動組件300‧‧‧流路組件C1‧‧‧第一凹部C2‧‧‧第二凹部C3‧‧‧第三凹部H1‧‧‧高度H2max‧‧‧全高W1、W2、W3‧‧‧寬度W2max‧‧‧全寬1‧‧‧Bottom plate 2‧‧‧Pressure drive unit 2A, 82A, 83A‧‧‧Central axis 3‧‧‧Piezo element 4‧‧‧Intermediate member 4S‧‧‧Flat surface 4T‧‧‧Curved surface 5‧‧ ‧Hammer member 6‧‧‧Upper plate 6c ‧‧‧Through hole 6d ‧‧‧ Liquid supply channel 6e ‧‧‧ Discharge channel 6S ‧‧‧ Diaphragm side surface 7 ‧‧Drain hole 7g‧‧‧Flexible area 7S‧‧‧Upper plate side surface 7T‧‧‧Pressure chamber plate side surface 8‧‧‧Pressure chamber plate 8S‧‧‧Contact surface 8T‧‧‧Outer surface 9‧ ‧‧Seal 11‧‧‧First column part 12‧‧‧Second column part 13‧‧‧Beam part 14‧‧‧Receiving recess 51c‧‧‧Abutment surface 61‧‧‧Cylinder joint 62‧‧‧ Discharge connector 81‧‧‧channel 82‧‧‧ pressure chamber 82S, 83S‧‧‧inner side 83‧‧‧nozzle 84‧‧‧outflow channel 85‧‧‧sealing tank 100‧‧‧liquid agent coating device 200‧‧ ‧Drive assembly 300‧‧‧Flow path assembly C1‧‧‧The first concave part C2‧‧‧Second concave part C3‧‧‧‧The third concave part H1‧‧‧Height H2max W2max‧‧‧full width
圖1是液劑塗布裝置的立體圖。圖2是液劑塗布裝置的分解立體圖。圖3是液劑塗布裝置的剖面圖。圖4是隔膜的平面圖。圖5是壓力室板的平面圖。圖6是壓力室板的立體圖。圖7是隔膜、壓力室板及密封件的剖面圖。圖8是液劑塗布裝置100的剖面圖。 圖9是中間構件的立體圖。FIG. 1 is a perspective view of a liquid agent application device. Fig. 2 is an exploded perspective view of a liquid agent coating device. 3 is a cross-sectional view of a liquid agent coating device. 4 is a plan view of the diaphragm. Fig. 5 is a plan view of the pressure chamber plate. 6 is a perspective view of a pressure chamber plate. 7 is a cross-sectional view of a diaphragm, a pressure chamber plate, and a seal. FIG. 8 is a cross-sectional view of the liquid
3‧‧‧壓電元件 3‧‧‧ Piezoelectric element
4‧‧‧中間構件 4‧‧‧Intermediate component
4S‧‧‧平面 4S‧‧‧Plane
4T‧‧‧曲面 4T‧‧‧Surface
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| WO2022181736A1 (en) * | 2021-02-24 | 2022-09-01 | 国立大学法人山形大学 | Inkjet head, method for producing same, method for producing semiconductor device using same, and printing device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002143746A (en) * | 2000-11-08 | 2002-05-21 | Matsushita Electric Ind Co Ltd | Fluid supply device and fluid supply method |
| JP4881126B2 (en) * | 2006-10-25 | 2012-02-22 | 株式会社東芝 | Nozzle plate manufacturing method and droplet discharge head manufacturing method |
| KR20190113908A (en) * | 2017-03-27 | 2019-10-08 | 니혼 덴산 가부시키가이샤 | Droplet ejection device |
-
2019
- 2019-05-29 WO PCT/JP2019/021334 patent/WO2019230816A1/en not_active Ceased
- 2019-05-29 JP JP2020522257A patent/JP7212389B2/en active Active
- 2019-05-31 TW TW108118861A patent/TW202003271A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JP7212389B2 (en) | 2023-01-25 |
| JPWO2019230816A1 (en) | 2021-07-29 |
| WO2019230816A1 (en) | 2019-12-05 |
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