TW202425361A - Photodetector - Google Patents

Abstract

The light detector of the present invention comprises: a package having a bottom wall and a window facing each other; a light receiving element arranged on the bottom wall in the package; a light transmitting component arranged on the light receiving element in the package; and an optical filter component arranged on the light transmitting component in the package. The light receiving element has a light receiving area including a plurality of light receiving parts. When viewed from the direction in which the bottom wall and the window face each other, the outer edge of the light receiving element is located inside the outer edge of the optical filter component.

Description

Light detector

The present disclosure relates to a light detector.

A photodetector is known, which includes: a package having a bottom wall and a window facing each other; and a light receiving element disposed on the bottom wall in the package; and the window is composed of an optical filter component (for example, refer to patent document 1). [Prior art document] [Patent document]

Patent document 1: Japanese Patent Application Publication No. 3-27554

[The problem the invention is trying to solve]

In the above-mentioned light detector, since the window portion in the package is formed by the optical filter component, only the light of the detection object can be incident on the light receiving element. On the other hand, for example, if the size of the opening closed by the window portion in the package is intended to be increased, the size of the optical filter component must be increased. However, generally speaking, it is intended to avoid increasing the size of the expensive optical filter component. That is, if the window portion in the package is formed by the optical filter component, the freedom of the shape of the package is restricted.

The purpose of this disclosure is to provide a light detector that can ensure the freedom of the shape of the package body and detect the light of the detection object with high precision. [Technical means to solve the problem]

One aspect of the photodetector disclosed herein [1] "comprises: a package having a bottom wall portion and a window portion facing each other; a light receiving element disposed on the bottom wall portion in the package; a light transmitting component disposed on the light receiving element in the package; and an optical filter component disposed on the light transmitting component in the package; wherein the light receiving element has a light receiving area including a plurality of light receiving portions; and when viewed from a direction in which the bottom wall portion and the window portion face each other, an outer edge of the light receiving element is located on the inner side of an outer edge of the optical filter component."

In the above-mentioned photodetector, a light receiving element is arranged on the bottom wall portion in the package, and an optical filter component is arranged on the light receiving element in the package. Thereby, for example, there is no need to reduce the size of the opening closed by the window portion in the package, and the freedom of the shape of the package is ensured. Furthermore, in the above-mentioned photodetector, when viewed from the direction in which the bottom wall portion and the window portion are opposite to each other, the outer edge of the light receiving element is located on the inner side of the outer edge of the optical filter component. Thereby, the probability of light being incident on the light receiving element through the optical filter component becomes higher. Based on the above facts, according to the above-mentioned photodetector, the freedom of the shape of the package can be ensured, and the light of the detection object can be detected with high precision.

It is feasible that the light detector of one aspect of the present disclosure, [2] "is the light detector as described in [1] above, wherein when the bottom wall portion and the window portion are viewed in the aforementioned direction facing each other, the distance between the outer edge of the light receiving area and the aforementioned outer edge of the light receiving element is greater than the distance between the aforementioned outer edge of the light receiving element and the aforementioned outer edge of the optical filter component." According to this light detector, light that obliquely enters the light receiving element without passing through the optical filter component can be suppressed from entering the light receiving area, and the light of the detection object can be detected with higher accuracy.

It is feasible that the light detector of one aspect of the present disclosure, [3] "is a light detector as described in [1] or [2] above, wherein when the bottom wall portion and the window portion are viewed in the aforementioned direction facing each other, the outer edge of the light-transmitting member is located on the inner side of the aforementioned outer edge of the optical filter member." According to this light detector, light obliquely incident on the light-transmitting member without passing through the optical filter member can be suppressed from being guided by the light-transmitting member and incident on the light-receiving element, so that the light of the detection object can be detected with higher accuracy.

It is feasible that the light detector of one aspect of the present disclosure, [4] "is the light detector as described in [3] above, further comprising a bonding member, the bonding member being arranged between the aforementioned light-transmitting member and the aforementioned optical filter member." According to the light detector, when an adhesive (having fluidity and solidifying after bonding) is used as the bonding member during the manufacture of the light detector, since the adhesive is easily accumulated in the corner between the side surface of the light-transmitting member and the surface of the light-transmitting member side in the optical filter member, the useless expansion of the adhesive can be suppressed, and the optical filter member can be firmly fixed to the light-transmitting member.

One aspect of the present disclosure may be a photodetector [5] as described in any one of [1] to [4], further comprising a circuit element disposed between the bottom wall and the light receiving element. According to the photodetector, the size of the photodetector when viewed from a direction in which the bottom wall and the window face each other can be reduced.

It is feasible that the photodetector of one aspect of the present disclosure, [6] "is the photodetector as described in [5] above, further comprising a plurality of bumps, wherein the bumps electrically and physically connect the circuit element and the light receiving element." According to the photodetector, the responsiveness of the electrical signal between the circuit element and the light receiving element can be improved.

It is feasible that the photodetector of one aspect of the present disclosure, [7] "is the photodetector as described in [6] above, further comprising a first resin member, the first resin member being disposed between the circuit element and the light receiving element, and the first resin member reaching the side surface of the light transmitting member via the side surface of the light receiving element." According to the photodetector, not only the circuit element and the light receiving element can be fixedly maintained, but also the light receiving element and the light transmitting member can be fixedly maintained.

It is feasible that the photodetector of one aspect of the present disclosure, [8] "is a photodetector as described in [5] above, wherein the circuit element and the light receiving element are electrically and physically connected by direct bonding." According to the photodetector, the responsiveness of the electrical signal between the circuit element and the light receiving element can be improved.

A feasible photodetector according to one aspect of the present disclosure is [9] "a photodetector as in any one of [5] to [8] above, further comprising: a wire which is connected between the terminal of the bottom wall and the terminal of the circuit element; and a second resin member which covers the wire." According to the photodetector, unintentional energization can be suppressed and a high voltage can be applied to the wire.

It is feasible that the photodetector of one aspect of the present disclosure, [10] "is a photodetector as described in [9] above, wherein the aforementioned wire is a wire for applying a power voltage to the aforementioned light-receiving element." According to this photodetector, unintentional conduction of electricity in the wire can be suppressed, and a power voltage can be applied to the light-receiving element.

It is possible that the light detector of one aspect of the present disclosure, [11] "is a light detector as described in any one of [1] to [10] above, wherein the optical filter component comprises: a light-transmitting substrate, and an optical filter film formed on a surface of the light-transmitting substrate on the side of the light-transmitting component." According to the light detector, for example, compared with the case where the optical filter film is formed on the surface of the light-transmitting substrate on the opposite side to the light-transmitting component, the probability of light entering the light-receiving element through the optical filter film can be increased, and the light of the detection object can be detected with higher accuracy.

It is feasible that the light detector of one aspect of the present disclosure, [12] "is a light detector as described in any one of [1] to [11] above, wherein when the bottom wall and the window are viewed in the aforementioned direction facing each other, the outer edge of the light-transmitting area of the window is located outside the aforementioned outer edge of the optical filter member." According to this light detector, the visibility inside the package through the window can be improved, and the inspection inside the package can be appropriately performed.

It is feasible that the light detector of one aspect of the present disclosure, [13] "is a light detector as described in any one of [1] to [12] above, wherein the distance between the outer edge of the aforementioned light receiving area and the aforementioned outer edge of the aforementioned light receiving element when the aforementioned bottom wall portion and the aforementioned window portion are viewed in the aforementioned direction facing each other is greater than the thickness of the aforementioned light receiving element in the aforementioned direction facing each other between the aforementioned bottom wall portion and the aforementioned window portion." According to this light detector, light obliquely incident on the light receiving element without passing through the optical filter component can be suppressed from being incident on the light receiving area, and the light of the detection object can be detected with higher accuracy.

It is feasible that the light detector of one aspect of the present disclosure, [14] may be "a light detector as in any one of the above [1] to [13], wherein the distance between the outer edge of the aforementioned light receiving area and the aforementioned outer edge of the aforementioned optical filter component when the aforementioned bottom wall portion and the aforementioned window portion are viewed in the aforementioned direction facing each other is greater than the thickness of the aforementioned light-transmitting component in the aforementioned direction facing each other between the aforementioned bottom wall portion and the aforementioned window portion." According to the light detector, light obliquely incident on the light receiving element without passing through the optical filter component can be suppressed from being incident on the light receiving area, and the light of the detection object can be detected with higher accuracy. [Effect of the invention]

According to the present disclosure, it is possible to provide a light detector that can ensure the freedom of the shape of a package body and detect the light of a detection object with high precision.

The following is a detailed description of the implementation of the present disclosure with reference to the drawings. In addition, the same or equivalent parts are given the same symbols in each figure, and repeated descriptions are omitted. [Structure of the photodetector]

As shown in FIG. 1 and FIG. 2 , the photodetector 1 has a package 2. The package 2 has a bottom wall portion 21, a side wall portion 22, and a window portion 23. The bottom wall portion 21 and the window portion 23 are opposite to each other in the Z direction via the side wall portion 22. When the package 2 is observed from the Z direction, it is, for example, in the shape of a rectangle with the X direction and the Y direction as the long side direction and the short side direction, respectively. As an example, the width of the package 2 in the X direction is about 20 mm, the width of the package 2 in the Y direction is about 10 mm, and the width of the package 2 in the Z direction is about 3 mm. In addition, the Z direction, the X direction, and the Y direction are mutually orthogonal directions.

The bottom wall portion 21 is a substrate provided with a plurality of wirings (not shown in the figure). The substrate is formed into a rectangular plate shape, for example, by glass fiber and epoxy resin. The bottom wall portion 21 is not transparent to light (including visible light) including light of the detection object. The bottom wall portion 21 has a surface 21a on one side of the Z direction and a surface 21b on the other side. One end of each wiring is arranged on the surface 21a as a terminal 24, and the other end of each wiring is arranged on the surface 21b as a terminal (not shown in the figure). That is, the bottom wall portion 21 has a plurality of terminals 24 arranged on the surface 21a. A through hole 21c is formed in the bottom wall portion 21. The through hole 21c connects the space inside the package 2 with the space outside the package 2.

The side wall portion 22 is a frame extending along the outer edge of the surface 21a of the bottom wall portion 21. The side wall portion 22 is formed into a rectangular frame shape by, for example, glass fiber and epoxy resin. The bottom wall portion 22 is not transparent to light including light of the detection object. The side wall portion 22 has an end face 22a on one side of the Z direction and an end face 22b on the other side. The side wall portion 22 is fixed to the bottom wall portion 21 by a connecting member (not shown) arranged between the surface 21a of the bottom wall portion 21 and the end face 22b of the side wall portion 22.

The window portion 23 is a substrate that is transparent to light including light of a detection object. The window portion 23 is formed into a rectangular plate shape by, for example, glass. The window portion 23 has a surface 23a on one side of the Z direction and a surface 23b on the other side. The window portion 23 is fixed to the side wall portion 22 by a connecting member 25 disposed between the end surface 22a of the side wall portion 22 and the surface 23b of the window portion 23. The side surface 23c of the window portion 23 is disposed on the end surface 22a of the side wall portion 22 when viewed from the Z direction. Then, the member 25 extends from the area between the end surface 22a of the side wall 22 and the surface 23b of the window 23 to the corner between the surface 23b of the window 23 and the inner side surface 22c of the side wall 22, and the corner between the side surface 23c of the window 23 and the end surface 22a of the side wall 22. In addition, an anti-reflection film (not shown) is formed on each surface 23a, 23b of the window 23. The anti-reflection film may be formed only on the surface 23a of the window 23, or may be formed only on the surface 23b of the window 23.

As shown in FIGS. 1, 2 and 3, a circuit element 3 is arranged on the bottom wall portion 21 in the package body 2. The circuit element 3 is an element having a signal processing circuit. The circuit element 3 is, for example, a TIA (transimpedance amplifier). The circuit element 3 is, for example, in the shape of a rectangular plate with the X direction and the Y direction as the long side direction and the short side direction respectively and the Z direction as the thickness direction. The circuit element 3 has a surface 3a on one side of the Z direction and a surface 3b on the other side. The circuit element 3 is fixed to the bottom wall portion 21 by a connecting member (not shown) arranged between the surface 21a of the bottom wall portion 21 and the surface 3b of the circuit element 3. The circuit element 3 has a plurality of terminals 31 arranged on the surface 3a.

In the package body 2, a light receiving element 4 is arranged on the circuit element 3. That is, the light receiving element 4 is arranged on the bottom wall portion 21 with the circuit element 3 interposed therebetween. In other words, the circuit element 3 is arranged between the bottom wall portion 21 and the light receiving element 4. The light receiving element 4 is a back-incident optical semiconductor element that is sensitive to light including the light of the measurement object. The light receiving element 4 is, for example, a back-incident Si-APD (avalanche photodiode) array. The light receiving element 4 is, for example, in the shape of a rectangular plate with the X direction and the Y direction as the long side direction and the short side direction respectively and the Z direction as the thickness direction. The light receiving element 4 has a surface 4a on one side of the Z direction and a surface 4b on the other side. As an example, the thickness of the light receiving element 4 is about 50 μm.

The light receiving element 4 has a light receiving area 42 including a plurality of light receiving parts 41. When the light receiving area 42 is observed from the Z direction, it is, for example, in a rectangular shape with the X direction and the Y direction as the long side direction and the short side direction, respectively. The plurality of light receiving parts 41 are arranged two-dimensionally along the surface 4b. Each light receiving part 41 is, for example, composed of an APD. In addition, each light receiving part 41 can be, for example, composed of a PD (photodiode) or a SiPM (silicon photomultiplier).

The light receiving element 4 is electrically and physically connected to the circuit element 3 via a plurality of bumps 5. A plurality of bumps 5 are arranged between a plurality of terminals (not shown) arranged on the surface 3a of the circuit element 3 and a plurality of terminals (not shown) arranged on the surface 4b of the light receiving element 4. Each bump 5 electrically and physically connects the terminals facing each other in the Z direction. A resin member (first resin member) 6 is arranged between the circuit element 3 and the light receiving element 4 so as to cover each bump 5. The resin member 6 is, for example, an underfill resin member.

A light-transmitting component 7 is arranged on the light-receiving element 4 in the package 2. The light-transmitting component 7 is a substrate that is transparent to light including the light of the detection object. The light-transmitting component 7 is, for example, in the shape of a rectangular plate with the X direction and the Y direction as the long side direction and the short side direction respectively and the Z direction as the thickness direction. The light-transmitting component 7 is, for example, formed into a rectangular plate shape by glass. The light-transmitting component 7 has a surface 7a on one side in the Z direction and a surface 7b on the other side. The light-transmitting component 7 is fixed to the light-receiving element 4 by directly joining the surface 4a of the light-receiving element 4 and the surface 7b of the light-transmitting component 7. When observed from the Z direction, the outer edge 70 of the light-transmitting component 7 is consistent with the outer edge 40 of the light-receiving element 4. The thickness of the light-transmitting component 7 is greater than the thickness of the light-receiving element 4. As an example, the thickness of the light-transmitting component 7 is about 300 μm. In addition, the light-transmitting member 7 can be fixed to the light-receiving element 4 by a light-transmitting bonding member (for example, bonding agent, bonding sheet, etc.) disposed between the surface 4 a of the light-receiving element 4 and the surface 7 b of the light-transmitting member 7 .

The light receiving element 4 and the light transmitting component 7 as described above are manufactured as follows as an example. First, prepare a first wafer including a portion of each of the plurality of light receiving elements 4 arranged in a two-dimensional shape, and a second wafer including a portion of each of the plurality of light transmitting components 7 arranged in a two-dimensional shape. Then, join the second wafer to the first wafer. Then, cut the first wafer and the second wafer joined to each other into each of the portions of each of the plurality of light receiving elements 4. In this way, the light receiving element 4 and the light transmitting component 7 joined to each other are obtained. In such a light receiving element 4 and the light transmitting component 7, the light transmitting component 7 functions as a supporting substrate of the thinned light receiving element 4.

When viewed from the Z direction, the outer edge 40 of the light receiving element 4 and the outer edge 70 of the light transmitting component 7 are located inside the outer edge 30 of the circuit element 3. The plurality of terminals 31 are arranged on the surface 3a of the circuit element 3 in such a manner as to be located outside the outer edge 40 of the light receiving element 4 and the outer edge 70 of the light transmitting component 7 when viewed from the Z direction. The resin component 6 does not reach the plurality of terminals 31 on the surface 3a of the circuit element 3, but reaches the side surface 7c of the light transmitting component 7 via the side surface 4c of the light receiving element 4. A plurality of wires 11 and a plurality of wires 12 are connected to the plurality of terminals 31. Each wire 11 is a wire for applying a power voltage to the light receiving element 4, and is provided between the terminal 24 and the terminal 31 corresponding to each other. Each lead 12 is a lead for outputting a detection signal and is laid between the corresponding terminal 24 and the terminal 31. Each lead 11 is covered by a resin member (second resin member) 13. In addition, the resin member 6 can reach the side surface 4c of the light receiving element 4, but does not reach the side surface 7c of the light transmitting member 7.

In the package 2, an optical filter component 8 is arranged on the light-transmitting component 7. The optical filter component 8 is, for example, in the shape of a rectangular plate with the X direction and the Y direction as the long side direction and the short side direction, respectively, and the Z direction as the thickness direction. The optical filter component 8 has a surface 8a on one side of the Z direction and a surface 8b on the other side. The optical filter component 8 is fixed to the light-transmitting component 7 by a connecting component 9 arranged between the surface 7a of the light-transmitting component 7 and the surface 8b of the optical filter component 8. The connecting component 9 is not transparent to light including the light of the detection object.

The optical filter component 8 has a transparent substrate 81 and an optical filter film 82. The transparent substrate 81 is a substrate that is transparent to light including the light of the detection object. The transparent substrate 81 is, for example, in the shape of a rectangular plate with the X direction and the Y direction as the long side direction and the short side direction respectively and the Z direction as the thickness direction. The transparent substrate 81 is formed into a rectangular plate shape by glass, for example. The transparent substrate 81 has a surface 81a on one side of the Z direction and a surface 81b on the other side (the surface of the transparent substrate on the transparent component side). The thickness of the transparent substrate 81 is greater than the thickness of the transparent component 7. As an example, the thickness of the transparent substrate 81 is about 500 μm. The optical filter film 82 is formed on the surface 81b of the transparent substrate 81. The optical filter film 82 allows only the light of the detection object to pass through. The optical filter film 82 is, for example, a bandpass filter. As an example, the thickness of the optical filter film 82 is about 0.5 μm. An anti-reflection film (not shown) is formed on the surface 81a of the transparent substrate 81. In addition, the thickness of the transparent substrate 81 can be less than the thickness of the transparent component 7. In addition, the anti-reflection film may not be formed on the surface 81a of the transparent substrate 81.

As shown in FIG1 , when viewed from the Z direction, the outer edge 40 of the light receiving element 4 and the outer edge 70 of the light transmitting member 7 are located inside the outer edge 80 of the optical filter member 8. As shown in FIG3 , the member 9 extends from the area between the surface 7a of the light transmitting member 7 and the surface 8b of the optical filter member 8 to the corner between the surface 8b of the optical filter member 8 and the side surface 7c of the light transmitting member 7.

As shown in FIG1 , when viewed from the Z direction, the distance between the outer edge 42a of the light receiving area 42 and the outer edge 40 of the light receiving element 4 is greater than the distance between the outer edge 40 of the light receiving element 4 and the outer edge 80 of the optical filter member 8. The distance between the outer edge 42a of the light receiving area 42 and the outer edge 40 of the light receiving element 4 when viewed from the Z direction is "the distance between one side of the outer edge 42a and one side of the outer edge 40 parallel to the side of the outer edge 42a (that is, one side of the outer edge 40 on the opposite side of the light receiving area 42 relative to the side of the outer edge 42a)" when viewed from the Z direction, and in the case where the distances differ depending on the sides, it means the minimum value among the different distances. The distance between the outer edge 40 of the light-receiving element 4 and the outer edge 80 of the optical filter component 8 when observed from the Z direction is "the distance between one side of the outer edge 40 and one side of the outer edge 80 parallel to the side of the outer edge 40 (that is, one side of the outer edge 80 on the opposite side to the side of the light-receiving element 4 relative to the outer edge 40)" when observed from the Z direction. When the distance is different depending on the side, it means the maximum value among the different distances. For example, the distance between the outer edge 42a of the light receiving area 42 and the outer edge 40 of the light receiving element 4 when viewed from the Z direction is about 500 μm, and the distance between the outer edge 40 of the light receiving element 4 and the outer edge 80 of the optical filter member 8 when viewed from the Z direction is about 200 μm.

As shown in FIG. 1 and FIG. 2, the distance between the outer edge 42a of the light receiving area 42 and the outer edge 40 of the light receiving element 4 when viewed from the Z direction is greater than the thickness of the light receiving element 4 in the Z direction. As an example, the distance between the outer edge 42a of the light receiving area 42 and the outer edge 40 of the light receiving element 4 is about 500 μm, and the thickness of the light receiving element 4 in the Z direction is about 50 μm. The distance between the outer edge 42a of the light receiving area 42 and the outer edge 80 of the optical filter component 8 when viewed from the Z direction is greater than the thickness of the light transmitting component 7 in the Z direction. As an example, the distance between the outer edge 42a of the light receiving area 42 and the outer edge 80 of the optical filter component 8 when viewed from the Z direction is about 700 μm, and the thickness of the light transmitting component 7 is about 300 μm.

As shown in FIG1 , when viewed from the Z direction, the outer edge 26a of the light-transmitting region 26 of the window 23 is located outside the outer edge 80 of the optical filter member 8. The light-transmitting region 26 is a region in the window 23 that allows light including light of the detection object to pass through along the Z direction. In the present embodiment, the light-transmitting region 26 is a region in the window 23 that is located on the inner side of the connecting member 25 when viewed from the Z direction.

As shown in FIG. 1 and FIG. 2 , a plurality of chip type capacitors 15 and a plurality of chip type capacitors 16 are arranged on the bottom wall portion 21 in the package body 2. Each chip type capacitor 15 is a chip type capacitor for the circuit element 3 and is electrically and physically connected to a corresponding terminal 24 via a conductive resin member. Each chip type capacitor 16 is a chip type capacitor for the light receiving element 4 and is electrically and physically connected to a corresponding terminal 24 via a solder member.

In the optical detector 1 constructed as above, when light including light of the detection object passes through the window portion 23 and enters the optical filter component 8, only the light of the detection object passes through the optical filter film 82. The light of the detection object passing through the optical filter film 82 passes through the connecting component 9 and the transparent component 7 and enters the light receiving area 42 of the light receiving element 4. The detection signal generated in each light receiving portion 41 by the incidence of the light of the detection object on the light receiving area 42 is output to the outside through each bump 5, the circuit element 3, each wire 12, and each wiring of the bottom wall portion 21. [Manufacturing method of optical detector]

The manufacturing method of the above-mentioned light detector 1 is explained. First, as shown in FIG. 4 (a), the side wall substrate 220 is connected to the bottom wall substrate 210 by a connecting member (illustration omitted). The bottom wall substrate 210 includes a portion of each of the plurality of bottom wall portions 21 arranged in a two-dimensional shape. The side wall substrate 220 includes a portion of each of the plurality of side wall portions 22 arranged in a two-dimensional shape. Then, as shown in FIG. 4 (b), the circuit element 3, the mutually joined light-receiving element 4 and the light-transmitting member 7, the optical filter member 8, and a plurality of chip-type capacitors 15 and a plurality of chip-type capacitors 16 are mounted on the portion of each of the plurality of bottom wall portions 21 through the opening of the portion of each of the plurality of side wall portions 22.

Next, as shown in FIG. 5( a ), the window portion 23 is connected to the portion that becomes each of the plurality of side wall portions 22 by the connecting member 25 in a manner of sealing the opening of the portion that becomes each of the plurality of side wall portions 22. At this time, since gas is released from the space inside the portion that becomes each of the plurality of side wall portions 22 through the through hole 21c (see FIG. 1 ) formed in the portion that becomes each of the plurality of bottom wall portions 21, the window portion 23 is reliably connected to the portion that becomes each of the plurality of side wall portions 22.

Next, as shown in FIG. 5( b), with the dicing tape 100 attached to the surface 210a of the bottom wall substrate 210 on the opposite side to the side wall substrate 220, the bottom wall substrate 210 and the side wall substrate 220 connected to each other are cut for each of the parts that become the plurality of packages 2. At this time, since the through hole 21c (refer to FIG. 1) formed in the part that becomes each of the plurality of bottom wall portions 21 is closed by the dicing tape 100, water for cutting is prevented from intruding into the space inside the part that becomes each of the plurality of packages 2.

Next, a plurality of photodetectors 1 are picked up from the dicing tape 100. In this way, a plurality of photodetectors 1 are obtained. In addition, each photodetector 1 is inspected inside the package 2 through the window 23. The inspection is performed, for example, by checking the presence or absence of foreign matter using a camera or the like. [Function and Effect]

In the photodetector 1, a light receiving element 4 is arranged on the bottom wall portion 21 in the package 2, and an optical filter component 8 is arranged on the light receiving element 4 in the package 2. Thereby, for example, it is not necessary to reduce the size of the opening closed by the window portion 23 in the package 2, and the freedom of the shape of the package 2 is ensured. Furthermore, in the photodetector 1, when observed from the Z direction, the outer edge 40 of the light receiving element 4 is located on the inner side of the outer edge 80 of the optical filter component 8. Thereby, the probability of light entering the light receiving element 4 through the optical filter component 8 becomes higher. Based on the above facts, according to the photodetector 1, the freedom of the shape of the package 2 can be ensured, and the light of the detection object can be detected with high precision.

In the photodetector 1, when viewed from the Z direction, the distance between the outer edge 42a of the light receiving area 42 and the outer edge 40 of the light receiving element 4 is greater than the distance between the outer edge 40 of the light receiving element 4 and the outer edge 80 of the optical filter member 8. Thus, light that obliquely enters the light receiving element 4 without passing through the optical filter member 8 can be suppressed from entering the light receiving area 42, and the light of the detection object can be detected with higher accuracy.

In the optical detector 1, when viewed from the Z direction, the outer edge 70 of the light-transmitting member 7 is located inside the outer edge 80 of the optical filter member 8. This can prevent light obliquely incident on the light-transmitting member 7 without passing through the optical filter member 8 from being guided by the light-transmitting member 7 and incident on the light-receiving element 4, thereby enabling detection of the light of the detection object with higher accuracy.

In the photodetector 1, a bonding member 9 is disposed between the light-transmitting member 7 and the optical filter member 8. Thus, when an adhesive (which is fluid and solidifies after bonding) is used as the bonding member 9 during the manufacture of the photodetector 1, since the adhesive is easily accumulated at the corner between the side surface 7c of the light-transmitting member 7 and the surface 8b of the optical filter member 8, the unnecessary spread of the adhesive can be suppressed, and the optical filter member 8 can be firmly fixed to the light-transmitting member 7.

In the photodetector 1, the circuit element 3 is arranged between the bottom wall portion 21 and the light receiving element 4. Thereby, the size of the photodetector 1 when viewed from the Z direction can be reduced.

In the photodetector 1, the circuit element 3 and the light receiving element 4 are electrically and physically connected via a plurality of bumps 5. Thus, the responsiveness of the electrical signal between the circuit element 3 and the light receiving element 4 can be improved.

In the photodetector 1, the resin member 6 disposed between the circuit element 3 and the light receiving element 4 reaches the side surface 7c of the light-transmitting member 7 via the side surface 4c of the light receiving element 4. Thus, not only the circuit element 3 and the light receiving element 4 can be fixedly secured, but also the light receiving element 4 and the light-transmitting member 7 can be fixedly secured.

In the photodetector 1, the wire 11 spanning the terminal 24 of the bottom wall 21 and the terminal 31 of the circuit element 3 is covered with the resin member 13. Thereby, unintentional conduction is suppressed and a high voltage is applied to the wire 11.

In the photodetector 1, the wire 11 is a wire for applying a power voltage to the light receiving element 4. Thereby, the power voltage can be applied to the light receiving element 4 while suppressing unintentional conduction of electricity in the wire 11.

In the light detector 1, the optical filter member 8 has a transparent substrate 81 and an optical filter film 82 formed on a surface 81b of the transparent substrate 81 on the side of the transparent member 7. Thus, for example, compared with the case where the optical filter film 82 is formed on a surface 81a of the transparent substrate 81 on the opposite side to the transparent member 7, the probability of light entering the light receiving element 4 through the optical filter film 82 can be increased, and the light of the detection object can be detected with higher accuracy.

In the optical detector 1, when viewed from the Z direction, the outer edge 26a of the light-transmitting region 26 of the window 23 is located outside the outer edge 80 of the optical filter member 8. This improves visibility of the inside of the package 2 through the window 23, and inspection of the inside of the package 2 can be appropriately performed.

In the photodetector 1, the distance between the outer edge 42a of the light receiving area 42 and the outer edge 40 of the light receiving element 4 when viewed from the Z direction is greater than the thickness of the light receiving element 4 in the Z direction. This can prevent the light that obliquely enters the light receiving element 4 without passing through the optical filter member 8 from entering the light receiving area 42, and the light of the detection object can be detected with higher accuracy.

In the photodetector 1, the distance between the outer edge 42a of the light receiving area 42 and the outer edge 80 of the optical filter member 8 when viewed from the Z direction is greater than the thickness of the light transmitting member 7 in the Z direction. Thus, light obliquely incident on the light receiving element 4 without passing through the optical filter member 8 can be suppressed from entering the light receiving area 42, and the light of the detection object can be detected with higher accuracy.

In the photodetector 1, compared with the case where the window portion 23 is formed by the optical filter member 8 in the package 2, the size of the expensive optical filter member 8 can generally be reduced, so that the cost of the photodetector 1 can be reduced. Here, in order to reduce the size of the optical filter member 8, it is also possible to consider forming the optical filter film 82 on the light-transmitting member 7. However, if the optical filter film 82 is integrally formed on the second wafer including the portions of each of the plurality of light-transmitting members 7 arranged two-dimensionally, warping will occur in the second wafer, and it may be difficult to bond the second wafer to the first wafer including the portions of each of the plurality of light-receiving elements 4 arranged two-dimensionally. To this end, in the photodetector 1, a structure is adopted in which an optical filter film 82 is formed on a light-transmitting substrate 81 having a thickness greater than that of the light-transmitting member 7.

In the photodetector 1, the space inside the package 2 is connected to the space outside the package 2 by means of the through hole 21c formed in the bottom wall 21. This prevents the formation of a gap between the side wall 22 and the window 23 due to the expansion of the gas inside the package 2. In addition, it prevents the formation of condensation inside the package 2 due to the temperature difference between the space inside the package 2 and the space outside the package 2. [Variation Example]

The present disclosure is not limited to the above-mentioned implementation forms. For example, the circuit element 3 and the light receiving element 4 can be electrically and physically connected by direct bonding. Accordingly, the responsiveness of the electrical signal between the circuit element 3 and the light receiving element 4 can be improved. In addition, the optical filter component 8 can be fixed to the light transmitting component 7 by a bonding film or the like without disposing the bonding component 9 between the light transmitting component 7 and the optical filter component 8.

Furthermore, the circuit element 3 may not be disposed between the bottom wall portion 21 and the light receiving element 4, and in this state, the light receiving element 4 may be disposed on the bottom wall portion 21. Furthermore, the light transmitting member 7 may not be disposed between the light receiving element 4 and the optical filter member 8, and in this state, the optical filter member 8 may be disposed on the light receiving element 4.

Furthermore, the light receiving element 4 may be a surface incident type optical semiconductor element in which a plurality of light receiving parts 41 are arranged two-dimensionally along the surface 4a. Furthermore, regardless of whether the light receiving element 4 is a back incident type optical semiconductor element or a surface incident type optical semiconductor element, a plurality of light receiving parts 41 may be arranged one-dimensionally.

Furthermore, the optical filter member 8 may be formed by forming an optical filter film 82 on a surface 81a of a transparent substrate 81 opposite to the transparent member 7. Furthermore, when viewed from the Z direction, the outer edge of the transparent member 7 may not coincide with the outer edge of the light receiving element 4. Furthermore, when viewed from the Z direction, the outer edge 26a of the transparent region 26 of the window portion 23 may not be located outside the outer edge 80 of the optical filter member 8. Furthermore, the side wall portion 22 may be formed integrally with the bottom wall portion 21.

Furthermore, when viewed from the Z direction, the distance between the outer edge 42a of the light receiving region 42 and the outer edge 40 of the light receiving element 4 may be less than the distance between the outer edge 40 of the light receiving element 4 and the outer edge 80 of the optical filter member 8. Furthermore, the distance between the outer edge 42a of the light receiving region 42 and the outer edge 40 of the light receiving element 4 when viewed from the Z direction may be less than the thickness of the light receiving element 4 in the Z direction. Furthermore, the distance between the outer edge 42a of the light receiving region 42 and the outer edge 80 of the optical filter member 8 when viewed from the Z direction may be less than the thickness of the light transmitting member 7 in the Z direction. In either case, when viewed from the Z direction, the outer edge 42a of the light receiving area 42 is located inside the outer edge 40 of the light receiving element 4, thereby suppressing the light that obliquely enters the light transmitting member 7 and/or the light receiving element 4 without passing through the optical filter member 8 from entering the light receiving area 42. In addition, in either case, when viewed from the Z direction, the outer edge 42a of the light receiving area 42 can overlap with the outer edge 40 of the light receiving element 4.

1: Photodetector 2: Package 3: Circuit element 3a, 3b, 4a, 4b, 7a, 7b, 8a, 8b, 21a, 21b, 23a, 23b, 81a, 210a: Surface 4: Photoreceiving element 4c, 7c, 22c, 23c: Side 5: Bump 6: Resin member (first resin member) 7: Light-transmitting member 8: Optical filter member 9, 25: Connecting member 11, 12: Wire 13: Resin member (second resin member) 15, 16: Chip capacitor 21: Bottom wall 21c: Through hole 22: Side wall 22a, 22b: End face 23: Window 24, 31: Terminal 26: Transparent area 26a, 30, 40, 42a, 70, 80: Outer edge 41: Light receiving part 42: Light receiving area 81: Transparent substrate 81b: Surface (surface on the transparent component side of the transparent substrate) 82: Optical filter film 100: Cutting tape 210: Bottom wall substrate 220: Side wall substrate II-II: Line X, Y, Z: Direction

FIG. 1 is a top view of a photodetector in an embodiment. FIG. 2 is a cross-sectional view of the photodetector along the II-II line shown in FIG. 1. FIG. 3 is an enlarged view of a portion of the photodetector shown in FIG. 2. FIG. 4 (a) and (b) are views showing the manufacturing process of the photodetector shown in FIG. 1. FIG. 5 (a) and (b) are views showing the manufacturing process of the photodetector shown in FIG. 1.

1: Light detector

2: Package body

3: Circuit components

4: Light receiving element

5: Bump

6: Resin component (first resin component)

7: Light-transmitting components

8: Optical filter components

9,25: Next, the components

11: Wire

13: Resin component (second resin component)

16: Chip type capacitor

21: Bottom wall

21a,21b,23a,23b:Surface

22: Side wall

22a, 22b: end face

22c,23c: Side

23: Window

41: Light receiving part

42: Light receiving area

81: Translucent substrate

82: Optical filter film

X,Y,Z: Direction

Claims (14)

A photodetector, comprising: a package having a bottom wall and a window facing each other; a light receiving element disposed on the bottom wall in the package; a light transmitting component disposed on the light receiving element in the package; and an optical filter component disposed on the light transmitting component in the package; and the light receiving element has a light receiving area including a plurality of light receiving parts; when viewed from the direction in which the bottom wall and the window face each other, the outer edge of the light receiving element is located inside the outer edge of the optical filter component. A photodetector as claimed in claim 1, wherein when observed from the bottom wall portion and the window portion in the aforementioned direction facing each other, the distance between the outer edge of the aforementioned light receiving area and the aforementioned outer edge of the aforementioned light receiving element is greater than the distance between the aforementioned outer edge of the aforementioned light receiving element and the aforementioned outer edge of the aforementioned optical filter component. As in the light detector of claim 1 or 2, when the bottom wall portion and the window portion are observed in the aforementioned direction facing each other, the outer edge of the aforementioned light-transmitting component is located on the inner side of the aforementioned outer edge of the aforementioned optical filter component. The optical detector of claim 3 further comprises a connecting component, which is arranged between the aforementioned light-transmitting component and the aforementioned optical filter component. The photodetector of any one of claims 1 to 4 further comprises a circuit element, which is arranged between the bottom wall portion and the light receiving element. The photodetector of claim 5 further comprises a plurality of bumps which electrically and physically connect the aforementioned circuit element with the aforementioned photosensitive element. The photodetector of claim 6 further comprises a first resin component, which is disposed between the aforementioned circuit element and the aforementioned light-receiving element; and the aforementioned first resin component reaches the side surface of the aforementioned light-transmitting component through the side surface of the aforementioned light-receiving element. A photodetector as claimed in claim 5, wherein the aforementioned circuit element and the aforementioned light receiving element are electrically and physically connected by direct bonding. The photodetector of any one of claims 5 to 8 further comprises: a wire which is mounted on the terminal of the bottom wall and the terminal of the circuit element; and a second resin member which covers the wire. A photodetector as claimed in claim 9, wherein the wire is a wire used for applying a power voltage to the light receiving element. A photodetector as in any one of claims 1 to 10, wherein the optical filter component comprises a light-transmitting substrate and an optical filter film formed on a surface of the light-transmitting substrate on the side of the light-transmitting component. A light detector as in any one of claims 1 to 11, wherein when the bottom wall portion and the window portion are observed in the aforementioned direction facing each other, the outer edge of the light-transmitting area of the window portion is located outside the aforementioned outer edge of the aforementioned optical filter component. A light detector as in any one of claims 1 to 12, wherein the distance between the outer edge of the aforementioned light receiving area and the aforementioned outer edge of the aforementioned light receiving element when observed in the aforementioned direction from the aforementioned bottom wall portion and the aforementioned window portion relative to each other is greater than the thickness of the aforementioned light receiving element in the aforementioned direction from the aforementioned bottom wall portion and the aforementioned window portion relative to each other. A light detector as in any one of claims 1 to 13, wherein the distance between the outer edge of the aforementioned light receiving area and the aforementioned outer edge of the aforementioned optical filter component when observed from the aforementioned direction opposite to each other by the aforementioned bottom wall portion and the aforementioned window portion is greater than the thickness of the aforementioned light-transmitting component in the aforementioned direction opposite to each other by the aforementioned bottom wall portion and the aforementioned window portion.