TW202425198A - Substrate processing apparatus and substrate processing method - Google Patents

Abstract

The present invention relates to a substrate processing device and a substrate processing method that can precisely align upper and lower wafers when bonding wafers, which may include: a first base for clamping a first substrate; a second base for clamping a second substrate to bond the second substrate to the first substrate; a first camera device for photographing the first substrate to align the first substrate; a second camera device for photographing the second substrate to align the second substrate; and a control unit that uses the first camera device to align the first substrate, aligns the optical axes of the first camera device and the second camera device, and uses the aligned second camera device to align the second substrate.

Description

Substrate processing device and substrate processing method

The present invention relates to a substrate processing device and a substrate processing method, and more particularly to a substrate processing device and a substrate processing method capable of precisely aligning upper and lower wafers when bonding wafers.

In the manufacturing process of semiconductor devices, a wafer bonding process can be performed to bond two wafers to each other. Such a wafer bonding process can be implemented in order to increase the packaging density of semiconductor chips in semiconductor devices. For example, a semiconductor module having a structure of stacked semiconductor chips is beneficial to improving the packaging density of semiconductor chips, and is also beneficial to shortening the wiring length between semiconductor chips and high-speed signal processing. When manufacturing a semiconductor module with a stacked semiconductor chip structure, the process of bonding in wafer units and then cutting in units of stacked semiconductor chips can improve production yield more than bonding in units of semiconductor chips.

The wafer bonding process can be performed by directly bonding two wafers in a wafer-to-wafer manner without an additional medium. The wafer-to-wafer method can usually be performed using a wafer bonding device, which includes a bonding chuck for arranging and fixing the wafers and a structural unit for pressurizing the wafers.

Existing wafer bonding devices use a pattern transmission alignment method, etc. The pattern transmission alignment method refers to aligning two substrates by, for example, using an IR camera to transmit alignment marks formed on two wafers and align them.

Problem to be solved:

However, the existing alignment method has the following problems: since alignment marks should be formed on the two wafers respectively, alignment and wafer bonding cannot be performed for bare wafers without alignment marks or other identifiable patterns. For example, when more than three wafers are stacked, the resolution drops sharply, and therefore the precision also decreases.

The present invention is used to solve multiple problems including the above problems, and its purpose is to provide a substrate processing device and a substrate processing method, which can realize the alignment of bare wafers without alignment marks or other identifiable patterns, and can realize the alignment of more than three wafers, and can also be implemented at any time when bonding wafers, thereby greatly improving the alignment accuracy. However, such problems are only exemplary, and the scope of the present invention is not limited by these problems.

Solution:

A substrate processing device for solving the above-mentioned problem based on the concept of the present invention may include: a first base for clamping a first substrate; a second base for clamping a second substrate so as to key the second substrate to the first substrate; a first camera device for photographing the first substrate so as to align the first substrate; a second camera device for photographing the second substrate so as to align the second substrate; and a control unit for aligning the first substrate using the first camera device, aligning the optical axes of the first camera device and the second camera device, and aligning the second substrate using the aligned second camera device.

In addition, according to the present invention, the first substrate may be an upper wafer, and the second substrate may be a lower wafer capable of being bonded to the upper wafer; the first camera device may include a lower camera capable of photographing the upper wafer, and the second camera device may include an upper camera capable of photographing the lower wafer.

In addition, according to the present invention, the first camera device may include: a first camera, arranged below the first substrate to shoot the first substrate upward; and a first camera moving device, which enables the first camera to move so that the first camera can perform three-point edge shooting or θ-axis alignment shooting of the first substrate.

In addition, according to the present invention, the first camera can be formed on one side of the second base, and the first camera moving device is a second base moving device that moves the second base, so as to simplify the device.

In addition, according to the present invention, the second camera device may include: a second camera, which is arranged above the second substrate to shoot the second substrate downward; and a second camera moving device, which moves the second camera so that the second camera can perform three-point edge shooting or θ-axis alignment shooting of the second substrate.

In addition, according to the present invention, the second camera can be arranged on a bridge portion that moves along the left track and the right track; and the second camera moving device can be a bridge-type moving device that enables the bridge portion to move.

In addition, according to the present invention, the control unit can be configured as follows: when the first substrate is aligned using the first camera device, the first camera device is moved and three edge points of the first substrate are photographed, or at least one alignment mark is photographed, so as to align the center (X, Y coordinate values) of the first substrate; the θ axis of the first substrate is aligned by moving the first camera device and photographing the alignment mark, or by using the notch.

In addition, according to the present invention, the control unit can be configured as follows: when aligning the optical axes of the first camera device and the second camera device, the first camera device or the second camera device aligns the optical axis using the second camera device or the first camera device that images the projection target mark in the form of light in the shooting area.

Furthermore, according to the present invention, the control unit may be configured as follows: applying a keying control signal to the first base moving device or the second base moving device to key the aligned first substrate to the aligned second substrate.

In addition, according to the present invention, the first substrate or the second substrate may include a bare wafer on which no pattern is formed.

In addition, the substrate processing method for solving the above-mentioned problem based on the concept of the present invention can utilize a substrate processing device, and the substrate processing device can include: a first base for clamping a first substrate; a second base for clamping a second substrate to bond the second substrate to the first substrate; a first camera device for photographing the first substrate to align the first substrate; a second camera device for photographing the second substrate to align the second substrate; and a control unit for photographing the first substrate by using the first camera device. The first substrate is aligned with the first camera device, and the optical axes of the first camera device and the second camera device are aligned, and the second substrate is aligned with the aligned second camera device; the substrate processing method may include: step (a), aligning the first substrate with the first camera device; step (b), aligning the optical axes of the first camera device and the second camera device; and step (c), aligning the second substrate with the aligned second camera device.

In addition, according to the present invention, the step (a) may include: step (a-1), moving the first camera device and photographing three edge points of the first substrate, or photographing at least one alignment mark, so as to align the center (X, Y coordinate values) of the first substrate; and step (a-2), aligning the θ axis of the first substrate by moving the first camera device and photographing the alignment mark, or by using the notch.

In addition, according to the present invention, in the step (b), the first camera device or the second camera device can align the optical axis by using the second camera device or the first camera device that images the projection target mark in the form of light in the shooting area.

In addition, according to the present invention, the step (c) may include: step (c-1), moving the second camera device and photographing three edge points of the second substrate, or photographing at least one alignment mark, so as to align the center (X, Y coordinate values) of the second substrate; and step (c-2), aligning the θ axis of the second substrate by moving the second camera device and photographing the alignment mark, or by using the notch.

In addition, according to the present invention, a step (d) may be further included, wherein the step (d) is to bond the first substrate to the aligned second substrate.

In addition, according to the present invention, the first substrate can be an upper wafer, and the second substrate can be a lower wafer bonded to the upper wafer; the first camera utilizes a lower camera capable of photographing the upper wafer, and the second camera utilizes an upper camera capable of photographing the lower wafer.

Furthermore, according to the present invention, in the step (a), in order to photograph the first substrate upward, the first camera disposed below the first substrate can be moved so that the first camera can perform three-point photography of the edge of the first substrate or θ-axis alignment photography.

Furthermore, according to the present invention, in the step (a), the first camera may be formed on one side of the second base, and the first camera moving device utilizes the second base moving device that moves the second base, so as to simplify the device.

Furthermore, according to the present invention, in the step (c), in order to photograph the second substrate downward, the second camera disposed above the second substrate can be moved so that the second camera can perform three-point photography of the edge of the second substrate or θ-axis alignment photography.

In addition, a substrate processing device for solving the above-mentioned problem based on the concept of the present invention may include: a first base for clamping a first substrate; a second base for clamping a second substrate to key the second substrate to the first substrate; a first camera device for photographing the first substrate to align the first substrate; a second camera device for photographing the second substrate to align the second substrate; and a control unit for aligning the first substrate using the first camera device, aligning the optical axes of the first camera device and the second camera device, and aligning the second substrate using the aligned second camera device; the first substrate is an upper crystal The first camera device comprises a lower camera capable of photographing the upper wafer, and the second camera device comprises an upper camera capable of photographing the lower wafer; the first camera device may include: a first camera, which is arranged below the first substrate to photograph the first substrate upward; and a first camera moving device, which enables the first camera to move so that the first camera can perform three-point edge photography or θ-axis alignment photography of the first substrate; the first camera is formed on one side of the second base, and the first camera moving device is a second base moving device that enables the second base to move. , so as to simplify the device; the second camera device may include: a second camera, which is arranged above the second substrate to shoot the second substrate downward; and a second camera moving device, which moves the second camera so that the second camera can perform three-point edge shooting or θ-axis alignment shooting of the second substrate; the second camera is arranged on a bridge portion that moves along the left track and the right track; the second camera moving device is a bridge-type moving device that moves the bridge portion; the control unit may be configured as follows: when the first camera device is used to align the first substrate, the first camera device is moved and shoots three-point edge shooting of the first substrate; point, or photographing at least one alignment mark, thereby aligning the center (X, Y coordinate values) of the first substrate; aligning the θ axis of the first substrate by moving the first camera device and photographing the alignment mark, or by using the notch; when aligning the optical axes of the first camera device and the second camera device, the first camera device or the second camera device uses the second camera device or the first camera device that images the projection target mark in the form of light in the shooting area to align the optical axis; applying a keying control signal to the first base moving device or the second base moving device to key the aligned first substrate to the aligned second substrate.

Effect of invention:

The multiple embodiments of the present invention constructed as described above have the following effects: it is possible to achieve alignment of bare wafers that are not formed with alignment marks or other identifiable patterns, and it is possible to achieve alignment of more than three wafers. It can also be implemented at any time when bonding wafers, thereby greatly improving the alignment accuracy. By effectively utilizing a base moving device or a bridge camera, etc., the unit price or manufacturing cost of the product can be reduced.

Hereinafter, some preferred embodiments of the present invention will be described in detail with reference to the drawings.

The embodiments of the present invention are intended to more completely describe the present invention to those having ordinary knowledge in the technical field to which the present invention belongs. The following embodiments can be changed into several different forms, and the scope of the present invention is not limited to the following embodiments. On the contrary, these embodiments are intended to make the present disclosure more thorough and complete, and fully convey the spirit of the present invention to those having ordinary knowledge in the technical field to which the present invention belongs. In addition, for the convenience and clarity of explanation, the thickness or size of each layer in the attached drawings is exaggerated.

The terms used in this specification are used to describe specific embodiments and are not used to limit the present invention. As used in this specification, singular forms may include plural forms unless the context clearly indicates otherwise. In addition, the term "including" used in this specification specifically specifies the existence of the shapes, numbers, steps, operations, components, elements and/or combinations thereof, and does not exclude the existence or addition of more than one other shapes, numbers, operations, components, elements and/or combinations.

Embodiments of the present invention are described below with reference to the accompanying drawings which schematically illustrate preferred embodiments of the present invention. In the accompanying drawings, variations of the shapes depicted can be expected, for example, based on manufacturing techniques and/or tolerances. Therefore, the embodiments contemplated by the present invention should not be interpreted as being limited to the specific shapes depicted in this specification, but should include, for example, shape variations resulting from manufacturing.

FIG. 1 is a side view schematically illustrating a substrate processing apparatus 100 according to a partial embodiment of the present invention.

As shown in FIG. 1 , a substrate processing apparatus 100 according to some embodiments of the present invention may generally include a first base 10 , a second base 20 , a first camera 30 , a second camera 40 , and a control unit 50 .

The first base 10 may be a base provided with a vacuum chuck or an electrostatic chuck for clamping a first substrate W1 (shown in FIG. 2 ), wherein the first substrate W1 is a first substrate on a semiconductor substrate such as a wafer or a display substrate such as a glass substrate. Although not shown, the first base 10 may be an upper base capable of being provided with a heating device (not shown) for heating the first substrate W1, a partition (not shown), a vacuum pipeline or an electrostatic electrode, etc.

Here, the first base 10 can move toward the X-axis, Y-axis, Z-axis and θ-axis through the first base moving device 12. The first base moving device 12 can apply various moving devices such as X-axis, Y-axis, Z-axis and θ-axis base moving devices or transfer robots, and detailed descriptions are omitted here.

The second base 20 may be a base provided with a vacuum chuck or an electrostatic chuck for clamping the second substrate W2 (shown in FIG. 2 ) in order to bond the second substrate W2 to the first substrate W1. The second substrate W2 is a second substrate on a semiconductor substrate such as a wafer or a display substrate such as a glass substrate. Although not shown, the second base 20 may be an upper base capable of being provided with a heating device (not shown) for heating the second substrate W2, a partition (not shown), a vacuum pipeline or an electrostatic electrode, etc.

Here, the second base 20 can move toward the X-axis, Y-axis, Z-axis and θ-axis through the second base moving device 22. The second base moving device 22 can apply various moving devices such as X-axis, Y-axis, Z-axis and θ-axis base moving devices or transfer robots, and detailed descriptions are omitted here.

The first camera device 30 is a device for photographing the first substrate W1 and recognizing the position and rotation angle of the first substrate W1 in order to align the first substrate W1, and can be disposed opposite to the first substrate W1.

The second camera device 40 is a device for photographing the second substrate W2 and recognizing the position and rotation angle of the second substrate W2 in order to align the second substrate W2, and can be disposed opposite to the second substrate W2.

For example, as shown in FIG. 1 , the first substrate W1 is an upper wafer, and the second substrate W2 is a lower wafer that can be bonded to the upper wafer in a wafer-to-wafer manner.

However, these substrates W1 and W2 are not limited to wafers, and can be applied to various forms of substrates such as display substrates. The positions are not limited to top and bottom, but can be located in various directions such as bottom and top or left and right.

In addition, for example, at least one of the first substrate W1 and the second substrate W2 includes a bare wafer without a pattern formed thereon, and according to the present invention, bare wafers that could not be bonded in a wafer-to-wafer manner in the past can be bonded.

Here, the first camera device 30 includes a lower camera capable of photographing an upper wafer, and the second camera device 40 includes an upper camera capable of photographing a lower wafer. However, this is not limited to the upper and lower parts, and cameras of a wide variety of forms or positions can be applied.

More specifically, for example, the first camera device 30 may include: a first camera 31, which is arranged below the first substrate W1 to photograph the first substrate W1 upward; and a first camera moving device 32, which enables the first camera 31 to move so that the first camera 31 can photograph three edge points P1, P2, and P3 of the first substrate W1 (shown in Figure 8), or use alignment marks M1, M2, and M3 (shown in Figure 9) or notch N (shown in Figure 10) to perform θ-axis alignment shooting.

Here, the first camera 31 is formed on one side of the second base 20 and moves together with the second base 20. The first camera moving device 32 can simultaneously utilize the second base moving device 22 that moves the second base 20 to simplify the device and reduce the manufacturing unit price and manufacturing costs.

The second camera device 40 may include: a second camera 41, which is arranged above the second substrate W2 to photograph the second substrate W2 downward; and a second camera moving device 42, which moves the second camera 41 so that the second camera 41 can photograph the three edge points P1, P2, and P3 of the second substrate W2 (shown in Figure 8), or use alignment marks M1, M2, and M3 (shown in Figure 9) or notch N (shown in Figure 10) to perform θ-axis alignment shooting.

As the control unit 50, various control devices such as microprocessors, central processing units, computing devices, computers, server computers, mobile phones, tablets, etc., memory devices storing programs, circuit boards, control boards, control panels, electronic components, etc. can be applied. The various control devices apply control signals to the base moving devices 12, 22 and the camera devices 30, 40 in order to execute a series of processes such as aligning the first substrate W1 using the first camera 30, aligning the optical axes of the first camera device 30 and the second camera device 40, and aligning the second substrate W2 using the aligned second camera device 40.

More specifically, for example, when the control unit 50 uses the first camera device 30 to align the first substrate W1, the first camera device 30 can be moved to photograph three edge points of the first substrate W1 or at least one alignment mark to align the center (X, Y coordinate values) of the first substrate W1, and the θ-axis of the first substrate W1 can be aligned by moving the first camera device 30 and photographing the alignment mark, or by using the notch.

In addition, for example, when the control unit 50 aligns the optical axes of the first camera device 30 and the second camera device 40, the first camera device 30 or the second camera device 40 can align the optical axis by using the second camera device 40 or the first camera device 30 that images the projection target mark in the form of light in the shooting area.

In addition, for example, the control unit 50 may apply a bonding control signal to the first base moving device 12 or the second base moving device 22 to bond the aligned first substrate W1 onto the aligned second substrate W2.

Figure 2 is a side view showing a substrate loading state of the substrate processing device 100 in Figure 1; Figure 3 is a side view showing a first substrate alignment state of the substrate processing device 100 in Figure 2; Figure 4 is a side view showing an optical axis alignment state of a camera device of the substrate processing device 100 in Figure 3; Figure 5 is a side view showing a second substrate alignment state of the substrate processing device 100 in Figure 4; Figure 6 is a side view showing a substrate bonding state of the substrate processing device 100 in Figure 5.

In addition, Figure 8 is a schematic diagram showing a center alignment process of the first substrate W1 or the second substrate W2 of the substrate processing device in Figure 1; Figure 9 is a schematic diagram showing an example of the θ-axis alignment process of the first substrate W1 or the second substrate W2 of the substrate processing device in Figure 1; and Figure 10 is a schematic diagram showing another example of the θ-axis alignment process of the first substrate W1 or the second substrate W2 of the substrate processing device in Figure 1.

As shown in FIG. 2 and FIG. 6 , a substrate alignment process of a substrate processing device 100 according to a partial embodiment of the present invention is described in stages. First, as shown in FIG. 2 , a first substrate W1 is loaded and clamped on a first base 10, and a second substrate W2 is loaded and clamped on a second base 20 in a manner opposite to the first substrate W1.

Next, as shown in Fig. 3, the control unit 50 may align the first substrate W1 using the first camera device 30. Of course, here, the second substrate W2 may also be aligned first.

At this time, as shown in Figures 8 to 10, the center C (X, Y coordinate values) of the first substrate W1 can be aligned by moving the first camera device 30 and photographing the three edge points P1, P2, P3 of the first substrate W1 or photographing at least one alignment mark M1, M2, M3, and the θ-axis of the first substrate W1 can be aligned by moving the first camera device 30 and photographing the alignment marks M1, M2, M3, or by using the notch N.

Subsequently, as shown in FIG. 4 , in order to align the optical axes of the first camera device 30 and the second camera device 40, the first camera device 30 can utilize the second camera device 40 that images the projection target mark T in the form of light in the shooting area to align the optical axis with the projection target mark T, thereby aligning the optical axes of each other.

That is, by aligning the upper/lower optical axes of the camera in the manner of a projection target, the X, Y, and Z points of the contact (bonding) coordinates of the first substrate W1 and the second substrate W2 can be found.

For example, the X, Y coordinate values of the first substrate W1 can be added to the X, Y coordinate values of the optical axis target and then subtracted from the X, Y coordinate values of the second substrate W2 to obtain the bonding X, Y coordinates. The Z coordinate value of the first substrate W1 can be added to the Z coordinate value of the optical axis target and then subtracted from the coordinate value of the first substrate W1 to obtain the bonding Z coordinate.

Here, the technology of imaging the projected target mark T in the form of light and aligning the optical axis can be achieved by adjusting the focus of the lens so that the light is concentrated on the optical axis and imaged.

For example, more detailed information about the projected target mark T can be found in Korean Patent No. 10-1134371, and the detailed description is omitted here.

Next, as shown in FIG. 5 , the second substrate W2 may be aligned using the second camera device 40 that has been aligned with the optical axis.

At this time, as shown in Figures 8 to 10, the center C (X, Y coordinate values) of the second substrate W2 can be aligned by moving the second camera device 40 and photographing the three edge points P1, P2, P3 of the second substrate W2 or photographing at least one alignment mark M1, M2, M3, and the θ-axis of the second substrate W2 can be aligned by moving the second camera device 40 and photographing the alignment marks M1, M2, M3, or by using the notch N.

Next, as shown in FIG. 6 , the first substrate W1 which has been precisely aligned as described above may be bonded to the second substrate W2 in a wafer-to-wafer manner.

Therefore, according to the present invention, it is possible to align bare wafers that are not formed with alignment marks or other identifiable patterns, and it is possible to align more than three wafers. It can also be implemented at any time when bonding wafers, thereby greatly improving the alignment accuracy.

FIG. 7 is a perspective view showing a substrate processing apparatus 200 according to another embodiment of the present invention.

As shown in FIG. 7 , a substrate processing device 200 according to another embodiment of the present invention may be configured as follows: a second camera 41 is disposed on a bridge portion 43 that moves along the left rail R1 and the right rail R2; and a second camera moving device 42 is a bridge-type moving device 44 that moves the bridge portion 43.

Therefore, the second camera 41 moves via the bridge-type moving device 44 while photographing the three edge points P1, P2, P3 of the second substrate W2 or photographing at least one alignment mark M1, M2, M3, so as to align the center C (X, Y coordinate values) of the second substrate W2, and aligns the θ-axis of the second substrate W2 by moving the second camera device 40 and photographing the alignment marks M1, M2, M3, or by utilizing the notch N.

Therefore, according to the present invention, a base moving device or a bridge camera can be effectively utilized, and the unit price or manufacturing cost of the product can be reduced.

FIG. 11 is a flow chart showing a substrate processing method according to a partial embodiment of the present invention.

As shown in Figures 1 to 11, a substrate processing method according to some embodiments of the present invention is a substrate processing method using the substrate processing device 100 as described above, which may include: step (a), using the first camera device 30 to align the first substrate W1; step (b), aligning the optical axes of the first camera device 30 and the second camera device 40; step (c), using the aligned second camera device 40 to align the second substrate W2; and step (d), bonding the first substrate W1 to the aligned second substrate W2.

FIG. 12 is a flow chart showing step (a) of the substrate processing method of FIG. 11 .

As shown in FIG. 12 , the step (a) may include: a step (a-1), moving the first camera device 30 and photographing three edge points P1, P2, and P3 of the first substrate W1, or photographing at least one alignment mark, thereby aligning the center C (X, Y coordinate values) of the first substrate; and a step (a-2), aligning the θ-axis of the first substrate by moving the first camera device 30 and photographing the alignment marks M1, M2, and M3, or by using the notch N.

In the step (b), the first camera device 30 or the second camera device 40 aligns the optical axis by using the second camera device 40 or the first camera device 30 that images the projection target mark T in the form of light in the shooting area.

FIG. 13 is a flow chart showing step (c) of the substrate processing method of FIG. 11 .

As shown in Figures 1 to 13, the step (c) may include: step (c-1), moving the second camera device 40 and photographing the three edge points P1, P2, and P3 of the second substrate W2, or photographing at least one alignment mark M1, M2, and M3, so as to align the center C (X, Y coordinate values) of the second substrate W2; and step (c-2), aligning the θ axis of the second substrate W2 by moving the second camera device 40 and photographing the alignment marks M1, M2, and M3, or by using the notch N.

FIG. 14 is a flow chart showing a substrate processing method according to another embodiment of the present invention.

As shown in Figures 1 to 14, as a substrate processing method according to another embodiment of the present invention, first, the first step can be to load the first substrate (upper wafer) (S1) and load the second substrate (lower wafer) (S2) during the wafer loading process.

Next, the second step may be to use a first camera device (cassette optical system) to identify three edge points of the first substrate (top wafer) during the alignment process of the first substrate (top wafer) (S3).

Next, if there is a pattern on the wafer (S4), the first camera device (cassette optical system) is used to align the θ axis of the wafer (S5); if not, the wafer notch is identified and the θ axis is aligned (S6).

Next, the third step may be to first use the second camera device (bridge camera) to match the upper and lower optical axis projection target marks during the alignment process of the second substrate (bottom substrate) (S7), and to use the second camera device (card optical system) to identify three edge points of the second substrate (S8).

Next, if there is a pattern on the wafer (S9), the θ axis of the wafer is aligned using a second camera device (bridge optical system) (S10); if not, the wafer notch is identified and the θ axis is aligned (S11).

Next, the first substrate W1 and the second substrate W2 may be bonded in a wafer-to-wafer manner ( S12 ), and the bonded first substrate W1 and the second substrate W2 may be unloaded ( S13 ).

The present invention describes the embodiment shown in the figure as a reference, but this is only an example. It is understood that a person with ordinary knowledge in the technical field to which the invention belongs can make various changes and obtain other equivalent embodiments. Therefore, the true technical protection scope of the present invention should be determined according to the technical idea of the attached patent application scope.

10: First base 12: First base moving device 20: Second base 22: Second base moving device 30: First camera device 31: First camera 32: First camera moving device 40: Second camera device 41: Second camera 42: Second camera moving device 43: Bridge unit 44: Bridge moving device 50: Control unit 100, 200: Substrate processing device W1: First substrate W2: Second substrate P1, P2, P3: Three edge points R1: Left track R2: Right track M1, M2, M3: Alignment mark C: Center N: Notch T: Projection target mark

FIG. 1 is a schematic side view of a substrate processing device according to a partial embodiment of the present invention; FIG. 2 is a side view showing a substrate loading state of the substrate processing device in FIG. 1; FIG. 3 is a side view showing a first substrate alignment state of the substrate processing device in FIG. 2; FIG. 4 is a side view showing an optical axis alignment state of a camera device of the substrate processing device in FIG. 3; FIG. 5 is a side view showing a second substrate alignment state of the substrate processing device in FIG. 4; FIG. 6 is a side view showing a substrate bonding state of the substrate processing device in FIG. 5; FIG. 7 is a three-dimensional view showing a substrate processing device according to another partial embodiment of the present invention; FIG. 8 is a schematic diagram showing a center alignment process of a first substrate or a second substrate of the substrate processing device in FIG. 1; FIG. 9 is a schematic diagram showing an example of the θ-axis alignment process of the first substrate or the second substrate of the substrate processing device in FIG. 1; FIG. 10 is a schematic diagram showing another example of the θ-axis alignment process of the first substrate or the second substrate of the substrate processing device in FIG. 1; FIG. 11 is a flow chart showing a substrate processing method according to a partial embodiment of the present invention; FIG. 12 is a flow chart showing step (a) in the substrate processing method in FIG. 11; FIG. 13 is a flow chart showing step (c) in the substrate processing method in FIG. 11; FIG. 14 is a flow chart showing a substrate processing method according to another partial embodiment of the present invention.

10: First base

12: First base moving device

20: Second base

22: Second base moving device

30: First camera device

31: First Camera

32: First camera moving device

40: Second camera device

41: Second camera

42: Second camera moving device

50: Control Department

100: Substrate processing device

Claims (20)

A substrate processing device includes: a first base for clamping a first substrate; a second base for clamping a second substrate to key the second substrate to the first substrate; a first camera device for photographing the first substrate to align the first substrate; a second camera device for photographing the second substrate to align the second substrate; and a control unit for aligning the first substrate using the first camera device, aligning the optical axes of the first camera device and the second camera device, and aligning the second substrate using the aligned second camera device. A substrate processing device as described in claim 1, wherein the first substrate is an upper wafer, the second substrate is a lower wafer capable of being bonded to the upper wafer; and the first camera device includes a lower camera capable of photographing the upper wafer, and the second camera device includes an upper camera capable of photographing the lower wafer. The substrate processing device as described in claim 2, wherein the first camera device comprises: A first camera, disposed below the first substrate, to shoot the first substrate upward; and A first camera moving device, to move the first camera so that the first camera can perform three-point edge shooting or θ-axis alignment shooting of the first substrate. In the substrate processing apparatus as described in claim 3, the first camera is formed on one side of the second base, and the first camera moving device is a second base moving device that moves the second base to simplify the apparatus. The substrate processing device as described in claim 2, wherein the second camera device comprises: A second camera, disposed above the second substrate, to photograph the second substrate downward; and A second camera moving device, to move the second camera so that the second camera can perform three-point edge photography or θ-axis alignment photography of the second substrate. A substrate processing device as described in claim 5, wherein the second camera is disposed on a bridge portion that moves along the left rail and the right rail; and the second camera moving device is a bridge-type moving device that moves the bridge portion. The substrate processing device as described in claim 1, wherein the control unit is configured as follows: When the first camera device is used to align the first substrate, the first camera device is moved and three edge points of the first substrate are photographed, or at least one alignment mark is photographed, so as to align the center of the first substrate; and The θ axis of the first substrate is aligned by moving the first camera device and photographing the alignment mark, or by using the notch. The substrate processing device as described in claim 1, wherein the control unit is configured as follows: When aligning the optical axes of the first camera device and the second camera device, the first camera device or the second camera device aligns the optical axis using the second camera device or the first camera device that images the projection target mark in the form of light in the shooting area. The substrate processing device as described in claim 1, wherein the control unit is configured as follows: Applying a keying control signal to the first base moving device or the second base moving device to key the aligned first substrate to the aligned second substrate. A substrate processing apparatus as described in claim 1, wherein the first substrate or the second substrate comprises a bare wafer without a pattern formed thereon. A substrate processing method, wherein the substrate processing method uses a substrate processing device, the substrate processing device comprising: a first base for clamping a first substrate; a second base for clamping a second substrate to key the second substrate to the first substrate; a first camera device for photographing the first substrate to align the first substrate; a second camera device for photographing the second substrate to align the second substrate; and a control unit for aligning the first substrate with the first camera device, aligning the optical axes of the first camera device and the second camera device, and aligning the second substrate with the aligned second camera device; The substrate processing method comprises: Step (a), aligning the first substrate with the first camera device; Step (b), aligning the optical axes of the first camera device and the second camera device; and Step (c), aligning the second substrate using the aligned second camera device. The substrate processing method as described in claim 11, wherein the step (a) comprises: Step (a-1), moving the first camera device and photographing three edge points of the first substrate, or photographing at least one alignment mark, thereby aligning the center of the first substrate; and Step (a-2), aligning the θ axis of the first substrate by moving the first camera device and photographing the alignment mark, or by using the notch. A substrate processing method as described in claim 11, wherein in the step (b), the first camera device or the second camera device aligns the optical axis by using the second camera device or the first camera device that images the projection target mark in the form of light in the shooting area. The substrate processing method as described in claim 11, wherein the step (c) comprises: step (c-1), moving the second camera device and photographing three points of the edge of the second substrate, or photographing at least one alignment mark, thereby aligning the center of the second substrate; and step (c-2), aligning the θ axis of the second substrate by moving the second camera device and photographing the alignment mark, or by using the notch. The substrate processing method as described in claim 11 further includes step (d), wherein step (d) is bonding the first substrate to the aligned second substrate. A substrate processing method as described in claim 11, wherein the first substrate is an upper wafer, the second substrate is a lower wafer bonded to the upper wafer; and the first camera utilizes a lower camera capable of photographing the upper wafer, and the second camera utilizes an upper camera capable of photographing the lower wafer. A substrate processing method as described in claim 16, wherein in the step (a), in order to photograph the first substrate upward, the first camera arranged below the first substrate is moved so that the first camera can perform three-point edge photography or θ-axis alignment photography of the first substrate. A substrate processing method as described in claim 17, wherein in the step (a), the first camera is formed on one side of the second base. A substrate processing method as described in claim 11, wherein in the step (c), in order to photograph the second substrate downward, the second camera arranged above the second substrate is moved so that the second camera can perform three-point edge photography or θ-axis alignment photography of the second substrate. A substrate processing device comprises: A first base for clamping a first substrate; A second base for clamping a second substrate to bond the second substrate to the first substrate; A first camera device for photographing the first substrate to align the first substrate; A second camera device for photographing the second substrate to align the second substrate; and A control unit for aligning the first substrate using the first camera device, aligning the optical axes of the first camera device and the second camera device, and aligning the second substrate using the aligned second camera device; The first substrate is an upper wafer, and the second substrate is a lower wafer capable of bonding to the upper wafer; The first camera device includes a lower camera capable of photographing the upper wafer, and the second camera device includes an upper camera capable of photographing the lower wafer; The first camera device includes: A first camera, disposed below the first substrate, to photograph the first substrate upward; and A first camera moving device, to move the first camera so that the first camera can perform three-point edge photography or θ-axis alignment photography of the first substrate; The first camera is formed on one side of the second base, and the first camera moving device is a second base moving device that moves the second base to simplify the device; The second camera device includes: The second camera is arranged above the second substrate to shoot the second substrate downward; and The second camera moving device moves the second camera so that the second camera can shoot three points of the edge of the second substrate or θ-axis alignment shooting; The second camera is arranged on a bridge portion that moves along the left track and the right track; The second camera moving device is a bridge-type moving device that moves the bridge portion; The control unit is configured as follows: When the first camera device is used to align the first substrate, the first camera device is moved and shoots three points of the edge of the first substrate, or shoots at least one alignment mark, so as to align the center of the first substrate; By moving the first camera device and photographing the alignment mark, or by using the notch to align the θ axis of the first substrate; When aligning the optical axes of the first camera device and the second camera device, the first camera device or the second camera device uses the second camera device or the first camera device that images the projection target mark in the form of light in the shooting area to align the optical axis; Applying a keying control signal to the first base moving device or the second base moving device to key the aligned first substrate to the aligned second substrate.

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