TW202012135A - 劃線方法 - Google Patents
劃線方法 Download PDFInfo
- Publication number
- TW202012135A TW202012135A TW108127865A TW108127865A TW202012135A TW 202012135 A TW202012135 A TW 202012135A TW 108127865 A TW108127865 A TW 108127865A TW 108127865 A TW108127865 A TW 108127865A TW 202012135 A TW202012135 A TW 202012135A
- Authority
- TW
- Taiwan
- Prior art keywords
- section
- load
- substrate
- scribing
- wheel
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 182
- 238000000034 method Methods 0.000 title claims abstract description 83
- 238000003825 pressing Methods 0.000 claims abstract description 5
- 238000013077 scoring method Methods 0.000 claims description 18
- 238000012986 modification Methods 0.000 description 91
- 230000004048 modification Effects 0.000 description 91
- 239000011521 glass Substances 0.000 description 32
- 238000010586 diagram Methods 0.000 description 23
- 238000001514 detection method Methods 0.000 description 20
- 230000008569 process Effects 0.000 description 20
- 238000012795 verification Methods 0.000 description 9
- 230000009471 action Effects 0.000 description 6
- 230000007246 mechanism Effects 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 238000012545 processing Methods 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/037—Controlling or regulating
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Dicing (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018184292A JP2020050570A (ja) | 2018-09-28 | 2018-09-28 | スクライブ方法 |
| JP2018-184292 | 2018-09-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW202012135A true TW202012135A (zh) | 2020-04-01 |
Family
ID=69995754
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW108127865A TW202012135A (zh) | 2018-09-28 | 2019-08-06 | 劃線方法 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2020050570A (ko) |
| KR (1) | KR20200036721A (ko) |
| CN (1) | CN110962245A (ko) |
| TW (1) | TW202012135A (ko) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102457343B1 (ko) * | 2020-12-14 | 2022-10-21 | 한국미쯔보시다이아몬드공업(주) | 단자부를 갖는 접합 취성 기판의 스크라이빙 방법 |
| JP7749447B2 (ja) | 2021-12-20 | 2025-10-06 | キオクシア株式会社 | 半導体装置および制御方法 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6897951B2 (ja) | 2016-12-28 | 2021-07-07 | 三星ダイヤモンド工業株式会社 | カッターホイール |
-
2018
- 2018-09-28 JP JP2018184292A patent/JP2020050570A/ja active Pending
-
2019
- 2019-07-31 KR KR1020190092805A patent/KR20200036721A/ko not_active Withdrawn
- 2019-08-06 TW TW108127865A patent/TW202012135A/zh unknown
- 2019-08-23 CN CN201910788336.1A patent/CN110962245A/zh active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JP2020050570A (ja) | 2020-04-02 |
| CN110962245A (zh) | 2020-04-07 |
| KR20200036721A (ko) | 2020-04-07 |
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