TW202500771A - 銅合金材料以及使用該銅合金材料之電阻器用電阻材料、電阻器、發熱體用材料及發熱體 - Google Patents
銅合金材料以及使用該銅合金材料之電阻器用電阻材料、電阻器、發熱體用材料及發熱體 Download PDFInfo
- Publication number
- TW202500771A TW202500771A TW113121986A TW113121986A TW202500771A TW 202500771 A TW202500771 A TW 202500771A TW 113121986 A TW113121986 A TW 113121986A TW 113121986 A TW113121986 A TW 113121986A TW 202500771 A TW202500771 A TW 202500771A
- Authority
- TW
- Taiwan
- Prior art keywords
- mass
- copper alloy
- copper
- resistor
- alloy material
- Prior art date
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/05—Alloys based on copper with manganese as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C13/00—Resistors not provided for elsewhere
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Electromagnetism (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023097821 | 2023-06-14 | ||
| JP2023-097821 | 2023-06-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW202500771A true TW202500771A (zh) | 2025-01-01 |
Family
ID=93852180
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW113121986A TW202500771A (zh) | 2023-06-14 | 2024-06-14 | 銅合金材料以及使用該銅合金材料之電阻器用電阻材料、電阻器、發熱體用材料及發熱體 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2024257812A1 (fr) |
| TW (1) | TW202500771A (fr) |
| WO (1) | WO2024257812A1 (fr) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59143035A (ja) * | 1983-02-01 | 1984-08-16 | Mitsubishi Heavy Ind Ltd | 防汚金属材料 |
| JP2934064B2 (ja) * | 1991-07-09 | 1999-08-16 | 古河電気工業株式会社 | 易加工高力銅合金とその製造方法 |
| JPH0525568A (ja) * | 1991-07-22 | 1993-02-02 | Furukawa Electric Co Ltd:The | 易加工高力銅合金とその製造方法 |
| JP6471494B2 (ja) * | 2014-09-29 | 2019-02-20 | 日立金属株式会社 | Cu合金材およびその製造方法 |
| JP6762438B2 (ja) * | 2018-06-20 | 2020-09-30 | 古河電気工業株式会社 | 抵抗器用抵抗材料およびその製造方法並びに抵抗器 |
| CN109971992B (zh) * | 2019-03-11 | 2021-07-16 | 中南大学 | 高抗变色低成本金色青铜合金及制备方法 |
-
2024
- 2024-06-12 JP JP2025527976A patent/JPWO2024257812A1/ja active Pending
- 2024-06-12 WO PCT/JP2024/021379 patent/WO2024257812A1/fr active Pending
- 2024-06-14 TW TW113121986A patent/TW202500771A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024257812A1 (fr) | 2024-12-19 |
| JPWO2024257812A1 (fr) | 2024-12-19 |
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