TW202015158A - 遮罩移送系統及框架一體型遮罩的製造方法 - Google Patents

遮罩移送系統及框架一體型遮罩的製造方法 Download PDF

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Publication number
TW202015158A
TW202015158A TW108127574A TW108127574A TW202015158A TW 202015158 A TW202015158 A TW 202015158A TW 108127574 A TW108127574 A TW 108127574A TW 108127574 A TW108127574 A TW 108127574A TW 202015158 A TW202015158 A TW 202015158A
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TW
Taiwan
Prior art keywords
mask
frame
temperature
loading
unit
Prior art date
Application number
TW108127574A
Other languages
English (en)
Chinese (zh)
Inventor
李炳一
Original Assignee
南韓商Tgo科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 南韓商Tgo科技股份有限公司 filed Critical 南韓商Tgo科技股份有限公司
Publication of TW202015158A publication Critical patent/TW202015158A/zh

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3222—Loading to or unloading from a conveyor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Electroluminescent Light Sources (AREA)
TW108127574A 2018-08-08 2019-08-02 遮罩移送系統及框架一體型遮罩的製造方法 TW202015158A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020180092533A KR102283202B1 (ko) 2018-08-08 2018-08-08 마스크의 이송 시스템 및 프레임 일체형 마스크의 제조 방법
KR10-2018-0092533 2018-08-08

Publications (1)

Publication Number Publication Date
TW202015158A true TW202015158A (zh) 2020-04-16

Family

ID=69415571

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108127574A TW202015158A (zh) 2018-08-08 2019-08-02 遮罩移送系統及框架一體型遮罩的製造方法

Country Status (3)

Country Link
KR (1) KR102283202B1 (fr)
TW (1) TW202015158A (fr)
WO (1) WO2020032511A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102724543B1 (ko) * 2020-07-23 2024-11-04 삼성디스플레이 주식회사 마스크 척 및 이를 포함하는 마스크 제조 장치
KR102929156B1 (ko) 2020-08-31 2026-02-24 삼성디스플레이 주식회사 마스크, 이의 제조 방법, 및 표시 패널 제조 방법
CN115505872B (zh) * 2022-09-28 2025-02-07 昆山国显光电有限公司 掩膜板组件

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100671658B1 (ko) * 2005-01-05 2007-01-19 삼성에스디아이 주식회사 마스크 프레임 및 이를 사용한 마스크 고정방법
KR100947442B1 (ko) * 2007-11-20 2010-03-12 삼성모바일디스플레이주식회사 수직 증착형 마스크 제조장치 및 이를 이용한 수직 증착형마스크의 제조방법
KR101876331B1 (ko) * 2011-10-20 2018-07-10 엘지디스플레이 주식회사 마스크, 그 제조 방법 및 그를 제조하기 위한 스트레처
KR101969955B1 (ko) * 2012-10-25 2019-04-18 삼성디스플레이 주식회사 평판표시장치용 증착 마스크 조립체 제조장치
KR20140123844A (ko) * 2013-04-15 2014-10-23 주식회사 원익아이피에스 박막 증착 시스템의 얼라인장치의 마스크 어셈블리
KR20160049963A (ko) * 2014-10-28 2016-05-10 에스엔유 프리시젼 주식회사 증착용 마스크 장착장치
KR102082784B1 (ko) * 2014-12-11 2020-03-02 삼성디스플레이 주식회사 마스크 프레임 조립체, 그 제조 방법 및 유기 발광 표시 장치의 제조 방법
KR101764023B1 (ko) * 2015-11-25 2017-08-14 주식회사 야스 마스크와 기판 트레이가 일체로 된 기판이송시스템

Also Published As

Publication number Publication date
WO2020032511A1 (fr) 2020-02-13
KR102283202B1 (ko) 2021-07-30
KR20200017217A (ko) 2020-02-18

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