TW202025970A - 用於微機械超音波換能器腔室的吸氣技術 - Google Patents

用於微機械超音波換能器腔室的吸氣技術 Download PDF

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Publication number
TW202025970A
TW202025970A TW108141022A TW108141022A TW202025970A TW 202025970 A TW202025970 A TW 202025970A TW 108141022 A TW108141022 A TW 108141022A TW 108141022 A TW108141022 A TW 108141022A TW 202025970 A TW202025970 A TW 202025970A
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TW
Taiwan
Prior art keywords
layer
getter material
diffusion barrier
material layer
forming
Prior art date
Application number
TW108141022A
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English (en)
Chinese (zh)
Inventor
凱斯 Ｇ 法菲
繆淩雲
建威 劉
強納森 Ｍ 羅斯貝格
Original Assignee
美商蝴蝶網路公司
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Filing date
Publication date
Application filed by 美商蝴蝶網路公司 filed Critical 美商蝴蝶網路公司
Publication of TW202025970A publication Critical patent/TW202025970A/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/0292—Electrostatic transducers, e.g. electret-type
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
    • A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
    • A61B8/4483—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer
    • A61B8/4494—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer characterised by the arrangement of the transducer elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems ; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0035—Packages or encapsulation for maintaining a controlled atmosphere inside of the chamber containing the MEMS
    • B81B7/0038—Packages or encapsulation for maintaining a controlled atmosphere inside of the chamber containing the MEMS using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00277—Processes for packaging MEMS devices for maintaining a controlled atmosphere inside of the cavity containing the MEMS
    • B81C1/00285—Processes for packaging MEMS devices for maintaining a controlled atmosphere inside of the cavity containing the MEMS using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B2562/00—Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
    • A61B2562/12—Manufacturing methods specially adapted for producing sensors for in-vivo measurements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B2201/00—Indexing scheme associated with B06B1/0207 for details covered by B06B1/0207 but not provided for in any of its subgroups
    • B06B2201/70—Specific application
    • B06B2201/76—Medical, dental
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0271—Resonators; ultrasonic resonators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/01—Suspended structures, i.e. structures allowing a movement
    • B81B2203/0127—Diaphragms, i.e. structures separating two media that can control the passage from one medium to another; Membranes, i.e. diaphragms with filtering function
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/03—Static structures
    • B81B2203/0315—Cavities
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/04—Electrodes
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R17/00—Piezoelectric transducers; Electrostrictive transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/003—Mems transducers or their use
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Mechanical Engineering (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Animal Behavior & Ethology (AREA)
  • Pathology (AREA)
  • Radiology & Medical Imaging (AREA)
  • Biomedical Technology (AREA)
  • Biophysics (AREA)
  • Medical Informatics (AREA)
  • Molecular Biology (AREA)
  • Surgery (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • General Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Veterinary Medicine (AREA)
  • Physics & Mathematics (AREA)
  • Gynecology & Obstetrics (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Micromachines (AREA)
TW108141022A 2018-11-13 2019-11-12 用於微機械超音波換能器腔室的吸氣技術 TW202025970A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201862760887P 2018-11-13 2018-11-13
US62/760,887 2018-11-13

Publications (1)

Publication Number Publication Date
TW202025970A true TW202025970A (zh) 2020-07-16

Family

ID=70551495

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108141022A TW202025970A (zh) 2018-11-13 2019-11-12 用於微機械超音波換能器腔室的吸氣技術

Country Status (7)

Country Link
US (1) US11638931B2 (fr)
EP (1) EP3880373A4 (fr)
CN (1) CN113039024A (fr)
AU (1) AU2019379545A1 (fr)
CA (1) CA3118563A1 (fr)
TW (1) TW202025970A (fr)
WO (1) WO2020102130A1 (fr)

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EP3788798B1 (fr) 2018-05-03 2023-07-05 BFLY Operations, Inc. Transducteurs ultrasonores avec orifices de pression
WO2020163595A1 (fr) 2019-02-07 2020-08-13 Butterfly Network, Inc Électrode métallique bicouche pour dispositifs transducteurs ultrasonores micro-usinés
US11501562B2 (en) 2019-04-30 2022-11-15 Bfly Operations, Inc. Ultrasound face scanning and identification apparatuses and methods
US11684951B2 (en) 2019-08-08 2023-06-27 Bfly Operations, Inc. Micromachined ultrasonic transducer devices having truncated circle shaped cavities
FR3101414B1 (fr) * 2019-09-30 2021-09-03 Commissariat Energie Atomique procede de fabrication d’un dispositif de detection de rayonnement electromagnétique comportant un materiau getter
US11260424B2 (en) * 2020-01-20 2022-03-01 The Board Of Trustees Of The Leland Stanford Junior University Contoured electrode for capacitive micromachined ultrasonic transducer
US11988640B2 (en) 2020-03-11 2024-05-21 Bfly Operations, Inc. Bottom electrode material stack for micromachined ultrasonic transducer devices
TW202240165A (zh) 2021-03-04 2022-10-16 美商蝴蝶營運公司 具有柱腳的微加工超音波換能器
US12246348B2 (en) 2021-03-04 2025-03-11 BFLY Operations, Inc Capacitive Micromachined ultrasonic transducers (CMUTs) having non-uniform pedestals
CN117427864A (zh) * 2022-07-14 2024-01-23 苏州佳世达电通有限公司 超声波换能模组及超声波探头
US20250058353A1 (en) * 2023-08-16 2025-02-20 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor ultrasonic transducer device and methods of formation

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US7839722B2 (en) 2007-09-20 2010-11-23 Siemens Medical Solutions Usa, Inc. Microfabricated acoustic transducer with a multilayer electrode
AU2009243918A1 (en) 2008-05-07 2009-11-12 Signostics Limited Docking system for medical diagnostic scanning using a handheld device
US7989266B2 (en) * 2009-06-18 2011-08-02 Aptina Imaging Corporation Methods for separating individual semiconductor devices from a carrier
US8222065B1 (en) * 2009-10-02 2012-07-17 National Semiconductor Corporation Method and system for forming a capacitive micromachined ultrasonic transducer
KR20130078965A (ko) * 2012-01-02 2013-07-10 에스케이하이닉스 주식회사 다성분계 유전막 형성 방법 및 반도체장치 제조 방법
US9533873B2 (en) 2013-02-05 2017-01-03 Butterfly Network, Inc. CMOS ultrasonic transducers and related apparatus and methods
AU2014293274B2 (en) 2013-07-23 2018-11-01 Butterfly Network, Inc. Interconnectable ultrasound transducer probes and related methods and apparatus
US9242853B2 (en) 2013-10-15 2016-01-26 Taiwan Semiconductor Manufacturing Co., Ltd. Method of improving getter efficiency by increasing superficial area
KR20150065067A (ko) 2013-12-04 2015-06-12 삼성전자주식회사 정전용량 미세가공 초음파 변환기 및 그 제조방법
US9067779B1 (en) 2014-07-14 2015-06-30 Butterfly Network, Inc. Microfabricated ultrasonic transducers and related apparatus and methods
US9422149B2 (en) 2014-07-25 2016-08-23 Semiconductor Manufacturing International (Shanghai) Corporation Trapped sacrificial structures and methods of manufacturing same using thin-film encapsulation
US20160009544A1 (en) 2015-03-02 2016-01-14 Butterfly Network, Inc. Microfabricated ultrasonic transducers and related apparatus and methods
EP3642611B1 (fr) 2017-06-21 2024-02-14 Butterfly Network, Inc. Transducteur à ultrasons microfabriqué ayant des cellules individuelles comportant des sections d'électrode électriquement isolées
EP3745961B1 (fr) 2018-01-30 2025-10-01 BFLY Operations, Inc. Procédés et appareils d'emballage d'une puce à ultrasons
US11590532B2 (en) 2018-03-09 2023-02-28 Bfly Operations, Inc. Ultrasound transducer devices and methods for fabricating ultrasound transducer devices
TW201947717A (zh) 2018-05-03 2019-12-16 美商蝴蝶網路公司 用於超音波晶片的垂直封裝及相關方法
EP3788798B1 (fr) 2018-05-03 2023-07-05 BFLY Operations, Inc. Transducteurs ultrasonores avec orifices de pression
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JP2021529459A (ja) 2018-07-06 2021-10-28 バタフライ ネットワーク，インコーポレイテッド 超音波オンチップをパッケージングする方法及び装置
WO2020069252A1 (fr) 2018-09-28 2020-04-02 Butterfly Network, Inc. Techniques de fabrication et structures de matériaux filtres dans des cavités de transducteur ultrasonore

Also Published As

Publication number Publication date
US11638931B2 (en) 2023-05-02
CA3118563A1 (fr) 2020-05-22
AU2019379545A1 (en) 2021-05-27
WO2020102130A1 (fr) 2020-05-22
US20200147641A1 (en) 2020-05-14
CN113039024A (zh) 2021-06-25
EP3880373A4 (fr) 2022-07-20
EP3880373A1 (fr) 2021-09-22

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